Intel BOXNUC8I7HNKQC Product Data Sheet

Intel® NUC Kit NUC8i7HN
Technical Product Specification
Regulatory Model: NUC8HN
August 2018
Order Number: J89398-005
Revision History
003
Spec clarification
May 2018
004
Spec change
July 2018
005
Spec change
August 2018
Revision Revision History Date
001 First release of the Intel NUC Kit NUC8i7HN Technical Product Specification March 2018
002 Spec change April 2018
Disclaimer
This product specification applies to only the standard Intel NUC Kit with BIOS identifier HNSKLi70.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel NUC Kits are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
Learn About Intel
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others. Copyright  2018 Intel Corporation. All rights reserved.
®
Processor Numbers
Kit Identification Information
SA Revision
Power Cord
BIOS Revision
Notes
J71486 – 502
EU Power Cord
HNKBLi70.86A.0029
1,2
J71486 – 502
UK Power Cord
HNKBLi70.86A.0029
1,2
J71486 – 502
AU Power Cord
HNKBLi70.86A.0029
1,2
Device
Stepping
S-Spec Numbers
Intel Core i7-8705G
B0
SR3RK
Differentiating Features
Kit with Power Adapter
Kit with Power Adapter, 512GB Intel® M.2 NVME SSD,
Date
Type of Change
Description of Changes or Clarifications
April 2018
Specification
Changed TBD86A to HNKBLi70.86A in the section “Overview of BIOS
May 2018
Specification
Corrected reference to Table 3 in section “DisplayPort 1.2 Multi-Stream
Basic Intel® NUC Kit NUC8i7HN Identification Information
J71486 – 502 No Power Cord HNKBLi70.86A.0029 1,2
J71486 – 502 US Power Cord HNKBLi70.86A.0029 1,2
Notes:
1. The SA number is found on a bottom side of the chassis.
2. The Intel® Core™ i7-8705G processor is used on this SA revision consisting of the following component:
Product Identification Information
Intel® NUC Products NUC8i7HNK{x} Identification Information
Product Name Intel® NUC Board
NUC8i7HNK NUC8i7HNB
NUC8i7HNKQC{x}
J71486 – xxx
16GB DDR4-2400 SDRAM, Microsoft Windows 10 Home
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC8i7HN.
Specification Changes or Clarifications
change
clarification
Features” > “Introduction”
Changed hyperlink http://intel.com/TBD to https://downloadcenter.intel.com/download/27641 in the section “Overview of BIOS Features” > “System LED Functionality”
Transport Daisy-Chaining”
iii
Intel NUC Kit NUC8i7HN Technical Product Specification
July 2018
Spec change
Added SATA Power section to 2.2.3.1
August 2018
Spec change
Added “Product Identification Information” table
Added 1.15 – Intel Platform Security Technologies
Added 1.16 – Thunderbolt 3
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html
for the latest documentation.
iv
Preface
Chapter
Description
1
A description of the hardware used on Intel NUC Kit NUC8i7HN
2
A map of the resources of the Intel NUC Kit NUC8i7HN
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
This Technical Product Specification (TPS) specifies the layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Kit NUC8i7HN.
NOTE
In this document, the use of “kit” will refer to Intel® NUC Kit NUC8i7HN.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC8i7HN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel NUC Kit NUC8i7HN Technical Product Specification
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
KB Kilobyte (1024 bytes)
MB/s Megabytes per second
Xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
owners.
vi
Contents
Revision History ............................................................................................................... ii
Disclaimer .................................................................................................................................................................. ii
Kit Identification Information ........................................................................................................................... iii
Product Identification Information ................................................................................................................. iii
Errata ........................................................................................................................................................................... iv
Preface ............................................................................................................................... v
Intended Audience ................................................................................................................................................. v
What This Document Contains ......................................................................................................................... v
Typographical Conventions ............................................................................................................................... v
Contents .......................................................................................................................... vii
1 Product Description ............................................................................................... 11
1.1 Overview ...................................................................................................................................................... 11
1.1.1 Feature Summary .................................................................................................................. 11
1.1.2 Block Diagram ......................................................................................................................... 13
1.2 Online Support .......................................................................................................................................... 14
1.3 Processor ..................................................................................................................................................... 14
1.4 Platform Controller Hub (PCH) ........................................................................................................... 14
1.4.1 Direct Media Interface (DMI) .............................................................................................. 14
1.5 System Memory ........................................................................................................................................ 15
1.5.1 Memory Configurations ...................................................................................................... 16
1.6 Graphics Capabilities .............................................................................................................................. 17
1.6.1 Intel Integrated Graphics .................................................................................................... 17
1.6.2 Radeon RX Vega M ................................................................................................................ 17
1.7 USB ................................................................................................................................................................. 21
1.8 Storage Interface ...................................................................................................................................... 22
1.8.1 AHCI Mode ................................................................................................................................ 22
1.8.2 Intel® Rapid Storage Technology / SATA RAID ......................................................... 22
1.9 SDXC Card Reader ................................................................................................................................... 22
1.10 Real-Time Clock ........................................................................................................................................ 23
1.11 Audio 23
1.11.1 Audio Software ....................................................................................................................... 24
1.12 LAN 24
1.12.1 Intel® Gigabit Ethernet Controller I219-LM ................................................................ 24
1.12.2 Intel® Gigabit Ethernet Controller I210-AT ................................................................. 24
1.12.3 LAN Software ........................................................................................................................... 25
1.12.4 RJ-45 LAN Connector with Integrated LEDs .............................................................. 26
1.12.5 Wireless Network Module .................................................................................................. 27
1.13 Hardware Management Subsystem ................................................................................................. 27
vii
1.13.1 Hardware Monitoring ........................................................................................................... 27
1.13.2 Fan Monitoring ........................................................................................................................ 27
1.13.3 Thermal Solution ................................................................................................................... 28
1.14 Power Management ................................................................................................................................ 29
1.14.1 ACPI ............................................................................................................................................. 29
1.14.2 Hardware Support ................................................................................................................. 31
1.15 Intel Platform Security Technologies .............................................................................................. 33
1.15.1 Intel® Virtualization Technology ...................................................................................... 33
1.15.2 Intel® Platform Trust Technology ................................................................................... 33
1.16 Thunderbolt 3 ............................................................................................................................................ 34
2 Technical Reference ............................................................................................... 35
2.1 Memory Resources .................................................................................................................................. 35
2.1.1 Addressable Memory ........................................................................................................... 35
2.2 Connectors and Headers....................................................................................................................... 35
2.2.1 Front Panel Connectors ...................................................................................................... 36
2.2.2 Back Panel Connectors ....................................................................................................... 38
2.2.3 USB and I/O Headers ........................................................................................................... 39
2.3 VESA Bracket .............................................................................................................................................. 48
2.4 Power Supply ............................................................................................................................................. 50
2.4.1 Power Supply Connector ................................................................................................... 51
2.4.2 Fan Header Current Capability ......................................................................................... 51
2.5 Reliability ..................................................................................................................................................... 51
2.6 Environmental ........................................................................................................................................... 52
3 Overview of BIOS Features ................................................................................... 53
3.1 Introduction ................................................................................................................................................ 53
3.2 BIOS Flash Memory Organization ..................................................................................................... 53
3.3 System Management BIOS (SMBIOS) .............................................................................................. 53
3.4 Legacy USB Support ............................................................................................................................... 54
3.5 BIOS Updates ............................................................................................................................................. 54
3.5.1 Language Support ................................................................................................................. 55
3.6 BIOS Recovery ........................................................................................................................................... 55
3.7 Boot Options .............................................................................................................................................. 55
3.7.1 Network Boot........................................................................................................................... 55
3.7.2 Booting Without Attached Devices ................................................................................ 56
3.7.3 Changing the Default Boot Device During POST ...................................................... 56
3.7.4 Power Button Menu .............................................................................................................. 57
3.8 Hard Disk Drive Password Security Feature .................................................................................. 58
3.9 BIOS Security Features .......................................................................................................................... 58
3.10 System LED Functionality ..................................................................................................................... 60
4 Error Messages and Blink Codes ......................................................................... 61
4.1 Front-panel Power LED Blink Codes ................................................................................................ 61
4.2 BIOS Error Messages ............................................................................................................................... 61
viii
Contents
Figures
Figure 1. Block Diagram ........................................................................................................................................... 13
Figure 2. Memory Channel and SO-DIMM Configuration.......................................................................... 16
Figure 3. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 23
Figure 4. LAN Connector LED Locations........................................................................................................... 26
Figure 5. Thermal Solution and Fan Header ................................................................................................... 28
Figure 6. Front Panel Layout ................................................................................................................................. 36
Figure 7. Back Panel Layout ................................................................................................................................... 38
Figure 8. Headers and Connectors (Top) ......................................................................................................... 39
Figure 9. USB 3.0 Internal Header (1.25 mm Pitch) ..................................................................................... 41
Figure 10. Connection Diagram for the Internal IO Common Header (1.25 mm Pitch)................ 42
Figure 11. Additional Headers and Connectors ............................................................................................ 43
Figure 12. BIOS Security Jumper ........................................................................................................................ 44
Figure 13. Kit Dimensions ....................................................................................................................................... 47
Figure 14. Install VESA Bracket ............................................................................................................................ 48
Figure 15. VESA Bracket Dimensions ................................................................................................................ 49
Figure 16. Power Adapter and Plugs Included with the Kit ...................................................................... 50
Tables
Table 1. Feature Summary ..................................................................................................................................... 11
Table 2. Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations .................................... 15
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions .......................... 19
Table 4. Multiple Display Configuration Maximum Resolutions ............................................................ 20
Table 5. Audio Formats Supported by the HDMI and Mini DisplayPort Interfaces ........................ 21
Table 6. LAN Connector LED States ................................................................................................................... 26
Table 7. Effects of Pressing the Power Switch ............................................................................................... 29
Table 8. Power States and Targeted System Power ................................................................................... 30
Table 9. Wake-up Devices and Events .............................................................................................................. 31
Table 10. Components Shown in Figure 6 ...................................................................................................... 36
Table 11. Components Shown in Figure 7 ...................................................................................................... 38
Table 12. Headers and Connectors Shown in Figure 8 .............................................................................. 39
Table 13. Auxiliary SATA power connector pin out ..................................................................................... 40
Table 14. Headers and Connectors Shown in Figure 11 ........................................................................... 43
Table 15. BIOS Security Jumper Settings ........................................................................................................ 45
Table 16. M.2 2280 Module (key type M) Connectors ................................................................................ 45
Table 17. Dual Fan Header Current Capability .............................................................................................. 51
Table 18. Environmental Specifications ........................................................................................................... 52
Table 19. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 55
Table 20. Boot Device Menu Options ................................................................................................................ 56
Table 21. Master Key and User Hard Drive Password Functions ........................................................... 58
Table 22. Supervisor and User Password Functions................................................................................... 59
Table 23. Default RGB LED Locations and Behaviors .............................................................................. 60
Table 24. Front-panel Power LED Blink Codes ............................................................................................. 61
ix
Table 25. BIOS Error Messages ............................................................................................................................ 61
x
8.66 inches by 5.51 inches by 1.57 inches (220 millimeters by 140 millimeters by
Processor
A soldered-down 8
th
generation Intel® Core™ i7-8705G quad-core processor with up to a
PCH
Intel® HM175 Platform Controller Hub
Memory
Two 260-pin DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
Graphics
Integrated graphics support for processors with Intel® Graphics Technology
Audio
Intel® High Definition (Intel
®
HD) Audio via the HDMI v2.0, Mini DisplayPort 1.2 and Type C

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Kit NUC8i7HN.
Table 1. Feature Summary
Form Factor
40 millimeters)
maximum 45 W TDP
Intel® HD Graphics 630 Integrated memory controller
sockets
Support for DDR4 2400 MHz SO-DIMMs
Support for 4 Gb and 8 Gb memory technology
Support for up to 32 GB of system memory with two SO-DIMMs
Support for non-ECC memory
Support for 1.2 V and 1.35 V low voltage JEDEC memory only
Note: 2 Gb memory technology (SDRAM Density) is not compatible
Discrete graphics support by Radeon RX Vega M GL Two Full Size High Definition Multimedia Interface* (HDMI*) Front and Back panel
connectors
Two Mini DisplayPort* back panel connectors Two Type C back panel connectors
interfaces through the processor/Discrete GPU
Radeon High Definition Audio
Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel
and 3.5mm combination speaker/TOSLINK jack on the back panel
Storage Two SATA 6.0 Gb/s or Gen3 PCIe X4 AHCI, NVMe ports are reserved for M.2 storage
modules supporting M.2 2242 and M.2 2280 (key type M) modules
Note: Supports key type M (PCI Express* x1/x2/x4 and SATA)
continued
11
Peripheral Interfaces
• USB 3.1 Gen 2 Ports:
Expansion Capabilities
Two M.2 connectors supporting M.2 2242 (1 slot) and M.2 2280 (key type M both slots)
BIOS
Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
Instantly Available PC
Suspend to RAM support
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® Gigabit Ethernet Controller
Wireless
Intel® Dual Band Wireless-AC 8265
Table 1. Feature Summary (continued)
USB 3.0 Ports:
USB 2.0 ports:
• Consumer Infrared (CIR)
• One Full Size SDXC Slot
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
One Type-A port is implemented with an external front panel connector (blue), one
Type C port is implemented with an external front panel connnector
One port is implemented with an external front panel connector (yellow charging
capable)
Four ports are implemented with external back panel connectors (blue) Two ports are implemented via an internal header (blue)1 port implemented via the external back panel Type C connector
Two ports via an internal common IO header (white) One port is reserved for the M.2 2230 Wireless module
modules
System Management BIOS (SMBIOS)
Technology
LAN
Hardware Monitor Subsystem
Wake on PCI Express, LAN, front panel, CIR, and USB ports
I219-LM
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® Gigabit Ethernet Controller I210-at
Hardware monitoring subsystem, based on a ITE IT8987VG including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
Two processor fan headers
Fan sense input used to monitor fan activity
Fan speed control
802.11ac, Dual Band, Wi-Fi + Bluetooth 4.2
Supports Intel® Wireless Display 6.0 (WiDi)
12

1.1.2 Block Diagram

Figure 1 is a block diagram of the major functional areas of Intel NUC Kit NUC8i7HN.
Product Description
Figure 1. Block Diagram
13
To find information about…
Visit this World Wide Web site:
Intel NUC Kit NUC8i7HN
http://www.intel.com/NUC
Intel NUC Kit Support
http://www.intel.com/NUCSupport
Available configurations for Intel NUC Kit NUC8i7HN
http://ark.intel.com
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/NUCSupport
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
http://ark.intel.com

1.2 Online Support

1.3 Processor

A soldered-down 8th generation Intel® Core™ i7-8705G quad-core processor with up to a maximum 45 W TDP.
Intel HD Graphics 630
Integrated memory controller
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 50 for information on power supply requirements.

1.4 Platform Controller Hub (PCH)

A soldered-down Intel HM175 Platform Controller Hub with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LAN, PCI Express interfaces. The HM175 is a centralized controller for the kit’s I/O paths.

1.4.1 Direct Media Interface (DMI)

Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.
14
Product Description
# of
A
8GB
8Gb
1024M x 8
8 1 16/10
16
8K B 8GB
4Gb
512M x 8
16 2 15/10
16
8K
B
16GB
8Gb
1024M x 8
16 2 16/10
16
8K
C
4GB
8Gb
512M x 16
4 1 16/10
8
8K E 8GB
4Gb
512M x 8
16 2 15/10
16
8K
E
16GB
8Gb
1024M x 8
16 2 16/10
16
8K
For information about…
Refer to:
Tested Memory
http://www.intel.com/NUCSupport

1.5 System Memory

The kit has two 260-pin SO-DIMM sockets and supports the following memory features:
1.2V / 1.35V DDR4 SDRAM SO-DIMMs with gold plated contacts
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
32 GB maximum total system memory. Refer to Section 2.1.1 on page 35 for information on
the total amount of addressable memory.
Minimum recommended total system memory: 4096 MB
Non-ECC SO-DIMMs
Serial Presence Detect
DDR4 2400 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the kit should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.
Table 2 lists the supported SO-DIMM configurations.
Table 2. Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations
Raw Card Version
A 4GB 4Gb 512M x 8 8 1 15/10 16 8K
C 2GB 4Gb 256M x 16 4 1 15/10 8 8K
DIMM Capacity
DRAM Device Technology
DRAM Organization
# of DRAM Devices
# of Ranks
# of Row/Col Address Bits
Banks Inside DRAM
Page Size
15
For information about…
Refer to:

1.5.1 Memory Configurations

The processor supports the following types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
Memory Configuration Examples http://www.intel.com/NUCSupport
Figure 2 illustrates the memory channel and SO-DIMM configuration.
16
Figure 2. Memory Channel and SO-DIMM Configuration
Product Description

1.6 Graphics Capabilities

The kit supports graphics computing through Intel® HD™ Graphics 630.

1.6.1 Intel Integrated Graphics

The kit supports integrated graphics processing via the processor.
1.6.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel HD graphics controller features the following:
3D Features
DirectX* 12.1 support OpenGL* 4.4 support OpenCL* 2.1, OpenCL 2.0, OpenCL 1.2 support
Video:
Next Generation Intel® Clear Video Technology HD support is a collection of video playback
and enhancement features that improve the end user’s viewing experience
Encode/transcode HD content
DirectX* Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2/HEVC HW Encode/Decode
Intel
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)
*The graphics outputs of the NUC8i7HN are not physically connected to the HD Graphics 630.
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.

1.6.2 Radeon RX Vega M

The kit supports graphics processing via discrete on package Radeon RX Vega M GL graphics processor.
1.6.2.1 Radeon™ RX Vega M GL Graphics
The Radeon RX Vega M GL Graphics controller features the following:
3D Features
DirectX* 12 (Direct3D feature level 12.0 support) OpenGL* 4.5 support OpenCL* 2.0 support Vulkan 1.0
Decode:
HEVC Main Profile@level 5.1
HEVC Main10 Profile@level 5.1
H.264 Constrained Baseline Profile@level 5.2
H.264 Main Profile@level 5.2
17
H.264 High Profile@level 5.2
H.264 Stereo High Profile@level 5.2
VC1 Simple & Main Profile@High Level(VLD)
VC1 Advanced Profile@level 3(VLD)
MPEG2 Main Profile@High level(IDCT/VLD)
MPEG4 Part 2 Advanced Simple Profile@level 5
MJPEG 1080p@60fps
Encode:
H.264 Constrained Baseline Profile@level 5.2
H.264 Main Profile@level 5.2
H.264 High Profile@level 5.2
HEVC user program up to Main Profile@level 6.2 for offline encode; HEVC Main Profile@level
5.1 in real time
1.6.2.2 Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.
1.6.2.3 High Definition Multimedia Interface* (HDMI*)
The HDMI ports support standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The ports are compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/192 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24 bpp. The HDMI ports are compliant with the HDMI 2.0b specification.
For information about Refer to
HDMI technology http://www.hdmi.org
1.6.2.4 DisplayPort* via Mini DisplayPort and Type C
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The Mini DisplayPort and Type C connectors are compliant with the DisplayPort 1.2 specification and have a maximum supported resolution of 4096 x 2160 @ 60Hz 24bpp.
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 specification and allow for this feature.
18
Product Description
DisplayPort technology
http://www.displayport.org
DisplayPort Usage Models
Monitor 1
Monitor 2
Monitor 3
2 Monitors
2560 x 1600 @ 60 Hz
2560 x 1600 @ 60 Hz
3 Monitors
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
For information about Refer to
1.6.2.4.1 DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions
3 Monitors 1920 x 1200 @ 60 Hz 1920 x 1200 @ 60 Hz 1920 x 1200 @ 60 Hz
(with DisplayPort 1.2 hub)
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