Intel BX80633I74930K, BX80633I74820K User Manual

Intel® Core™ i7 Processor Family for LGA2011 Socket

Datasheet – Volume 1 of 2

Supporting Desktop Intel® Core™ i7-4960X Extreme Edition Processor Series for the LGA2011 Socket

Supporting Desktop Intel® Core™ i7-49xx and i7-48xx Processor Series for the LGA2011 Socket

September 2013

329366-001

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No computer system can provide absolute security under all conditions. Intel a computer system with Intel

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code

Trusted Execution Technology (Intel® TXT) requires

Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security/

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see

http://www.intel.com/products/ht/hyperthreading_more.htm.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

Intel (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

Intel Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see

http://www.intel.com/technology/turboboost/.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel configurations. Consult with your system vendor for more information.

64 architecture. Performance will vary depending on your hardware and software

 Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor%5Fnumber/ for details.

C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed

I by Intel. Implementations of the I North American Philips Corporation.

Intel, Intel, Enhanced Intel

VT-d, Intel® Turbo Boost Technology, Intel® Hyper-Threading Technology (Intel® HT Technology), Intel® Streaming SIMD

Intel Extensions (Intel

SSE) Intel Core, and the Intel logo are trademarks of Intel Corporation in the U. S. and/or other countries.

*Other names and brands may be claimed as the property of others.

C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and

SpeedStep® Technology, Intel® 64 Technology, Intel® Virtualization Technology (Intel® VT),

2 Datasheet

Table of Contents

1 Introduction ..............................................................................................................8

1.1 Processor Feature Details .....................................................................................9

1.2 Supported Technologies ..................................................................................... 10

1.3 Interfaces ........................................................................................................ 10

1.3.1 System Memory Support ......................................................................... 10

1.3.2 PCI Express* ......................................................................................... 11

1.3.3 Direct Media Interface Gen 2 (DMI2)......................................................... 12

1.3.4 Platform Environment Control Interface (PECI) ........................................... 13

1.4 Power Management Support ...............................................................................13

1.4.1 Processor Package and Core States........................................................... 13

1.4.2 System States Support ...........................................................................13

1.4.3 Memory Controller.................................................................................. 13

1.4.4 PCI Express* ......................................................................................... 13

1.5 Thermal Management Support ............................................................................13

1.6 Package Summary............................................................................................. 14

1.7 Terminology .....................................................................................................14

1.8 Related Documents............................................................................................ 16

2 Interfaces................................................................................................................ 18

2.1 System Memory Interface................................................................................... 18

2.1.1 System Memory Technology Support ........................................................ 18

2.1.2 System Memory Timing Support............................................................... 18

2.2 PCI Express* Interface....................................................................................... 19

2.2.1 PCI Express* Architecture ....................................................................... 19

2.2.2 PCI Express* Configuration Mechanism .....................................................20

2.3 Direct Media Interface 2 (DMI2) / PCI Express* Interface .......................................21

2.3.1 DMI2 Error Flow .....................................................................................21

2.3.2 Processor / PCH Compatibility Assumptions................................................ 21

2.3.3 DMI2 Link Down..................................................................................... 21

2.4 Platform Environment Control Interface (PECI) ...................................................... 21

3 Technologies ...........................................................................................................22

3.1 Intel

3.2 Security Technologies ........................................................................................ 25

3.3 Intel

3.4 Intel

3.5 Enhanced Intel

3.6 Intel

4 Power Management ................................................................................................. 29

4.1 Advanced Configuration and Power Interface (ACPI) States Supported...................... 29

Virtualization Technology (Intel® VT).......................................................... 22

3.1.1 Intel

3.1.2 Intel

3.1.3 Intel

3.1.4 Intel

3.2.1 Intel

3.2.2 Execute Disable Bit................................................................................. 25

® ®

3.4.1 Intel

VT-x Objectives ............................................................................ 22

VT-x Features............................................................................... 23

VT-d Objectives ............................................................................ 23

Virtualization Technology Processor Extensions ................................. 24

Advanced Encryption Standard New Instructions

(Intel

AES-NI) Instructions .................................................................... 25

Hyper-Threading Technology (Intel® HT Technology).................................... 25

Turbo Boost Technology............................................................................ 26

Turbo Boost Operating Frequency ...................................................26

SpeedStep® Technology............................................................. 26

Advanced Vector Extensions (Intel® AVX) ................................................... 27

4.1.1 System States .......................................................................................29

4.1.2 Processor Package and Core States........................................................... 29

4.1.3 Integrated Memory Controller (IMC) States................................................ 31

4.1.4 Direct Media Interface Gen 2 (DMI2) / PCI Express* Link States ................... 31

4.1.5 G, S, and C State Combinations ...............................................................32

Datasheet 3

4.2 Processor Core / Package Power Management ...................................................... 32

4.2.1 Enhanced Intel

SpeedStep® Technology ................................................. 32

4.2.2 Low-Power Idle States............................................................................ 33

4.2.3 Requesting Low-Power Idle States ........................................................... 34

4.2.4 Core C-states ........................................................................................ 35

4.2.5 Package C-States................................................................................... 36

4.2.6 Package C-State Power Specifications....................................................... 39

4.3 System Memory Power Management ................................................................... 39

4.3.1 CKE Power-Down ................................................................................... 40

4.3.2 Self-Refresh .......................................................................................... 40

4.3.3 DRAM I/O Power Management ................................................................. 41

4.4 Direct Media Interface 2 (DMI2) / PCI Express* Power Management ........................ 41

5 Thermal Management Specifications ....................................................................... 42

6 Signal Descriptions ................................................................................................. 43

6.1 System Memory Interface Signals ....................................................................... 43

6.2 PCI Express* Based Interface Signals .................................................................. 44

6.3 Direct Media Interface Gen 2 (DMI2) / PCI Express* Port 0 Signals.......................... 46

6.4 Platform Environment Control Interface (PECI) Signal ............................................ 46

6.5 System Reference Clock Signals.......................................................................... 46

6.6 Joint Test Action Group (JTAG) and Test Access Point (TAP) Signals......................... 46

6.7 Serial Voltage Identification (SVID) Signals .......................................................... 47

6.8 Processor Asynchronous Sideband and Miscellaneous Signals.................................. 47

6.9 Processor Power and Ground Supplies ................................................................. 50

7 Electrical Specifications .......................................................................................... 51

7.1 Processor Signaling ........................................................................................... 51

7.1.1 System Memory Interface Signal Groups................................................... 51

7.1.2 PCI Express* Signals.............................................................................. 51

7.1.3 Direct Media Interface Gen 2 (DMI2) / PCI Express* Signals ........................ 51

7.1.4 Platform Environmental Control Interface (PECI) ........................................ 52

7.1.5 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN) ........................ 52

7.1.6 Joint Test Action Group (JTAG) and Test Access

Port (TAP) Signals.................................................................................. 53

7.1.7 Processor Sideband Signals ..................................................................... 53

7.1.8 Power, Ground and Sense Signals ............................................................ 53

7.1.9 Reserved or Unused Signals .................................................................... 58

7.2 Signal Group Summary...................................................................................... 58

7.3 Power-On Configuration (POC) Options ................................................................ 61

7.4 Absolute Maximum and Minimum Ratings............................................................. 62

7.4.1 Storage Conditions Specifications............................................................. 62

7.5 DC Specifications .............................................................................................. 63

7.5.1 Voltage and Current Specifications ........................................................... 63

7.5.2 Die Voltage Validation ............................................................................ 66

7.5.3 Signal DC Specifications ......................................................................... 67

8 Processor Land Listing ............................................................................................ 73

9 Package Mechanical Specifications.........................................................................116

10 Boxed Processor Specifications..............................................................................117

10.1 Introduction .................................................................................................... 117

10.2 Boxed Processor Contents.................................................................................117

4 Datasheet

Figures

1-1 Processor Platform Block Diagram Example.............................................................9

1-2 PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) ..................12

2-1 PCI Express* Layering Diagram........................................................................... 19

2-2 Packet Flow through the Layers........................................................................... 19

4-1 Idle Power Management Breakdown of the Processor Cores..................................... 33

4-2 Thread and Core C-State Entry and Exit ...............................................................33

4-3 Package C-State Entry and Exit ........................................................................... 37

7-1 Input Device Hysteresis...................................................................................... 52

7-2 Voltage Regulator (VR) Power-State Transitions .................................................... 56

7-3 V

Overshoot Example Waveform ...................................................................... 66

Tables

1-1 Terminology .....................................................................................................14

1-2 Processor Documents......................................................................................... 16

1-3 Public Specifications .......................................................................................... 17

4-1 System States ..................................................................................................29

4-2 Package C-State Support.................................................................................... 30

4-3 Core C-State Support......................................................................................... 30

4-4 System Memory Power States ............................................................................. 31

4-5 DMI2 / PCI Express* Link States .........................................................................31

4-6 G, S and C State Combinations ...........................................................................32

4-7 Coordination of Thread Power States at the Core Level ...........................................34

4-8 P_LVLx to MWAIT Conversion.............................................................................. 34

4-9 Coordination of Core Power States at the Package Level ......................................... 37

4-10 Package C-State Power Specifications ..................................................................39

6-1 Memory Channel DDR0, DDR1, DDR2, DDR3......................................................... 43

6-2 Memory Channel Miscellaneous ........................................................................... 44

6-3 PCI Express* Port 1 Signals ................................................................................ 44

6-4 PCI Express* Port 2 Signals ................................................................................ 44

6-5 PCI Express* Port 3 Signals ................................................................................ 45

6-6 PCI Express* Miscellaneous Signals .....................................................................45

6-7 DMI2 and PCI Express Port 0 Signals ................................................................... 46

6-8 Platform Environment Control Interface (PECI) Signals ........................................... 46

6-9 System Reference Clock (BCLK{0/1}) Signals ....................................................... 46

6-10 Joint Test Action Group (JTAG) and Test Access Port (TAP) Signals........................... 46

6-11 Serial Voltage Identification (SVID) Signals........................................................... 47

6-12 Processor Asynchronous Sideband Signals ............................................................ 47

6-13 Miscellaneous Signals......................................................................................... 49

6-14 Power and Ground Signals .................................................................................. 50

7-1 Power and Ground Lands.................................................................................... 54

7-2 Serial Voltage Identification (SVID) Address Usage ................................................ 57

7-3 VR12.0 Reference Code Voltage Identification (VID) Table ...................................... 57

7-4 Signal Description Buffer Types ........................................................................... 58

7-5 Signal Groups ................................................................................................... 59

7-6 Signals with On-Die Termination.......................................................................... 61

7-7 Power-On Configuration Option Lands .................................................................. 61

7-8 Processor Absolute Minimum and Maximum Ratings ............................................... 62

7-9 Storage Condition Ratings ..................................................................................62

Datasheet 5

7-10 Voltage Specifications........................................................................................ 63

7-11 Current Specifications........................................................................................ 65

7-12 V

Overshoot Specifications .............................................................................. 66

7-13 DDR3 and DDR3L Signal DC Specifications ........................................................... 67

7-14 PECI DC Specifications ...................................................................................... 68

7-15 System Reference Clock (BCLK{0/1}) DC Specifications......................................... 69

7-16 SMBus DC Specifications.................................................................................... 69

7-17 Joint Test Action Group (JTAG) and Test Access Point (TAP) Signals DC Specifications 70

7-18 Serial VID Interface (SVID) DC Specifications ....................................................... 70

7-19 Processor Asynchronous Sideband DC Specifications.............................................. 71

7-20 Miscellaneous Signals DC Specifications ............................................................... 71

8-1 Land List by Land Name..................................................................................... 74

8-2 Land List by Land Number.................................................................................. 95

6 Datasheet

Revision History

Revision

Number

001 • Initial release September 2013

Description Date

Datasheet 7

1 Introduction

The Intel® Core™ i7 processor family for LGA2011 socket are the next generation of 64-bit, multi-core desktop processors built on 22-nanometer process technology. Based on the low-power/high-performance Intel processor is designed for a two-chip platform instead of to the traditional three-chip platforms (processor, Memory Controller Hub, and Platform Controller Hub). The twochip platform consists of a processor and the Platform Controller Hub (PCH) enabling higher performance, easier validation, and improved x-y footprint. Refer to Figure 1-1 for a platform block diagram.

The processor features per socket, up to 40 lanes of PCI Express* 3.0 links capable of

8.0 GT/s, and 4 lanes of DMI2/PCI Express* 2.0 interface with a peak transfer rate of

5.0 GT/s. The processor supports up to 46 bits of physical address space and a 48-bit virtual address space.

Included in this family of processors is an integrated memory controller (IMC) and integrated I/O (IIO) (such as PCI Express* and DMI2) on a single silicon die. This single die solution is known as a monolithic processor.

Introduction

Core™ i7 processor micro-architecture, the

The Datasheet - Volume 1 covers DC electrical specifications, land and signal definitions, differential signaling specifications, interface functional descriptions, power management descriptions, and additional feature information pertinent to the implementation and operation of the processor on its platform. Volume 2 provides register information. Refer to the Related Documents section for access to Volume 2.

Note: Throughout this document, the Intel® Core™ i7 processor family for LGA2011 socket

Note: Throughout this document, the Intel® Core™ i7-49xx processor series for the LGA2011

Note: Throughout this document, the Intel® Core™ i7-48xx processor series for the LGA2011

Note: Throughout this document, the Intel® X79 Chipset Platform Controller Hub may be

Note: Some processor features are not available on all platforms. Refer to the processor

may be referred to as “processor”.

socket refers t the Intel

socket refers to the Intel

referred to as “PCH”.

specification update for details.

Core™ i7-4930K processor.

Core™ i7-4820K processor.

8 Datasheet

Introduction

Figure 1-1. Processor Platform Block Diagram Example

1.1 Processor Feature Details

• Up to 6 execution cores

• Each core supports two threads (Intel® Hyper-Threading Technology), up to 12

threads per socket

• 32KB instruction and 32-KB data first-level cache (L1) for each core

• 256KB shared instruction/data mid-level (L2) cache for each core

• Up to 15MB last level cache (LLC): up to 2.5MB per core instruction/data last level cache (LLC), shared among all cores

Datasheet 9

1.2 Supported Technologies

• Intel® Virtualization Technology (Intel® VT)

• Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)

• Intel® Virtualization Technology (Intel® VT) Processor Extensions

• Intel® 64 Architecture

• Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)

• Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)

• Intel® Advanced Vector Extensions (Intel® AVX)

• Intel® AVX Floating Point Bit Depth Conversion (Float 16)

• Intel® Hyper-Threading Technology

• Execute Disable Bit

• Intel® Turbo Boost Technology

• Enhanced Intel® SpeedStep® Technology

1.3 Interfaces

Introduction

1.3.1 System Memory Support

• Supports four DDR3 channels

• Unbuffered DDR3 DIMMs supported

• Independent channel mode or lockstep mode

• Data burst length of eight cycles for all memory organization modes

• Memory DDR3 data transfer rates of 1066 MT/s, 1333 MT/s, 1600 MT/s, and 1866

MT/s

• 64-bit wide channels

• DDR3 standard I/O Voltage of 1.5 V

• 1-Gb, 2-Gb, 4-Gb, and 8-Gb DDR3 DRAM technologies supported for these devices:

— UDIMMs x8, x16

• Up to 4 ranks supported per memory channel, 1, 2, or 4 ranks per DIMM

• Open with adaptive idle page close timer or closed page policy

• Per channel memory test and initialization engine can initialize DRAM to all logical zeros or a predefined test pattern

• Minimum memory configuration: independent channel support with 1 DIMM populated

• Command launch modes of 1n/2n

• Improved Thermal Throttling

• Memory thermal monitoring support for DIMM temperature using two memory signals, MEM_HOT_C{01/23}_N

10 Datasheet

Introduction

1.3.2 PCI Express*

• The PCI Express* port(s) are fully-compliant with the PCI Express* Base Specification, Revision 3.0 (PCIe 3.0)

• Support for PCI Express* 3.0 (8.0 GT/s), 2.0 (5.0 GT/s), and 1.0 (2.5 GT/s)

• Up to 40 lanes of PCI Express* interconnect for general purpose PCI Express* devices at PCIe* 3.0 speeds that are configurable for up to 10 independent ports

• 4 lanes of PCI Express* at PCIe* 2.0 speeds when not using DMI2 port (Port 0), also can be downgraded to x2 or x1

• Negotiating down to narrower widths is supported, see Figure 1-2:

— x16 port (Port 2 and Port 3) may negotiate down to x8, x4, x2, or x1

— x8 port (Port 1) may negotiate down to x4, x2, or x1

— x4 port (Port 0) may negotiate down to x2, or x1

— When negotiating down to narrower widths, there are caveats as to how lane

reversal is supported

• Address Translation Services (ATS) 1.0 support

• Hierarchical PCI-compliant configuration mechanism for downstream devices

• Traditional PCI style traffic (asynchronous snooped, PCI ordering)

• PCI Express* extended configuration space. The first 256 bytes of configuration space aliases directly to the PCI compatibility configuration space. The remaining portion of the fixed 4-KB block of memory-mapped space above that (starting at 100h) is known as extended configuration space.

• PCI Express* Enhanced Access Mechanism – accessing the device configuration space in a flat memory mapped fashion

• Automatic discovery, negotiation, and training of link out of reset

• Supports receiving and decoding 64 bits of address from PCI Express*:

— Memory transactions received from PCI Express* that go above the top of

physical address space (when Intel VT-d is enabled, the check would be against the translated Host Physical Address (HPA)) are reported as errors by the processor.

— Outbound access to PCI Express* will always have address bits 63:46 cleared

• Re-issues Configuration cycles that have been previously completed with the Configuration Retry status

• Power Management Event (PME) functions

• Message Signaled Interrupt (MSI and MSI-X) messages

• Degraded Mode support and Lane Reversal support

• Static lane numbering reversal and polarity inversion support

• Support for PCIe* 3.0 atomic operation, PCIe 3.0 optional extension on atomic read-modify-write mechanism

Datasheet 11

Introduction

Figure 1-2. PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2)

1.3.3 Direct Media Interface Gen 2 (DMI2)

• Serves as the chip-to-chip interface to the PCH

• The DMI2 port supports x4 link width and only operates in a x4 mode when in DMI2

• Operates at PCI Express* 1.0 or 2.0 speeds

• Transparent to software

• Processor and peer-to-peer writes and reads with 64-bit address support

• APIC and Message Signaled Interrupt (MSI) support. Will send Intel-defined “End of Interrupt” broadcast message when initiated by the processor.

• System Management Interrupt (SMI), SCI, and SERR error indication

• Static lane numbering reversal support

• Supports DMI2 virtual channels VC0, VC1, VCm, and VCp

12 Datasheet

Introduction

1.3.4 Platform Environment Control Interface (PECI)

The PECI is a one-wire interface that provides a communication channel between a PECI client (the processor) and a PECI master (the PCH). Refer to the Processor Thermal Mechanical Specifications and Design Guide for additional details on PECI services available in the processor (Refer to the Related Documents section).

• Supports operation at up to 2 Mbps data transfers

• Link layer improvements to support additional services and higher efficiency over PECI 2.0 generation

• Services include processor thermal and estimated power information, control functions for power limiting, P-state and T-state control, and access for Machine Check Architecture registers and PCI configuration space (both within the processor package and downstream devices)

• Single domain (Domain 0) is supported

1.4 Power Management Support

1.4.1 Processor Package and Core States

• Advance Configuration and Power Interface (ACPI) C-states as implemented by the following processor C-states:

— Package: PC0, PC1/PC1E, PC2, PC3, PC6 (Package C7 is not supported)

— Core: CC0, CC1, CC1E, CC3, CC6, CC7

• Enhanced Intel SpeedStep Technology

1.4.2 System States Support

• S0, S1, S3, S4, S5

1.4.3 Memory Controller

• Multiple CKE power-down modes

• Multiple self-refresh modes

• Memory thermal monitoring using MEM_HOT_C01_N and MEM_HOT_C23_N signals

1.4.4 PCI Express*

• L1 ASPM power management capability; L0s is not supported

1.5 Thermal Management Support

• Digital Thermal Sensor with multiple on-die temperature zones

• Adaptive Thermal Monitor

• THERMTRIP_N and PROCHOT_N signal support

• On-Demand mode clock modulation

• Fan speed control with DTS

• Two integrated SMBus masters for accessing thermal data from DIMMs

• New Memory Thermal Throttling features using MEM_HOT_C{01/23}_N signals

Datasheet 13

1.6 Package Summary

The processor socket type is noted as LGA2011. The processor package is a

52.5 x 45 mm FC-LGA package (LGA2011). Refer to the Processor Thermal Mechanical Specification and Design Guide (see Related Documents section) for the package mechanical specifications.

1.7 Terminology

Table 1-1. Terminology (Sheet 1 of 3)

Term Description

ACPI Advanced Configuration and Power Interface

ASPM Active State Power Management

CCM Continuous Conduction Mode

DCM Discontinuous Conduction Mode

DDR3

DMA Direct Memory Access

DMI Direct Media Interface

DMI2 Direct Media Interface Gen 2

DTS Digital Thermal Sensor

Enhanced Intel SpeedStep Technology (EIST)

EPT Extended Page Tables

ESD Electro-Static Discharge

Execute Disable Bit

Functional Operation

IHS

IIO

IMC

Intel

Intel Technology

Intel Technology (Intel

64 Technology

ME Intel® Management Engine (Intel® ME)

Turbo Boost

Virtualization

Third generation Double Data Rate SDRAM memory technology that is the successor to DDR2 SDRAM

Allows the operating system to reduce power consumption when performance is not needed.

The Execute Disable bit allows memory to be marked as executable or nonexecutable when combined with a supporting operating system. If code attempts to run in non-executable memory, the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel detailed information.

Refers to the normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical, and thermal are satisfied.

Integrated Heat Spreader. A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

The Integrated I/O Controller. An I/O controller that is integrated in the processor die.

The Integrated Memory Controller. A Memory Controller that is integrated in the processor die.

64-bit memory extensions to the IA-32 architecture. Further details on Intel 64 architecture and programming model can be found at

http://developer.intel.com/technology/intel64/.

Turbo Boost Technology is a way to automatically run the processor core faster

Intel than the marked frequency if the part is operating under power, temperature, and current specifications limits of the Thermal Design Power (TDP). This results in increased performance of both single and multi-threaded applications.

Processor virtualization, which when used in conjunction with Virtual Machine Monitor software, enables multiple robust independent software environments inside a single

VT)

platform.

Introduction

64 and IA-32 Architectures Software Developer's Manuals for more

14 Datasheet

Introduction

Table 1-1. Terminology (Sheet 2 of 3)

Term Description

Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a hardware

Intel

VT-d

Intel

IOV I/O Virtualization

Jitter Any timing variation of a transition edge or edges from the defined Unit Interval (UI).

JTAG Joint Test Action Group

LGA2011-0 Socket

LLC Last Level Cache

MCH Memory Controller Hub

NCTF

NEBS

PCH

PCI Express* PCI Express* Generation 2.0/3.0

PCI Express* 2 PCI Express* Generation 2.0

PCI Express* 3 PCI Express* Generation 3.0

PCU Power Control Unit

PECI Platform Environment Control Interface

PLE Pause Loop Exiting

Processor The 64-bit, single-core or multi-core component (package)

Processor Core

QoS Quality of Service

Rank

SCI

SMBus

SSE Intel

STD Suspend-to-Disk

STR Suspend-to-RAM

SVID Serial Voltage Identification

TAC Thermal Averaging Constant

TAP Test Access Port

TCC Thermal Control Circuit

TDP Thermal Design Power

TLP Transaction Layer Packet

assist, under system software (Virtual Machine Manager or operating system) control, for enabling I/O device virtualization. Intel VT-d also brings robust security by providing protection from errant DMAs by using DMA remapping, a key feature of Intel VT-d.

The LGA2011-0 land FCLGA package mates with the system board through this surface mount, LGA2011-0 contact socket.

Non-Critical to Function: NCTF locations are typically redundant ground or noncritical reserved; thus, the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

Network Equipment Building System. NEBS is the most common set of environmental design guidelines applied to telecommunications equipment in the United States.

Platform Controller Hub. The next generation chipset with centralized platform capabilities including the main I/O interfaces along with display connectivity, audio features, power management, manageability, security, and storage features.

The term “processor core” refers to silicon die itself that can contain multiple execution cores. Each execution core has an instruction cache, data cache, and 256-KB L2 cache. All execution cores share the L3 cache. All DC and AC timing and signal integrity specifications are measured at the processor die (pads), unless otherwise noted.

A unit of DRAM corresponding four to eight devices in parallel. These devices are usually, but not always, mounted on a single side of a DDR3 DIMM.

System Control Interrupt. Used in Advanced Configuration and Power Interface (ACPI) protocol.

System Management Bus. A two-wire interface through which simple system and power management related devices can communicate with the rest of the system. It is based on the principals of the operation of the I Philips* Semiconductor.

Streaming SIMD Extensions (Intel® SSE)

C* two-wire serial bus from

Datasheet 15

Table 1-1. Terminology (Sheet 3 of 3)

Term Description

TSOD Thermal Sensor on DIMM

UDIMM Unbuffered Dual In-line Module

Uncore The portion of the processor comprising the shared cache, IMC, HA, PCU, and UBox.

Signaling convention that is binary and unidirectional. In this binary signaling, one bit is sent for every edge of the forwarded clock, whether it be a rising edge or a falling

Unit Interval

, V

CCD_01

CCD_23

VID Voltage Identification

VM Virtual Machine

VMM Virtual Machine Monitor

VPID Virtual Processor ID

VR Voltage Regulator

VRD Voltage Regulator Down

VRM Voltage Regulator Module

x1 Refers to a Link or Port with one Physical Lane

x16 Refers to a Link or Port with sixteen Physical Lanes

x4 Refers to a Link or Port with four Physical Lanes

x8 Refers to a Link or Port with eight Physical Lanes

edge. If a number of edges are collected at instances t instance “n” is defined as:

= t n – t n – 1

Processor core power supply

Variable power supply for the processor system memory interface. V generic term for V

Processor ground

CCD_01

, V

CCD_23

Introduction

, t2, tn,...., t

then the UI at

is the

CCD

1.8 Related Documents

Refer to the following documents for additional information.

Table 1-2. Processor Documents

Document

Core™ i7 Processor Family for LGA2011 Socket Datasheet – Volume 2 of

Intel 2

Core™ i7 Processor Families for the LGA2011-0 Socket Thermal

Intel Mechanical Specifications and Design Guide

Core™ i7 Processor Family for LGA2011 Socket Specification Update 326199

Intel

Document Number /

Location

329367

329368

16 Datasheet

Introduction

Table 1-3. Public Specifications

Document Document Number / Location

Advanced Configuration and Power Interface Specification 3.0 http://www.acpi.info

PCI Local Bus Specification 3.0 http://www.pcisig.com/specifications

PCI Express Base Specification - Revision 2.1 and 1.1 PCI Express Base Specification - Revision 3.0

System Management Bus (SMBus) Specification, Revision 2.0 http://smbus.org/

DDR3 SDRAM Specification http://www.jedec.org

Low (JESD22-A119) and High (JESD-A103) Temperature Storage Life Specifications

64 and IA-32 Architectures Software Developer’s Manuals

Intel

• Volume 1: Basic Architecture

• Volume 2A: Instruction Set Reference, A-M

• Volume 2B: Instruction Set Reference, N-Z

• Volume 3A: System Programming Guide

• Volume 3B: System Programming Guide

64 and IA-32 Architectures Optimization Reference Manual

Intel

Virtualization Technology Specification for Directed I/O

Intel Architecture Specification

National Institute of Standards and Technology NIST SP800-90 http://csrc.nist.gov/publications/Pubs

http://www.pcisig.com

http://www.jedec.org

http://www.intel.com/products/proce ssor/manuals/index.htm

http://download.intel.com/technolog y/computing/vptech/Intel(r)_VT_for_ Direct_IO.pdf

SPs.html

Datasheet 17

2 Interfaces

This chapter describes the functional behaviors supported by the processor. Topics covered include:

• System Memory Interface

• PCI Express* Interface

• Direct Media Interface 2 (DMI2) / PCI Express* Interface

• Platform Environment Control Interface (PECI)

2.1 System Memory Interface

2.1.1 System Memory Technology Support

The Integrated Memory Controller (IMC) supports DDR3 protocols with four independent 64-bit memory channels and supports 1 unbuffered DIMM per channel.

Interfaces

2.1.2 System Memory Timing Support

The IMC supports the following DDR3 Speed Bin, CAS Write Latency (CWL), and command signal mode timings on the main memory interface:

• tCL = CAS Latency

• tRCD = Activate Command to READ or WRITE Command delay

• tRP = PRECHARGE Command Period

• CWL = CAS Write Latency

• Command Signal modes = 1n indicates a new command may be issued every clock and 2n indicates a new command may be issued every 2 clocks. Command launch mode programming depends on the transfer rate and memory configuration.

18 Datasheet

Interfaces

2.2 PCI Express* Interface

This section describes the PCI Express* 3.0 interface capabilities of the processor. See the PCI Express* Base Specification for details of PCI Express*

2.2.1 PCI Express* Architecture

Compatibility with the PCI addressing model is maintained to ensure that all existing applications and drivers operate unchanged. The PCI Express* configuration uses standard mechanisms as defined in the PCI Plug-and-Play specification.

The PCI Express* architecture is specified in three layers – Transaction Layer, Data Link Layer, and Physical Layer. The partitioning in the component is not necessarily along these same boundaries. Refer to the following figure for the PCI Express* Layering Diagram.

Figure 2-1. PCI Express* Layering Diagram

3.0.

PCI Express* uses packets to communicate information between components. Packets are formed in the Transaction and Data Link Layers to carry the information from the transmitting component to the receiving component. As the transmitted packets flow through the other layers, the packets are extended with additional information necessary to handle packets at those layers. At the receiving side, the reverse process occurs and packets get transformed from their Physical Layer representation to the Data Link Layer representation and finally (for Transaction Layer Packets) to the form that can be processed by the Transaction Layer of the receiving device.

Figure 2-2. Packet Flow through the Layers

Datasheet 19

2.2.1.1 Transaction Layer

The upper layer of the PCI Express* architecture is the Transaction Layer. The Transaction Layer's primary responsibility is the assembly and disassembly of Transaction Layer Packets (TLPs). TLPs are used to communicate transactions, such as read and write, as well as certain types of events. The Transaction Layer also manages flow control of TLPs.

2.2.1.2 Data Link Layer

The middle layer in the PCI Express* stack, the Data Link Layer, serves as an intermediate stage between the Transaction Layer and the Physical Layer. Responsibilities of Data Link Layer include link management, error detection, and error correction.

The transmission side of the Data Link Layer accepts TLPs assembled by the Transaction Layer, calculates and applies data protection code and TLP sequence number, and submits them to Physical Layer for transmission across the Link. The receiving Data Link Layer is responsible for checking the integrity of received TLPs and for submitting them to the Transaction Layer for further processing. On detection of TLP error(s), this layer is responsible for requesting retransmission of TLPs until information is correctly received, or the Link is determined to have failed. The Data Link Layer also generates and consumes packets that are used for Link management functions.

Interfaces

2.2.1.3 Physical Layer

The Physical Layer includes all circuitry for interface operation, including driver and input buffers, parallel-to-serial and serial-to-parallel conversion, PLL(s), and impedance matching circuitry. It also includes logical functions related to interface initialization and maintenance. The Physical Layer exchanges data with the Data Link Layer in an implementation-specific format, and is responsible for converting this to an appropriate serialized format and transmitting it across the PCI Express* Link at a frequency and width compatible with the remote device.

2.2.2 PCI Express* Configuration Mechanism

The PCI Express* link is mapped through a PCI-to-PCI bridge structure.

PCI Express* extends the configuration space to 4096 bytes per-device/function, as compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express* configuration space is divided into a PCI-compatible region (which consists of the first 256 bytes of a logical device's configuration space) and an extended PCI Express* region (which consists of the remaining configuration space). The PCI-compatible region can be accessed using either the mechanisms defined in the PCI specification or using the enhanced PCI Express* configuration access mechanism described in the PCI Express* Enhanced Configuration Mechanism section.

The PCI Express* Host Bridge is required to translate the memory-mapped PCI Express* configuration space accesses from the host processor to PCI Express* configuration cycles. To maintain compatibility with PCI configuration addressing mechanisms, it is recommended that system software access the enhanced configuration space using 32-bit operations (32-bit aligned) only.

See the PCI Express* Base Specification for details of both the PCI-compatible and PCI Express* Enhanced configuration mechanisms and transaction rules.

20 Datasheet

Interfaces

2.3 Direct Media Interface 2 (DMI2) / PCI Express* Interface

Direct Media Interface 2 (DMI2) connects the processor to the Platform Controller Hub (PCH). DMI2 is similar to a four-lane PCI Express* supporting a speed of 5 GT/s per lane. Refer to Section 6.3 for additional details.

Note: Only DMI2 x4 configuration is supported.

2.3.1 DMI2 Error Flow

DMI2 can only generate SERR in response to errors, never SCI, SMI, MSI, PCI INT, or GPE. Any DMI2 related SERR activity is associated with Device 0.

2.3.2 Processor / PCH Compatibility Assumptions

The processor is compatible with the PCH and is not compatible with any previous Intel Memory Controller Hub (MCH) and Integrated Controller Hub (ICH) products.

2.3.3 DMI2 Link Down

The DMI2 link going down is a fatal, unrecoverable error. If the DMI2 data link goes to data link down, after the link was up, then the DMI2 link hangs the system by not allowing the link to retrain to prevent data corruption. This is controlled by the PCH.

Downstream transactions that had been successfully transmitted across the link prior to the link going down may be processed as normal. No completions from downstream, non-posted transactions are returned upstream over the DMI2 link after a link down event.

2.4 Platform Environment Control Interface (PECI)

The Platform Environment Control Interface (PECI) uses a single wire for self-clocking and data transfer. The bus requires no additional control lines. The physical layer is a self-clocked one-wire bus that begins each bit with a driven, rising edge from an idle level near zero volts. The duration of the signal driven high depends on whether the bit value is a logic ‘0’ or logic ‘1’. PECI also includes variable data transfer rate established with every message. In this way, it is highly flexible even though underlying logic is simple.

The interface design was optimized for interfacing to Intel processor and chipset components in both single processor and multiple processor environments. The single wire interface provides low board routing overhead for the multiple load connections in the congested routing area near the processor and chipset components. Bus speed, error checking, and low protocol overhead provides adequate link bandwidth and reliability to transfer critical device operating conditions and configuration information.

Datasheet 21

3 Technologies

This chapter covers the following technologies:

• Intel® Virtualization Technology (Intel® VT)

• Security Technologies

• Intel® Hyper-Threading Technology (Intel® HT Technology)

• Intel® Turbo Boost Technology

• Enhanced Intel® SpeedStep® Technology

• Intel® Advanced Vector Extensions (Intel® AVX)

3.1 Intel® Virtualization Technology (Intel® VT)

Intel® Virtualization Technology (Intel® VT) makes a single system appear as multiple independent systems to software. This allows multiple, independent operating systems to run simultaneously on a single system. Intel VT comprises technology components to support virtualization of platforms based on Intel architecture microprocessors and chipsets.

• Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel®

Architecture (Intel

the virtualization performance and robustness. Intel VT-x specifications and functional descriptions are included in the Intel Software Developer’s Manual, Volume 3B and is available at http://www.intel.com/products/processor/manuals/index.htm

• Intel® Virtualization Technology (Intel® VT) for Directed I/O

(Intel

improve I/O virtualization performance and robustness. The Intel VT-d specification and other Intel VT documents can be referenced at

http://www.intel.com/technology/virtualization/index.htm

VT-d) adds processor and uncore implementations to support and

VT-x) adds hardware support in the processor to improve

64 and IA-32 Architectures

Technologies

3.1.1 Intel® VT-x Objectives

Intel VT-x provides hardware acceleration for virtualization of IA platforms. Virtual Machine Monitor (VMM) can use Intel VT-x features to provide improved reliable virtualized platforms. By using Intel VT-x, a VMM is:

• Robust: VMMs no longer need to use para-virtualization or binary translation. This means that off-the-shelf operating systems and applications can be run without any special steps.

• Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86 processors.

• More reliable: Due to the hardware support, VMMs can now be smaller, less complex, and more efficient. This improves reliability and availability and reduces the potential for software conflicts.

• More secure: The use of hardware transitions in the VMM strengthens the isolation of VMs and further prevents corruption of one VM from affecting others on the same system.

22 Datasheet

Technologies

3.1.2 Intel® VT-x Features

The processor core supports the following Intel VT-x features:

• Extended Page Tables (EPT)

— hardware assisted page table virtualization.

— eliminates VM exits from guest operating system to the VMM for shadow page-

table maintenance.

• Virtual Processor IDs (VPID)

— Ability to assign a VM ID to tag processor core hardware structures (such as,

TLBs).

— This avoids flushes on VM transitions to give a lower-cost VM transition time

and an overall reduction in virtualization overhead.

• Guest Preemption Timer

— Mechanism for a VMM to preempt the execution of a guest operating system

after an amount of time specified by the VMM. The VMM sets a timer value before entering a guest.

— The feature aids VMM developers in flexibility and Quality of Service (QoS)

guarantees.

• Descriptor-Table Exiting

— Descriptor-table exiting allows a VMM to protect a guest operating system from

internal (malicious software based) attack by preventing relocation of key system data structures like IDT (interrupt descriptor table), GDT (global descriptor table), LDT (local descriptor table), and TSS (task segment selector).

— A VMM using this feature can intercept (by a VM exit) attempts to relocate

these data structures and prevent them from being tampered by malicious software.

• Pause Loop Exiting (PLE)

— PLE aims to improve virtualization performance and enhance the scaling of

virtual machines with multiple virtual processors

— PLE attempts to detect lock-holder preemption in a VM and helps the VMM to

make better scheduling decisions

3.1.3 Intel® VT-d Objectives

The key Intel VT-d objectives are domain-based isolation and hardware-based virtualization. A domain can be abstractly defined as an isolated environment in a platform to which a subset of host physical memory is allocated. Virtualization allows for the creation of one or more partitions on a single system. This could be multiple partitions in the same operating system, or there can be multiple operating system instances running on the same system – offering benefits such as system consolidation, legacy migration, activity partitioning, or security.

Datasheet 23

3.1.3.1 Intel® VT-d Features Supported

The processor supports the following Intel VT-d features:

• Root entry, context entry, and default context

• Support for 4-K page sizes only

• Support for register-based fault recording only (for single entry only) and support for MSI interrupts for faults

— Support for fault collapsing based on Requester ID

• Support for both leaf and non-leaf caching

• Support for boot protection of default page table

— Support for non-caching of invalid page table entries

• Support for hardware based flushing of translated but pending writes and pending reads upon IOTLB invalidation

• Support for page-selective IOTLB invalidation

• Support for ARI (Alternative Requester ID – a PCI SIG ECR for increasing the function number count in a PCIe* device) to support I/O Virtualization (IOV) devices

• Improved invalidation architecture

• End point caching support (ATS)

• Interrupt remapping

Technologies

3.1.4 Intel® Virtualization Technology Processor Extensions

The processor supports the following Intel VT processor extension features:

• Large Intel VT-d Pages

— Adds 2MB and 1GB page sizes to Intel VT-d implementations

— Matches current support for Extended Page Tables (EPT)

— Ability to share processor EPT page-table (with super-pages) with Intel VT-d

— Benefits:

• Less memory foot-print for I/O page-tables when using super-pages

• Potential for improved performance – due to shorter page-walks, allows hardware optimization for IOTLB

• Transition latency reductions expected to improve virtualization performance without the need for VMM enabling. This reduces the VMM overheads further and increase virtualization performance.

24 Datasheet

Technologies

3.2 Security Technologies

3.2.1 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) Instructions

These instructions enable fast and secure data encryption and decryption, using the Advanced Encryption Standard (Intel AES-NI) which is defined by FIPS Publication number 197. Since Intel AES-NI is the dominant block cipher, and it is deployed in various protocols, the new instructions will be valuable for a wide range of applications.

The architecture consists of six instructions that offer full hardware support for Intel AES-NI. Four instructions support the Intel AES-NI encryption and decryption, and the other two instructions support the Intel AES-NI key expansion. Together, they offer a significant increase in performance compared to pure software implementations.

The Intel AES-NI instructions have the flexibility to support all three standard Intel AES-NI key lengths, all standard modes of operation, and even some nonstandard or future variants.

Beyond improving performance, the Intel AES-NI instructions provide important security benefits. Since the instructions run in data-independent time and do not use lookup tables, the instructions help in eliminating the major timing and cache-based attacks that threaten table-based software implementations of Intel AES-NI. In addition, these instructions make AES simple to implement, with reduced code size. This helps reducing the risk of inadvertent introduction of security flaws, such as difficult-to-detect side channel leaks.

3.2.2 Execute Disable Bit

The Intel Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system.

• Allows the processor to classify areas in memory by where application code can execute and where it cannot.

• When a malicious worm attempts to insert code in the buffer, the processor disables code execution, preventing damage and worm propagation.

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology) that allows an execution core to function as two logical processors. While some execution resources such as caches, execution units, and buses are shared, each logical processor has its own architectural state with its own set of general-purpose registers and control registers. This feature must be enabled using the BIOS and requires operating system support.

For more information on Intel Hyper-Threading Technology, see http://www.intel.com/products/ht/hyperthreading_more.htm.

Datasheet 25

3.4 Intel® Turbo Boost Technology

Intel Turbo Boost Technology is a feature that allows the processor to opportunistically and automatically run faster than its rated operating frequency if it is operating below power, temperature, and current limits. The result is increased performance in multithreaded and single threaded workloads. It should be enabled in the BIOS for the processor to operate with maximum performance.

3.4.1 Intel® Turbo Boost Operating Frequency

The processor’s rated frequency assumes that all execution cores are running an application at the thermal design power (TDP). However, under typical operation, not all cores are active. Therefore, most applications are consuming less than the TDP at the rated frequency. To take advantage of the available TDP headroom, the active cores can increase their operating frequency.

To determine the highest performance frequency amongst active cores, the processor takes the following into consideration:

• number of cores operating in the C0 state

• estimated current consumption

• estimated power consumption

• die temperature

Technologies

Any of these factors can affect the maximum frequency for a given workload. If the power, current, or thermal limit is reached, the processor will automatically reduce the frequency to stay with its TDP limit.

Note: Intel Turbo Boost Technology is only active if the operating system is requesting the P0

state. For more information on P-states and C-states, refer to

Chapter 4.

3.5 Enhanced Intel® SpeedStep® Technology

The processor supports Enhanced Intel SpeedStep® Technology as an advanced means of enabling very high performance while also meeting the power-conservation needs of the platform.

Enhanced Intel SpeedStep Technology builds upon that architecture using design strategies that include the following:

• Separation between Voltage and Frequency Changes. By stepping voltage up and down in small increments separately from frequency changes, the processor is able to reduce periods of system unavailability that occur during frequency change. Thus, the system is able to transition between voltage and frequency states more often, providing improved power/performance balance.

• Clock Partitioning and Recovery. The bus clock continues running during state transition, even when the core clock and Phase-Locked Loop are stopped, which allows logic to remain active. The core clock can also restart more quickly under Enhanced Intel SpeedStep Technology.

For additional information on Enhanced Intel SpeedStep® Technology, refer to

Section 4.2.1.

26 Datasheet

Technologies

3.6 Intel® Advanced Vector Extensions (Intel® AVX)

Intel Advanced Vector Extensions (Intel AVX) is a new 256-bit vector SIMD extension of Intel Architecture. The introduction of Intel AVX started with the 2nd Generation Intel

Core™ processor family. Intel AVX accelerates the trend of parallel computation in general purpose applications like image, video and audio processing, engineering applications (such as 3D modeling and analysis), scientific simulation, and financial analysts.

Intel AVX is a comprehensive ISA extension of the Intel 64 Architecture. The main elements of Intel AVX are:

• Support for wider vector data (up to 256-bit) for floating-point computation

• Efficient instruction encoding scheme that supports 3 operand syntax and headroom for future extensions

• Flexibility in programming environment, ranging from branch handling to relaxed memory alignment requirements

• New data manipulation and arithmetic compute primitives, including broadcast, permute, fused-multiply-add, and so on

• Floating point bit depth conversion (Float 16)

• A group of 4 instructions that accelerate data conversion between 16-bit floating point format to 32-bit and vice versa.

• This benefits image processing and graphical applications allowing compression of data so less memory and bandwidth is required.

The key advantages of Intel AVX are:

• Performance – Intel AVX can accelerate application performance using data parallelism and scalable hardware infrastructure across existing and new application domains:

— 256-bit vector data sets can be processed up to twice the throughput of 128-bit

data sets

— Application performance can scale up with the number of hardware threads and

number of cores

— Application domain can scale out with advanced platform interconnect fabrics

• Power Efficiency – Intel AVX is extremely power efficient. Incremental power is insignificant when the instructions are unused or scarcely used. Combined with the high performance that it can deliver, applications that lend themselves heavily to using Intel AVX can be much more energy efficient and realize a higher performance-per-watt.

• Extensibility – Intel AVX has built-in extensibility for the future vector extensions:

— Operating System context management for vector-widths beyond 256 bits is

streamlined

— Efficient instruction encoding allows unlimited functional enhancements:

• Vector width support beyond 256 bits

• 256-bit Vector Integer processing

• Additional computational and/or data manipulation primitives

Datasheet 27

Technologies

• Compatibility – Intel AVX is backward compatible with previous ISA extensions including Intel SSE4:

— Existing Intel SSE applications/library can:

• Run unmodified and benefit from processor enhancements

• Recompile existing Intel

SSE intrinsic using compilers that generate

Intel AVX code

• Inter-operate with library ported to Intel AVX

— Applications compiled with Intel AVX can inter-operate with existing Intel SSE

libraries.

28 Datasheet

Power Management

4 Power Management

This chapter provides information on the following power management topics:

• Advanced Configuration and Power Interface (ACPI) States Supported

• Processor Core / Package Power Management

• System Memory Power Management

• Direct Media Interface 2 (DMI2) / PCI Express* Power Management

4.1 Advanced Configuration and Power Interface (ACPI) States Supported

The ACPI states supported by the processor are described in this section.

4.1.1 System States

Table 4-1. System States

State Description

G0/S0 Full On

G1/S3-Cold Suspend-to-RAM (STR). Context saved to memory.

G1/S4 Suspend-to-Disk (STD). All power lost (except wakeup on PCH).

G2/S5 Soft off. All power lost (except wakeup on PCH). Total reboot.

G3 Mechanical off. All power removed from system.

4.1.2 Processor Package and Core States

The following table lists the package C-state support as: 1) the shallowest core C-state that allows entry into the package C-state, 2) the additional factors that will restrict the state from going any deeper, and 3) the actions taken with respect to the Ring Vcc, PLL state, and LLC.

Table 4-3 lists the processor core C-states support.

Datasheet 29

Table 4-2. Package C-State Support

Power Management

Package C-

State

PC0 – Active CC0 N/A No No 2

PC2 – Snoopable Idle

PC3 – Light Retention

PC6 Deeper Retention

Notes:

1. Package C7 is not supported.

2. All package states are defined to be "E" states – such that the states always exit back into the LFM point upon execution resume

3. The mapping of actions for PC3, and PC6 are suggestions – microcode will dynamically determine which actions should be taken based on the desired exit latency parameters.

4. CC3/CC6 will all use a voltage below the VccMin operational point. The exact voltage selected will be a function of the snoop and interrupt response time requirements made by the devices (PCIe* and DMI) and the operating system.

Core

States

CC3–CC7

at least

one Core

in C3

CC6–CC7

Limiting Factors

• PCIe/PCH and Remote Socket Snoops

• PCIe/PCH and Remote Socket Accesses

• Interrupt response time requirement

• DMI Sidebands

• Configuration Constraints

• Core C-State

• Snoop Response Time

• Interrupt Response Time

• Non Snoop Response Time

• LLC ways open

• Snoop Response Time

• Non Snoop Response Time

• Interrupt Response Time

Retention and

PLL-Off

VccMin

Freq = MinFreq

PLL = ON

Vcc = retention

PLL = OFF

Vcc = retention

PLL = OFF

LLC

Fully

Flushed

No 2

No 2, 3, 4

Notes

Table 4-3. Core C-State Support

Core C-State Global Clock PLL L1/L2 Cache Core VCC Context

CC0 Running On Coherent Active Maintained

CC1 Stopped On Coherent Active Maintained

CC1E Stopped On Coherent Request LFM Maintained

CC3 Stopped On Flushed to LLC Request Retention Maintained

CC6 Stopped Off Flushed to LLC Power Gate Flushed to LLC

CC7 Stopped Off Flushed to LLC Power Gate Flushed to LLC

30 Datasheet

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