Intel DH61AGL Specification
Intel® Desktop Board
DH61AGL
Technical Product Specification
September 2012
Part Number: G73643-001
The Intel Desktop Board DH61AGL may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH61AGL Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DH61AGL Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier
AGH6120H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2012, Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
September 2012
G71256-202
AGH6120H.86A.0011
1,2
Board Identification Information
Basic Desktop Board DH61AGL Identification Information
AA Revision BIOS Revision Notes
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H61 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel H61 Express Chipset B3 SLJ4B
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DH61AGL Technical Product Specification
iv
1
A description of the hardware used on Intel Desktop Board DH61AGL
2
A map of the resources of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DH61AGL.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH61AGL and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
Typographical Conventions
®
Desktop
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DH61AGL Technical Product Specification
Gb/s
Gigabits per second
kb/s
1000 bits per second
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
I/O Input/Output
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information .................................................................. iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Graphics Subsystem .............................................................. 17
1.4 System Memory ............................................................................... 18
1.4.1 Memory Configurations .......................................................... 19
®
1.5 Intel
1.5.1 Direct Media Interface (DMI) .................................................. 21
1.5.2 Display Interfaces ................................................................. 21
1.5.3 USB ..................................................................................... 24
1.5.4 SATA Interfaces .................................................................... 25
1.6 Real-Time Clock Subsystem ............................................................... 25
1.7 Legacy I/O Controller ........................................................................ 25
1.8 Audio Subsystem .............................................................................. 26
1.8.1 Audio Subsystem Software ..................................................... 26
1.8.2 Audio Connectors and Headers ................................................ 27
1.9 LAN Subsystem ................................................................................ 29
1.9.1 Intel
1.9.2 LAN Subsystem Software ....................................................... 30
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 30
1.10 Hardware Management Subsystem ..................................................... 31
1.10.1 Hardware Monitoring ............................................................. 31
1.10.2 Fan Monitoring ...................................................................... 31
1.10.3 Thermal Monitoring ............................................................... 32
1.11 Power Management .......................................................................... 33
1.11.1 ACPI .................................................................................... 33
1.11.2 Hardware Support ................................................................. 35
H61 Express Chipset ................................................................ 21
®
82579V Gigabit Ethernet Controller ................................ 29
vii
Intel Desktop Board DH61AGL Technical Product Specification
2 Technical Reference
2.1 Memory Resources ........................................................................... 39
2.1.1 Addressable Memory.............................................................. 39
2.1.2 Memory Map ......................................................................... 41
2.2 Connectors and Headers .................................................................... 41
2.2.1 Back Panel Connectors ........................................................... 42
2.2.2 Connectors and Headers ........................................................ 43
2.3 I/O Shield ........................................................................................ 54
2.4 Jumper Block ................................................................................... 55
2.5 Mechanical Considerations ................................................................. 57
2.5.1 Form Factor .......................................................................... 57
2.5.2 Board 3D View ...................................................................... 59
2.6 Electrical Considerations .................................................................... 60
2.6.1 Power Supply Considerations .................................................. 60
2.6.2 Fan Header Current Capability ................................................ 62
2.7 Thermal Considerations ..................................................................... 62
2.8 Reliability ........................................................................................ 65
2.9 Environmental .................................................................................. 65
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 67
3.2 BIOS Flash Memory Organization ........................................................ 68
3.3 Resource Configuration ..................................................................... 68
3.3.1 PCI Express Autoconfiguration ................................................ 68
3.4 System Management BIOS (SMBIOS) ................................................. 69
3.5 Legacy USB Support ......................................................................... 69
3.6 BIOS Updates .................................................................................. 70
3.6.1 Language Support ................................................................. 70
3.6.2 Custom Splash Screen ........................................................... 71
3.7 BIOS Recovery ................................................................................. 71
3.8 Boot Options .................................................................................... 72
3.8.1 Optical Drive Boot ................................................................. 72
3.8.2 Network Boot ........................................................................ 72
3.8.3 Booting Without Attached Devices ........................................... 72
3.8.4 Changing the Default Boot Device During POST ......................... 72
3.9 Adjusting Boot Speed ........................................................................ 73
3.9.1 Peripheral Selection and Configuration ..................................... 73
3.9.2 BIOS Boot Optimizations ........................................................ 73
3.10 BIOS Security Features ..................................................................... 74
3.11 BIOS Performance Features ............................................................... 75
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................. 77
4.3 Front-panel Power LED Blink Codes .....................................................
4.4 BIOS Error Messages ........................................................................ 78
4.5 Port 80h Power On Self Test (POST) Codes .......................................... 79
viii
78
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 85
5.1.1 Safety Standards................................................................... 85
5.1.2 European Union Declaration of Conformity Statement ................ 86
5.1.3 Product Ecology Statements ................................................... 87
5.1.4 China RoHS .......................................................................... 90
5.1.5 EMC Regulations ................................................................... 91
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 93
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 94
5.2 Battery Disposal Information .............................................................. 95
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 20
4. Flat Panel Interfaces ......................................................................... 22
5. Back Panel Audio Connectors ............................................................. 27
6. Internal Audio Headers and Connector ................................................ 28
7. LAN Connector LED Locations ............................................................. 30
8. Thermal Sensors and Fan Headers ...................................................... 32
9. Location of the Standby Power LED ..................................................... 38
10. Detailed System Memory Address Map ................................................ 40
11. Back Panel Connectors ...................................................................... 42
12. Connectors and Headers .................................................................... 43
13. Connection Diagram for Front Panel Header ......................................... 52
14. I/O Shield Reference Diagram ............................................................ 54
15. Location of the Jumper Block ............................................................. 55
16. Board Dimensions ............................................................................. 58
17. 3D View of Intel Desktop Board DH61AGL ........................................... 59
18. Localized High Temperature Zones ..................................................... 63
19. Intel Desktop Board DH61AGL China RoHS Material Self
Declaration Table .............................................................................. 90
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Supported Memory Configurations ...................................................... 18
4. Audio Jack Support ........................................................................... 26
5. LAN Connector LED States ................................................................. 30
6. Effects of Pressing the Power Switch ................................................... 33
7. Power States and Targeted System Power ........................................... 34
8. Wake-up Devices and Events ............................................................. 35
9. System Memory Map......................................................................... 41
10. Connectors and Headers Shown in Figure 12 ........................................
ix
44
Intel Desktop Board DH61AGL Technical Product Specification
11. Front Panel Audio Header for Intel HD Audio ........................................ 45
12. Front Panel Audio Header for AC ’97 Audio ........................................... 45
13. SATA Connectors .............................................................................. 45
14. PCI Express Half-Mini Card Connector ................................................. 46
15. SATA Power Connector ...................................................................... 47
16. Processor and System (4-Pin) Fan Headers .......................................... 48
17. Internal Stereo Speakers Connector .................................................... 48
18. DMIC Header ................................................................................... 48
19. Dual-Port Front Panel USB 2.0 Header (single key) ............................... 49
20. Dual-Port Front Panel USB 2.0 Headers (dual key) ................................ 49
21. Single-Port USB 2.0 Header ............................................................... 49
22. 40-Pin LVDS Connector ..................................................................... 50
23. 8-Pin FPD Brightness Connector ......................................................... 50
24. Backlight-off and Mute Header ........................................................... 51
25. System ID / Custom Solutions Header................................................. 51
26. Internal Power Supply Connector Pinout .............................................. 51
27. Front Panel Header ........................................................................... 52
28. States for a One-Color Power LED ....................................................... 53
29. States for a Two-Color Power LED....................................................... 53
30. BIOS Setup Configuration Jumper Settings .......................................... 56
31. Typical System-Level Power Consumption Figures ................................ 61
32. Fan Header Current Capability ............................................................ 62
33. Thermal Considerations for Components .............................................. 64
34. Tcontrol Values for Components ......................................................... 64
35. Environmental Specifications .............................................................. 65
36. BIOS Setup Program Menu Bar ........................................................... 68
37. BIOS Setup Program Function Keys .................................................... 68
38. Acceptable Drives/Media Types for BIOS Recovery ................................ 71
39. Boot Device Menu Options ................................................................. 72
40. Supervisor and User Password Functions ............................................. 74
41. BIOS Beep Codes ............................................................................. 77
42. Front-panel Power LED Blink Codes ..................................................... 78
43. BIOS Error Messages ........................................................................ 78
44. Port 80h POST Code Ranges .............................................................. 79
45. Port 80h POST Codes ........................................................................ 80
46. Typical Port 80h POST Sequence ........................................................ 84
47. Safety Standards
..............................................................................
48. EMC Regulations ............................................................................... 91
49. Regulatory Compliance Marks ............................................................ 94
85
x
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• 3rd generation Intel® Core processor family and 2nd generation Intel® Core
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
Intel
®
H61 Express Chipset consisting of the Intel® H61 Express Platform
• Integrated graphics support for processors with Intel® Graphics Technology:
• 2+2 Intel® High Definition (Intel® HD) audio via the Realtek* ALC662 audio
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
processor family processors with up to 65 W TDP in an LGA1155 socket
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
Memory
DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-
DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) JEDEC memory
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
Core processor family processors
Chipset
Controller Hub (PCH)
Graphics
― High Definition Multimedia Interface* (HDMI*)
― Internal flat panel display (LVDS)
Audio
codec
― In-chassis stereo speakers support (3 W/4 Ω via internal connector)
― DMIC digital microphone input (internal header)
― Analog stereo line-out (back panel jack)
― Analog line-in (back panel jack)
― Front panel Intel HD Audio/AC’97 headphones/mic support (internal
header)
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface
®
HD Graphics)
rd
generation Intel
continued
11
Intel Desktop Board DH61AGL Technical Product Specification
Chipset
Capabilities
and SMBIOS
PC Technology
Wake on PCI Express, LAN, front panel, and USB ports
®
Ethernet Controller
Legacy I/O Control
Nuvoton NCT6776D I/O controller for hardware management support
• Fan speed control
Table 1. Feature Summary (continued)
Peripheral
Interfaces
• USB 2.0 ports:
― Four ports implemented with stacked back panel connectors
― Five front panel ports implemented through three internal headers (two
dual and one single header)
― One port implemented in the PCI Express Half–Mini Card slot
• Serial ATA (SATA) ports:
― Two internal SATA 3.0 Gb/s interfaces through the Intel H61 Express
Expansion
BIOS
Instantly Available
LAN Support
Hardware Monitor
Subsystem
One PCI Express Half-Mini Card slot
®
• Intel
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Suspend to RAM support
•
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel
82579V Gigabit
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers
• Two fan sense inputs used to monitor fan activity
12
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DH61AGL.
Product Description
13
Figure 1. Major Board Components
Intel Desktop Board DH61AGL Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Battery
B Standby power LED
C Intel H61 Express Chipset
D Back panel connectors
E Internal power connector
F System fan header
G Single-port USB 2.0 header
H SATA 3.0 Gb/s connectors through the PCH
I SATA power connector
J Processor fan header
K BIOS Setup configuration jumper
L System ID / Custom Solutions header
M Front panel header
N Backlight off and mute header
O LVDS connector
P DDR3 SO-DIMM 2 socket
Q DDR3 SO-DIMM 1 socket
R FPD brightness connector
S Front panel dual-port USB 2.0 connector (single key)
T Front panel dual-port USB 2.0 connector (dual key)
U LGA1155 processor socket
V PCI Express Half-Mini Card connector
W DMIC header
X Internal stereo speakers connector
Y Front panel audio header
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DH61AGL Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH61AGL http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH61AGL
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
Thin Mini-ITX-based Computing http://www.intel.com/go/aio
http://ark.intel.com
025414.htm
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processor family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 65 W Thermal Design Power (TDP). The processors listed
above are only supported when falling within the wattage requirements of Intel
Desktop Board DH61AGL. See the Intel web site listed below for the most up-to-date
list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 60 for information on power supply requirements for this board.
16
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through the processor Intel HD Graphics.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
DirectX* 10.1, 10 and 9 support (3
rd
and 2nd generation Intel Core processor
families)
DirectX* 11 support (3
rd
generation Intel Core processor family)
OpenGL* 3.0 support
High-Definition content at up to 1080p resolution
Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
®
Intel
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
17
Intel Desktop Board DH61AGL Technical Product Specification
Raw Card
SO-DIMM
DRAM Device
DRAM
# of DRAM
1.4 System Memory
The board has two SO-DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts, with the option to raise
the voltage to support higher performance DDR3 SDRAM SO-DIMMs.
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs with the following restriction:
SO-DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM SO-DIMMs
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
processor family processors
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 3 lists the supported SO-DIMM configurations.
Table 3. Supported Memory Configurations
Version
A
B
C
F
Note: System memory configurations are based on availability and are subject to change.
Capacity
1 GB 1 Gb 64 M x 16 8
2 GB 2 Gb 128 M x 16 8
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
512 MB 1 Gb 64 M x 16 4
1 GB 2 Gb 128 M x 16 4
2 GB 1 Gb 128 M x 8 16
4 GB 2 Gb 256 M x 8 16
8 GB 4 Gb 512 M x 8 16
Technology
Organization
Devices
18
Product Description
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DH61AGL Technical Product Specification
Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration
20
Product Description
1.5 Intel® H61 Express Chipset
Intel H61 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and
Direct Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel H61 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel H61 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the
display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 High Definition Multimedia Interface (HDMI)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the
HDMI 1.4 specification.
21
Intel Desktop Board DH61AGL Technical Product Specification
A
FPD brightness connector
B
LVDS connector
C
Monitor-off and mute header
1.5.2.3 Flat Panel Display Interfaces
The board supports flat panel display via the LVDS connector. Figure 4 shows the flat
panel interfaces.
22
Item Description
Figure 4. Flat Panel Interfaces
Product Description
1.5.2.3.1 LVDS Interface
The LVDS flat panel display interface supports the following:
• 1920 x 1200 @ 60 Hz resolution
• Single-channel and dual-channel interface, up to 135 MHz clock rate 18 bpp and
24 bpp (VESA* and JEIDA mappings) color depth support
• Multiple EDID data source capability (panel, predefined, and custom payloads)
• 5 V flat panel display voltage with up to 3 A current
• 19 V backlight inverter voltage with up to 3 A current
• Backlight inverter signal redundancy on dedicated header as well as LVDS
connector (for discrete inverter or panel-integrated inverter support using a single
cable)
• Flat panel brightness control via front panel button input as well as Windows* 7
and Windows 8 “Screen brightness” adjustment slider
• Spread-spectrum control
1.5.2.3.2 Configuration Modes
For monitors attached to the HDMI ports video modes supported by this board are
based on the Extended Display Identification Data (EDID) protocol.
Video mode configuration for LVDS displays is supported as follows:
• Automatic panel identification via Extended Display Identification Data (EDID) for
panels with onboard EDID support
• Panel selection from common predefined panel types (without onboard EDID)
• Custom EDID payload installation for ultimate parameter flexibility, allowing
custom definition of EDID data on panels without onboard EDID
In addition, BIOS setup provides the following configuration parameters for internal
flat panel displays:
• All-In-One Chassis: allows the system integrator to choose between various All-In-
One chassis profiles for one step configuration of display panel settings.
• Flat Panel Configuration Changes: allows the system integrator to “lock” critical
settings of the LVDS configuration to avoid end users potentially rendering the
display unusable.
• Screen Brightness: allows the end user to set the screen brightness for the display
effective through the Power-On Self Test stage (such as while showing the splash
screen image and BIOS setup). Windows 7 and Windows 8 will ignore this setting
in favor of the native “screen brightness” control provided by the operating system.
• LVDS Interface Type: allows the system integrator to select whether the LVDS
panel is a single-channel or dual-channel display.
• Color Depth: allows the system integrator to select whether the panel is 24 bpp
with VESA color mapping, 24 bpp with JEIDA color mapping, or 18 bpp.
• Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.
• Maximum and Minimum Inverter Current Limit (%): allows the system integrator
to set maximum PWM%, as appropriate, according to the power requirements of
the internal flat panel display and the selected inverter board.
23
Intel Desktop Board DH61AGL Technical Product Specification
The location of the USB connectors on the back panel
Figure 11, page 42
• Panel Power Sequencing: allows the system integrator to adjust panel sequencing
parameters, if necessary.
• LVDS Spread Spectrum Control: allows the system integrator to adjust spread
spectrum for the LVDS interface.
NOTE
Support for flat panel display configuration complies with the following:
1. Internal flat panel display settings will not be overwritten by loading BIOS setup
defaults.
2. Internal flat panel display settings will be preserved across BIOS updates.
1.5.3 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.
The Intel H61 Express Chipset provides the USB controller. The port arrangement is
as follows:
• Four ports are implemented with stacked back panel connectors
• Five front panel ports implemented through three internal headers (two dual and
one single header)
• One port implemented in the PCI Express Half–Mini Card slot
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the front panel USB headers Figure 12, page 43
24
Product Description
1.5.4 SATA Interfaces
The board provides two SATA connectors, through the PCH, which support one device
each.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3.0 Gb/s. A point-to-point interface is used for host-to-device connections.
The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows operating systems.
For information about Refer to
The location of the SATA connectors Figure 12, page 43
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• Serial IRQ interface compatible with serialized IRQ support for PCI Express systems
• Intelligent power management, including a programmable wake-up event interface
• Fan control
The BIOS Setup program provides configuration options for the I/O controller.
25
Intel Desktop Board DH61AGL Technical Product Specification
Front panel – Green
Default
1.8 Audio Subsystem
The board supports Intel HD Audio via the Realtek ALC662 audio codec. The audio
subsystem supports the following features:
• Analog stereo line-out (back panel jack)
• Analog line-in (back panel jack)
• In-chassis stereo speakers support (3 W/4 Ω via internal connector)
• Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs and outputs
• DMIC interface (internal header), with support for mono and stereo digital
microphones
• Front panel HD Audio/AC’97 headphones/microphone support (internal header)
• Advanced jack sense for the back panel line-out jack that enables the audio codec
to recognize the connected device
• Microphone input jack that supports a single dynamic, condenser, or electret
microphone
• Windows 7 Ultimate and Windows 8 certification
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack Headphones Microphone Line Out Line In
Front panel – Pink Default
Back panel – Green (ctrl panel) (jack-detect)
Back panel – Pink Default
Internal Stereo
Speakers
Default
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
26
Product Description
A
Analog Line In
B
Analog Line Out
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors). The available configurable back panel audio connectors are shown in
Figure 5.
Item Description
Figure 5. Back Panel Audio Connectors
NOTE
The analog circuit of the back panel audio line out connector is designed to power
headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output.
27
Intel Desktop Board DH61AGL Technical Product Specification
A
Front panel audio header
B
Internal stereo speakers connector
C
DMIC header
Figure 4 shows the location of the internal audio headers and connector.
Item Description
Figure 6. Internal Audio Headers and Connector
For information about Refer to
The signal names of the front panel audio header and DMIC audio header Section 2.2.2.1, page 45
28
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel H61 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI bus power management
ACPI technology support
LAN wake capabilities
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.9.1 Intel® 82579V Gigabit Ethernet Controller
The Ethernet controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
PCI Express-based interface for active state operation (S0) state
SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
29
Intel Desktop Board DH61AGL Technical Product Specification
Green
100 Mb/s data rate is selected.
1.9.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 7).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 7. LAN Connector LED Locations
Error! Reference source not found. describes the LED states when the board is
powered up and the LAN subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected.
Yellow 1000 Mb/s data rate is selected.
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