Intel Server Board S5500HV, Server System SR1670HV Technical Product Specification

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Intel® Server Board S5500HV/Intel® Server System SR1670HV
Technical Product Specification
Revision 1.2
May, 2010
Enterprise Platforms and Services Division
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Revision History Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Revision History
Date Revision
Number
June 2009 1.0 1st Production Release July 2009 1.1 Corrected some typo and power connector pin-outs definition March 2010 1.2 Updated new 5600 processor support information and revise CNCA Certification
Modifications
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
®
Server Board S5500HV and Intel® Server System SR1670HV may contain design defects or errors known
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the intended thermal requirements of these components when the fully integrated system is used together. It is the responsibility of the system integrator that chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2010.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Table of Contents
Table of Contents
1. Introduction ..........................................................................................................................1
1.1 Chapter Outline........................................................................................................1
1.2 Server Board Use Disclaimer ..................................................................................1
2. Intel® Server Board S5500HV Overview .............................................................................2
2.1 Intel® Server Board S5500HV Feature Set..............................................................2
2.2 Server Board Layout................................................................................................4
2.2.1 Server Board Connector and Component Layout....................................................5
2.2.2 Server Board Rear I/O Layout .................................................................................6
3. Functional Architecture.......................................................................................................7
3.1 Processor Support...................................................................................................7
3.1.1 Intel® Xeon® Processor 5500 Series and 5600 Series.............................................8
3.1.2 Processor Population Rules ..................................................................................11
3.1.3 Unified Retention System Support.........................................................................11
3.2 Intel® QuickPath Memory Controller and Memory Subsystem ..............................12
3.2.1 Intel® Server Board S5500HV Memory Support....................................................13
3.3 Intel® 5500 Chipset IOH.........................................................................................19
3.4 Intel® 82801Jx I/O Controller Hub (ICH10R)..........................................................19
3.4.2 USB 2.0 Support....................................................................................................21
3.4.3 Keyboard and Mouse Support...............................................................................21
3.5 Network Interface Controller (NIC) ........................................................................21
3.6 ASPEED* AST2050 Graphics and Remote Management Processor....................23
3.6.1 Video Support........................................................................................................23
3.6.2 Baseboard Management Controller & BMC Module..............................................23
4. Platform Management........................................................................................................26
4.1 System Fan Control...............................................................................................27
4.2 On-board/System Sensor Information ...................................................................27
4.3 Error Handling and Messaging..............................................................................31
5. Connector/Header Locations and Pin-outs......................................................................36
5.1 Power Connectors.................................................................................................36
5.2 Serial ATA Connectors..........................................................................................36
5.3 Front Panel Headers..............................................................................................37
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Table of Contents Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
5.4 System Management Headers ..............................................................................39
5.4.1 SGPIO Header.......................................................................................................39
5.4.2 Power Supply SMBus Connectors.........................................................................39
5.5 I/O Connectors.......................................................................................................40
5.5.1 VGA Connector......................................................................................................40
5.5.2 NIC Ports...............................................................................................................40
5.5.3 Serial Port Connector ............................................................................................41
5.5.4 USB Connectors....................................................................................................41
5.6 Fan Headers..........................................................................................................42
6. Configuration Jumpers......................................................................................................43
6.1 Clear RTC RAM (CLRTC1) Jumper.......................................................................43
6.2 VGA Controller Enable/Disable Jumper ................................................................44
6.3 NIC 1 & NIC 2 Enable/Disable Jumper..................................................................44
6.4 Embedded RAID Option Select Jumper ................................................................45
6.5 DDR3 voltage control jumpers (**Future Support Only) ........................................46
6.6 BIOS Recovery Jumper.........................................................................................47
7. Intel® Light-Guided Diagnostics........................................................................................48
7.1 Standby Voltage LED ............................................................................................48
7.2 CPU Fault LED......................................................................................................48
7.3 System Identification LED......................................................................................49
7.4 BMC LED...............................................................................................................49
8. Intel® Server System SR1670HV Overview ......................................................................50
8.1 Front Panel Features.............................................................................................51
8.2 Rear Panel Features..............................................................................................52
8.3 System LED Overview...........................................................................................53
8.3.1 Front Control Panel LEDs......................................................................................53
8.3.2 LAN Port LEDs ......................................................................................................53
8.3.3 Hard Drive Status LEDs.........................................................................................54
8.4 System Storage.....................................................................................................54
8.5 System Cooling......................................................................................................55
8.6 System Power........................................................................................................56
8.6.1 Power Supply Module Specification ......................................................................57
8.6.2 AC Power Cord Specification Requirements.........................................................58
8.7 Add-in Card Support..............................................................................................58
9. Environmental Specifications...........................................................................................59
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9.1 Intel® Server Board S5500HV Environmental Specifications.................................59
9.2 Processor Power Support (Server Board Only).....................................................59
9.3 Intel® Server System SR1670HV Environmental Specifications............................60
9.4 Processor Power Support (Integrated System) .....................................................60
10. Regulatory and Certification.............................................................................................61
10.1 Intel® Server Board S5500HV Regulatory and Certification ..................................61
10.1.1 Electromagnetic Compatibility Notices ..................................................................62
10.1.2 FCC Verification Statement...................................................................................63
10.1.3 ICES-003 (Canada)...............................................................................................63
10.1.4 Europe (CE Declaration of Conformity) .................................................................63
10.1.5 Japan EMC Compatibility ......................................................................................63
10.1.6 BSMI (Taiwan).......................................................................................................64
10.1.7 RRL (Korea)...........................................................................................................64
10.2 Intel® Server System SR1670HV Regulatory and Certification .............................64
10.2.1 Product Regulatory Compliance............................................................................64
10.2.2 Use of Specified Regulated Components..............................................................65
10.2.3 Electromagnetic Compatibility Notices ..................................................................67
10.3 Product Ecology Compliance.................................................................................69
10.4 Other Markings......................................................................................................71
10.5 Component Regulatory Requirements to Support System and/or Baseboard Level
Certifications............................................................................................................................72
11. Product Safety Information...............................................................................................74
11.1 Safety Warnings & Cautions..................................................................................74
11.2 Site Selection.........................................................................................................74
11.3 Equipment Handling Practices...............................................................................75
11.4 Power and Electrical Warnings..............................................................................75
11.4.1 Replacing the Back up Battery ..............................................................................75
11.4.2 Power Cord Warnings............................................................................................76
11.5 System Access Warnings......................................................................................77
11.6 Rack Mount Warnings ...........................................................................................77
11.7 Cooling and Airflow................................................................................................78
11.8 Laser Peripherals or Devices.................................................................................78
Appendix A: Product Usage Tips............................................................................................79
Glossary.....................................................................................................................................80
Reference Documents..............................................................................................................83
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List of Figures Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
List of Figures
Figure 1. Intel® Server Board S5500HV........................................................................................4
Figure 2. Intel® Server Board S5500HV Layout............................................................................5
Figure 3. Intel® Server Board S5500HV Rear I/O Layout .............................................................6
Figure 4. Intel® Server Board S5500HV Functional Block Diagram..............................................7
Figure 5 Processor Architecture ...................................................................................................9
Figure 6. Unified Retention System and Unified Backplate Assembly........................................12
Figure 7. Conceptual Memory Layout Diagram ..........................................................................13
Figure 8. DIMM Slot Nomenclature.............................................................................................14
Figure 9. Intel Server Board S5500HV Memory Slot Layout.......................................................14
Figure 10. Mirror Channel Mode Memory Population.................................................................18
Figure 11. RAID Option Jumper Block........................................................................................20
Figure 12. Internal USB Port Locations ......................................................................................21
Figure 13. NIC Enable/Disabled Jumper Block...........................................................................22
Figure 14. Video Enable/Disable Jumper Block..........................................................................23
Figure 15. Baseboard Management Module...............................................................................24
Figure 16. Management NIC.......................................................................................................25
Figure 17. System Fan Connector Locations..............................................................................27
Figure 18. System Fan Connector Pin-out Definition..................................................................27
Figure 19. 20-pin ATX Main Power Connector Pin-out and Location.........................................36
Figure 20. 4-pin Peripheral Power Connector Pin-out and Location...........................................36
Figure 21. SATA Connector Location and Pin-out......................................................................37
Figure 22. Front Panel Header Location and Pin-out .................................................................37
Figure 23. AUX Front Panel Header Location and Pinout..........................................................38
Figure 24. SGPIO Header Location and Pin-out.........................................................................39
Figure 25. Power Supply SMBus Connector Location and Pin-out ............................................40
Figure 26. Clear RTC Jumper Block...........................................................................................43
Figure 27. Video Enable/Disable Jumper ...................................................................................44
Figure 28. NIC1 & NIC2 Enable/Disable Jumper.......................................................................45
Figure 29. Embedded RAID Option Select Jumper ....................................................................45
Figure 30. BIOS Recovery Jumper.............................................................................................47
Figure 31. Stand-by Voltage LED...............................................................................................48
Figure 32. CPU Fault LED..........................................................................................................48
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS List of Figures
Figure 33. System ID LED..........................................................................................................49
Figure 34. BMC LED...................................................................................................................49
Figure 35. Intel® Server System SR1670HV...............................................................................50
Figure 36. Intel® Server System SR1670HV - Front Panel Overview.........................................52
Figure 37. Intel® Server System SR1670HV - Back Panel Overview .........................................52
Figure 38. Intel® Server System SR1670HV - Front Control Panel LEDs...................................53
Figure 39. LAN Port LED Identification.......................................................................................53
Figure 40. Hard Drive LED Identification ....................................................................................54
Figure 41. Hard Drive Assembly.................................................................................................54
Figure 42 Har driver Bay Assembly............................................................................................55
Figure 43. System Fan Assembly...............................................................................................55
Figure 44. System Fan Removal ................................................................................................55
Figure 45. Intel® Server System SR1670HV - Power Sub-system .............................................56
Figure 46. Power Module Removal.............................................................................................57
Figure 47. AC Cord Specification................................................................................................58
Figure 48. Intel® Server System SR1670HV - Add-in card support............................................58
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List of Tables Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
List of Tables
Table 1. Intel® Server Board S5500HV Feature Set.....................................................................2
Table 2. Major Board Components...............................................................................................6
Table 3 Supported RDIMM configurations..................................................................................15
Table 4 Supported UDIMM configurations..................................................................................16
Table 5 Memory Population Table..............................................................................................17
Table 6. Supported Mirrored DIMM Population ..........................................................................19
Table 7. NIC Status LEDs...........................................................................................................22
Table 8. System Sensors............................................................................................................29
Table 9. LED/Power Module Sensors.........................................................................................30
Table 10. Backplane Sensors.....................................................................................................30
Table 11. Power Module Sensors...............................................................................................30
Table 12. System Fan Sensors...................................................................................................30
Table 13. FRU Sensors ..............................................................................................................31
Table 14. BIOS Error Messages and Checkpoints.....................................................................31
Table 15. VGA Connector Pin-out ..............................................................................................40
Table 16. RJ-45 10/100/1000 NIC Connector Pin-out................................................................41
Table 17. Serial Port Pin-out.......................................................................................................41
Table 18. External USB Connector Pin-out ................................................................................42
Table 19. 4-pin System Fan Connector Pin-out..........................................................................42
Table 20. Intel® Server System SR1670HV Feature Set............................................................51
Table 21. Power Supply Module Specification............................................................................57
Table 22. Over Current Protection Limits....................................................................................57
Table 23. Over Voltage Protection Limits ...................................................................................57
Table 24. AC Cord Specification.................................................................................................58
Table 25. Server Board Environmental Limits Summary............................................................59
Table 26. Intel® Xeon® Processor TDP Guidelines.....................................................................59
Table 27. Server System Environmental Limits Summary..........................................................60
Table 28. Server Board Product Safety & Electromagnetic (EMC) Compliance.........................61
Table 29. Server System Product Safety & Electromagnetic (EMC) Compliance ......................66
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Introduction
1. Introduction
This Technical Product Specification (TPS) provides information detailing the features, functionality, and high-level architecture of the Intel
®
Server Board S5500HV and the Intel®
Server System SR1670HV. Additional product information can be found at the following Intel website:
http://support.intel.com/support/motherboards/server/SR1670HV/
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction Chapter 2 – Intel Chapter 3 – Functional Architecture Chapter 4 – Platform Management Chapter 5 – Connector/Header Locations and Pin-outs Chapter 6 – Configuration Jumpers Chapter 7 – Intel Chapter 8 – Intel Chapter 9 – Environmental Specifications Chapter 10 – Regulatory and Certification Chapter 11 – Product Safety Information Appendix A – Product Usage Tips Glossary of Terms Product Reference Documents
®
Server Board S5500HV Overview
®
Light-Guided Diagnostics
®
Server System SR1670HV Overview
1.2 Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system meets the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.
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Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
2. Intel
®
Server Board S5500HV Overview
The Intel® Server Board S5500HV is designed to support high density rack server markets. Its unique half width board design (6.3” x 16.7”) allows for possible dual server node configurations within a single rack mount chassis application.
2.1 Intel
Processors Support for one or two Intel® Xeon® Processors 5500 Series and 5600 Series in FC-
Memory Support for 800/1066/1333 MT/s ECC registered (RDIMM) or unbuffered (UDIMM)
Chipset
I/O Control External connections:
System Fan Support Four 4-pin managed system fan headers Add-in Adapter Support One riser slot supporting low-profile X16 GEN2 PCI Express* riser cards Video On-board ASPEED* AST2050 with integrated Video Controller
Hard Drive Support for Four ICH10R SATA II ports with support for the following integrated RAID
LAN Two 10/100/1000 Ethernet LAN ports provided by Intel® 82574L PHYs with Intel® I/O
®
Server Board S5500HV Feature Set
Table 1. Intel® Server Board S5500HV Feature Set
Feature Description
LGA 1366 Socket B package with up to 130 W Thermal Design Power (TDP) 4.8 GT/s, 5.86 GT/s and 6.4 GT/s Intel® QuickPath Interconnect (Intel® QPI)
DDR3 memory. 12 DIMMs total across 6 memory channels (3 channels per processor).
®
5500 Chipset IOH
Intel
®
82801Jx I/O Controller Hub (ICH10R)
Intel
DB-15 Video connector DB-9 COM1 Serial Port connector Two RJ-45 Network Interface Connectors (Stacked) for 10/100/1000 Mb One RJ-45 Management Network Interface Connector Two USB 2.0 connectors
Internal connections:
One USB 1x5 pin header, supporting one USB 2.0 port One USB 2.0 Type F Connector Four SATA II Connectors 20-pin ATX Main Power Connector(s) 4-pin Peripheral Drive Power Connector Power Supply SMBus Interface Header Front Panel Headers providing support for control button and LED options
Integrated 2D Video Controller 8 MB Video Memory
solutions:
®
Intel
LSI* SATA Software RAID supporting Software RAID levels 0/1/10 (Windows and
Acceleration Technology
Matrix Storage Manager supporting Software RAID levels 0/1/5/10
(Windows* Only)
Linux)
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Overview
Feature Description
Server Management On-board ASPEED AST2050 with integrated Baseboard Management Controller
BMC Management Module with IPMI 2.0 support (Included) 10/100 Management NIC port
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Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
2.2 Server Board Layout
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Figure 1. Intel® Server Board S5500HV
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Overview
C
2.2.1 Server Board Connector and Component Layout
The following figure shows the board layout of the server board. Each connector and major component is identified by letter, with a description of each given in Table 2.
A
B
Q
D
K
P
O N
E
M
L
F
G
G
Figure 2. Intel® Server Board S5500HV Layout
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H
I
H
I
J
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Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Table 2. Major Board Components
A Rear I/O Connectors K CPU 1 DIMM Slots (Slots A1– C2) B BMC Management Module connector L Peripheral Drive Power Connector – 4 pin C SATA Ports 1-4 M CPU 2 - LGA 1366 Socket D Internal USB(4) 2.0 Port N CMOS Battery E CPU 2 DIMM Slots (Slots D1 – F2) O Auxilary Front Panel Header F CPU 1 - LGA 1366 Socket P Front Panel Header G Power Supply SMBus - 2x3 Pin Header Q X16 GEN 2 PCI Express* Riser Card Slot H Main Power Connector – 20 pin I System Fan Connectors J USB(3) 2.0 - 1x5 Pin Header
Description Description
2.2.2 Server Board Rear I/O Layout
The following figure shows the layout of the rear I/O components for the server board.
1 BMC Management NIC Port 5 COM 1 Serial Port 2 Stacked USB 2.0 Ports 6 Video Connector 3 LAN 1 Port 10/100/1000 7 Blue System ID LED 4 LAN 2 Port 10/100/1000
Figure 3. Intel® Server Board S5500HV Rear I/O Layout
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
®
®
3. Functional Architecture
The Intel® Server Board S5500HV is based on Intel architecture with I/O and performance features provided with the Intel and the Intel Interconnect (Intel
®
Xeon® processor 5500 Series and 5600 Series featuring Intel® QuickPath
®
QPI).
®
5500 Chipset I/O Hub (IOH), Intel® ICH10R I/O controller hub,
This chapter provides a high-level description of the functionality associated with each chipset component and the architectural blocks that make up the server board.
DDR3 – C1, C2 DDR3 – B1, B2
DDR3 – A1, A2 DDR3 – D1, D2
Intel® Xeon®
Processor
5500 Series
EP
QuickPath
Intel® Xeon®
Processor
5500 Series
EP
DDR3 – F1, F2 DDR3 – E1, E2
QuickPath
CPU 2
X16 Riser Card Slot
PCI Express* Gen 2
CPU 1
QuickPath
Intel
X16
5500 Chipset IOH
ESI
4 x SATA
USB 1 USB 2 USB 3
Intel
ICH10R
X1
X1
PCI 33
LPC
USB
®
Figure 4. Intel
Server Board S5500HV Functional Block Diagram
3.1 Processor Support
The server board supports the following:
Two on board FC-LGA 1366 socket B package processor sockets.
AST2050
MGNT NIC
BMC Module
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Functional support for one or two Intel® Xeon® Processors 5500 Series and 5600 Series with 4.8 GT/s, 5.86 GT/s or 6.4 GT/s with Intel
®
QuickPath Interconnect.
Up to 130 Watt Thermal Design Power (TDP)
NOTE: Previous generations of the Intel
®
Xeon® processors are not supported on this server
board.
3.1.1 Intel
®
Xeon® Processor 5500 Series and 5600 Series
The Intel® Xeon® Processor 5500 Series and 5600 Series are new micro-architecture based on Intel 45nm and 32nm process technology. The enhancements of the Intel Xeon Processor 5500 Series and 5600 Series are a result of six major technology developments:
New processor architecture Intel
®
QuickPath Technology
Hyper-threading Intelligent power Turbo boost Integrated Memory Controller
The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and Streaming SIMD Extensions 4 (SSE4); in addition to several advanced technologies including:
Execute Disable Bit Intel Enhanced Intel SpeedStep Intel Simultaneous Multithreading.
®
Extended Memory 64 Technology (Intel® EM64T)
®
Technology
®
Virtualization Technology (Intel® VT)
3.1.1.1 New Processor Architecture
®
The Intel
Xeon® Processor 5500 Series and 5600 Series feature several new architectural
innovations, including:
A distinction between the core and “uncore” in terms of chip design Four distinct cores per processor New Level 3 shared Smart Cache More parallelism: 33% more micro-ops over 45nm Intel Enhanced algorithms and branch prediction capabilities High bandwidth Intel An Integrated Memory Controller
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®
Xeon® Processor 5400 Series
®
QuickPath Memory Controller: up to 25.6GB/s
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
Core Core Core Core
8M Shared Cache
Memory
Controller
3x DDR3
Channels
Link
Controller
2x Intel
QuickPath
interconnects
Core
Uncore
Figure 5 Processor Architecture
The Intel Smart Cache architecture features a new three-level hierarchy.
st
1
Level Cache
32 KB instruction cache 32 KB data cache (which supports more L1 misses in parallel than Core 2)
nd
Level Cache
2
New cache introduced in the Intel
®
Xeon® Processor 5500 Series and 5600 Series
Unified (holds code and data) 256KB per core Performance: Very low latency (new dedicated L2 cache improves performance by
reducing latency to frequently used data)
Scalability: As core count increases, pressure on shared cache is reduced
rd
Level Cache
3
Shared across all cores Size depends on number of cores Quad-core: up to 8 MB Scalability: built to vary size with varied core counts with the ability to easily increase L3
size in future parts
Inclusive cache policy for best performance The data residing in L1/L2 must be present in 3rd level Shares memory among all cores
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
3.1.1.2 Intel
®
QPI is a cache-coherent, link-based interconnect specification for processor, chipset, and
Intel I/O bridge components. Intel platforms spanning IA-32 and Intel
®
QuickPath Interconnect (Intel® QPI)
®
QPI can be used in a wide variety of desktop, mobile, and server
®
Itanium® architectures. Intel® QPI also provides support for high-performance I/O transfer between I/O nodes. It allows connection to standard I/O buses such as PCI Express*, PCI-X, PCI (including peer-to-peer communication support), AGP, etc., through appropriate bridges.
Each Intel and receiver, plus a differential forwarded clock. A full width Intel signals (20 differential pairs in each direction) plus a forwarded differential clock in each direction. Each Intel links, one going to the other processor and the other to the Intel
In the current implementation, Intel
6.4 GT/s. Intel
- 5 lanes) independently in each direction between a pair of devices communicating via Intel
®
QPI link consists of 20 pairs of uni-directional differential lanes for the transmitter
®
Xeon® Processor 5500 Series and 5600 Series supports two Intel® QPI
®
®
QPI ports operate at multiple lane widths (full - 20 lanes, half - 10 lanes, quarter
QPI ports are capable of operating at transfer rates of up to
®
QPI link pair consists of 84
®
5500 Chipset IOH.
®
QPI. The server board supports full width communication only.
3.1.1.3 Intel
®
Hyper-Threading Technology lets you run two threads at the same time per core. This
Intel
®
Hyper-Threading Technology
capability lets the processor take advantage of a 4-wide execution engine, effectively hiding the latency of a single thread. However, the data residing in L1/L2 must be present in 3rd level cache.
This is the most power efficient performance feature of the Intel
®
Xeon® Processor 5500 Series and 5600 Series. It’s very efficient performance boost that comes at a very low die area cost. Depending on the application, it can provide significant performance benefit and is much more efficient than adding an entire core. It supports larger caches and provides for massive memory bandwidth.
3.1.1.4 Intel
®
The Intel
Xeon® Processor 5500 Series and 5600 Series feature two Intel® Intelligent Power
®
Intelligent Power Technology
Technologies: Integrated Power Gates - this feature lets individual idle cores reduce power to nearly zero
independently. Core power can be controlled automatically or manually. Automated Low Power States – this feature allows for more and lower CPU power states with
reduced latency during transitions. Also, it now features power management on memory and I/O chip as well as the processor. This adjusts system power consumption based on real-time loads.
3.1.1.5 Turbo Mode
®
Intel
Turbo Boost Technology opportunistically and automatically allows the processor to run faster than the marked frequency if the part is operating below power, temperature, and current limits. This can result in increased performance of both multi-threaded and single threaded workloads.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
Turbo boost operation:
Operates under OS control – only entered when OS requests higher performance state
(P0).
Turbo Boost availability is independent of the number of active cores Max Turbo boost frequency is dependent on the number of active cores and varies by
processor configuration.
Amount of time the system spends in Turbo Boost will depend on the workload,
operating environment, and platform design.
Turbo Boost can be enabled or disabled by BIOS.
3.1.1.6 Integrated Memory Controller
®
The Intel as the Intel
5500 Chipset Series employs a new design where the memory controller, referred to
®
QuickPath Memory Controller, is now embedded as part of the processor
architecture. The Intel
®
QuickPath Memory Controller provides up to three memory channels per processor supporting up to 32 GB/s bandwidth per memory controller. Supported memory follows the DDR3 specification and supports the following characteristics:
800MHz, 1066MHz and 1333MHz operating frequencies Single-rank (SR), dual-rank (DR) and quad-rank (QR) Registered DIMM (RDIMM) or Unbuffered DIMM (UDIMM)
3.1.2
Processor Population Rules
Note: Although the server board does support dual-processor configurations consisting of different processors that meet the defined criteria below, Intel does not perform validation testing of this configuation. For optimal system performance in dual-processor configurations, Intel recommends that identical processors be installed.
When using a single processor configuration, the processor can be installed into either CPU1 or CPU2 processor sockets.
When two processors are installed, the following population rules apply:
Both processors must have the same Intel Both processors must have the same core frequency Both processors must have the same internal cache sizes Both processors must have the same Thermal Design Power (TDP - Watts) rating Processor stepping within a common processor family can be mixed as long as it is
®
QuickPath Interconnect frequency
listed in the processor specification updates published by Intel Corporation.
3.1.3
Unified Retention System Support
The server board complies with Intel’s Unified Retention System (URS) and the Unified Backplate Assembly. The server board ships with a made-up assembly of Independent Loading Mechanism (ILM) and Unified Backplate for each processor socket.
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The URS retention transfers load to the server board through the unified backplate assembly. The URS spring, captive in the heatsink, provides the necessary compressive load for the thermal interface material. All components of the URS heatsink solution are captive to the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly. See the following figure for the stacking order of the URS components.
Screw
Heatsink
ILM and Socket
ILM Attach Studs
Heatsink
Attach Studs
Server Board
Compression Spring
Retention Cup
Retaining Ring
Thermal Interface Material (TIM)
Unified Backplate
Figure 6. Unified Retention System and Unified Backplate Assembly
3.2 Intel
®
QuickPath Memory Controller and Memory Subsystem
The Intel® QuickPath Memory Controller provides up to three memory channels per processor supporting up to 32 GB/s bandwidth per memory controller. Supported memory follows the DDR3 specification and supports the following characteristics:
800MHz, 1066MHz and 1333MHz operating frequencies Single-rank (SR), dual-rank (DR) and quad-rank (QR)
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0
Registered DIMM (RDIMM) or Unbuffered DIMM (UDIMM)
RDIMMs must be ECC only UDIMMs can be ECC or non-ECC and can be mixed within a common configuration The Channel Independent mode is the only memory RAS mode that supports non-
ECC DIMMs.
The presence of a single non-ECC UDIMM results in the disabling of ECC
functionality.
RDIMMs and UDIMMs cannot be mixed within a common system memory
configuration
Note:
Although non-ECC memory can be used on this server board, Intel does not validate and
strongly discourages their use in a working server environment. The following table shows the maximum memory amounts possible using RDIMM type memory:
Single Rank RDIMMs 800 MHz and 1066 MHz Dual Rank RDIMMs 800 MHz and 1066 MHz Quad Rank RDIMMs (1) 800 MHz only
48 GB (12x 4GB DIMMs) 96 GB (12x 8GB DIMMs) 96 GB (12x 8GB DIMMs)
NOTE: (1) Due to thermal requirements needed to support Quad Rank x4 DDR3 DIMMs, this memory type is not supported in the Intel® Server System SR1670HV. Support for this memory type should be verified with other server chassis/system manufacturers planning to support this server board.
3.2.1 Intel
®
Server Board S5500HV Memory Support
The Intel® Server Board S5500HV provides six DIMM slots across 3 memory channels per processor, for a total of twelve DIMM slots.
0
1
2
3 channels per
CPU
1
2
Intel®
®
Xeon
Processo
r 5500
CPU 1
QPI
Intel® Xeon
Processo
r 5500
CPU 2
®
Figure 7. Conceptual Memory Layout Diagram
13 Intel Confidential Revision 1.2 Intel order number E69391-006
1 2
2 1
2 DIMMs per
channel
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
A
A
The nomenclature for DIMM slots implemented on the Intel® Server Board S5500HV is detailed in the following figure.
Processor Socket 1 Processor Socket 2
Channel 0
(A)
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2
Channel 1 (B) Channel 2
(C)
Channel 0
(D)
Channel 1 (E) Channel 2
(F)
Figure 8. DIMM Slot Nomenclature
On the Intel® Server Board S5500HV the DIMM slots are identified as shown below:
D2
D1
E2
E1
F2
F1
CPU 2
Intel® Xeon®
Processor
5500 Series
Intel® Xeon®
Processor
5500 Series
CPU 1
Figure 9. Intel Server Board S5500HV Memory Slot Layout
C2B1B2
C1
2
1
Note: Memory is only populated using DIMM slots associated with a given installed processor. Ie.) With only one processor installed, only the DIMM slots associated with that processor should be populated. Memory installed into DIMM slots for a processor that is not installed are non-functional.
DIMMs are organized into physical slots on DDR3 memory channels that belong to
processor sockets.
The memory channels from processor socket 1 are identified as Channels A, B, and C.
The memory channels from processor socket 2 are identified as Channels D, E, and F.
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The memory slots associated with a given processor are unavailable if the given processor socket is not populated.
A processor may be installed without populating the associated memory slots provided a
second processor is installed with associated memory. In this case, the memory is shared by the processors. However, this is not a recommended configuration due to the associated latency which will affect performance.
Processor sockets are self-contained and autonomous. However, all memory subsystem
support (i.e., Memory RAS, Error Management, etc.) in the BIOS setup are applied commonly across processor sockets.
3.2.1.1 Memory Population Rules
DIMM population requirements are dependent upon the number of slots per channel; the number of DIMMs installed; and rank type. When installing memory consider the following:
Populate DIMMs by channel starting with the Blue slot farthest from the CPU All channels in a system will run at the fastest common frequency RDIMMs and UDIMMs may not be mixed If two 1333 MHz capable UDIMMs or RDIMMs is detected in the same channel, BIOS
will flag this as a warning and force the speed down to 1066 MHz.
3.2.1.1.1 Supported RDIMM configurations:
Table 3 Supported RDIMM configurations
DIMM Slots
per Channel
2 1 Registered
2 1 Registered
2 2 Registered
2 2 Registered
DIMMs Populated
per Channel
DIMM Type Speeds Ranks per
DIMM
DDR3 ECC
DDR3 ECC
DDR3 ECC
DDR3 ECC
800,
1066,
1333
800, 1066 QR Only
800, 1066 Mixing SR,
800 Mixing SR,
SR or DR
DR
DR, QR
Population Rules
1. Any combination of x4 and x8 RDIMMs, with 1Gb or 2Gb DRAM density
256 Mb, 512 Mb and 4 Gb DRAM technologies and x16 DRAM on RDIMM are NOT
supported
If a quad rank RDIMM is mixed with a single rank or dual rank DIMM on given channel,
the quad rank DIMM must be populated in the lowest numbered slot.
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
3.2.1.1.2 Supported UDIMM configurations:
Table 4 Supported UDIMM configurations
DIMM
Slots per
Channel
2 1 Unbuffered DDR3
2 2 Unbuffered DDR3
DIMMs
Populated
per Channel
DIMM Type Speeds Ranks per DIMM Population Rules
SR or DR
Mixing SR, DR
1. Any combination of x8 UDIMMs with 1Gb or 2Gb DRAM Density
(with or without
ECC)
(with or without
ECC)
800,
1066,
1333
800,
1066
256 Mb, 512 Mb and 4 Gb DRAM technologies; x4 DRAM on UDIMM and Quad rank
UDIMM are not supported
Mixing ECC and non-ECC UDIMMs anywhere on the platform will force system to run in
non-ECC mode
No RAS support for non-ECC UDIMMs No x4 SDDC support with UDIMM w/ECC, however x8 SDDC is supported in lock step
mode with x8 UDIMMs w/ECC
Note:
Although non-ECC memory can be used on this server board, Intel does not plan to
validate and strongly discourages their use in a working server environment.
When installing DIMMs, the following population rules should be followed to deliver best performance
Maximize number of channels populated first Balanced DIMM population across channels and sockets.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
; ; ;
- -
-
-
; ;
CPU 1 Configuration
1 DIMM 2 DIMMs 3 DIMMs 4 DIMMs 6 DIMMs
Table 5 Memory Population Table
DIMM_A2 DIMM_A1 DIMM_B2 DIMM_B1 DIMM_C2 DIMM_C1
-
-
-
; ;
; ; ;
- - - -
-
-
-
; ; ; ; ; ;
CPU 2 Configuration
1 DIMM 2 DIMMs 3 DIMMs 4 DIMMs 6 DIMMs
DIMM_D2 DIMM_D1 DIMM_E2 DIMM_E1 DIMM_F2 DIMM_F1
-
-
-
; ;
; ; ;
- - - -
-
-
-
; ; ;
- -
-
-
; ;
; ; ; ; ; ;
With two processors installed, the system will operate if only the DIMM slots of one processor are populated. In this case, memory is shared between the two processors. However, due to the associated latency of this configuration, this is NOT a recommended operating mode.
3.2.1.2 Memory RAS Modes
The server board supports the following memory RAS Modes:
Independent Channel Mode Mirrored Channel Mode
Mirrored Channel Mode requires that all installed DIMMs support ECC and that there be matching DIMM populations between channels. Matching DIMMs must meet the following criteria: DIMM size, DIMM organization (rank, banks, rows, columns). DIMM timings do not have to match, however, timings will be set to support all DIMMs populated.
Independent channel mode is the only memory RAS mode that supports either non-ECC or ECC DIMMs.
Independent Channel Mode
In the Channel Independent mode, channels can be populated in any order (e.g., channels B and C can be populated while channel A is empty). All three channels may be populated in any order and have no matching requirements. All channels must run at the same interface frequency, but individual channels may run at different DIMM timings (RAS latency, CAS latency, and so on).
The single channel mode is established using the Channel Independent mode by populating DIMM slots from channel A only.
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
A
A
Mirrored Channel Mode
In Mirrored Channel Mode, the memory controller supports mirroring across channels, but not across CPU sockets. The contents are mirrored between the first 2 channels of a given processor. For CPU1, mirrored slot pairs include {A1, B1} and {A2, B2}. For CPU2, the mirrored slot pairs include {D1, E1} and {D2, E2}. The sockets of the 3rd channel of each CPU are not used in this mode.
D2
D1
E2
E1
F2
F1
Intel® Xeon®
CPU 2
Processor
5500 Series
Intel® Xeon®
Processor
C1
C2
B1
B2
1
5500 Series
2
CPU 1
Figure 10. Mirror Channel Mode Memory Population
Mirrored channel mode requires the following memory population rules:
Channel 0 and Channel 1 of a given processor must be populated identically. DIMM slot populations within a channel do not have to be identical, but the same DIMM
slot location across Channel 0 and Channel 1 must be populated the same.
For example; DIMM slots A1 and B1 must have identical DIMMs installed to be
mirrored together. DIMM slots A2 and B2 must have identical DIMMs installed to be mirrored together. However the DIMMs used in mirrored pair {A1, B1} can be different than those used in mirrored pair {A2, B2}.
With two processors installed, DIMM slots associated with each processor must have a
valid mirroring configuration for memory channels 0 and 1. However, the memory configuration of each processor can be different from the other.
The exception to this rule is that one processor has no memory installed. Because of
the associated latency, this is NOT a recommended operating mode.
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The following table illustrates possible DIMM configurations that can be mirrored, with the following assumptions: Two processors are installed; all installed DIMMs are identical.
Table 6. Supported Mirrored DIMM Population
A1 A2 B1 B2 C1 C2 D1 D2 E1 E2 F1 F2 Mirroring
Possible?
; ;
;
; ; ; ; ; ; ; ; ; ; ; ; ;
;
;
; ; ; ; ;
;
Yes Yes Yes Yes Yes
3.3 Intel
The Intel components and Intel
®
5500 Chipset IOH
®
5500 Chipset I/O Hub (IOH) provides a connection point between various I/O
®
QuickPath Interconnect (Intel® QPI) based processors. It is capable of interfacing with up to 24 PCI Express* lanes, which can be configured in various combinations of x4, x8, x16 and limited x2 and x1 devices.
On the Intel Server Board S5500HV the IOH provides the following:
Two Intel One X16 PCI Express* Gen 2 port supporting a single PCI Express Gen2 compliant X16
®
QuickPath Interconnect (Intel® QPI) interfaces
riser card slot. (Compliant to the PCI Express Base Specification, Revision 2.0)
One X4 ESI link interface to the I/O controller hub Intel
3.4 Intel
®
82801Jx I/O Controller Hub (ICH10R)
®
ICH10R
The server board utilizes features of the Intel® 82801Jx I/O Controller Hub (ICH10R). Supported features include the following:
PCI Express* Base Specification, Revision 1.1 support PCI Local Bus Specification, Revision 2.3 support for 33-MHz PCI operations (supports
up to four REQ#/GNT# pairs)
ACPI Power Management Logic Support, Revision 3.0a Enhanced DMA controller, interrupt controller, and timer functions Integrated Serial ATA host controllers with independent DMA operation on up to four
ports and AHCI support
USB host interface with support for four USB 2.0 ports; Two external, two internal System Management Bus (SMBus) Specification, Version 2.0 with additional support for
2
I
C devices
Low Pin Count (LPC) interface support Firmware Hub (FWH) interface support Serial Peripheral Interface (SPI) support
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
(
3.4.1.1 Serial ATA Support
The ICH10R has an integrated Serial ATA (SATA) controller that supports independent DMA operation on four ports with data transfer rates of up to 3.0 Gb/s. The four SATA ports on the server board are numbered SATA-1 through SATA-4. The SATA ports can be enabled or disabled and/or configured by accessing the BIOS setup utility during POST.
3.4.1.2 Integrated RAID Support
The server board has embedded support for two RAID options:
Intel
®
Matrix Storage Manager with support for RAID levels 0, 1, 5, and 10 (Windows*
support only)
LSI* MegaRAID (Default) with support for RAID levels 0, 1, and 10 (Windows* and Linux)
By default the server board is configured to support the LSI* MegaRAID option. To change this, a jumper block on the board needs to be changed. The following diagram shows the location of the jumper block and its settings.
1 2 3
Default)
LSI
1 2 3
Intel
By default, BIOS does NOT enable RAID support. To enable this feature, on option in BIOS setup must be set as described in the following procedure:
1. Enter BIOS Setup (F2 Key) during POST
2. Go to the MAIN menu > IDE Configuration, and press <Enter>
3. Set the Configure SATA As option to [RAID]
4. Save changes and then exit BIOS Setup
Note: Refer to Intel
Revision 1.2 Intel Confidential 20 Intel order number E69391-006
®
Server System SR1670HV Service Guide for RAID setup information
Figure 11. RAID Option Jumper Block
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
r
3.4.2 USB 2.0 Support
The USB controller functionality integrated into ICH10R provides the server board with an interface for 4 USB 2.0 ports. All ports are high-speed, full-speed and low-speed capable.
Two external connectors are located on the back edge of the server board. Two internal connectors (A-Type USB 4, 5x1 header USB 3) allow for optional USB
support
USB 4
Type 4 device
connecto
Figure 12. Internal USB Port Locations
USB 3
Power USB Port A-
USB Port A+
GND
3.4.3 Keyboard and Mouse Support
The server board does not support PS/2 interface keyboards and mice. However, the system BIOS recognizes USB specification-compliant keyboard and mice.
3.5 Network Interface Controller (NIC)
This server board supports two external Gigabit Ethernet ports in a stacked housing on the back edge of the server board. The network interface is provided using two on-board Intel Gigabit Ethernet Controllers supporting 10/100/1000 Mbps operation.
The Intel 1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and 802.3ab).
Each network interface controller (NIC) drives two status LEDs located on each external network interface connector. The activity/link LED (at the left of the connector) indicates network connection when on, and transmit/receive activity when blinking. The speed LED (at the right of
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®
82574L device provides MDI (copper) standard IEEE 802.3 Ethernet interface for
®
82574L
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
the connector) indicates 1000-Mbps operation when green, 100-Mbps operation when orange, and 10-Mbps when off. The following table provides an overview of the LEDs.
Act/Link
LED
Speed
LED
Table 7. NIC Status LEDs
Act/Link LED Speed LED
Status Description Status Description
OFF No Link OFF 10 Mbps connection
GREEN Linked ORANGE 100 Mbps connection
BLINKING Data Activity GREEN 1000 Mbps connection
Each LAN port can be enabled (default) or disabled via a jumper block, identified in the following diagram.
NIC 1
NIC 2
1 2
Enabled
1 2
Disabled
Figure 13. NIC Enable/Disabled Jumper Block
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3.6 ASPEED* AST2050 Graphics and Remote Management Processor
This server board utilizes the graphics and baseboard management features of the ASPEED* AST2050 Graphics and Remote Management Processor. Features utilized include:
Embedded 2D VGA Controller Baseboard Management Controller 10/100 Mbps MAC (option)
3.6.1
Video Support
Video support on this server board is provided using the video controller features embedded in the ASPEED* AST2050. Video support includes a 2D VGA controller capable of supporting video resolutions up to and including 1600x1200@60Hz 16bpp.
The video is accessed using a standard 15-pin VGA connector found on the back edge of the server board. The on-board video controller can be enabled (default) or disabled via a jumper on the baseboard, identified in the following diagram:
1 2
Enable
(Default)
1 2
Disable
Figure 14. Video Enable/Disable Jumper Block
3.6.2 Baseboard Management Controller & BMC Module
This server board uses the Baseboard Management Controller feature of the ASPEED AST2050 along with a Winbond* 83795ADG hardware monitoring chip to monitor various server board sensors including Processor Temp, Fan Tach, and DC Voltages. Sensor data can be accessed in-band with or without the included Baseboard Management Module. For out-of-band access to this sensor data, the included Baseboard Management Module must be installed.
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Functional Architecture Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
3.6.2.1 Baseboard Management Module
The server board includes an IPMI 2.0/1.5 compliant Baseboard Management Module which provides support for out-of-band system access.
Figure 15. Baseboard Management Module
Additional features of the BMC Module include the following:
IPMI 2.0 Advanced Encryption Standard (AES) support Secure Socket Layer (SSL) support Dynamic Host Configuration Protocol (DHCP) support Telnet Access, SSH support SMASH CLP support ARC support Remote Monitor support Remote Re-Direct (SOL for Text Mode only) Remote Update Firmware support Remote CMOS Setting (Text Mode SOL) Automatic System Recovery (ASR) by watchdog timer Remote Reboot Remote Power On/Off PEF Configuration SMTP (Email) support Platform Event Trap (PET) support
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Functional Architecture
3.6.2.2 Management NIC
The server board provides Serial-Over-LAN support via a dedicated 10/100 Mbps Management NIC. The management port is located on the back edge of the server board in a stacked housing over the USB ports as shown in the following diagram.
Management NIC
Figure 16. Management NIC
Note: The Management NIC is only enabled with the BMC Module installed.
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Platform Management Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
4. Platform Management
The platform management subsystem consists of several components of the server board including the embedded BMC features of the ASPEED* 2050, Winbond* 83795ADG hardware monitoring chip, BMC Module, on-board sensors, BIOS and Firmware. Together these components provide several platform management features including:
Note: The following feature list is only supported with the BMC Module installed.
In-band/Out-of-Band Sensor monitoring PMBus support PSMI support PET SNMP Trap E-Mail Notification Fan Control Error Handling and Reporting IPMI 2.0 support
System Interface (KCS) LAN Interface (support RMCP+) System Event Log (SEL) Sensor Data Records (SDR) Field Replaceable Unit (FRU) Remote Power on/off, reboot Serial Over LAN (SOL) Authentication Type: RAKP-HMAC_SHA1 Encryption (AES) Platform Event Filtering (PEF) Platform Event Trap (PET) Watchdog Timer
See also the IPMI 2.0 Specification.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Platform Management
4.1 System Fan Control
The server board provides four 4-pin system fan connectors.
FAN 2 FAN 1
FAN 3
FAN 4
Figure 17. System Fan Connector Locations
Each system fan connector has the following pin-out definition:
Connector
Key
Figure 18. System Fan Connector Pin-out Definition
Pin 1 – GND Pin 2 – Fan Power Pin 3 – Fan Speed Pin 4 – PWM Control
The fan speed for all the system fans is controlled by a single pulse width modulator (PWM) and monitored by the BMC. BIOS setup provides two fan speed options: Full Speed Mode & High Density Mode.
In Full Speed Mode, system fans will only operate at highest fan speed, providing maximum air flow.
In High Density Mode, fan speed is controlled, allowing for a quieter system. At nominal CPU temperatures, the fan speeds will operate at 50% of maximum. As CPU temperatures rise, the fan speeds will gradually increase to a maximum 100%. As CPU temperatures fall, fan speeds will automatically readjust to a lower speed.
4.2 On-board/System Sensor Information
The server board includes many on-board sensors which are monitored by the BMC for various server management functions.
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Platform Management Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
The following tables list the sensor identification numbers and information about the sensor type, name, supported thresholds, assertion and de-assertion information. See the Intelligent Platform Management Interface Specification, Version 2.0, for sensor and event/reading-type table information.
Sensor Type
The Sensor Type values are the values enumerated in the Sensor Type Codes table in the IPMI specification. The Sensor Type provides the context in which to interpret the sensor, such as the physical entity or characteristic that is represented by this sensor.
Event/Reading Type
The Event/Reading Type values are from the Event/Reading Type Code Ranges and Generic Event/Reading Type Codes tables in the IPMI specification. Digital sensors are a specific type of discrete sensor, which have only two states.
Event Offset/Triggers
Event Thresholds are event-generating thresholds for threshold types of sensors.
- [u,l][nr,c,nc]: upper non-recoverable, upper critical, upper non-critical, lower non- recoverable, lower critical, lower non-critical
- uc, lc: upper critical, lower critical
Event Triggers are supported event-generating offsets for discrete type sensors. The offsets can be found in the Generic Event/Reading Type Codes or Sensor Type Codes tables in the IPMI specification, depending on whether the sensor event/reading type is generic or a sensor-specific response.
MLED
The MLED column indicates whether a particular sensor reading will trigger the Message LED located on the system front panel to illuminate or not.
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Platform Management
Table 8. System Sensors
System Sensor Table
No Sensor Name Sensor Type Sensor
Type code
30h 31h
32h CPU2 Temperature Temperature cch TR1 Temperature Temperature cdh TR2 Temperature Temperature
34h 35h 36h 37h 38h 39h 3ah 3bh
3ch VBAT Voltage
3dh 3eh
3fh P2VTT Voltage
40h 41h 4Fh
Reserved CPU1 Temperature
VCORE1 Voltage VCORE2 Voltage +3.3V Voltage +5V Voltage +12V Voltage +1.5V_ICH Voltage 02h Threshold (01h) +1.1V_IOH Voltage 02h Threshold (01h) +5VSB Voltage
P1VTT Voltage +1.5V_P1DDR3 Voltage 02h Threshold (01h)
+3.3VSB Voltage +1.5V_P2DDR3 Voltage 02h Threshold (01h) Chassis Intrusion Discrete (6Fh)
Temperature
01h 01h
01h 01h 01h 01h 01h
01h 01h 01h 01h 01h 01h
01h 01h 01h
02h Threshold (01h) 02h Threshold (01h) 02h Threshold (01h) 02h Threshold (01h) 02h Threshold (01h)
02h Threshold (01h) 02h Threshold (01h) 02h Threshold (01h)
02h Threshold (01h) 02h Threshold (01h)
Threshold (01h) 00h:Lower Non-critical - going low 01h:Lower Non-critical - going high 02h:Lower Critical - going low 03h:Lower Critical - going high 04h:Lower Non-recoverable - going low 05h:Lower Non-recoverable - going high 06h:Upper Non-critical - going low 07h:Upper Non-critical - going high
08h:Upper Critical - going low 09h:Upper Critical - going high 0Ah:Upper Non-recoverable - going low 0Bh:Upper Non-recoverable - going high UC, UNC Threshold (01h) UC, UNC Threshold (01h) UC, UNC Threshold (01h) UC, UNC
UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC UC, UNC, LC, LNC 01h: General Chassis Intrusion,
02h: Drive Bay Intrusion
Event Type MLED
UC
UC UC UC UC,
LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC UC, LC
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Table 9. LED/Power Module Sensors
LED/Power Module Sensor Table
No Sensor Name Sensor Type Sensor
Type code
53h 54h
Message LED OEM Message LED C0h Read sensor 0: off, 1:on Locate LED OEM Locate LED C0h Read sensor 0: off, 1:on
Event Type MLED
Table 10. Backplane Sensors
Backplane 1 Sensor Table
No Sensor Name Sensor Type Sensor
Type
68h
69h
6Ah
6Bh
Backplane1 HD1 Drive Slot 0Dh Discrete (6Fh)
Backplane1 HD2 Drive Slot 0Dh Discrete (6Fh)
Backplane1 HD3 Drive Slot 0Dh Discrete (6Fh)
Backplane1 HD4 Drive Slot 0Dh Discrete (6Fh)
code
01h: Drive Presence, 02h: Drive Fault
01h: Drive Presence, 02h: Drive Fault
01h: Drive Presence, 02h: Drive Fault.
01h: Drive Presence, 02h: Drive Fault.
Event Type MLED
Table 11. Power Module Sensors
Power Module Sensor Table
No Sensor Name Sensor Type Sensor
Type code
90h
91h
92h
93h
94h
PSU1 PSON Power Supply 08h Discrete (6Fh)
PSU1 PWRGOOD Power Supply 08h Discrete (6Fh)
PSU1 Over Temp Temperature 01h Discrete (07h)
PSU1 FAN Low FAN 04h Discrete (07h)
PSU1 AC Lost Power Supply
08h
Event Type MLED
01h: Presence detected 02h: Power Supply Failure detected
01h: Presence detected 02h: Power Supply Failure detected
01h: Transition to OK 02h: Transition to Non-Critical from
OK
04h: Transition to Critical from less
severe
01h: Transition to OK 02h: Transition to Non-Critical from
OK Discrete (6Fh) 01h: Presence detected 08h: Power Supply input lost
(AC/DC)
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Table 12. System Fan Sensors
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Fan Sensor Table
No Sensor Name Sensor Type Sensor
Type code
A2h A3h A4h A5h
FRNT_FAN1 Fan 04h LC, LNC FRNT_FAN2 Fan 04h Threshold (01h) FRNT_FAN3 Fan 04h LC, LNC FRNT_FAN4 Fan 04h Threshold (01h)
Event Type MLED
Table 13. FRU Sensors
FRU Sensor Table
No FRU Name FRU Type SDR
MB FRU MB FRU 11h
Type
code
FRU ID=0Ah
FRI ID
4.3 Error Handling and Messaging
BIOS has the ability to generate many possible error messages and BIOS initialization checkpoints during the POST process. The following table provides a description for each possible BIOS generated error message and checkpoint:
Note: Some of the listed error messages and checkpoints may not be supported on this server board.
Table 14. BIOS Error Messages and Checkpoints
Message Displayed Message Description
Memory
Invalid Memory Configuration on CPU1
Invalid Memory Configuration on CPU2
Parity Error Fatal memory parity error has been detected. System will halt after displaying this
Storage Devices SATA Port-1 Device Error Failed SATA Device detected on SATA Port-1 SATA Port-2 Device Error Failed SATA Device detected on SATA Port-2 SATA Port-3 Device Error Failed SATA Device detected on SATA Port-3 SATA Port-4 Device Error Failed SATA Device detected on SATA Port-4 SMART capable but
command failed
SMART Command Failed The BIOS tried to send a SMART message to a hard disk, but the command
SMART Status Bad, Backup A SMART capable hard disk sends this message when it detects an imminent
When CPU1 is not installed, this message will occur when DIMMs are populated in any of the DIMM slots associated with CPU-1
When CPU2 is not installed, this message will occur when DIMMs are populated in any of the DIMM slots associated with CPU-2
message
The BIOS tried to send a SMART message to a hard disk, but the command transaction failed.
This message can be reported by an ATAPI device using the SMART error reporting standard. SMART failure messages may indicate the need to replace the hard disk
transaction failed. This message can be reported by an ATAPI device using the SMART error reporting
standard. SMART failure messages may indicate the need to replace the hard disk
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Message Displayed Message Description
and Replace failure.
This message can be reported by an ATAPI device using the SMART error reporting standard. SMART failure messages may indicate the need to replace the hard disk.
SMART capable and status BAD
System Configuration
DMA-1 Error Error initializing primary DMA controller. This is a fatal error often indicating a
DMA-2 Error Error initializing primary DMA controller. This is a fatal error often indicating a
DMA Controller Error POST error while trying to initialize the DMA controller. This is a fatal error often
Checking NVRAM… Update Failed
Unknown CPU is detected, updating BIOS is required to unleash its full power!
Resource Conflict More than one system device is trying to use the same non-shareable resources
PCI I/O Conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST PCI ROM Conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST PCI IRQ Conflict A PCI adapter generated an I/O resource conflict when configured by BIOS POST Timer Error Indicates an error while programming the count register of channel 2 of the 8254
Interrupt Controller-1 Error BIOS POST could not initialize the Master Interrupt Controller. This may indicate a
Interrupt Controller-2 Error BIOS POST could not initialize the Slave Interrupt Controller. This may indicate a
CMOS
CMOS Date/Time Not Set The CMOS Date and/or Time are invalid. This error can be resolved by resetting the
CMOS Battery Low CMOS battery is low. This message usually indicates that the CMOS battery needs
CMOS Settings Wrong CMOS settings are invalid. This error can be resolved by resetting and saving
CMOS Checksum Bad CMOS contents failed the checksum check. Indicates that the CMOS data has been
Miscellaneous
Chassis Intrusion Detected This message will occur when a chassis intrusion switch has triggered a chassis
Serial Port Component was not detected
Boot Block Initialization Code
Checkpoints
D0 1. go to flat mode with 4GB limit and GA20 enabled
A SMART capable hard disk sends this message when it detects an imminent failure.
This message can be reported by an ATAPI device using the SMART error reporting standard. SMART failure messages may indicate the need to replace the hard disk.
problem with system hardware
problem with system hardware
indicating a problem with system hardware BIOS could not write to the NVRAM block. This message appears when the FLASH
part is write protected or if there is no FLASH part present. BIOS could not find or load the CPU microcode update for the CPU detected.
(memory or I/O)
timer. This may indicate a problem with system hardware
problem with system hardware
problem with system hardware
system time in BIOS Setup
to be replaced.
options in BIOS setup.
changed by a program other than the BIOS or that the CMOS is not retaining its data due to a malfunction. This error can typically be resolved by resetting and saving options in BIOS Setup.
intrusion event This message will occur when the serial redirection feature is enabled but no serial
port is available.
2. Initialize CAR function
3. Initialize CPU
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Message Displayed Message Description
D1 1. Initialize KBC and RTC D2 1. Check BIOS Checksum D3 1. Initialize IOH
2. Initialize ICH10
3. Initialize SIO
4. Initialize IPMI
5. Initialize Intel RC code D4 Test base 512KB memory. Adjust policies and cache first 8MB. Set stack D5 Boot block code is copied from ROM to lower system memory and control is given to
it. BIOS now executes out of RAM
D6 Both key sequence and OEM specific method is checked to determine if BIOS
recovery is forced. Main BIOS checksum is tested. If BIOS recovery is necessary, control flows to checkpoint E0.
D7 Restore CPUID value back into register. The Boot block runtime interface module is
moved to system memory and control is given to it. Determine whether to execute serial flash
D8 The runtime module is uncompressed into memory. CPUID information is stored in
memory.
D9 Store the uncompressed pointer for future use in PMM. Copying main BIOS into
memory.
DA Restore CPUID value back into register. Give control to BIOS POST.
Boot Block Recovery Code
Checkpoints
E0 Initialize the floppy controller in the super IO. DMA controller is initialized. 8259
E9 Set up floppy controller and data. Attempt to read from floppy EA Enable ATAPI hardware. Attempt to read from ARMD and ATAPI CDROM EB Disable ATAPI hardware. Jump back to checkpoint E9 EF Read error occurred on media. Jump back to checkpoint EB E9 or EA Determine information about root directory of recovery media F0 Search for pre-defined recovery file name in root directory F1 Recovery file not found F2 Start reading FAT table and analyze FAT to find the clusters occupied by the
F3 Start reading the recovery file cluster by cluster F5 Disable L1 cache FA Check the validity of the recovery file configuration to the current configuration of the
FB Make flash write enabled. Detect proper flash part. Verify that the found flash part
F4 The recovery file size does not equal the found flash part size FC Erase the flash part FD Program the flash part FF The flash has been updated successfully. Make flash write disabled. Disable ATAPI
Post Code Checkpoints
03 Disable NMI, Parity, video for EGA and DMA controllers. Initialize BIOS, POST,
04 Check CMOS diagnostic byte to determine if battery power is OK and CMOS
interrupt controller is initialized. L1 cache is enabled.
recovery file
flash part
size equals the recovery file size
hardware. Restore CPUID value back into register
Runtime Data area. Also initialize BIOS Modules on POST entry and GPNV area.
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Message Displayed Message Description
checksum is OK. 05 Initializes the interrupt controlling hardware (generally PIC) and interrupt vector table 06 Do R/W test to CH-2 count reg. Intialize CH-0 as system timer. Install the POST
INT1Ch handler. Enable IRQ-0 in PIC for system timer interrupt. Traps INT1Ch
vector to POST INT1Ch handler block 08 Initializes the CPU. The BAT test is being done on KBC. Program the keyboard
controller command byte is being done after auto detection of KB/MS C0 Early CPU init start – disable cache – init local APIC C1 Setup boot strap processor information C2 Setup boot strap processor for POST C5 Enumerate and set up application processors C6 Re-enable cache for boot strap processor C7 Early CPU init exit 0A Initializes the 8042 compatible key board controller 0B Detects the presence of PS/2 mouse 0C Detects the presence of keyboard in KBC port 0E Testing and initialization of different input devices. Also update the kernel variables.
Traps the INT09h vector so that the POST INT09h handler gets control for IRQ1.
Uncompress all available language, BIOS logo, and silent logo modules 13 Early POST initialization of chipset registers. 20 Initialize system management interrupt 24 Uncompress and initialize any platform specific BIOS modules 2A Initializes different devices through DIM. 2C Initializes different devices. Detects and initializes video adapter installed in the
system that have option ROMs 2E Initializes all the output devices 31 Allocate memory for ADM module and uncompress itl. Give control to ADM module
for initialization. Initialize language and font modules for ADM. Activate ADM
module. 33 Initializes the silent boot module. Set the window for displaying text information 37 Display sign-on message, CPU information, setup key message, and OEM specific
information 38 Initializes different devices through DIM. 39 Initializes DMAC-1 & DMAC-2 3A Initialize RTC date/time 3B Test for total memory installed in the system. Also check for DEL or ESC keys to
limit memory test. Display total memory in the system. 3C Mid POST initialization of chipset registers 40 Detect different devices successfully installed in the system and update the BDA,
EBDA… etc. 50 Programming the memory hole or any kind of implementation that needs an
adjustment in system RAM size if needed. 60 Initializes NUM-LOCK status and programs the KBD typematic rate 75 Initialize int-13 and prepare for IPL detection 78 Initializes IPL devices controlled by BIOS and option ROMs 84 Log errors encountered during POST 85 Display errors to the user and gets the user response for error 87 Execute BIOS Setup if needed/requested
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Message Displayed Message Description
8D Build ACPI tables (if ACPI is supported) 8C Late POST initialization of chipset registers. 8E Program the peripheral parameters. Enable/Disable NMI as needed. 90 Late POST initialization of system management interrupt A1 Clean-up work needed before booting to OS A2 Takes care of runtime image preparation for different BIOS modules. Fill the free
area in F000h segment with 0FFh. Initializes the Microsoft* IRQ routing table.
Prepares the runtime language module. Disables the system configuration display if
needed. A4 Initialize runtime language module A7 Displays the system configuration screen if enabled. Intialize the CPUs before boot,
which includes the programming of MTRR’s A9 Wait for user input at config display if needed AA Uninstall POST INT1Ch vector and INT09h vector. Deinitializes the ADM module AB Prepare BBS for Int 19 boot AC End of POST initialization of chipset registers B1 Save system context for ACPI 00 Passes control to OS Loader (typically INT19h)
ACPI Runtime Checkpoints
AC First ASL check point. Indicates the system is running in ACPI mode. AA System is running in ACPI Mode 01, 02, 03, 04, 05 Entering sleep state S1, S2, S3, S4, or S5 10, 20, 30, 40, 50 Waking from sleep state S1, S2, S3, S4, or S5
BIOS Beep Codes
1 long beep and 2 short beeps
1 long beep and 3 short beeps
No Memory Available
No Video Available
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Connector/Header Locations and Pin-outs Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
5. Connector/Header Locations and Pin-outs
The following section provides detailed information regarding all connectors and headers on the server board.
5.1 Power Connectors
The server board provides dual 20-pin ATX Main Power connectors. Both connectors have identical pin-outs and are not used concurrently.
Figure 19. 20-pin ATX Main Power Connector Pin-out and Location
The server board provides a 4-pin peripheral power connector. This connector can supply power as needed to add-in peripheral devices such as hard drives or optical drives. This connector has the following pin-out and board location:
+ 12 V
GND
GND
+ 5 V
Figure 20. 4-pin Peripheral Power Connector Pin-out and Location
5.2 Serial ATA Connectors
The server board provides four red Serial ATA (SATA) connectors numbered SATA-1 thru SATA-4. The pin-out and location of each is shown below.
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Figure 21. SATA Connector Location and Pin-out
5.3 Front Panel Headers
The server board provides two front panel headers, each supporting different platform control Button and LED options. Pin-out definitions for each are described below.
Figure 22. Front Panel Header Location and Pin-out
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System Power LED (3-pin PLED)
This 3-pin connector is used to support a front panel system power LED. The LED is illuminated solid when power is turned on, and will blink when the system enters a sleep mode.
Message LED (2-pin MLED)
This 2-pin connector is used to support a front panel message LED. The message LED is controlled by system monitoring hardware and will indicate an abnormal system event has occurred.
System Warning Speaker (4-pin SPEAKER)
This 4-pin connector can be used for an optional front panel mounted speaker. The speaker is used for BIOS generated beep codes which identify that a specific system event has occurred.
Hard Disk Drive Activity LED (2-pin HDDLED)
This 2-pin connector is used to support a front panel HDD activity LED. The HDD LED is illuminated each time data is written to or read from one of the attached on-board SATA hard disks.
Power Button/Sleep Button (2-pin PWRSW)
This connector is used to support a front panel power on/off button or can be used to place the system into am ACPI sleep mode. Pressing the power button while the system is in a powered down state will turn the system on. With an operating system running, and depending on how it is setup, pressing the power button may put the system into an ACPI sleep state. Pressing and holding the power button in for four seconds while a system is powered on, will power the system off.
Reset Button (2-pin RESET)
This 2-pin connector is used to support a front panel reset button. Pressing this button while the system is running will cause the system to cold reboot.
Figure 23. AUX Front Panel Header Location and Pinout
1. Front Panel SMB (1x6 pin FPSMB)
These pins can be used to support a front panel SMB connection.
2. LAN Activity LED (2-pin LAN1_LED, LAN2_LED)
These pins can be used to support front panel LAN activity LEDs for onboard LAN ports 1 and 2
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3. Chassis Intrusion Switch (1x4 pin CHASSIS)
These pins can be used to support an optional chassis intrusion switch. When a chassis cover is removed, the sensor triggers a high level signal to these pins to record a chassis intrusion event. The default setting is to short by jumper the CASEOPEN and GND pins, which in effect disables this function.
4. System ID LED (2-pin LOCATORLED1 and 2-pin LOCATORLED2)
These pins can be used to support Chassis ID LEDs. The LEDs will illuminate when the System ID Button is pushed.
5. System ID Button (2-pin LOCATORBTN)
These pins can be used to support a front panel System ID Button. Pushing this button will change the state of the System ID LED(s): Off -> On, On -> Off.
5.4 System Management Headers
5.4.1 SGPIO Header
The server board provides a Serial General Purpose Input/Output (SGPIO) connector which can be used to drive SATA LEDs when utilizing the embedded LSI* MegaRAID or Intel options.
®
Matrix RAID
Figure 24. SGPIO Header Location and Pin-out
5.4.2
Power Supply SMBus Connectors
The server board provides a 2x3 pin Server Management Bus (SMBus) connector next to each of the two main power connectors. These connectors can be used to collect power supply data via server management software using a SMBus interface. The location and pin-out for these
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Connector/Header Locations and Pin-outs Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
connectors is shown below.
Figure 25. Power Supply SMBus Connector Location and Pin-out
5.5 I/O Connectors
5.5.1 VGA Connector
The following table details the pin-out definition of the external VGA connector.
Table 15. VGA Connector Pin-out
Pin Signal Name Description
1 V_IO_R_CONN Red (analog color signal R) 2 V_IO_G_CONN Green (analog color signal G) 3 V_IO_B_CONN Blue (analog color signal B) 4 TP_VID_CONN_B4 No connection 5 GND Ground 6 GND Ground 7 GND Ground 8 GND Ground 9 TP_VID_CONN_B9 No connection 10 GND Ground 11 TP_VID_CONN_B11 No connection 12 V_IO_DDCDAT DDCDAT 13 V_IO_HSYNC_CONN HSYNC (horizontal sync) 14 V_IO_VSYNC_CONN VSYNC (vertical sync) 15 V_IO_DDCCLK DDCCLK
5.5.2 NIC Ports
The server board provides two stacked RJ-45 NIC ports on the back edge of the board. The pin­out for NIC connectors are identical and are defined in the following table.
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Table 16. RJ-45 10/100/1000 NIC Connector Pin-out
Pin Signal Name
1 GND 2 P1V8_NIC 3 NIC_A_MDI3P 4 NIC_A_MDI3N 5 NIC_A_MDI2P 6 NIC_A_MDI2N 7 NIC_A_MDI1P 8 NIC_A_MDI1N 9 NIC_A_MDI0P 10 NIC_A_MDI0N 11 (D1) NIC_LINKA_1000_N (LED 12 (D2) NIC_LINKA_100_N (LED) 13 (D3) NIC_ACT_LED_N 14 NIC_LINK_LED_N 15 GND 16 GND
5.5.3 Serial Port Connector
The server board provides one external DB9 Serial port with the following pin-out.
Table 17. Serial Port Pin-out
Pin Assignment Description
1 DCD Data Carrier Detect 2 RXD Receive Data 3 TXD Transmit Data 4 DTR Data Terminal Ready 5 GND Signal Ground 6 DSR Data Set Ready 7 RTS Request to Send 8 CTS Clear to Send 9 RI Ring Indicator
5.5.4 USB Connectors
The following table details the pin-out of the external USB connectors found on the back edge of the server board and system front panel.
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Table 18. External USB Connector Pin-out
Pin Signal Name Description
1 USB_OC USB_PWR 2 USB_PN DATAL0 (Differential data line paired with DATAH0) 3 USB_PP DATAH0 (Differential data line paired with DATAL0) 4 GND Ground
5.6 Fan Headers
The server board provides four 4-pin system fan connectors, capable of supporting fans that meet the following specifications: 350mA-740mA (8.88W max) or a total of 3.15 A – 6.66 A (53.28W max) at +12V.
Table 19. 4-pin System Fan Connector Pin-out
Pin Signal Name Type Description
1 Ground GND Ground is the power supply ground 2 12 V Power Power supply 12 V 3 Fan Tach In FAN_TACH signal is connected to the Integrated BMC to monitor the fan
speed
4 Fan PWM Out FAN_PWM signal to control fan speed
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Configuration Jumpers
6. Configuration Jumpers
The server board has several jumper blocks that can be used to configure, protect, or recover specific features of the server board.
6.1 Clear RTC RAM (CLRTC1) Jumper
This jumper allows you to clear the Real Time Clock (RTC) RAM in CMOS. Using this jumper, you can clear the CMOS memory of date, time and system setup parameters.
Figure 26. Clear RTC Jumper Block
The following procedure should be used to clear the RTC RAM:
1. Power OFF the system and unplug it from the AC source
2. Move the jumper from pins 1-2 (default) to pins 2-3. Wait 5-10 seconds.
3. Move the jumper back to pins 1-2
4. Re-apply AC power to the system and power on
5. During POST, enter the BIOS Setup Utility and reset desired options.
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Configuration Jumpers Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
6.2 VGA Controller Enable/Disable Jumper
This jumper block allows you to enable or disable the on-board video controller. Set to pins 1-2 ((default) to enable video, set to pin 2-3 to disable video.
Figure 27. Video Enable/Disable Jumper
6.3 NIC 1 & NIC 2 Enable/Disable Jumper
These jumpers allow you to Enable or Disable the onboard LAN controllers. Set jumper to pins 1-2 (Default) to enable LAN controller, set jumper to pins 2-3 to disable LAN controller.
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Figure 28. NIC1 & NIC2 Enable/Disable Jumper
6.4 Embedded RAID Option Select Jumper
The server board has the option to select either of two embedded SATA RAID options: LSI* SATA Software RAID or Intel configured on pins 1-2 to support the LSI option. Moving the jumper to pins 2-3 changes the RAID option to Intel
®
Matrix Storage Manager. Neither RAID option is enabled until the SATA
Option in BIOS Setup is set to RAID.
®
Matrix Storage Manager. By default the jumper block is
Figure 29. Embedded RAID Option Select Jumper
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Configuration Jumpers Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
6.5 DDR3 voltage control jumpers (**Future Support Only)
The server board provides a DDR3 voltage control jumper block for each CPU bank of memory. These jumper blocks change the voltage level supplied to the DIMM bank, and should only be changed when low voltage DDR3 DIMMs are installed.
Caution
– Moving these jumpers from their Default position may cause irreparable damage.The use of LV (low voltage) DDR3 DIMMs on this server board is intended for future use only, and will only be supported after Intel has validated their functionality. This document will be updated with proper usage information once validation is complete and tested LV DDR3 DIMMs are added to the Tested Memory List for this server board.
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6.6 BIOS Recovery Jumper
In the unlikely event that the BIOS update process fails or the BIOS becomes corrupted and no longer allows the system to POST, the server board provides a BIOS recovery jumper, which forces the system to boot to a DOS image on a removable media. The following procedure should be followed only in the event the standard BIOS update process fails, the system can no longer boot, and all other recovery methods have been exhausted.
Figure 30. BIOS Recovery Jumper
The following files must be located in the root directory of the recovery media:
1. xxxxxx.ROM
2. AFUDOS.EXE
Use the following steps to perform the BIOS recovery:
1. Power OFF the system and remove AC power.
2. Insert the recovery media.
3. Move the BIOS Recovery Jumper to pins 2-3.
4. Reapply AC power and power on the system.
5. The BIOS update will automatically begin once the appropriate files are detected
6. Once the BIOS Update has successfully completed, power down the system and remove AC power.
7. Move the BIOS Recovery Jumper back to its default location on pins 1-2.
8. Power on the server and enter the BIOS Setup Utility when prompted to reconfigure desired options.
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Intel® Light Guided Diagnostics Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
7. Intel
®
Light-Guided Diagnostics
7.1 Standby Voltage LED
Several server management features of this server board require that a standby voltage be supplied from the power supply when the rest of the system is powered off. To indicate the presence of standby power, the server board provides an LED which illuminates as soon as AC is applied. The LED location is shown in the following illustration.
Figure 31. Stand-by Voltage LED
7.2 CPU Fault LED
The server board provides a CPU Fault LED for each of the processor slots. The LED location is indicated in the following illustration.
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Figure 32. CPU Fault LED
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Intel® Light Guided Diagnostics
7.3 System Identification LED
The server board includes a System ID LED. This LED illuminates when the System ID button on the front panel is pushed. This LED is used to identify the system when servicing is required in a racked environment.
Figure 33. System ID LED
Note: The blue system ID LED will turn on when plug power cord until the BMC reset complete.
7.4 BMC LED
The server board includes a BMC LED. With the BMC Management Module installed, this LEDs blinks once per second to indicate the BMC is operating.
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Figure 34. BMC LED
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Server System Overview Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
8. Intel
The Intel® Server System SR1670HV is an integrated 1U rack mount platform utilizing the features and functions of two Intel
®
Server System SR1670HV Overview
®
Server Boards S5500HV.
Figure 35. Intel® Server System SR1670HV
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The Intel® Server System SR1670HV supports the following feature set:
Table 20. Intel® Server System SR1670HV Feature Set
Feature Description
Chassis Form Factor Server Board Processors
Memory
Chipset
On-board I/O
1U Rack Mount Server
®
2 x Intel Support for up to four Intel
per server node) 24 x DIMM slots (12 DIMM per server node) Support for 800/1066/1333 MT/s ECC registered (RDIMM) or unbuffered
(UDIMM) DDR3 memory. Intel Intel Per Node:
Server Boards S5500HV
®
Xeon® Processors 5500 Series and 5600 Series (two
®
5500 Chipset IOH
®
82801Jx I/O Controller Hub (ICH10R)
1 x External Serial Port 2 x RJ-45 NIC ports (stacked) 1 x RJ-45 Management NIC port 3 x USB 2.0 ports (Front x 1, Rear x 2) 1 x VGA port 1 x Internal A-type USB Port
System Fan Support
Add-in Adapter Support
Video On-board ASPEED* AST2050 with integrated Video Controller
Storage
Power Supply Networking
Server Management On-board ASPEED AST2050 with integrated Baseboard Management
System Dimensions
8 x 4-pin managed system fan. (Four fans per server node)
2 x PCI Express* X16 GEN2 slots supporting low-profile half height add-in cards (one per server node)
Integrated 2D Video Controller 8 MB Video Memory
8 x 2.5-inch hot-swap SATA Hard Drive Bays (Four drive bays per server node) Embedded support for the following RAID solutions:
Intel
LSI* SATA Software RAID w/ RAID levels 0/1/10 (Windows and Linux)
Dual 770 Watt cold swap Power Supply modules. (non-redundent) 4 x 10/100/1000 ports provided by Intel
Acceleration Technology (Two LAN ports per server node)
BMC Management Module with IPMI 2.0 support (Included) 2 x 10/100 Management LAN port (One per server node)
686 mm x 444 mm x 43.4 mm
®
Matrix Storage Manager supporting RAID levels 0/1/5/10 (Windows*
Only)
®
82574L PHYs with Intel® I/O
Controller
8.1 Front Panel Features
The server system provides the following features on the system’s front panel:
8 x 2.5-inch hot-swap SATA/ SAS hard drive bays – four for each server node
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Dual independent front control panels – one for each server node
System ID LED
System ID Button
Figure 36. Intel
®
Server System SR1670HV - Front Panel Overview
8.2 Rear Panel Features
The server system provides the following features on the system’s back panel:
Dual cold swap 770-Watt Power Supply modules. (non-redundant) Add-in card slot covers for each installed server node. External I/O ports for each installed server node.
Figure 37. Intel® Server System SR1670HV - Back Panel Overview
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8.3 System LED Overview
8.3.1 Front Control Panel LEDs
The system provides two independent front control panels, one for each server node. Each control panel supports the following LEDs:
LED Display Status Description
Power LED ON System power ON HDD Activity LED OFF
Blinking
Message LED OFF
Blinking
System ID LED OFF
ON
LAN LEDs OFF
Blinking ON
No activity Read/write data into the HDD
- System is normal; no incoming event
- Indicates a HW monitor event
- Normal status
- System ID Button is pressed (Press the System ID Button again to turn off) BMC reset in progress when re-plug Power cord
- No LAN connection
- LAN is transmitting or receiving data
- LAN connection is present
Figure 38. Intel® Server System SR1670HV - Front Control Panel LEDs
8.3.2 LAN Port LEDs
ACT/LINK LED SPEED LED
Status Description Status Description
OFF No link OFF 10 Mbps connection GREEN Linked ORANGE 100 Mbps connection BLINKING Data activity GREEN 1 Gbps connection
Figure 39. LAN Port LED Identification
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8.3.3 Hard Drive Status LEDs
LED Status Description
Power
Active
Green Light ON Red Light ON G/R Blinking OFF
Green Blink Data read/write to HDD
Figure 40. Hard Drive LED Identification
Power On (detection HDD present) RAID HDD fail (HDD plug-in ready but detection error) RAID rebuilding HDD not found
8.4 System Storage
The system can support up to eight 2.5-inch hot-swap SATA/SAS hard drives, four per server node. Each installed hard drive is tray mounted. Mounting the hard drive into the tray requires the use of four screws.
Figure 41. Hard Drive Assembly
The hard drive assembly, slides into a drive bay where the hard drive I/O and power connectors are blind-mated with matching connectors on a backplane.
Hard disk I/O cables from each server node are routed to connectors on the backplane. The cables can be attached to the SATA ports of each server node (default) or can be attached to add-in RAID cards. For backplane FRU replacement, the entire hard drive bay is modular and can be removed from the chassis by removing 6 screws and sliding the entire bay assembly forward, then up and out of the chassis. See the Intel for more FRU replacement information.
®
Server System SR1670HV Service Guide
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Figure 42 Har driver Bay Assembly
8.5 System Cooling
The system provides a bank of four dual rotor system fans for each server node. Each bank of four system fans is independent of each other and controlled by the server node to which they are attached. In addition, the system also includes a fan in each power supply module.
System Fans
Server Node 1
Figure 43. System Fan Assembly
System Fans
Server Node 2
The system provides no redundant fan support. To prevent the system from over heating, a failed fan should be replaced as soon as possible.
Figure 44. System Fan Removal
Each bank of fans is monitored and controlled by the server node to which they are attached. Fan control is determined by selecting either of two fan control options in BIOS Setup: Full Speed mode or High Density mode.
In Full Speed Mode, system fans will only operate at the highest fan speed, allowing for maximum air flow.
In High Density Mode, fan speed is controlled, allowing for a quieter system. At nominal CPU temperatures, the fan speeds will operate at 50% of maximum. As CPU temperatures rise, the
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fan speeds will gradually increase to a maximum 100%. As CPU temperatures fall, fan speeds will automatically readjust to a lower speed.
8.6 System Power
The system includes two 770-Watt power supply modules and a power distribution board. Each power supply module provides power to a single server node. The power supply modules provide no power redundancy.
Power
Module 1
Main Power
cable
Harness for
Node 1
Power
Module 2
Air Duct
(Shortened for
Photographic purposes
only)
Main Power
cable
Harness for
Node 2
Figure 45. Intel® Server System SR1670HV - Power Sub-system
Each power supply module can be cold swapped. The modules slide into the back of the system where an edge connector is blind-mated with a matching slot on the power distribution board.
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Figure 46. Power Module Removal
8.6.1 Power Supply Module Specification
Table 21. Power Supply Module Specification
Module Outputs 770 Watt: 62.5 Amps, 5VSB: 4 Amps Module Efficiency ~85% efficiency @ 20%, 230VAC
~89% efficiency @ 50%, 230VAC ~85% efficiency @ 100% load, 230VAC
AC Input 90VAC to 264VAC
Power Factor Corrected (EN61000-3-2) IEC 320 inlet connector on module
Hold up time 12msec @100% load (770W)
20msec @ 60% load
SMBUS (PSMI) Module AC input voltage (Vrms), AC input current (Arms), Output
Power (12V), Output Current (12V), Fan speed control and Temp Sensors, Critical and warning events, FRU data
Protection Over Current, Over Temperature, Over Voltage
Output Voltage OVP MIN (V) OVP MAX (V)
+12V 13.3 14.5
+5VSB 5.7 6.5
8.6.1.1 Over Temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition the PS module will shutdown. When the power supply temperature drops to within specified limits, the power supply shall restore power automatically, while the 5VSB remains always on. The OTP trop level shall have a minimum of 4 C of ambient temperature hysteresis, so the power supply will not oscillate on
57 Intel Confidential Revision 1.2 Intel order number E69391-006
Table 22. Over Current Protection Limits
Output Voltage OCP Limits
+12V 69A min; 83A max
+5VSB 5.0A min; 6.0A max
Table 23. Over Voltage Protection Limits
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and off due to a temperature recovery condition. The power supply shall alert the system of the OTP condition via the power supply FAIL signal and the PWR LED.
8.6.2
AC Power Cord Specification Requirements
Table 24. AC Cord Specification
Cable Type SJT Wire Size 16 AWG Temperature Rating 105ºC Amperage Rating 13 A
Voltage Rating 125 V
Figure 47. AC Cord Specification
8.7 Add-in Card Support
Each server node can support a single low profile, half-height, PCI-Express* Gen2, X16 add-in card. Add-in cards are installed into a riser assembly as shown in the following photographs.
Figure 48. Intel® Server System SR1670HV - Add-in card support
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9. Environmental Specifications
9.1 Intel
®
Server Board S5500HV Environmental Specifications
The operation of the server board at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability.
Table 25. Server Board Environmental Limits Summary
Operating Temperature 0º C to 55º C 1 (32º F to 131º F) Non-Operating Temperature -40º C to 70º C (-40º F to 158º F) DC Voltage ± 5% of all nominal voltages Shock (Unpackaged) Trapezoidal, 50 G, 170 inches/sec Shock (Packaged) <20 pounds 20 to <40 pounds 40 to <80 pounds 80 to <100 pounds 100 to <120 pounds 120 pounds Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
1
Chassis design must provide proper airflow to avoid exceeding the Intel® Xeon® processor maximum case
temperature.
36 inches 30 inches 24 inches 18 inches 12 inches 9 inches
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.
9.2 Processor Power Support (Server Board Only)
Electrically, the server board supports the Thermal Design Power (TDP) guideline for Intel®
®
Xeon Icc, TDP power and T
processor 5500 series and 5600 series. The following table provides maximum values for
for the Intel® Xeon® processor 5500 series and 5600 series.
CASE
Table 26. Intel® Xeon® Processor TDP Guidelines
TDP Power Maximum T
130 W 67.0º C 150 A
Icc Maximum
CASE
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Note: Intel® Server Systems processor support is limited to 95W TDP power.
9.3 Intel
®
Server System SR1670HV Environmental Specifications
The operation of the server system at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability
Table 27. Server System Environmental Limits Summary
Parameter Limits
Operating Temperature +10°C to +35°C with the maximum rate of change not to exceed 10°C per hour Non-Operating Temperature Non-Operating Humidity 90%, non-condensing at 35°C Acoustic noise Idle = 67.3 dBA
Shock, operating Half sine, 2 g peak, 11 milliseconds Shock, unpackaged
Shock, packaged Vibration, unpackaged 5 Hz to 500 Hz, 2.20 g RMS random
Shock, operating Half sine, 2 g peak, 11 milliseconds ESD +/-15 KV except I/O port +/- 8 KV per Intel® Environmental test specification System Cooling Requirement in BTU/Hr Operating Temperature +10°C to +35°C with the maximum rate of change not to exceed 10°C per hour
-40°C to +70°C
Active = 73.5 dBA
Trapezoidal, 25 g, velocity change 136 inches/second (40 lbs to < 80 lbs) Non-palletized free fall in height 24 inches (40 lbs to < 80 lbs)
2550 BTU/hour
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.
9.4 Processor Power Support (Integrated System)
Thermally, the Intel Server System SR1670HV can support a maximum Thermal Design Power (TDP) rating of 95 Watts for Intel
®
Xeon® processor 5500 series and 5600 series.
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A
A
10. Regulatory and Certification
10.1 Intel
®
Server Board S5500HV Regulatory and Certification
Intended Application – This product was evaluated as Information Technology Equipment (ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.
The following table references Server Baseboard Compliance and markings that may appear on the product. Markings below are typical markings however, may vary or be different based on how certification is obtained. Some markings may appear in product literature due to limited space on board for marking.
Note: Certifications Emissions requirements are to Class A.
Table 28. Server Board Product Safety & Electromagnetic (EMC) Compliance
Compliance Regional
Description
ustralia/New Zealand
S/NZS 3548 (Emissions)
Compliance
Reference
Compliance Reference Marking Example
N232
Canada/USA
CENELEC Europe Low Voltage Directive
International CB Certification – IEC60950
CSA 60950 – UL 60950 (Safety) CONFORMS TO ANSI/UL STD. 60950-1 CERTIFIED TO CAN/CSA STD. C22.2 No. 60950-1
Industry Canada ICES-003 (Emissions)
FCC CFR 47, Part 15 (Emissions)
EMC Directive EN55022 (Emissions) EN55024 (Immunity) CE Declaration of Conformity
CISPR 22/CISPR 24
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
This device complies with Part 15 of the
FCC Rules. Operation of this device is
subject to the following two conditions:
(1) This device may not cause harmful
interference, and (2) This device must
accept interference receive, including
interference that may cause undesired operation.
None Required
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Compliance Regional
Description
Japan VCCI Certification
Korea KCC Certification
Taiwan BSMI CNS13438
Compliance
Reference
10.1.1 Electromagnetic Compatibility Notices
Compliance Reference Marking Example
인증번호: CPU-Model Name (A)
D33025
10.1.1.1 USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact: Intel Corporation
5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
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Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void the user’s authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC Class B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.
10.1.2
FCC Verification Statement
Product Type: S5500HV This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact: Intel Corporation
5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
10.1.3
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
(English translation of the notice above) This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of Communications.
10.1.4
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.
10.1.5
Japan EMC Compatibility
Electromagnetic Compatibility Notices (International)
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English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council For
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
10.1.6
BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety label which is located on the bottom side (pedestal orientation) or side (rack mount configuration).
10.1.7
RRL (Korea)
Following is the RRL certification information for Korea.
English translation of the notice above:
1. Type of Equipment (Model Name): On License and Product
2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative
3. Name of Certification Recipient: Intel Corporation
4. Date of Manufacturer: Refer to date code on product
5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
10.2 Intel
®
Server System SR1670HV Regulatory and Certification
10.2.1 Product Regulatory Compliance
The server system product, when correctly integrated, complies with the following safety and electromagnetic compatibility (EMC) regulations.
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Intended Application – This product was evaluated as Information Technology Equipment
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.
Notifications to Users on Product Regulatory Compliance and Maintaining Compliance –
To ensure regulatory compliance, you must adhere to the assembly instructions documented in the product Service Guide to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in the product Service Guide. Use of other products/components will void the UL or other NRTL listings and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold.
To help ensure EMC compliance with your local regional rules and regulations, before computer integration, make sure that the chassis, power supply, and other modules have passed EMC testing using a server board with a microprocessor from the same family (or higher) and operating at the same (or higher) speed as the microprocessor used on this server board. The final configuration of your end system product may require additional EMC compliance testing. For more information please contact your local Intel Representative. This is an FCC Class A device and its use is intended for a commercial type market place.
10.2.2
Use of Specified Regulated Components
To maintain the UL and/or other NRTL listings and compliance to other regulatory certifications and/or declarations, the following regulated components must be used and conditions adhered to. Interchanging or use of other component will void the UL listing and other product certifications and approvals.
Updated product information for configurations can be found on the Intel Server Builder Web site at the following URL:
http://channel.intel.com/go/serverbuilder
If you do not have access to Intel’s Web address, please contact your local Intel representative.
Server chassis (base chassis is provided with power supply and fans) – UL listed.  Server board – you must use an Intel server board – UL or other NRTL recognized.  Add-in boards – must have a printed wiring board flammability rating of minimum
UL94V-1. Add-in boards containing external power connectors and/or lithium batteries must be UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed. In addition, the modem must have the appropriate telecommunications, safety, and EMC approvals for the region in which it is sold.
Peripheral Storage Devices – must be UL recognized or UL listed accessory and
TUV or VDE licensed. Maximum power rating of any one device or combination of devices can not exceed manufacturer’s specifications. Total server configuration is not to exceed the maximum loading conditions of the power supply.
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A
A
The following table references Server System Compliance and markings that may appear on the product. Markings below are typical markings however, may vary or be different based on how certification is obtained.
Note: Certifications Emissions requirements are to Class A.
Table 29. Server System Product Safety & Electromagnetic (EMC) Compliance
Compliance Regional
Description
ustralia/New Zealand
Argentina IRAM Certification (Safety)
Canada/USA
S/NZS 3548 (Emissions)
CSA 60950 – UL 60950 (Safety) ­CONFORMS TO ANSI/UL STD. 60950-1 CERTIFIED TO CAN/CSA STD. C22.2 No. 60950-1
Industry Canada ICES-003 (Emissions)
FCC CFR 47, Part 15 (Emissions)
Compliance
Reference
Compliance Reference Marking Example
N232
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
This device complies with Part 15 of the
FCC Rules. Operation of this device is
subject to the following two conditions:
(1) This device may not cause harmful
interference, and (2) This device must
accept interference receive, including
interference that may cause undesired operation.
CENELEC Europe Low Voltage Directive
EMC Directive EN55022 (Emissions) EN55024 (Immunity) EN61000-3-2 (Harmonics) EN61000-3-3 (Voltage Flicker) CE Declaration of Conformity
Germany GS Certification – EN60950
International CB Certification – IEC60950
CISPR 22/CISPR 24
Japan VCCI Certification
Revision 1.2 Intel Confidential 66 Intel order number E69391-006
None Required
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Regulatory and Certification
Compliance Regional
Description
Korea KCC Certification
Compliance
Reference
Compliance Reference Marking Example
인증번호: CPU-Model Name (A)
Russia GOST-R Certification
Ukraine Ukraine Certification None Required
Taiwan BSMI CNS13438
R33025
10.2.3 Electromagnetic Compatibility Notices
10.2.3.1 USA
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact: Intel Corporation
5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the receiver is
connected.
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Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void the user’s authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC Class B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.
10.2.3.2 FCC Verification Statement
Product Type: SR1670HV This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact: Intel Corporation
5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497
Phone: 1 (800)-INTEL4U or 1 (800) 628-8686
10.2.3.3 ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
(English translation of the notice above) This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of Communications.
10.2.3.4 Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.
10.2.3.5 Japan EMC Compatibility
Electromagnetic Compatibility Notices (International)
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English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council For
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
10.2.3.6 BSMI (Taiwan)
The BSMI Certification number and the following warning is located on the product safety label which is located on the bottom side (pedestal orientation) or side (rack mount configuration).
10.2.3.7 RRL (Korea)
Following is the RRL certification information for Korea.
English translation of the notice above:
1. Type of Equipment (Model Name): On License and Product
2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative
3. Name of Certification Recipient: Intel Corporation
4. Date of Manufacturer: Refer to date code on product
5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
10.3 Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world wide product ecology regulatory requirements. The following is Intel’s product ecology compliance criteria.
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Regulatory and Certification Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
A
A
A
Compliance Regional
Description
California California Code of Regulations, Title 22, Division 4.5;
Chapter 33: Best Management Practices for Perchlorate Materials.
China
Intel Internal Specification
China RoHS
dministrative Measures on the Control of Pollution Caused by Electronic Information Products” (EIP) #39. Referred to as China RoHS. Mark requires to be applied to retail products only. Mark used is the Environmental Friendly Use Period (EFUP). Number represents years.
China Recycling (GB18455-2001) Mark requires to be applied to be retail product only. Marking applied to bulk packaging and single packages. Not applied to internal packaging such as plastics, foams, etc.
ll materials, parts and subassemblies must not contain restricted materials as defined in Intel’s Environmental Product Content Specification of Suppliers and Outsourced Manufacturers – http://supplier.intel.com/ehs/environmental.htm
Compliance Reference
Compliance Reference Marking
Example
Special handling may apply.
See
www.dtsc.ca.gov/hazardousw
aste/perchlorate
This notice is required by
California Code of
Regulations, Title 22, Division
4.5; Chapter 33: Best
Management Practices for
Perchlorate Materials. This
product/part includes a
battery which contains
Perchlorate material.
None Required
Europe
Germany
Intel Internal Specification
Waste Electrical and Electronic Equipment (WEEE)
Directive 2002/96/EC
products only.
European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS) Threshold limits and banned substances are noted below. Quantity limit of 0.1% by mass (1000 PPM) for: Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers (PBB/PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
German Green Dot Applied to Retail Packaging Only for Boxed Boards
ll materials, parts and subassemblies must not contain restricted materials as defined in Intel’s Environmental Product Content Specification of Suppliers and Outsourced Manufacturers – http://supplier.intel.com/ehs/environmental.htm
– Mark applied to system level
-
None Required
None Required
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Regulatory and Certification
j
Compliance Regional
Description
International
Japan
ISO11469 - Plastic parts weighing >25gm are intended to be marked with per ISO11469.
Recycling Markings – Fiberboard (FB) and Cardboard (CB) are marked with international recycling marks. Applied to outer bulk packaging and single package.
Japan Recycling Applied to Retail Packaging Only for Boxed Boards
Compliance Reference
10.4 Other Markings
Compliance Description
Stand-by Power 60950 Safety Requirement
Applied to product is stand-by power switch is used.
Multiple Power Cords (only for product with more than 1 power cord)
60950 Safety Requirement Applied to product if more than one power cord is used.
Compliance Reference
Compliance Reference Marking
Example
>PC/ABS<
Compliance Reference Marking
Example
.
This unit has more than one
power supply cord. To reduce the
disconnect (2) two power supply
English:
risk of electrical shock, cords before servicing.
Ground Connection 60950 Deviation for Nordic Countries
71 Intel Confidential Revision 1.2 Intel order number E69391-006
Simplified Chinese:
注意:
设备包括多条电源系统电缆。
为避免遭受电击,在进行维修之
前应断开两(2)条电源系统电
缆。
Traditional Chinese:
本設備包括多條電源系統電纜。 為避免遭受電擊,在進行維修之
前應斷開兩(2)條電源系統電
Dieses Geräte hat mehr als ein
Stromkabel. Um eine Gefahr des
elektrischen Schlages zu
verringern trennen sie beide (2)
Line1: “WARNING:” Swedish on line2:
“Apparaten skall anslutas till
ordat uttag, när den ansluts till
ett nätverk.”
注意:
纜。
German:
Stromkabeln bevor
Instandhaltung.
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Regulatory and Certification Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Compliance Description
Compliance Reference
Compliance Reference Marking
Example
Finnish on line 3:
“Laite on liitettävä suojamaadoituskoskettimilla varustettuun pistorasiaan.” English on line 4:
“Connect only to a properly earth grounded outlet.”
Country of Origin Logistic Requirements
Applied to products to indicate where product was made.
Made in XXXX
10.5 Component Regulatory Requirements to Support System and/or
Baseboard Level Certifications
Various components and materials require component level certifications to support server system and/or server baseboard level certifications. Certification of components shall be at the most current certifications standard.
Power Supplies
Minimum Certifications: UL, cUL Recognition (Canada/USA) CE DOC (Europe) CB Certificate & Report (International)
Note: CB to include all CB national deviations) Certification marks to be visible on power supply. Power supply is to comply with the Intel power supply specification.
Peripheral Devices (e.g. Disk Drives, CD ROMs)
Minimum Certifications: UL, cUL Recognition (Canada/USA), CE DOC (Europe), One European Approval (e.g. TUV or VDE; or SEMKO, NEMKO or DEMKO). Certification marks to be visible on peripheral
Fans
Minimum Certifications: UL and TUV or VDE. Certification marks to be visible on fan Current Limiting Devices (Used for Safety Purposes)
Such Devices may be fuse, PTC or other). Minimum Certifications: UL and TUV or VDE
Lithium Batteries
Require being UL recognized; and battery circuits are to have suitable reverse bias current protection for the application it is used in. Certification marks to be visible on battery
Printed Wiring Boards
Requires being UL Recognized board from a UL approved bare board fabricator/manufacturer. Ratings require being minimum V-0 and 130C. Fabricators name and/or trade mark; UL symbol
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Regulatory and Certification
Connectors
Requires being UL Recognized. Rated minimum V-0 and temperature wise suitably rated for its application.
Cables/Wiring Harnesses
(e.g. Ribbon cables)
Requires being UL Recognized and temperature wise suitably rated for its application. Certification marks to be visible on harness.
Plastics
Requires being UL Recognized and suitable flammability requirement for its application. For example: Fire Enclosure >18Kg requires min 5V Fire Enclosure <18Kg requires min V-1 All plastic parts require to be marked with Plastic Fabricators name and/or UL Fabricator ID Material Name (e.g. GE, C2800), Date Code
Labels Use for Product Safety
Require being purchased from UL approved label vendor, and suitable for the surface it is being applied to. Alternatively, labels may be printed from a UL approved label printing system and suitable for the surface it is being applied to.
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Product Safety Information Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
11. Product Safety Information
This document applies to Intel® Server Boards, Intel® Server Chassis (pedestal and rack-mount) and installed peripherals. To reduce the risk of bodily injury, electrical shock, fire, and equipment damage, read this document and observe all warnings and precautions in this guide before installing or maintaining your Intel
In the event of a conflict between the information in this document and information provided with the product or on the website for a particular product, the product documentation takes precedence.
Your server should be integrated and serviced only by technically qualified persons. You must adhere to the guidelines in this guide and the assembly instructions in your server manuals to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this guide. Use of other products/components will void the UL Listing and other regulatory approvals of the product, and may result in noncompliance with product regulations in the region(s) in which the product is sold.
®
server product.
11.1 Safety Warnings & Cautions
To avoid personal injury or property damage, before you begin installing the product, read, observe, and adhere to all of the following safety instructions and information. The following safety symbols may be used throughout the documentation and may be marked on the product and/or the product packaging.
CAUTION
WARNING
Indicates the presence of a hazard that may cause minor personal injury or property damage if the CAUTION is ignored.
Indicates the presence of a hazard that may result in serious personal injury if the WARNING is ignored.
Indicates potential hazard if indicated information is ignored. Indicates shock hazards that result in serious injury or death if
safety instructions are not followed. Indicates hot components or surfaces.
Indicates do not touch fan blades, may result in injury. Indicates to unplug all AC power cord(s) to disconnect AC power
11.2 Site Selection
The system is designed to operate in a typical office environment. Choose a site that is:
Clean, dry, and free of airborne particles (other than normal room dust). Well-ventilated and away from sources of heat including direct sunlight and radiators. Away from sources of vibration or physical shock. Isolated from strong electromagnetic fields produced by electrical devices.
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In regions that are susceptible to electrical storms, we recommend you plug your
system into a surge suppresser and disconnect telecommunication lines to your modem during an electrical storm.
Provided with a properly grounded wall outlet. Provided with sufficient space to access the power supply cord(s), because they serve
as the product's main power disconnect.
11.3 Equipment Handling Practices
Reduce the risk of personal injury or equipment damage:
Conform to local occupational health and safety requirements when moving and lifting
equipment.
Use mechanical assistance or other suitable assistance when moving and lifting
equipment.
To reduce the weight for easier handling, remove any easily detachable components.
11.4 Power and Electrical Warnings
CAUTION
The power button, indicated by the stand-by power marking, DOES NOT completely turn off the system AC power, 5V standby power is active whenever the system is plugged in. To remove power from system, you must unplug the AC power cord from the wall outlet. Your system may use more than one AC power cord. Make sure all AC power cords are unplugged. Make sure the AC power cord(s) is/are unplugged before you open the chassis, or add or remove any non hot-plug components. Do not attempt to modify or use an AC power cord if it is not the exact type required. A separate AC cord is required for each system power supply. The power supply in this product contains no user-serviceable parts. Do not open the power supply. Hazardous voltage, current and energy levels are present inside the power supply. Return to manufacturer for servicing. When replacing a hot-plug power supply, unplug the power cord to the power supply being replaced before removing it from the server. To avoid risk of electric shock, turn off the server and disconnect the power cord, telecommunications systems, networks, and modems attached to the server before opening it.
11.4.1
The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong. Contact your customer service representative or dealer for a list of approved devices.
Replacing the Back up Battery
WARNING
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer’s instructions.
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Product Safety Information Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
ADVARSEL!
Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.
11.4.2
If an AC power cord was not provided with your product, purchase one that is approved for use in your country.
CAUTION
To avoid electrical shock or fire, check the power cord(s) that will be used with the product as follows:
Power Cord Warnings
Do not attempt to modify or use the AC power cord(s) if they are not the exact
type required to fit into the grounded electrical outlets
The power cord(s) must meet the following criteria:
The power cord must have an electrical rating that is greater than that of the
electrical current rating marked on the product.
The power cord must have safety ground pin or contact that is suitable for the
electrical outlet.
The power supply cord(s) is/are the main disconnect device to AC power. The
socket outlet(s) must be near the equipment and readily accessible for disconnection.
The power supply cord(s) must be plugged into socket-outlet(s) that is /are
provided with a suitable earth ground.
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11.5 System Access Warnings
CAUTION
To avoid personal injury or property damage, the following safety instructions apply whenever accessing the inside of the product:
Turn off all peripheral devices connected to this product. Turn off the system by pressing the power button to off. Disconnect the AC power by unplugging all AC power cords from the system or
wall outlet.
Disconnect all cables and telecommunication lines that are connected to the
system.
Retain all screws or other fasteners when removing access cover(s). Upon
completion of accessing inside the product, refasten access cover with original screws or fasteners.
Do not access the inside of the power supply. There are no serviceable parts in
the power supply. Return to manufacturer for servicing.
Power down the server and disconnect all power cords before adding or
replacing any non hot-plug component.
When replacing a hot-plug power supply, unplug the power cord to the power
supply being replaced before removing the power supply from the server.
CAUTION
If the server has been running, any installed processor(s) and heat sink(s) may be hot. Unless you are adding or removing a hot-plug component, allow the system to cool before opening the covers. To avoid the possibility of coming into contact with hot component(s) during a hot-plug installation, be careful when removing or installing the hot-plug component(s).
CAUTION
To avoid injury do not contact moving fan blades. If your system is supplied with a guard over the fan, do not operate the system without the fan guard in place.
11.6 Rack Mount Warnings
The equipment rack must be anchored to an unmovable support to prevent it from tipping when a server or piece of equipment is extended from it. The equipment rack must be installed according to the rack manufacturer's instructions. Install equipment in the rack from the bottom up, with the heaviest equipment at the bottom of the rack. Extend only one piece of equipment from the rack at a time. You are responsible for installing a main power disconnect for the entire rack unit. This main disconnect must be readily accessible, and it must be labeled as controlling power to the entire unit, not just to the server(s). To avoid risk of potential electric shock, a proper safety ground must be implemented for the rack and each piece of equipment installed in it.
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11.7 Cooling and Airflow
CAUTION
Carefully route cables as directed to minimize airflow blockage and cooling problems. For proper cooling and airflow, operate the system only with the chassis covers installed. Operating the system without the covers in place can damage system parts. To install the covers:
1. Check first to make sure you have not left loose tools or parts inside the system.
2. Check that cables, add-in boards, and other components are properly installed.
3. Attach the covers to the chassis according to the product instructions.
11.8 Laser Peripherals or Devices
CAUTION
To avoid risk of radiation exposure and/or personal injury:
Do not open the enclosure of any laser peripheral or device Laser peripherals or devices have are not user serviceable Return to manufacturer for servicing
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Appendix A: Product Usage Tips
Appendix A: Product Usage Tips
When adding or removing components or peripherals from the server board, AC power
must be removed. With AC power plugged into the server board, 5-Volt standby is still present even though the server board is powered off.
Each time AC power is applied to the server, the Blue System ID LED will turn on, the
power button will be disabled, and a delay of 30-45 seconds will occur before the system is able to power on. This delay is needed to reset the BMC controller on the BMC Management Module. Once the BMC reset has completed, the System ID LED will turn off, and the power button will be re-enabled allowing for the system to be powered on.
Only the Intel® Xeon® Processor 5500 Series and 5600 Series with 130 Watt and less Thermal Design Power (TDP) are supported on the Intel Previous generations of the Intel
Only the Intel
®
Xeon® Processor 5500 Series and 5600 Series with 95 Watt and less Thermal Design Power (TDP) are supported in the Intel Previous generations of the Intel
Only registered DDR3 DIMMs (RDIMMs) and unbuffered DDR3 DIMMs (UDIMMs) are
®
Xeon® processors are not supported.
®
Xeon® processors are not supported.
®
Server Board S5500HV.
®
Server System SR1670HV.
supported on this server board. Mixing of RDIMMs and UDIMMs is not supported.
For the best performance, the number of DDR3 DIMMs installed should be balanced
across both processor sockets and memory channels. For example, a two-DIMM configuration performs better than a one-DIMM configuration. In a two-DIMM configuration, DIMMs should be installed in DIMM sockets A1 and D1. A six-DIMM configuration (DIMM sockets A1, B1, C1, D1, E1, and F1) performs better than a three­DIMM configuration (DIMM sockets A1, B1, and C1).
Due to thermal requirements needed to support Quad Rank x4 DDR3 DIMMs, this
memory type is not supported in the Intel
®
Server System SR1670HV. Support for this
memory type should be verified with other server chassis/system manufacturers planning to support this server board.
Memory is only populated using DIMM slots associated with a given installed processor.
Ie.) With only one processor installed, only the DIMM slots associated with that processor should be populated. Memory installed into DIMM slots for a processor that is not installed are non-functional.
The Management NIC port is only enabled with the BMC Module installed on to the
server board. With no BMC module installed, the Management NIC port, located above the rear external USB ports, will be non-functional.
Reference the Intel
®
Server System SR1670HV Service Guide for RAID setup
information
Reference the Intel
®
Server System SR1670HV Service Guide for BIOS setup
information
Reference the Intel
®
Server System SR1670HV Service Guide for System Update Utility
usage information
Reference the Intel
®
Server System SR1670HV Service Guide for system service and
support information
.
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Glossary Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Glossary
This appendix contains important terms used in this document. For ease of use, numeric entries are listed first (e.g., “82460GX”) followed by alpha entries (e.g., “AGP 4x”). Acronyms are followed by non-acronyms.
Term Definition
ACPI Advanced Configuration and Power Interface AP Application Processor APIC Advanced Programmable Interrupt Control ARP Address Resolution Protocal ASIC Application Specific Integrated Circuit ASMI Advanced Server Management Interface BIOS Basic Input/Output System BIST Built-In Self Test BMC Baseboard Management Controller Bridge Circuitry connecting one computer bus to another, allowing an agent on one to access the other BSP Bootstrap Processor Byte 8-bit quantity CBC Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis. CEK Common Enabling Kit CHAP Challenge Handshake Authentication Protocol CMOS Complementary Metal-oxide-semiconductor
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board. DHCP Dynamic Host Configuration Protocal DPC Direct Platform Control EEPROM Electrically Erasable Programmable Read-Only Memory EHCI Enhanced Host Controller Interface EMP Emergency Management Port EPS External Product Specification ESB2 Enterprise South Bridge 2 FBD Fully Buffered DIMM F MB Flexible Mother Board FRB Fault Resilient Booting FRU Field Replaceable Unit FSB Front Side Bus GB 1024 MB GPA Guest Physical Address GPIO General Purpose I/O GTL Gunning Transceiver Logic HPA Host Physical Address HSC Hot-swap Controller Hz Hertz (1 cycle/second) I2C Inter-Integrated Circuit Bus
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Glossary
Term Definition
IA Intel® Architecture IBF Input Buffer ICH I/O Controller Hub ICMB Intelligent Chassis Management Bus IERR Internal Error IFB I/O and Firmware Bridge ILM Independent Loading Mechanism IMC Integrated Memory Controller INTR Interrupt I/OAT I/O Acceleration Technology IOH I/O Hub IP Internet Protocol IPMB Intelligent Platform Management Bus IPMI Intelligent Platform Management Interface IR Infrared ITP In-Target Probe KB 1024 bytes KCS Keyboard Controller Style KVM Keyboard, Video, Mouse LAN Local Area Network LCD Liquid Crystal Display LDAP Local Directory Authentication Protocol LED Light Emitting Diode LPC Low Pin Count LUN Logical Unit Number MAC Media Access Control MB 1024 KB MCH Memory Controller Hub MD2 Message Digest 2 – Hashing Algorithm MD5 Message Digest 5 – Hashing Algorithm – Higher Security ME Management Engine MMU Memory Management Unit ms Milliseconds MTTR Memory Type Range Register Mux Multiplexor NIC Network Interface Controller NMI Nonmaskable Interrupt OBF Output Buffer OEM Original Equipment Manufacturer Ohm Unit of electrical resistance OVP Over-voltage Protection PECI Platform Environment Control Interface PEF Platform Event Filtering PEP Platform Event Paging
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Glossary Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS
Term Definition
PIA Platform Information Area (This feature configures the firmware for the platform hardware) PLD Programmable Logic Device PMI Platform Management Interrupt POST Power-On Self Test PSMI Power Supply Management Interface PWM Pulse-Width Modulation QPI QuickPath Interconnect RAM Random Access Memory RASUM Reliability, Availability, Serviceability, Usability, and Manageability RISC Reduced Instruction Set Computing RMII Reduced Media-Independent Interface ROM Read Only Memory RTC Real-Time Clock (Component of ICH peripheral chip on the server board) SDR Sensor Data Record SECC Single Edge Connector Cartridge SEEPROM Serial Electrically Erasable Programmable Read-Only Memory SEL System Event Log SIO Server Input/Output SMBUS System Management BUS SMI Server Management Interrupt (SMI is the highest priority non-maskable interrupt) SMM Server Management Mode SMS Server Management Software SNMP Simple Network Management Protocol SPS Server Platform Services SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSE4 Streaming SIMD Extensions 4 TBD To Be Determined TDP Thermal Design Power TIM Thermal Interface Material UART Universal Asynchronous Receiver/Transmitter UDP User Datagram Protocol UHCI Universal Host Controller Interface URS Unified Retention System UTC Universal time coordinare VID Voltage Identification VRD Voltage Regulator Down VT Virtualization Technology Word 16-bit quantity WS-MAN Web Services for Management ZIF Zero Insertion Force
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Intel® Server Board S5500HV/Intel® Server System SR1670HV TPS Reference Documents
Reference Documents
Refer to the following documents for additional product information:
Intel Intel Intel LSI* Embedded MegaRAID Software Users Guide
®
Server System SR1670HV Service Guide
®
Server Board S5500HV/Intel® Server System SR1670HV Configuration Guide
®
Matrix Storage Manager 8.x Users Manual
83 Intel Confidential Revision 1.2
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