Intel® NUC Kit NUC8i7HN
Technical Product Specification
Regulatory Model: NUC8HN
August 2018
Order Number: J89398-005
Intel NUC Kit NUC8i7HN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Kit NUC8i7HN Specification Update.
Revision History
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Revision History |
Date |
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001 |
First release of the Intel NUC Kit NUC8i7HN Technical Product Specification |
March 2018 |
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002 |
Spec change |
April 2018 |
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003 |
Spec clarification |
May 2018 |
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004 |
Spec change |
July 2018 |
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005 |
Spec change |
August 2018 |
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Disclaimer
This product specification applies to only the standard Intel NUC Kit with BIOS identifier HNSKLi70.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel NUC Kits are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others.
Copyright 2018 Intel Corporation. All rights reserved.
Kit Identification Information
Basic Intel® NUC Kit NUC8i7HN Identification Information
SA Revision |
Power Cord |
BIOS Revision |
Notes |
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J71486 – 502 |
No Power Cord |
HNKBLi70.86A.0029 |
1,2 |
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J71486 – 502 |
US Power Cord |
HNKBLi70.86A.0029 |
1,2 |
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J71486 – 502 |
EU Power Cord |
HNKBLi70.86A.0029 |
1,2 |
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J71486 – 502 |
UK Power Cord |
HNKBLi70.86A.0029 |
1,2 |
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J71486 – 502 |
AU Power Cord |
HNKBLi70.86A.0029 |
1,2 |
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Notes:
1.The SA number is found on a bottom side of the chassis.
2.The Intel® Core™ i7-8705G processor is used on this SA revision consisting of the following component:
Device |
Stepping |
S-Spec Numbers |
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Intel Core i7-8705G |
B0 |
SR3RK |
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Product Identification Information
Intel® NUC Products NUC8i7HNK{x} Identification Information
Product Name |
Intel® NUC Board |
Differentiating Features |
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NUC8i7HNK |
NUC8i7HNB |
Kit with Power Adapter |
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J71486 – xxx |
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NUC8i7HNKQC{x} |
Kit with Power Adapter, 512GB Intel® M.2 NVME SSD, |
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16GB DDR4-2400 SDRAM, |
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Microsoft Windows 10 Home |
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Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC8i7HN.
Specification Changes or Clarifications
Date |
Type of Change |
Description of Changes or Clarifications |
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April 2018 |
Specification |
Changed TBD86A to HNKBLi70.86A in the section “Overview of BIOS |
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change |
Features” > “Introduction” |
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Changed hyperlink http://intel.com/TBD to |
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https://downloadcenter.intel.com/download/27641 in the section “Overview |
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of BIOS Features” > “System LED Functionality” |
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May 2018 |
Specification |
Corrected reference to Table 3 in section “DisplayPort 1.2 Multi-Stream |
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clarification |
Transport Daisy-Chaining” |
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iii
Intel NUC Kit NUC8i7HN Technical Product Specification
July 2018 |
Spec change |
Added SATA Power section to 2.2.3.1 |
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Added 1.15 |
– Intel Platform Security Technologies |
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Added 1.16 |
– Thunderbolt 3 |
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August 2018 |
Spec change |
Added “Product Identification Information” table |
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Errata
Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.
iv
Preface
This Technical Product Specification (TPS) specifies the layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Kit NUC8i7HN.
NOTE
In this document, the use of “kit” will refer to Intel® NUC Kit NUC8i7HN.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC8i7HN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter |
Description |
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1 |
A description of the hardware used on Intel NUC Kit NUC8i7HN |
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2 |
A map of the resources of the Intel NUC Kit NUC8i7HN |
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3 |
The features supported by the BIOS Setup program |
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4 |
A description of the BIOS error messages, beep codes, and POST codes |
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5 |
Regulatory compliance and battery disposal information |
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Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel NUC Kit NUC8i7HN Technical Product Specification
Other Common Notation
# |
Used after a signal name to identify an active-low signal (such as USBP0#) |
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GB |
Gigabyte (1,073,741,824 bytes) |
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GB/s |
Gigabytes per second |
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Gb/s |
Gigabits per second |
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KB |
Kilobyte (1024 bytes) |
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Kb |
Kilobit (1024 bits) |
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kb/s |
1000 bits per second |
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MB |
Megabyte (1,048,576 bytes) |
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MB/s |
Megabytes per second |
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Mb |
Megabit (1,048,576 bits) |
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Mb/s |
Megabits per second |
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TDP |
Thermal Design Power |
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Xxh |
An address or data value ending with a lowercase h indicates a hexadecimal value. |
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x.x V |
Volts. Voltages are DC unless otherwise specified. |
*This symbol is used to indicate third-party brands and names that are the property of their respective owners.
vi
Contents
Revision History............................................................................................................... |
ii |
Disclaimer .................................................................................................................................................................. |
ii |
Kit Identification Information ........................................................................................................................... |
iii |
Product Identification Information................................................................................................................. |
iii |
Errata........................................................................................................................................................................... |
iv |
Preface ............................................................................................................................... |
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v |
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Intended Audience................................................................................................................................................. |
v |
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What This Document Contains......................................................................................................................... |
v |
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Typographical Conventions ............................................................................................................................... |
v |
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Contents .......................................................................................................................... |
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vii |
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1 Product Description ............................................................................................... |
11 |
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1.1 |
Overview ...................................................................................................................................................... |
11 |
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1.1.1 |
Feature Summary .................................................................................................................. |
11 |
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1.1.2 |
Block Diagram ......................................................................................................................... |
13 |
1.2 |
Online Support.......................................................................................................................................... |
14 |
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1.3 |
Processor..................................................................................................................................................... |
14 |
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1.4 |
Platform Controller Hub (PCH)........................................................................................................... |
14 |
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1.4.1 |
Direct Media Interface (DMI).............................................................................................. |
14 |
1.5 |
System Memory ........................................................................................................................................ |
15 |
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1.5.1 |
Memory Configurations ...................................................................................................... |
16 |
1.6 |
Graphics Capabilities .............................................................................................................................. |
17 |
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1.6.1 |
Intel Integrated Graphics.................................................................................................... |
17 |
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1.6.2 |
Radeon RX Vega M................................................................................................................ |
17 |
1.7 |
USB................................................................................................................................................................. |
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21 |
1.8 |
Storage Interface...................................................................................................................................... |
22 |
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1.8.1 |
AHCI Mode................................................................................................................................ |
22 |
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1.8.2 |
Intel® Rapid Storage Technology / SATA RAID ......................................................... |
22 |
1.9 |
SDXC Card Reader ................................................................................................................................... |
22 |
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1.10 Real-Time Clock........................................................................................................................................ |
23 |
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1.11 Audio |
23 |
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1.11.1 |
Audio Software ....................................................................................................................... |
24 |
1.12 LAN |
24 |
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1.12.1 Intel® Gigabit Ethernet Controller I219-LM ................................................................ |
24 |
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1.12.2 Intel® Gigabit Ethernet Controller I210-AT................................................................. |
24 |
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1.12.3 |
LAN Software........................................................................................................................... |
25 |
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1.12.4 RJ-45 LAN Connector with Integrated LEDs.............................................................. |
26 |
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1.12.5 |
Wireless Network Module.................................................................................................. |
27 |
1.13 Hardware Management Subsystem ................................................................................................. |
27 |
vii
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1.13.1 |
Hardware Monitoring ........................................................................................................... |
27 |
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1.13.2 |
Fan Monitoring........................................................................................................................ |
27 |
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1.13.3 |
Thermal Solution................................................................................................................... |
28 |
1.14 |
Power Management ................................................................................................................................ |
29 |
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1.14.1 |
ACPI............................................................................................................................................. |
29 |
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1.14.2 |
Hardware Support................................................................................................................. |
31 |
1.15 |
Intel Platform Security Technologies .............................................................................................. |
33 |
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1.15.1 |
Intel® Virtualization Technology...................................................................................... |
33 |
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1.15.2 Intel® Platform Trust Technology ................................................................................... |
33 |
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1.16 |
Thunderbolt 3............................................................................................................................................ |
34 |
2 Technical Reference............................................................................................... |
35 |
||
2.1 |
Memory Resources .................................................................................................................................. |
35 |
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2.1.1 |
Addressable Memory........................................................................................................... |
35 |
2.2 |
Connectors and Headers....................................................................................................................... |
35 |
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2.2.1 |
Front Panel Connectors ...................................................................................................... |
36 |
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2.2.2 |
Back Panel Connectors ....................................................................................................... |
38 |
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2.2.3 |
USB and I/O Headers ........................................................................................................... |
39 |
2.3 |
VESA Bracket.............................................................................................................................................. |
48 |
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2.4 |
Power Supply............................................................................................................................................. |
50 |
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2.4.1 |
Power Supply Connector ................................................................................................... |
51 |
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2.4.2 |
Fan Header Current Capability......................................................................................... |
51 |
2.5 |
Reliability ..................................................................................................................................................... |
51 |
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2.6 |
Environmental ........................................................................................................................................... |
52 |
3 Overview of BIOS Features................................................................................... |
53 |
||
3.1 |
Introduction................................................................................................................................................ |
53 |
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3.2 |
BIOS Flash Memory Organization ..................................................................................................... |
53 |
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3.3 |
System Management BIOS (SMBIOS).............................................................................................. |
53 |
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3.4 |
Legacy USB Support ............................................................................................................................... |
54 |
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3.5 |
BIOS Updates............................................................................................................................................. |
54 |
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3.5.1 |
Language Support................................................................................................................. |
55 |
3.6 |
BIOS Recovery ........................................................................................................................................... |
55 |
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3.7 |
Boot Options .............................................................................................................................................. |
55 |
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3.7.1 |
Network Boot........................................................................................................................... |
55 |
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3.7.2 |
Booting Without Attached Devices ................................................................................ |
56 |
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3.7.3 |
Changing the Default Boot Device During POST...................................................... |
56 |
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3.7.4 |
Power Button Menu.............................................................................................................. |
57 |
3.8 |
Hard Disk Drive Password Security Feature.................................................................................. |
58 |
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3.9 |
BIOS Security Features .......................................................................................................................... |
58 |
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3.10 System LED Functionality..................................................................................................................... |
60 |
4 Error Messages and Blink Codes......................................................................... |
61 |
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4.1 |
Front-panel Power LED Blink Codes................................................................................................ |
61 |
4.2 |
BIOS Error Messages............................................................................................................................... |
61 |
viii
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Contents |
Figures |
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Figure 1. Block Diagram........................................................................................................................................... |
13 |
Figure 2. Memory Channel and SO-DIMM Configuration.......................................................................... |
16 |
Figure 3. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... |
23 |
Figure 4. LAN Connector LED Locations........................................................................................................... |
26 |
Figure 5. Thermal Solution and Fan Header................................................................................................... |
28 |
Figure 6. Front Panel Layout ................................................................................................................................. |
36 |
Figure 7. Back Panel Layout................................................................................................................................... |
38 |
Figure 8. Headers and Connectors (Top) ......................................................................................................... |
39 |
Figure 9. USB 3.0 Internal Header (1.25 mm Pitch) ..................................................................................... |
41 |
Figure 10. Connection Diagram for the Internal IO Common Header (1.25 mm Pitch)................ |
42 |
Figure 11. Additional Headers and Connectors ............................................................................................ |
43 |
Figure 12. BIOS Security Jumper ........................................................................................................................ |
44 |
Figure 13. Kit Dimensions....................................................................................................................................... |
47 |
Figure 14. Install VESA Bracket............................................................................................................................ |
48 |
Figure 15. VESA Bracket Dimensions ................................................................................................................ |
49 |
Figure 16. Power Adapter and Plugs Included with the Kit...................................................................... |
50 |
Tables |
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Table 1. Feature Summary..................................................................................................................................... |
11 |
Table 2. Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations.................................... |
15 |
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions .......................... |
19 |
Table 4. Multiple Display Configuration Maximum Resolutions ............................................................ |
20 |
Table 5. Audio Formats Supported by the HDMI and Mini DisplayPort Interfaces........................ |
21 |
Table 6. LAN Connector LED States................................................................................................................... |
26 |
Table 7. Effects of Pressing the Power Switch............................................................................................... |
29 |
Table 8. Power States and Targeted System Power ................................................................................... |
30 |
Table 9. Wake-up Devices and Events.............................................................................................................. |
31 |
Table 10. Components Shown in Figure 6 ...................................................................................................... |
36 |
Table 11. Components Shown in Figure 7 ...................................................................................................... |
38 |
Table 12. Headers and Connectors Shown in Figure 8.............................................................................. |
39 |
Table 13. Auxiliary SATA power connector pin out..................................................................................... |
40 |
Table 14. Headers and Connectors Shown in Figure 11........................................................................... |
43 |
Table 15. BIOS Security Jumper Settings........................................................................................................ |
45 |
Table 16. M.2 2280 Module (key type M) Connectors................................................................................ |
45 |
Table 17. Dual Fan Header Current Capability .............................................................................................. |
51 |
Table 18. Environmental Specifications........................................................................................................... |
52 |
Table 19. Acceptable Drives/Media Types for BIOS Recovery ............................................................... |
55 |
Table 20. Boot Device Menu Options................................................................................................................ |
56 |
Table 21. Master Key and User Hard Drive Password Functions........................................................... |
58 |
Table 22. Supervisor and User Password Functions................................................................................... |
59 |
Table 23. Default RGB LED Locations and Behaviors.............................................................................. |
60 |
Table 24. Front-panel Power LED Blink Codes ............................................................................................. |
61 |
ix
Table 25. BIOS Error Messages............................................................................................................................ |
61 |
x
Table 1 summarizes the major features of Intel® NUC Kit NUC8i7HN.
Table 1. Feature Summary
Form Factor |
8.66 inches by 5.51 inches by 1.57 inches (220 millimeters by 140 millimeters by |
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40 millimeters) |
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Processor |
• A soldered-down 8th generation Intel® Core™ i7-8705G quad-core processor with up to a |
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maximum 45 W TDP |
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― Intel® HD Graphics 630 |
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― Integrated memory controller |
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PCH |
Intel® HM175 Platform Controller Hub |
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Memory |
• Two 260-pin DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) |
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sockets |
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• Support for DDR4 2400 MHz SO-DIMMs |
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• Support for 4 Gb and 8 Gb memory technology |
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• Support for up to 32 GB of system memory with two SO-DIMMs |
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• Support for non-ECC memory |
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• Support for 1.2 V and 1.35 V low voltage JEDEC memory only |
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Note: 2 Gb memory technology (SDRAM Density) is not compatible |
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Graphics |
• Integrated graphics support for processors with Intel® Graphics Technology |
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• Discrete graphics support by Radeon RX Vega M GL |
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― Two Full Size High Definition Multimedia Interface* (HDMI*) Front and Back panel |
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connectors |
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― Two Mini DisplayPort* back panel connectors |
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― Two Type C back panel connectors |
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Audio |
• Intel® High Definition (Intel® HD) Audio via the HDMI v2.0, Mini DisplayPort 1.2 and Type C |
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interfaces through the processor/Discrete GPU |
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• Radeon High Definition Audio |
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• Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel |
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and 3.5mm combination speaker/TOSLINK jack on the back panel |
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Storage |
Two SATA 6.0 Gb/s or Gen3 PCIe X4 AHCI, NVMe ports are reserved for M.2 storage |
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modules supporting M.2 2242 and M.2 2280 (key type M) modules |
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Note: Supports key type M (PCI Express* x1/x2/x4 and SATA) |
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continued |
11
Table 1. Feature Summary (continued)
Peripheral Interfaces |
• |
USB 3.1 Gen 2 Ports: |
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― One Type-A port is implemented with an external front panel connector (blue), one |
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Type C port is implemented with an external front panel connnector |
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• |
USB 3.0 Ports: |
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― One port is implemented with an external front panel connector (yellow charging |
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capable) |
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― Four ports are implemented with external back panel connectors (blue) |
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― Two ports are implemented via an internal header (blue) |
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― 1 port implemented via the external back panel Type C connector |
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• |
USB 2.0 ports: |
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― Two ports via an internal common IO header (white) |
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― One port is reserved for the M.2 2230 Wireless module |
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• |
Consumer Infrared (CIR) |
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Expansion Capabilities |
• |
Two M.2 connectors supporting M.2 2242 (1 slot) and M.2 2280 (key type M both slots) |
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modules |
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• One Full Size SDXC Slot |
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BIOS |
• |
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device |
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• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and |
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System Management BIOS (SMBIOS) |
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Instantly Available PC |
• |
Suspend to RAM support |
Technology |
• |
Wake on PCI Express, LAN, front panel, CIR, and USB ports |
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LAN |
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® Gigabit Ethernet Controller |
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I219-LM |
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Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® Gigabit Ethernet Controller |
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I210-at |
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Hardware Monitor |
Hardware monitoring subsystem, based on a ITE IT8987VG including: |
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Subsystem |
• |
Voltage sense to detect out of range power supply voltages |
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• Thermal sense to detect out of range thermal values |
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• Two processor fan headers |
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• Fan sense input used to monitor fan activity |
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• |
Fan speed control |
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Wireless |
Intel® Dual Band Wireless-AC 8265 |
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• 802.11ac, Dual Band, Wi-Fi + Bluetooth 4.2 |
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• Supports Intel® Wireless Display 6.0 (WiDi) |
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|
12
Product Description
Figure 1 is a block diagram of the major functional areas of Intel NUC Kit NUC8i7HN.
Figure 1. Block Diagram
13
1.2 |
Online Support |
|
|
To find information about… |
Visit this World Wide Web site: |
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Intel NUC Kit NUC8i7HN |
http://www.intel.com/NUC |
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Intel NUC Kit Support |
http://www.intel.com/NUCSupport |
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Available configurations for Intel NUC Kit NUC8i7HN |
http://ark.intel.com |
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BIOS and driver updates |
http://downloadcenter.intel.com |
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Tested memory |
http://www.intel.com/NUCSupport |
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Integration information |
http://www.intel.com/NUCSupport |
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Processor datasheet |
http://ark.intel.com |
A soldered-down 8th generation Intel® Core™ i7-8705G quad-core processor with up to a maximum 45 W TDP.
•Intel HD Graphics 630
•Integrated memory controller
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 50 for information on power supply requirements.
A soldered-down Intel HM175 Platform Controller Hub with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LAN, PCI Express interfaces. The HM175 is a centralized controller for the kit’s I/O paths.
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and PCH. This high-speed interface integrates advanced priority-based servicing allowing for concurrent traffic and true isochronous transfer capabilities.
14
Product Description
The kit has two 260-pin SO-DIMM sockets and supports the following memory features:
•1.2V / 1.35V DDR4 SDRAM SO-DIMMs with gold plated contacts
•Two independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided SO-DIMMs
•32 GB maximum total system memory. Refer to Section 2.1.1 on page 35 for information on the total amount of addressable memory.
•Minimum recommended total system memory: 4096 MB
•Non-ECC SO-DIMMs
•Serial Presence Detect
•DDR4 2400 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the kit should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.
Table 2 lists the supported SO-DIMM configurations.
Table 2. Supported DDR4/-RS Non-ECC SO-DIMM Module Configurations
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# of |
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Banks |
|
Raw Card |
DIMM |
DRAM Device |
DRAM |
# of DRAM |
# of |
# of Row/Col |
Inside |
Page |
Version |
Capacity |
Technology |
Organization |
Devices |
Ranks |
Address Bits |
DRAM |
Size |
A |
4GB |
4Gb |
512M x 8 |
8 |
1 |
15/10 |
16 |
8K |
|
|
|
|
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A |
8GB |
8Gb |
1024M x 8 |
8 |
1 |
16/10 |
16 |
8K |
|
|
|
|
|
|
|
|
|
B |
8GB |
4Gb |
512M x 8 |
16 |
2 |
15/10 |
16 |
8K |
|
|
|
|
|
|
|
|
|
B |
16GB |
8Gb |
1024M x 8 |
16 |
2 |
16/10 |
16 |
8K |
|
|
|
|
|
|
|
|
|
C |
2GB |
4Gb |
256M x 16 |
4 |
1 |
15/10 |
8 |
8K |
|
|
|
|
|
|
|
|
|
C |
4GB |
8Gb |
512M x 16 |
4 |
1 |
16/10 |
8 |
8K |
|
|
|
|
|
|
|
|
|
E |
8GB |
4Gb |
512M x 8 |
16 |
2 |
15/10 |
16 |
8K |
|
|
|
|
|
|
|
|
|
E |
16GB |
8Gb |
1024M x 8 |
16 |
2 |
16/10 |
16 |
8K |
|
|
|
|
|
|
|
|
|
For information about… |
Refer to: |
|
|
Tested Memory |
http://www.intel.com/NUCSupport |
|
|
15
The processor supports the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
For information about… |
Refer to: |
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Memory Configuration Examples |
http://www.intel.com/NUCSupport |
|
|
Figure 2 illustrates the memory channel and SO-DIMM configuration.
Figure 2. Memory Channel and SO-DIMM Configuration
16
Product Description
The kit supports graphics computing through Intel® HD™ Graphics 630.
The kit supports integrated graphics processing via the processor.
The Intel HD graphics controller features the following:
•3D Features
―DirectX* 12.1 support
―OpenGL* 4.4 support
―OpenCL* 2.1, OpenCL 2.0, OpenCL 1.2 support
•Video:
•Next Generation Intel® Clear Video Technology HD support is a collection of video playback and enhancement features that improve the end user’s viewing experience
•Encode/transcode HD content
•DirectX* Video Acceleration (DXVA) support for accelerating video processing
•Full AVC/VC1/MPEG2/HEVC HW Encode/Decode
•Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)
*The graphics outputs of the NUC8i7HN are not physically connected to the HD Graphics 630.
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.
The kit supports graphics processing via discrete on package Radeon RX Vega M GL graphics processor.
The Radeon RX Vega M GL Graphics controller features the following:
•3D Features
―DirectX* 12 (Direct3D feature level 12.0 support)
―OpenGL* 4.5 support
―OpenCL* 2.0 support
―Vulkan 1.0
Decode:
•HEVC Main Profile@level 5.1
•HEVC Main10 Profile@level 5.1
•H.264 Constrained Baseline Profile@level 5.2
•H.264 Main Profile@level 5.2
17
•H.264 High Profile@level 5.2
•H.264 Stereo High Profile@level 5.2
•VC1 Simple & Main Profile@High Level(VLD)
•VC1 Advanced Profile@level 3(VLD)
•MPEG2 Main Profile@High level(IDCT/VLD)
•MPEG4 Part 2 Advanced Simple Profile@level 5
•MJPEG 1080p@60fps
Encode:
•H.264 Constrained Baseline Profile@level 5.2
•H.264 Main Profile@level 5.2
•H.264 High Profile@level 5.2
•HEVC user program up to Main Profile@level 6.2 for offline encode; HEVC Main Profile@level 5.1 in real time
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.
The HDMI ports support standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The ports are compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/192 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24 bpp. The HDMI ports are compliant with the HDMI 2.0b specification.
For information about |
Refer to |
|
|
HDMI technology |
http://www.hdmi.org |
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|
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The Mini DisplayPort and Type C connectors are compliant with the DisplayPort 1.2 specification and have a maximum supported resolution of 4096 x 2160 @ 60Hz 24bpp.
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 specification and allow for this feature.
18
Product Description
For information about |
Refer to |
|
|
DisplayPort technology |
http://www.displayport.org |
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|
1.6.2.4.1DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.
Table 3. Mini DisplayPort and Type C DisplayPort Multi-Streaming Resolutions
DisplayPort Usage Models |
Monitor 1 |
Monitor 2 |
Monitor 3 |
|
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|
|
3 Monitors |
1920 x 1200 @ 60 Hz |
1920 x 1200 @ 60 Hz |
1920 x 1200 @ 60 Hz |
|
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|
|
2 Monitors |
2560 x 1600 @ 60 Hz |
2560 x 1600 @ 60 Hz |
|
|
|
|
|
3 Monitors |
1920 x 1080 @ 60 Hz |
1920 x 1080 @ 60 Hz |
1920 x 1080 @ 60 Hz |
(with DisplayPort 1.2 hub) |
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19