Intel STCK1A32FC, Compute Stick, STCK1A32WFC, STCK1A8LFC Technical Product Specification
Intel® Compute Stick
STCK1A32WFC
STCK1A32FC
STCK1A8LFC
Technical Product Specification
September 2015
Order Number: H91229-001
Revision History
Revision Revision History Date
001 First release September 2015
Disclaimer
This product specification applies to only the standard Intel® Compute Stick with BIOS identifier
FCBYT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel Compute Sticks are evaluated as Information Technology Equipment (I.T.E.) for installation in homes, offices,
schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC
applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported
without further evaluation by Intel.
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
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Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
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Copyright 2015 Intel Corporation. All rights reserved.
®
Processor Numbers
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/ComputeStickSupport
for the latest documentation.
Preface
1
A description of the hardware used on Intel Compute Stick
2
A map of the resources of the Intel Compute Stick
3
The features supported by the BIOS Setup program
This Technical Product Specification (TPS) specifies the layout, components, connectors, power
and environmental requirements, and the BIOS for Intel Compute Stick STCK1A32WFC,
STCK1A32FC and STCK1A8LFC.
NOTE
In this document, the use of “Intel Compute Stick” will refer to the STCK1A32WFC, STCK1A32FC
and STCK1A8LFC versions of the Intel Compute Stick.
Intended Audience
The TPS is intended to provide detailed technical information about Intel Compute Stick
STCK1A32WFC, STCK1A32FC and STCK1A8LFC and its components to the vendors, system
integrators, and other engineers and technicians who need this level of information. It is
specifically not intended for general audiences.
What This Document Contains
Chapter Description
STCK1A32WFC, STCK1A32FC and
STCK1A8LFC
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
Xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
iv
Contents
Revision History
Errata ............................................................................................................................................................................ ii
Preface
Intended Audience................................................................................................................................................ iii
What This Document Contains ........................................................................................................................ iii
Typographical Conventions .............................................................................................................................. iii
1 Product Description
1.1 Overview ......................................................................................................................................................... 7
1.1.1 Version Summary ..................................................................................................................... 7
1.1.2 Feature Summary ..................................................................................................................... 7
1.1.3 Location of Components ....................................................................................................... 8
1.1.4 Block Diagram ............................................................................................................................ 9
1.2 Online Support .......................................................................................................................................... 10
1.3 Operating System Overview ................................................................................................................ 10
1.4 Processor ..................................................................................................................................................... 10
1.5 System Memory ........................................................................................................................................ 11
1.6 System Storage ......................................................................................................................................... 11
1.7 Processor Graphics Subsystem ......................................................................................................... 11
1.7.1 Integrated Graphics .............................................................................................................. 11
1.8 USB ................................................................................................................................................................. 12
1.9 Wireless LAN Subsystem ...................................................................................................................... 12
1.9.1 Wireless Network Module .................................................................................................. 12
1.10 Hardware Management Subsystem ................................................................................................. 13
1.11 Power Management ................................................................................................................................ 13
1.11.1 ACPI ............................................................................................................................................. 13
1.11.2 Hardware Support ................................................................................................................. 15
2 Technical Reference
2.1 Memory Resources .................................................................................................................................. 17
2.1.1 Addressable Memory ........................................................................................................... 17
2.2 Co
2.3 Reliability ..................................................................................................................................................... 20
2.4 Environmental ........................................................................................................................................... 20
nnectors .................................................................................................................................................. 18
2.2.1 USB 2.0 Connector ................................................................................................................ 18
2.2.2 Micro SD Card Reader .......................................................................................................... 18
2.2.3 Power Adapter Connector ................................................................................................. 19
2.2.4 Power Adapter ........................................................................................................................ 19
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
3 Overview of BIOS Features
3.1 Introduction ................................................................................................................................................ 21
3.2 BIOS Flash Memory Organization ..................................................................................................... 21
3.3 System Management BIOS (SMBIOS) .............................................................................................. 21
3.4 BIOS Updates ............................................................................................................................................. 22
3.4.1 Language Support ................................................................................................................. 22
3.5 BIOS Recovery ........................................................................................................................................... 22
3.6 Boot Options .............................................................................................................................................. 23
3.6.1 Booting Without Attached Devices. ............................................................................... 23
3.6.2 Changing the Default Boot Device During POST ..................................................... 23
3.6.3 Power Button Menu .............................................................................................................. 23
3.7 BIOS Error Messages .............................................................................................................................. 24
Figures
1. Left-Side View of Intel Compute Stick ............................................................................................... 8
2. Right-Side View of Intel Compute Stick ............................................................................................ 8
3. Block Diagram ............................................................................................................................................... 9
4. USB 2.0 Connector .................................................................................................................................. 18
5. Micro SD Card Reader ............................................................................................................................ 18
6. Power Adapter Connector .................................................................................................................... 19
7. Power Adapter ........................................................................................................................................... 19
Tables
1. Version Summary ........................................................................................................................................ 7
2. Feature Summary ........................................................................................................................................ 7
3. Effects of Pressing the Power Switch .............................................................................................. 13
4. Power States and Targeted System Power ................................................................................... 14
5. Wake-up Devices and Events ............................................................................................................. 15
6.
Environmental Specifications ............................................................................................................. 20
7. Acceptable Drives/Media Types for BIOS Recovery ................................................................. 22
8. Boot Device Menu Options .................................................................................................................. 23
9. BIOS Error Messages .............................................................................................................................. 24
vi
Version
Processor
OS Pre-installed
103.4 millimeters by 37.6 millimeters by 12.5 millimeters (4.0709 inches by 1.44803 inches
• Soldered-down Intel® Atom™ processor
•
• Integrated graphics support with Intel® HD Graphics Technology:
―
• 32 GB soldered-down Embedded MultiMediaCard (eMMC) onboard storage on
•
Soldered-down Single Band Wireless-N module
1 Product Description
1.1 Overview
1.1.1 Version Summary
There are three different versions of this model of Intel® Compute Stick available which are
summarized in Table 1. Unless otherwise noted in this document all features are available on all
versions of the Intel Compute Stick.
Table 1. Version Summary
STCK1A32WFC Intel® Atom™ Z3735F Yes, Windows*
STCK1A32FC Intel® Atom™ Z3735F No
STCK1A8LFC Intel® Atom™ Z3735F Yes, Linux*
1.1.2 Feature Summary
Table 2 summarizes the major features of the Intel Compute Stick.
Table 2. Feature Summary
Form Factor
Processor
Memory
Graphics
Audio Intel® High Definition (Intel® HD) Audio via the HDMI v1.4a interface
Peripheral Interfaces One full size USB 2.0 port
Storage
BIOS
Wireless LAN
by 0.4921 inches)
― Integrated graphics
― Integrated memory controller
― Integrated PCH
Soldered-down single-channel DDR3L/L-RS 1.35 V 1333 MHz memory
• 2 GB total memory on STCK1A32WFC and STCK1A32FC
• 1 GB total memory on STCK1A8LFC
High Definition Multimedia Interface* (HDMI*)
STCK1A32WFC and STCK1A32FC
• 8 GB soldered-down Embedded MultiMediaCard (eMMC) onboard storage on
STCK1A8LFC
• One Micro SD card slot (SDXC v3.0 with UHS-I support)
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
System Management BIOS (SMBIOS)
• 802.11g/n, Single Band, 1x1 Wi-Fi + Bluetooth* 4.0
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Intel Compute Stick STCK1A32WFC, STCK1A32FC and STCK1A8LFC Technical Product Specification
1.1.3 Location of Components
Figures 1 and 2 show the location of the components on the Intel Compute Stick.
Item Description
A HDMI Connector
B Power LED
C Micro SD Card Reader Slot
Figure 1. Left-Side View of Intel Compute Stick
Item Description
A Security Loop
B USB 2.0 Connector
C 5 V DC Connector
D Power On/Off Button
Figure 2. Right-Side View of Intel Compute Stick
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