Intel Server Board S5500HV, Server System SR1670HV Technical Product Specification
Intel® Server Board S5500HV/Intel®
Server System SR1670HV
Technical Product Specification
Intel order number E69391-006
Revision 1.2
May, 2010
Enterprise Platforms and Services Division
Revision History Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Revision History
Date Revision
Number
June 2009 1.0 1st Production Release
July 2009 1.1 Corrected some typo and power connector pin-outs definition
March 2010 1.2 Updated new 5600 processor support information and revise CNCA Certification
Modifications
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
The Intel
as errata which may cause the product to deviate from published specifications. Current characterized errata are
available on request.
®
Server Board S5500HV and Intel® Server System SR1670HV may contain design defects or errors known
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of
these components when the fully integrated system is used together. It is the responsibility of the system integrator
that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters
to determine the amount of airflow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible if components fail or the server board does not operate correctly when used
outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2010.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Table of Contents
Table of Contents
1. Introduction ..........................................................................................................................1
1.1 Chapter Outline........................................................................................................1
1.2 Server Board Use Disclaimer ..................................................................................1
2. Intel® Server Board S5500HV Overview .............................................................................2
2.1 Intel® Server Board S5500HV Feature Set..............................................................2
2.2 Server Board Layout................................................................................................4
2.2.1 Server Board Connector and Component Layout....................................................5
2.2.2 Server Board Rear I/O Layout .................................................................................6
3. Functional Architecture.......................................................................................................7
3.1 Processor Support...................................................................................................7
3.1.1 Intel® Xeon® Processor 5500 Series and 5600 Series.............................................8
3.1.2 Processor Population Rules ..................................................................................11
3.1.3 Unified Retention System Support.........................................................................11
3.2 Intel® QuickPath Memory Controller and Memory Subsystem ..............................12
3.2.1 Intel® Server Board S5500HV Memory Support....................................................13
3.3 Intel® 5500 Chipset IOH.........................................................................................19
3.4 Intel® 82801Jx I/O Controller Hub (ICH10R)..........................................................19
3.4.2 USB 2.0 Support....................................................................................................21
3.4.3 Keyboard and Mouse Support...............................................................................21
3.5 Network Interface Controller (NIC) ........................................................................21
3.6 ASPEED* AST2050 Graphics and Remote Management Processor....................23
3.6.1 Video Support........................................................................................................23
3.6.2 Baseboard Management Controller & BMC Module..............................................23
4. Platform Management........................................................................................................26
4.1 System Fan Control...............................................................................................27
4.2 On-board/System Sensor Information ...................................................................27
4.3 Error Handling and Messaging..............................................................................31
5. Connector/Header Locations and Pin-outs......................................................................36
5.1 Power Connectors.................................................................................................36
5.2 Serial ATA Connectors..........................................................................................36
5.3 Front Panel Headers..............................................................................................37
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Table of Contents Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
5.4 System Management Headers ..............................................................................39
5.4.1 SGPIO Header.......................................................................................................39
5.4.2 Power Supply SMBus Connectors.........................................................................39
5.5 I/O Connectors.......................................................................................................40
5.5.1 VGA Connector......................................................................................................40
5.5.2 NIC Ports...............................................................................................................40
5.5.3 Serial Port Connector ............................................................................................41
5.5.4 USB Connectors....................................................................................................41
5.6 Fan Headers..........................................................................................................42
6. Configuration Jumpers......................................................................................................43
6.1 Clear RTC RAM (CLRTC1) Jumper.......................................................................43
6.2 VGA Controller Enable/Disable Jumper ................................................................44
6.3 NIC 1 & NIC 2 Enable/Disable Jumper..................................................................44
6.4 Embedded RAID Option Select Jumper ................................................................45
6.5 DDR3 voltage control jumpers (**Future Support Only) ........................................46
6.6 BIOS Recovery Jumper.........................................................................................47
7. Intel® Light-Guided Diagnostics........................................................................................48
7.1 Standby Voltage LED ............................................................................................48
7.2 CPU Fault LED......................................................................................................48
7.3 System Identification LED......................................................................................49
7.4 BMC LED...............................................................................................................49
8. Intel® Server System SR1670HV Overview ......................................................................50
8.1 Front Panel Features.............................................................................................51
8.2 Rear Panel Features..............................................................................................52
8.3 System LED Overview...........................................................................................53
8.3.1 Front Control Panel LEDs......................................................................................53
8.3.2 LAN Port LEDs ......................................................................................................53
8.3.3 Hard Drive Status LEDs.........................................................................................54
8.4 System Storage.....................................................................................................54
8.5 System Cooling......................................................................................................55
8.6 System Power........................................................................................................56
8.6.1 Power Supply Module Specification ......................................................................57
8.6.2 AC Power Cord Specification Requirements.........................................................58
8.7 Add-in Card Support..............................................................................................58
9. Environmental Specifications...........................................................................................59
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9.1 Intel® Server Board S5500HV Environmental Specifications.................................59
9.2 Processor Power Support (Server Board Only).....................................................59
9.3 Intel® Server System SR1670HV Environmental Specifications............................60
9.4 Processor Power Support (Integrated System) .....................................................60
10. Regulatory and Certification.............................................................................................61
10.1 Intel® Server Board S5500HV Regulatory and Certification ..................................61
10.1.1 Electromagnetic Compatibility Notices ..................................................................62
10.1.2 FCC Verification Statement...................................................................................63
10.1.3 ICES-003 (Canada)...............................................................................................63
10.1.4 Europe (CE Declaration of Conformity) .................................................................63
10.1.5 Japan EMC Compatibility ......................................................................................63
10.1.6 BSMI (Taiwan).......................................................................................................64
10.1.7 RRL (Korea)...........................................................................................................64
10.2 Intel® Server System SR1670HV Regulatory and Certification .............................64
10.2.1 Product Regulatory Compliance............................................................................64
10.2.2 Use of Specified Regulated Components..............................................................65
10.2.3 Electromagnetic Compatibility Notices ..................................................................67
10.3 Product Ecology Compliance.................................................................................69
10.4 Other Markings......................................................................................................71
10.5 Component Regulatory Requirements to Support System and/or Baseboard Level
Certifications............................................................................................................................72
11. Product Safety Information...............................................................................................74
11.1 Safety Warnings & Cautions..................................................................................74
11.2 Site Selection.........................................................................................................74
11.3 Equipment Handling Practices...............................................................................75
11.4 Power and Electrical Warnings..............................................................................75
11.4.1 Replacing the Back up Battery ..............................................................................75
11.4.2 Power Cord Warnings............................................................................................76
11.5 System Access Warnings......................................................................................77
11.6 Rack Mount Warnings ...........................................................................................77
11.7 Cooling and Airflow................................................................................................78
11.8 Laser Peripherals or Devices.................................................................................78
Appendix A: Product Usage Tips............................................................................................79
Glossary.....................................................................................................................................80
Reference Documents..............................................................................................................83
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List of Figures Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
List of Figures
Figure 1. Intel® Server Board S5500HV........................................................................................4
Figure 2. Intel® Server Board S5500HV Layout............................................................................5
Figure 3. Intel® Server Board S5500HV Rear I/O Layout .............................................................6
Figure 4. Intel® Server Board S5500HV Functional Block Diagram..............................................7
Figure 5 Processor Architecture ...................................................................................................9
Figure 6. Unified Retention System and Unified Backplate Assembly........................................12
Figure 7. Conceptual Memory Layout Diagram ..........................................................................13
Figure 8. DIMM Slot Nomenclature.............................................................................................14
Figure 9. Intel Server Board S5500HV Memory Slot Layout.......................................................14
Figure 10. Mirror Channel Mode Memory Population.................................................................18
Figure 11. RAID Option Jumper Block........................................................................................20
Figure 12. Internal USB Port Locations ......................................................................................21
Figure 13. NIC Enable/Disabled Jumper Block...........................................................................22
Figure 14. Video Enable/Disable Jumper Block..........................................................................23
Figure 15. Baseboard Management Module...............................................................................24
Figure 16. Management NIC.......................................................................................................25
Figure 17. System Fan Connector Locations..............................................................................27
Figure 18. System Fan Connector Pin-out Definition..................................................................27
Figure 19. 20-pin ATX Main Power Connector Pin-out and Location.........................................36
Figure 20. 4-pin Peripheral Power Connector Pin-out and Location...........................................36
Figure 21. SATA Connector Location and Pin-out......................................................................37
Figure 22. Front Panel Header Location and Pin-out .................................................................37
Figure 23. AUX Front Panel Header Location and Pinout..........................................................38
Figure 24. SGPIO Header Location and Pin-out.........................................................................39
Figure 25. Power Supply SMBus Connector Location and Pin-out ............................................40
Figure 26. Clear RTC Jumper Block...........................................................................................43
Figure 27. Video Enable/Disable Jumper ...................................................................................44
Figure 28. NIC1 & NIC2 Enable/Disable Jumper.......................................................................45
Figure 29. Embedded RAID Option Select Jumper ....................................................................45
Figure 30. BIOS Recovery Jumper.............................................................................................47
Figure 31. Stand-by Voltage LED...............................................................................................48
Figure 32. CPU Fault LED..........................................................................................................48
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS List of Figures
Figure 33. System ID LED..........................................................................................................49
Figure 34. BMC LED...................................................................................................................49
Figure 35. Intel® Server System SR1670HV...............................................................................50
Figure 36. Intel® Server System SR1670HV - Front Panel Overview.........................................52
Figure 37. Intel® Server System SR1670HV - Back Panel Overview .........................................52
Figure 38. Intel® Server System SR1670HV - Front Control Panel LEDs...................................53
Figure 39. LAN Port LED Identification.......................................................................................53
Figure 40. Hard Drive LED Identification ....................................................................................54
Figure 41. Hard Drive Assembly.................................................................................................54
Figure 42 Har driver Bay Assembly............................................................................................55
Figure 43. System Fan Assembly...............................................................................................55
Figure 44. System Fan Removal ................................................................................................55
Figure 45. Intel® Server System SR1670HV - Power Sub-system .............................................56
Figure 46. Power Module Removal.............................................................................................57
Figure 47. AC Cord Specification................................................................................................58
Figure 48. Intel® Server System SR1670HV - Add-in card support............................................58
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List of Tables Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
List of Tables
Table 1. Intel® Server Board S5500HV Feature Set.....................................................................2
Table 2. Major Board Components...............................................................................................6
Table 3 Supported RDIMM configurations..................................................................................15
Table 4 Supported UDIMM configurations..................................................................................16
Table 5 Memory Population Table..............................................................................................17
Table 6. Supported Mirrored DIMM Population ..........................................................................19
Table 7. NIC Status LEDs...........................................................................................................22
Table 8. System Sensors............................................................................................................29
Table 9. LED/Power Module Sensors.........................................................................................30
Table 10. Backplane Sensors.....................................................................................................30
Table 11. Power Module Sensors...............................................................................................30
Table 12. System Fan Sensors...................................................................................................30
Table 13. FRU Sensors ..............................................................................................................31
Table 14. BIOS Error Messages and Checkpoints.....................................................................31
Table 15. VGA Connector Pin-out ..............................................................................................40
Table 16. RJ-45 10/100/1000 NIC Connector Pin-out................................................................41
Table 17. Serial Port Pin-out.......................................................................................................41
Table 18. External USB Connector Pin-out ................................................................................42
Table 19. 4-pin System Fan Connector Pin-out..........................................................................42
Table 20. Intel® Server System SR1670HV Feature Set............................................................51
Table 21. Power Supply Module Specification............................................................................57
Table 22. Over Current Protection Limits....................................................................................57
Table 23. Over Voltage Protection Limits ...................................................................................57
Table 24. AC Cord Specification.................................................................................................58
Table 25. Server Board Environmental Limits Summary............................................................59
Table 26. Intel® Xeon® Processor TDP Guidelines.....................................................................59
Table 27. Server System Environmental Limits Summary..........................................................60
Table 28. Server Board Product Safety & Electromagnetic (EMC) Compliance.........................61
Table 29. Server System Product Safety & Electromagnetic (EMC) Compliance ......................66
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS List of Tables
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Introduction
1. Introduction
This Technical Product Specification (TPS) provides information detailing the features,
functionality, and high-level architecture of the Intel
®
Server Board S5500HV and the Intel®
Server System SR1670HV.
Additional product information can be found at the following Intel website:
http://support.intel.com/support/motherboards/server/SR1670HV/
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Intel
Chapter 3 – Functional Architecture
Chapter 4 – Platform Management
Chapter 5 – Connector/Header Locations and Pin-outs
Chapter 6 – Configuration Jumpers
Chapter 7 – Intel
Chapter 8 – Intel
Chapter 9 – Environmental Specifications
Chapter 10 – Regulatory and Certification
Chapter 11 – Product Safety Information
Appendix A – Product Usage Tips
Glossary of Terms
Product Reference Documents
®
Server Board S5500HV Overview
®
Light-Guided Diagnostics
®
Server System SR1670HV Overview
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
1 Intel Confidential Revision 1.2
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Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
2. Intel
®
Server Board S5500HV Overview
The Intel® Server Board S5500HV is designed to support high density rack server markets. Its
unique half width board design (6.3” x 16.7”) allows for possible dual server node configurations
within a single rack mount chassis application.
2.1 Intel
Processors Support for one or two Intel® Xeon® Processors 5500 Series and 5600 Series in FC-
Memory Support for 800/1066/1333 MT/s ECC registered (RDIMM) or unbuffered (UDIMM)
Chipset
I/O Control External connections:
System Fan Support Four 4-pin managed system fan headers
Add-in Adapter Support One riser slot supporting low-profile X16 GEN2 PCI Express* riser cards
Video On-board ASPEED* AST2050 with integrated Video Controller
Hard Drive Support for Four ICH10R SATA II ports with support for the following integrated RAID
LAN Two 10/100/1000 Ethernet LAN ports provided by Intel® 82574L PHYs with Intel® I/O
®
Server Board S5500HV Feature Set
Table 1. Intel® Server Board S5500HV Feature Set
Feature Description
LGA 1366 Socket B package with up to 130 W Thermal Design Power (TDP)
4.8 GT/s, 5.86 GT/s and 6.4 GT/s Intel® QuickPath Interconnect (Intel® QPI)
DDR3 memory.
12 DIMMs total across 6 memory channels (3 channels per processor).
®
5500 Chipset IOH
Intel
®
82801Jx I/O Controller Hub (ICH10R)
Intel
DB-15 Video connector
DB-9 COM1 Serial Port connector
Two RJ-45 Network Interface Connectors (Stacked) for 10/100/1000 Mb
One RJ-45 Management Network Interface Connector
Two USB 2.0 connectors
Internal connections:
One USB 1x5 pin header, supporting one USB 2.0 port
One USB 2.0 Type F Connector
Four SATA II Connectors
20-pin ATX Main Power Connector(s)
4-pin Peripheral Drive Power Connector
Power Supply SMBus Interface Header
Front Panel Headers providing support for control button and LED options
Integrated 2D Video Controller
8 MB Video Memory
solutions:
®
Intel
LSI* SATA Software RAID supporting Software RAID levels 0/1/10 (Windows and
Acceleration Technology
Matrix Storage Manager supporting Software RAID levels 0/1/5/10
(Windows* Only)
Linux)
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Overview
Feature Description
Server Management On-board ASPEED AST2050 with integrated Baseboard Management Controller
BMC Management Module with IPMI 2.0 support (Included)
10/100 Management NIC port
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Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
2.2 Server Board Layout
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Figure 1. Intel® Server Board S5500HV
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Overview
C
2.2.1 Server Board Connector and Component Layout
The following figure shows the board layout of the server board. Each connector and major
component is identified by letter, with a description of each given in Table 2.
A
B
Q
D
K
P
O
N
E
M
L
F
G
G
Figure 2. Intel® Server Board S5500HV Layout
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H
I
H
I
J
Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Table 2. Major Board Components
A Rear I/O Connectors K CPU 1 DIMM Slots (Slots A1– C2)
B BMC Management Module connector L Peripheral Drive Power Connector – 4 pin
C SATA Ports 1-4 M CPU 2 - LGA 1366 Socket
D Internal USB(4) 2.0 Port N CMOS Battery
E CPU 2 DIMM Slots (Slots D1 – F2) O Auxilary Front Panel Header
F CPU 1 - LGA 1366 Socket P Front Panel Header
G Power Supply SMBus - 2x3 Pin Header Q X16 GEN 2 PCI Express* Riser Card Slot
H Main Power Connector – 20 pin
I System Fan Connectors
J USB(3) 2.0 - 1x5 Pin Header
Description Description
2.2.2 Server Board Rear I/O Layout
The following figure shows the layout of the rear I/O components for the server board.
1 BMC Management NIC Port 5 COM 1 Serial Port
2 Stacked USB 2.0 Ports 6 Video Connector
3 LAN 1 Port 10/100/1000 7 Blue System ID LED
4 LAN 2 Port 10/100/1000
Figure 3. Intel® Server Board S5500HV Rear I/O Layout
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
®
®
3. Functional Architecture
The Intel® Server Board S5500HV is based on Intel architecture with I/O and performance
features provided with the Intel
and the Intel
Interconnect (Intel
®
Xeon® processor 5500 Series and 5600 Series featuring Intel® QuickPath
®
QPI).
®
5500 Chipset I/O Hub (IOH), Intel® ICH10R I/O controller hub,
This chapter provides a high-level description of the functionality associated with each chipset
component and the architectural blocks that make up the server board.
DDR3 – C1, C2
DDR3 – B1, B2
DDR3 – A1, A2 DDR3 – D1, D2
Intel® Xeon®
Processor
5500 Series
EP
QuickPath
Intel® Xeon®
Processor
5500 Series
EP
DDR3 – F1, F2
DDR3 – E1, E2
QuickPath
CPU 2
X16 Riser Card Slot
PCI Express* Gen 2
CPU 1
QuickPath
Intel
X16
5500 Chipset IOH
ESI
4 x SATA
USB 1
USB 2
USB 3
Intel
ICH10R
X1
X1
PCI 33
LPC
USB
®
Figure 4. Intel
Server Board S5500HV Functional Block Diagram
3.1 Processor Support
The server board supports the following:
Two on board FC-LGA 1366 socket B package processor sockets.
AST2050
MGNT NIC
BMC Module
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Functional support for one or two Intel® Xeon® Processors 5500 Series and 5600 Series
with 4.8 GT/s, 5.86 GT/s or 6.4 GT/s with Intel
®
QuickPath Interconnect.
Up to 130 Watt Thermal Design Power (TDP)
NOTE: Previous generations of the Intel
®
Xeon® processors are not supported on this server
board.
3.1.1 Intel
®
Xeon® Processor 5500 Series and 5600 Series
The Intel® Xeon® Processor 5500 Series and 5600 Series are new micro-architecture based on
Intel 45nm and 32nm process technology. The enhancements of the Intel Xeon Processor 5500
Series and 5600 Series are a result of six major technology developments:
New processor architecture
Intel
®
QuickPath Technology
Hyper-threading
Intelligent power
Turbo boost
Integrated Memory Controller
The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD
Extensions 3 (SSE3) and Streaming SIMD Extensions 4 (SSE4); in addition to several
advanced technologies including:
Execute Disable Bit
Intel
Enhanced Intel SpeedStep
Intel
Simultaneous Multithreading.
®
Extended Memory 64 Technology (Intel® EM64T)
®
Technology
®
Virtualization Technology (Intel® VT)
3.1.1.1 New Processor Architecture
®
The Intel
Xeon® Processor 5500 Series and 5600 Series feature several new architectural
innovations, including:
A distinction between the core and “uncore” in terms of chip design
Four distinct cores per processor
New Level 3 shared Smart Cache
More parallelism: 33% more micro-ops over 45nm Intel
Enhanced algorithms and branch prediction capabilities
High bandwidth Intel
An Integrated Memory Controller
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®
Xeon® Processor 5400 Series
®
QuickPath Memory Controller: up to 25.6GB/s
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
Core Core Core Core
8M Shared Cache
Memory
Controller
3x DDR3
Channels
Link
Controller
2x Intel
QuickPath
interconnects
Core
Uncore
Figure 5 Processor Architecture
The Intel Smart Cache architecture features a new three-level hierarchy.
st
1
Level Cache
32 KB instruction cache
32 KB data cache (which supports more L1 misses in parallel than Core 2)
nd
Level Cache
2
New cache introduced in the Intel
®
Xeon® Processor 5500 Series and 5600 Series
Unified (holds code and data)
256KB per core
Performance: Very low latency (new dedicated L2 cache improves performance by
reducing latency to frequently used data)
Scalability: As core count increases, pressure on shared cache is reduced
rd
Level Cache
3
Shared across all cores
Size depends on number of cores
Quad-core: up to 8 MB
Scalability: built to vary size with varied core counts with the ability to easily increase L3
size in future parts
Inclusive cache policy for best performance
The data residing in L1/L2 must be present in 3rd level
Shares memory among all cores
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
3.1.1.2 Intel
®
QPI is a cache-coherent, link-based interconnect specification for processor, chipset, and
Intel
I/O bridge components. Intel
platforms spanning IA-32 and Intel
®
QuickPath Interconnect (Intel® QPI)
®
QPI can be used in a wide variety of desktop, mobile, and server
®
Itanium® architectures. Intel® QPI also provides support for
high-performance I/O transfer between I/O nodes. It allows connection to standard I/O buses
such as PCI Express*, PCI-X, PCI (including peer-to-peer communication support), AGP, etc.,
through appropriate bridges.
Each Intel
and receiver, plus a differential forwarded clock. A full width Intel
signals (20 differential pairs in each direction) plus a forwarded differential clock in each
direction. Each Intel
links, one going to the other processor and the other to the Intel
In the current implementation, Intel
6.4 GT/s. Intel
- 5 lanes) independently in each direction between a pair of devices communicating via Intel
®
QPI link consists of 20 pairs of uni-directional differential lanes for the transmitter
®
Xeon® Processor 5500 Series and 5600 Series supports two Intel® QPI
®
®
QPI ports operate at multiple lane widths (full - 20 lanes, half - 10 lanes, quarter
QPI ports are capable of operating at transfer rates of up to
®
QPI link pair consists of 84
®
5500 Chipset IOH.
®
QPI. The server board supports full width communication only.
3.1.1.3 Intel
®
Hyper-Threading Technology lets you run two threads at the same time per core. This
Intel
®
Hyper-Threading Technology
capability lets the processor take advantage of a 4-wide execution engine, effectively hiding the
latency of a single thread. However, the data residing in L1/L2 must be present in 3rd level
cache.
This is the most power efficient performance feature of the Intel
®
Xeon® Processor 5500 Series
and 5600 Series. It’s very efficient performance boost that comes at a very low die area cost.
Depending on the application, it can provide significant performance benefit and is much more
efficient than adding an entire core. It supports larger caches and provides for massive memory
bandwidth.
3.1.1.4 Intel
®
The Intel
Xeon® Processor 5500 Series and 5600 Series feature two Intel® Intelligent Power
®
Intelligent Power Technology
Technologies:
Integrated Power Gates - this feature lets individual idle cores reduce power to nearly zero
independently. Core power can be controlled automatically or manually.
Automated Low Power States – this feature allows for more and lower CPU power states with
reduced latency during transitions. Also, it now features power management on memory and I/O
chip as well as the processor. This adjusts system power consumption based on real-time loads.
3.1.1.5 Turbo Mode
®
Intel
Turbo Boost Technology opportunistically and automatically allows the processor to run
faster than the marked frequency if the part is operating below power, temperature, and current
limits. This can result in increased performance of both multi-threaded and single threaded
workloads.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
Turbo boost operation:
Operates under OS control – only entered when OS requests higher performance state
(P0).
Turbo Boost availability is independent of the number of active cores
Max Turbo boost frequency is dependent on the number of active cores and varies by
processor configuration.
Amount of time the system spends in Turbo Boost will depend on the workload,
operating environment, and platform design.
Turbo Boost can be enabled or disabled by BIOS.
3.1.1.6 Integrated Memory Controller
®
The Intel
as the Intel
5500 Chipset Series employs a new design where the memory controller, referred to
®
QuickPath Memory Controller, is now embedded as part of the processor
architecture.
The Intel
®
QuickPath Memory Controller provides up to three memory channels per processor
supporting up to 32 GB/s bandwidth per memory controller. Supported memory follows the
DDR3 specification and supports the following characteristics:
800MHz, 1066MHz and 1333MHz operating frequencies
Single-rank (SR), dual-rank (DR) and quad-rank (QR)
Registered DIMM (RDIMM) or Unbuffered DIMM (UDIMM)
3.1.2
Processor Population Rules
Note: Although the server board does support dual-processor configurations consisting of
different processors that meet the defined criteria below, Intel does not perform validation
testing of this configuation. For optimal system performance in dual-processor configurations,
Intel recommends that identical processors be installed.
When using a single processor configuration, the processor can be installed into either CPU1 or
CPU2 processor sockets.
When two processors are installed, the following population rules apply:
Both processors must have the same Intel
Both processors must have the same core frequency
Both processors must have the same internal cache sizes
Both processors must have the same Thermal Design Power (TDP - Watts) rating
Processor stepping within a common processor family can be mixed as long as it is
®
QuickPath Interconnect frequency
listed in the processor specification updates published by Intel Corporation.
3.1.3
Unified Retention System Support
The server board complies with Intel’s Unified Retention System (URS) and the Unified
Backplate Assembly. The server board ships with a made-up assembly of Independent Loading
Mechanism (ILM) and Unified Backplate for each processor socket.
11 Intel Confidential Revision 1.2
Intel order number E69391-006
Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
The URS retention transfers load to the server board through the unified backplate assembly.
The URS spring, captive in the heatsink, provides the necessary compressive load for the
thermal interface material. All components of the URS heatsink solution are captive to the
heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly.
See the following figure for the stacking order of the URS components.
Screw
Heatsink
ILM and Socket
ILM Attach Studs
Heatsink
Attach Studs
Server Board
Compression Spring
Retention Cup
Retaining Ring
Thermal Interface Material (TIM)
Unified Backplate
Figure 6. Unified Retention System and Unified Backplate Assembly
3.2 Intel
®
QuickPath Memory Controller and Memory Subsystem
The Intel® QuickPath Memory Controller provides up to three memory channels per processor
supporting up to 32 GB/s bandwidth per memory controller. Supported memory follows the
DDR3 specification and supports the following characteristics:
800MHz, 1066MHz and 1333MHz operating frequencies
Single-rank (SR), dual-rank (DR) and quad-rank (QR)
Revision 1.2 Intel Confidential 12
Intel order number E69391-006
AF002699
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
0
Registered DIMM (RDIMM) or Unbuffered DIMM (UDIMM)
RDIMMs must be ECC only
UDIMMs can be ECC or non-ECC and can be mixed within a common configuration
The Channel Independent mode is the only memory RAS mode that supports non-
ECC DIMMs.
The presence of a single non-ECC UDIMM results in the disabling of ECC
functionality.
RDIMMs and UDIMMs cannot be mixed within a common system memory
configuration
Note:
Although non-ECC memory can be used on this server board, Intel does not validate and
strongly discourages their use in a working server environment.
The following table shows the maximum memory amounts possible using RDIMM type memory:
Single Rank RDIMMs
800 MHz and 1066 MHz
Dual Rank RDIMMs
800 MHz and 1066 MHz
Quad Rank RDIMMs (1)
800 MHz only
48 GB
(12x 4GB DIMMs)
96 GB
(12x 8GB DIMMs)
96 GB
(12x 8GB DIMMs)
NOTE: (1) Due to thermal requirements needed to support Quad Rank x4 DDR3 DIMMs, this
memory type is not supported in the Intel® Server System SR1670HV. Support for this memory
type should be verified with other server chassis/system manufacturers planning to support this
server board.
3.2.1 Intel
®
Server Board S5500HV Memory Support
The Intel® Server Board S5500HV provides six DIMM slots across 3 memory channels per
processor, for a total of twelve DIMM slots.
0
1
2
3 channels per
CPU
1
2
Intel®
®
Xeon
Processo
r 5500
CPU 1
QPI
Intel®
Xeon
Processo
r 5500
CPU 2
®
Figure 7. Conceptual Memory Layout Diagram
13 Intel Confidential Revision 1.2
Intel order number E69391-006
1 2
2 1
2 DIMMs per
channel
Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
A
A
The nomenclature for DIMM slots implemented on the Intel® Server Board S5500HV is detailed
in the following figure.
Processor Socket 1 Processor Socket 2
Channel 0
(A)
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2
Channel 1 (B) Channel 2
(C)
Channel 0
(D)
Channel 1 (E) Channel 2
(F)
Figure 8. DIMM Slot Nomenclature
On the Intel® Server Board S5500HV the DIMM slots are identified as shown below:
D2
D1
E2
E1
F2
F1
CPU 2
Intel® Xeon®
Processor
5500 Series
Intel® Xeon®
Processor
5500 Series
CPU 1
Figure 9. Intel Server Board S5500HV Memory Slot Layout
C2B1B2
C1
2
1
Note: Memory is only populated using DIMM slots associated with a given installed processor.
Ie.) With only one processor installed, only the DIMM slots associated with that processor
should be populated. Memory installed into DIMM slots for a processor that is not installed are
non-functional.
DIMMs are organized into physical slots on DDR3 memory channels that belong to
processor sockets.
The memory channels from processor socket 1 are identified as Channels A, B, and C.
The memory channels from processor socket 2 are identified as Channels D, E, and F.
Revision 1.2 Intel Confidential 14
Intel order number E69391-006
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
The memory slots associated with a given processor are unavailable if the given
processor socket is not populated.
A processor may be installed without populating the associated memory slots provided a
second processor is installed with associated memory. In this case, the memory is
shared by the processors. However, this is not a recommended configuration due to the
associated latency which will affect performance.
Processor sockets are self-contained and autonomous. However, all memory subsystem
support (i.e., Memory RAS, Error Management, etc.) in the BIOS setup are applied
commonly across processor sockets.
3.2.1.1 Memory Population Rules
DIMM population requirements are dependent upon the number of slots per channel; the
number of DIMMs installed; and rank type. When installing memory consider the following:
Populate DIMMs by channel starting with the Blue slot farthest from the CPU
All channels in a system will run at the fastest common frequency
RDIMMs and UDIMMs may not be mixed
If two 1333 MHz capable UDIMMs or RDIMMs is detected in the same channel, BIOS
will flag this as a warning and force the speed down to 1066 MHz.
3.2.1.1.1 Supported RDIMM configurations:
Table 3 Supported RDIMM configurations
DIMM Slots
per Channel
2 1 Registered
2 1 Registered
2 2 Registered
2 2 Registered
DIMMs Populated
per Channel
DIMM Type Speeds Ranks per
DIMM
DDR3 ECC
DDR3 ECC
DDR3 ECC
DDR3 ECC
800,
1066,
1333
800, 1066 QR Only
800, 1066 Mixing SR,
800 Mixing SR,
SR or DR
DR
DR, QR
Population Rules
1. Any combination of x4 and x8
RDIMMs, with 1Gb or 2Gb DRAM
density
256 Mb, 512 Mb and 4 Gb DRAM technologies and x16 DRAM on RDIMM are NOT
supported
If a quad rank RDIMM is mixed with a single rank or dual rank DIMM on given channel,
the quad rank DIMM must be populated in the lowest numbered slot.
15 Intel Confidential Revision 1.2
Intel order number E69391-006
Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
3.2.1.1.2 Supported UDIMM configurations:
Table 4 Supported UDIMM configurations
DIMM
Slots per
Channel
2 1 Unbuffered DDR3
2 2 Unbuffered DDR3
DIMMs
Populated
per Channel
DIMM Type Speeds Ranks per DIMM Population Rules
SR or DR
Mixing SR, DR
1. Any combination of x8 UDIMMs with
1Gb or 2Gb DRAM Density
(with or without
ECC)
(with or without
ECC)
800,
1066,
1333
800,
1066
256 Mb, 512 Mb and 4 Gb DRAM technologies; x4 DRAM on UDIMM and Quad rank
UDIMM are not supported
Mixing ECC and non-ECC UDIMMs anywhere on the platform will force system to run in
non-ECC mode
No RAS support for non-ECC UDIMMs
No x4 SDDC support with UDIMM w/ECC, however x8 SDDC is supported in lock step
mode with x8 UDIMMs w/ECC
Note:
Although non-ECC memory can be used on this server board, Intel does not plan to
validate and strongly discourages their use in a working server environment.
When installing DIMMs, the following population rules should be followed to deliver best
performance
Maximize number of channels populated first
Balanced DIMM population across channels and sockets.
Revision 1.2 Intel Confidential 16
Intel order number E69391-006
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
;
;
;
- -
-
-
;
;
CPU 1 Configuration
1 DIMM
2 DIMMs
3 DIMMs
4 DIMMs
6 DIMMs
Table 5 Memory Population Table
DIMM_A2 DIMM_A1 DIMM_B2 DIMM_B1 DIMM_C2 DIMM_C1
-
-
-
; ;
;
;
;
- - - -
-
-
-
; ; ; ; ; ;
CPU 2 Configuration
1 DIMM
2 DIMMs
3 DIMMs
4 DIMMs
6 DIMMs
DIMM_D2 DIMM_D1 DIMM_E2 DIMM_E1 DIMM_F2 DIMM_F1
-
-
-
; ;
;
;
;
- - - -
-
-
-
;
;
;
- -
-
-
;
;
; ; ; ; ; ;
With two processors installed, the system will operate if only the DIMM slots of one processor
are populated. In this case, memory is shared between the two processors. However, due to the
associated latency of this configuration, this is NOT a recommended operating mode.
3.2.1.2 Memory RAS Modes
The server board supports the following memory RAS Modes:
Independent Channel Mode
Mirrored Channel Mode
Mirrored Channel Mode requires that all installed DIMMs support ECC and that there be
matching DIMM populations between channels. Matching DIMMs must meet the following
criteria: DIMM size, DIMM organization (rank, banks, rows, columns). DIMM timings do not have
to match, however, timings will be set to support all DIMMs populated.
Independent channel mode is the only memory RAS mode that supports either non-ECC or
ECC DIMMs.
Independent Channel Mode
In the Channel Independent mode, channels can be populated in any order (e.g., channels B
and C can be populated while channel A is empty). All three channels may be populated in any
order and have no matching requirements. All channels must run at the same interface
frequency, but individual channels may run at different DIMM timings (RAS latency, CAS
latency, and so on).
The single channel mode is established using the Channel Independent mode by populating
DIMM slots from channel A only.
17 Intel Confidential Revision 1.2
Intel order number E69391-006
Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
A
A
Mirrored Channel Mode
In Mirrored Channel Mode, the memory controller supports mirroring across channels, but not
across CPU sockets. The contents are mirrored between the first 2 channels of a given
processor. For CPU1, mirrored slot pairs include {A1, B1} and {A2, B2}. For CPU2, the mirrored
slot pairs include {D1, E1} and {D2, E2}. The sockets of the 3rd channel of each CPU are not
used in this mode.
D2
D1
E2
E1
F2
F1
Intel® Xeon®
CPU 2
Processor
5500 Series
Intel® Xeon®
Processor
C1
C2
B1
B2
1
5500 Series
2
CPU 1
Figure 10. Mirror Channel Mode Memory Population
Mirrored channel mode requires the following memory population rules:
Channel 0 and Channel 1 of a given processor must be populated identically.
DIMM slot populations within a channel do not have to be identical, but the same DIMM
slot location across Channel 0 and Channel 1 must be populated the same.
For example; DIMM slots A1 and B1 must have identical DIMMs installed to be
mirrored together. DIMM slots A2 and B2 must have identical DIMMs installed to be
mirrored together. However the DIMMs used in mirrored pair {A1, B1} can be
different than those used in mirrored pair {A2, B2}.
With two processors installed, DIMM slots associated with each processor must have a
valid mirroring configuration for memory channels 0 and 1. However, the memory
configuration of each processor can be different from the other.
The exception to this rule is that one processor has no memory installed. Because of
the associated latency, this is NOT a recommended operating mode.
Revision 1.2 Intel Confidential 18
Intel order number E69391-006
Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
The following table illustrates possible DIMM configurations that can be mirrored, with the
following assumptions: Two processors are installed; all installed DIMMs are identical.
Table 6. Supported Mirrored DIMM Population
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 Mirroring
Possible?
;
;
;
;
; ; ; ;
; ; ; ;
; ; ; ;
;
;
;
; ; ; ;
;
Yes
Yes
Yes
Yes
Yes
3.3 Intel
The Intel
components and Intel
®
5500 Chipset IOH
®
5500 Chipset I/O Hub (IOH) provides a connection point between various I/O
®
QuickPath Interconnect (Intel® QPI) based processors. It is capable of
interfacing with up to 24 PCI Express* lanes, which can be configured in various combinations
of x4, x8, x16 and limited x2 and x1 devices.
On the Intel Server Board S5500HV the IOH provides the following:
Two Intel
One X16 PCI Express* Gen 2 port supporting a single PCI Express Gen2 compliant X16
®
QuickPath Interconnect (Intel® QPI) interfaces
riser card slot. (Compliant to the PCI Express Base Specification, Revision 2.0)
One X4 ESI link interface to the I/O controller hub Intel
3.4 Intel
®
82801Jx I/O Controller Hub (ICH10R)
®
ICH10R
The server board utilizes features of the Intel® 82801Jx I/O Controller Hub (ICH10R). Supported
features include the following:
PCI Express* Base Specification, Revision 1.1 support
PCI Local Bus Specification, Revision 2.3 support for 33-MHz PCI operations (supports
up to four REQ#/GNT# pairs)
ACPI Power Management Logic Support, Revision 3.0a
Enhanced DMA controller, interrupt controller, and timer functions
Integrated Serial ATA host controllers with independent DMA operation on up to four
ports and AHCI support
USB host interface with support for four USB 2.0 ports; Two external, two internal
System Management Bus (SMBus) Specification, Version 2.0 with additional support for
2
I
C devices
Low Pin Count (LPC) interface support
Firmware Hub (FWH) interface support
Serial Peripheral Interface (SPI) support
19 Intel Confidential Revision 1.2
Intel order number E69391-006
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