Intel® Server System R1000GZ/GL Product Family TPS
Date
Revision Number
Modifications
January 2012
1.0
1st Production Release
• Updated Features Table
Revision History
• Updated Environmental Limits Table
oAdded ASHRAE support details
April 2012 1.1
• Updated thermal management sections
• Updated sections for embedded SCU and RAID support
• Added sections for product errata definition and FRUSDR usage
• Updated add-in card length limits to riser card sections.
• Updated reference documents list
Disclaimers
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GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR
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OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A
SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on
the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to
them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product
order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
®
Intel
Xeon® is a registered trademark of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Intel® Server System R1000GZ/GL Product Family TPS
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1. Introduction
Intel® Server System R1000GZ/GL Product Family TPS
This Technical Product Specification (TPS) provides system level information for the Intel® Server System
R1000GZ and Intel
product families are common, however the server board integrated into them is different. The Intel
System R1000GZ product family is integrated with an Intel
System R1000GL product family is integrated with the Intel
®
Server System R1000GL product families. The system level features of both these
®
Server Board S2600GZ and the Intel
®
Server Board S2600GL.
®
Server
®
Server
This document will describe the functions and features of the integrated server system which includes the
chassis layout, system boards, power sub-system, cooling sub-system, storage sub-system options, and
available installable options. Server board specific detail can be obtained by referencing the Intel
In addition, design-level information related to specific server board components / subsystems can be obtained
by ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to this
server generation. EPS and EDS documents are made available under NDA with Intel and must be ordered
through your local Intel
representative. See the Reference Documents section at the end of this document for a
list of available documents.
1.1 Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Product Family Overview
Chapter 3 – Power Subsystem
Chapter 4 – Thermal Management
Chapter 5 – System Storage and Peripherals Drive Bay Overview
Chapter 6 – Storage Controller Options Overview
Chapter 7 – Front Control Panel and I/O Panel Overview
Chapter 8 – Intel
Chapter 9 – PCI Riser Card Support
Chapter 10 – Mezzanine Module Support
Appendix A – Integration and Usage Tips
Appendix B – POST Code Diagnostic LED Decoder
Appendix C – Post Code Errors
Glossary
Reference Documents
®
Local Control Panel
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
development and testing that when Intel
will meet the intended thermal requirements of these components. It is the responsibility of the system
integrator who chooses not to use Intel
operating parameters to determine the amount of airflow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or
non-operating limits.
®
®
server building blocks are used together, the fully integrated system
®
-developed server building blocks to consult vendor datasheets and
Revision 1.1
ensures through its own chassis
1.3 Product Errata
Intel® Server System R1000GZ/GL Product Family TPS
The products described in this document may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Product Errata are documented in the Intel
Board S2600GZGL, Intel
®
Server System R1000GZGL, Intel® Server System R2000GZGL Monthly
®
Server
Specification Update which can be downloaded from Intel.com
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Intel® Server System R1000GZ/GL Product Family TPS
3
2. Product Family Overview
This generation of Intel 1U server platforms offers a variety of system options to meet the varied configuration
requirements of high-density high-performance computing environments. The Intel
R1000GZ/GL product families are comprised of several available 1U rack mount server systems that are
integrated with either an Intel
®
Server Board S2600GZ or Intel® Server Board S2600GL.
®
Server System
This chapter provides a high-level overview of the system features and available options as supported in
different platform SKUs within this server family. Greater detail for each major system component or feature is
provided in the following chapters.
Note: The following table lists features common to both server product families. Features that are unique to
one product family will be identified by either denoting the server system name or the integrated server board
name.
Revision 1.1
Intel® Server System R1000GZ/GL Product Family TPS
Server System
Integrated Server Board
Feature
Description
Support for one or two Intel® Xeon® processors E5-2600 product family
Memory DDR3 data transfer rates of 800, 1066, 1333 MT/s, and 1600 MT/s
DDR3 standard I/O voltage of 1.5V and DDR3 Low Voltage of 1.35V
RJ-45 Serial- A Port
Four RJ-45 Network Interface Connectors supporting 10/100/1000Mb
USB 2.0 connectors - 3 on back panel + 2 on front panel
One DH-10 Serial-B port connector
The following I/O modules utilize a single proprietary on-board connector. An installed I/O module can
be supported in addition to standard on-board features and any add-in expansion cards.
Quad port 1 GbE based on Intel® Ethernet Controller I350 – RMS25CB0080
Dual port 10GBase-T Ethernet module based on Intel
AXX10GBTWLIOM
Dual SFP+ port 10GbE module based on Intel® 82500 10 GbE controller – AXX10GBNIAIOM
Single Port FDR speed InfiniBand module with QSFP connector – AXX1FDRIBIOM
Intel® Server System R1000GZ/GL Product Family TPS
Parameter
Limits
2.2 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 2. System Environmental Limits Summary
Temperature
Operating ASHRAE Class A2 – Continuous Operation. 10º C to 35º C (50º F to 95º F) with the maximum
rate of change not to exceed 10°C per hour
ASHRAE Class A3 – Includes operation up to 40C for up to 900 hrs per year.
ASHRAE Class A4 – Includes operation up to 45C for up to 90 hrs per year.
Shipping -40º C to 70º C (-40º F to 158º F)
Altitude
Operating Support operation up to 3050m with ASHRAE class deratings.
Humidity
Shipping 50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25° C
to 35° C)
Shock
Operating Half sine, 2g, 11 mSec
Unpackaged Trapezoidal, 25 g, velocity change is based on packaged weight
Packaged Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged 5 Hz to 500 Hz 2.20 g RMS random
Packaged 5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage 90 Hz to 132 V and 180 V to 264 V
Frequency 47 Hz to 63 Hz
Source Interrupt No loss of data for power line drop-out of 12 mSec
Surge Non-
operating and
operating
Line to earth Only AC Leads 2.0 kV
ESD
Air Discharged 12.0 kV
Contact
Discharge
Acoustics
Sound Power
Measured
Servers/Rack
See the Intel
Power in Watts
Mount BA
®
S2600GZGL Product Family Power Budget and Thermal Configuration Tool for system
configuration requirements and limitations.
Unidirectional
I/O Leads 1.0 kV
DC Leads 0.5 kV
8.0 kV
<300 W ≥300 W ≥600 W ≥1000 W
7.0 7.0 7.0 7.0
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Intel® Server System R1000GZ/GL Product Family TPS
7
2.3 System Features and Options Overview
Figure 2. System Components Overview
2.3.1 Hot Swap Hard Drive Bay and Front Panel Options
Figure 3. 3.5" Hard Drive Bay - 4 Drive Configuration
Figure 4. 2.5" Hard Drive Bay - 8 Drive Configuration
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Intel® Server System R1000GZ/GL Product Family TPS
Label
Description
Label
Description
2.3.2 Back Panel Features
Figure 5. Back Panel Feature Identification
2.3.3 Front Control Panel Options
A System ID Button w/Integrated LED F System Status LED
B NMI Button (recessed, tool required for use) G Power Button w/Integrated LED
C NIC-1 Activity LED H Hard Drive Activity LED
D NIC-3 Activity LED I NIC-4 Activity LED
E System Cold Reset Button J NIC-2 Activity LED
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Figure 6. Front Control Panel Options
Intel® Server System R1000GZ/GL Product Family TPS
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2.4 Server Board Features Overview
The following illustration provides a general overview of the server board, identifying key feature and
component locations. The majority of the items identified are common between the Intel
®
Server Board
S2600GL and S2600GZ.
Figure 7. Intel® Server Board S2600GZ
Revision 1.1
Intel® Server System R1000GZ/GL Product Family TPS
Label
Description
Label
Description
A System ID I System Fan #3 Fan Fault
B System Status J Memory Fault
C POST Code Diagnostics K System Fan #2 Fan Fault
D 12V Stand-by Power Present L System Fan #1 Fan Fault
E CPU-2 Fault M CPU-1 Fault
F System Fan #6 Fan Fault N CATERR
G System Fan #5 Fan Fault O System Power Good
H System Fan #4 Fan Fault
Figure 8. Intel® Light-Guided Diagnostic LEDs - Server Board
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Intel® Server System R1000GZ/GL Product Family TPS
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2.5 Available Front Bezel Support
The optional front bezel is made of molded plastic and uses a snap-on design. When installed, its design
allows for maximum airflow to maintain system cooling requirements. The face of the bezel assembly includes
optional snap-in identification badge and wave (shown) features to allow for customization.
(Intel Product Order Code – A1UBEZEL)
Figure 9. Optional Front Bezel
2.6 Available Rack and Cabinet Mounting Kit Options
o 1U and 2U compatible
o 65 lbs max support weight
o Tool-less installation
o Full extension from rack
o Drop in system install
o Optional cable management arm support
• Value rack mount rail kit – Intel Product Code – AXXVRAIL
o 1U to 4U compatible
o 130 lbs max support weight
o Tool-less chassis attach
o Tools required to attach to rails to rack
o 2/3 extension from rack
• Cable Management Arm – Intel Product Code – AXX1U2UCMA (*supported with AXXPRAIL only)
Intel® Server System R1000GZ/GL Product Family TPS
3. Power Subsystem
This chapter provides a high level overview of the power management features and specification data for the
power supply options available for this server product. Specification variations will be identified for each
supported power supply.
The server system can have upto two power supply modules installed, supporting the following power supply
configurations: 1+0 (single power supply), 1+1 Redundant Power, and 2+0 Combined Power (non-redundant).
1+1 redundant power and 2+0 combined power configurations are automatically configured depending on the
total power draw of the system. If the total system power draw exceeds the power capacity of a single power
supply module, then power from the 2
redundancy is lost. In a 2+0 power configuration, total power available maybe less then twice the rated power
of the installed power supply modules due to the amount of heat produced with both supplies providing peak
power. Should system thermals exceed programmed limits, platform management will attempt to keep the
system operational. See Closed Loop System Throttling (CLST) later in this chapter, and Chapter 4 Thermal Management, for details.
There are three power supply options available for this server product: 460W AC, 750W AC, 750W DC.
The power supplies are modular, allowing for tool-less insertion and extraction from a bay in the back of the
chassis. When inserted, the card edge connector of the power supply mates blindly to a matching slot
connector on the server board.
nd
power supply module will be utilized. Should this occur, power
In the event of a power supply failure, redundant 1+1 power supply configurations have support for hot-swap
extraction and insertion.
The AC input is auto-ranging and power factor corrected.
3.1 Mechanical Overview
The physical size of the power supply enclosure is 39/40mm x 74mm x 185mm. The power supply contains a
single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge connector in
the system.
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13
74mm
FCI 2x25 card
edge connector
10035388-102
A25
A1
B25
B1
2mm
Retention Latch
Airflow direction
8.5mm
39mm
40mm fan
11mm
185mm
Intel® Server System R1000GZ/GL Product Family TPS
Figure 10. Power Supply Module Mechanical Drawing
Figure 12. Power Supply Module
Figure 11. AC and DC Power Supplies – Connector View
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