Intel SE400BX User Manual
SE440BX Motherboard Product Guide
Order Number: 697967-001
Revision History
Revision Revision History Date
-001 First release of the SE440BX Motherboard Product Guide. February, 1998
If an FCC declaration of conformity marking is present on the board, the following statement applies:
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that
may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee
that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
•
Reorient or relocate the receiving antenna.
•
Increase the separation between the equipment and the receiver.
•
Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.
•
Consult the dealer or an experienced radio/TV technician for help.
Canadian Department of Communications Compliance Statement:
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the
Radio Interference Regulations of the Canadian Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils
numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des
Communications du Canada.
Disclaimer
Intel Corporation (Intel) makes no warranty of any kind with regard to this material, including, but not limited to, the implied
warranties of merchantability and fitness for a particular purpose. Intel assumes no responsibility for any errors that may
appear in this document. Intel makes no commitment to update nor to keep current the information contained in this
document. No part of this document may be copied or reproduced in any form or by any means without prior written
consent of Intel.
An Intel product, when used in accordance with its associated documentation, is "Year 2000 Capable" when, upon
installation, it accurately stores, displays, processes, provides, and/or receives date data from, into, and between the
twentieth and twenty-first centuries, including leap year calculations, provided that all other technology used in combination
with said product properly exchanges date data with it.
†
Third-party brands and trademarks are the property of their respective owners.
††
Wake on LAN is a trademark of IBM Corporation.
Copyright 1998, Intel Corporation.
Contents
1 Motherboard Features
Features Summary............................................................................................................... 7
Components......................................................................................................................... 8
Back Panel I/O Connectors.................................................................................................. 9
Microprocessor....................................................................................................................10
Microprocessor Upgrades ...................................................................................................10
Main Memory ......................................................................................................................10
Second Level Cache Memory .............................................................................................10
PCI Enhanced IDE Interface ...............................................................................................10
Input/Output (I/O) Controller................................................................................................11
Real-Time Clock..................................................................................................................11
Universal Serial Bus (USB) Support....................................................................................11
A.G.P. .................................................................................................................................12
BIOS ...................................................................................................................................12
BIOS Upgrades ..........................................................................................................12
PCI Auto Configuration...............................................................................................12
IDE Auto Configuration...............................................................................................13
ISA Plug and Play Capability......................................................................................13
Security Passwords....................................................................................................13
Expansion Slots...................................................................................................................13
Power Management............................................................................................................14
Advanced Power Management (APM)........................................................................14
Advanced Configuration and Power Interface (ACPI).................................................14
Battery.................................................................................................................................14
Wake on Ring......................................................................................................................15
Wake on LAN Technology (Optional)..................................................................................15
Hardware Monitor (Optional)...............................................................................................15
Audio Subsystem (Optional)................................................................................................15
Crystal Semiconductor CS4236B Audio Codec ..........................................................16
Crystal Semiconductor CS4611 PCI Audio Accelerator..............................................16
Audio Connectors.......................................................................................................16
Speaker (Optional)..............................................................................................................16
2 Installing and Replacing Motherboard Components
Before You Begin................................................................................................................17
How to Install and Remove the Motherboard.......................................................................18
How to Install a Processor...................................................................................................18
Install the Retention Mechanism.................................................................................19
Install the Processor...................................................................................................20
How to Set the Processor Speed ........................................................................................21
®
How to Upgrade to a Boxed Pentium
Remove the Installed Processor.................................................................................23
Remove the Heatsink Support Base...........................................................................25
Upgrade the Processor...............................................................................................27
II Processor.............................................................23
iii
Contents
How to Install Memory.........................................................................................................27
How to Remove Memory.....................................................................................................29
How to Replace the Battery.................................................................................................30
How to Clear the Passwords...............................................................................................32
3 Using the Setup Program
Setup Program Modes ........................................................................................................33
Setup Menus.......................................................................................................................34
Function Keys .....................................................................................................................34
Maintenance Menu..............................................................................................................35
Main Menu ..........................................................................................................................35
Advanced Menu ..................................................................................................................36
Peripheral Configuration Submenu.............................................................................37
IDE Configuration .......................................................................................................38
IDE Configuration Submenus .....................................................................................39
Floppy Options ...........................................................................................................40
DMI Event Logging.....................................................................................................40
Video Configuration Submenu....................................................................................40
Resource Configuration Submenu..............................................................................41
Security Menu.....................................................................................................................41
Power Menu........................................................................................................................42
Boot Menu...........................................................................................................................42
Hard Drive Submenu..................................................................................................43
Removable Devices Submenu....................................................................................44
Exit Menu............................................................................................................................44
4 Upgrading the BIOS
Preparing for the Upgrade...................................................................................................45
Obtaining the BIOS Upgrade File ...............................................................................45
Recording the Current BIOS Settings.........................................................................45
Creating a Bootable Diskette......................................................................................46
Creating the BIOS Upgrade Diskette..........................................................................46
Upgrading the BIOS............................................................................................................46
Recovering the BIOS...........................................................................................................47
Changing the BIOS Language.............................................................................................48
5 Technical Reference
Motherboard Connectors.....................................................................................................49
Front Panel Connectors ......................................................................................................53
Motherboard Resources......................................................................................................54
Memory Map ..............................................................................................................54
DMA Channels ...........................................................................................................54
I/O Map .....................................................................................................................55
PCI Configuration Space Map ....................................................................................56
Interrupts....................................................................................................................56
iv
SE440BX Motherboard Product Guide
A Error Messages
BIOS Beep Codes...............................................................................................................57
BIOS Error Messages .........................................................................................................57
B Regulatory and Integration Information
Regulatory Compliance.......................................................................................................59
Product Certification Markings....................................................................................60
Installation Precautions .......................................................................................................60
Installation Instructions........................................................................................................60
Ensure Electromagnetic Compatibility (EMC).............................................................61
Ensure Host Computer and Accessory Module Certifications.....................................61
Prevent Power Supply Overload.................................................................................62
Place Battery Marking on the Computer.....................................................................62
Use Only for Intended Applications.............................................................................62
Figures
1. Motherboard Components........................................................................................... 8
2. Back Panel I/O Connectors ......................................................................................... 9
3. Mounting Screw Holes................................................................................................18
4. Installing the Processor Retention Mechanism...........................................................19
5. Installing the Processor ..............................................................................................20
6. Installing the Heatsink Support Top Bar......................................................................21
7. Location of the Configuration Jumper Block ...............................................................21
8. Removing the Heatsink Support Top Bar and the Processor......................................24
9. Removing the Heatsink Support Retention Pins.........................................................25
10. Placing the Heatsink Support Base Removal Tool on the Retention Pins...................26
11. Using the Heatsink Support Base Removal Tool........................................................26
12. Location of DIMM Sockets..........................................................................................28
13. Installing a DIMM........................................................................................................29
14. Replacing the Battery.................................................................................................31
15. Motherboard Connectors............................................................................................49
16. Front Panel Connectors..............................................................................................53
Tables
1. Jumper Settings for Setup Program Modes................................................................33
2. Setup Menu Bar .........................................................................................................34
3. Setup Function Keys ..................................................................................................34
4. Maintenance Menu.....................................................................................................35
5. Main Menu..................................................................................................................35
6. Advanced Menu..........................................................................................................36
7. Peripheral Configuration Submenu.............................................................................37
8. IDE Configuration.......................................................................................................38
9. IDE Configuration Submenus .....................................................................................39
10. Floppy Options...........................................................................................................40
11. DMI Event Logging Submenu.....................................................................................40
12. Video Configuration Submenu....................................................................................40
13. Resource Configuration Submenu..............................................................................41
v
Contents
14. Security Menu ............................................................................................................41
15. Power Menu...............................................................................................................42
16. Boot Menu..................................................................................................................42
17. Hard Drive Submenu..................................................................................................43
18. Removable Devices Submenu....................................................................................44
19. Exit Menu ...................................................................................................................44
20. Wake on Ring Connector............................................................................................50
21. Wake on LAN Technology Connector.........................................................................50
22. Fan 3 Connector.........................................................................................................50
23. Auxiliary Line In Connector.........................................................................................50
24. Telephony Connector.................................................................................................50
25. CD Audio Connector...................................................................................................51
26. Chassis Intrusion Connector.......................................................................................51
27. Fan 2 Connector.........................................................................................................51
28. Fan 1 Connector.........................................................................................................51
29. Power Supply Connector............................................................................................52
30. SCSI LED Connector..................................................................................................52
31. PC/PCI Connector......................................................................................................52
32. Front Panel I/O Connectors........................................................................................53
33. Memory Map ..............................................................................................................54
34. DMA Channels ...........................................................................................................54
35. I/O Map ......................................................................................................................55
36. PCI Configuration Space Map....................................................................................56
37. Interrupts....................................................................................................................56
38. Beep Codes................................................................................................................57
39. BIOS Error Messages.................................................................................................57
40. Safety Regulations .....................................................................................................59
41. EMC Regulations........................................................................................................59
vi
1 Motherboard Features
This chapter gives an overview of the SE440BX motherboard, including:
• Features
• Components
• Back panel I/O connectors
The remaining chapters explain how to:
• Add or upgrade components like processors or memory
• Use the BIOS Setup program to modify the motherboard’s configuration
• Upgrade the BIOS
Features Summary
• ATX form factor of 12 x 7.75 inches with seven mounting screw holes
• Support for a single Pentium
66 MHz and 100 MHz host bus speeds
Slot 1 connector
Integrated 512 KB second-level cache
• Three DIMM sockets
Supports up to 384 MB of synchronous DRAM (SDRAM) memory
• Intel 82440BX AGPset
PCI/A.G.P. controller (PAC)
PCI ISA IDE Xcelerator (PIIX4E)
• I/O controller
• Two USB ports
• Intel/Phoenix Basic Input/Output System (BIOS)
• Single-jumper configuration
• Onboard Accelerated Graphics Port (A.G.P.) connector
II processor
Software drivers and utilities are available from Intel.
NOTE
✏
For information about Intel motherboards, including technical product specifications, BIOS
upgrades, and device drivers, see “Products” at the Intel World Wide Web site:
http://developer.intel.com/
7
Motherboard Features
Components
Figure 1 shows the major components on the motherboard.
B HEDF GCA
X
W
V
U
A Wake on Ring connector M Power supply connector
B Wake on LAN†† technology connector (optional) N Diskette drive connector
C Fan 3 connector O SCSI LED connector
D Telephony connector (optional) P IDE connectors
E CD-ROM audio connector (optional) Q Front panel connectors
F Auxiliary Line In connector (optional) R Accelerated Graphics Port (A.G.P.) connector
G Chassis intrusion connector (optional) S PC/PCI connector
H Back panel connectors T Battery
I Slot 1 connector U Configuration jumper block
J Fan 2 connector V Speaker (optional)
K DIMM sockets W PCI slots
L Fan 1 connector X ISA slots
T
R Q NOS P M
I
J
K
L
OM07065
Figure 1. Motherboard Components
NOTE
✏
Components labeled optional do not come on all SE440BX motherboards.
8
Back Panel I/O Connectors
Figure 2 shows the back panel I/O connectors on the motherboard.
SE440BX Motherboard Product Guide
A
C
BD E
A PS/2† keyboard or mouse G Serial Port B
B PS/2 keyboard or mouse H MIDI/game Port (optional)
C USB Port 1 I Audio Line Out (optional)
D USB Port 0 J Audio Line In (optional)
E Serial Port A K Audio Mic In (optional)
F Parallel Port
F
G
H
IKJ
OM06985
Figure 2. Back Panel I/O Connectors
9
Motherboard Features
Microprocessor
The motherboard supports a single Pentium II processor operating at any of the Pentium II
processor speeds, voltages, and bus frequencies. Processors are not included with the SE440BX
motherboard and must be purchased separately.
The processor is packaged in a Single Edge Contact (S.E.C.) cartridge. The cartridge includes the
processor core, second-level cache subsystem, thermal plate, and back cover.
The processor connects to the motherboard through the Slot 1 connector, a 242-pin edge connector.
When mounted in Slot 1, the processor is secured by a retention mechanism attached to the
motherboard. A passive heatsink is stabilized by the heatsink support.
Microprocessor Upgrades
The motherboard can be upgraded with Pentium II processors that run at higher speeds. To
upgrade the processor, use the BIOS configuration mode to change the processor speed, see
Chapter 2.
Main Memory
The motherboard has three sockets for installing dual inline memory modules (DIMMs).
Minimum memory size is 8 MB; maximum memory size is 384 MB. To install memory, see
Chapter 2.
Second Level Cache Memory
The second-level cache is located in the S.E.C. cartridge. The cache includes synchronous
pipelined burst static RAM (PBSRAM) and tag RAM. There are four PBSRAM components
totaling 512 KB in size. All supported onboard memory is cacheable.
PCI Enhanced IDE Interface
The PCI enhanced IDE interface handles the exchange of information between the processor and
peripheral devices like hard disks and add-in boards inside the computer. The interface supports:
• Up to four IDE devices such as hard drives
• ATAPI devices
• PIO mode 3 and PIO mode 4 devices
• Up to four PCI cards or up to two ISA cards and three PCI cards
• Logical block addressing (LBA) of hard drives larger than 528 MB and extended cylinder head
sector (ECHS) translation modes
• Support for laser servo (LS-120) drives
10
SE440BX Motherboard Product Guide
Input/Output (I/O) Controller
The I/O controller handles the exchange of information between the processor and external devices
like the mouse and keyboard or a printer that are connected to the computer. The controller
features the following:
• Integrated keyboard and mouse controller
• Industry standard diskette drive controller
• One multimode bi-directional parallel port
Standard mode: Centronics-compatible operation
High speed mode: support for enhanced capabilities port (ECP) and enhanced parallel port
(EPP)
• Two serial ports
†
• Flexible IRQ and DMA mapping for Windows
95
Real-Time Clock
The motherboard has a time-of-day clock and 100-year calendar that will rollover to 2000 at the
turn of the century. A battery on the motherboard keeps the clock current when the computer is
turned off.
NOTE
✏
The recommended method of accessing the date in systems with Intel motherboards is indirectly
from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel motherboards and baseboards
contains a century checking and maintenance feature that checks the least two significant digits of
the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than
80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature
enables operating systems and applications using the BIOS date/time services to reliably
manipulate the year as a four-digit value.
For more information on proper date access in systems with Intel motherboards please see
http://support.intel.com/support/year2000/paper.htm
Universal Serial Bus (USB) Support
The motherboard has two USB ports. You can connect two USB peripheral devices directly to the
computer without an external hub. To attach more than two devices, connect an external hub to
either of the built-in ports. The motherboard supports the standard universal host controller
interface (UHCI) and takes advantage of standard software drivers written to be compatible with
UHCI. The USB features the following:
• Support for hot swapping Plug and Play devices
• Support for self-identifying peripherals
11
Motherboard Features
• Support for up to 127 physical devices
• Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other
applications
NOTE
✏
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use a
shielded cable that meets the requirements for a high-speed USB device.
A.G.P.
The A.G.P. is a high-performance interconnect for graphics-intensive applications, such as 3D
graphics. A.G.P. is independent of the PCI bus and is intended for exclusive use with graphical
display devices. A.G.P. provides these features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for near 100 percent bus efficiency
• AC timing for 133 MHz data transfer rates, allowing real data throughput in excess of
500 MB/sec
BIOS
The motherboard’s system BIOS is contained in a flash memory device on the motherboard. The
BIOS provides the power-on self test (POST), the BIOS Setup program, and the PCI and IDE autoconfiguration utilities.
The BIOS is always shadowed. Shadowing allows BIOS routines to be executed from fast 64-bit
onboard DRAM instead of from the slower 8-bit flash memory device.
BIOS Upgrades
Because the BIOS is stored in a flash memory device, you can upgrade the BIOS by using a
software utility on a diskette or hard disk, or over a network. For information on upgrading the
BIOS, see Chapter 4.
PCI Auto Configuration
If you install a PCI add-in board in your computer, the PCI auto-configuration utility in the BIOS
automatically detects and configures the resources (IRQs, DMA channels, and I/O space) for that
add-in board. You do not need to run the BIOS Setup program after you install a PCI add-in
board.
However, PCI add-in boards use the same IRQ resources as ISA add-in boards. If you install both
a PCI and an ISA add-in board, you must specify the IRQ used by the ISA card. The PCI auto
configuration program complies with version 2.1 of the PCI BIOS specification.
12
SE440BX Motherboard Product Guide
IDE Auto Configuration
If you install an IDE device (e.g., a hard drive) in your computer, the IDE auto-configuration
utility in the BIOS automatically detects and configures the device for your computer. You do not
need to run the BIOS Setup program after installing an IDE device.
ISA Plug and Play Capability
The motherboard provides auto configuration of Plug and Play ISA cards and resource
management for legacy (non-Plug and Play) ISA cards when used with the ISA Configuration
Utility (ICU) or a Plug and Play compatible operating system like Windows 95. To obtain the
ICU, contact your computer supplier.
Security Passwords
The BIOS includes security features that restrict whether the BIOS Setup program can be accessed
and who can boot the computer. A supervisor password and a user password can be set for the
Setup program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the Setup program. This is supervisor mode.
• The user password gives restricted access to view and change Setup options in the Setup
program. This is user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
Setup program gives the user restricted access to Setup.
• If both the supervisor and user passwords are set, you must enter either the supervisor
password or the user password to access Setup.
• Setting a user password restricts who can boot the computer. The password prompt is
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, you can enter either password
to boot the computer.
Expansion Slots
The motherboard has five expansion slots for installing add-in boards, like network cards, that
expand the capabilities of your computer. The expansion slots are as follows:
• One ISA slot
• Three PCI slots
• One shared PCI/ISA slot
13
Motherboard Features
Power Management
The motherboard supports two types of power management — Advanced Power Management
(APM) and Advanced Configuration and Power Interface (ACPI).
Advanced Power Management (APM)
APM’s energy saving standby mode can be initiated in the following ways:
• Specify a time-out period in Setup
• Press the suspend/resume switch connected to the front panel sleep connector
• Use an operating system option, such as the Suspend menu item in Windows 95
In standby mode, the motherboard can reduce power consumption by spinning down hard drives,
†
and reducing power to or turning off VESA
mode can be enabled or disabled in Setup (see Chapter 3).
While in standby mode, the system retains the ability to respond to external interrupts and service
requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the
system out of standby mode and immediately restores power to the monitor.
DPMS-compliant monitors. Power-management
The BIOS enables APM by default; but the operating system must support an APM driver for the
power-management features to work. For example, Windows 95 supports the power-management
features upon detecting that APM is enabled in the BIOS.
Advanced Configuration and Power Interface (ACPI)
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. ACPI requires an ACPI-aware operating system. ACPI features include:
• Plug and Play (including bus and device enumeration) and APM functionality normally
contained in the BIOS
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video monitor, and hard disk drives
• Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping
state, and less than 5-watt system operation in the Suspend to Disk sleeping state
• A Soft-off feature that enables the operating system to power off the computer
• Support for multiple wake up events
• Support for a front panel power and sleep mode switch
Battery
A battery on the motherboard keeps the clock and the values in CMOS RAM current when your
computer is turned off. To replace the battery, see Chapter 2.
14
SE440BX Motherboard Product Guide
Wake on Ring
Wake on Ring enables the computer to wake from sleep or soft-off mode when a call is received
on a telephony device, such as a modem, configured for operation on COM1. The first incoming
call powers up the computer. A second call must be made to access the computer. To access this
feature use the Wake on Ring connector. See Chapter 5 for the location and pinouts of the Wake
on Ring connector.
Wake on LAN Technology (Optional)
Wake on LAN technology enables remote wakeup of the computer through a network. Wake on
LAN technology requires a PCI add-in network interface card (NIC) with remote wakeup
capabilities. The remote wakeup connector on the NIC must be connected to the onboard Wake on
LAN technology connector. The NIC monitors network traffic at the MII interface; upon
†
detecting a Magic Packet
access this feature use the Wake on LAN technology connector. See Chapter 5 for the location and
pinouts of the Wake on LAN technology connector.
, the NIC asserts a wakeup signal that powers up the computer. To
CAUTION
For Wake on LAN, the 5-V standby line for the power supply must be capable of delivering +5 V
5 % at 720 mA. Failure to provide adequate standby current when implementing Wake on LAN,
±
can damage the power supply.
Hardware Monitor (Optional)
The optional hardware monitor subsystem provides low-cost instrumentation capabilities. The
features of the hardware monitor subsystem include:
• Support for an optional chassis intrusion connector
• An integrated ambient temperature sensor
• Fan speed sensors that monitor the fan 1 and fan 2 connectors (see Figure 15 for the location of
these connectors on the motherboard)
• Power supply voltage monitoring to detect levels above or below acceptable values
When suggested ratings for temperature, fan speed, or voltage are exceeded, an interrupt is
activated. The hardware monitor component connects to the system management (SM) bus.
Audio Subsystem (Optional)
The optional audio subsystem consists of the following:
• Crystal Semiconductor CS4236B audio codec
• Crystal Semiconductor CS4611 PCI audio accelerator
• Back panel and onboard audio connectors
15
Motherboard Features
Crystal Semiconductor CS4236B Audio Codec
The CS4236B audio codec’s features include:
Compatibility with Sound Blaster†, Sound Blaster Pro†, and Windows Sound System
•
MPU-401 compatible MIDI and joystick interfaces
•
Advanced MPC3-compliant input and output mixer
•
Crystal Semiconductor CS4611 PCI Audio Accelerator
The CS4611’s
bus and the device’s internal DMA engine and stream processor. Other features
A RAM-based Digital Signal Processor optimized for digital audio processing
•
A bus mastering PCI bus interface that complies with
•
Revision 2.1
Acceleration of DirectSound
•
General MIDI Wavetable Synthesis with Reverb and Chorus
•
PCI bus interface enables burst mode transfers of audio data between the system
PCI Local Bus Specification,
†
, DirectSound3D†, DirectInput†, and ActiveMovie† APIs
Audio Connectors
The audio connectors include the following:
Back panel connectors: stereo line-level output (Line Out), stereo line-level input (Line In),
•
and Mic In
CD audio header (black)
•
Telephony (green)
•
Stereo Line In (natural/white)
•
See Chapter 5 for the location and pinouts of the audio connectors.
Speaker (Optional)
include:
A piezoelectric speaker is mounted on the motherboard. The speaker provides audible error code
(beep code) information during the POST.
The motherboard also has a front panel connector for an offboard speaker.
16
2 Installing and Replacing Motherboard
Components
This chapter describes the following:
• How to install and remove the motherboard
• How to install a processor
• How to prepare the motherboard for a boxed Pentium II processor
• How to install and remove memory
• How to replace the battery
• How to use the configuration jumper to set processor speed and clear passwords
Before You Begin
CAUTION
Before you install this motherboard in a chassis, see Appendix B for regulatory requirements and
precautions.
• Always follow the steps in each procedure in the correct order.
• Set up a log to record information about your computer, such as model, serial numbers,
installed options, and configuration information.
• Use an antistatic wrist strap and a conductive foam pad when working on the motherboard.
WARNINGS
The procedures in this chapter assume familiarity with the general terminology associated with
personal computers and with the safety practices and regulatory compliance required for using
and modifying electronic equipment.
Disconnect the computer from its power source and from any telecommunications links,
networks, or modems before performing any of the procedures described in this chapter.
Failure to disconnect power, telecommunications links, networks, or modems before you open
the computer or perform any procedures can result in personal injury or equipment damage.
Some circuitry on the motherboard can continue to operate even though the front panel power
button is off.
CAUTION
Electrostatic discharge (ESD) can damage components. Perform the procedures described in this
chapter only at an ESD workstation. If such a station is not available, you can provide some ESD
protection by wearing an antistatic wrist strap and attaching it to a metal part of the computer
chassis.
17
Installing and Replacing Motherboard Components
How to Install and Remove the Motherboard
Refer to your chassis manual for instructions on installing and removing the motherboard. The
motherboard is secured to the chassis by seven screws. Figure 3 shows the locations of the
mounting screw holes.
NOTES
✏
You will need a Phillips (#2 bit) screwdriver.
Refer to Appendix B for regulatory requirements and installation instructions and precautions.
WARNING
This procedure should be done only by qualified technical personnel. Disconnect the computer
from its power source before doing the procedures described here. Failure to disconnect the
power before you open the computer can result in personal injury or equipment damage.
OM07070
Figure 3. Mounting Screw Holes
How to Install a Processor
To install a processor, in brief you must:
1. Install the retention mechanism.
2. Install the processor.
3. Set the processor speed.
Detailed instructions follow for each of these procedures.
NOTE
✏
If you are installing a boxed Intel Pentium II processor, see the instructions on page 23.
18
Install the Retention Mechanism
To install the retention mechanism, follow these steps:
1. Observe the precautions in “Before You Begin” (see page 17).
2. Find the Slot 1 connector on the motherboard (see Figure 4).
SE440BX Motherboard Product Guide
C
B
D
A Retention bracket C Fastener retainer pins
B Press-fit fasteners D Slot 1 connector
Figure 4. Installing the Processor Retention Mechanism
A
OM07025
3. Orient the retention bracket so the tab of the Slot 1 connector matches the corresponding
cutout in the retention bracket, then position the retention bracket on the motherboard.
4. Push each of the four fasteners through its mounting hole in the retention bracket, and then
through the motherboard mounting hole until you feel it snap into place.
5. Push a fastener retainer pin into the through hole of fastener until it is fully seated against the
top of the fastener. Repeat this step for each of the four fasteners.
19
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