Intel SR6850HW4 User Manual

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Intel® Server Platform SR6850HW4

Technical Product Specification

Intel order number D23151-001

Enterprise Platforms and Services Division – Marketing

Intel Confidential

Revision 1.0

May, 2005

Revision History Intel® Server Platform SR6850HW4 TPS

Revision History

Date Revision

Number

May 2005 1.0 Initial release.

Modifications

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” inches or “undefined” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design.

The Intel® Server Platform SR6850HW4 may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel Corporation server baseboards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

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Table of Contents

1. Product Overview.................................................................................................................1

2. System Overview..................................................................................................................3

2.1 System Feature Overview........................................................................................ 3

2.2 Introduction .............................................................................................................. 4

2.3 External Chassis Features - Front ........................................................................... 8

2.3.1 Front Control Panel.................................................................................................. 8

2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays .......................................... 9

2.4 External Chassis Features - Rear.......................................................................... 10

2.5 Internal Chassis Features...................................................................................... 11

2.5.1 Server Board Set SE8500HW4 Mainboard............................................................ 11

2.5.2 Server Board Set SE8500HW4 Memory Board ..................................................... 12

2.5.3 Power Distribution Board ....................................................................................... 12

2.5.4 SCSI Backplane Board Board ...............................................................................12

2.5.5 Front Panel I/O Board............................................................................................ 13

2.5.6 Front Panel Control Board ..................................................................................... 13

2.5.7 SATA-to-IDE Converter Board............................................................................... 13

2.5.8 Intel® Management Module................................................................................... 13

2.5.9 Fibre Channel Module ...........................................................................................14

2.5.10 RAID On Motherboard (ROMB) ............................................................................. 14

2.5.11 Power Supply Module............................................................................................ 14

2.5.12 Cooling Subsystem................................................................................................ 16

2.6 New Platform Features .......................................................................................... 16

2.6.1 Advanced Memory Performance and Protection ................................................... 16

2.6.2 Rolling BIOS .......................................................................................................... 17

2.7 Server Management .............................................................................................. 17

2.7.1 Intel Management Module (IMM)........................................................................... 17

2.7.2 Hot Swap Controller............................................................................................... 19

2.8 Reliability, Availability, Serviceability, Usability, Manageability (RASUM) ............. 19

2.9 Expansion Support ................................................................................................20

2.10 Specifications......................................................................................................... 21

2.10.1 Environmental Specifications Summary ................................................................ 21

2.10.2 Physical Specifications .......................................................................................... 22

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3. Server System Chassis and Assemblies .........................................................................23

3.1 Chassis, Rails and Top Cover ............................................................................... 23

3.1.1 Chassis .................................................................................................................. 23

3.1.2 Slide Rails.............................................................................................................. 25

3.1.3 Top Cover .............................................................................................................. 25

3.2 Power and Fans..................................................................................................... 25

3.3 Fan Subsystem...................................................................................................... 26

3.4 Mainboard Assembly ............................................................................................. 26

3.5 Peripheral Bay and Front Panel............................................................................. 27

3.5.1 Hot-Swap Hard Disk Drive Carrier......................................................................... 27

3.5.2 Optical Drive Carrier .............................................................................................. 28

3.5.3 Front Panel ............................................................................................................ 29

3.6 Front Bezel ............................................................................................................30

4. Cables and Connectors .....................................................................................................31

4.1 Cable and System Interconnect Descriptions........................................................ 33

4.2 User-accessible I/O Connectors ............................................................................ 35

4.2.1 Video Connectors .................................................................................................. 35

4.2.2 USB 2.0 Connectors .............................................................................................. 36

4.2.3 Etherent Connectors.............................................................................................. 37

4.2.4 External 68-pin Ultra320 SCSI VHDCI Connector................................................. 39

4.2.5 Internal 68-pin SCSI Connectors ........................................................................... 40

4.2.6 80-pin SCA2 Hard Disk Drive Connectors............................................................. 41

4.2.7 AC Power Input Connectors .................................................................................. 42

4.2.8 3-pin Chassis Intrusion Connector......................................................................... 42

4.2.9 12-pin Power Distribution Board Power Connector ............................................... 42

4.2.10 30-pin Power Distribution Board to Mainboard Connector .................................... 43

4.2.11 30-pin SCSI Backplane Board Board to Front Panel I/O Board Connector........... 43

4.2.12 100-pin Mainboard to SCSI Backplane Board Board Connector........................... 44

4.2.13 Peripheral Power Connector.................................................................................. 45

4.2.14 Fan Connectors ..................................................................................................... 46

4.2.15 50-pin Front Panel Control Module Connector ...................................................... 47

4.2.16 SATA-to-IDE Converter Board Connector ............................................................. 48

4.2.17 SATA-to-IDE Converter Board Power Connector .................................................. 48

4.2.18 SATA Connector.................................................................................................... 49

5. Power Supply......................................................................................................................51

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5.1 Mechanical Outline ................................................................................................ 52

5.2 Power Supply Output Interface.............................................................................. 54

5.2.1 Blade Connector .................................................................................................... 54

5.3 AC Input Requirement ........................................................................................... 55

5.3.1 AC Input Voltage Specification .............................................................................. 55

5.3.2 Efficiency ...............................................................................................................55

5.3.3 Input Over-Current Protection................................................................................ 55

5.3.4 Inrush Current........................................................................................................ 55

5.3.5 Auto Restart........................................................................................................... 56

5.3.6 Power Factor Correction (PFC) ............................................................................. 56

5.3.7 AC Input Connector ............................................................................................... 56

5.4 DC Output Requirements ...................................................................................... 56

5.4.1 Hot Swap Functionality .......................................................................................... 57

5.4.2 Output Current Rating............................................................................................ 57

5.4.3 Over- and Under-Voltage Protection ..................................................................... 57

5.4.4 Over-current Protection .........................................................................................58

5.4.5 Short Circuit Protection.......................................................................................... 58

5.4.6 Reset After Shutdown............................................................................................ 58

5.4.7 Current Sharing .....................................................................................................59

5.4.8 I2C Devices ............................................................................................................ 59

5.4.9 Fan Speed Control................................................................................................. 61

5.4.10 Power Supply Module LED indicators ................................................................... 61

6. Power Distribution Board..................................................................................................63

6.1 Introduction ............................................................................................................ 63

6.2 Signal Descriptions and Pinouts ............................................................................ 65

6.2.1 Remote On/Off (-PS_ON)...................................................................................... 66

6.2.2 Power Good Signal (POK or P_GOOD) ................................................................66

6.2.3 VIN_GOOD............................................................................................................ 66

7. SCSI Backplane Board.......................................................................................................67

7.1 Introduction ............................................................................................................ 67

7.1.1 Block Diagram .......................................................................................................67

7.1.2 Architectural Overview........................................................................................... 68

7.1.3 Mechanical Specifcations ...................................................................................... 70

7.1.4 Component Location.............................................................................................. 71

7.2 Functional Architecture .......................................................................................... 73

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7.2.1 SCSI Buses ...........................................................................................................73

7.2.2 SCSI Drive Power Control .....................................................................................73

7.2.3 SCSI Enclosure Management ............................................................................... 75

7.2.4 Server Management Interface ............................................................................... 76

7.2.5 Resets.................................................................................................................... 77

7.2.6 Connector Interlocks.............................................................................................. 77

7.2.7 Clock Generation ................................................................................................... 77

7.2.8 Programmed Devices ............................................................................................ 78

7.3 Signal Descriptions ................................................................................................ 78

7.3.1 Power from the Power Distribution Board.............................................................. 79

7.3.2 Front Panel Power Connector ...............................................................................79

7.3.3 Front Panel I/O Board Ribbon Cable Connector ................................................... 79

7.3.4 LVD SCSI 68-pin Connector.................................................................................. 80

7.3.5 SCA2 80-pin Drive Connectors.............................................................................. 81

7.3.6 Fans....................................................................................................................... 82

7.3.7 Internal Logic Signals ............................................................................................82

7.4 Electrical, Environmental, and Mechanical Specifications..................................... 83

7.4.1 Electrical Specifications ......................................................................................... 83

8. Front Panel I/O and Control Boards .................................................................................85

8.1 Introduction ............................................................................................................ 85

8.1.1 Block Diagram .......................................................................................................85

8.1.2 Architectural Overview........................................................................................... 86

8.1.3 Component Location.............................................................................................. 87

8.2 Functional Architecture .......................................................................................... 88

8.2.1 VGA ....................................................................................................................... 88

8.2.2 USB .......................................................................................................................88

8.2.3 NMI Button............................................................................................................. 88

8.3 Signal Descriptions ................................................................................................ 89

8.3.1 USB Connector...................................................................................................... 89

8.3.2 Front Panel VGA Connector .................................................................................. 90

8.4 Electrical, Environmental, and Mechanical Specifications..................................... 90

8.4.1 Electrical Specifications ......................................................................................... 90

8.4.2 Connector Specifications ....................................................................................... 91

8.4.3 Cooling Requirements ........................................................................................... 91

8.5 Front Panel Control Module................................................................................... 92

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8.5.1 Button Control Panel.............................................................................................. 92

8.5.2 Intel® Local Control Panel...................................................................................... 94

8.5.3 System ID Buttons and LEDs ................................................................................ 95

9. SATA-to-IDE Converter Board...........................................................................................97

9.1 Mechanical Outline ................................................................................................ 97

10. Regulatory Specifications .................................................................................................99

10.1 Important Safety Information ................................................................................. 99

10.2 Intended Application Uses ..................................................................................... 99

10.3 Product Safety ....................................................................................................... 99

10.4 Electromagnetic Compatibility (EMC) – Emissions and Immunity ......................... 99

10.5 Certifications / Registrations / Declarations ......................................................... 100

10.6 Regulatory Compliance Markings........................................................................ 101

10.7 Regional EMC Compliance Notices/Information.................................................. 102

Glossary...................................................................................................................................105

Reference Documents............................................................................................................107

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List of Figures Intel® Server Platform SR6850HW4 TPS

List of Figures

Figure 1. Intel

Server Platform SR6850HW4, Bezel Removed .................................................. 4

Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed ............... 5

Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed........................... 6

Figure 4. Server Platform SR6850HW4 Chassis Block Diagram................................................ 7

Figure 5. Rear View of the Server Platform SR6850HW4 ........................................................10

Figure 6. Server Platform SR6850HW4 Rack and Pedestal Configurations ............................. 24

Figure 7. Server Platform SR6850HW4, Bezel and Top Cover Removed................................24

Figure 8. Rear of Server Platform SR6850HW4, Power Supplies Installed.............................. 25

Figure 9. System Fan................................................................................................................. 26

Figure 10. Mainboard and Sheet Metal Tray, Assembly............................................................ 27

Figure 11. Hot-Swap Hard Drive Carrier.................................................................................... 28

Figure 12. Optical Drive Carrier with SATA-to-IDE Converter Board.........................................28

Figure 13. Front Panel with Button Control Panel...................................................................... 29

Figure 14. Front Panel with Intel

Local Control Panel .............................................................. 29

Figure 15. Front Bezels (Rack and Pedestal) ............................................................................ 30

Figure 16. Server Platform SR6850HW4 Interconnect Diagram............................................... 32

Figure 17. Dual Stacked Ethernet Connector ............................................................................ 38

Figure 18. 68-Pin SCSI Connector Non-Shielded...................................................................... 40

Figure 19. SCA2 80-Pin SCSI Connector .................................................................................. 41

Figure 20. AC Power Input Connector ....................................................................................... 42

Figure 21. 1570W Power Supply ............................................................................................... 51

Figure 22. Power Supply Mechanical Specification ................................................................... 53

Figure 23. Power Supply Signal Sharing ................................................................................... 63

Figure 24. Power Distribution Board Layout .............................................................................. 64

Figure 25. Power Distribution Board to Power Supply Module Docking Connector Signals...... 65

Figure 26. Mainboard Connector Signals ..................................................................................66

Figure 27. Server Platform SR6850HW4 SCSI Backplane Board Board Block Diagram ......... 68

Figure 28. SCSI Backplane Board Board Component Placement (Primary Side) ..................... 70

Figure 29. SCSI Backplane Board Board Component Placement (Primary Side) ..................... 71

Figure 30. SCSI Backplane Board Board Component Placement (Secondary Side) ................ 72

Figure 31. Enclosure Management Signal Flow Diagram.......................................................... 75

Figure 32. Front Panel I/O Board Block Diagram ......................................................................86

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Figure 33. Front Panel I/O Board Placement Diagram .............................................................. 87

Figure 34. Front Panel I/O Board...............................................................................................88

Figure 35. Button Control Panel Features .................................................................................92

Figure 36. Local Control Panel Features ................................................................................... 95

Figure 37. SATA-to-IDE Converter Board Mechanical Outline .................................................. 97

Figure 38. SATA-to-IDE Converter Board.................................................................................. 97

Figure 39. SATA-to-IDE Converter Board with Attached Optical Drive...................................... 98

Figure 40. SATA-to-IDE Converter Board with Attached Optical Drive...................................... 98

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List of Tables Intel® Server Platform SR6850HW4 TPS

List of Tables

Table 1. Intel

Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed................................. 8

Table 3. System Power Budget .................................................................................................15

Table 4. Expansion Support....................................................................................................... 20

Table 5. Environmental Specifications Summary ......................................................................21

Table 6. Physical Specifications ................................................................................................22

Table 7. Cable Descriptions.......................................................................................................33

Table 8. Connector Descriptions................................................................................................33

Table 9. Video Connector Pinout ............................................................................................... 35

Table 10. Dual USB Connector Pinout .....................................................................................36

Table 11. TaDual Ethernet Stacked Connector ......................................................................... 37

Table 12. Server Management Ethernet Connector .................................................................. 38

Table 13. Ultra320 SCSI VHDCI Connector Pinout ...................................................................39

Table 14. 68-Pin SCSI Connector Pinout ..................................................................................40

Table 15. SCA2 Drive Connector Pinout ...................................................................................41

Table 16. 3-pin Chassis Intrusion Connector.............................................................................42

Server Platform SR6850HW4 Feature List........................................................... 3

Table 17. Power Connector Pinout ............................................................................................ 42

Table 18. 30-pin Power Distribution Board to Mainboard Connector......................................... 43

Table 19. Front Panel I/O Board Connector Signal Description ................................................43

Table 20. 100-pin Connector Pinout (Unused and Ground) ......................................................44

Table 21. 100-pin Connector Pinout (Signals) ........................................................................... 44

Table 22. Peripheral Power Connector...................................................................................... 45

Table 23. 12-pin Fan Power and Control ................................................................................... 46

Table 24. 24-pin Fan Power and Control J6E1.......................................................................... 46

Table 25. Front Panel Control Module Connector Signal Description .......................................47

Table 26. SATA-to-IDE Converter Board Connector ................................................................. 48

Table 27. SATA-To-IDE Converter Board Power Connector..................................................... 48

Table 28. SATA Signal Connector ............................................................................................. 49

Table 29. PowerBlade Pin Assignment...................................................................................... 54

Table 30. AC Input Rating.......................................................................................................... 55

Table 31. DC Output Voltage Regulation Limits ........................................................................ 56

Table 32. 1570W Load Ratings .................................................................................................57

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Table 33. Over- and Under-voltage Limits ................................................................................. 57

Table 34. Over-current Protection Limits ................................................................................... 58

Table 35. Output Current Sharing..............................................................................................59

Table 36. I/O Port Expander Signals .........................................................................................60

Table 37. I/O Port Expander Codes........................................................................................... 60

Table 38. Power Supply Fan Voltage ........................................................................................61

Table 39. Hot-swap SCSI Hard Disk Drive LED Details ............................................................74

Table 40. I

Table 41. Global I

Table 42. I

C Local Bus Addresses ...........................................................................................76

C Bus Addresses (IPMB Bus) ...................................................................... 77

C IO Bus Address .................................................................................................... 77

Table 43. Power Interface Signals ............................................................................................. 79

Table 44. Front Panel I/O Board Power Interface Signals ......................................................... 79

Table 45. Front Panel I/O Board Ribbon Connector Signal Description .................................... 79

Table 46. LVD SCSI Connector Signal Description ................................................................... 80

Table 47. .LVD SCSI Bus Signals.............................................................................................. 81

Table 48. Internal Logic Signals................................................................................................. 82

Table 49. Electrical Specifications ............................................................................................. 83

Table 50. Maximum Power Consumption .................................................................................. 83

Table 51. SCSI Backplane Board Board Power Limits per Drive .............................................. 84

Table 52. DC Voltage Regulation ..............................................................................................84

Table 53. USB Connector .......................................................................................................... 89

Table 54. VGA Connector Signal Description............................................................................ 90

Table 55. Electrical Specifications ............................................................................................. 90

Table 56. Maximum Power Consumption .................................................................................. 91

Table 57. DC Voltage Regulation ..............................................................................................91

Table 58. Server Platform SR6850HW4 Front Panel I/O Board Connector Specifications ......91

Table 59. Button Control Panel Details...................................................................................... 92

Table 60. System ID LED Details ..............................................................................................95

Table 61. Product Regulatory Compliance Markings............................................................... 101

Table 62. Regional EMC Compliance Information................................................................... 102

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Intel® Server Platform SR6850HW4 TPS Product Overview

1. Product Overview

This product specification details the features of the Intel® Server Platform SR6850HW4. Reliability, low cost, time to market, modularity, high performance, and management features are primary considerations in the design.

The Server Platform SR6850HW4 supports up to four 64-bit Intel

Xeon™ Processors MP with up to 8MB L3 cache and incorporates features that clearly differentiate it as a high availability server. Building on previous server platforms, the Server Platform SR6850HW4 introduces redundant memory and networking in addition to the enterprise features of hot-swap power, cooling, PCI slots, and hard disk drives. Advanced server management features are also included to remotely monitor and manage the server. Finally, the server has two optional mass storage expansion features.

This document is organized into ten chapters:

Chapter 1: Introduction

An overview of this document.

Chapter 2: System Overview

An overview of the system hardware.

Chapter 3: System Chassis and Sub-Assemblies

An overview of the chassis and major sub-assemblies.

Chapter 4: Cables and Connectors

Describes the cables and connectors specific to the Server Platform SR6850HW4.

Chapter 5: Power Supply

Describes the power supplies used in the Server Platform SR6850HW4.

Chapter 6: Power Distribution Board

Describes the Power Distribution Board used in the Server Platform SR6850HW4 and

Intel

Server Platform SR4850HW4.

Chapter 7: SCSI Backplane Board

Describes the SCSI Backplane Board used in the Server Platform SR6850HW4.

Chapter 8: Front Panel I/O and Control Boards

Describes the Front Panel I/O Board and Control Boards used in the Server Platform SR6850HW4.

Chapter 9: SATA-to-IDE Converter Boards

Describes the SATA-to-IDE Converter Board used in the Server Platform SR4850HW4

and Server Platform SR6850HW4.

Chapter 10: Regulatory Specifications

Describes system compliance to regulatory specifications.

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Intel® Server Platform SR6850HW4 TPS System Overview

2. System Overview

This chapter describes the features of the Intel® Server Platform SR6850HW4.

2.1 System Feature Overview

Table 1 provides a list and brief description of the features of the Server Platform SR6850HW4, which utilizes the Intel

Server Board Set SE8500HW4.

Table 1. Intel® Server Platform SR6850HW4 Feature List

Feature Description

Compact, high-density system

Configuration flexibility One to four 64-bit Intel® Xeon™ processors MP with up to 8MB L3 cache

Serviceability Tool-less design features

Availability Two 1570W power supplies in a redundant (1+1) configuration with separate power cords

Manageability Remote management

Rack-mount server with a height of 6U (10.5 inches) and a depth of 28 inches (706mm)

Two Ultra320* SCSI ports

Two gigabit Ethernet ports

Ten 1-inch hot-swap Ultra320 SCSI hard disk drives

Seven PCI adapters (Four PCI Express* hot-plug, one PCI-X* 133MHz hot-plug, two PCI-X 100Mhz)

64GB Double Data Rate2 (DDR2) 400 MHz Synchronous Dynamic Random Access Memory (SDRAM), ECC Registered

Customizable bezel

Optional system-specific 2Gbps Fibre Channel Module

Optional RAID On Motherboard (ROMB) with DDR2 DIMM for disk cache and optional RAID Smart Battery (RSB) for cache battery backup

Either button or LCD front panel

Either Intel® Management Module (IMM) – Professional or Advanced

Front access to hot-swap hard disk drives

Top access to hot-plug PCI slots, cooling, and Hot-Swap Memory Boards

Rear access to hot-swap power supplies

Status and fault indicator LEDs

Front and rear viewable System ID switches and LEDs

Top viewable memory configuration and status LEDs

Processor failure LEDs

Detailed configuration label on top cover

Color-coded parts to identify hot-swap and non-hot-swap serviceable components

Four Hot-Plug Memory Boards

Intelligent Platform Management Interface (IPMI) 2.0 compliant

Wired For Management (WfM) 2.0 compliant

Emergency Management Port (EMP) – IPMI over serial or modem

Extensive system sensors and monitoring

Remote diagnostics support via serial and LAN ports

Web management console

With IMM Advanced:

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Feature Description

Dedicated Out-Of-Band management RJ45 port (telnet, embedded web server, DNS, DHCP)

KVM console redirection and remote viewer

Full SNMP access

Front panel interface Switches: Power, Reset, NMI, System ID

Video connector, Three USB 2.0

Ports:

Power, System ID, System status,

LEDs: LAN1 and LAN2 Activity, Hard drives status

Optional LCD

2.2 Introduction

The platform supports sockets for up to four 64-bit Intel Xeon processors MP, up to 64GB of memory, ten hot-swap hard disk drives, seven PCI slots, two different server management modules, two different front control panels, and two optional mass storage expansions. The server can be configured for use as either a rack, as shipped, or pedestal, with an optional accessory kit.

Figure 1, Figure 2 and Figure 3 show front and rear views of the platform.

Figure 1. Intel® Server Platform SR6850HW4, Bezel Removed

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TP01504

Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed

The Server Platform SR6850HW4 includes the Intel

Server Board Set SE8500HW4 with the E8500 chipset. To provide structural support the Intel Server Board Set SE8500HW4 Mainboard is mounted on a sheet metal tray that is installed at the rear of the chassis, above the power supplies.

Up to four Memory Boards can be installed into the Server Board Set SE8500HW4 Mainboard. The Memory Boards attach perpendicular to the Server Board Set SE8500HW4 Mainboard. These contain four DDR2 400HMz SDRAM DIMM slots each. With four Memory Boards installed, the system supports up to 64GB of memory (using 4GB DIMMs).

The hard drive bay, located at the front of platform, provides a bay for ten hot-swap 1-inch Ultra320* SCSI hard disk drives. SCSI hard disk drives plug into a vertical SCSI Backplane Board at the rear of hard disk drive bay. One Slimline (½-inch high) optical drive bay and one full-height 5¼-inch SCSI tape device bay are also located at the front of the platform.

The cooling subsystem requires six hot-swap system fan modules. Each fan module contains a status LED that illuminates in the event of a fan failure. The fan modules are accessible from the top of the system when the top cover is removed and connected into the SCSI Backplane Board.

The front control panel provides video, USB, buttons, status LEDs, and an optional LCD, that are used for monitoring and managing the platform. The front bezel is an optional cosmetic accessory that is installed with snap-on features. The bezel can be customized to meet integrator-specific industrial design requirements, including color and imprint.

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Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed

The power supply modules are located at the rear of the system below the Server Board Set SE8500HW4 Mainboard and plug directly into connectors on the horizontally oriented Power Distribution Board. The system supports two hot-swap power supply modules in a 1+1 redundant configuration or one hot-swap power supply and a power bay fan module in a non-redundant state.

Upon removal of the top cover, the user has access to the processors, Memory Boards, PCI adapters, IMM Board and optional mass storage features.

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Intel® Server Board SE8500HW4 Main Board

CPU

FSB 1

6700 PXH

Power and

Signal

Power

Dist Board

CPU

E8500

North Bridge

(NB)

SCSI Cable

CPU

RAID

Act Key

IMI D

IMI C

IMI B

IMI A

FSB 0

IOP332

Processor

SCSI Cable

(optional)

SCSI

Backplane Board

XMB

DDR2 RAID DIMM

LSI*

53C1030

Ultra320*

SCSI

Controller

Memory Board

SE8500HW4 Memory Board

BRCM5704*

Ethernet

Controller

SCSI Channel B

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

RAID Smart

Battery

82801EB

ICH5

Radeon*

Controller

IMM

Power

Front Panel I/O Board

FWH

10/100

SATA Cable

Video Port

USB Port

ATI*

7000

Video

SIO

SATA-to-IDE

Converter Board

Optical

Drive

Ethernet Port

External SCSI Connector (optional)

USB Port

Video Port

COM1/EMP

GCM (optional)

Hot-swap SCSI Drives (10)

SCSI Tape

Hot Swap Fans (6)

Figure 4. Server Platform SR6850HW4 Chassis Block Diagram

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Front Control Panel

Optional LCD

System Overview Intel® Server Platform SR6850HW4 TPS

2.3 External Chassis Features - Front

Table 2 shows the front view of the Server Platform SR6850HW4 with the bezel removed. The front provides access to the following components:

 Buttons and LEDs (with optional LCD)  Video and USB connectors  Hard drive bay, optical drive, SCSI tape device

A Video connector

B USB 2.0 ports (three)

C Front control panel (button control panel shown)

D Hot-swap fans (six)

E 5 ¼ peripheral bay (full height)

F Optical drive bay

G Hot-swap SCSI hard disk drives (ten)

TP01508

Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed

2.3.1 Front Control Panel

The front control panel contains system control buttons and LED status indicators. It also contains one video connector, three USB 2.0 ports, NMI button, and the system speaker. The front bezel must be removed to access the front control panel switches and connectors. All LEDs are visible with the front bezel installed. See Chapter 8 or a description of the Front Panel Boards.

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2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays

The hard disk drive and peripheral device bays can accommodate the following devices:

 Ten 1-inch hot-swap Ultra320 SCSI hard disk drives  One ½-inch optical drive (installed with base system)  Two half-height or one full-height 5¼-inch SCSI tape device

Note: Cooling and EMI constraints do not allow installation of an IDE hard disk drive in

the tape device bay.

The SCSI Backplane Board supports Low Voltage Differential (LVD) SCSI drives only. Single-ended (SE) devices are supported off the secondary external SCSI channel on the Server Board Set SE8500HW4 Mainboard. SE devices are not supported in the hot-swap hard disk drive bays in the front of the system, or validated by Intel.

The optical drive and SCSI tape device(s) are not hot-swap devices. System power must be turned off when installing or removing these drives.

Because hard disk drives have different cooling, power, and vibration characteristics, Intel

will validate specific hard disk drive types in the Server Platform SR6850HW4. See the Intel Server Board Set SE8500HW4 Tested Hardware and Operating System List for the qualified

drives.

The hard disk drive carriers supplied with the system accommodate 3½-inch x 1-inch SCSI hard disk drives. The hard disk drive is attached to the carrier with four Phillips*-head screws. The carrier is retained in the chassis by a locking handle.

The SCSI Backplane Board contains a dual color LED for each hard drive to display status. The LED signal is transmitted to the front of the system via a light pipe integrated in the hard drive carrier.

Due to the required cable length and bus performance, the Server Board Set SE8500HW4 Mainboard contains a Serial ATA (SATA) connecter instead of a Parallel ATA (PATA) connector. The optical drive connects to the SATA-to-IDE Converter Board, which converts the SATA signal to an IDE signal for the 1/2-inch optical drive. The optical drive is installed in a sheet metal bracket and then installed in the Server Platform SR6850HW4.

See Chapter 7 for a description of the SCSI Backplane Board. See Chapter 9 for descriptions of the SATA-to-IDE Converter Board.

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2.4 External Chassis Features - Rear

Figure 5 shows the rear view of the Server Platform SR6850HW4. The user-accessible

connectors, PCI slots, and power supply modules located at the rear of the system are described in the following sections.

1743256

A Video connector

B Serial port connector

C PCI slots

Slot 1 PCI Express* x8 (hot-plug)

Slot 2 PCI-X* 133Mhz, 64-bit (hot-plug)

Slot 3 PCI Express x4 (hot-plug)

Slot 4 PCI Express x4 (hot-plug)

Slot 5 PCI Express x4 (hot-plug)

Slot 6 PCI-X 100Mhz, 64-bit (not hot-plug)

Slot 7 PCI-X 100Mhz, 64-bit (not hot-plug)

D External SCSI connector

E System ID LED (blue)

F Fibre Channel Module slot (optional accessory)

G Power supply unit

H USB 2.0 ports (two)

I LAN ports, RJ45 connector (LAN1 on top, LAN2 on bottom)

J AC input power connector

K Power supply unit status LEDs

L Power cord retention featurek

M Active fan power supply blank

N System ID button

O DC jack (not used)

P Dedicated server management port, RJ45 connector (used with the IMM Advanced)

LG M

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Figure 5. Rear View of the Server Platform SR6850HW4

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2.5 Internal Chassis Features

2.5.1 Server Board Set SE8500HW4 Mainboard

The Server Board Set SE8500HW4 Mainboard supports the following features:

 Four sockets for 64-bit Intel Xeon processors MP with 1MB L2 cache or 64-bit Intel

Xeon processors with up to 8MB L3 cache

 Four PCI Express* x16 Memory Board connectors

- Four independent memory interface buses

- Supports hot-remove and hot-add operations

 Dual 667 MT/s Front Side Buses (FSB)  Intel E8500 chipset North Bridge (NB) with two shared 64-bit FSB interfaces

configured for symmetric multiprocessing (SMP)

 Intel E8500 chipset eXtended Memory Bridge (XMB) for support of memory hot-plug  Intel  Intel  Intel  LSI Logic* 53C1030 Ultra320* SCSI Controller: provides two independent Ultra320

 Broadcom* BRCM5704 NetXtreme* Gigabit Ethernet controller: provides two ports

 ATI* Radeon* 7000 video controller

 Advanced I/O slots including PCI Express and PCI-X and support circuits:

 Buttons and LED indicators for PCI hot-plug slots  Low Pin Count (LPC) Super I/O* enables the serial port/EMP  USB 2.0 support

 4MB Flash capacity to support rolling BIOS updates  Optional ROMB support: provides two channels of RAID 0, 1, 5, 10 or 50  Optional custom Fibre Channel Module: provides two optical connectors  Server management support via the Intel Management Module (IMM) connector

6700 PXH 64-bit Hub which acts as the bridge between the NB and PCI-X bus

82801EB I/O Controller Hub 5 (ICH5) which provides USB 2.0 and SATA

IOP332 storage I/O Processor for mass storage and PCI-X slots

SCSI interfaces

on the rear of the Mainboard

- 16MB embedded SDRAM

- Mirrored to both the rear and front I/O ports by default

- One hot-plug PCI Express x8 slot

- Three hot-plug PCI Express x4 slots

- One hot-plug 64-bit PCI-X 133MHz slot

- Two 64-bit PCI-X 100MHz slots (not hot-plug)

- Two ports at the rear of chassis

- Three ports on front of the chassis

See the Intel Server Board Set SE8500HW4 Technical Product Specification for a

description of this board.

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2.5.2 Server Board Set SE8500HW4 Memory Board

Each Memory Board supports the following features:

 PCI Express x16 card edge connector that plugs into the Server Board Set

SE8500HW4 Mainboard

 Intel E8500 chipset eXtended Memory Bridge (XMB)  Four DDR2 400HMz DIMM slots for registered ECC memory  Support for both single-rank and dual-rank DIMMs  Two DDR2 400MT/s busses  Independent Memory Interface (IMI), a high-speed differential bus  LED error indicators for each DIMM and an attention LED for hot-plug events  LED indicator for both memory mirroring and RAID configurations  Memory hot-plug at the card level, based on the PCI hot-plug model  Field Replaceable Unit (FRU) device  Two temperature sensors  Safety mechanism for instant power shut-down to the Memory Board when not

properly removed or inserted

See the Intel Server Board Set SE8500HW4 Technical Product Specification for

descriptions of this board.

2.5.3 Power Distribution Board

The Power Distribution Board is located horizontally, below the Server Board Set SE8500HW4 Mainboard in the middle-rear of the chassis. It has two connectors for the hotswap power supply modules and provides 12V, standby power and server management signals to the Server Board Set SE8500HW4 Mainboard and SCSI Backplane Board. The power distribution circuitry reports quantity, quality, and location of the installed power supplies through I

C server management. See Chapter 6 for a description of this board.

2.5.4 SCSI Backplane Board Board

The SCSI Backplane Board mounts vertically in the front of the system and contains ten industry-standard hot-swap Single Connector Attach 2 (SCA-2) connectors (80-pin). Ultra320 (or slower) Low Voltage Differential (LVD) SCSI hard disk drives can be installed in the system. The backplane accepts 15,000-RPM (and slower) hard disk drives. SingleEnded (SE) SCSI devices are not supported in the hot-swap hard disk drive bay.

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The SCSI Backplane Board performs the tasks associated with hot-swapping of the hard

disk drives and enclosure (chassis) monitoring and management, as specified in the SCSI Accessed Fault-Tolerant Enclosures (SAF-TE) Specification.

The SAF-TE-specified features

supported by the SCSI Backplane Board include, but are not limited to, the following:

 Monitoring the SCSI bus for enclosure services messages, and acting on them

appropriately. Examples of such messages include: activate a drive fault indicator; power down a drive that has failed; and report backplane temperature.

 SAF-TE intelligent agent acts as proxy for "dumb" I

C devices (that have no bus

mastering capability) during intrachassis communications.

The SCSI Backplane Board connects to the Server Board Set SE8500HW4 Mainboard, provides power, and signals to the front of the chassis. See Chapter 7 for a description of this board.

2.5.5 Front Panel I/O Board

The Front Panel I/O Board mounts horizontally in the front left of the system and communicates with the SCSI Backplane Board. USB ports and an NMI button.

See Chapter 8 for a description of this board.

The board contains a video connector, three

2.5.6 Front Panel Control Board

Two different front panel Control Boards are supported, the standard control panel and the Intel Local Control Panel (LCP). Both mount vertically into the chassis and connect to the Front Panel I/O Board via a cable. Each module houses the system operating buttons, LEDs and the Local Control Panel has an LCD. See Chapter 8 for a description of these boards.

2.5.7 SATA-to-IDE Converter Board

The SATA-to-IDE Converter Board attaches to the optical drive carrier, receives the SATA signal from the Server Board Set SE8500HW4 Mainboard via a SATA cable, and converts it to IDE signals routed to the optical drive. See Chapter 9 for a description of this board.

2.5.8 Intel® Management Module

The Intel Management Module (IMM) mounts onto the Server Board Set SE8500HW4 Mainboard and contains the Baseboard Management Controller (BMC) that provides server management support. The Advanced module adds more support for remote management. The Server Platform SR6850HW4 will not boot without one of these modules installed.

Module Installation and User’s Guide or the Intel Management Module Technical Product Specification for a description of this part.

There are two versions of the IMM, the Professional and Advanced.

See the Intel Management

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2.5.9 Fibre Channel Module

The Server Board Set SE8500HW4 Mainboard supports the Intel Fibre Channel Module as a mass storage expansion option. The card is based on the Qlogic* ISP2322 FC PCI-X controller and plugs into a reversed PCI Express x16 slot on the Server Board Set

SE8500HW4 Mainboard. See the Intel Fibre Channel Module Users Guide for descriptions

of this board.

2.5.10 RAID On Motherboard (ROMB)

The Server Board Set SE8500HW4 Mainboard supports a RAID On Motherboard (ROMB) solution via the Intel IOP332 storage I/O Processor

in conjunction with the LSI Logic*

53C1030 SCSI controller. To enable this option the Intel RAID Activation Key and a DDR2 400MHz DIMM are required. The optional Intel RAID Smart Battery is also available to

maintain the contents of the DIMM in the event of power loss. See the Intel RAID Smart Battery Technical Product Specification for a description of the ROMB solution.

2.5.11 Power Supply Module

Two hot-swap power supply modules are installed side by side at the rear of the chassis. Each supply has its own AC input power connector and is rated at 1570W over an input range of 100-240 VAC.

The power subsystem is configured as follows:

 With two power supply modules installed, a fully configured system has (1+1) power

redundancy.

 With one supply module installed, the system does not have redundant power but

will still run a fully configured system.

Note: When only one power supply module is installed, the active fan module is required in

the unpopulated power supply slot for proper system cooling.

One power supply module is capable of handling the maximum power requirements for a fully configured Server Platform SR6850HW4, which includes four processors, 64 GB of memory, seven PCI add-in cards, ten hot-swap hard disk drives, an optical drive, a Fibre Channel Module, ROMB options installed, and a SCSI tape device.

When two power supply modules are installed, the user can replace a failed power supply module without affecting the system functionality. Power supplies have three LEDs to identify failure, power good and AC OK.

The power subsystem receives AC power through two power cords.

When two power supply

modules and two power cords are installed, the system has (1+1) power cord redundancy and can be powered by two separate AC sources.

In this configuration, the system will

continue to function without interruption if one of the AC sources fails. See Chapter 5 for more information.

Note: The total power requirement for the Server Platform SR6850HW4 exceeds the 240

VA energy hazard limits that define an operator accessible area. As a result, only

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qualified technical individuals should access the processor and non-hot-plug I/O areas while the system is energized. Power cords should be removed from the system before accessing non-hot-plug areas.

2.5.11.1 System Power Budget

Table 3 shows a summary of the system power budget. voltage rail in columns and each major subsystem of the product in rows. power per subsystem is listed for each voltage rail.

The power budget lists each major

The worst-case

The total power per voltage rail, the

power supply specification, and the margin available are shown at the bottom of the table.

Table 3. System Power Budget

Subsystem Qty +3.3V +5V +12V (Total) +3.3V

Mainboard 1 49W 27W 147W 15W

SCSI Backplane Board Board

Front Panel I/O Board and front panel

Processors 4 448W

Memory 16 4W 192W

Fans 6 173W

Hard disk drives 10 28W 84W

½inches optical drive 1 1W 6W

SCSI tape device 1 3W 7W

PCI-X* slots 3 45W

PCI Express* slots 4 80W

Fibre channel module 1 15W

System Total 1189.5W 15W

Power subsystem spec 1570W 16.5W

Margin 380.5W 1.5W

1 2.5W 2.5W

1ea 2W 2W

stby

Notes:

1. 3.3V and 5V are derived from the 12V single switched output of the power supply modules.

2. 3.3V

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is the standby output of the power supply modules.

stby

The 12V column includes the 3.3V and 5V power.

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2.5.12 Cooling Subsystem

Primary cooling is generated by six fans, located at the top front of the chassis. It connects to the SCSI Backplane Board for power and server management. Air flows in through the front and exhausts out the rear of the chassis. The chassis has several air baffles to duct the air over critical parts, including processors, memory, and peripherals. Processor heat sinks or processor heat sink blanks, and Memory Boards or Memory Board blanks must be installed in each corresponding area to ensure proper airflow.

The system fans are sized to provide cooling for a fully configured system. The cooling system is designed using a worst-case analysis and appropriate fan speeds were chosen to meet acoustic and thermal requirements. Server management controls fan speed based on ambient and component temperatures. To ensure proper cooling, failed fans should be replaced within 1 minute.

2.6 New Platform Features

2.6.1 Advanced Memory Performance and Protection

The Server Board Set SE8500HW4 supports several new memory features that allow flexibility in performance, redundancy and the ability to upgrade. The System BIOS can be configured as follows:

 Maximum performance, where memory is up to four-way interleaved  Maximum compatibility, where memory can be hot-added  Memory mirroring, where two or four boards are used to keep a copy of system

memory

 Memory RAID, where four boards are used in a RAID4-like mode  Memory sparing, where a portion of each Memory Board is reserved for failover.

Hot-replace means the user can replace a Memory Board with another Memory Board of identical total size. This operation is supported in maximum compatibility, memory RAID and memory mirroring modes.

Hot-add means the user can add a Memory Board to a previously unoccupied slot. This requires operating system support and is supported in memory compatibility and memory mirroring modes.

Hot-removal means the user can remove a Memory Board. This operation is supported in memory RAID and memory mirroring modes.

Hot upgrade means the user can replace an existing Memory Board with a Memory Board that contains more memory capacity. A hot upgrade is not a unique operation, it is implemented as a hot-remove followed by a hot-add. This requires operating system support and is supported by the memory RAID mode only.

See the Intel Server Board Set SE8500HW4 Technical Product Specification for more

details on these new features.

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2.6.2 Rolling BIOS

The Server Board Set SE8500HW4 Mainboard supports two BIOS images to be stored in Flash. This provides a mechanism for BIOS updates without a system reboot as well as failover to an alternate image in the event of BIOS corruption. The system runs with the

current BIOS until a reboot, after which time the updated BIOS is used. See the Intel Server Board Set SE8500HW4 Technical Product Specification for more details on this feature.

2.7 Server Management

The management subsystem conforms to the IPMI v2.0 Specification. The server

management features are implemented using two microcontrollers: the Intel Management Module that plugs into the Server Board Set controller on the SCSI Backplane Board. The functions of each component are summarized in the following sections.

2.7.1 Intel Management Module (IMM)

The IMM has a Baseboard Management Controller (BMC) microcontroller and associated circuitry. The IMM contains flash memory that holds the operation code and the BMC configuration settings. The IMM monitors platform management events and logs their occurrence on the onboard non-volatile System Event Log (SEL). This includes events such as over-temperature and over-voltage conditions, fan failures, etc. The IMM also provides the interface to this monitored information so system management software can poll and retrieve the present status of the platform.

SE8500HW4 Mainboard, and the SCSI hot-swap

The IMM also provides the interface to the non-volatile Sensor Data Record (SDR) repository. SDRs provide a set of information that system management software can use to automatically configure itself for the number and type of IPMI sensors (e.g., temperature sensors, voltage sensors, etc.) in the system.

The following is a list of the major functions for the IMM:

 System power control

- ACPI power control

- ACPI sleep support

- Minimum power off time

 System reset control  System initialization

- Processor temperature and voltage threshold setting

- Fault Resilient Booting (FRB)

 Front panel user interface

- System status (green) LED control

- System status (amber) LED control

- System ID LED control

- Reset button control

- Power button control

- SDINT button control

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- System ID Button control

 System fan management  System management watchdog timer  System Event Log (SEL) interface – up to 3,200 entries  Sensor Data Record (SDR) repository interface  SDR/SEL timestamp clock  FRU inventory device  Diagnostics and beep code generation  Event message generation and reception  Platform Event Paging and Platform Event Filtering (PEP and PEF)  Dial page alerting  Alert over LAN and serial/PPP  Serial over LAN (SOL)  Terminal Mode (TM)  Battery monitoring  Sensor monitoring

- Temperature

- Voltage

- Fan speed

- Processor status

- Power supplies

 Processor Information ROM (PIROM) and Scratch Electrically Erasable

Programmable ROM (SEEPROM) access

 IPMB communication interface  Emergency Management Port (EMP) interface - IPMI messaging over Serial/Modem.

This feature is also referred to as DPC (Direct Platform Control) over Serial/Modem

 Inter-Chassis Management Bus (ICMB) interface - IPMI messaging between chassis  Additional features with IMM Advanced installed:

- Dedicated (Out-Of-Band) LAN interface through the Generic Communication

Module (GCM) on the rear of chassis (IMM Advanced)

- BMC-resident SNMP support for Out-Of-Band access using 3

party applications

such as HP* Openview*

- Embedded web server to access system health, view the SEL and issue IPMI

commands

- Embedded Command Line Interface (using telnet server running on the BMC) to

allow direct access to the BMC

- Alerting via email

- Keyboard, Video, Mouse (KVM) console redirection and remote viewer

See the Management Module Technical Product Specification for more information.

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2.7.2 Hot Swap Controller

Two hot-swap controllers are on the SCSI Backplane Board. The primary function of each hot-swap controller is as follows:

 Implements the SAF-TE command set  Controls the SCSI hard disk drive power, activity and fault LEDs  Provides a path for management information via the SCSI bus  Retrieves hard disk drive fault status, SCSI Backplane Board temperature, and fan

failure information via IPMB

 Queries the status of the Power Distribution Board by retrieving information from the

IMM via IPMB

 Controls hard disk drive power-on and power-down, facilitating hot-swapping

2.8 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)

The Server Platform SR6850HW4 supports the following reliability, availability, serviceability, usability and manageability (RASUM) features:

 Reliability features

- Machine check architecture

- Error Checking Code (ECC) in main memory and processor caches

- ECC, parity, and protocol checking on the FSB

- Parity on the Hub Link (HL-1.5) interface

- Parity checking on PCI buses

- RAID On Motherboard (ROMB) with the Intel RAID Smart Battery which provides

battery back-up to the DDR2 400MHz DIMM for disk cache

- Voltage and temperature monitoring throughout the system

 Availability features

- Hot-plug PCI Express and PCI-X

- Hot-Plug Memory Boards

- Redundant hot-swap power supplies

- Redundant power cords

- Redundant hot-swap system fans

- Hot-swap SCSI hard drives

- Teaming and failover Ethernet ports

 Serviceability features

- Tool-less installation and removal of major sub-assemblies

- Color-coded parts to identify serviceable components

Green: Hot-swap or hot-plug components Blue: Non-hot-swap components

- System ID buttons and LEDs

- LED indicators for system health, configured options, and activity

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 Usability features

- Tool-less design features

- External access to hot-swap hard disk drives, power supplies, LEDs and switches

- Front and rear viewable System ID switches and LEDs

- Detailed configuration label on top cover

- Color-coded parts to identify hot-swap and non-hot-swap serviceable components

 Manageability features

- Remote management via serial and LAN

- IPMI 2.0 and WfM 2.0 compliance

- Remote diagnostics via serial and LAN

- Remote management via KVM and dedicated LAN (IMM Advanced)

All boards are connected by a server management I

C bus to satisfy the system RASUM

requirements.

2.9 Expansion Support

Table 4 summarizes the expansion support provided by the platform.

Table 4. Expansion Support

Quantity Type

4 64-bit Intel® Xeon™ processors MP

7 PCI expansion bus slots

10 Single connector attachment (SCA-2) Ultra320* SCSI hard disk drive bays

1 5 1/4-inch full-height drive bay

1 External SCSI connector

16 DDR2 400HMz SDRAM registered ECC DIMM module sockets (four per memory

module)

1 RAID On MotherBoard (ROMB) socket, DDR2 DIMM socket and battery connector

1 Fibre Channel module connector (with two FCAL 2GBps connectors)

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2.10 Specifications

2.10.1 Environmental Specifications Summary

The Server Platform SR6850HW4 will be tested to the environmental specifications as indicated in Table 5.

Table 5. Environmental Specifications Summary

Environment Specification

Temperature operating 10°C to 35°C 50°F to 95°F

Temperature non-operating -40°C to 70°C -40°F to 158°F

Altitude -30 to 1,500 m -100 to 5,000 ft

Humidity non-operating 95%, non-condensing at temperatures of 25°C (77°F) to 30°C (86°F)

Vibration non-operating 2.2 Grms, 10 minutes per axis on each of the three axes

Shock operating Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three axes

Shock non-operating Trapezoidal, 25 G, two drops on each of six faces

∆V : 175 inches/sec on bottom face drop, 90 inches/sec on other 5 faces

Safety UL60 950, CSA60 950, AS/NZS 3562, GB4943-1995, EN60 950 and 73/23/EEC, IEC 60

950, EMKO-TSE (74-SEC) 207/94, GOST-R 50377-92

Emissions Certified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A and

89/336/EEC, VCCI Class A, AS/NZS 3548 Class A, ICES-003 Class A, GB9254-1998, MIC Notice 1997-42 Class A, GOST-R 29216-91 Class A, BSMI CNS13438

Immunity Verified to comply with EN55024, CISPR 24, GB9254-1998, MIC Notice 1997-41,

GOST-R 50628-95

Electrostatic discharge Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8 kV contact

discharge without physical damage

Acoustic Sound pressure: < 55 dBA at ambient temperature < 23° C measured at bystander, floor

standing position

Sound power: < 7.0 BA at ambient temperature < 23° C measured using the Dome Method

GOST MsanPiN 001-96

See Chapter 10 for more information on environmental specifications.

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2.10.2 Physical Specifications

Table 6 describes the physical specifications of the Server Platform SR6850HW4.

Table 6. Physical Specifications

Specification Value

Height – 6U 10.5inches 262 mm

Width 17.6inches 447 mm

Depth 27.8inches 706 mm

Front clearance 3inches 76 mm

Side clearance 1inches 25 mm

Rear clearance 6inches 152 mm

Weight (full config) 130 lbs 60 kg

Note: The system weight is an estimate for a fully configured system and will vary depending on number of

peripheral devices and add-in cards, and the number of processors and DIMMs installed in the system.

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3. Server System Chassis and Assemblies

This chapter provides an overview of the chassis and assembly pieces that reside within the platform. This chapter is divided into the following areas:

Section 3.1: Chassis, Rails and Top Cover Section 3.2: Power and Fans Section 3.3: Fan Subsystem Section 3.4: Mainboard Assembly Section 3.5: Peripherals Bay and Front Panel Section 3.6: Front Bezel

3.1 Chassis, Rails and Top Cover

3.1.1 Chassis

The Server Platform SR6850HW4 utilizes a standard 19-inch EIA chassis that is 6U high x 28 inches deep. The chassis can be rack-mounted or used as a pedestal system. Rack mounting the platform requires a 6U x 19 inches x 34 inches deep space, with the extra six inches required for cable management. When used in a rack, the chassis can be mounted with an optional rail kit and cable management arm. Pedestal operation requires a pedestal conversion kit that consists of a different bezel, floor supports/wheels and a cosmetic cover.

The 6U height is defined by standard EIA rack units where 1U = 1.75-inches. The 28-inch depth is measured from the front mounting flange to the back of the PCI slots. This measurement does not include cables or the bezel.

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(both sides of chassis)

Figure 6. Server Platform SR6850HW4 Rack and Pedestal Configurations

Memory Modules

PCI Adapter Slots

Slide Rail Mount Points

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3.1.2 Slide Rails

The Server Platform SR6850HW4 accommodates slide rails to mount the chassis into a standard 19-inch rack. The slide rails attach to studs on the sides of the chassis using keyhole features on the slide rails. No loose hardware is needed. Intel produces two accessories common to enterprise servers:

 AXXRAIL3U7U, which attach to the provided mounts, or any 3U to 7U server that has

mounts in these locations

 AXXCMA3U7U, which attaches to the rail accessory to provide a cable management

arm.

3.1.3 Top Cover

The top cover is a one-piece design. It attaches to the chassis with a series of slots in the sides of the chassis that align with tabs in the top cover. To install the top cover, the tabs drop into the slots and the cover slides forward. Two captive non-knurled screws on the faceplate secure the top cover in place. A tool is required to remove or install these screws. In addition, the cover has a label on the bottom side that describes system layout, jumpers and a summary of common tasks.

3.2 Power and Fans

The power bay provides space for two power supply modules/blanks and for the Power Distribution Board. It is an integral member of the chassis structure. Each power supply in the power bay is approximately 7.7-inches (W) x 14.2-inches (D) x 4.1-inches (H). The redundant AC power inputs are external to the system.

The Power Distribution Board distributes the power in two ways. First, a connector on the back edge of the board mates to the power supplies. Second, a cable routes +12V power to the SCSI Backplane Board and +3.3V Mainboard. The AC power is filtered with a combination 15A power plug integrated with a filter.

,+12V power and signals to the Server Board Set SE8500HW4

stby

Figure 8. Rear of Server Platform SR6850HW4, Power Supplies Installed

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3.3 Fan Subsystem

The six system fans are accessible for hot-swap operations at the top of the chassis. The fan assembly has an integrated amber LED wired to the top of the assembly. This LED lights when the fan is not functioning within specification. The fan connector extends from the bottom of the fan assembly and mates into floating connectors routed to the Server Platform SR6850HW4 SCSI Backplane Board.

Failure LED

Figure 9. System Fan

3.4 Mainboard Assembly

The Server Board Set SE8500HW4 Mainboard mounts to a sheet metal tray with four metal springs from the Intel Component Enabling Kit (CEK) and four non-captive screws. The Server Board Set SE8500HW4 Mainboard assembly is mounted in the chassis with slot and tab hooks. It is secured into the chassis by a single captive fastener.

Memory Boards mount vertically on the left and right side of the board however, processors and heatsinks mount in the front.

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eat S

Processors and

inks

Figure 10. Mainboard and Sheet Metal Tray, Assembly

3.5 Peripheral Bay and Front Panel

The peripheral bay is a sheet metal enclosure with features to mount the hot-swap SCSI hard disk drives, 5¼-inch device, and an optical drive. The SCSI Backplane Board has slots on it that slide into hooks on the peripheral bay. A plunger and captive thumbscrew secure the SCSI Backplane Board and Front Panel I/O Board to the peripheral bay.

3.5.1 Hot-Swap Hard Disk Drive Carrier

The hot-swap hard disk drive carrier is an assembly that provides guides for installing hard disk drives. The carrier has an integrated light pipe to transfer the LED indicator from the SCSI Backplane Board to the front of the drive carrier and an insertion/extraction mechanism. The hard drive bezel can be customized to meet integrator-specific industrial design requirements, by changing the color and imprint.

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Latch

LED

Figure 11. Hot-Swap Hard Drive Carrier

3.5.2 Optical Drive Carrier

The optical drive is installed in a sheet metal bracket. The SATA-to-IDE Converter Board is plugged into the IDE connector at the back of the optical device. This assembly is then installed into the chassis.

Figure 12. Optical Drive Carrier with SATA-to-IDE Converter Board

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3.5.3 Front Panel

The Server Platform SR6850HW4 requires either a Button Control Panel, providing basic functionality, or an Intel with server management features. Both front panels contain switches and LED status indicators. The front panel is retained in the chassis by two clips and connects to the Front Panel I/O Board via a cable.

In the upper left of the chassis front, there is also a video connector, NMI button, and three-port USB 2.0 connector.

See Chapter 8 for more information on the front panel area.

Server Platform Local Control Panel, which adds an LCD for integration

Figure 13. Front Panel with Button Control Panel

Figure 14. Front Panel with Intel® Local Control Panel

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3.6 Front Bezel

The front bezel is an optional one-piece cosmetic accessory that is installed with snap-on features. The bezel can be customized to meet integrator-specific industrial design requirements, by changing the color and imprint. The bezel design allows adequate airflow to cool system components and has light pipes to allow front panel LEDs to be visible from the front of the server. Removing the bezel exposes peripherals, front panel switches and I/O connectors.

Two black plastic pull handles cover the EIA mounting flanges and enable a user to slide the chassis in and out of a rack.

Figure 15. Front Bezels (Rack and Pedestal)

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Intel® Server Platform SR6850HW4 TPS Cables and Connectors

4. Cables and Connectors

This chapter describes cables and connectors specific to the Server Platform SR6850HW4. This chapter includes an overview diagram of the Server Platform SR6850HW4 interconnections, and tables that describe the signals and pinouts for user accessible connectors. Chapters that follow will cover platform-specific board cables and connectors. See

the Server Board Set SE8500HW4 Technical Product Specification for other connector signal

descriptions and pinouts. This chapter is organized as follows:

Section 4.1: Cable and System Interconnect Descriptions

Provides a list of the connectors and cables in the system.

Section 4.2: User-accessible I/O Connectors

Describes the form-factor and pinout of user-accessible interconnects.

The block diagram in Figure 16 provides an overview of the cables and their relation to System Boards in the platform.

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Cables and Connectors Intel® Server Platform SR6850HW4 TPS

Intel® Server Board SE8500HW4 Main Board

CPU

FSB 1

6700 PXH

Power and

Signal

Power

Dist Board

CPU

E8500

North Bridge

(NB)

SCSI Cable

CPU

IMI D

RAID

Act Key

IMI C

IMI B

IMI A

FSB 0

IOP332

Processor

SCSI Cable

(optional)

SCSI

Backplane Board

XMB

DDR2 RAID DIMM

BRCM5704*

LSI* 53C1030 Ultra320*

SCSI

Controller

Memory Board

SE8500HW4 Memory Board

Ethernet

Controller

SCSI Channel B

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

DIMM

DDR2 DIMM

RAID Smart

Battery

82801EB

ICH5

Radeon*

7000

Video

Controller

IMM

Power

Front Panel I/O Board

FWH

10/100

SATA Cable

Video Port

USB Port

ATI*

SIO

SATA-to-IDE

Converter Board

Optical

Drive

Ethernet Port

External SCSI Connector (optional)

USB Port

Video Port

COM1/EMP

GCM (optional)

Hot-swap SCSI Drives (10)

SCSI Tape

Hot Swap Fans (6)

Front Control Panel

Optional LCD

Figure 16. Server Platform SR6850HW4 Interconnect Diagram

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4.1 Cable and System Interconnect Descriptions

Table 7 and Table 8 list cables and connectors used in the assembly of the Server Platform SR6850HW4.

Table 7. Cable Descriptions

Type Qty From To Cable Description

Signal 1 Mainboard SCSI Backplane Board

Board

Signal 1 SCSI Backplane Board

Board

SCSI 2 Mainboard SCSI Backplane Board

SCSI 1 Mainboard Rear panel 68 Pin VHDCI SCSI (optional)

SATA 1 Mainboard SATA-to-IDE converter

DC Power 1 SCSI Backplane Board

Board

Signal 1 Front Panel I/O Board Front panel 50 Pin (multi-signal function)

Switch 1 Mainboard Chassis intrusion switch 3 Pin switch

Front Panel I/O Board 30 Pin (multi-signal function)

Board

board

SATA-to-IDE Converter Board

SCSI tape device

100 Pin (multi-signal function)

68 Pin internal SCSI

7 Pin SATA

4 Pin power (mini connector)

4 Pin power

System

Component

Mainboard

Table 8. Connector Descriptions

Type Qty From To Interconnect Description

Processors 4 Mainboard Processor 604 Pin ZIF sockets

PCI Express* 4 Mainboard Memory Board

connector

Memory 1 Mainboard ROMB DIMM 240 Pin Card Edge Connector

PCI Express 1 Mainboard Fibre Channel Module 164 Pin Card Edge Connector

VRM 1 Mainboard VRM9.1 module 62 Pin Card Edge Connector

VRM 2 Mainboard VRM10.2 module 54 Pin power connectors

PCI-X* 3 Mainboard PCI-X adapters 188 Pin Card Edge Connectors

PCI Express 4 Mainboard PCI Express adapters 98 Pin Card Edge Connectors

IMM 1 Mainboard IMM 120 Pin connector

ICMB 1 Mainboard Internal interface 1 x 5 Header connector

IPMB 1 Mainboard Internal interface 1 x 3 Header connector

Chassis Intrusion

USB 1 Mainboard Rear panel 1 x 4 Pin double stacked USB

USB 1 Mainboard Internal interface 1 x 4 Pin connector

Video 1 Mainboard Rear panel, monitor 15 Pin, monitor device

1 Mainboard Top cover switch 1 x 3 Header connector

164 Pin Card Edge Connectors

connector

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System

Component

Memory Board

SCSI Backplane Board Board

Front Panel I/O Board

Converter Board

Type Qty From To Interconnect Description

COM1/EMP 1 Mainboard Rear panel 9 Pin Emergency Management

Port (DB9)

COM2 1 Mainboard Internal interface 2 x 5 Pin header

Ethernet 1 Mainboard Rear panel Double stacked RJ45 connector

ports

SCSI 2 Mainboard Internal SCSI

channels

Signal 1 Mainboard SCSI Backplane

Board Board

Ethernet 1 Mainboard External interface RJ45 connector port, GCM

DC power and signal

SATA signal 1 Mainboard SATA-to-IDE

DC power 2 Mainboard Power Distribution

DC signal 1 Mainboard Power Distribution

Memory 1 Memory Board Mainboard 164 Pin Card Edge Connector

Memory 4 Memory Board DDR2 DIMMs 240 Pin Card Edge Connector

SCA2 10 SCSI Backplane

SCSI 2 SCSI Backplane

Signal 1 SCSI Backplane

DC power and signal

DC power 1 SCSI Backplane

Signal 1 SCSI Backplane

DC power 1 SCSI Backplane

Signal 1 Front Panel I/O

Video 1 Front Panel I/O

USB 1 Front Panel I/O

Front panel 1 Front Panel I/O

Signal 1 SATA-to-IDE

SATA 1 SATA-to-IDE

1 Mainboard RAID Smart Battery 2 x 10 Pin header

Converter Board

Board

Hot-swap hard disk

Board Board

2 SCSI Backplane

Board Board

Board

Converter Board

drive

Mainboard 68 pin SCSI connectors

Mainboard 100 Pin connector

Fans 2 x 14 Pin headers

SATA-to-IDE Converter Board, Tape device

Front Panel I/O Board 34 Pin connector

Power Distribution Board

SCSI Backplane Board Board

Front panel, monitor 15 Pin, monitor device

Front panel 1x4 Pin triple stacked USB

Button Control Panel or Local Control Panel

Optical device 50 Pin JAE (IDE) SATA-to-IDE

Mainboard 1 x 7 Pin connector (standard

68 Pin SCSI connectors

100 Pin connector

1 x 7 Pin connector (standard SATA)

1 x 12 Pin connectors

2 x 15 Pin header

(x16 PCIe)

(4 per board)

80 Pin SCA2 connectors

1 x 4 Pin header

1 x 12 Pin connector

30 Pin header

connector

50 Pin header

SATA)

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5 1

15 11

610

System

Component

Fan module DC power

Button control panel or Local control panel

Power Distribution Board

Type Qty From To Interconnect Description

DC power 1 SATA-to-IDE

and signal

Signal 1 Button control

DC power and signal

DC power 2 Power

Signal 1 Power

DC power 1 Power

DC power and signal

AC power 1 Power supply External interface IEC filtered 15A receptacle

SCSI Backplane

Converter Board

6 Fan SCSI Backplane

panel or Local control panel

2 Power

Distribution Board

1 Power supply Power Distribution

Board Board

Front Panel I/O Board 50 Pin header

Power supply 34-blade connector

Mainboard 1 x 12 Pin connector

Mainboard 2 x 15 Pin header

SCSI Backplane Board Board

Board

1 x 4 Pin header (mini connector)

2 x 6 Pin header

1 x 12 Pin connector

34-blade connector Power Supply

4.2 User-accessible I/O Connectors

4.2.1 Video Connectors

The Server Board Set SE8500HW4 Mainboard and Server Platform SR6850HW4 Front Panel I/O Board provide a video port interface with a standard VGA-compatible, 15-pin connector.

Table 9. Video Connector Pinout

Pin Signal Name and Description Video Connector

1 VID_R (analog color signal red)

2 VID_G (analog color signal green)

3 VID_B (analog color signal blue)

4 No connection

5 GND

6 GND

7 GND

8 GND

9 No connection

10 GND

11 No connection

12 MONID1 (to support DDCx, Display Data Channel* standard)

13 VID_HSYNC (horizontal sync)

14 VID_VSYNC (vertical sync)

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Pin Signal Name and Description Video Connector

15 MONID2 (to support DDCx, Display Data Channel standard)

4.2.2 USB 2.0 Connectors

The Server Board Set SE8500HW4 Mainboard provides a double-stacked USB port at the rear panel and one vertical USB port located in the middle of the Mainboard. The Server Platform SR6850HW4 Front Panel I/O Board provides three stacked USB port connectors via a USB hub controller. These built-in USB ports permit the direct connection of six USB peripherals without an external hub. If more devices are required, an external hub can be connected to any of the built-in ports.

Table 10. Dual USB Connector Pinout

Pin Signal USB Connectors

A1 Fused Voltage Controlled Current (VCC) (+5 V with over-

current monitoring)

A2 USBPxM (differential data line)

A3 USBPxP (differential data line)

A4 GND (ground)

B1 Fused VCC (+5 V with over-current monitoring)

B2 USBPxM (differential data line)

B3 USBPxP (differential data line)

B4 GND (ground)

Dual Stacked USB Connector on Rear Panel

Triple Stacked USB Connector on Front Panel

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4.2.3 Etherent Connectors

The Server Board Set SE8500HW4 Mainboard provides a dual-RJ45 connector for Ethernet connection.

Table 11. TaDual Ethernet Stacked Connector

Pin Signal Description

LED Signals

27 DNW_LINKB10_N Lower (Port 1) green status LED cathode signal indicating Port 1 activity

28 DNW1_ACT_N_R Lower (Port 1) green status LED anode to 100-ohm pullup to 3.3V Standby

29 DNW_LINKB100_N Lower (Port 1) green speed LED cathode, yellow LED anode

30 LANB1000_N_R Lower (Port 1) yellow speed LED cathode, green LED anode

31 DNW_LINKA10_N Upper (Port 2) green status LED cathode signal indicating Port 2 activity

32 DNW0_ACT_N_R Upper (Port 2) green status LED anode to 100-ohm pullup to 3.3V Standby

33 DNW_LINKA100_N Upper (Port 2) green speed LED cathode, yellow LED anode

34 LANA1000_N_R Upper (Port 2) yellow speed LED cathode, green LED anode

Ethernet Signals

15 DNW_MDIB_DP<0> Port 1 transceiver 0 positive of differential pair

21 DNW_MDIB_DN<0> Port 1 transceiver 0 negative of differential pair

23 DNW_MDIB_DP<1> Port 1 transceiver 1 positive of differential pair

16 DNW_MDIB_DN<1> Port 1 transceiver 1 negative of differential pair

18 DNW_MDIB_DP<2> Port 1 transceiver 2 positive of differential pair

24 DNW_MDIB_DN<2>> Port 1 transceiver 2 negative of differential pair

26 DNW_MDIB_DP<3> Port 1 transceiver 3 positive of differential pair

19 DNW_MDIB_DN<3> Port 1 transceiver 3 negative of differential pair

6 DNW_MDIA_DP<0> Port 2 transceiver 0 positive of differential pair

13 DNW_MDIA_DN<0> Port 2 transceiver 0 negative of differential pair

11 DNW_MDIA_DP<1> Port 2 transceiver 1 positive of differential pair

5 DNW_MDIA_DN<1> Port 2 transceiver 1 negative of differential pair

3 DNW_MDIA_DP<2> Port 2 transceiver 2 positive of differential pair

10 DNW_MDIA_DN<2> Port 2 transceiver 2 negative of differential pair

8 DNW_MDIA_DP<3> Port 2 transceiver 3 positive of differential pair

2 DNW_MDIA_DN<3> Port 2 transceiver 3 negative of differential pair

Power Signals

4, 7, 9, 12, 14, 17, 22, 25

1, 20, 35, 36, 37, 38

+1.8V Standby

Chassis Ground

Ground

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Figure 17. Dual Stacked Ethernet Connector

The Mainboard also provides an RJ45 connector that connects to the IMM Advanced for out-ofband server management features. This out-of-band connector is also referred to as the Generic Communication Module (GCM), or server management Ethernet controller.

Table 12. Server Management Ethernet Connector

Pin Signal Description Server Management Ethernet

Connector

1 GCM_NIC_RDM

2 GCM_NIC_RDP

3 Magnetics Tap

4 Magnetics Tap

5 Magnetics Tap

6 Magnetics Tap

7 GCM_NIC_TDM

8 GCM_NIC_TDP

A1 TP_GMC_RJ45_YEL_LED_A Yellow LED Anode

C1 TP_GMC_RJ45_YEL_LED_C Yellow LED Cathode

A2 GMC_NIC_ACTLED_N Green LED Anode

C2 GMC_NIC_ACTLED_R_N Green LED Cathode

Green LED

Yellow LED

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4.2.4 External 68-pin Ultra320 SCSI VHDCI Connector

As an option, the Server Platform SR6850HW4 can support a shielded external SCSI connection. This SCSI port is controlled by the SCSI controller component located on the Server Board Set SE8500HW4 Mainboard. This interconnect is a VHDCI connector at the rear panel.

Table 13. Ultra320 SCSI VHDCI Connector Pinout

Pin Signal Name Ultra320 SCSI VHDCI Connector Pin Signal Name

1 +DB(12) 35 -DB(12)

2 +DB(13) 36 -DB(13)

3 +DB(14) 37 -DB(14)

4 +DB(15) 38 -DB(15)

5 +DB(P1) 39 -DB(P1)

6 +DB(0) 40 -DB(0)

7 +DB(1) 41 -DB(1)

8 +DB(2) 42 -DB(2)

9 +DB(3) 43 -DB(3)

10 +DB(4) 44 -DB(4)

11 +DB(5) 45 -DB(5)

12 +DB(6) 46 -DB(6)

13 +DB(7) 47 -DB(7)

14 +P_CRCA 48 +P_CRCA

15 GND 49 GND

16 DIFFSENS 50 GND

17 TERMPWR 51 TERMPWR

18 TERMPWR 52 TERMPWR

19 NC 53 NC

20 GND 54 GND

21 +ATN 55 -ATN

22 GND 56 GND

23 +BSY 57 -BSY

24 +ACK 58 -ACK

25 +RST 59 -RST

26 +MSG 60 -MSG

27 +SEL 61 -SEL

28 +C/D 62 -C/D

29 +REQ 63 -REQ

30 +I/O 64 -I/O

31 +DB(8) 65 -DB(8)

32 +DB(9) 66 -DB(9)

33 +DB(10) 67 -DB(10)

34 +DB(11)

68 -DB(11)

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4.2.5 Internal 68-pin SCSI Connectors

The Server Mainboard SE8500HW4 has two unshielded 68-pin SCSI connectors for SCSI channel A and B.

SOCKET 34

SOCKET 68

68 POSITION DEVICE CONNECTOR

SOCKET 1

SOCKET 35

Figure 18. 68-Pin SCSI Connector Non-Shielded

Table 14. 68-Pin SCSI Connector Pinout

Connector Pin Signal Name Connector Pin Signal Name

1 SCSI(A:B)_DB_P12 35 SCSI(A:B)_DB_N12

2 SCSI(A:B)_DB_P13 36 SCSI(A:B)_DB_N13

3 SCSI(A:B)_DB_P14 37 SCSI(A:B)_DB_N14

4 SCSI(A:B)_DB_P15 38 SCSI(A:B)_DB_N15

5 SCSI(A:B)_DB_PP1 39 SCSI(A:B)_DB_NP1

6 SCSI(A:B)_DB_P0 40 SCSI(A:B)_DB_N0

7 SCSI(A:B)_DB_P1 41 SCSI(A:B)_DB_N1

8 SCSI(A:B)_DB_P2 42 SCSI(A:B)_DB_N2

9 SCSI(A:B)_DB_P3 43 SCSI(A:B)_DB_N3

10 SCSI(A:B)_DB_P4 44 SCSI(A:B)_DB_N4

11 SCSI(A:B)_DB_P5 45 SCSI(A:B)_DB_N5

12 SCSI(A:B)_DB_P6 46 SCSI(A:B)_DB_N6

13 SCSI(A:B)_DB_P7 47 SCSI(A:B)_DB_N7

14 SCSI(A:B)_DP0_P 48 SCSI(A:B)_DP0_N

15 GND 49 GND

16 SCSI(A:B)_DIFFSENSE 50 GND

17 SCSI(A:B)_TERMPWR 51 SCSI(A:B)_TERMPWR

18 SCSI(A:B)_TERMPWR 52 SCSI(A:B)_TERMPWR

19 RESERVED (NC) 53 RESERVED

20 GND 54 GND

21 SCSI(A:B)_ATN_P 55 SCSI(A:B)_ATN_N

22 GND 56 GND

23 SCSI(A:B)_BSY_P 57 SCSI(A:B)_BSY_N

24 SCSI(A:B)_ACK_P 58 SCSI(A:B)_ACK_N

25 SCSI(A:B)_RST_P 59 SCSI(A:B)_RST_N

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Connector Pin Signal Name Connector Pin Signal Name

26 SCSI(A:B)_MSG_P 60 SCSI(A:B)_MSG_N

27 SCSI(A:B)_SEL_P 61 SCSI(A:B)_SEL_N

28 SCSI(A:B)_CD_P 62 SCSI(A:B)_CD_N

29 SCSI(A:B)_REQ_P 63 SCSI(A:B)_REQ_N

30 SCSI(A:B)_IO_P 64 SCSI(A:B)_IO_N

31 SCSI(A:B)_DB_P8 65 SCSI(A:B)_DB_N8

32 SCSI(A:B)_DB_P9 66 SCSI(A:B)_DB_N9

33 SCSI(A:B)_DB_P10 67 SCSI(A:B)_DB_N10

34 SCSI(A:B)_DB_P11 68 SCSI(A:B)_DB_N11

4.2.6 80-pin SCA2 Hard Disk Drive Connectors

The Server Platform SR6850HW4 SCSI Backplane Board has ten SCA2 connectors.

Figure 19. SCA2 80-Pin SCSI Connector

Table 15. SCA2 Drive Connector Pinout

Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name

1 +12V 21 LVD_DB7_N 41 GND 61 LVD_DB7_P

2 +12V 22 LVD_DB6_N 42 GND 62 LVD_DB6_P

3 +12V 23 LVD_DB5_N 43 GND 63 LVD_DB5_P

4 +12V 24 LVD_DB4_N 44 SCSI_MATED 64 LVD_DB4_P

5 NC 25 LVD_DB3_N 45 NC 65 LVD_DB3_P

6 NC 26 LVD_DB2_N 46 DIFFSENSE 66 LVD_DB2_P

7 LVD_DB11_N 27 LVD_DB1_N 47 LVD_DB11_P 67 LVD_DB1_P

8 LVD_DB10_N 28 LVD_DB0_N 48 LVD_DB10_P 68 LVD_DB0_P

9 LVD_DB9_N 29 LVD_DBP1_N 49 LVD_DB9_P 69 LVD_DBP1_P

10 LVD_DB8_N 30 LVD_DB15_N 50 LVD_DB8_P 70 LVD_DB15_P

11 LVD_IO_N 31 LVD_DB14_N 51 LVD_IO_P 71 LVD_DB14_P

12 LVD_REQ_N 32 LVD_DB13_N 52 LVD_REQ_P 72 LVD_DB13_P

13 LVD_CD_N 33 LVD_DB12_N 53 LVD_CD_P 73 LVD_DB12_P

14 LVD_SEL_N 34 +5V 54 LVD_SEL_P 74 SCSI_MATED

15 LVD_MSG_N 35 +5V 55 LVD_MSG_P 75 GND

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16 LVD_RST_N 36 +5V 56 LVD_RST_P 76 GND

17 LVD_ACK_N 37 NC 57 LVD_ACK_P 77 SCSI_ACT

18 LVD_BSY_N 38 GND 58 LVD_BSY_P 78 NC

19 LVD_ATN_N 39 SCSI_ID (0) 59 LVD_ATN_P 79 SCSI_ID(1)

20 LVD_DBP_N 40 SCSI_ID (2) 60 LVD_DBP_P 80 SCSI_ID(3)

4.2.7 AC Power Input Connectors

An IEC320 15A receptacle is located on each power supply. An appropriately sized power cord and AC main power source are required. See Chapter 5 for system voltage, frequency, and current draw specifications. An external AC cord retention feature is supported by the chassis

but is not supplied by Intel. Please refer to the Server Platform SR6850HW4 Power Cord Enabling Specification to assist in the procurement of power cords for the platform.

NEUTRAL LINE

GND

IEC 320 C19

Figure 20. AC Power Input Connector

4.2.8 3-pin Chassis Intrusion Connector

Please, see the table below for 3-pin Chassis Intrusion Connector information.

Table 16. 3-pin Chassis Intrusion Connector

Pin Signal

1 Intrusion event

2 GND

3 Intrusion button attached

4.2.9 12-pin Power Distribution Board Power Connector

The Server Platform SR4850HW4/SR6850HW4 Power Distribution Board has three power connectors, two for the Server Board Set SE8500HW4 Mainboard and one for the Server Platform SR6850HW4 SCSI Backplane Board.

Table 17. Power Connector Pinout

Pins Signal

1-6 GND

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7-12 +12V

4.2.10 30-pin Power Distribution Board to Mainboard Connector

See the table below for the 30-pin Power Distribution Board to Mainboard Connector information.

Table 18. 30-pin Power Distribution Board to Mainboard Connector

Pins Sig n al Descriptio n

1,17,25,30 GND

6,7,10,12,14,15,24 3.3V

2 PS1 present

3 PS2 AC good

4 PS Fan control

5 PS1 AC good

8 PS1 AC range

9 PS on

11 I2C SCL

13 I2C SDA

16 12V Sense return

18 PS 90% utilization

19 PS 74% utilization

20 PS 45% utilization

21 PS 37% utilization

22 Int alert

23 PS2 AC range

26 PS1 AC good

27 12V Sense

28 PS1 power OK

29 PS2 present

stby

4.2.11 30-pin SCSI Backplane Board Board to Front Panel I/O Board Connector

Please, see the table below for the 30-pin SCSI Backplane Board to Front Panel I/O Board connector information.

Table 19. Front Panel I/O Board Connector Signal Description

Pins Signal Description

1,7,10,26,28 Ground 19,21,23,25 5V

2 USB Hub DPD1

3 USB Hub DMD1

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Pins Signal Description

5 USB Hub DPD2

6 USB Hub DMD2

8 USB Hub DPD3

9 USB Hub DMD3

11 USB1 overcurrent output, active high

12 USB2 overcurrent

13 USB3 overcurrent

14 NMI button, active low

15 Video DCC out SCLCK

16 Video DCC out SDA

17 Video vertical sync

18 Video horizontal sync

20 Video red

22 Video green

24 Video blue

27 Speaker drive, active high

29 Monitor presence, active low

30 Unused, keying pin

4.2.12 100-pin Mainboard to SCSI Backplane Board Board Connector

Please, see the tables below for the 100-pin Mainboard to SCSI Backplane Board connector information.

Table 20. 100-pin Connector Pinout (Unused and Ground)

Pin Numbers Signal

Descriptions

1,3,7,10,14,20,27,42,51,52,54,58,62,65,73,77,79,82,83,85,87,89,91,93,95,100 Ground

4,6,8,12,13,15,17,19,22,24,26,29,31,33,35,37,41,44,46,48,50,53,56,59,61,66,68,70,72 Unused

Table 21. 100-pin Connector Pinout (Signals)

Pin Number Signal Name Signal Description

2 GND – RESISTOR Ground through zero ohm resistor

5 GND – RESISTOR Ground through zero ohm resistor

9 GND – RESISTOR Ground through zero ohm resistor

11 GND – RESISTOR Ground through zero ohm resistor

16 FAN1_TACH Fan 1 Tachometer signal – edges per revolution

18 FAN2_TACH Fan 2 Tachometer signal – edges per revolution

21 FAN3_TACH Fan 3 Tachometer signal – edges per revolution

23 FAN4_TACH Fan 4 Tachometer signal – edges per revolution

25 RESET_BTN Front panel reset button signal

28 FAN5_TACH Fan 5 Tachometer signal – edges per revolution

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Pin Number Signal Name Signal Description

30 FAN6_TACH Fan 6 Tachometer signal – edges per revolution

32 FAN_PWM1 Zone 1 Fan PWM control signal

34 5VSTANDBY 5V standby to front panel

36 BP_D2D_EN Backplane D2D enable

38 5VSTANDBY 5Vstandby to front panel

39 ICH5_PDD8 IDE primary disk data 8

40 HD_ACT_N SATA Hard Drive Activity

43 BP_PWRGOOD Backplane power good signal

45 PCI_RST_BP_N PCI reset to backplane

47 CP_PWR_LED Control Panel Power LED signal

49 CP_SPKR_OUT_N Speaker signal to front panel

55 NIC1_LED NIC 1 activity LED signal

57 ID_LED ID LED Signal

60 CP_BTN_PWR_ON Control panel Power Button signal

63 SYS_STATUS_AMB_LED System Status amber LED signal

64 CD_PRES_N CD drive presence signal

67 CP_ID_BUTTON_RAW Control panel ID button signal

69 CP_BTN_NMI Control panel NMI button

71 NIC2_LED NIC2 activity LED signal

74 I2C_IPMB_SCL IPMB I2C bus clock

75 BP_PRES_N SCSI Backplane Board Board presence signal, indicates System

Board interlock is achieved

76 I2C_IPMB_SDA IPMB I2C bus data

78 SYS_PWRGD4 Mainboard power good signal to SCSI Backplane Board Board

80 USB_FRONT_N USB port 2 differential negative signal to front bezel

81 USB_FRONT_P USB port 2 differential positive signal to front bezel

84 VID_RED_FRONT Video DAC 2 RED signal

86 VID_BLUE_FRONT Video DAC 2 BLUE signal

88 VID_GREEN_FRONT Video DAC 2 GREEN signal

90 VID_HS_OUT_FRONT Video DAC 2 Horizontal Synchronization signal

92 VID_VS_OUT_FRONT Video DAC 2 Vertical synchronization signal

94 VID_DDC_OUT_SCLK_FRONT Video Monitor detection I2C bus clock

96 VID_DDC_OUT_SDA_FRONT Video monitor detection I2C bus data

97 I2C_CP_SDA Control panel I2C bus data (I2C segment 2)

98 SYS_STATUS_GRN_LED System status green LED signal

99 I2C_CP_SCL Control panel I2C bus data (I2C segment 2)

4.2.13 Peripheral Power Connector

The Server Platform SR6850HW4 SCSI Backplane Board provides a standard power connector to drive both the SCSI tape device and optical drive.

Table 22. Peripheral Power Connector

Pins Signal

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1 12V

2,3 GND

4 5V

4.2.14 Fan Connectors

Two fan power connectors on the Server Platform SR6850HW4 SCSI Backplane Board control and supply the power for the six system fans.

Table 23. 12-pin Fan Power and Control

Pins Signal

7, 10 12V

1, 4, 9, 12 GND

8, 11 FAN_PWM

2 FAN1_TACH

3 FAN1_AMB

5 FAN2_TACH

6 FAN2_AMB

Table 24. 24-pin Fan Power and Control J6E1

Pins Signal

13, 16, 19, 22 12V

1, 4, 7, 10, 15, 18, 21 ,24 GND

14, 17, 20, 23 FAN_PWM

2 FAN3_TACH

3 FAN3_AMB

5 FAN4_TACH

6 FAN4_AMB

8 FAN5_TACH

9 FAN5_AMB

11 FAN6_TACH

12 FAN6_AMB

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4.2.15 50-pin Front Panel Control Module Connector

This connector is used between the Server Platform SR6850HW4 Front Panel I/O Board and standard button control panel or Local Control Panel.

Table 25. Front Panel Control Module Connector Signal Description

PIN Sign al Descriptio n PIN Signal Description

1 +5V Standby 26 not used

2 +5V Standby 27 LAN1 link

3 +5V 28 LAN1 activity

4 Hard drive activity, 29 GND

5 System status 30 Front panel NMI button, not used

6 not used 31 not used

7 System status 32 not used

8 +5V Standby 33 not used

9 +5V Standby 34 not used

10 Power LED 35 not used

11 Hard drive activity pull up 36 not used

12 I2C IPMB SDA 37 not used

13 GND 38 not used

14 I2C IPMB SCL 39 not used

15 System ID LED 40 not used

16 Power button input, active low 41 GND

17 LAN2 link 42 not used

18 Hard drive fault 43 GND

19 LAN2 activity 44 not used

20 Front panel reset button, active low 45 GND

21 not used 46 not used

22 GND 47 GND

23 not used 48 not used

24 Front panel ID button, active low 49 GND

25 not used 50 not used

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4.2.16 SATA-to-IDE Converter Board Connector

The Server Platform SR4850HW4/SR6850HW4 SATA-to-IDE Converter Board connects to an optical drive with this connector.

Table 26. SATA-to-IDE Converter Board Connector

Pin Signal Signal Pin

1 Audio L-Ch Audio R-Ch 2

3 Audio GND GND 4

5 RESET- DD8 6

7 DD7 DD9 8

9 DD6 DD10 10

11 DD5 DD11 12

13 DD4 DD12 14

15 DD3 DD13 16

17 DD2 DD14 18

19 DD1 DD15 20

21 DD0 DMARQ 22

23 GND /DIOR 24

25 DIOW- GND 26

27 IORDY /DMACK 28

29 INTRQ /IOCS16 30

31 DA1 /PDIAG 32

33 DA0 DA2 34

35 /CS1FX /CS3FX 36

37 /DASP +5V 38

39 +5V +5V 40

41 +5V +5V 42

43 GND GND 44

45 GND GND 46

47 CSEL GND 48

49 RESERVED RESERVED 50

4.2.17 SATA-to-IDE Converter Board Power Connector

Please, see the table below for the SATA-to-IDE Converter Board Power Connector information.

Table 27. SATA-To-IDE Converter Board Power Connector

Pin Signal

1 +5 VDC

2 Ground

3 Ground

4 +12V (Not used on adapter)

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4.2.18 SATA Connector

The Server Board Set SE8500HW4 Mainboard has a SATA connector that is routed via a cable to the Server Platform SR4850HW4/SR6850HW4 SATA-to-IDE Converter Board.

Table 28. SATA Signal Connector

Pin Signal

1 Ground

2 A+

3 A-

4 Ground

5 B-

6 B+

7 Ground

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5. Power Supply

This chapter describes the Server Platform SR6850HW4 power supply. The Server Platform SR6850HW4 power supply is current sharing with auto ranging input. The Server Platform SR6850HW4 power supply is approximately 7.7 inches wide, 14.5 inches deep and 3.5 inches high. The unit mounts into the server with a latch.

The output rating of the power supply is 1570W when operated between 170VAC and 264VAC. The platform can run with a single power supply installed. For redundancy, two power supplies must be installed.

The Server Platform SR6850HW4 power supply is shown in Figure 21.

Figure 21. 1570W Power Supply

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5.1 Mechanical Outline

The mechanical outline and dimensions are shown on the next page. The dimensions should be used only as a reference.

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Figure 22. Power Supply Mechanical Specification

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5.2 Power Supply Output Interface

5.2.1 Blade Connector

The power supply output power and control signals interface to the system Power Distribution Board through an FCI PowerBlade* right-angle connector.

Table 29. PowerBlade Pin Assignment

P1 Pin Signal Name Amps per pin

FCI Powerblade* 5172110002410AA or approved equivalent

Mates to FCI 5174110002410CC on Power Distribution Board

PB RH1 +12V return 26

PB RH2 +12V return 26

PB RH3 +12V return 26

PB RH4 +12V return 26

PB RH5 +12V return 26

PB RH6 +12V 26

PB RH7 +12V 26

PB RH8 +12V 26

PB RH9 +12V 26

PB RH10 +12V 26

A1 PS_KILL

A2 +12V current share

A3 Return

A4 +3.3V

A5 PS A0

A6 +3.3V

B1 Return

B2 Not used

B3 Return

B4 +3.3V

B5 SDA

B6 -PS_ON

C1 Return

C2 Not used

C3 Return

C4 +3.3V

C5 SCL

C6 VIN_GOOD

D1 -PS_Present

D2 +12V_Sense

D3 +12V_Rtn_Sense

D4 +3.3V

D5 S_INT(Alert)

D6 POK

stby

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5.3 AC Input Requirement

5.3.1 AC Input Voltage Specification

The power supply operates over the range and limits shown in Table 30.

Table 30. AC Input Rating

Parameter Minimum Nominal Maximum Unit

Vin (voltage) 85 100/240 264 VACrms

Vin (frequency) 47 50/60 63 Hz

Iin (90VAC) 16.7 Arms

Iin (100VAC) 15.0 Arms

Iin (115VAC) 16.0 Arms

Iin (180VAC) 11.25 Arms

Vin (turn-on) 80 85 VACrms

Vin (turn-off) 75 80 VACrms

The main outputs of the power supply will turn off per Vin (turn-off). Any standby outputs may continue to operate at input AC voltages below Vin (turn-off).

5.3.2 Efficiency

The power supply has a minimum efficiency of 78% when operated under the maximum loading conditions of 90VAC-264VAC, and environmental conditions. The minimum efficiency is 77% when operated between 85-90VAC.

For loads less than maximum, the internal power dissipation cannot exceed 453W.

5.3.3 Input Over-Current Protection

The power supply has internal primary over-current protection. A normal-blow (fast blow), highbreaking-capacity fuse is placed in the input circuit.

5.3.4 Inrush Current

When input power is applied to the power supply, any initial current surge or spike of 10ms or less will not exceed 55A peak. Any additional inrush current surges or spikes in the form of AC cycles or multiple AC cycles greater than 10ms, and less than 150ms, will not exceed 25A peak.

For any conditions during turn-on, the inrush current will not open the primary input fuse or damage any other components.

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5.3.5 Auto Restart

Although the power supply may power off under the conditions mentioned in Sections 5.3.3 and

5.3.4 it is capable of restarting, either automatically or under program control after the

disturbance. In addition, the power supply will not be in a latched state such that any of the operator buttons/buttons do not operate correctly after the disturbance. At no time will the AC power cord have to be removed to clear an error condition.

Auto restart conditions are tested from -40% to -100% AC under-voltage conditions for time intervals ranging from 25ms to 2sec. For each time interval, all of the under-voltage conditions listed below will be tested. These tests are performed at both the lowest and highest nominal operating voltages of the power supply.

Time intervals: 25ms, 40ms, 60ms, 90ms, 130ms, 200ms, 280ms, 400ms, 600ms, 900ms,

1.3sec, and 2.0sec

Under-voltage deviation from nominal AC voltage: -40%, -50%, -60%, -70%, -80%, -90%, 100%

5.3.6 Power Factor Correction (PFC)

The Power Factor Correction (PFC) is 0.97, or greater, for all specified AC input voltages with output loads greater than 90%.

The PFC is 0.75, or greater, for all specified AC input voltages with output loads greater than 50%.

5.3.7 AC Input Connector

The AC input receptacle is an IEC-320 16A rated for 250VAC minimum.

5.4 DC Output Requirements

The DC output voltages will remain within the regulation ranges shown in the Table 31 when measured at the load end of the connector.

Table 31. DC Output Voltage Regulation Limits

Output Level Minimum (V) Nominal (V) Maximum (V)

+12V 11.64 12.00 12.60

+3.3V

3.17 3.30 3.47

stby

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5.4.1 Hot Swap Functionality

Hot swapping is the process of inserting and extracting a power supply from an operating power bay. During this process, the output voltages will remain within the limits specified in Table 31, and the system will continue to operate normally.

5.4.2 Output Current Rating

The combined continuous output power for all outputs will not exceed 1570W. Each output has a maximum and minimum current rating shown in Table 32.

Table 32. 1570W Load Ratings

Output Level Minimum (A)1 Maximum (A)1 Peak (A)1

+12V3 1.0 91.66 95.672

+12V4 1.0 112.5 117.00

+12V5 1.0 130.8 135.552

+3.3V

0.0 5.0

stby

1. Values are at the system level. For 1+1 redundant systems the load each supply provides is based on its current-sharing accuracy.

2. Peak +12V output power not to exceed 15 seconds in duration. Maximum duty cycle is 5%.

3. For 85-121VAC operation (100/110VAC rated).

4. For 103.5-139VAC operation (115/120/127VAC rated).

5. For 170VAC, and higher, operation (200/208/220/230/240VAC rated).

5.4.3 Over- and Under-Voltage Protection

The power supply provides latch mode over and under voltage protection as defined in the following table. A fault on any output will cause the rest of the outputs to latch off. See note 3 below the table.

Table 33. Over- and Under-voltage Limits

Under-Voltage Over Voltage Output Level

Minimum (V) Maximum (V) Minimum (V) Maximum (V)

+12V 10.5 11.0 13.5 15.0

+3.3V

1. In standby mode, the power supply does not latch off due to an under-voltage condition.

2. In standby mode, the power supply may or may not latch off due to an over-voltage condition.

3. A fault on any output other than +3.3V causes the other outputs to turn off.

1,2,3 2.77 3.00 3.76 4.3

stby

will not cause the +3.3V

stby

to turn off. A fault on +3.3V Standby

stby

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5.4.4 Over-current Protection

Over-current is a fault condition defined as a 10A/s current ramp starting from full load applied to the output under test. A fault on any output causes the rest of the outputs to latch off. See note 3 below the following table.

Table 34. Over-current Protection Limits

Output Level Minimum (A)

+3.3V Standby

+12V6 122 141

+12V7 142 163

1,3,5

5.3 6.2

2,4

Maximum (A)

2,4

1. Output is Level III SELV and non-energy hazard complaint

2. The above current limits will be satisfied throughout the entire operating temperature range

3. A fault on any output other than +3.3V cause the other outputs to turn off.

4. Dynamic loading must not cause a false over current when 2 supplies are in parallel.

5. The +3.3V foldback method is preferred.

6. +12V OC limits change base on the state of AC_RANGE. This helps protect the power supply from overloading the PFC stage. AC_RANGE low.

7. +12V OC limits change base on the state of AC_RANGE. This helps protect the power supply from overloading the PFC stage. AC_RANGE high.

output will not latch off. It must return to normal operation once the fault is removed. Current

stby

will not cause the +3.3V

stby

to turn off. A fault on +3.3V

stby

will

5.4.5 Short Circuit Protection

A short circuit, which is defined as an impedance of 0.1Ω, or less, applied to any output during start-up or while running will not cause any damage to the power supply (connectors, components, PCB traces, etc.).

When the +3.3V

is shorted the output may go into "hiccup mode". When the +3.3V

stby

attempts to restart the maximum peak current from the output must be less than 8.0A. The maximum average current, taking into account the “hiccup" duty cycle, must be less than 4.0A.

5.4.6 Reset After Shutdown

If the power supply latches into a shutdown state due to a fault condition on any output, the power supply will return to normal operation only after the fault has been removed and the power supply has been power-cycled. Power cycling is defined as either:

 Removing AC input power, waiting for +3.3V

power. The time it takes for +3.3V

to drop below 1.0V shall not exceed 15 seconds.

stby

 Cycling the state of PS_ON from on to off to on. The minimum cycle time is 1ms.

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stby

Intel® Server Platform SR6850HW4 TPS Power Supply

5.4.7 Current Sharing

Outputs of two supplies that are connected in parallel must meet the regulation requirements of a single supply. Under normal operation with two supplies running in parallel, the outputs must share the load current. If one of the supplies fails, the remaining supply must pick up the entire load without any of the outputs dropping out of regulation. A defective supply that is connected to the output voltage bus has no adverse effect on the operation of the remaining functional supply.

Table 35. Output Current Sharing

Output Level Output Sharing

+3.3V

+12V Active

Not required

stby

5.4.8 I2C Devices

All I2C devices are powered from the cathode side of the +3.3V status and FRU data to be read from a power supply that is not powered on or has some other fault. Protection is provided so if a power supply fault occurs it does not take down the +3.3V bus.

OR’ing diode. This allows the

stby

Address locations will be determined by external settings through P1, pin A5. The 0xA1 and 0xA2 address will be wired high on the power supply. (NE1617A does not have an 0xA2 address). The alert signal from (only) the I/O port will be through P1, pin D5.

5.4.8.1 FRU Data

The power supply contains a serial EEPROM. The address is either 0xAC or 0xAE, depending on address bit 0xA0.

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5.4.8.2 I/O Port Expander

The power supply contains a serial I/O port expander, Philips* PCF8575 or approved equivalent. The address is either 0x4C or 0x4E, depending on address bit 0xA0.

Table 36. I/O Port Expander Signals

Signal Name I/O Port

-OC +12V P0

-Fan_Fault P1

-UV P2

-OV P3

VIN_GOOD P4

P_GOOD P5

-PS_STATUS P6

AC_PRFAIL P7

-PFC_OTP P10

POWER_LEVEL_1 P11

POWER_LEVEL_1 P12

POWER_LEVEL_1 P13

POWER_LEVEL_1 P14

High P15,P16,P17

Table 37. I/O Port Expander Codes

Signal Name Normal Off Normal On +12V OC AC Dropout Low AC No AC

-OC +12V 1 1 0 1 1 1

Not Used 1 1 1 1 1 1

-UV 1 1 1 or 0 1 1 1

-OV 1 1 1 1 1 1

VIN_GOOD 1 1 1 1 or 0 0 0

P_GOOD 0 1 0 0 0 0

-PS_STATUS 1 0 1 1 1 1

-AC_PRFAIL 1 1 1 0 1 1

Note: The No AC column refers to the status of the I/O port when only the external +3.3

available.

bus voltage is

stby

5.4.8.3 Temperature Sensors

A Philips* NE1617A or equivalent temperature sensor is located near the air inlet of the supply. The address is either 0x34 or 0x9C depending on address bit 0xA0. A second sensor is near the exhaust outlet.

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5.4.9 Fan Speed Control

The power supply provides forced air-cooling through three DC fans that have intake through the circular grill. The cooling fans are 60mm in diameter and 38mm in depth. The fans are mounted to the front (output connector), and exhaust through the rear (AC Inlet connector) of the PS case.

The power supply uses a fan speed controller that is based on the input Fan_Cntl. The input is an analog signal from 0.0V to 3.0V. Control of the fan is linear in relation to the Fan_Cntl signal.

Table 38. Power Supply Fan Voltage

Fan_Cntl Voltage Minimum Fan Voltage Maximum Fan Voltage

0.00V 7.00V 7.50V

1.50V 9.55V 10.05V

3.00V 11.50V 12.60V

A fan fault is defined as a fan RPM below 1,000 ±200 RPM during normal operation. This fault is inhibited for 15 ±5 seconds when the power supply outputs are first powered on. This allows time for the fan to come up to speed and the fan detects circuitry to stabilize.

A fault on two fans turns off the power supply. See Section 5.2.

Note: Fan speed control must operate even if no AC is applied to the power supply. Fan power

comes from the 12V bus after the OR’ing diode. The control circuit power comes from either the 12V bus and/or the 3.3V

stby

bus.

5.4.10 Power Supply Module LED indicators

There are three LEDs on the rear of the power supply, next to the AC input power connector.

5.4.10.1 Power Supply Fail

The amber power supply fail LED is driven by internal circuitry. It lights when a power rail has failed. The LED is not lit if the supply turns off due to PS_KILL. The LED illuminates even if the power supply is in a latched state. The only time during a fault when it does not illuminate is if the +3.3V

5.4.10.2 Power Good

The green power good LED is driven by internal circuitry. It lights whenever PWRGD is asserted.

5.4.10.3 AC OK

is lost.

stby

The green AC OK LED is driven by internal circuitry. It lights whenever VIN_GOOD is asserted.

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6. Power Distribution Board

This chapter describes the Server Platform SR4850HW4/SR6850HW4 Power Distribution Board and is organized as follows:

Section 6.1: Introduction

An overview of the Server Platform SR4850HW4/SR6850HW4 Power Distribution Board and board layout.

Section 0: Signal Descriptions and Pinouts

Summarizes the Server Platform SR4850HW4/SR6850HW4 Power Distribution Board internal signals and connector signals, and the connector signal pin names and the signal descriptions.

6.1 Introduction

The Server Platform SR4850HW4/SR6850HW4 Power Distribution Board provides docking connectors for the hot-swap power supply modules. It distributes power to the SR4850HW4 SCSI Backplane Board and Server Board Set SE8500HW4 Mainboard as well as power consumption information to the Server Board Set SE8500HW4 Mainboard via a group of comparators. The board contains EEPROM FRU information storage but has no logic on it; it is a pass-through board. The signals shared between the two power supplies are shown in the diagram below.

Server Platform

INT_ALERT

12V_SENSE

12V_SENSE_RTN

PS_ON_N

PS2

Figure 23. Power Supply Signal Sharing

CURRENT_SHARE

PDB_FRU_SDA

PDB_FRU_SCL

PS1

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PS1PS2

GND

+12V

SIGNAL

+12V

GND

Ado be Systems

Figure 24. Power Distribution Board Layout

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6.2 Signal Descriptions and Pinouts

+3.3V_AUX

+12V

Adobe Systems

4.7K 100-5%

P10_1 P10_2 P10_3 P10_4

P9_1 P9_2 P9_3 P9_4

P8_1 P8_2 P8_3 P8_4

P7_1 P7_2 P7_3 P7_4

P6_1 P6_2 P6_3 P6_4

P5_1 P5_2 P5_3

P5_4

P4_1 P4_2 P4_3

P4_4

P3_1 P3_2

P3_3 P3_4

P2_1 P2_2

P2_3 P2_4

P1_1 P1_2 P1_3 P1_4

A1 A2 A3 A4

A5 A6

B1 B2 B3 B4 B5 B6

FCI 51761-10002410AA

P10_5 P10_6 P10_7 P10_8

P9_5 P9_6 P9_7 P9_8

P8_5 P8_6 P8_7 P8_8

P7_5 P7_6 P7_7 P7_8

P6_5 P6_6 P6_7 P6_8

P5_5 P5_6 P5_7

P5_8

P4_5 P4_6 P4_7

P4_8

P3_5 P3_6

P3_7 P3_8

P2_5 P2_6

P2_7 P2_8

P1_5 P1_6 P1_7 P1_8

+12V

C1 C2 C3 C4

C5 C6

D1 D2 D3 D4 D5 D6

+3.3V_AUX

Figure 25. Power Distribution Board to Power Supply Module Docking Connector Signals

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+3.3V_AUX +3.3V_AUX

Ado be Systems

LATCH DIP PLUG

Figure 26. Mainboard Connector Signals

6.2.1 Remote On/Off (-PS_ON)

The power supply DC outputs are enabled when this signal is pulled low, below 0.8V. In the low state the input will not source more than 1mA of current. The DC outputs are disabled when the input is driven higher than 2.4V, or open circuited.

Provisions for de-bouncing are included in the –PS_ON circuitry. This prevents the power supply from oscillating on and off at startup.

6.2.2 Power Good Signal (POK or P_GOOD)

A power good signal is asserted or driven high by the power supply to indicate that all outputs are valid. If any of the outputs fails, this output is driven low.

If AC main power is lost, or if a fan has failed, this signal must be driven low at least 1ms before any of the outputs go out of regulation.

The output is an open collector/drain. It is capable of driving the output below 0.4V with a load of 4mA. The output has an internal pull-up resistor of 1KΩ between the output and +3.3V The pull-up is connected to the anode side of the +3.3V

This output also goes to I

C port P5.

OR’ing diode.

stby

6.2.3 VIN_GOOD

This signal is asserted, driven high, by the power supply to indicate that the input voltage meets the minimum requirements of the input voltage range. Within 12ms after falling outside the input voltage requirements, the output must be driven low.

OR’ing diode.

stby

This output also goes to I

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7. SCSI Backplane Board

This chapter describes the Server Platform SR6850HW4 SCSI Backplane Board and is organized as follows:

Section 1: Introduction

Provides an overview of the Server Platform SR6850HW4 SCSI Backplane Board, showing functional blocks and the board layout.

Section 2: Functional Architecture

Describes the Server Platform SR6850HW4 SCSI Backplane Board functional blocks.

Section 3: Signal Descriptions

Summary of the Server Platform SR6850HW4 SCSI Backplane Board internal signals and connector signals, and the connector signal pin names and the signal descriptions.

Section 4: Electrical, Environmental, and Mechanical Specifications

Specifies operational parameters and considerations, and connector pinouts.

7.1 Introduction

The Server Platform SR6850HW4 SCSI Backplane Board supports up to ten hot-swap Ultra320 SCSI hard disk drives mounted into the chassis. The board provides drive status information and allows adding, removing and replacing hard disk drives without powering down the system. The following block diagram, architectural overview, and placement diagram provide an overview of the Server Platform SR6850HW4 SCSI Backplane Board.

7.1.1 Block Diagram

The block diagram divides SCSI Backplane Board into physical and functional blocks. Arrows represent buses and signals. Blocks represent the physical and functional blocks.

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Figure 27. Server Platform SR6850HW4 SCSI Backplane Board Board Block Diagram

7.1.2 Architectural Overview

The SCSI Backplane Board provides the following functions for the platform.

 Ultra320 SCSI bus passes SCSI signals between the hot-swap hard disk drives and the

Server Board Set SE8500HW4 Mainboard

- Two standard 68-pin SCSI connector provides connection to the Server Board Set

SE8500HW4 Mainboard

- Ten 80-pin SCA-2 blind-mate connectors connect to SCSI hard disk drives

 Fault tolerant enclosure management

- SAF-TE

- SCSI power control

- LED control logic

 Server management

- I

C interface

- I

C Serial CMOS EEPROM (FRU)

- Temperature sensors (primary ambient for system)

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 Voltage regulators

- 12VDC to 5VDC

- 5VDC to 3.3VDC

- 5VDC to 1.8VDC

 System fan control  USB 2.0 Hub  Driver circuit for the Server Platform SR6850HW4 Front Panel I/O Board speaker  Buffering for the buttons on the Button Control Panel

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7.1.3 Mechanical Specifcations

The board outline dimensions are 16.5inches x 6.380inches. The board thickness is

0.093inches +.008/-.005inches. All dimensions are in inches.

Figure 28. SCSI Backplane Board Board Component Placement (Primary Side)

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7.1.4 Component Location

Figure 29 and shows the placement of the major components and connectors on the SCSI Backplane Board.

FRONT PANEL

I/O BOARD

CONNECTOR

SCSI BUS A DRIVE CONNECTORS

A0 A 1 A2 A3 A4

BOARD

CONNECTOR

OPTICAL

DRIVE POWER

CONNECTOR

100-PIN MAIN

BOARD

CONNECTOR

FANS 3 - 6

CONNECTOR

B10 B11 B12 B13 B14

SCSI BUS B DRIVE CONNECTORS

SCSI BUS A

CONNECTOR

FANS 1 - 2

CONNECTOR

SCSI BUS B

CONNECTOR

Figure 29. SCSI Backplane Board Board Component Placement (Primary Side)

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USB HUB

1.8V REGULATOR

TEMP SENSE 1

SCSI BUS A

TERMINATORS (2)

5V D2D

CONTROLLER

SCSI BUS A SAF-TE

CONTROLLER

FLASH MEMORY

FRU

POWER DISTRIBUTION

BOARD CONNECTOR

TAPE BAY POWER

CONNECTOR

SCSI BUS A SAF-TE

CONTROLLER

TEMP SENSE 1

3.3V REGULATOR

PLD

10 MHZ

OSCILLATOR

SCSI BUS B

TERMINATORS (2)

SCSI BUS B SAF-TE

CONTROLLER

FLASH MEMORY

SCSI BUS B SAF-TE

CONTROLLER

Figure 30. SCSI Backplane Board Board Component Placement (Secondary Side)

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7.2 Functional Architecture

This section provides an architectural description of the Server Platform SR6850HW4 SCSI Backplane Board functional blocks.

7.2.1 SCSI Buses

The SCSI Backplane Board passes the SCSI bus from the Server Board Set SE8500HW4 Mainboard to the internal hot-swap SCSI hard disk drives. Each bus is Ultra320 SCSI lowvoltage differential (LVD) capable. Single-ended (SE) drives are not supported in the hot-swap disk drive bay. Do not install an internal SE drive because the behavior of the drives is unpredictable and data corruption could result. This bus is comprised of 68 signals, operating at an 80MHz clock rate. The SCSI bus is capable of a 320MB data rate, from double transition (DT) data transfers on a two-byte wide bus. The bus attaches to the Server Board Set SE8500HW4 Mainboard with a standard 68-pin SCSI connector.

320 MB/s = 2 byte bus * 80 MHz clock * double transitions.

Note: Drives and the SCSI controller on the Server Board Set SE8500HW4 Mainboard

negotiate the actual SCSI bus data rate.

7.2.2 SCSI Drive Power Control

SCSI power control is provided under control of the Programmable Logic Device (PLD). SCSI power control includes drive power switching, initial power-on charge pumping, over-current protection, system status notification, and drive status LEDs.

The system is notified when a hot-swap SCSI hard disk drive is detected. The SCSI Backplane Board applies power to the designated hot-swap SCSI hard disk drive and illuminates the status LED to provide visual indication of the event.

7.2.2.1 Internal SCSI Drive Power Switching

Each SCSI drive is supplied with +12V and +5V. Separate MOSFET switches are used to apply and remove +12V and +5V to each hot-swap SCSI hard disk drive.

7.2.2.2 Initial Power-on Charge Pumping

An initial current surge (up to 20A) is applied when power is first applied to a hot-swap SCSI hard disk drive. To reduce this initial current surge the SCSI Backplane Board charge pumps the drives for ~700µs. Charge pumping the hard disk drives keeps the average power-on current to approximately 3A.

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7.2.2.3 Over-current Protection (OCP)

If either power rail for a drive exceeds 6A on 12V or 4.5A on 5V, the MOSFET switch for the out-of-spec rail is turned off. Removing power protects the MOSFET and the platform from damage if a short occurs on one of the power rails. After one-third of a second, the MOSFET is turned on to see if the short has been removed. It will continue turning on and checking for a short every one-third of a second until the system instructs the SCSI Backplane Board to remove power or until the fault disappears.

When the MOSFET is first enabled, the over current condition is not detected during the powerup period. This no-OCP period allows the initial current surge produced by many hot-swap SCSI hard disk drives. The power-up period is short enough to prevent damage to occur to the MOSFETS or the platform.

7.2.2.4 Power Control Interlock

The power control interlock prevents drives from powering on at the same time. Since only one hot-swap SCSI hard disk drive can power on at once, the board power requirements can be kept lower. Drives power on at one-third second intervals.

7.2.2.5 System Status Notification

Hot-swap SCSI hard disk drive status information is collected by the Qlogic* GEM359 SAF-TE controller for each bus. The controller passes the information to the server management via the global I

C bus and enclosure management information via the SCSI bus.

7.2.2.6 SCSI Status LEDs

The status LEDs give the user a visual indication of the status of each hot-swap SCSI hard disk drive. A single bi-color (amber and green) LED is present for each drive. The LEDs use a combination of color and blinking frequency to indicate multiple conditions.

The hot-swap SCSI hard disk drive status LEDs are located on the SCSI Backplane Board and projected out the front system by light pipes on the drive carrier. The states of the LEDs are described in Table 39.

Table 39. Hot-swap SCSI Hard Disk Drive LED Details

LED State Description

Green on Drive is being initialized

Green blinking Drive is active

Amber on Drive/slot failure

Amber slow blinking (~1Hz) Predictive drive/slot failure or array rebuild is in process

Amber fast blinking (~2.5Hz) Array rebuild interrupted, rebuild on empty slot, or identify slot

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7.2.3 SCSI Enclosure Management

SCSI enclosure management allows the SCSI Backplane Board to report hot-swap SCSI hard disk drive status via the SCSI bus. This information is normally consumed by a RAID controller that supports enclosure management; the optional ROMB accessory supports this feature. The SCSI enclosure management subsystem consists of a Qlogic GEM359 controller, flash, and PLD.

THERMAL

LVD SCSI BUS DATA 0..7

LVD SCSI BUS CONTROL

ENCLOSURE

MANAGEMENT

CONTROLLER

(Qlogic* GEM359)

I2C

SENSOR

(DS75)

FRU

(24C02)

Control

Addres 0..16

DATA

RESET

control

Drive and LED

PLD

FLASH

(LC4128V)

Figure 31. Enclosure Management Signal Flow Diagram

7.2.3.1 Qlogic GEM359 Enclosure Management Controller

The GEM359s send board and drive information to both the SCSI and IPMB bus. The GEM359s also act on requests from both the SCSI bus and global I

C bus. GEM359s GPIOs send LED

information to the PLD.

7.2.3.2 4-Mb Flash

The GEM359s code is stored in a 4-Megabit FLASH (512K x 8). The FLASH boot block is in the top 16k of the block. The boot block is write-protected. Non-protected FLASH can be updated through the IPMB bus.

7.2.3.3 PLD

The PLD governs the SCSI power control circuit and controls the LEDs. The PLD is an In-System Programmable (ISP) with an 8-pin header connector.

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7.2.4 Server Management Interface

The SCSI Backplane Board supports the following server management features:

 Local I2C Interface

- Field Replaceable Unit (FRU)

- Temperature sensor

- Microcontroller interface (Hot Swap Controller)

 System I2C Interface

- Micro-controller IPMB interface

- I

C/SM Bus (for fan monitoring)

7.2.4.1 Local I2C Bus

The Bus A local I AT24C02N (or equivalent) serial EEPROM (with FRU data) to the microcontroller. This thermal sensor is used by the BMC for the ambient temperature of the system.

C bus connects the DS75 (or equivalent) thermal sensor and Atmel*

7.2.4.2 Isolated Global I

The global I

C bus connects the controllers to the system. The global I2C bus is isolated from

C Bus (IPMB)

the system until the system PWRGRD reaches the SCSI Backplane Board.

7.2.4.3 I

C I/O Bus

The I2C I/O bus connects the Server Board Set SE8500HW4 Mainboard microcontroller to the

Server Platform SR6850HW4 Front Panel I/O Board, fan control and the USB hub.

7.2.4.4 I2C Addresses

Four I

C devices and their addresses are listed in Table 40 and Table 41. The following I2C

devices can be addressed on or through the SCSI Backplane Board:

 Hot Swap microcontroller (HSC)  FRU EEPROM  Temperature sensor  Fan controller

Table 40. I2C Local Bus Addresses

Device Address Bus/Location Description

AT24C02 0xA0 Legacy I2C/SCSI Backplane

Board Board

DS75 0x90 Legacy I2C /SCSI Backplane

Board Board

Private SCSI Backplane Board Board FRU EEPROM

Private SCSI Backplane Board Board temperature sensor

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Table 41. Global I2C Bus Addresses (IPMB Bus)

Device A ddress Bus/Location Description

Bus A GEM359 0xC0 Legacy I2C/SCSI Backplane Board

Board

Bus B GEM359 0xC2 Legacy I2C/SCSI Backplane Board

Board

Microcontroller public IPMB bus

Table 42. I2C IO Bus Address

Device Address Bus/Location Description

PCA9555 0x42 Legacy I2C/SCSI Backplane Board

Board

Microcontroller public I/O bus

7.2.5 Resets

The PCI_RST_BP_N signal from the Server Board Set SE8500HW4 Mainboard via the 100-pin connector provides the principal reset for the logic on the SCSI Backplane Board. The signal resets the USB hub and SCSI drive power sequencing timing in the PLD. The PLD resets the GEM359s and their flash chips.

The PCA9555 device used to control the fans has an internal power-on reset that configures all its I/O pins as inputs.

7.2.6 Connector Interlocks

7.2.6.1 Mainboard Cable Connector

The SCSI Backplane Board has an interlock on the 100-pin connector so the Server Board Set SE8500HW4 Mainboard can detect its presence.

7.2.6.2 SCA-2 Connector

The SCSI Backplane Board uses an interlock to determine if a hot-swap SCSI hard disk drive is present. This interlock is defined by the SCSI_MATED# signals. Drive presence is used by enclosure management.

7.2.7 Clock Generation

The SCSI Backplane Board has a single, 10.0MHz, local clock. It supplies a 5V-rail clock input to the GEM359s and PLD. The clock is separately buffered by a 74LVT244.

The SMSC* USB20H04 USB hub has its own built-in 24MHz crystal oscillator that uses an external crystal.

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7.2.8 Programmed Devices

Four programmed devices are on the SCSI Backplane Board:

 FLASH: Flash contains program code to be run by the onboard microcontroller, the

HSC. Memory configuration: 512 K x 8.

 Field Replaceable Unit (FRU): The FRU is programmed at the factory. Memory

Configuration: 256 x 8 serial.

 USB hub circuit: The USB hub circuit has a serial EEPROM programmed with

configuration data for the USB hub controller. Memory Configuration: 256 x 8 serial.

 Programmable Logic Device (PLD): The PLD governs the SCSI power control circuit,

controls LEDs, and provides a deglitching function for the Flash chips. The PLD is independently In-System-Programmable (ISP) with an 8-pin header connector.

7.3 Signal Descriptions

The following notations are used to describe the signal type, from the perspective of the Server Platform SR6850HW4 SCSI Backplane Board:

 I Input pin to the Server Platform SR6850HW4 SCSI Backplane Board  O Output pin from the Server Platform SR6850HW4 SCSI Backplane Board  I/O Bi-directional (input/output) pin  PWR Power supply pin

The signal description also includes the type of buffer used for the particular signal:

 LVD Low Voltage Differential SCSI  SE Standard Single Ended SCSI  TTL 5V TTL signals  CMOS 5V CMOS signals  Analog Typically a voltage reference or specialty power supply  hs This suffix is added to indicate high-speed requirements that make

modifications subject to review

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7.3.1 Power from the Power Distribution Board

The SCSI Backplane Board receives only +12V from the Power Distribution Board through a 12pin connector. These pins are tied together and Table 43 provides a summary of the power connector pins.

Table 43. Power Interface Signals

Signal Type Driver Name and Description

+12V I PWR +12 Volt supply from Power Distribution Board

7.3.2 Front Panel Power Connector

Table 44 is a summary of the Server Platform SR6850HW4 Front Panel I/O Board power connector pins.

Table 44. Front Panel I/O Board Power Interface Signals

Signal Type Driver Name and Description

+3.3V

+3.3V O PWR +3.3 Volt supply to Front Panel I/O Board

+5V O PWR +5 Volt supply to Front Panel I/O Board

I PWR +3.3 Volt standby supply from Front Panel I/O Board

stby

7.3.3 Front Panel I/O Board Ribbon Cable Connector

The 30-pin Server Platform SR6850HW4 Front Panel I/O Board ribbon cable connector carries signals to and from the SCSI Backplane Board. Table 45 provides a description of the Front Panel I/O Board ribbon cable connector. See Chapter 4 for pinouts.

Table 45. Front Panel I/O Board Ribbon Connector Signal Description

Signal Type Driver Name and Description

FP_ID_BTN_N I Switch ID button, ground when pressed

FP_PWR_BTN_N I Switch Power button, ground when pressed

FP_RST_BTN_N I Switch Reset button, ground when pressed

SYS_STATUS_GRN_ LED_R_N

SYS_STATUS_AMB_ LED_R_N

FP_ID_LED_R_N O Drives the front control panel ID blue LED under Mainboard

FP_PWR_LED_R_N O Drives the front control panel power green LED under Mainboard

O Drives the front control panel system status green LED under

Mainboard control

O Drives the front control panel system status amber LED under

Mainboard control

control

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HDD_LED_ACT_R_N O Drives the front control panel drive active green LED when either

a SCSI drive or an SATA drive is active

HDD_LED_FLT_R_N O Drives the front control panel drive fault amber LED to indicate a

SCSI drive fault

NIC1_LINK_LED_R_N O Drives the front control panel LAN1 green LED to indicate status

of LAN1 on the Mainboard

NIC2_LINK_LED_R_N O Drives the front control panel LAN22 green LED to indicate

status of LAN2 on the Mainboard

I2C_IPMB_SCL I/O This pin supplies an isolated version of the global IPMB Bus

clock to the front control panel.

I2C_IPMB_SDA I/O This pin supplies an isolated version of the global IPMB Bus data

to the front control panel.

+5V O Power for the front control panel

+5V STBY O Power for the blue LED on the front control panel

GND O Ground, signal common

7.3.4 LVD SCSI 68-pin Connector

Each 68-pin LVD SCSI connector carries SCSI signals between the SCSI Backplane Board. The Server Board Set SE8500HW4 Mainboard is unshielded. Table 46 provides a description of the LVD SCSI connector.

Table 46. LVD SCSI Connector Signal Description

Signal Type Driver Name and Description

LVD_DB[15..0]_[P, N] I/O LVD hs SCSI data bus. The data bits for the differential SCSI bus.

LVD_DBP_[P, N]

LVD_DBP1_[P, N]

DIFFSENSE I Analog Differential sense. The voltage level determines the operating mode of

LVD_ATN_[P, N] I/O LVD hs SCSI bus attention. Asserted by a SCSI device in initiator mode to alert

LVD_BSY_[P, N] I/O LVD hs SCSI bus busy. Indicate that the SCSI bus is being used. Can be driven

LVD_ACK_[P, N] I/O LVD hs SCSI bus acknowledge. Driven by an initiator, indicating an

LVD_RST_[P, N] I/O LVD hs SCSI bus reset. Indicate a SCSI bus reset condition.

LVD_MSG_[P, N] I/O LVD hs SCSI bus message phase. Driven by a SCSI target to indicate it is in the

LVD_SEL_[P, N] I/O LVD hs SCSI bus select. Used by an initiator to select a target or by a target to

LVD_CD_[P, N] I/O LVD hs SCSI bus control/data phase. Driven by a target, these pins indicate that

LVD_REQ_[P, N] I/O LVD hs SCSI bus request. Driven by a target, these pins indicate a request for a

I/O LVD hs SCSI data parity. Support parity on the SCSI bus. DB_P0[P/N] supports

parity for data [7..0]. DB_P1[P/N] supports parity for data [15..8].

the target devices on the SCSI bus. If the voltage on the DIFFSENSE signal is from –0.35 V to +0.5 V the mode will be SE. If it is from +0.7 V to 1.9 V the mode will be LVD.

the target that the initiator has a message to transfer.

by both the initiator and the target device.

acknowledgement for a SCSI data transfer.

Message Phase.

reselect an initiator.

control or data information is being transferred over the SCSI bus.

SCSI data-transfer handshake.

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Signal Type Driver Name and Description

LVD_IO_[P, N] I/O LVD hs SCSI bus I/O phase. Driven by the target, these pins control the

direction of data transfer on the SCSI bus. When asserted, this signal indicates input to the initiator. When not asserted, this signal indicates output from the initiator.

GND I/O PWR Ground. Provide secondary ground reference.

7.3.5 SCA2 80-pin Drive Connectors

The SCA2 connector carries power and signal between the SCSI Backplane Boardboard and hot-swap SCSI hard disk drives. The LVD SCSI bus signals are driven by either the Server Board Set SE8500HW4 Mainboard SCSI controller, the LVD transceiver, or the hot-swap SCSI hard disk drives. Table 47 provides a description of each signal on the SCSI connectors.

Table 47. .LVD SCSI Bus Signals

Signal Type Driver Name and Description

LVD_DB[15..0]_[P, N] I/O LVD hs SCSI data bus. Along with the DBP[1/0][P/N] pins they form the bi-

directional SCSI data bus.

LVD_DBP_[P, N]

LVD_DBP1_[P, N]

DIFFSENSE I Analog Differential sense. Monitor the DIFFSENSE signal from the

LVD_ATN_[P, N] I/O LVD hs SCSI bus attention. Asserted by a SCSI device in initiator mode to

LVD_BSY_[P, N] I/O LVD hs SCSI bus busy. In SE mode, these pins are bi-directional and are

LVD_ACK_[P, N] I/O LVD hs SCSI bus acknowledge. Asserted by a SCSI device in initiator mode

LVD_RST_[P, N] I/O LVD hs SCSI bus reset. In SE mode, these pins are bi-directional and are

LVD_MSG_[P, N] I/O LVD hs SCSI bus message phase. Asserted by a SCSI device in target

LVD_SEL_[P, N] I/O LVD hs SCSI bus select. In SE mode, these pins are bi-directional and are

LVD_CD_[P, N] I/O LVD hs SCSI bus control/data phase. Asserted or de-asserted by a SCSI

LVD_REQ_[P, N] I/O LVD hs SCSI bus request. Asserted by a SCSI device in target mode to

LVD_IO_[P, N] I/O LVD hs SCSI bus I/O phase. Asserted by a SCSI device in target mode to

I/O LVD hs SCSI data parity. Support parity on the SCSI bus.

DBP[P/N] supports parity for data [7..0]

DBP1[P/N] supports parity for data [15..8]

terminator. The voltage level determines the operating mode of the target devices on the SCSI bus. If the voltage on the DIFFSENSE signal is from –0.35V to +0.5V the mode will be SE. If it is from +0.7V to 1.9V the mode will be LVD.

alert the target that the initiator has a message to transfer.

asserted to gain use of the SCSI bus and to indicate that that SCSI bus is in use.

to acknowledge the target’s request for a data transfer.

asserted when all the SCSI devices attached to the SCSI bus need to be reset.

mode to indicate the Message In or Message Out phase.

asserted by the controller when attempting to select or reselect a SCSI device.

device in target mode to indicate that control or data information is being transferred over the SCSI bus

indicate that the target is requesting a data transfer over the SCSI bus.

indicate the direction of data movement on the SCSI bus between the target and the initiator.

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Signal Type Driver Name and Description

SCSI_ID O GND/OPEN SCSI ID. Sets internal SCSI ID depending on slot. Drive 1 has SCSI

address 0. Drive 2 has SCSI address 1 and so on.

SCSI_MATED_L [1-5] I/O TTL SCSI MATED. Determine if SCSI is present and has proper contact.

GND I/O PWR Ground. Provide secondary ground reference.

+12V O PWR +12 Volt supply. Max 1A of continuous current/6A peak current.

+5V O PWR +5 Volt supply. Max 1.4A of continuous current/6A peak current.

7.3.6 Fans

Each fan has an integral amber LED with a grounded cathode. This provides a small current to a transistor that drives the FAN[10..1]_PRES signal. This signal is read by server management through U2P1, and the PCA9555 I FAN[10..1]_LED signal. FET drivers boost the current through the LED to brighten it.

The FAN_PWM signal from the Mainboard controls the fan speed. The FAN[10..1]_TACH signal is shaped by an FET buffer and driven to the Mainboard as FAN[10..1]_TACH_BUFF for determination of fan speed.

C Port. Server management can also use U2P1 to turn on a

7.3.7 Internal Logic Signals

Table 48 is a summary of the signals that route between logic on the SCSI Backplane Board.

Table 48. Internal Logic Signals

Signal Type Driver Name and Description

CLK_10MHz O CMOS 10-MHz clock that is used by the GEM359 and PLD.

Clks

ADDR<16..0> O CMOS Address/bus. Address bus for the FLASH.

PROM_VPP_L O CMOS FLASH PROGRAM VOLTAGE ENABLE. Driven by the

GEM359 to all FLASH to be programmed.

PROM_OE_L O CMOS FLASH output enable. Driven by the GEM359 to enable the

FLASH for writing data on the bus.

PROM_CE_L O CMOS FLASH output enable. Driven by the PLD to enable the

FLASH.

PROM_WE_L I CMOS FLASH chip enable. Driven by the GEM359 to enable

GEM359 Logic Control

KCK_5V_L [1-10] O Analog 5 Volt kick start. Primes 5 Volt FET to start delivering power

KCK_12V_L [110]

FLT_5V_L [1-10] I CMOS 5 Volt hot-swap fault. Indicates greater than 5A of current

FLT_12V_L [1-10] I CMOS 12 Volt hot-swap fault. Indicates greater than 5A of current

STP_5V_L[1-10] I Analog 5 Volt stop. Stops 5 Volt FET from delivering power to a

SCSI Power Control

STP_12V_L[1-10] I Analog 12 Volt stop. Stops 12 Volt FET from delivering power to a

O Analog 12 Volt kick start. Primes 12 Volt FET, to start delivering

writing to the FLASH.

to a drive.

power to a drive.

drawn from 5V rail.

drawn from 12V rail.

drive.

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Signal Type Driver Name and Description

PWR_TIMER O Analog Power timer. Starts one second timer for FET reset.

TMR_DONE I Analog Timer done. One second reset timer complete.

FAN_PRES[1-6] I Analog Fan is present on system

FAN_LED[1-6] I Analog LED signal when fan was off line

FAN_TACH[1-6] I Analog Fan speed

Fan Control

7.4 Electrical, Environmental, and Mechanical Specifications

This section specifies the operational parameters and physical characteristics for the Server Platform SR6850HW4 SCSI Backplane Board. Further topics in this section specify normal operating conditions, mechanical specifications and connector interfaces to the board.

7.4.1 Electrical Specifications

The power budget for the SCSI Backplane Board and pinouts of the external interface connectors are defined in the following table.

Table 49. Electrical Specifications

Feature Absolute Maximum Rating

Voltage of any signal with respect to ground -0.3V to Vcc1 to Vcc1+0.3V

+3.3V

+3 .3V supply with respect to ground -0.3V to +3.465V

+5V supply with respect to ground -0.3V to +5.25V

+12V supply with respect to ground -0.3V to +12.6V

Note: 1. Vcc refers to the supply voltage for the device.

supply with respect to ground -0.3V to +3.465V

stby

7.4.1.1 Power Consumption

Table 50 shows the power consumed on each supply line for the SCSI Backplane Board.

Table 50. Maximum Power Consumption

Devices Power

Dissipation

12V 180W Ext

5V 100W Int

3.3V 0.5W Int

3.3V

0.5W Ext

stby

1.8V 0.2W Int

Note: The numbers in the table are provided only to show design limits. Power consumption will vary, depending on the exact configuration.

Ext/Int

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SCSI Backplane Board Intel® Server Platform SR6850HW4 TPS

7.4.1.2 Hot-Swap SCSI Hard Disk Drive Supplied Power

Hot-swap SCSI hard disk drives must fall within the power limits shown in Table 51. The SCSI Backplane Board works with drives that meet the following requirements.

Table 51. SCSI Backplane Board Board Power Limits per Drive

Device constraint +5 V +12 V

Peak start current 0.73A 1.5A

Max operating current 0.81A 1.15A

Average idle 0.68A 0.61A

7.4.1.3 Power Supply Requirements

The external and internal power supply must meet the following requirements:

 Rise time of less than 50ms (for all voltages).  Delay of 5ms (minimum) from valid power to power good.

See Table 52 for voltage regulation requirements.

Table 52. DC Voltage Regulation

DC Voltage Acceptable Tolerance

+5V ± 5%

+12V ± 5%

+3.3V ± 5%

+3.3V

+1.8V ± 5%

± 5%

stby

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Intel® Server Platform SR6850HW4 TPS Front Panel I/O and Control Boards

8. Front Panel I/O and Control Boards

This chapter describes the Server Platform SR6850HW4 Front Panel I/O Board and is organized as follows:

Section 8.1: Introduction

Provides an overview of the Server Platform SR6850HW4 Front Panel I/O Board, showing functional blocks and board layout.

Section 8.2: Functional Architecture

Describes the Server Platform SR6850HW4 Front Panel I/O Board functional blocks.

Section 8.3: Signal Descriptions

Summary of the internal and connector signals, and the connector signal

pin names and descriptions. Signal mnemonics appear throughout this

chapter.

Section 8.4: Electrical, Environmental and Mechanical Specifications

Specifies operational parameters and considerations, and connector pinouts.

Section 8.5: Front Panel Control Module

Describes the two different front panel control modules available in the Server Platform SR6850HW4.

8.1 Introduction

The Server Platform SR6850HW4 Front Panel I/O Board provides access to the video and USB interfaces. It also interfaces to the front panel control module that contains the front control panel buttons, LEDs and optional LCD window. Circuitry on the Server Platform SR6850HW4 Front Panel I/O Board consists of video filters, USB filters, USB port power bulk capacitors with fusing, and a speaker.

8.1.1 Block Diagram

The following block diagram divides the Front Panel I/O Board into physical and functional blocks. Arrows represent buses and signals. Blocks represent the physical and functional circuits. Figure 32 illustrates the general architecture of the front panel.

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Front Panel I/O and Control Boards Intel® Server Platform SR6850HW4 TPS

Figure 32. Front Panel I/O Board Block Diagram

8.1.2 Architectural Overview

The Front Panel I/O Board provides three main functions for the platform. The first function is to provide filtered video and USB signals to the front panel connector. The second is to provide a speaker. The third is to provide a system NMI button.

Functional blocks are as follows:

 USB ports

- External front control panel connector for three USB 2.0 ports

- Filtering for the USB signals

- Bulk capacitance and fused power for USB ports

 Video connector

- External front control panel 15-pin VGA connector

- Required safety fusing and EMI filtering

 Speaker

- Audible beep-code and alarm speaker

 NMI button

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Intel® Server Platform SR6850HW4 TPS Front Panel I/O and Control Boards

8.1.3 Component Location

The following figure shows the placement of the major components and connectors on the Front Panel I/O Board. Figure 34 provides a three-dimensional view of the board.

Speaker

Connector for cable to SCSI Backplane Board

USB

Video port

Figure 33. Front Panel I/O Board Placement Diagram

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NMI

button

ports

Front Panel I/O and Control Boards Intel® Server Platform SR6850HW4 TPS

Figure 34. Front Panel I/O Board

8.2 Functional Architecture

This section provides an architectural description of the Server Platform SR6850HW4 Front Panel I/O Board functional blocks.

8.2.1 VGA

The Front Panel I/O Board passes the VGA video signals from the Server Platform SR6850HW4 SCSI Backplane Board connector to the Front Panel I/O Board. The video signals originate on the Server Platform E8500HW4 Mainboard and route to the Server Platform SR6850HW4 SCSI Backplane Board through a 100-pin cable.

Using the default operating system video driver options, the VGA signal is mirrored between the rear panel and the front panel of the platform. This design consideration was made to facilitate user debug of an operating system hard failure. When the system is in a failure state, a portable monitor could be attached to the front of the system to determine root cause. Since this is an enterprise server, Intel is not validating the video driver configured with the Front Panel I/O Board VGA connector in a non-mirrored, extended desktop state.

8.2.2 USB

The Front Panel I/O Board passes the high-speed USB 2.0 signals from the Server Platform SR6850HW4 SCSI Backplane Board to the three USB ports on the front of the system.

8.2.3 NMI Button

The Front Panel I/O Board has an NMI button; this signal is routed to the 30-pin Server Platform SR6850HW4 SCSI Backplane Board connector.

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Intel SR6850HW4 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual