The Intel Desktop Board DN2800MT may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DN2800MT Specification Update.
August 2012
Revision History
Revision Revision History Date
001 First release of the Intel® Desktop Board DN2800MT Te c hnic al Pr oduct
Specification
002 Updated the Board Identification I nformation section and added a spec
clarification
003 Specification Clarification June 2012
004 Specification Clarification August 2012
Disclaimer
This product spec ification applies to only the standard Intel® Desktop Board with BIOS identifier
MTCDT10N.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED I N INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATI NG TO FI TNESS FOR A PARTICU LAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.
®
All Intel
computers (PC) fo r installation in homes, offices, schools, co mputer rooms, and similar locations. The
suitability of this pr o duct for other PC or embedded no n-PC ap plications or other e nv ironments, such as
medical, industrial, alarm systems, test equipment, e tc . may not be supporte d without further eva luation by
Intel.
Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other
intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and
other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.
Intel may make change s to specifications and p roduct descrip tions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for
conflicts or inco mpatibilities arising from future changes to the m .
Intel desktop b oards may contain de s ign defects or errors known as e r rata, which may cause the product to
deviate from p ub lis he d specifications. C ur rent characterized errata are available o n request.
Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p la c ing your
product order.
Intel and Intel Atom are trademarks of Intel Co rporation in the U.S. and/or other countries.
* Other names and b rands may be claimed a s the property of others.
Copyright 2011, 2012, I nte l C orporation. All ri g hts reserved.
desktop boa r ds are evaluated as Information Techno logy Equipment (I.T.E.) f or use in personal
December 2011
April 2012
ii
Added section 2.2.3.7 C us to m S o luti o ns He ader.
Board Identification Information
Basic Desktop Board DN2800MT Identification Information
1. The AA number is found on a small label on the component side of the b oard.
2. The NM10 Express Chipset used on this AA rev i s io n c onsists of the follo wing component:
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DN 2 800MT.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
April 2012 Spec Clarification Updated sections 1.6.1.1 Intel® High Definition (Inte l® HD)
Graphics, 1.6.2.1 LVDS Inter f a c e , and 1.6.2.2 Embedded
DisplayPort (eD P) Interface to co rrect the max reso lution from
1920 x 1200 to 1920 x 1080.
June 2012 Spec Clarification
August 2012 Spec Clarification
• Corrected the orientation of the Custom Solutions header in
Figure 1 and Figure 13.
• Added a Note to section 1.4 System Memory on page 20.
•
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DN2800MT.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DN2800MT and its components to the v endors, system integrators, and other
engineers and technicians who need t his level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardwar e used on Intel Desktop Board DN2800MT
2 A map of the resources of the Intel Desktop Board
4 A description of the BIOS er r or m es s a ges , beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Desktop
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attentio n to important informatio n.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits )
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,5 76 bits)
Mbits/s Megabits per second
TDP Thermal Design Power
xxh An address or data value e nd ing with a lowercase h ind ic ate s a he xadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of thei r
respective owners.
vi
Contents
Revision History
Disclaimer ................................................................................................ ii
Board Identification Information .................................................................. iii
Specification Changes or Clarifications .......................................................... iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
Two 204-pin DDR3 SDRAM Sma ll O utli ne D ual Inline Memory Module (S O-
®
Integrated graphics:
®
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor Fanlessly-cooled, soldered-down D ual-Core Intel® Atom™ Processor N2800 with
Memory
Chipset
Graphics
Audio
Mini-ITX (6.7 inches by 6 .7 inches [170.18 mil lime te rs by 170.18 millimeters])
integrated graphi c s and inte grated memory c o ntroller
•
DIMM) sockets
• Support for DDR3 800 MHz and DDR3 1066 MHz SO-DIMMs
Note: Higher speed SO-DIMMs supported at 1066 MHz if supported b y the
memory module.
• Support for up to 4 GB of system memory on a single SO-DIMM (or two
2 GB SO-DIMMs)
NM10 Express Chipset
Intel
•
― Digital displays (High Definition Multimedia I nte rface* (HDMI*))
― Analog displays (V G A)
― Internal flat panel di s p lays:
LVDS
eDP (Embedded DisplayPort*)
• External graphics:
― One PCI Express 1.0a x1 graphics add-in card connecto r
• 2+2 Intel
codec
― Analog stereo line-out (back panel jack)
― In-chassis stereo speakers support (3 W/3 Ω via internal header)
― S/PDIF digital aud io output (internal header)
― DMIC digital micr o phone input (internal header )
― Analog line-in (back panel j ac k)
― Front panel Intel HD Audio/AC’97 he adphones/mic suppo rt (internal
header)
• 8-channel (7.1) Intel High D e finition Audio via the HDMI interface
High Definition (I nte l® HD) audio via the Realtek* ALC888S audio
Gigabit (10/100/1000 Mbits/s) LAN s ub s ystem using the Intel
®
82574L Gigabit
• Hardware monitoring through the Nuvoto n I/O controller
Table 2. Feature Summary (continued)
Peripheral
Interfaces
Expansion
Capabilities
BIOS
LAN Support
Legacy I/O Control Nuvoton W83627DHG I/O controller for hardwar e manag e ment, s e r i al ports and
Hardware Monitor
Subsystem
• Ten USB 2.0 ports:
― Four front pane l ports (via two inter nal he aders; one header s up p orts an
®
Z-U130 USB Solid-State Drive (or compatible d e v ic e ))
Intel
― Two ports are im p le m e nte d w i th sta c k e d back panel connectors (black)
― Two high-current/fast-charging ports implemented through s tac ked back
panel connectors (yellow)
― One port implemente d in the PCI Express Ha lf-Mini Card slot
― One port impleme nte d in the PCI Express Full-/Half-Mini Card slot
• Two SATA ports:
― One internal SATA connector (black)
― One internal SATA co nne c to r (multiplexed with mSATA port , routed to PCI
Express Full-/Half-Mini Card slot) (gray)
•
• One PCI Express Half-Mini Card slot
• One PCI Express Full-/Half-Mini Card slot
• Intel
BIOS resid e nt in the S e rial Peripheral Interface (SPI) Flash device
• Support for A d vanced Configur ation and Power Interface (ACPI), Plug a nd
Play, and System Management BIOS (SMBIOS)
Ethernet Controller
parallel port support
• Voltage sense to d e te c t o ut of range power supply voltage s
• Thermal sense to dete c t out of range thermal v a lue s
• One 3-wire system fan header
• One fan sense input use d to monitor fan activ ity
• Fan speed control
14
Product Description
1.1.2 Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of the Intel
Desktop Board DN2800MT.
Table 3 lists the components identified in Figure 1.
Table 3. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Debug connector
B Battery
C Back panel connectors
D System fan header
E Inter na l p ower connector
F Intel NM10 Express Chipset
G BIOS Setup configuration jumper b lock
H SATA data conne c to r
I SATA power connector
J PCI Express Half-Mini card slot
K S A T A d ata c o nne c tor
L Intel Atom processor and heatsink
M Flat panel display connectors
N DDR3 SO-DIMM 0 socket
O DDR3 SO-DIMM 1 socket
P Front panel header
Q Front panel audio heade r
R F ront panel dual-port USB headers
S Standby power LED
T Se r ia l p ort headers
U Parallel po rt header
V DMIC header
W PCI Express Full-/Half-Mini Card slot
X Custom Solutions header
Y PCI Express 1.0a x1 connector
Z S/PDIF header
AA Internal stereo speakers connector
16
Product Description
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of the Intel
Desktop Board DN2800MT.
Figure 3 is a block diagram of the major functional areas of the board.
18
Figure 3. Block Diagram
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DN2800MT http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for Intel
Desktop Board DN2800MT
Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration info r m ation http://www.intel.com/support/go/buildit
1.3 Processor
Product Description
http://ark.intel.com
025414.htm
The board has a fanlessly-cooled, soldered-down dual-core Intel Atom processor
N2800 with integrated graphics and integrated memory controller.
NOTE
The board is designed to be fanlessly cooled in a properly ventilated chassis. Chassis
venting locations are recommended above and next to the processor area for
maximum heat dissipation effectiveness.
The board has two 204-pin SO-DIMM sockets and supports the following memory
features:
• 1.5 V DDR3-800 and DDR3-1066 SO-DIMMs with gold-plated contacts
• Unbuffered, non-ECC, Raw Card B (1Rx8) and Raw Card-F (2Rx8) SO-DIMMs only
• Single-sided or double-sided modules
• 4 GB maximum total system memory
• Serial Presence Detect
• DDR3 800 MHz and DDR3 1066 MHz SO-DIMMs
(Higher speed SO-DIMMs supported at 1066 MHz if supported by the memory
module.)
NOTES
•Due to fanless thermal constraints, system memory must have an operating
temperature rating of 85
The board is des igned to be fanlessly cooled in a properly ventilated chassis.
Chassis venting locations are recommended above the system memory area for
maximum heat dissipation effectiveness.
•If you are installing only one SO-DIM M, it must be installed in the bottom socket
(SO-DIMM 1).
•To be fully compliant with all applicable DDR SDRAM memory specifications , the
board should be populated with SO-DIMMs that support the Serial Presence Detect
(SPD) data structure. This allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If nonSPD memory is installed, the B I OS will attempt to correctly configure the memory
settings, but perfo rmance and reliability may be impacted or the SO-DIMMs may
not function under the determined frequency.
o
C.
20
Table 5 lists the supported SO-DIMM configurations.
Version
Capacity
Technology
Organization
Devices
Table 5. Supported Memory Configurations
Raw Card
SO-DIMM
DRAM Device
DRAM
Product Description
# of DRAM
B
F
Note: System memory conf i g urations are based on availability and are subject to change.
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
2 GB 1 Gb 128 M x 8 16
4 GB 2 Gb 256 M x 8 16
Intel NM10 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces.
The Intel NM10 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel NM10 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
NM10 Express Chipset
1.6 Graphics Subsystem
The board support s graphics through Intel Graphics Technology.
1.6.1 Integrated Graphics
The board support s integrated graphics through the Intel® Flexible Display Interface
®
(Intel
NOTE
The board can simultaneously support up to two of the three integrated graphics
interfaces: VGA, HDMI, and Flat Panel Display.
FDI) for processors with Intel Graphics Technology.
Flat Panel Display is supported by eDP and LVDS interfaces, however only one can be
used at a time.
1.6.1.1 Intel
The Intel® GMA graphics controller features the following:
• 640 MHz core frequency
• Video
Blu-ray* 2.0
PAVP 1.1c
HDCP 1.3
• Display
Supports VGA displays up to 1920 x 1200 (WUXGA) at 60 Hz
Supports HDMI displays up to 1920 x 1200 (WUXGA) at 60 Hz
Supports eDP or LVDS internal flat panel displays up to 1920 x 1080 at 60 Hz
Dual independent display support
For information about Refer to
Obtaining graphics s oftware and utilities Section 1.2, page 19
®
High Definition (Intel® HD) Graphics
22
Product Description
1.6.1.2 Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory f or use as graphics me m ory to balance 2D/3D gra phics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.
1.6.1.3 High Definition Multimedia Interface* (HDMI*)
The HDMI por t supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio. The
maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant
with the HDMI 1.3a specification.
Depending on the type of a d d-in card installed in the PCI Express x1 connector, the
HDMI port will behave as described in Table 6.
Table 6. HDMI Port Status Conditions
PCI Express x1 Connector Status HDMI Port Status
No add-in card installed Enabled
Non-video PCI Express x1 a dd-in card installed Enabled
Video PCI Express x1 add-in card installed Disabled
1.6.1.4 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 1920 x
1200 (WUXGA) at a 60 Hz refre sh rate.
The board support s flat panel display via the LVDS and Embedded DisplayPort
interfaces. Figure 5 shows the flat panel connectors.
Item Description
A Backlight inverter voltage selection header
B Flat panel voltage se le c tion header
C FPD brightness conne c tor
D LV DS connector
E Embed d e d DisplayPort conne c to r
24
Figure 5. Flat Panel Connectors
Product Description
1.6.2.1 LVDS Interface
The LVDS flat panel display interface supports the f ollowing:
• 1920 x 1080 @ 60 Hz resolution
• Single-channel and dual-channel interface, up to 135 MHz clock rate 18 bpp and
24 bpp (VESA* and JEIDA mappings) color depth support
• Multiple EDID data source capability (panel, predefined, and custom payloads)
• 3.3 V, 5 V, and 12 V flat panel display voltage flexibility, with up to 3 A current
• 5 V, 12 V and Vin backlight inverter voltage flexibility, with up to 3 A current
• Backlight inverter signal redundancy on dedicated header as well as on LVDS
connector (for discrete inverter or panel-integrated inverter support using a single
cable)
•Flat panel brightness control via front panel button input as well as Windows* 7
“Screen brightness” adjustment slider
•Spread-spectrum control
NOTE
Backlight inverter voltage option “Vin” re fers to board input v oltage as provide d to
board power input connector.
1.6.2.2 Embedded DisplayPort (eDP) Interface
The eDP (Embedded DisplayPort) flat panel display interface supports the following:
• 1920 x 1080 @ 60 Hz resolution
• 1-lane, 2-lane, and 4-lane bandwidth at 1.62 Gb/s or 2.7 Gb/s
• Multiple EDID data source capability (panel, predefined, and custom payloads)
• 3.3 V, 5 V, and 12 V flat panel display voltage flexibility, with up to 3 A current
• 5 V, 12 V and Vin backlight inverter voltage flexibility, with up to 3 A current
• Backlight inverter signal redundancy on a dedicated header as well as on eDP
connector (for discrete inverter or panel-integrated inverter support using a single
cable)
•Flat panel brightness control via front panel button input as well as Windows 7
“Screen brightness” adjustment slider
NOTE
Backlight inverter voltage option “Vin” re fers to board input v oltage as provide d to
board power input connector.
1.6.2.3 Configuration Modes
Video mode configuration for eDP/LVDS displays is supported as follows:
•Automatic panel identification via Extended Display Identification Data (EDID) for
panels with onboard EDID support
• Panel selection from common predefined panel types (without onboard EDID)
• Custom EDID payload installation for ultimate paramet er flexibility, allowing
custom definition of EDID d a ta on panels without onboard EDID
In addition, BIOS setup pr ovides the following configuration parameters for internal
flat panel displays:
•Screen Brightness: allows the end user to set the screen brightness for the display
effective through the Power-On Self Test stage (such as while showing the splash
screen image and BIOS setup). Windows 7 will ignore this setting in favor of the
native “screen brightness” control provided by the operating syste m .
•Flat Panel Configuration Changes Lock: allows the system integrator to “lock”
critical settings of the LVDS configuration to avoid end users potentially rendering
the display unusable.
•Brightness Steps: allows the system integrator to configure the brightness steps for
the operating system’s “screen brightness” control (such as the “Screen brightness”
adjustment slider under the Windows 7 “Power Options” control panel).
•LVDS Interface Type: allows the system integrator to select whether the LVDS
panel is a single-channel or dual-channel display.
•Swap LVDS Channels 0/1: allows the system integrator to swap the EVEN/ODD
LVDS channel assignments shall the cable be wired opposite the panel pinout.
•Color Depth: allows the system integrator to select whether the panel is 24 bpp
with VESA color mapping (eDP and LVDS), 24 bpp with JEIDA color mapping (LVDS
only), or 18 bpp (eDP and LVDS).
•eDP Interface Type: allows the system integrator to select whether the eDP panel is
a 1-lane, 2-lane, or 4-lane display.
•eDP Data Rate: allows the system integrator to select whether the eDP panel runs
at 1.62 Gb/s or 2.7 Gb/s.
•Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.
•Maximum and Minimum Inverter Current Limit (%): allows the system integrato r to
set maximum PWM%, as appropriate, according to the power requirements of the
internal flat panel display and the selected inverter board.
•Panel Power Sequencing: allows the system integrator to adjust panel sequencing
parameters, if necessary.
•LVDS Spread Spectrum Control: allows the system integrator to adjust spread
spectrum for the LVDS interface.
NOTE
Support for flat panel display configuration complies with the following:
1. Internal flat panel display connec tivity is disabled (and all parameters hidden) by
default.
2. Internal flat panel display settings are not exposed through Intel
Toolkit or Intel
3. Internal flat panel display settings will not be overwritten by loading BIOS setup
defaults.
4. Internal flat panel display settings will be preserved across BIOS updates.
26
®
Integrator Assis tant GUIs.
®
Integrator
Product Description
1.6.3 USB
The board support s up to ten USB ports. The port arrangement is as follows:
•Four front panel ports (via two internal headers; one header supports an Intel
Z-U130 USB Solid-State Drive (or compatible device))
• Two ports are implemented with stacked back panel connectors (black)
• Two high-current/fast-charging ports are implemented through stacked back p a nel
connectors (yellow)
• One port implemented in the PCI Express Half–Mini Card slot
• One port implemented in the PCI Express Full-/Half-Mini Card slot
The USB controller on the Intel NM10 Express Chipset provides a direct logical
connection to the USB ports on the back panel as well as on the PCI Express Mini Card
slots, and an indirect connection (through onboard USB hub) to the interna l USB
headers. All ten USB ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port ma y not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB c onnectors on the back panel Figure 12, page 46
The location of the front panel USB headers Figure 13, page 47
The board provides two SATA ports through the PCH, which support one device per
port:
• One internal SATA connector (black)
• One internal SATA connector (multiplexed with mSATA port , routed to PCI Express
Full-/Half-Mini Card slot) (gray)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using Windows operating systems.
The board has an internal SATA power connector and ships with a power cable for
powering internal SATA storage devices. The power cable includes:
• Right-angled 15-pin SATA female connector (for motherboard connectivity)
• 15-pin SATA female connector (for storage connectivity)
• Vertical 15-pin SATA female connector (for storage connectivity)
NOTE
Board power supplied through the SATA power connector is rated a t a ma ximum of:
• 1.0 A from 12 V rail
• 2.5 A from 5 V rail
• 0.5 A from 3.3 V rail
For information about Refer to
The location of the SA TA c onnectors Figure 13, page 47
1.7.1 AHCI Mode
The board support s AHCI storage mode via the Intel NM10 Express Chipset.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft Windows 7
includes the necessary AHCI drivers without the need to install separate AHCI drivers
during the operating system installation process, however, it is always good practice to
update the AHCI drivers to the latest available release.
28
Product Description
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the po w er supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5 V STBY rail.
NOTE
If the battery and AC po w er fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 15 shows the location of the battery.
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Two serial port headers
• One parallel port header with output only, bi-directional and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
The BIOS Setup program provides configuration options for the I /O controller.
1.9.1 Serial Ports
The serial ports, are implemented as two 10-pin headers on the board. The serial
ports support data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
1.9.2 Parallel Port
The location of the serial port headers Figure 13, page 47
The parallel port is implemented as a 26-pin header on the board. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port header Figure 13, page 47