Intel BX80539T2500 - Core Duo 2 GHz Processor, BX80623I52550K, Core Duo Series User Manual
Intel® Core™ 2 Duo Processor and
Intel
Intel
®
Core™ Duo Processor with
®
E7520 Chipset Development
Kit
User’s Manual
January 2007
Order Number: 316068-001US
Legal Lines and Disclaimers
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OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Intel may make changes to specifications and product descriptions at any time, without notice.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
presented su bje ct matter. The furnishing of documents and other materials and information does not pr ovide an y license, express or implied, by estoppel
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processor families. See http://www.intel.com/products/processor_number for details.
The Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit may contain design defects or errors
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products/ht/Hyperthreading_more.htm for additional information.
This User’s Manual as well as the software described in it is furnished under license and may only be used or copied in accordance with the terms of the
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commitment by Intel Corporation. Intel Corporation assumes no responsibility o r l ia b ility f or any err ors or inaccur acies that may appear in this document
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Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any
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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling
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Celeron, Intel, Intel Centrino, Intel logo, Intel NetBurst, Intel NetStructure, Intel Xeon, Intel XScale, Pentium, Pentium II Xeon, Pentium III Xeon and
VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All Rights Reserved.
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
2 Order Number: 316068-001US
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
Contents
1.0 About This Manual
.....................................................................................................6
1.1 Content Overview................................................................................................6
1.2 Text Conventions ................................................................................................6
1.3 Technical Support................................................................................................7
1.4 Product Literature ............................................................................................... 8
1.5 Related Documents .............................................................................................8
2.0 Getting Started
.......................................................................................................... 9
2.1 Overview ........................................................................................................... 9
2.2 Evaluation Board Features..................................................................................10
2.3 Included Hardware ............................................................................................11
2.4 Software Key Features ....................................................................................... 11
2.5 Before You Begin...............................................................................................12
2.6 Configuring the BIOS.........................................................................................23
3.0 Theor y of Ope r a t i on
.................................................................................................25
3.1 Block Diagram .................................................................................................. 25
3.2 Thermal Management ........................................................................................ 25
3.3 System Features ...............................................................................................26
3.4 Battery Requirements........................................................................................38
4.0 Platform Management
.............................................................................................39
4.1 Power Button.................................................................................................... 39
4.2 Sleep States Supported...................................................................................... 39
4.3 PCI PM Support.................................................................................................41
4.4 Platform Management........................................................................................41
4.5 System Fan Operation........................................................................................41
5.0 Driver and Operating System Support
......................................................................42
5.1 Video Driver Issue............................................................................................. 42
6.0 Hardware Reference
................................................................................................43
6.1 Chipset Components.......................................................................................... 44
6.2 Expansion Slots and Sockets............................................................................... 44
6.3 On-Board Connectors......................................................................................... 51
6.4 Jumpers........................................................................................................... 54
6.5 SMBUS Headers ................................................................................................57
6.6 Back Panel Connectors....................................................................................... 57
7.0 Board Setup Checklist
8.0 Debug Procedure
..............................................................................................61
..................................................................................................... 62
8.1 Level 1 Debug (Port80/BIOS).............................................................................. 62
8.2 Level 2 Debug (Power Sequence) ........................................................................ 62
8.3 Level 3 Debug (Voltage References)..................................................................... 63
Figures
1 E val ua tio n Bo ard Befo re Insta llin g Ad ditio n al Hard wa re .... . .. . .. .. . .. . .. .. ... . .. . .. .. . .. . .. .. . .. . .. . .. . 13
2 Location for the Processor, MCH, and PXH for Heatsink Installation .................................15
3 Processor Heatsink Top and Bottom View ....................................................................16
4 Processor in Socket and Package Secured ...................................................................16
5 Clean Top of Processor Die........................................................................................17
6 Back Plate in Place ...................................................................................................18
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
7 Heatsink Mounted on Processor ..................................................................................18
8 Screw Tightening Order.............................................................................................19
9 MCH Heatsink Top View.............................................................................................19
10 Clean Top of MCH Die ...............................................................................................20
11 Hook Heatsink Clip to Anchor.....................................................................................20
12 Heatsink Fan Connector.............................................................................................21
13 Block Diagram of Layout............................................................................................25
14 DDR2-400 Memory—DIMM Ordering ...........................................................................29
15 ITP location .............................................................................................................30
16 Power Distribution Block Diagram ...............................................................................31
17 Clock Block Diagram.................................................................................................32
18 Platform Reset Diagram.............................................................................................33
19 SMBus Block Diagram ...............................................................................................34
20 IRQ Routing Diagram ................................................................................................35
21 Evaluation Board......................................................................................................43
22 Key Jumper Locations ...............................................................................................56
23 Back Panel Connectors..............................................................................................57
Tables
1 Intel Literature Centers .............................................................................................. 8
2 Related Documents.................................................................................................... 8
3 Supported Processors................................................................................................10
4 Additional Hardware..................................................................................................12
5 Heatsink Information ................................................................................................15
6 Supported DIMM Module Types ..................................................................................29
7 Processor VRD Settings.............................................................................................37
8 Chipset Components.................................................................................................44
9 Expansion Slots and Socket .......................................................................................44
10 PCI Express* Port A (x8) Connector Pinout ..................................................................44
11 PCI Express* Port B (X4) Connector Pinout ..................................................................46
12 32-Bit 5 V PCI Connector Pinout.................................................................................47
13 PCI-X Connector Pinout.............................................................................................48
14 On-Board Connector .................................................................................................51
15 SATA Connector Pinout..............................................................................................52
16 IDE Connector Pinout................................................................................................52
17 Floppy Drive Connector Pinout....................................................................................53
18 Front Panel Connector Pinout .....................................................................................53
19 Jumpers and Descriptions..........................................................................................54
20 SMBUS 3.3 V STBY Pinout .........................................................................................57
21 PS/2* Mouse and Keyboard Pinout..............................................................................57
22 Parallel Port Connector Pinout ....................................................................................58
23 Serial Port Connector Pinout ......................................................................................58
24 USB Connector Pinout...............................................................................................59
25 Video Port Connector Pinout.......................................................................................59
26 Dual Gigabit Ethernet Port Connector Pinout.................................................................59
27 Level 1 Debug (Port80/BIOS) .....................................................................................62
28 Level 2 Debug (Power Sequence) ...............................................................................62
29 Level 3 Debug (Voltage Reference) .............................................................................63
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
Revision History
Date Revision Description
January 2007 001 Initial release.
January 2007 User’s Manual
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
1.0 About This Manual
Development Kit
This manual describes how to set up and use the evaluation board and other
components included in the Intel
Processor with Intel
®
E7520 Chipset Development Kit.
1.1 Content Overview
Chapter 1.0, “About This Manual” – Description of conventions used in this manual and
instructions for obtaining literature and contacting customer support.
Chapter 2.0, “Gettin g Started ” – Complete instructions on how to configure the
evaluation board and processor assembly by setting jumpers, connecting peripherals,
providing power, and configuring the BIOS.
Chapter 3.0, “Theory of Operation” – Information on the system design.
Chapter 4.0, “Platform Management” – Inform at i on on t he sy s t e m p owe r ma na ge me nt
operation.
Chapter 5.0, “Driver and Operating System Support” – List of supported drivers and
operating systems.
Chapter 6.0, “Hardware Reference” – R efe re nce in for mat ion on t he har dw are , inc ludi ng
locations of evaluation board components, connector pinout information, and jumper
settings.
Chapter 7.0, “Board Setup Checklist” – Check lis t of it ems t o en sure pr oper func ti onal it y
of the evaluation board.
Chapter 8.0, “Debug Procedure” – Debug procedure to determine baseline functionality
for the Development Kit.
®
Core™ 2 Duo Processor and Intel® Core™ Duo
1.2 Text Conventions
The following notations may be used throughout this manual:
# -
The pound symbol (#) appended to a signal name indicates that the signal is active
low.
Variables -
values.
Instructions -
programming, instructions are not case-sensitive. You may use either upper- or
lowercase.
Numbers -
followed by the character “h”. A zero prefix is added to numbers that begin with A
through F. For example, FF is shown as 0FFh. Decimal and binary numbers are
represented by their customary notations. That is, 255 is a decimal number and 1111
1111 is a binary number. In some cases, the character “b” is added for clarity.
Signal Names -
common name, an individual signal is represented by the signal name followed by a
number, while the group is represented by the signal name followed by a variable (n).
For example, the lower chip-select signals are named CS0#, CS1#, CS2#, and so on;
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
6 Order Number: 316068-001US
Variables are shown in italics. Variables must be replaced with correct
Instruction mnemonics are shown in uppercase. When you are
Hexadecimal numbers are represented by a string of hexadecimal digits
Signal names are shown in uppercase. When several signals share a
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
they are collectively called CSn#. A pound symbol (#) appended to a signal name
identifies an active-low signal. Port pins are represented by the port abbreviation, a
period, and the pin number (e.g., P1.0).
Units of Measure -
The following abbreviations are used to represent units of
measure:
A amps, amperes
GB GByte, gigabytes
GHz gigahertz
KB KByte, kiloby tes
ΚΩ
kilo-ohms
mA milliamps, milliamperes
MB MByte, megabytes
MHz megahertz
ms milliseconds
mW milliwatts
ns nanoseconds
pF picofarads
W watts
V volts
µ
A microamps, microamperes
µ
F microfarads
µ
s microseconds
µ
W microwatts
1.3 Technical Support
Support Services for your hardware and software are provided through the secure
®
Intel
Premier Support Web site at https://premier.intel.com. After you log on, you can
obtain technical support, review “What’s New,” and download any items required to
maint ai n the pl atf orm . Sup por t i s pr ovi ded th roug h th e fo llow ing p rod uct :
Kit (Embedded/Core Duo/Core 2 Duo/E7520)
1.3.1 Additional Technical Support
If you require additional technical support, please contact your field sales
representative or local distributor.
Development
.
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
1.4 Product Literature
You can order product literature from the following Intel literature centers.
Table 1. Intel Literature Centers
U.S. and Canada 1-800-548-4725
U.S. (from overseas) 708-296-9333
Europe (U.K.) 44(0)1793-431155
Germany 44(0)1793-421333
France 44(0)1793-421777
Japan (fax only) 81(0)120-47-88-32
1.5 Related Documents
Tabl e 2 is a partial list of the available collateral. For the full lists, contact your local
Intel representative .
Table 2. Related Documents
Document Document Number
®
6300ESB I/O Controller Hub (ICH) Datasheet
Intel
®
Intel
E7520 Memory Controller Hub (MCH) Datasheet
®
Intel
E7520 Memory Controller Hub (MCH) Specification
®
Intel
E7520 Memory Controller Hub (MCH) Specifications Addendum
®
Intel
E7520 Memory Controller Hub (MCH) Specifications Embedded
Addendum
Intel
Intel
Intel
Specification
Intel® Core™ 2 Duo and Intel® Core™ Duo Processor with Intel®
E7520 Chipset Platform Design Guide
Intel
Intel
Datasheet
Extended Debug Port Design Guide for UP and DP platforms
®
6700PXH PCI Hub Datasheet
®
82571EB Gigabit Ethernet Controller Datasheet
®
IMVP-6 Mobile Processor and Mobile Chipset Voltage Regulation
®
Core™ Duo Processoron 65nm Process Datasheet
®
Core™ 2 Duo Processor for Intel Centrino Mobile technology
Development Kit
Contact your Intel field
representative for access.
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
2.0 Getting Started
This chapter identifies the Intel® Core™ 2 Duo Processor and Intel® Core™ Duo
Processor with Intel
specifications. It also describes how to set up the board for operation. Development
software is included in the kit.
Note:
This manual assumes you are familiar with basic concepts involved with installing and
configuring hardware for a PC or server system.
2.1 Overview
The development kit contains a baseboard with an Intel® Core™ 2 Duo Processor
(2.16 GHz), Intel
components and peripheral connectors.
Note:
Note:
Note:
The development kit also contains an additional processor, an Intel
Processor (2 GHz), that can be installed in place of the Intel
The evaluation board is shipped as an open system allowing for maximum flexibility in
changi ng h ar d wa r e co nf ig uration and p er i p he rals in a la b en v i r onm en t . Si nce the board
is not in a protective chassis, the user is required to observe extra precautions when
handling and operating the system. Some assembly is required before use.
Review the document provided with the Development Kit titled Important Safety and
Re gula tor y I nfor mat io n. Thi s doc ument cont ai ns add it ion sa fet y war ning s and ca uti ons.
®
E7520 Chipset Development Kit key components, features and
®
E7520 MCH, Intel® 6300ESB ICH, and other system board
®
®
Core™ 2 Duo Processor.
Core™ Duo
January 2007 User’s Manual
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
2.2 Evaluation Board Features
Tabl e 3 provides an overview of the supported processor pairing for the Intel® E7520
MCH.
Table 3. Supported Processors
Development Kit
Processor Brand Process Clock Speed
®
Core™ Duo Processor T2500
Intel
®
Intel
Core™ Duo Processor L2400 (BGA Only) 1.66 GHz 667 MHz 2 MB L2
65 nm
Note:
®
Intel
Core™ 2 Duo Processor T7400 2.16 GHz 667 MHz 4 MB L2
®
Intel
Core™ 2 Duo Processor L7400 1.5 GHz 667 MHz 4 MB L2
The Intel
®
Core™ Duo ProcessorL2400 is supported by the Intel® E7520 MCH platform,
but a BGA part is not supported by the Customer Reference Board that is included in
this Development Kit.
®
Note:
The Intel
Core™ 2 Duo Processor (T7400 and L7400) and the Intel® Core™ Duo
Processor (T2500) are supported by the Customer Reference Board that is included in
this Development kit. The Customer Reference Board comes with the Intel
Duo Processor (T7400) installed at the factory . An Intel
is included in the Development Kit and can be installed in place of Intel
Processor. A separate BIOS flash chip is also included in this kit and must be installed
when using the Intel
®
Core™ Duo Processor.
The evaluation board features are summarized below:
®
•Intel
Core™ 2 Duo Processor (2.16 GHz) or Intel® Core™ Duo Processor (2 GHz)
— 667 MHz front side bus
— On-board processor voltage regulator compatible with IMVP-6 Design Guide
®
•Intel
E7520 MCH
— 1 PCI Express* x8 slot
— 1 PCI Express x4 slot
— 2 DDR2–400 DIMMs on two channels (4 slots total)
®
•Intel
6300ESB ICH
— From Intel
®
6300ESB ICH
1 PCI 2.2 32/33 Slot
2 PCI-X 66 MHz slots
2 IDE connectors
2 Serial ATA connectors
2 Serial ports
4 USB 2.0 ports
Front Side
Bus
2 GHz 667 MHz 2 MB L2
®
Core™ Duo Processor (T2500)
Cache
®
Core™ 2
®
Core™ 2 Duo
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
— Super I/O via LPC bus from the Intel® 6300ESB ICH
1 Floppy port
1 Parallel port
1 Serial port
1 PS/2 port
®
• Intel
6700PXH PCI Hub
— 2 PCI-X 100 MHz slots
— 1 PCI-X 133 MHz slot
®
• Intel
82571EB Gigabit Ethernet Controller
— 2 Gigabit Ethernet connections
• ITP-XDP debug port
• Port 80 7-segment LEDs
• Board Form Factor - 13” x 16” for benchtop use
2.3 Included Hardware
The following hardware is included in the development kit:
®
• Intel
• Intel
• Processor heatsink
• Pre-installed jumpers
• Two 512 MB DDR2-400 DIMMs
• Unformatted IDE Hard Drive
• IDE cable
• CD with drivers
• FWH mounted and flashed with the BIOS, additional BIOS chip for the Intel
• Standoffs for benchtop use
Core™ 2 Duo Processor 2.16 GHz, 667 MHz FSB (installed)
®
Core™ Duo Processor 2 GHz, 667 MHz FSB (additional processor)
Core™ Duo Processor
®
2.4 Software Key Features
The software in the development kit was chosen to facilitate development of real-time
appl ic ations based o n t he co mp on en t s us e d i n the evalua t i on b oa r d. T he sof t w a r e t o ol s
includ ed are des crib ed in this sec tion .
Drivers included:
• Chipset INF Install Utili ty for Micro so ft Windo w s*
• Optional Intel
• Linux* driver packages
Note:
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Software in the kit is provided free by the vendor and is only licensed for evaluation
purposes.
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
®
6300ESB ICH driver updates
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Refer to the documentation in your kit for further details on any terms and conditions
that may be applicable to the granted licenses. Customers using tools that work with
other third party products must have licensed those products. Any targets created by
those tools should also have appropriate licenses. Software included in the kit is subject
to change.
Refer to http://developer.intel.com/design/intarch/devkits for details on additional
software from other third party vendors.
2.4.1 AMIBIOS * fo r the D ev el op m en t Kit
The evaluation board is pre-installed and licensed with a copy of AMIBIOS* from
American Megatrends*.
BIOS updates may be updated periodically. Please contact an field sales representative
for BIOS updates.
2.5 Before You Begin
Tabl e 4 presents the additional hardware you may need for your kit.
Table 4. Additional Hardware
VGA Monitor You can use any standard VGA or greater resolution monitor.
Keyboard You can use a keyboard with a PS/2* connector or adapter as well as USB.
Mouse You can use a mouse with a PS/2* connector or adapter as well as USB.
Hard Drives You can connect up to four IDE and two SATA devices to the evaluation board.
Floppy Drive
(optional)
Other Devices and
Adapters
450 W or greater SSI
12 V external power
supply
You can connect a floppy drive to the connector on the evaluation board. No floppy
drives or cables are included in the development kit.
The evaluation board behaves much like a standard PC motherb oard. Many PC-
compatible peripherals can be attached and configured to work with the evaluation
board. For example, you may want to install a sound card or additional network
adapters. You are responsible for procuring and installing any drivers required for
additional devices.
Power supply for the Evaluation Board. No power supply is included in the
development kit.
Development Kit
2.5.1 Setting up the Evaluation Board
Once you have gathered the hardware described in Section 2.5, follow the steps below
to set up the development kit. This manual assumes you are familiar with basic
concepts involved with installing and configuring hardware for a PC or server system.
Note:
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
12 Order Number: 316068-001US
Review the document provided with the Development Kit titled Important Safety and
Re g ul at o r y I nf or m a t i on. T hi s do cum e nt con t ai ns add i t i on sa f ety warnings and ca ut i on s.
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
Figure 1. Evaluation Board Before Installing Additional Hardware
2.5.2 Safety
Ensure a safe work environment.
before removing any components from their anti-static packaging. The evaluation
board is susceptible to electrostatic discharge, which may cause product failure or
unpredictable operation.
Caution:
Warning:
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Connecting the wrong cable or reversing a cable may damage the evaluation board and
may da mag e the dev ice bein g conne ct ed. Si nce t he bo ard is not in a pr ote ct iv e chas sis,
use caution when connecting cables to this product.
Make sure AC cord of power supply is unplugged before performing the following steps
in Section 2.6.
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Make sure you are in a static-free environment
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
2.5.3 Packa g e Co nten ts
Development Kit
Veri f y ki t cont en ts.
Insp e ct t h e c ontents of yo ur k it and ensure that ever y t hi ng l i st e d
in Section 2.3 is included. Check for damage that may have occurred during shipment.
Contact your sales representative if any items are missing or damaged.
Check jumper settings.
Section 6.4 for detailed descriptions of all jumpers and their default settings indicated
in bold.
2.5.4 Installed Hardware
Verify installed hardware.
evaluation board:
•Intel
•Intel
®
E7520 MCH heatsink
®
6700PXH PCI Hub heatsink
•BIOS FWH
• Battery in holder
Caution:
The above hardware should have been correctly installed at the factory. If components
are not installed correctly, DO NOT power on the board. Correctly re-install the
components before proceeding. If you suspect that any of the kit components have
been damaged, contact your Intel field sales representative or local distributor for
assistance.
2.5.5 Installing Standoffs
The evaluation board in this development kit is shipped as an open system allowing for
maximum flexibility in changing hardware configuration and peripherals in the lab
environment. Since the board is not in a protective chassis, the user is required to
observe extra precautions when handling and operating the system.
Verify that the jumpers are set in their default state. Refer to
Make sure the following hardware is populated on your
The board is a standard ATX form factor and provides non-plated mounting holes with
top and bottom ground rings. If the board is not going to be used in a chassis,
standoffs are included for bench top use in the lab environment.
The development kit includes eight standoffs and eight screws that you can use to
attach to the board for bench top use. Standoffs should be attached to board at the
following mounting hole locations, A1, A4, A9, E1, E3, K1, J6, and J9.
1. Insert screw through top mounting hole.
2. Place standoff on back side of board and hand tighten to screw.
3. Repeat for additional standoffs on the board until all eight standoffs are installed.
2.5.6 Installing the Heatsinks for Processor and MCH
Heatsink Installation:
installed on the processor and on the Intel
wit hou t a pr o ce ss or t he r m al sol ution. Heats i nk s ma y al r e ad y com e p r e- i n st a ll e d on the
MCH. Please refer to this section if you need to remove or re-install the heatsinks.
Tools Needed:
Flat head screwdriver and Phillips head screwdriver
Consumable Items Needed:
Note:
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
14 Order Number: 316068-001US
Processor heatsink may be silver or copper in color.
In ord er f or t he bo ar d t o op erate prop er l y, a heat s in k mus t be
®
E7520 MCH.
DO NOT
power on board
Disposable towels and isopropyl alcohol
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
Table 5. Heatsink Information
Component
Processor 1 Cooler Master* EEP-N41CS-0 1-G P
®
Intel
E7520 MCH 1 Cooler Master* ECB-00208-03-GP Active heatsink
®
Intel
6700PXH PCI
Hub
Quantity Per
Board
1Sunon*
Heatsink
Manufacturer
Part Number Comments
Acti ve he atsi nk and
back plate
GC123506BH-
8DA.05.N.B515GN/
2026GN
Active heatsink
Figure 2. Location for the Processor, MCH, and PXH for Heatsink Installation
Caution:
Note:
Applying excess pressure may cause damage to the processor.
Do not turn power on until the processor thermal solution has been installed.
2.5.7 Processor Heatsink Installation
This section details how to install the processor heatsink.
Note:
January 2007 User’s Manual
Order Number: 31 60 68 -00 1U S 15
If the Thermal Interface Material (TIM) is scratched, scrape it off and replace with new
material. If a replacement is needed, use a TIM with high thermal conductivity such as
thermal grease or a phase change material. The gasket ensures the heatsink is sitting
flat on the package.
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Figure 3. Processor Heatsink Top and Bottom View
1. Make certain that the processor is firmly seated in socket U6G1, and the package is
secured using a flathead screwdriver.
Development Kit
Note:
The processor socket has a screw locking mechanism. The socket has an indication to
show if the processor is locked in place. To remove the processor, turn the screw
counter-clockwise all the way until it stops. The processor will be loose and will come
out easily. To insert the processor, line up the socket and processor corners that do not
have pins and insert the processor in the socket. Turn the screw clock-wise until it is
tight and the processor is firmly held.
Figure 4. Processor in Socket and Package Secured
z
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Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
2. Clean the top surface of the processor die with a clean towel and isopropyl alcohol
(IPA).
Figure 5. Clean Top of Processor Die
Note:
3. Install the back plate to the bottom side of the PCB at the processor location. Align
the standoffs to the four mounting holes in the board.
There is a non-electrically conductive tape to hold the back plate in place until the
heatsink is completely installed.
January 2007 User’s Manual
Order Number: 31 60 68 -00 1U S 17
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Figure 6. Back Plate in Place
Development Kit
4. Mount the heatsink to the processor. Ensure the TIM and die have contact.
Figure 7. Heatsink Mounted on Processor
5. Align the screws (4x at corners) to the threaded holes of the standoffs on the back
plate. Using the Phillips head screwdriver, tighten the four screws in a diagonal
manner (as shown in the diagram). Tighten each screw half of the screw length for
A to B and follow by ¼ for C to D. Then tighten A to B until the screw hard stops
and repeat for C to D. The screws are designed to compress the springs a
predetermined amount.
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
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Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Development Kit
Figure 8. Screw Tightening Order
6. Plug the fan connector to the fan pin header J7J1 on the board.
Note:
The heatsink removal process is the reverse of the installation procedure.
2.5.8 MCH Heatsink Installation
This section may not apply if the MCH heatsink is pre-installed on the board. However,
you may want to briefly look over the procedure to verify that the heatsink is properly
installed and it has not been damaged in the packaging.
Note:
Figure 9. MCH Heatsink Top View
If the Thermal Interface Material (TIM) is scratched, scrape it off and replace with new
material. Use a TIM with high thermal conductivity, such as thermal grease or phase
change material.
1. Clean t he t op sur f ac e of t he MC H di e wi t h a cl ea n t ow el and is op r op y l al c oho l ( I P A ) .
January 2007 User’s Manual
Order Number: 31 60 68 -00 1U S 19
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
Intel® Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset
Figure 10. Clean Top of MCH Die
Development Kit
2. Hook one end of the heatsink clip to one of the anchors located near the corner of
the MCH. Securely hold the other end of the heatsink clip.
Figure 11. Hook Heatsink Clip to Anchor
3. Hold the clip firmly to the anchor to prevent the heatsink from moving. Attach the
other end of the clip to the other anchor. Ensure that the heatsink is level with the
MCH package.
®
Intel
Core™ 2 Duo Processor and Intel® Core™ Duo Processor with Intel® E7520 Chipset Development Kit
User’s Manual January 2007
20 Order Number: 316068-001US
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