Intel® Desktop Board
DH61AGL
Technical Product Specification
September 2012
Part Number: G73643-001
The Intel Desktop Board DH61AGL may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH61AGL Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DH61AGL Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier
AGH6120H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2012, Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
rd
generation Intel Core processor family, and 2nd generation Intel Core processor family are
September 2012
G71256-202
AGH6120H.86A.0011
1,2
Board Identification Information
Basic Desktop Board DH61AGL Identification Information
AA Revision BIOS Revision Notes
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H61 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel H61 Express Chipset B3 SLJ4B
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DH61AGL Technical Product Specification
iv
1
A description of the hardware used on Intel Desktop Board DH61AGL
2
A map of the resources of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DH61AGL.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH61AGL and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
Typographical Conventions
®
Desktop
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DH61AGL Technical Product Specification
Gb/s
Gigabits per second
kb/s
1000 bits per second
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
I/O Input/Output
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information .................................................................. iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support ................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Graphics Subsystem .............................................................. 17
1.4 System Memory ............................................................................... 18
1.4.1 Memory Configurations .......................................................... 19
®
1.5 Intel
1.5.1 Direct Media Interface (DMI) .................................................. 21
1.5.2 Display Interfaces ................................................................. 21
1.5.3 USB ..................................................................................... 24
1.5.4 SATA Interfaces .................................................................... 25
1.6 Real-Time Clock Subsystem ............................................................... 25
1.7 Legacy I/O Controller ........................................................................ 25
1.8 Audio Subsystem .............................................................................. 26
1.8.1 Audio Subsystem Software ..................................................... 26
1.8.2 Audio Connectors and Headers ................................................ 27
1.9 LAN Subsystem ................................................................................ 29
1.9.1 Intel
1.9.2 LAN Subsystem Software ....................................................... 30
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 30
1.10 Hardware Management Subsystem ..................................................... 31
1.10.1 Hardware Monitoring ............................................................. 31
1.10.2 Fan Monitoring ...................................................................... 31
1.10.3 Thermal Monitoring ............................................................... 32
1.11 Power Management .......................................................................... 33
1.11.1 ACPI .................................................................................... 33
1.11.2 Hardware Support ................................................................. 35
H61 Express Chipset ................................................................ 21
®
82579V Gigabit Ethernet Controller ................................ 29
vii
Intel Desktop Board DH61AGL Technical Product Specification
2 Technical Reference
2.1 Memory Resources ........................................................................... 39
2.1.1 Addressable Memory.............................................................. 39
2.1.2 Memory Map ......................................................................... 41
2.2 Connectors and Headers .................................................................... 41
2.2.1 Back Panel Connectors ........................................................... 42
2.2.2 Connectors and Headers ........................................................ 43
2.3 I/O Shield ........................................................................................ 54
2.4 Jumper Block ................................................................................... 55
2.5 Mechanical Considerations ................................................................. 57
2.5.1 Form Factor .......................................................................... 57
2.5.2 Board 3D View ...................................................................... 59
2.6 Electrical Considerations .................................................................... 60
2.6.1 Power Supply Considerations .................................................. 60
2.6.2 Fan Header Current Capability ................................................ 62
2.7 Thermal Considerations ..................................................................... 62
2.8 Reliability ........................................................................................ 65
2.9 Environmental .................................................................................. 65
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 67
3.2 BIOS Flash Memory Organization ........................................................ 68
3.3 Resource Configuration ..................................................................... 68
3.3.1 PCI Express Autoconfiguration ................................................ 68
3.4 System Management BIOS (SMBIOS) ................................................. 69
3.5 Legacy USB Support ......................................................................... 69
3.6 BIOS Updates .................................................................................. 70
3.6.1 Language Support ................................................................. 70
3.6.2 Custom Splash Screen ........................................................... 71
3.7 BIOS Recovery ................................................................................. 71
3.8 Boot Options .................................................................................... 72
3.8.1 Optical Drive Boot ................................................................. 72
3.8.2 Network Boot ........................................................................ 72
3.8.3 Booting Without Attached Devices ........................................... 72
3.8.4 Changing the Default Boot Device During POST ......................... 72
3.9 Adjusting Boot Speed ........................................................................ 73
3.9.1 Peripheral Selection and Configuration ..................................... 73
3.9.2 BIOS Boot Optimizations ........................................................ 73
3.10 BIOS Security Features ..................................................................... 74
3.11 BIOS Performance Features ............................................................... 75
4 Error Messages and Beep Codes
4.1 Speaker .......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................. 77
4.3 Front-panel Power LED Blink Codes .....................................................
4.4 BIOS Error Messages ........................................................................ 78
4.5 Port 80h Power On Self Test (POST) Codes .......................................... 79
viii
78
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 85
5.1.1 Safety Standards................................................................... 85
5.1.2 European Union Declaration of Conformity Statement ................ 86
5.1.3 Product Ecology Statements ................................................... 87
5.1.4 China RoHS .......................................................................... 90
5.1.5 EMC Regulations ................................................................... 91
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 93
5.1.7 Regulatory Compliance Marks (Board Level) ............................. 94
5.2 Battery Disposal Information .............................................................. 95
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 20
4. Flat Panel Interfaces ......................................................................... 22
5. Back Panel Audio Connectors ............................................................. 27
6. Internal Audio Headers and Connector ................................................ 28
7. LAN Connector LED Locations ............................................................. 30
8. Thermal Sensors and Fan Headers ...................................................... 32
9. Location of the Standby Power LED ..................................................... 38
10. Detailed System Memory Address Map ................................................ 40
11. Back Panel Connectors ...................................................................... 42
12. Connectors and Headers .................................................................... 43
13. Connection Diagram for Front Panel Header ......................................... 52
14. I/O Shield Reference Diagram ............................................................ 54
15. Location of the Jumper Block ............................................................. 55
16. Board Dimensions ............................................................................. 58
17. 3D View of Intel Desktop Board DH61AGL ........................................... 59
18. Localized High Temperature Zones ..................................................... 63
19. Intel Desktop Board DH61AGL China RoHS Material Self
Declaration Table .............................................................................. 90
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Supported Memory Configurations ...................................................... 18
4. Audio Jack Support ........................................................................... 26
5. LAN Connector LED States ................................................................. 30
6. Effects of Pressing the Power Switch ................................................... 33
7. Power States and Targeted System Power ........................................... 34
8. Wake-up Devices and Events ............................................................. 35
9. System Memory Map......................................................................... 41
10. Connectors and Headers Shown in Figure 12 ........................................
ix
44
Intel Desktop Board DH61AGL Technical Product Specification
11. Front Panel Audio Header for Intel HD Audio ........................................ 45
12. Front Panel Audio Header for AC ’97 Audio ........................................... 45
13. SATA Connectors .............................................................................. 45
14. PCI Express Half-Mini Card Connector ................................................. 46
15. SATA Power Connector ...................................................................... 47
16. Processor and System (4-Pin) Fan Headers .......................................... 48
17. Internal Stereo Speakers Connector .................................................... 48
18. DMIC Header ................................................................................... 48
19. Dual-Port Front Panel USB 2.0 Header (single key) ............................... 49
20. Dual-Port Front Panel USB 2.0 Headers (dual key) ................................ 49
21. Single-Port USB 2.0 Header ............................................................... 49
22. 40-Pin LVDS Connector ..................................................................... 50
23. 8-Pin FPD Brightness Connector ......................................................... 50
24. Backlight-off and Mute Header ........................................................... 51
25. System ID / Custom Solutions Header................................................. 51
26. Internal Power Supply Connector Pinout .............................................. 51
27. Front Panel Header ........................................................................... 52
28. States for a One-Color Power LED ....................................................... 53
29. States for a Two-Color Power LED....................................................... 53
30. BIOS Setup Configuration Jumper Settings .......................................... 56
31. Typical System-Level Power Consumption Figures ................................ 61
32. Fan Header Current Capability ............................................................ 62
33. Thermal Considerations for Components .............................................. 64
34. Tcontrol Values for Components ......................................................... 64
35. Environmental Specifications .............................................................. 65
36. BIOS Setup Program Menu Bar ........................................................... 68
37. BIOS Setup Program Function Keys .................................................... 68
38. Acceptable Drives/Media Types for BIOS Recovery ................................ 71
39. Boot Device Menu Options ................................................................. 72
40. Supervisor and User Password Functions ............................................. 74
41. BIOS Beep Codes ............................................................................. 77
42. Front-panel Power LED Blink Codes ..................................................... 78
43. BIOS Error Messages ........................................................................ 78
44. Port 80h POST Code Ranges .............................................................. 79
45. Port 80h POST Codes ........................................................................ 80
46. Typical Port 80h POST Sequence ........................................................ 84
47. Safety Standards
..............................................................................
48. EMC Regulations ............................................................................... 91
49. Regulatory Compliance Marks ............................................................ 94
85
x
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• 3rd generation Intel® Core processor family and 2nd generation Intel® Core
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
Intel
®
H61 Express Chipset consisting of the Intel® H61 Express Platform
• Integrated graphics support for processors with Intel® Graphics Technology:
• 2+2 Intel® High Definition (Intel® HD) audio via the Realtek* ALC662 audio
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
processor family processors with up to 65 W TDP in an LGA1155 socket
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
Memory
DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SO-
DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) JEDEC memory
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
Core processor family processors
Chipset
Controller Hub (PCH)
Graphics
― High Definition Multimedia Interface* (HDMI*)
― Internal flat panel display (LVDS)
Audio
codec
― In-chassis stereo speakers support (3 W/4 Ω via internal connector)
― DMIC digital microphone input (internal header)
― Analog stereo line-out (back panel jack)
― Analog line-in (back panel jack)
― Front panel Intel HD Audio/AC’97 headphones/mic support (internal
header)
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface
®
HD Graphics)
rd
generation Intel
continued
11
Intel Desktop Board DH61AGL Technical Product Specification
Chipset
Capabilities
and SMBIOS
PC Technology
Wake on PCI Express, LAN, front panel, and USB ports
®
Ethernet Controller
Legacy I/O Control
Nuvoton NCT6776D I/O controller for hardware management support
• Fan speed control
Table 1. Feature Summary (continued)
Peripheral
Interfaces
• USB 2.0 ports:
― Four ports implemented with stacked back panel connectors
― Five front panel ports implemented through three internal headers (two
dual and one single header)
― One port implemented in the PCI Express Half–Mini Card slot
• Serial ATA (SATA) ports:
― Two internal SATA 3.0 Gb/s interfaces through the Intel H61 Express
Expansion
BIOS
Instantly Available
LAN Support
Hardware Monitor
Subsystem
One PCI Express Half-Mini Card slot
®
• Intel
BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Suspend to RAM support
•
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel
82579V Gigabit
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers
• Two fan sense inputs used to monitor fan activity
12
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DH61AGL.
Product Description
13
Figure 1. Major Board Components
Intel Desktop Board DH61AGL Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Battery
B Standby power LED
C Intel H61 Express Chipset
D Back panel connectors
E Internal power connector
F System fan header
G Single-port USB 2.0 header
H SATA 3.0 Gb/s connectors through the PCH
I SATA power connector
J Processor fan header
K BIOS Setup configuration jumper
L System ID / Custom Solutions header
M Front panel header
N Backlight off and mute header
O LVDS connector
P DDR3 SO-DIMM 2 socket
Q DDR3 SO-DIMM 1 socket
R FPD brightness connector
S Front panel dual-port USB 2.0 connector (single key)
T Front panel dual-port USB 2.0 connector (dual key)
U LGA1155 processor socket
V PCI Express Half-Mini Card connector
W DMIC header
X Internal stereo speakers connector
Y Front panel audio header
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DH61AGL Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH61AGL http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH61AGL
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
Thin Mini-ITX-based Computing http://www.intel.com/go/aio
http://ark.intel.com
025414.htm
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processor family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 65 W Thermal Design Power (TDP). The processors listed
above are only supported when falling within the wattage requirements of Intel
Desktop Board DH61AGL. See the Intel web site listed below for the most up-to-date
list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 60 for information on power supply requirements for this board.
16
Product Description
1.3.1 Graphics Subsystem
The board supports graphics through the processor Intel HD Graphics.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.3.1.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
• 3D Features
• Video
FDI) for processors with Intel HD Graphics.
DirectX* 10.1, 10 and 9 support (3
rd
and 2nd generation Intel Core processor
families)
DirectX* 11 support (3
rd
generation Intel Core processor family)
OpenGL* 3.0 support
High-Definition content at up to 1080p resolution
Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
®
Intel
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
17
Intel Desktop Board DH61AGL Technical Product Specification
Raw Card
SO-DIMM
DRAM Device
DRAM
# of DRAM
1.4 System Memory
The board has two SO-DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts, with the option to raise
the voltage to support higher performance DDR3 SDRAM SO-DIMMs.
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs with the following restriction:
SO-DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 1 GB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM SO-DIMMs
Note: DDR3 1600 MHz SO-DIMMs are only supported by 3
processor family processors
rd
generation Intel Core
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 3 lists the supported SO-DIMM configurations.
Table 3. Supported Memory Configurations
Version
A
B
C
F
Note: System memory configurations are based on availability and are subject to change.
Capacity
1 GB 1 Gb 64 M x 16 8
2 GB 2 Gb 128 M x 16 8
1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
512 MB 1 Gb 64 M x 16 4
1 GB 2 Gb 128 M x 16 4
2 GB 1 Gb 128 M x 8 16
4 GB 2 Gb 256 M x 8 16
8 GB 4 Gb 512 M x 8 16
Technology
Organization
Devices
18
Product Description
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
1.4.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DH61AGL Technical Product Specification
Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration
20
Product Description
1.5 Intel® H61 Express Chipset
Intel H61 Express Chipset with Intel Flexible Display Interconnect (Intel FDI) and
Direct Media Interface (DMI) interconnect provides interfaces to the processor and the
display, USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel H61 Express
Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel H61 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allowing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports.
The PCH receives the display data over Intel FDI and transcodes the data as per the
display technology protocol and sends the data through the display interface.
1.5.2.1 Intel
Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the display monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 High Definition Multimedia Interface (HDMI)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the
HDMI 1.4 specification.
21
Intel Desktop Board DH61AGL Technical Product Specification
A
FPD brightness connector
B
LVDS connector
C
Monitor-off and mute header
1.5.2.3 Flat Panel Display Interfaces
The board supports flat panel display via the LVDS connector. Figure 4 shows the flat
panel interfaces.
22
Item Description
Figure 4. Flat Panel Interfaces
Product Description
1.5.2.3.1 LVDS Interface
The LVDS flat panel display interface supports the following:
• 1920 x 1200 @ 60 Hz resolution
• Single-channel and dual-channel interface, up to 135 MHz clock rate 18 bpp and
24 bpp (VESA* and JEIDA mappings) color depth support
• Multiple EDID data source capability (panel, predefined, and custom payloads)
• 5 V flat panel display voltage with up to 3 A current
• 19 V backlight inverter voltage with up to 3 A current
• Backlight inverter signal redundancy on dedicated header as well as LVDS
connector (for discrete inverter or panel-integrated inverter support using a single
cable)
• Flat panel brightness control via front panel button input as well as Windows* 7
and Windows 8 “Screen brightness” adjustment slider
• Spread-spectrum control
1.5.2.3.2 Configuration Modes
For monitors attached to the HDMI ports video modes supported by this board are
based on the Extended Display Identification Data (EDID) protocol.
Video mode configuration for LVDS displays is supported as follows:
• Automatic panel identification via Extended Display Identification Data (EDID) for
panels with onboard EDID support
• Panel selection from common predefined panel types (without onboard EDID)
• Custom EDID payload installation for ultimate parameter flexibility, allowing
custom definition of EDID data on panels without onboard EDID
In addition, BIOS setup provides the following configuration parameters for internal
flat panel displays:
• All-In-One Chassis: allows the system integrator to choose between various All-In-
One chassis profiles for one step configuration of display panel settings.
• Flat Panel Configuration Changes: allows the system integrator to “lock” critical
settings of the LVDS configuration to avoid end users potentially rendering the
display unusable.
• Screen Brightness: allows the end user to set the screen brightness for the display
effective through the Power-On Self Test stage (such as while showing the splash
screen image and BIOS setup). Windows 7 and Windows 8 will ignore this setting
in favor of the native “screen brightness” control provided by the operating system.
• LVDS Interface Type: allows the system integrator to select whether the LVDS
panel is a single-channel or dual-channel display.
• Color Depth: allows the system integrator to select whether the panel is 24 bpp
with VESA color mapping, 24 bpp with JEIDA color mapping, or 18 bpp.
• Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.
• Maximum and Minimum Inverter Current Limit (%): allows the system integrator
to set maximum PWM%, as appropriate, according to the power requirements of
the internal flat panel display and the selected inverter board.
23
Intel Desktop Board DH61AGL Technical Product Specification
The location of the USB connectors on the back panel
Figure 11, page 42
• Panel Power Sequencing: allows the system integrator to adjust panel sequencing
parameters, if necessary.
• LVDS Spread Spectrum Control: allows the system integrator to adjust spread
spectrum for the LVDS interface.
NOTE
Support for flat panel display configuration complies with the following:
1. Internal flat panel display settings will not be overwritten by loading BIOS setup
defaults.
2. Internal flat panel display settings will be preserved across BIOS updates.
1.5.3 USB
The PCH contains up to two Enhanced Host Controller Interface (EHCI) host controllers
that support USB high-speed signaling. High-speed USB 2.0 allows data transfers up to
480 Mb/s. All ports are high-speed, full-speed, and low-speed capable.
The Intel H61 Express Chipset provides the USB controller. The port arrangement is
as follows:
• Four ports are implemented with stacked back panel connectors
• Five front panel ports implemented through three internal headers (two dual and
one single header)
• One port implemented in the PCI Express Half–Mini Card slot
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the front panel USB headers Figure 12, page 43
24
Product Description
1.5.4 SATA Interfaces
The board provides two SATA connectors, through the PCH, which support one device
each.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3.0 Gb/s. A point-to-point interface is used for host-to-device connections.
The PCH supports the Serial ATA Specification, Revision 3.0. The PCH also supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0
Specification, Revision 1.0 (AHCI support is required for some elements).
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows operating systems.
For information about Refer to
The location of the SATA connectors Figure 12, page 43
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The I/O controller provides the following features:
• Serial IRQ interface compatible with serialized IRQ support for PCI Express systems
• Intelligent power management, including a programmable wake-up event interface
• Fan control
The BIOS Setup program provides configuration options for the I/O controller.
25
Intel Desktop Board DH61AGL Technical Product Specification
Front panel – Green
Default
1.8 Audio Subsystem
The board supports Intel HD Audio via the Realtek ALC662 audio codec. The audio
subsystem supports the following features:
• Analog stereo line-out (back panel jack)
• Analog line-in (back panel jack)
• In-chassis stereo speakers support (3 W/4 Ω via internal connector)
• Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs and outputs
• DMIC interface (internal header), with support for mono and stereo digital
microphones
• Front panel HD Audio/AC’97 headphones/microphone support (internal header)
• Advanced jack sense for the back panel line-out jack that enables the audio codec
to recognize the connected device
• Microphone input jack that supports a single dynamic, condenser, or electret
microphone
• Windows 7 Ultimate and Windows 8 certification
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack Headphones Microphone Line Out Line In
Front panel – Pink Default
Back panel – Green (ctrl panel) (jack-detect)
Back panel – Pink Default
Internal Stereo
Speakers
Default
1.8.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
26
Product Description
A
Analog Line In
B
Analog Line Out
1.8.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include front panel
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio
connectors). The available configurable back panel audio connectors are shown in
Figure 5.
Item Description
Figure 5. Back Panel Audio Connectors
NOTE
The analog circuit of the back panel audio line out connector is designed to power
headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output.
27
Intel Desktop Board DH61AGL Technical Product Specification
A
Front panel audio header
B
Internal stereo speakers connector
C
DMIC header
Figure 4 shows the location of the internal audio headers and connector.
Item Description
Figure 6. Internal Audio Headers and Connector
For information about Refer to
The signal names of the front panel audio header and DMIC audio header Section 2.2.2.1, page 45
28
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel H61 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI bus power management
ACPI technology support
LAN wake capabilities
• ACPI technology support
• LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.9.1 Intel® 82579V Gigabit Ethernet Controller
The Ethernet controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle [LPI] mode)
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
PCI Express-based interface for active state operation (S0) state
SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
29
Intel Desktop Board DH61AGL Technical Product Specification
Green
100 Mb/s data rate is selected.
1.9.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.9.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 7).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 7. LAN Connector LED Locations
Error! Reference source not found. describes the LED states when the board is
powered up and the LAN subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mb/s data rate is selected.
Yellow 1000 Mb/s data rate is selected.
30
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton
NCT6776D device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, 3.3 Vstandby, V_SM, +VCCP,
PCH VCC
• SMBus interface
and
1.10.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.11.2.1, page 36
31
Intel Desktop Board DH61AGL Technical Product Specification
A
Thermal diode, located on the Intel H61 PCH
B
System fan header
C
Processor fan header
D
Thermal sensor for system temperature
E
Thermal sensor for the processor voltage regulator
F
Thermal diode, located on the processor die
1.10.3 Thermal Monitoring
Figure 8 shows the locations of the thermal sensors and fan headers.
Item Description
Figure 8. Thermal Sensors and Fan Headers
32
Product Description
If the system is in this
state…
…and the power switch is
pressed for
…the system enters this state
Off
(ACPI G2/G5 – Soft off)
Less than four seconds
Power-on
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Less than four seconds
Soft-off/Standby
(ACPI G1 – sleeping state)
On
(ACPI G0 – working state)
More than six seconds
Fail safe power-off
(ACPI G2/G5 – Soft off)
Sleep
(ACPI G1 – sleeping state)
Less than four seconds
Wake-up
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
More than six seconds
Power-off
(ACPI G2/G5 – Soft off)
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
PCI Express WAKE# signal support
Wake from S5
+5 V Standby Power Indicator LED
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 35)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
33
Intel Desktop Board DH61AGL Technical Product Specification
G1 – sleeping
S3 – Suspend to
No power
D3 – no power
Power < 5 W
(Note 2)
1.11.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power
Global States Sleeping States
G0 – working
state
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
S0 – working C0 – working D0 – working
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
Context not saved.
Cold boot is
required.
No power to the
system.
Processor
States
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
except for
wake-up logic.
except for
wake-up logic.
except for
wake-up logic.
wake-up logic,
except when
provided by
battery or
external source.
Targeted System
Power
Full power > 30 W
Power < 5 W
Power < 5 W
No power to the system.
Service can be performed
safely.
(Note 1)
(Note 2)
(Note 2)
34
Product Description
These devices/events can wake up the computer…
…from this state
Power switch
S3, S4, S5
(
Note)
S3, S4, S5
(Note)
LAN
S3, S4, S5
(Note)
USB
S3
(Note)
1.11.1.2 Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events
RTC alarm
WAKE#
Note: S4 implies operating system support only.
NOTE
S3, S4, S5
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
1.11.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PCI Express WAKE# signal support
• Wake from S5
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
35
Intel Desktop Board DH61AGL Technical Product Specification
The signal names of the internal power connector
Table 26, page 51
1.11.2.1 Power Input
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the internal power connector Figure 12, page 43
1.11.2.2 Fan Headers
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state
• The fans are off when the board is off or in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• The fan headers are controlled by Pulse Width Modulation
For information about Refer to
The location of the fan headers Figure 12, page 43
The location of the fan headers and sensors for thermal monitoring Figure 8, page 32
1.11.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• By Ping
• Magic Packet
• The onboard LAN subsystem
36
Product Description
1.11.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must
be capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing Instantly Available PC technology can damage the
power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 35 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI Express add-in cards and drivers.
1.11.2.5 Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.11.2.6 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S3, S4, or S5 state.
1.11.2.7 Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake
from an ACPI S5 state.
37
Intel Desktop Board DH61AGL Technical Product Specification
1.11.2.8 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 9 shows the location of the standby power LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 9. Location of the Standby Power LED
38
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Express configuration space, BIOS (SPI Flash device), and
chipset overhead resides above the top of DRAM (total system memory). On a system
that has 16 GB of system memory installed, it is not possible to use all of the installed
memory due to system address space being allocated for other system critical
functions. These functions include the following:
• BIOS/SPI Flash device (96 Mb)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards
(256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 10 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
39
Intel Desktop Board DH61AGL Technical Product Specification
Figure 10. Detailed System Memory Address Map
40
2.1.2 Memory Map
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 16777216 K 100000 – 400000000 16382 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Technical Reference
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
memory manager software)
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• On-board I/O connectors and headers
41
Intel Desktop Board DH61AGL Technical Product Specification
A
19 V DC input jack
B
USB ports
C
HDMI connector
D
LAN port
E
Analog line-in
F
Analog line-out
2.2.1 Back Panel Connectors
Figure 11 shows the location of the back panel connectors for the board.
Item Description
Figure 11. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
42
Technical Reference
2.2.2 Connectors and Headers
Figure 12 shows the locations of the connectors and headers on Intel Desktop Board
DH61AGL.
43
Figure 12. Connectors and Headers
Intel Desktop Board DH61AGL Technical Product Specification
Table 10 lists the connectors and headers identified in Figure 12.
Table 10. Connectors and Headers Shown in Figure 12
Item/callout
from Figure 12
A Internal power connector Molex* 5566-2 Molex 5557-02R
B System fan header 4-wire fan
C Single-port USB 2.0 header 1x5, 2.54mm-pitch
D SATA 3.0 Gb/s connectors 7-pin SATA
E SATA power connector 15-pin SATA
F Processor fan header 4-wire fan
G System ID / Custom Solutions
H Front panel header 2x5, 2.54mm-pitch
I Backlight off and mute header 1x2, 2.54mm-pitch
J LVDS connector
K FPD brightness connector Foxconn* HF5508 JWT* A2001H02-8P
L Front panel dual-port USB header
M Front panel dual-port USB header
N PCI Express Half-Mini Card
O DMIC header 1x5, 2.54mm-pitch
P Internal stereo speakers connector JS*-1125-04 JWT* A2001H02-4P
Q Front panel audio header 2x5, 2.54mm-pitch
Connector Information
Description Board Connector Mating Plug
header
ACES* 88341-40
(single key)
(dual key)
connector
2x5, 2.00mm-pitch
ACES 88441-40
Starconn* 107F40
2x5, 2.54mm-pitch
2x5, 2.54mm-pitch
44
Technical Reference
3
[Port 1] Right channel
4
PRESENCE# (Dongle present)
1
Ground
2
TXP 3 TXN 4 Ground
5
RXN 6 RXP 7 Ground
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. Front Panel Audio Header for Intel HD Audio
Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 12. Front Panel Audio Header for AC ’97 Audio
Pin Signal Name Pin Signal Name
1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 AUD_5V 8 KEY (no pin)
9 FP_OUT_L 10 FP_RETURN_L
Table 13. SATA Connectors
Pin Signal Name
45
Intel Desktop Board DH61AGL Technical Product Specification
Table 14. PCI Express Half-Mini Card Connector
Pin Signal Name
1 WAKE#
2 +3.3 V aux
3 Reserved
4 GND
5 Reserved
6 1.5 V
7 CLKREQ#
8 Reserved
9 GND
10 Reserved
11 REFCLK-
12 Reserved
13 REFCLK+
14 Reserved
15 GND
16 Reserved
17 Reserved
18 GND
19 Reserved
20 Reserved
21 GND
22 PERST#
23 PERn0
24 +3.3 V aux
25 PERp0
26 GND
27 GND
28 +1.5 V
29 GND
30 SMB_CLK
31 PETn0
32 SMB_DATA
33 PETp0
34 GND
35 GND
36 USB_D-
37 GND
38 USB_D+
continued
46
Table 14. PCI Express Half-Mini Card Connector (continued)
8
5 V DC
12
Ground
Pin Signal Name
39 +3.3 V aux
40 GND
41 +3.3 V aux
42 LED_WWAN#
43 Reserved
44 LED_WLAN#
45 Reserved
46 LED_WPAN#
47 Reserved
48 +1.5V
49 Reserved
50 GND
51 Reserved
52 +3.3 V aux
Technical Reference
Table 15. SATA Power Connector
Pin Signal Name
1 3.3 V DC
2 3.3 V DC
3 3.3 V DC
4 Ground
5 Ground
6 Ground
7 5 V DC
9 5 V DC
10 Ground
11 Ground
13 12 V DC
14 12 V DC
15 12 V DC
47
Intel Desktop Board DH61AGL Technical Product Specification
(Note)
4
DMIC_CLK
DMIC clock signal
Table 16. Processor and System
(4-Pin) Fan Headers
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
Table 17. Internal Stereo Speakers Connector
Pin Signal Name Description
1 Front_L− Analog front left (differential negative)
2 Front_L+ Analog front left (differential positive)
3 Front_R+ Analog front right (differential positive)
4 Front_R− Analog front right (differential negative)
Table 18. DMIC Header
Pin Signal Name Description
1 +3.3 V 3.3 V power (for DMIC module)
2 DMIC_DATA DMIC data signal
3 GND Ground
5 Key (no pin) Key (no pin)
48
Table 19. Dual-Port Front Panel USB 2.0 Header (single key)
5
D+ 6 D+
Pin Signal Name Pin Signal Name
1 +5 V DC 2 +5 V DC
3 D− 4 D−
5 D+ 6 D+
7 Ground 8 Ground
9 KEY (no pin) 10 Serial POST
Notes: The +5 V DC power on the USB headers is fused.
The Serial POST pin is reserved for compatibility with future POST debug cards
Table 20. Dual-Port Front Panel USB 2.0 Headers (dual key)
Pin Signal Name Pin Signal Name
1 +5 V DC 2 +5 V DC
3 D− 4 D−
Technical Reference
7 Ground 8 Ground
9 KEY (no pin) 10 KEY (no pin)
Note: The +5 V DC power on the USB headers is fused.
Table 21. Single-Port USB 2.0 Header
Pin Signal Name
1 +5 V DC
2 D−
3 D+
4 Ground
5 Key (no pin)
Note: The +5 V DC power on the USB headers is fused.
49
Intel Desktop Board DH61AGL Technical Product Specification
3
BKLT_PWR (19 V)
Backlight inverter power
Table 22. 40-Pin LVDS Connector
Pin Signal Name Pin Signal Name
1 ODD_Lane3_P 21 N/C
2 ODD_Lane3_N 22 EDID_3.3 V
3 ODD_Lane2_P 23 LCD_GND
4 ODD_Lane2_N 24 LCD_GND
5 ODD_Lane1_P 25 LCD_GND
6 ODD_Lane1_N 26 ODD_CLK_P
7 ODD_Lane0_P 27 ODD_CLK_N
8 ODD_Lane0_N 28 BKLT_GND
9 EVEN_Lane3_P 29 BKLT_GND
10 EVEN_Lane3_N 30 BKLT_GND
11 EVEN_Lane2_P 31 EDID_CLK
12 EVEN_Lane2_N 32 BKLT_ENABLE
13 EVEN_Lane1_P 33 BKLT_PWM_DIM
14 EVEN_Lane1_N 34 EVEN_CLK_P
15 EVEN_Lane0_P 35 EVEN_CLK_N
16 EVEN_Lane0_N 36 BKLT_PWR (19 V)
17 EDID_GND 37 BKLT_PWR (19 V)
18 LCD_VCC (5 V) 38 BKLT_PWR (19 V)
19 LCD_VCC (5 V) 39 N/C
20 LCD_VCC (5 V) 40 EDID_DATA
NOTE
LVDS single-channel output is driven from the ODD signals.
Table 23. 8-Pin FPD Brightness Connector
Pin Signal Name Description
1 BKLT_EN Backlight enable
2 BKLT_PWM Backlight control
4 BKLT_PWR (19 V) Backlight inverter power
5 BKLT_GND/Brightness_GND Ground (shared)
6 BKLT_GND/Brightness_GND Ground (shared)
7 Brightness_Up Panel brightness increase
8 Brightness_Down Panel brightness decrease
50
5
+3.3 VSB
6
SMB_Data
Table 24. Backlight-off and Mute Header
Pin Signal Name Description
1 BKLT_OFF Backlight-off and mute signal
2 GND Ground
Table 25. System ID / Custom Solutions Header
Pin Signal Name Pin Signal Name
1 Prog_LED 2 Ground
3 Key (no pin) 4 SMB_CLK
7 PWRBTN# 8 HDM CEC
9 +5 VSB 10 SCI/SMI GPI
2.2.2.2 Add-in Card Connectors
Technical Reference
The board has a PCI Express Half-Mini Card slot.
2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
• External Power Supply – the board can be powered through a 19 V DC
connector on the back panel. The back panel DC connector is compatible with a
7.4 mm/OD (outer diameter) and 5.1 mm/ID (inner diameter) plug, where the
inner contact is +19 (±10%) V DC and the shell is GND. The maximum current
rating is 12 A.
• Internal Power Supply – the board can alternatively be powered via the internal
19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (±10%) VDC.
The maximum current rating for this connector is 9 A.
Table 26. Internal Power Supply Connector Pinout
Pin Signal Name
1 Ground
2 DC input: +8 (±10%) through +19 (±10%) VDC
For information about Refer to
Power supply considerations Section 2.6.1, page 60
51
Intel Desktop Board DH61AGL Technical Product Specification
2.2.2.4 Front Panel Header
This section describes the functions of the front panel header. Table 27 lists the signal
names of the front panel header. Figure 13 is a connection diagram for the front panel
header.
Table 27. Front Panel Header
Pin Signal Name Description Pin Signal Name Description
1 HDD_POWER_LED Pull-up resistor
(750 Ω) to +5V
3 HDD_LED# [Out] Hard disk
activity LED
5 GROUND Ground 6 POWER_SWITCH# [In] Power switch
7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground
9 +5V_DC Power 10 Key No pin
2 POWER_LED_MAIN [Out] Front panel LED
(main color)
4 POWER_LED_ALT [Out] Front panel LED
(alt color)
Figure 13. Connection Diagram for Front Panel Header
2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires a SATA hard
drive or optical drive connected to an onboard SATA connector.
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
52
Technical Reference
Off
Power off
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 28 shows the
possible states for a one-color LED. Table 29 shows the possible states for a two-color
LED.
Table 28. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 29. States for a Two-Color Power LED
LED State Description
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 28 and Table 29 are suggested colors only. Actual LED colors
are chassis-specific.
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.5 System ID / Custom Solutions Header
The System ID / Customs Solution header is provided for future support of All-In-One
chassis detection and to aid customers in developing custom applications.
• Prog_LED#: general purpose signal output that indicates when an event was
triggered by the operating system. Signal is amplified by a transistor. Intel can
provide sample code for customers who may want to write their own applications
leveraging this signal.
• SMB_CLK and SMB_DATA: SMBus interface, reserved for future support of All-In-
One chassis detection. General SMBus information can be found on the platform
EDS and at http://smbus.org/specs/.
• 3.3 V Standby: can be used to monitor the presence of 3.3 V standby power.
• PWRBT#: power button signal (functions in the same manner as the power button
pin on the front panel header).
• HDMI Consumer Electronics Control (CEC): standard communication signal from the
HDMI connector (http://www.hdmi.org/) - the signal is exposed through this header
53
Intel Desktop Board DH61AGL Technical Product Specification
for third party solutions to monitor/control CEC activity between multiple HDMI
devices.
• 5 V Standby: can be used to monitor the presence of 5V Standby power or provide
power from the 5V Standby rail (up to 2A current rating).
• SCI/SMI GPI: input signal for direct connection to a front panel push-button to
trigger a Windows command. Intel will be adding BIOS support and accompanying
Windows utility to enable Direct Application Launch* feature. General information
about Direct Application Launch can be found at:
http://msdn.microsoft.com/en-us/windows/hardware/gg463078.aspx
2.3 I/O Shield
The I/O shield provided with the board allows access to all back panel connectors and
is compatible with standard microATX chassis. Figure 14 shows an I/O shield
reference diagram.
Figure 14. I/O Shield Reference Diagram
54
Technical Reference
2.4 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 15 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 30 describes the jumper settings for the three
modes: normal, configure, and recovery. When the jumper is set to configure mode
and the computer is powered-up, the BIOS compares the processor version and the
microcode version in the BIOS and reports if the two match.
55
Figure 15. Location of the Jumper Block
Intel Desktop Board DH61AGL Technical Product Specification
Table 30. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal
Configure
1-2
2-3
The BIOS uses current configuration information and passwords
for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery
None
The BIOS attempts to recover the BIOS configuration. A
recovery CD or flash drive is required.
56
Technical Reference
2.5 Mechanical Considerations
2.5.1 Form Factor
The board is designed to fit into a Thin Mini-ITX form-factor chassis. Figure 16
illustrates the mechanical form factor for the board. Dimensions are given in inches
[millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170.18 millimeters
by 170.18 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
NOTE
The board is designed to have a total height of less than 20 mm from the underside of
the board to the top of its tallest components, including all back panel I/O ports,
internal connectors, installed system memory, and factory-installed thermal solutions,
in compliance with thin mini-ITX requirements per version 2 of the Mini-ITX Addendum
to the microATX Motherboard Interface Specification.
For more information about Refer to
Thin mini-ITX form factor http://www.formfactors.org/developer%5Cspecs%5CMini_ITX_
Spec_V2_0.pdf
57
Intel Desktop Board DH61AGL Technical Product Specification
Figure 16. Board Dimensions
58
2.5.2 Board 3D View
The Intel Desktop Board DH61AGL has a 3D view as shown in Figure 17.
Technical Reference
Figure 17. 3D View of Intel Desktop Board DH61AGL
NOTE
Adobe* Acrobat* Pro or Adobe Reader, version 8.1 or later, is required for interactive
3D view. Use mouse controls in the 3D view to manipulate the drawing, as follows:
• mouse wheel for zoom in/out
• click-and-drag for rotation
• right-click and “Full Screen Multimedia” for full-screen mode
• right-click for other tools…
59
Intel Desktop Board DH61AGL Technical Product Specification
2.6 Electrical Considerations
2.6.1 Power Supply Considerations
CAUTION
The external 19 V DC jack is the primary power input connector of Intel Desktop Board
DH61AGL. However, the desktop board also provides an internal 1 x 2 power
connector that can be used in custom-developed systems that have an internal power
supply.
There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2
power connector. It is the system integrator’s responsibility to ensure no more than
one power supply unit is or can be attached to the board at any time and to ensure the
external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used.
Simultaneous connection of both external and internal power supply units could result
in potential damage to the desktop board, power supplies, or other hardware.
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s
responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen. Table 31 lists
example power consumption from both the board and typical system-level
components.
60
Technical Reference
PCH
4 x USB2 (back panel)
LAN, audio, other ICs
Total System Power
88.4
165.9
Table 31. Typical System-Level Power Consumption Figures
35 W processor 35 43.8 95% 41.6
65 W processor 65 81.3 95% 77.2
LCD w/LED backlight 25 31.3 95% 29.7
2 x 2 GB RAM 4 5 95% 4.8
2 x 4 GB RAM 8 10 95% 9.5
5 x USB2 (internal) 12.5 15.6 36%3 5.6 36%3 5.6
PCIe* HMC 5 6.25 20%4 1.25 20%4 1.25
SATA power 26.15 32.69 29%5 9.48 29%5 9.48
Speakers 6 7.5 100% 7.5
CPU fan 2.4 3 100% 3 100% 3
System fan 3.6 4.5 100% 4.5 100% 4.5
Max
Power
Rating
(W)
5 6.3 75% 4.7 75% 4.7
10 12.5 60%2 7.5 60%2 7.5
5 6.25 95% 5.94 95% 5.94
Power Req
(W)
1
35 W Slim Desktop 65 W AiO
Util Budget
(W)
Util Budget
(W)
Notes:
1. Power requirement estimated for 80% VR efficiency.
2. 60% utilization for back panel USB2 refers to current draw of 100 mA on ports 1-2 and 500 mA on
ports 3-4.
3. 36% utilization for internal USB2 headers refers to current draw of 100 mA on ports 5-8 and 500 mA on
port 9.
4. 20% utilization for Half-Mini Card refers to ~1 W Wi-Fi card power consumption.
5. 29% utilization for SATA refers to ~5 W slim ODD and ~2.5 W HDD (2.5”) power consumption.
61
Intel Desktop Board DH61AGL Technical Product Specification
2.6.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 32 lists the current capability of the fan headers.
Table 32. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A
System fan 1.5 A
2.7 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional airflow
to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
62
Technical Reference
Item
Description
A
Intel H61 Express Chipset
B
Processor
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 18) can reach a temperature of up to 120
an open chassis.
Figure 18 shows the locations of the localized high temperature zones.
o
C in
Figure 18. Localized High Temperature Zones
63
C Processor voltage regulator area
Intel Desktop Board DH61AGL Technical Product Specification
For information about
Refer to
Intel H61 Express Chipset
http://www.intel.com/products/desktop/
Table 33 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 33. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset 104 oC
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 33. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol.
Table 34. Tcontrol Values for Components
Component Tcontrol
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Express Chipset 104 oC
Processor datasheets and specification updates Section 1.2, page 16
chipsets/
64
Technical Reference
2.8 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Issue 2; Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate
repair rates and spare parts requirements. The MTBF for the Intel Desktop Board
DH61AGL is 61,767 hours.
2.9 Environmental
Table 35 lists the environmental specifications for the board.
Table 35. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/s²
Packaged Dimension of package (L x W x H) 465 x 220 x 230 mm
Package weight 12.54 pounds
Drop height 36 inches
Drop sequence (total drops) 6 faces, 2 corners, 3 edges (11)
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-40 °C to +60 °C
0 °C to +60 °C
65
Intel Desktop Board DH61AGL Technical Product Specification
66
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as AGH6120H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.4 on page 55 shows how to put the board in configure mode.
67
Intel Desktop Board DH61AGL Technical Product Specification
<←> or <→>
Selects a different menu screen (Moves the cursor left or right)
<F9>
Load the default configuration values for the current menu
Table 36 lists the BIOS Setup program menu features.
Table 36. BIOS Setup Program Menu Bar
Maintenance Main
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configuration
Configures
advanced
features
available
through the
chipset
Performance Security Power
Configures
Memory, Bus
and Processor
overrides
Sets
passwords
and
security
features
Table 37 lists the function keys available for menu screens.
Table 37. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key
<↑> or <↓>
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Description
Selects an item (Moves the cursor up or down)
Configures
power
management
features and
power supply
controls
Boot
Selects
boot
options
Exit
Saves or
discards
changes to
Setup
program
options
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 96 Mbit
(12288 KB) flash memory device.
3.3 Resource Configuration
3.3.1 PCI Express Autoconfiguration
The BIOS can automatically configure PCI Express devices. PCI Express devices may
be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI
Express cards without having to configure the system. When a user turns on the
system after adding a PCI Express card, the BIOS automatically configures interrupts,
the I/O space, and other system resources. Any interrupts set to Available in Setup
are considered to be available for use by the add-in card.
68
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel
Toolkit.
®
Integrator
69
Intel Desktop Board DH61AGL Technical Product Specification
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel
• Intel
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
®
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
®
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about Refer to
BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm.
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for support.
70
Overview of BIOS Features
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Intel Integrator Toolkit http://downloadcenter.intel.com/Detail_Desc.aspx?agr=Y&
Refer to
DwnldID=20829&lang=eng&wapkw=integrator+toolkit
3.7 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 38 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 38. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the SATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
For information about Refer to
BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm
71
Intel Desktop Board DH61AGL Technical Product Specification
<↑> or <↓>
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.8.1 Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 39 lists the boot device menu
options.
Table 39. Boot Device Menu Options
Boot Device Menu Function Keys Description
Selects a default boot device
<Enter> Exits the menu, and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority
defined through BIOS setup
72
Overview of BIOS Features
3.9 Adjusting Boot Speed
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
• Enabling the Fast Boot feature
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds that minimizes hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot menu, enable the settings for Fast Boot. This option will allow BIOS to
skip through various stages of POST and boot quickly to the last detected boot
device.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay
feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup
program).
73
Intel Desktop Board DH61AGL Technical Product Specification
Neither
Can change all
Can change all
None
None
None
Supervisor
Can change all
Can change a
Supervisor Password
Supervisor
None
User only
N/A
Can change all
Enter Password
User
User
Supervisor
Can change all
Can change a
Supervisor Password
Supervisor or
Supervisor or
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 40 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 40. Supervisor and User Password Functions
Password
Set
only
and user set
Note: If no password is set, any user can change all Setup options.
Supervisor
Mode
options
options
options
(Note)
User Mode
options
limited number
of options
options
limited number
of options
(Note)
Setup Options
Clear User Password
Enter Password
Password to
Enter Setup
user
Password
During Boot
user
NOTE
The BIOS complies with NIST Special Publication 800-147 BIOS Protection Guidelines /
Recommendations of the National Institute of Standards and Technology. Refer to
http://csrc.nist.gov/publications/nistpubs/800-147/NIST-SP800-147-April2011.pdf for
more information.
74
3.11 BIOS Performance Features
Overview of BIOS Features
The BIOS includes the following options to provide custom performance enhancements
when using 3
rd
generation Intel Core processor family and 2nd generation Intel Core
processor family processors in an LGA1155 socket.
• Processor Maximum Non-Turbo Ratio (processor multiplier can only be adjusted
down)
• Memory multiplier adjustment
• Memory voltage adjustment
• Graphics multiplier adjustment
75
Intel Desktop Board DH61AGL Technical Product Specification
76
4 Error Messages and Beep Codes
4.1 Speaker
Audible error code (beep code) information generated during POST is routed to the
audio codec and can be heard through attached speakers.
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the attached
speakers to beep an error message describing the problem (see Table 41).
Table 41. BIOS Beep Codes
Type Pattern Frequency
F2 Setup/F10 Boot Menu
Prompt
BIOS update in progress None
Video error On-off (1.0 second each) two times, then
Memory error On-off (1.0 second each) three times, then
Thermal trip warning Alternate high and low beeps (1.0 second each)
One 0.5 second beep when BIOS is ready to
accept keyboard input
2.5-second pause (off), entire pattern repeats
(beeps and pause) once and the BIOS will
continue to boot.
2.5-second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
for eight beeps, followed by system shut down.
932 Hz
932 Hz
When no VGA option ROM is
found.
932 Hz
High beep 2000 Hz
Low beep 1500 Hz
77
Intel Desktop Board DH61AGL Technical Product Specification
F2 Setup/F10 Boot Menu
None
The CMOS checksum is incorrect. CMOS memory may have been
4.3 Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 42).
Table 42. Front-panel Power LED Blink Codes
Type Pattern Note
Prompt
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.
Memory error On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning Each beep will be accompanied by the following
blink pattern: .25 seconds on, .25 seconds off,
.25 seconds on, .25 seconds off. This will result
in a total of 16 blinks.
When no VGA option ROM is
found.
4.4 BIOS Error Messages
Table 43 lists the error messages and provides a brief description of each.
Table 43. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
78
Error Messages and Beep Codes
4.5 Port 80h Power On Self Test (POST) Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display. Refer to the location of the Debug header in
Figure 1.
The following tables provide information about the POST codes generated by the BIOS:
• Table 44 lists the Port 80h POST code ranges
• Table 45 lists the Port 80h POST codes themselves
• Table 46 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 44. Port 80h POST Code Ranges
Range Subsystem
0x00 – 0x05 Entering SX states S0 to S5.
0x10, 0x20, 0x30,
0x40, 0x50
0x08 – 0x0F Security (SEC) phase
0x11 – 0x1F PEI phase pre MRC execution
0x21 – 0x29 MRC Memory detection
0x2A – 0x2F PEI phase post MRC execution
0x31 – 0x35 Recovery
0x36 – 0x3F Platform DXE driver
0x41 – 0x4F CPU Initialization (PEI, DXE, SMM)
0x50 – 0x5F I/O Buses: PCI, USB, ISA, ATA etc. 0x5F is an unrecoverable error. Start with PCI.
0x60 – 0x6F BDS
0x70 – 0x7F Output Devices: All output consoles.
0x80 – 0x8F For future use
0x90 – 0x9F Input devices: Keyboard/Mouse.
0xA0 – 0xAF For future use
0xB0 – 0xBF Boot Devices: Includes fixed media and removable media. Not that critical since
0xC0 – 0xCF For future use
0xD0 – 0xDF For future use
0xF0 – 0xFF
Resuming from SX states. 0x10 – S1, 0x20 – S2, 0x30 – S3, etc.
consoles should be up at this point.
79
Intel Desktop Board DH61AGL Technical Product Specification
ACPI S States
PEI before MRC
PEI Over-Clock Programming
Table 45. Port 80h POST Codes
Port 80 Code Progress Code Enumeration
0x00,0x01,0x02,0x03,0x04,0x05 Entering S0, S2, S3, S4, or S5 state
0x10,0x20,0x30,0x40,0x50 Resuming from S2, S3, S4, S5
Security Phase (SEC)
0x08 Starting BIOS execution after CPU BIST
0x09 SPI prefetching and caching
0x0A Load BSP microcode
0x0B Load APs microcodes
0x0C Platform program baseaddresses
0x0D Wake Up All APs
0x0E Initialize NEM
0x0F Pass entry point of the PEI core
PEI Platform driver
0x11 Set bootmode, GPIO init
0x12 Early chipset register programming including graphics init
0x13 Basic PCH init, discrete device init (1394, SATA)
0x14 LAN init
0x15 Exit early platform init driver
PEI SMBUS
0x16 SMBUSriver init
0x17 Entry to SMBUS execute read/write
0x18 Exit SMBUS execute read/write
PEI CK505 Clock Programming
0x19 Entry to CK505 programming
0x1A Exit CK505 programming
0x1B Entry to entry to PEI over-clock programming
0x1C Exit PEI over-clock programming
Memory
0x21 MRC entry point
0x23 Reading SPD from memory SO-DIMMs
0x24 Detecting presence of memory SO-DIMMs
0x27 Configuring memory
0x28 Testing memory
0x29 Exit MRC driver
continued
80
Error Messages and Beep Codes
PEI after MRC
CPU PEI Phase
CPU PEI SMM Phase
CPU DXE Phase
ATA/ATAPI/SATA
Table 45. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
0x2A Start to Program MTRR Settings
0x2B Done Programming MTRR Settings
PEIMs/Recovery
0x31 Crisis Recovery has initiated
0x33 Loading recovery capsule
0x34 Start recovery capsule/ valid capsule is found
CPU Initialization
0x41 Begin CPU PEI Init
0x42 XMM instruction enabling
0x43 End CPU PEI Init
0x44 Begin CPU SMM Init smm relocate bases
0x45 Smm relocate bases for APs
0x46 End CPU SMM Init
0x47 CPU DXE Phase begin
0x48 Refresh memory space attributes according to MTRRs
0x49 Load the microcode if needed
0x4A Initialize strings to HII database
0x4B Initialize MP Support
0x4C CPU DXE Phase End
CPU DXE SMM Phase
0x4D CPU DXE SMM Phase begin
0x4E Relocate SM bases for all APs
0x4F CPU DXE SMM Phase end
IO BUSES
0x50 Enumerating PCI buses
0x51 Allocating resources to PCI bus
0x52 Hot Plug PCI controller initialization
USB
0x58 Resetting USB bus
0x59 Reserved for USB
0x5A Resetting PATA/SATA bus and all devices
0x5B Reserved for ATA
continued
81
Intel Desktop Board DH61AGL Technical Product Specification
BDS
Mouse (PS2 or USB)
Table 45. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
0x60 BDS driver entry point initialize
0x61 BDS service routine entry point (can be called multiple times)
0x62 BDS Step2
0x63 BDS Step3
0x64 BDS Step4
0x65 BDS Step5
0x66 BDS Step6
0x67 BDS Step7
0x68 BDS Step8
0x69 BDS Step9
0x6A BDS Step10
0x6B BDS Step11
0x6C BDS Step12
0x6D BDS Step13
0x6E BDS Step14
0x6F BDS return to DXE core (should not get here)
Keyboard (PS2 or USB)
0x90 Resetting keyboard
0x91 Disabling the keyboard
0x92 Detecting the presence of the keyboard
0x93 Enabling the keyboard
0x94 Clearing keyboard input buffer
0x95 Instructing keyboard controller to run Self Test (PS2 only)
0x98 Resetting mouse
0x99 Detecting mouse
0x9A Detecting presence of mouse
0x9B Enabling mouse
Fixed Media
0xB0 Resetting fixed media
0xB1 Disabling fixed media
0xB2 Detecting presence of a fixed media (IDE hard drive detection etc.)
0xB3 Enabling/configuring a fixed media
continued
82
Error Messages and Beep Codes
Removable Media
Runtime Phase/EFI OS Boot
Table 45. Port 80h POST Codes (continued)
Port 80 Code Progress Code Enumeration
0xB8 Resetting removable media
0xB9 Disabling removable media
0xBA Detecting presence of a removable media (IDE, CDROM detection
etc.)
0xBB Enabling/configuring a removable media
DXE Core
0xE4 Entered DXE phase
BDS
0xE7 Waiting for user input
0xE8 Checking password
0xE9 Entering BIOS setup
0xEB Calling Legacy Option ROMs
0xF8 EFI boot service ExitBootServices ( ) has been called
0xF9 EFI runtime service SetVirtualAddressMap ( ) has been called
83
Intel Desktop Board DH61AGL Technical Product Specification
Table 46. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory SO-DIMMs
23 Detecting presence of memory SO-DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI buses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot
84
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Intel Desktop
Board DH61AGL:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards
Intel Desktop Board DH61AGL complies with the safety standards stated in Table 47
when correctly installed in a compatible host system.
Table 47. Safety Standards
Standard Title
CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
IEC 60950-1 Information Technology Equipment – Safety - Part 1: General
Requirements (International)
85
Intel Desktop Board DH61AGL Technical Product Specification
5.1.2 European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DH61AGL is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC
(ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC,
2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.
86
Regulatory Compliance and Battery Disposal Information
中文
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,
2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品
回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用
处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及
产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
87
Intel Desktop Board DH61AGL Technical Product Specification
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル ブランド製品を指定の場所へ返送していただき、リ
サイクルを適切に行えるよう、インテル製品リサイクル プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、
http://www.intel.com/intel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
88
Regulatory Compliance and Battery Disposal Information
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology Web sayfasına gidin.
89
Intel Desktop Board DH61AGL Technical Product Specification
5.1.4 China RoHS
Intel Desktop Board DH61AGL is a China RoHS-compliant product.
The China Ministry of Information Industry (MII) stipulates that a material Self
Declaration Table (SDT) must be included in a product’s user documentation. The SDT
for Intel Desktop Board DH61AGL is shown in Figure 19.
Figure 19. Intel Desktop Board DH61AGL China RoHS Material
90
Self Declaration Table
Regulatory Compliance and Battery Disposal Information
Subpart B
Frequency Devices. (USA)
ICES-003
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
of Information Technology Equipment. (European Union)
methods of measurement. (European Union)
Compatibility. (Australia and New Zealand)
Information Technology Equipment. (International)
Methods of Measurement. (International)
(Japan)
Telecommunications and Radio Waves Act (South Korea)
CNS 13438
Bureau of Standards, Metrology, and Inspection (Taiwan)
5.1.5 EMC Regulations
Intel Desktop Board DH61AGL complies with the EMC regulations stated in Table 48
when correctly installed in a compatible host system.
Table 48. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
EN55022
EN55024
EN55022
CISPR 22
CISPR 24
VCCI V-3, V-4
KN-22, KN-24
Limits and methods of measurement of Radio Interference Characteristics
Information Technology Equipment – Immunity Characteristics Limits and
Australian Communications Authority, Standard for Electromagnetic
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment – Immunity Characteristics – Limits and
Voluntary Control for Interference by Information Technology Equipment.
Korean Communications Commission – Framework Act on
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
91
Intel Desktop Board DH61AGL Technical Product Specification
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.
Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas.
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For information about
Refer to
5.1.6 ENERGY STAR* 5.0, e-Standby, and ErP
Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Desktop Board DH61AGL meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient power
supply:
• Energy Star v5.0, category A
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2013 (ErP) Lot 6
NOTE
Energy Star compliance is based at the system level not the board level. Use of an
Intel Desktop Board alone does not guarantee Energy Star compliance.
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm
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Intel Desktop Board DH61AGL Technical Product Specification
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5.1.7 Regulatory Compliance Marks (Board Level)
Intel Desktop Board DH61AGL has the regulatory compliance marks shown in
Table 49.
Table 49. Regulatory Compliance Marks
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive,
Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel
supplier code number, N-232.
The linked image cannot be displayed. The file may have been moved, renamed, or deleted. Verify that the link points to the correct file and location.
Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean Communications
Commission) certification number:
KCC-REM-CPU-DH61AGL.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
V-0
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Regulatory Compliance and Battery Disposal Information
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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Intel Desktop Board DH61AGL Technical Product Specification
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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Regulatory Compliance and Battery Disposal Information
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel Desktop Board DH61AGL Technical Product Specification
小心
주의
如果更換的電池類型不正確，可能會有爆炸的危險。請盡可能將電池送至回收處。請依照當地的環保
規範來處理使用過的電池。
배터리를 잘못된 종류로 교체할 경우 폭발 위험이 있습니다. 가능한 경우 배터리는 재활용해야
하며, 수명이 다한 배터리를 폐기할 때는 각 지역의 환경법을 따라야 합니다.
THẬN TRỌNG
Có nguy cơ xảy ra nổ nếu thay pin không đúng loại. Pin cần được tái chế nếu có thể
thực hiện được. Việc thải bỏ pin đã sử dụng phải tuân theo các quy định của địa
phương về môi trường.
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Intel Desktop Board DH61AGL Technical Product Specification
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