Intel SR6850HW4 User Manual
Intel® Server Platform
SR6850HW4
Technical Product Specification
Intel order number D23151-001
Enterprise Platforms and Services Division – Marketing
Intel Confidential
Revision 1.0
May, 2005
Revision History Intel® Server Platform SR6850HW4 TPS
Revision History
Date Revision
Number
May 2005 1.0 Initial release.
Modifications
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
“reserved” inches or “undefined” Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product
is available. Verify with your local sales office that you have the latest datasheet before
finalizing a design.
The Intel® Server Platform SR6850HW4 may contain design defects or errors known as errata,
which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Intel Corporation server baseboards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel’s own chassis are designed and tested to
meet the intended thermal requirements of these components when the fully integrated system
is used together. It is the responsibility of the system integrator that chooses not to use Intel
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or non-operating
limits.
Intel and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2005.
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Intel® Server Platform SR6850HW4 TPS Table of Contents
Table of Contents
1. Product Overview.................................................................................................................1
2. System Overview..................................................................................................................3
2.1 System Feature Overview........................................................................................ 3
2.2 Introduction .............................................................................................................. 4
2.3 External Chassis Features - Front ........................................................................... 8
2.3.1 Front Control Panel.................................................................................................. 8
2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays .......................................... 9
2.4 External Chassis Features - Rear.......................................................................... 10
2.5 Internal Chassis Features...................................................................................... 11
2.5.1 Server Board Set SE8500HW4 Mainboard............................................................ 11
2.5.2 Server Board Set SE8500HW4 Memory Board ..................................................... 12
2.5.3 Power Distribution Board ....................................................................................... 12
2.5.4 SCSI Backplane Board Board ...............................................................................12
2.5.5 Front Panel I/O Board............................................................................................ 13
2.5.6 Front Panel Control Board ..................................................................................... 13
2.5.7 SATA-to-IDE Converter Board............................................................................... 13
2.5.8 Intel® Management Module................................................................................... 13
2.5.9 Fibre Channel Module ...........................................................................................14
2.5.10 RAID On Motherboard (ROMB) ............................................................................. 14
2.5.11 Power Supply Module............................................................................................ 14
2.5.12 Cooling Subsystem................................................................................................ 16
2.6 New Platform Features .......................................................................................... 16
2.6.1 Advanced Memory Performance and Protection ................................................... 16
2.6.2 Rolling BIOS .......................................................................................................... 17
2.7 Server Management .............................................................................................. 17
2.7.1 Intel Management Module (IMM)........................................................................... 17
2.7.2 Hot Swap Controller............................................................................................... 19
2.8 Reliability, Availability, Serviceability, Usability, Manageability (RASUM) ............. 19
2.9 Expansion Support ................................................................................................20
2.10 Specifications......................................................................................................... 21
2.10.1 Environmental Specifications Summary ................................................................ 21
2.10.2 Physical Specifications .......................................................................................... 22
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3. Server System Chassis and Assemblies .........................................................................23
3.1 Chassis, Rails and Top Cover ............................................................................... 23
3.1.1 Chassis .................................................................................................................. 23
3.1.2 Slide Rails.............................................................................................................. 25
3.1.3 Top Cover .............................................................................................................. 25
3.2 Power and Fans..................................................................................................... 25
3.3 Fan Subsystem...................................................................................................... 26
3.4 Mainboard Assembly ............................................................................................. 26
3.5 Peripheral Bay and Front Panel............................................................................. 27
3.5.1 Hot-Swap Hard Disk Drive Carrier......................................................................... 27
3.5.2 Optical Drive Carrier .............................................................................................. 28
3.5.3 Front Panel ............................................................................................................ 29
3.6 Front Bezel ............................................................................................................30
4. Cables and Connectors .....................................................................................................31
4.1 Cable and System Interconnect Descriptions........................................................ 33
4.2 User-accessible I/O Connectors ............................................................................ 35
4.2.1 Video Connectors .................................................................................................. 35
4.2.2 USB 2.0 Connectors .............................................................................................. 36
4.2.3 Etherent Connectors.............................................................................................. 37
4.2.4 External 68-pin Ultra320 SCSI VHDCI Connector................................................. 39
4.2.5 Internal 68-pin SCSI Connectors ........................................................................... 40
4.2.6 80-pin SCA2 Hard Disk Drive Connectors............................................................. 41
4.2.7 AC Power Input Connectors .................................................................................. 42
4.2.8 3-pin Chassis Intrusion Connector......................................................................... 42
4.2.9 12-pin Power Distribution Board Power Connector ............................................... 42
4.2.10 30-pin Power Distribution Board to Mainboard Connector .................................... 43
4.2.11 30-pin SCSI Backplane Board Board to Front Panel I/O Board Connector........... 43
4.2.12 100-pin Mainboard to SCSI Backplane Board Board Connector........................... 44
4.2.13 Peripheral Power Connector.................................................................................. 45
4.2.14 Fan Connectors ..................................................................................................... 46
4.2.15 50-pin Front Panel Control Module Connector ...................................................... 47
4.2.16 SATA-to-IDE Converter Board Connector ............................................................. 48
4.2.17 SATA-to-IDE Converter Board Power Connector .................................................. 48
4.2.18 SATA Connector.................................................................................................... 49
5. Power Supply......................................................................................................................51
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5.1 Mechanical Outline ................................................................................................ 52
5.2 Power Supply Output Interface.............................................................................. 54
5.2.1 Blade Connector .................................................................................................... 54
5.3 AC Input Requirement ........................................................................................... 55
5.3.1 AC Input Voltage Specification .............................................................................. 55
5.3.2 Efficiency ...............................................................................................................55
5.3.3 Input Over-Current Protection................................................................................ 55
5.3.4 Inrush Current........................................................................................................ 55
5.3.5 Auto Restart........................................................................................................... 56
5.3.6 Power Factor Correction (PFC) ............................................................................. 56
5.3.7 AC Input Connector ............................................................................................... 56
5.4 DC Output Requirements ...................................................................................... 56
5.4.1 Hot Swap Functionality .......................................................................................... 57
5.4.2 Output Current Rating............................................................................................ 57
5.4.3 Over- and Under-Voltage Protection ..................................................................... 57
5.4.4 Over-current Protection .........................................................................................58
5.4.5 Short Circuit Protection.......................................................................................... 58
5.4.6 Reset After Shutdown............................................................................................ 58
5.4.7 Current Sharing .....................................................................................................59
5.4.8 I2C Devices ............................................................................................................ 59
5.4.9 Fan Speed Control................................................................................................. 61
5.4.10 Power Supply Module LED indicators ................................................................... 61
6. Power Distribution Board..................................................................................................63
6.1 Introduction ............................................................................................................ 63
6.2 Signal Descriptions and Pinouts ............................................................................ 65
6.2.1 Remote On/Off (-PS_ON)...................................................................................... 66
6.2.2 Power Good Signal (POK or P_GOOD) ................................................................66
6.2.3 VIN_GOOD............................................................................................................ 66
7. SCSI Backplane Board.......................................................................................................67
7.1 Introduction ............................................................................................................ 67
7.1.1 Block Diagram .......................................................................................................67
7.1.2 Architectural Overview........................................................................................... 68
7.1.3 Mechanical Specifcations ...................................................................................... 70
7.1.4 Component Location.............................................................................................. 71
7.2 Functional Architecture .......................................................................................... 73
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7.2.1 SCSI Buses ...........................................................................................................73
7.2.2 SCSI Drive Power Control .....................................................................................73
7.2.3 SCSI Enclosure Management ............................................................................... 75
7.2.4 Server Management Interface ............................................................................... 76
7.2.5 Resets.................................................................................................................... 77
7.2.6 Connector Interlocks.............................................................................................. 77
7.2.7 Clock Generation ................................................................................................... 77
7.2.8 Programmed Devices ............................................................................................ 78
7.3 Signal Descriptions ................................................................................................ 78
7.3.1 Power from the Power Distribution Board.............................................................. 79
7.3.2 Front Panel Power Connector ...............................................................................79
7.3.3 Front Panel I/O Board Ribbon Cable Connector ................................................... 79
7.3.4 LVD SCSI 68-pin Connector.................................................................................. 80
7.3.5 SCA2 80-pin Drive Connectors.............................................................................. 81
7.3.6 Fans....................................................................................................................... 82
7.3.7 Internal Logic Signals ............................................................................................82
7.4 Electrical, Environmental, and Mechanical Specifications..................................... 83
7.4.1 Electrical Specifications ......................................................................................... 83
8. Front Panel I/O and Control Boards .................................................................................85
8.1 Introduction ............................................................................................................ 85
8.1.1 Block Diagram .......................................................................................................85
8.1.2 Architectural Overview........................................................................................... 86
8.1.3 Component Location.............................................................................................. 87
8.2 Functional Architecture .......................................................................................... 88
8.2.1 VGA ....................................................................................................................... 88
8.2.2 USB .......................................................................................................................88
8.2.3 NMI Button............................................................................................................. 88
8.3 Signal Descriptions ................................................................................................ 89
8.3.1 USB Connector...................................................................................................... 89
8.3.2 Front Panel VGA Connector .................................................................................. 90
8.4 Electrical, Environmental, and Mechanical Specifications..................................... 90
8.4.1 Electrical Specifications ......................................................................................... 90
8.4.2 Connector Specifications ....................................................................................... 91
8.4.3 Cooling Requirements ........................................................................................... 91
8.5 Front Panel Control Module................................................................................... 92
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8.5.1 Button Control Panel.............................................................................................. 92
8.5.2 Intel® Local Control Panel...................................................................................... 94
8.5.3 System ID Buttons and LEDs ................................................................................ 95
9. SATA-to-IDE Converter Board...........................................................................................97
9.1 Mechanical Outline ................................................................................................ 97
10. Regulatory Specifications .................................................................................................99
10.1 Important Safety Information ................................................................................. 99
10.2 Intended Application Uses ..................................................................................... 99
10.3 Product Safety ....................................................................................................... 99
10.4 Electromagnetic Compatibility (EMC) – Emissions and Immunity ......................... 99
10.5 Certifications / Registrations / Declarations ......................................................... 100
10.6 Regulatory Compliance Markings........................................................................ 101
10.7 Regional EMC Compliance Notices/Information.................................................. 102
Glossary...................................................................................................................................105
Reference Documents............................................................................................................107
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List of Figures Intel® Server Platform SR6850HW4 TPS
List of Figures
Figure 1. Intel
®
Server Platform SR6850HW4, Bezel Removed .................................................. 4
Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed ............... 5
Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed........................... 6
Figure 4. Server Platform SR6850HW4 Chassis Block Diagram................................................ 7
Figure 5. Rear View of the Server Platform SR6850HW4 ........................................................10
Figure 6. Server Platform SR6850HW4 Rack and Pedestal Configurations ............................. 24
Figure 7. Server Platform SR6850HW4, Bezel and Top Cover Removed................................24
Figure 8. Rear of Server Platform SR6850HW4, Power Supplies Installed.............................. 25
Figure 9. System Fan................................................................................................................. 26
Figure 10. Mainboard and Sheet Metal Tray, Assembly............................................................ 27
Figure 11. Hot-Swap Hard Drive Carrier.................................................................................... 28
Figure 12. Optical Drive Carrier with SATA-to-IDE Converter Board.........................................28
Figure 13. Front Panel with Button Control Panel...................................................................... 29
Figure 14. Front Panel with Intel
®
Local Control Panel .............................................................. 29
Figure 15. Front Bezels (Rack and Pedestal) ............................................................................ 30
Figure 16. Server Platform SR6850HW4 Interconnect Diagram............................................... 32
Figure 17. Dual Stacked Ethernet Connector ............................................................................ 38
Figure 18. 68-Pin SCSI Connector Non-Shielded...................................................................... 40
Figure 19. SCA2 80-Pin SCSI Connector .................................................................................. 41
Figure 20. AC Power Input Connector ....................................................................................... 42
Figure 21. 1570W Power Supply ............................................................................................... 51
Figure 22. Power Supply Mechanical Specification ................................................................... 53
Figure 23. Power Supply Signal Sharing ................................................................................... 63
Figure 24. Power Distribution Board Layout .............................................................................. 64
Figure 25. Power Distribution Board to Power Supply Module Docking Connector Signals...... 65
Figure 26. Mainboard Connector Signals ..................................................................................66
Figure 27. Server Platform SR6850HW4 SCSI Backplane Board Board Block Diagram ......... 68
Figure 28. SCSI Backplane Board Board Component Placement (Primary Side) ..................... 70
Figure 29. SCSI Backplane Board Board Component Placement (Primary Side) ..................... 71
Figure 30. SCSI Backplane Board Board Component Placement (Secondary Side) ................ 72
Figure 31. Enclosure Management Signal Flow Diagram.......................................................... 75
Figure 32. Front Panel I/O Board Block Diagram ......................................................................86
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Figure 33. Front Panel I/O Board Placement Diagram .............................................................. 87
Figure 34. Front Panel I/O Board...............................................................................................88
Figure 35. Button Control Panel Features .................................................................................92
Figure 36. Local Control Panel Features ................................................................................... 95
Figure 37. SATA-to-IDE Converter Board Mechanical Outline .................................................. 97
Figure 38. SATA-to-IDE Converter Board.................................................................................. 97
Figure 39. SATA-to-IDE Converter Board with Attached Optical Drive...................................... 98
Figure 40. SATA-to-IDE Converter Board with Attached Optical Drive...................................... 98
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List of Tables Intel® Server Platform SR6850HW4 TPS
List of Tables
Table 1. Intel
Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed................................. 8
Table 3. System Power Budget .................................................................................................15
Table 4. Expansion Support....................................................................................................... 20
Table 5. Environmental Specifications Summary ......................................................................21
Table 6. Physical Specifications ................................................................................................22
Table 7. Cable Descriptions.......................................................................................................33
Table 8. Connector Descriptions................................................................................................33
Table 9. Video Connector Pinout ............................................................................................... 35
Table 10. Dual USB Connector Pinout .....................................................................................36
Table 11. TaDual Ethernet Stacked Connector ......................................................................... 37
Table 12. Server Management Ethernet Connector .................................................................. 38
Table 13. Ultra320 SCSI VHDCI Connector Pinout ...................................................................39
Table 14. 68-Pin SCSI Connector Pinout ..................................................................................40
Table 15. SCA2 Drive Connector Pinout ...................................................................................41
Table 16. 3-pin Chassis Intrusion Connector.............................................................................42
®
Server Platform SR6850HW4 Feature List........................................................... 3
Table 17. Power Connector Pinout ............................................................................................ 42
Table 18. 30-pin Power Distribution Board to Mainboard Connector......................................... 43
Table 19. Front Panel I/O Board Connector Signal Description ................................................43
Table 20. 100-pin Connector Pinout (Unused and Ground) ......................................................44
Table 21. 100-pin Connector Pinout (Signals) ........................................................................... 44
Table 22. Peripheral Power Connector...................................................................................... 45
Table 23. 12-pin Fan Power and Control ................................................................................... 46
Table 24. 24-pin Fan Power and Control J6E1.......................................................................... 46
Table 25. Front Panel Control Module Connector Signal Description .......................................47
Table 26. SATA-to-IDE Converter Board Connector ................................................................. 48
Table 27. SATA-To-IDE Converter Board Power Connector..................................................... 48
Table 28. SATA Signal Connector ............................................................................................. 49
Table 29. PowerBlade Pin Assignment...................................................................................... 54
Table 30. AC Input Rating.......................................................................................................... 55
Table 31. DC Output Voltage Regulation Limits ........................................................................ 56
Table 32. 1570W Load Ratings .................................................................................................57
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Table 33. Over- and Under-voltage Limits ................................................................................. 57
Table 34. Over-current Protection Limits ................................................................................... 58
Table 35. Output Current Sharing..............................................................................................59
Table 36. I/O Port Expander Signals .........................................................................................60
Table 37. I/O Port Expander Codes........................................................................................... 60
Table 38. Power Supply Fan Voltage ........................................................................................61
Table 39. Hot-swap SCSI Hard Disk Drive LED Details ............................................................74
Table 40. I
Table 41. Global I
Table 42. I
2
C Local Bus Addresses ...........................................................................................76
2
C Bus Addresses (IPMB Bus) ...................................................................... 77
2
C IO Bus Address .................................................................................................... 77
Table 43. Power Interface Signals ............................................................................................. 79
Table 44. Front Panel I/O Board Power Interface Signals ......................................................... 79
Table 45. Front Panel I/O Board Ribbon Connector Signal Description .................................... 79
Table 46. LVD SCSI Connector Signal Description ................................................................... 80
Table 47. .LVD SCSI Bus Signals.............................................................................................. 81
Table 48. Internal Logic Signals................................................................................................. 82
Table 49. Electrical Specifications ............................................................................................. 83
Table 50. Maximum Power Consumption .................................................................................. 83
Table 51. SCSI Backplane Board Board Power Limits per Drive .............................................. 84
Table 52. DC Voltage Regulation ..............................................................................................84
Table 53. USB Connector .......................................................................................................... 89
Table 54. VGA Connector Signal Description............................................................................ 90
Table 55. Electrical Specifications ............................................................................................. 90
Table 56. Maximum Power Consumption .................................................................................. 91
Table 57. DC Voltage Regulation ..............................................................................................91
Table 58. Server Platform SR6850HW4 Front Panel I/O Board Connector Specifications ......91
Table 59. Button Control Panel Details...................................................................................... 92
Table 60. System ID LED Details ..............................................................................................95
Table 61. Product Regulatory Compliance Markings............................................................... 101
Table 62. Regional EMC Compliance Information................................................................... 102
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Intel® Server Platform SR6850HW4 TPS Product Overview
1. Product Overview
This product specification details the features of the Intel® Server Platform SR6850HW4.
Reliability, low cost, time to market, modularity, high performance, and management features
are primary considerations in the design.
The Server Platform SR6850HW4 supports up to four 64-bit Intel
®
Xeon™ Processors MP with
up to 8MB L3 cache and incorporates features that clearly differentiate it as a high availability
server. Building on previous server platforms, the Server Platform SR6850HW4 introduces
redundant memory and networking in addition to the enterprise features of hot-swap power,
cooling, PCI slots, and hard disk drives. Advanced server management features are also
included to remotely monitor and manage the server. Finally, the server has two optional mass
storage expansion features.
This document is organized into ten chapters:
Chapter 1: Introduction
An overview of this document.
Chapter 2: System Overview
An overview of the system hardware.
Chapter 3: System Chassis and Sub-Assemblies
An overview of the chassis and major sub-assemblies.
Chapter 4: Cables and Connectors
Describes the cables and connectors specific to the Server Platform SR6850HW4.
Chapter 5: Power Supply
Describes the power supplies used in the Server Platform SR6850HW4.
Chapter 6: Power Distribution Board
Describes the Power Distribution Board used in the Server Platform SR6850HW4 and
®
Intel
Server Platform SR4850HW4.
Chapter 7: SCSI Backplane Board
Describes the SCSI Backplane Board used in the Server Platform SR6850HW4.
Chapter 8: Front Panel I/O and Control Boards
Describes the Front Panel I/O Board and Control Boards used in the Server Platform
SR6850HW4.
Chapter 9: SATA-to-IDE Converter Boards
Describes the SATA-to-IDE Converter Board used in the Server Platform SR4850HW4
and Server Platform SR6850HW4.
Chapter 10: Regulatory Specifications
Describes system compliance to regulatory specifications.
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Intel® Server Platform SR6850HW4 TPS System Overview
2. System Overview
This chapter describes the features of the Intel® Server Platform SR6850HW4.
2.1 System Feature Overview
Table 1 provides a list and brief description of the features of the Server Platform SR6850HW4,
which utilizes the Intel
®
Server Board Set SE8500HW4.
Table 1. Intel® Server Platform SR6850HW4 Feature List
Feature Description
Compact, high-density
system
Configuration flexibility One to four 64-bit Intel® Xeon™ processors MP with up to 8MB L3 cache
Serviceability Tool-less design features
Availability Two 1570W power supplies in a redundant (1+1) configuration with separate power cords
Manageability Remote management
Rack-mount server with a height of 6U (10.5 inches) and a depth of 28 inches (706mm)
Two Ultra320* SCSI ports
Two gigabit Ethernet ports
Ten 1-inch hot-swap Ultra320 SCSI hard disk drives
Seven PCI adapters (Four PCI Express* hot-plug, one PCI-X* 133MHz hot-plug, two PCI-X
100Mhz)
64GB Double Data Rate2 (DDR2) 400 MHz Synchronous Dynamic Random Access
Memory (SDRAM), ECC Registered
Customizable bezel
Optional system-specific 2Gbps Fibre Channel Module
Optional RAID On Motherboard (ROMB) with DDR2 DIMM for disk cache and optional
RAID Smart Battery (RSB) for cache battery backup
Either button or LCD front panel
Either Intel® Management Module (IMM) – Professional or Advanced
Front access to hot-swap hard disk drives
Top access to hot-plug PCI slots, cooling, and Hot-Swap Memory Boards
Rear access to hot-swap power supplies
Status and fault indicator LEDs
Front and rear viewable System ID switches and LEDs
Top viewable memory configuration and status LEDs
Processor failure LEDs
Detailed configuration label on top cover
Color-coded parts to identify hot-swap and non-hot-swap serviceable components
Four Hot-Plug Memory Boards
Intelligent Platform Management Interface (IPMI) 2.0 compliant
Wired For Management (WfM) 2.0 compliant
Emergency Management Port (EMP) – IPMI over serial or modem
Extensive system sensors and monitoring
Remote diagnostics support via serial and LAN ports
Web management console
With IMM Advanced:
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System Overview Intel® Server Platform SR6850HW4 TPS
Feature Description
Dedicated Out-Of-Band management RJ45 port (telnet, embedded web server, DNS,
DHCP)
KVM console redirection and remote viewer
Full SNMP access
Front panel interface Switches: Power, Reset, NMI, System ID
Video connector, Three USB 2.0
Ports:
Power, System ID, System status,
LEDs:
LAN1 and LAN2 Activity, Hard drives status
Optional LCD
2.2 Introduction
The platform supports sockets for up to four 64-bit Intel Xeon processors MP, up to 64GB of
memory, ten hot-swap hard disk drives, seven PCI slots, two different server management
modules, two different front control panels, and two optional mass storage expansions. The
server can be configured for use as either a rack, as shipped, or pedestal, with an optional
accessory kit.
Figure 1, Figure 2 and Figure 3 show front and rear views of the platform.
Figure 1. Intel® Server Platform SR6850HW4, Bezel Removed
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1
2
TP01504
Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed
The Server Platform SR6850HW4 includes the Intel
®
Server Board Set SE8500HW4 with
the E8500 chipset. To provide structural support the Intel Server Board Set SE8500HW4
Mainboard is mounted on a sheet metal tray that is installed at the rear of the chassis,
above the power supplies.
Up to four Memory Boards can be installed into the Server Board Set SE8500HW4
Mainboard. The Memory Boards attach perpendicular to the Server Board Set SE8500HW4
Mainboard. These contain four DDR2 400HMz SDRAM DIMM slots each. With four Memory
Boards installed, the system supports up to 64GB of memory (using 4GB DIMMs).
The hard drive bay, located at the front of platform, provides a bay for ten hot-swap 1-inch
Ultra320* SCSI hard disk drives. SCSI hard disk drives plug into a vertical SCSI Backplane
Board at the rear of hard disk drive bay. One Slimline (½-inch high) optical drive bay and
one full-height 5¼-inch SCSI tape device bay are also located at the front of the platform.
The cooling subsystem requires six hot-swap system fan modules. Each fan module
contains a status LED that illuminates in the event of a fan failure. The fan modules are
accessible from the top of the system when the top cover is removed and connected into the
SCSI Backplane Board.
The front control panel provides video, USB, buttons, status LEDs, and an optional LCD,
that are used for monitoring and managing the platform. The front bezel is an optional
cosmetic accessory that is installed with snap-on features. The bezel can be customized to
meet integrator-specific industrial design requirements, including color and imprint.
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System Overview Intel® Server Platform SR6850HW4 TPS
Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed
The power supply modules are located at the rear of the system below the Server Board Set
SE8500HW4 Mainboard and plug directly into connectors on the horizontally oriented Power
Distribution Board. The system supports two hot-swap power supply modules in a 1+1
redundant configuration or one hot-swap power supply and a power bay fan module in a
non-redundant state.
Upon removal of the top cover, the user has access to the processors, Memory Boards, PCI
adapters, IMM Board and optional mass storage features.
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Intel® Server Board SE8500HW4 Main Board
CPU
1
FSB 1
6700
PXH
Power and
Signal
Power
Dist Board
CPU
CPU
2
E8500
North Bridge
(NB)
SCSI Cable
CPU
RAID
Act Key
3
IMI D
IMI C
IMI B
IMI A
4
FSB 0
IOP332
Processor
SCSI Cable
(optional)
SCSI
Backplane Board
XMB
XMB
XMB
XMB
DDR2 RAID DIMM
LSI*
53C1030
Ultra320*
SCSI
Controller
Memory Board
Memory Board
Memory Board
SE8500HW4 Memory Board
BRCM5704*
Ethernet
Controller
SCSI Channel B
DIMM
DIMM
DIMM
DIMM
DDR2 DIMM
DIMM
DIMM
DDR2 DIMM
DIMM
DIMM
DIMM
DIMM
DDR2 DIMM
DIMM
DIMM
DDR2 DIMM
RAID Smart
Battery
82801EB
ICH5
Radeon*
Controller
IMM
Power
Front
Panel I/O
Board
FWH
10/100
SATA Cable
Video Port
USB Port
USB Port
USB Port
ATI*
7000
Video
SIO
SATA-to-IDE
Converter Board
Optical
Drive
Ethernet Port
Ethernet Port
External SCSI
Connector
(optional)
USB Port
USB Port
Video Port
COM1/EMP
GCM
(optional)
Hot-swap SCSI Drives (10)
SCSI
Tape
Hot Swap Fans (6)
Figure 4. Server Platform SR6850HW4 Chassis Block Diagram
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Front Control Panel
Optional LCD
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System Overview Intel® Server Platform SR6850HW4 TPS
2.3 External Chassis Features - Front
Table 2 shows the front view of the Server Platform SR6850HW4 with the bezel removed.
The front provides access to the following components:
Buttons and LEDs (with optional LCD)
Video and USB connectors
Hard drive bay, optical drive, SCSI tape device
A
A Video connector
B USB 2.0 ports (three)
C Front control panel (button control panel shown)
D Hot-swap fans (six)
E 5 ¼ peripheral bay (full height)
F Optical drive bay
G Hot-swap SCSI hard disk drives (ten)
C
B
E
F
D
G
TP01508
Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed
2.3.1 Front Control Panel
The front control panel contains system control buttons and LED status indicators. It also
contains one video connector, three USB 2.0 ports, NMI button, and the system speaker.
The front bezel must be removed to access the front control panel switches and connectors.
All LEDs are visible with the front bezel installed. See Chapter 8 or a description of the Front
Panel Boards.
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2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays
The hard disk drive and peripheral device bays can accommodate the following devices:
Ten 1-inch hot-swap Ultra320 SCSI hard disk drives
One ½-inch optical drive (installed with base system)
Two half-height or one full-height 5¼-inch SCSI tape device
Note: Cooling and EMI constraints do not allow installation of an IDE hard disk drive in
the tape device bay.
The SCSI Backplane Board supports Low Voltage Differential (LVD) SCSI drives only.
Single-ended (SE) devices are supported off the secondary external SCSI channel on the
Server Board Set SE8500HW4 Mainboard. SE devices are not supported in the hot-swap
hard disk drive bays in the front of the system, or validated by Intel.
The optical drive and SCSI tape device(s) are not hot-swap devices. System power must be
turned off when installing or removing these drives.
Because hard disk drives have different cooling, power, and vibration characteristics, Intel
will validate specific hard disk drive types in the Server Platform SR6850HW4. See the Intel
Server Board Set SE8500HW4 Tested Hardware and Operating System List for the qualified
drives.
The hard disk drive carriers supplied with the system accommodate 3½-inch x 1-inch SCSI
hard disk drives. The hard disk drive is attached to the carrier with four Phillips*-head
screws. The carrier is retained in the chassis by a locking handle.
The SCSI Backplane Board contains a dual color LED for each hard drive to display status.
The LED signal is transmitted to the front of the system via a light pipe integrated in the hard
drive carrier.
Due to the required cable length and bus performance, the Server Board Set SE8500HW4
Mainboard contains a Serial ATA (SATA) connecter instead of a Parallel ATA (PATA)
connector. The optical drive connects to the SATA-to-IDE Converter Board, which converts
the SATA signal to an IDE signal for the 1/2-inch optical drive. The optical drive is installed
in a sheet metal bracket and then installed in the Server Platform SR6850HW4.
See Chapter 7 for a description of the SCSI Backplane Board. See Chapter 9 for
descriptions of the SATA-to-IDE Converter Board.
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2.4 External Chassis Features - Rear
Figure 5 shows the rear view of the Server Platform SR6850HW4. The user-accessible
connectors, PCI slots, and power supply modules located at the rear of the system are described
in the following sections.
A
B
1743256
C
D
F
E
P
I
KJ
H
A Video connector
B Serial port connector
C PCI slots
Slot 1 PCI Express* x8 (hot-plug)
Slot 2 PCI-X* 133Mhz, 64-bit (hot-plug)
Slot 3 PCI Express x4 (hot-plug)
Slot 4 PCI Express x4 (hot-plug)
Slot 5 PCI Express x4 (hot-plug)
Slot 6 PCI-X 100Mhz, 64-bit (not hot-plug)
Slot 7 PCI-X 100Mhz, 64-bit (not hot-plug)
D External SCSI connector
E System ID LED (blue)
F Fibre Channel Module slot (optional accessory)
G Power supply unit
H USB 2.0 ports (two)
I LAN ports, RJ45 connector (LAN1 on top, LAN2 on bottom)
J AC input power connector
K Power supply unit status LEDs
L Power cord retention featurek
M Active fan power supply blank
N System ID button
O DC jack (not used)
P Dedicated server management port, RJ45 connector (used with the IMM Advanced)
LG M
N
O
TP01507
Figure 5. Rear View of the Server Platform SR6850HW4
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2.5 Internal Chassis Features
2.5.1 Server Board Set SE8500HW4 Mainboard
The Server Board Set SE8500HW4 Mainboard supports the following features:
Four sockets for 64-bit Intel Xeon processors MP with 1MB L2 cache or 64-bit Intel
Xeon processors with up to 8MB L3 cache
Four PCI Express* x16 Memory Board connectors
- Four independent memory interface buses
- Supports hot-remove and hot-add operations
Dual 667 MT/s Front Side Buses (FSB)
Intel E8500 chipset North Bridge (NB) with two shared 64-bit FSB interfaces
configured for symmetric multiprocessing (SMP)
Intel E8500 chipset eXtended Memory Bridge (XMB) for support of memory hot-plug
Intel
Intel
Intel
LSI Logic* 53C1030 Ultra320* SCSI Controller: provides two independent Ultra320
Broadcom* BRCM5704 NetXtreme* Gigabit Ethernet controller: provides two ports
ATI* Radeon* 7000 video controller
Advanced I/O slots including PCI Express and PCI-X and support circuits:
Buttons and LED indicators for PCI hot-plug slots
Low Pin Count (LPC) Super I/O* enables the serial port/EMP
USB 2.0 support
4MB Flash capacity to support rolling BIOS updates
Optional ROMB support: provides two channels of RAID 0, 1, 5, 10 or 50
Optional custom Fibre Channel Module: provides two optical connectors
Server management support via the Intel Management Module (IMM) connector
®
6700 PXH 64-bit Hub which acts as the bridge between the NB and PCI-X bus
®
82801EB I/O Controller Hub 5 (ICH5) which provides USB 2.0 and SATA
®
IOP332 storage I/O Processor for mass storage and PCI-X slots
SCSI interfaces
on the rear of the Mainboard
- 16MB embedded SDRAM
- Mirrored to both the rear and front I/O ports by default
- One hot-plug PCI Express x8 slot
- Three hot-plug PCI Express x4 slots
- One hot-plug 64-bit PCI-X 133MHz slot
- Two 64-bit PCI-X 100MHz slots (not hot-plug)
- Two ports at the rear of chassis
- Three ports on front of the chassis
See the Intel Server Board Set SE8500HW4 Technical Product Specification for a
description of this board.
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System Overview Intel® Server Platform SR6850HW4 TPS
2.5.2 Server Board Set SE8500HW4 Memory Board
Each Memory Board supports the following features:
PCI Express x16 card edge connector that plugs into the Server Board Set
SE8500HW4 Mainboard
Intel E8500 chipset eXtended Memory Bridge (XMB)
Four DDR2 400HMz DIMM slots for registered ECC memory
Support for both single-rank and dual-rank DIMMs
Two DDR2 400MT/s busses
Independent Memory Interface (IMI), a high-speed differential bus
LED error indicators for each DIMM and an attention LED for hot-plug events
LED indicator for both memory mirroring and RAID configurations
Memory hot-plug at the card level, based on the PCI hot-plug model
Field Replaceable Unit (FRU) device
Two temperature sensors
Safety mechanism for instant power shut-down to the Memory Board when not
properly removed or inserted
See the Intel Server Board Set SE8500HW4 Technical Product Specification for
descriptions of this board.
2.5.3 Power Distribution Board
The Power Distribution Board is located horizontally, below the Server Board Set
SE8500HW4 Mainboard in the middle-rear of the chassis. It has two connectors for the hotswap power supply modules and provides 12V, standby power and server management
signals to the Server Board Set SE8500HW4 Mainboard and SCSI Backplane Board. The
power distribution circuitry reports quantity, quality, and location of the installed power
supplies through I
2
C server management. See Chapter 6 for a description of this board.
2.5.4 SCSI Backplane Board Board
The SCSI Backplane Board mounts vertically in the front of the system and contains ten
industry-standard hot-swap Single Connector Attach 2 (SCA-2) connectors (80-pin).
Ultra320 (or slower) Low Voltage Differential (LVD) SCSI hard disk drives can be installed in
the system. The backplane accepts 15,000-RPM (and slower) hard disk drives. SingleEnded (SE) SCSI devices are not supported in the hot-swap hard disk drive bay.
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The SCSI Backplane Board performs the tasks associated with hot-swapping of the hard
disk drives and enclosure (chassis) monitoring and management, as specified in the SCSI
Accessed Fault-Tolerant Enclosures (SAF-TE) Specification.
The SAF-TE-specified features
supported by the SCSI Backplane Board include, but are not limited to, the following:
Monitoring the SCSI bus for enclosure services messages, and acting on them
appropriately. Examples of such messages include: activate a drive fault indicator;
power down a drive that has failed; and report backplane temperature.
SAF-TE intelligent agent acts as proxy for "dumb" I
2
C devices (that have no bus
mastering capability) during intrachassis communications.
The SCSI Backplane Board connects to the Server Board Set SE8500HW4 Mainboard,
provides power, and signals to the front of the chassis. See Chapter 7 for a description of
this board.
2.5.5 Front Panel I/O Board
The Front Panel I/O Board mounts horizontally in the front left of the system and
communicates with the SCSI Backplane Board.
USB ports and an NMI button.
See Chapter 8 for a description of this board.
The board contains a video connector, three
2.5.6 Front Panel Control Board
Two different front panel Control Boards are supported, the standard control panel and the
Intel Local Control Panel (LCP). Both mount vertically into the chassis and connect to the
Front Panel I/O Board via a cable. Each module houses the system operating buttons, LEDs
and the Local Control Panel has an LCD. See Chapter 8 for a description of these boards.
2.5.7 SATA-to-IDE Converter Board
The SATA-to-IDE Converter Board attaches to the optical drive carrier, receives the SATA
signal from the Server Board Set SE8500HW4 Mainboard via a SATA cable, and converts it to
IDE signals routed to the optical drive. See Chapter 9 for a description of this board.
2.5.8 Intel® Management Module
The Intel Management Module (IMM) mounts onto the Server Board Set SE8500HW4
Mainboard and contains the Baseboard Management Controller (BMC) that provides server
management support.
The Advanced module adds more support for remote management. The Server Platform
SR6850HW4 will not boot without one of these modules installed.
Module Installation and User’s Guide or the Intel Management Module Technical Product
Specification for a description of this part.
There are two versions of the IMM, the Professional and Advanced.
See the Intel Management
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2.5.9 Fibre Channel Module
The Server Board Set SE8500HW4 Mainboard supports the Intel Fibre Channel Module as
a mass storage expansion option. The card is based on the Qlogic* ISP2322 FC PCI-X
controller and plugs into a reversed PCI Express x16 slot on the Server Board Set
SE8500HW4 Mainboard. See the Intel Fibre Channel Module Users Guide for descriptions
of this board.
2.5.10 RAID On Motherboard (ROMB)
The Server Board Set SE8500HW4 Mainboard supports a RAID On Motherboard (ROMB)
solution via the Intel IOP332 storage I/O Processor
in conjunction with the LSI Logic*
53C1030 SCSI controller. To enable this option the Intel RAID Activation Key and a DDR2
400MHz DIMM are required. The optional Intel RAID Smart Battery is also available to
maintain the contents of the DIMM in the event of power loss. See the Intel RAID Smart
Battery Technical Product Specification for a description of the ROMB solution.
2.5.11 Power Supply Module
Two hot-swap power supply modules are installed side by side at the rear of the chassis.
Each supply has its own AC input power connector and is rated at 1570W over an input
range of 100-240 VAC.
The power subsystem is configured as follows:
With two power supply modules installed, a fully configured system has (1+1) power
redundancy.
With one supply module installed, the system does not have redundant power but
will still run a fully configured system.
Note: When only one power supply module is installed, the active fan module is required in
the unpopulated power supply slot for proper system cooling.
One power supply module is capable of handling the maximum power requirements for a
fully configured Server Platform SR6850HW4, which includes four processors, 64 GB of
memory, seven PCI add-in cards, ten hot-swap hard disk drives, an optical drive, a Fibre
Channel Module, ROMB options installed, and a SCSI tape device.
When two power supply modules are installed, the user can replace a failed power supply
module without affecting the system functionality. Power supplies have three LEDs to
identify failure, power good and AC OK.
The power subsystem receives AC power through two power cords.
When two power supply
modules and two power cords are installed, the system has (1+1) power cord redundancy
and can be powered by two separate AC sources.
In this configuration, the system will
continue to function without interruption if one of the AC sources fails. See Chapter 5 for
more information.
Note: The total power requirement for the Server Platform SR6850HW4 exceeds the 240
VA energy hazard limits that define an operator accessible area. As a result, only
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qualified technical individuals should access the processor and non-hot-plug I/O
areas while the system is energized. Power cords should be removed from the
system before accessing non-hot-plug areas.
2.5.11.1 System Power Budget
Table 3 shows a summary of the system power budget.
voltage rail in columns and each major subsystem of the product in rows.
power per subsystem is listed for each voltage rail.
The power budget lists each major
The worst-case
The total power per voltage rail, the
power supply specification, and the margin available are shown at the bottom of the table.
Table 3. System Power Budget
Subsystem Qty +3.3V +5V +12V (Total) +3.3V
Mainboard 1 49W 27W 147W 15W
SCSI Backplane Board
Board
Front Panel I/O Board
and front panel
Processors 4 448W
Memory 16 4W 192W
Fans 6 173W
Hard disk drives 10 28W 84W
½inches optical drive 1 1W 6W
SCSI tape device 1 3W 7W
PCI-X* slots 3 45W
PCI Express* slots 4 80W
Fibre channel module 1 15W
System Total 1189.5W 15W
Power subsystem spec 1570W 16.5W
Margin 380.5W 1.5W
1 2.5W 2.5W
1ea 2W 2W
stby
Notes:
1. 3.3V and 5V are derived from the 12V single switched output of the power
supply modules.
2. 3.3V
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is the standby output of the power supply modules.
stby
The 12V column includes the 3.3V and 5V power.
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2.5.12 Cooling Subsystem
Primary cooling is generated by six fans, located at the top front of the chassis. It connects
to the SCSI Backplane Board for power and server management. Air flows in through the
front and exhausts out the rear of the chassis. The chassis has several air baffles to duct the
air over critical parts, including processors, memory, and peripherals. Processor heat sinks
or processor heat sink blanks, and Memory Boards or Memory Board blanks must be
installed in each corresponding area to ensure proper airflow.
The system fans are sized to provide cooling for a fully configured system. The cooling
system is designed using a worst-case analysis and appropriate fan speeds were chosen to
meet acoustic and thermal requirements. Server management controls fan speed based on
ambient and component temperatures. To ensure proper cooling, failed fans should be
replaced within 1 minute.
2.6 New Platform Features
2.6.1 Advanced Memory Performance and Protection
The Server Board Set SE8500HW4 supports several new memory features that allow
flexibility in performance, redundancy and the ability to upgrade. The System BIOS can be
configured as follows:
Maximum performance, where memory is up to four-way interleaved
Maximum compatibility, where memory can be hot-added
Memory mirroring, where two or four boards are used to keep a copy of system
memory
Memory RAID, where four boards are used in a RAID4-like mode
Memory sparing, where a portion of each Memory Board is reserved for failover.
Hot-replace means the user can replace a Memory Board with another Memory Board of
identical total size. This operation is supported in maximum compatibility, memory RAID and
memory mirroring modes.
Hot-add means the user can add a Memory Board to a previously unoccupied slot. This
requires operating system support and is supported in memory compatibility and memory
mirroring modes.
Hot-removal means the user can remove a Memory Board. This operation is supported in
memory RAID and memory mirroring modes.
Hot upgrade means the user can replace an existing Memory Board with a Memory Board
that contains more memory capacity. A hot upgrade is not a unique operation, it is
implemented as a hot-remove followed by a hot-add. This requires operating system support
and is supported by the memory RAID mode only.
See the Intel Server Board Set SE8500HW4 Technical Product Specification for more
details on these new features.
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2.6.2 Rolling BIOS
The Server Board Set SE8500HW4 Mainboard supports two BIOS images to be stored in
Flash. This provides a mechanism for BIOS updates without a system reboot as well as
failover to an alternate image in the event of BIOS corruption. The system runs with the
current BIOS until a reboot, after which time the updated BIOS is used. See the Intel Server
Board Set SE8500HW4 Technical Product Specification for more details on this feature.
2.7 Server Management
The management subsystem conforms to the IPMI v2.0 Specification. The server
management features are implemented using two microcontrollers: the Intel Management
Module that plugs into the Server Board Set
controller on the SCSI Backplane Board. The functions of each component are summarized
in the following sections.
2.7.1 Intel Management Module (IMM)
The IMM has a Baseboard Management Controller (BMC) microcontroller and associated
circuitry. The IMM contains flash memory that holds the operation code and the BMC
configuration settings. The IMM monitors platform management events and logs their
occurrence on the onboard non-volatile System Event Log (SEL). This includes events such
as over-temperature and over-voltage conditions, fan failures, etc. The IMM also provides
the interface to this monitored information so system management software can poll and
retrieve the present status of the platform.
SE8500HW4 Mainboard, and the SCSI hot-swap
The IMM also provides the interface to the non-volatile Sensor Data Record (SDR)
repository. SDRs provide a set of information that system management software can use to
automatically configure itself for the number and type of IPMI sensors (e.g., temperature
sensors, voltage sensors, etc.) in the system.
The following is a list of the major functions for the IMM:
System power control
- ACPI power control
- ACPI sleep support
- Minimum power off time
System reset control
System initialization
- Processor temperature and voltage threshold setting
- Fault Resilient Booting (FRB)
Front panel user interface
- System status (green) LED control
- System status (amber) LED control
- System ID LED control
- Reset button control
- Power button control
- SDINT button control
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- System ID Button control
System fan management
System management watchdog timer
System Event Log (SEL) interface – up to 3,200 entries
Sensor Data Record (SDR) repository interface
SDR/SEL timestamp clock
FRU inventory device
Diagnostics and beep code generation
Event message generation and reception
Platform Event Paging and Platform Event Filtering (PEP and PEF)
Dial page alerting
Alert over LAN and serial/PPP
Serial over LAN (SOL)
Terminal Mode (TM)
Battery monitoring
Sensor monitoring
- Temperature
- Voltage
- Fan speed
- Processor status
- Power supplies
Processor Information ROM (PIROM) and Scratch Electrically Erasable
Programmable ROM (SEEPROM) access
IPMB communication interface
Emergency Management Port (EMP) interface - IPMI messaging over Serial/Modem.
This feature is also referred to as DPC (Direct Platform Control) over Serial/Modem
Inter-Chassis Management Bus (ICMB) interface - IPMI messaging between chassis
Additional features with IMM Advanced installed:
- Dedicated (Out-Of-Band) LAN interface through the Generic Communication
Module (GCM) on the rear of chassis (IMM Advanced)
- BMC-resident SNMP support for Out-Of-Band access using 3
rd
party applications
such as HP* Openview*
- Embedded web server to access system health, view the SEL and issue IPMI
commands
- Embedded Command Line Interface (using telnet server running on the BMC) to
allow direct access to the BMC
- Alerting via email
- Keyboard, Video, Mouse (KVM) console redirection and remote viewer
See the Management Module Technical Product Specification for more information.
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