Intel BOXDX79TO Specification
Intel® Desktop Board
DX79TO
Technical Product Specification
Order Number: G44010-002
The Intel® Desktop Board DX79TO may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DX79TO Specification Update.
January 2012
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DX79TO Technical Product
Specification
-002 Specification Changes January 2012
This product specification applies to only the standard Intel® Desktop Board DX79TO with BIOS
identifier SIX7910J.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
November 2011
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
Copyright © 2011-2012 Intel Corporation. All rights reserved.
ii
Board Identification Information
Basic Desktop Board DX79TO Identification Information
AA Revision BIOS Revision Notes
G28805-400 SIX7910J.86A.0281 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The X79 PCH used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82X79 PCH C0 SLJHW
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DX79TO.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2012 Spec Change Added Section 1.12.2.10 Power Supervisor
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DX79TO Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DX79TO.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DX79TO and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DX79TO
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DX79TO Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary
1.1.2 Board Layout
1.1.3 Block Diagram
1.2 Legacy Considerations ...................................................................... 16
1.3 Online Support ................................................................................ 16
1.4 Processor ....................................................................................... 16
1.4.1 PCI Express x16 Graphics
1.5 System Memory
.............................................................................. 17
1.5.1 Memory Configurations
®
1.6 Intel
X79 Express Chipset ............................................................... 21
1.6.1 USB ................................................................................... 21
1.6.2 SATA Interfaces
1.7 Real-Time Clock Subsystem
1.8 Legacy I/O Controller
1.8.1 Consumer Infrared (CIR)
1.9 Audio Subsystem ............................................................................. 24
1.9.1 Audio Subsystem Software
1.9.2 Audio Subsystem Components
1.10LAN Subsystem
1.10.1 Intel
............................................................................... 26
®
82579L Gigabit Ethernet Controller ................................ 26
1.10.2 LAN Subsystem Software ....................................................... 27
1.10.3 RJ-45 LAN Connector with Integrated LEDs
1.11Hardware Management Subsystem
1.11.1 Hardware Monitoring and Fan Control ...................................... 28
1.11.2 Fan Monitoring
1.11.3 Chassis Intrusion and Detection .............................................. 28
1.11.4 Thermal Monitoring
1.12Power Management
......................................................................... 30
1.12.1 ACPI ................................................................................... 30
1.12.2 Hardware Support
1.13Board Status LEDs
........................................................................... 37
1.14Onboard Power and Reset Buttons
1.15Trusted Platform Module (TPM) .......................................................... 40
................................................................ 11
....................................................................... 13
..................................................................... 15
...................................................... 17
......................................................... 19
................................................................... 21
.............................................................. 23
....................................................................... 23
....................................................... 23
.................................................... 24
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.............................. 27
.................................................... 28
..................................................................... 28
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................................................................ 33
..................................................... 39
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Intel Desktop Board DX79TO Technical Product Specification
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory ............................................................. 41
2.1.2 Memory Map ........................................................................ 43
2.2 Connectors and Headers ................................................................... 43
2.2.1 Back Panel Connectors
2.2.2 Component-side Connectors and Headers
2.3 Jumper Block
.................................................................................. 55
2.4 Mechanical Considerations
2.4.1 Form Factor ......................................................................... 57
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
2.5.2 Fan Header Current Capability ................................................ 59
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
2.7 Reliability ....................................................................................... 62
2.8 Environmental ................................................................................ 62
.......................................................................... 41
.......................................................... 44
................................ 46
................................................................ 57
................................................................... 58
................................................. 58
.................................................. 59
.................................................................... 60
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 63
3.2 BIOS Flash Memory Organization
3.3 Resource Configuration
.................................................................... 64
3.3.1 PCI Autoconfiguration
3.4 System Management BIOS (SMBIOS) ................................................. 65
3.5 Legacy USB Support
3.6 BIOS Updates
................................................................................. 66
3.6.1 Language Support
........................................................................ 65
................................................................ 66
3.6.2 Custom Splash Screen
3.7 BIOS Recovery ................................................................................ 67
3.8 Boot Options ................................................................................... 68
3.8.1 Optical Drive Boot
................................................................ 68
3.8.2 Network Boot ....................................................................... 68
3.8.3 Booting Without Attached Devices........................................... 68
3.8.4 Changing the Default Boot Device During POST
3.9 Adjusting Boot Speed ....................................................................... 69
3.9.1 Peripheral Selection and Configuration ..................................... 69
3.9.2 BIOS Boot Optimizations
3.10BIOS Security Features
.................................................................... 70
3.11BIOS Performance Features
....................................................... 64
........................................................... 64
.......................................................... 67
........................ 68
....................................................... 69
.............................................................. 71
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 73
4.2 BIOS Beep Codes
4.3 Front-panel Power LED Blink Codes
4.4 BIOS Error Messages
4.5 Port 80h POST Codes
viii
............................................................................ 73
.................................................... 74
....................................................................... 74
....................................................................... 75
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 81
5.1.1 Safety Standards .................................................................. 81
5.1.2 European Union Declaration of Conformity Statement
................ 82
5.1.3 Product Ecology Statements ................................................... 83
5.1.4 EMC Regulations
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance
5.1.6 Regulatory Compliance Marks (Board Level)
.................................................................. 85
................. 88
............................. 89
5.2 Battery Disposal Information ............................................................. 90
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations ............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of Board Status LEDs ........................................................... 37
8. Location of the Onboard Power and Reset Buttons
9. Detailed System Memory Address Map ............................................... 42
10. Back Panel Connectors ..................................................................... 44
11. I/O Shield Reference Diagram ........................................................... 45
12. Component-side Connectors and Headers ........................................... 46
13. Connection Diagram for Front Panel Header ........................................ 52
14. Connection Diagram for Front Panel USB 2.0 Headers
15. Location of the Jumper Block ............................................................. 55
16. Board Dimensions ........................................................................... 57
17. Localized High Temperature Zones ..................................................... 61
................................ 39
........................... 54
Tables
1. Specification Changes or Clarifications .................................................. iii
2. Feature Summary ............................................................................ 11
3. Components Shown in Figure 1 ......................................................... 14
4. Supported Memory Configurations ..................................................... 18
5. Audio Jack Support .......................................................................... 24
6. LAN Connector LED States ................................................................ 27
7. Effects of Pressing the Power Switch .................................................. 30
8. Power States and Targeted System Power ........................................... 31
9. Wake-up Devices and Events ............................................................ 32
10. Board Status LEDs ........................................................................... 38
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 12 ................ 47
13. Front Panel Audio Header for Intel HD Audio ........................................ 48
14. Front Panel Audio Header for AC ’97 Audio
15. IEEE 1394a Header .......................................................................... 49
.......................................... 48
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Intel Desktop Board DX79TO Technical Product Specification
16. SATA Connectors ............................................................................. 49
17. USB 2.0 Headers ............................................................................. 49
18. Chassis Intrusion Header .................................................................. 49
19. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers
20. Back Panel CIR Emitter (Output) Header ............................................. 50
21. Front Panel CIR Receiver (Input) Header ............................................. 50
22. Processor Core Power Connector ........................................................ 51
23. Main Power Connector ...................................................................... 51
24. Front Panel Header .......................................................................... 52
25. States for a One-Color Power LED ...................................................... 53
26. States for a Two-Color Power LED ...................................................... 53
27. BIOS Setup Configuration Jumper Settings .......................................... 56
28. Recommended Power Supply Current Values ....................................... 58
29. Fan Header Current Capability ........................................................... 59
30. Thermal Considerations for Components ............................................. 61
31. Environmental Specifications ............................................................. 62
32. BIOS Setup Program Menu Bar .......................................................... 64
33. BIOS Setup Program Function Keys .................................................... 64
34. Acceptable Drives/Media Types for BIOS Recovery
............................... 67
35. Boot Device Menu Options ................................................................ 68
36. Supervisor and User Password Functions ............................................. 70
37. BIOS Beep Codes ............................................................................ 73
38. Front-panel Power LED Blink Codes .................................................... 74
39. BIOS Error Messages ....................................................................... 74
40. Port 80h POST Code Ranges.............................................................. 75
41. Port 80h POST Codes ....................................................................... 76
42. Typical Port 80h POST Sequence ........................................................ 80
43. Safety Standards ............................................................................. 81
44. EMC Regulations ............................................................................. 85
45. Regulatory Compliance Marks ............................................................ 89
..... 49
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
• Intel
• Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 64 GB of system memory with eight DIMMs using 4 Gb
• Support for non-ECC and ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
• Support for manual memory over clocking (voltage, clock, ratio)
Intel
Hub (PCH)
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Fourteen USB 2.0 ports:
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel X79 Express
• Four internal SATA 3.0 Gb/s interfaces through the Intel X79 Express Chipset
• Two IEEE 1394a ports:
Core™ i7 and Intel® Xeon® processors in an LGA2011 socket:
― Two PCI Express 3.0 x16 graphics interfaces
― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)
arranged as four channels
1066 MHz DIMMs
memory technology
®
X79 Express Chipset consisting of the Intel
― Six ports are implemented with stacked back panel connectors (black)
― Eight front panel ports implemented through four internal headers
®
Chipset with Intel
with Intel Rapid Storage Technology RAID support (black)
― One port via a back panel connector
― One port via a front-panel header (blue)
Rapid Storage Technology RAID support (blue)
®
X79 Platform Controller
continued
11
Intel Desktop Board DX79TO Technical Product Specification
®
Table 2. Feature Summary (continued)
®
BIOS
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Fast Boot
• Support for advanced over clocking
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Ethernet Controller
• Two PCI Express 3.0 x16 connectors
• Three PCI Express 2.0 x1 bus add-in card connectors from the PCH
• One Conventional PCI bus add-in card connector from the PCH
• Hardware monitoring and fan control through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers for processor, front,
• Support for Platform Environmental Control Interface (PECI)
BIOS resident in the SPI Flash device
and SMBIOS
rear, and auxiliary) with selectable support in BIOS for 3 wire fans
82579L Gigabit
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DX79TO.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
13
Intel Desktop Board DX79TO Technical Product Specification
Table 3. Components Shown in Figure 1
Label Description
A Front panel audio header
B PCI Express x1 add-in card connector
C PCI Express x1 add-in card connector
D Piezoelectric speaker
E Conventional PCI add-in card connector
F PCI Express 3.0 x16 add-in card connector
G PCI Express x1 add-in card connector
H PCI Express 3.0 x16 add-in card connector
I Rear chassis fan header
J Battery
K Back panel connectors
L Processor fan header
M DIMM 1 (Channel A, DIMM 0)
N DIMM 5 (Channel B, DIMM 0)
O DIMM 2 (Channel A, DIMM 1)
P DIMM 6 (Channel B, DIMM 1)
Q LGA2011 processor socket
R 12 V processor core voltage connector (2 x 4 pin)
S DIMM 8 (Channel D, DIMM 1)
T DIMM 4 (Channel C, DIMM 1)
U DIMM 7 (Channel D, DIMM 0)
V DIMM 3 (Channel C, DIMM 0)
W Main power connector (2 x 12 pin)
X Front chassis fan header
Y 3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA connectors (blue)
Z Intel X79 Express Chipset
AA Front panel USB 2.0 headers (4)
BB Consumer IR emitter (output) header
CC BIOS Setup configuration jumper block
DD Power Fault LED
EE Alternate front panel power LED header
FF Consumer IR receiver (input) header
GG Voltage measurement test points
HH Front panel header
II Post Code LED display
JJ Front panel IEEE 1394a header
KK Onboard Reset button
LL Onboard Power button
MM Chassis intrusion header
NN Auxiliary fan header
OO Board Status LEDs
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DX79TO Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DX79TO http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DX79TO
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support Intel Core i7 and Intel Xeon processors in an
LGA2011 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W with margin to allow for greater than
200 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Intel Desktop Board DX79TO. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 58 for information on power supply requirements for this board.
16
Product Description
1.4.1 PCI Express x16 Graphics
Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express
add-in graphics cards via the board’s PCI Express x16 connectors. These processors
support the following generations of PCI Express:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a bandwidth of 16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a bandwidth of 8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
1.5 System Memory
The board has eight DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)
• Four independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 64 GB maximum total system memory (using 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC and ECC DIMMs
• Serial Presence Detect
• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
• XMP performance profile support for memory speeds above 1600 MHz
• Full support for over clocking memory (see
www.intel.com/support/motherboards/desktop/sb/CS-031689.htm
information about over clocking)
• DIMM slots are numbered in installation order
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.
for more
17
Intel Desktop Board DX79TO Technical Product Specification
CAUTION
1.5 V is the recommended and default setting for DDR3 memory voltage. The other
memory voltage settings in the BIOS Setup program are provided for performance
tuning purposes only. Altering the memory voltage may (i) reduce system stability
and the useful life of the system, memory, and processor; (ii) cause the processor and
other system components to fail; (iii) cause reductions in system performance; (iv)
cause additional heat or other damage; and (v) affect system data integrity.
Intel has not tested and does not warranty the operation of the processor beyond its
specifications. For information on the processor warranty, refer to
http://www.intel.com/support/processors/sb/CS-
020033.htm?wapkw=(processor+warranty).
Intel assumes no responsibility that the memory installed on the desktop board, if
used with altered clock frequencies and/or voltages, will be fit for any particular
purpose. Check with the memory manufacturer for warranty terms and additional
details.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
SDRAM
Density
DIMM
Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
(Note)
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
18
Product Description
1.5.1 Memory Configurations
The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
• Quad channel (Interleaved) mode. This mode offers the highest throughput for
real world applications.
• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
• Dual channel (Interleaved) mode. Dual channel mode is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DX79TO Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory into the blue DIMM memory
sockets if installing four DIMMs or less in your configuration.
20
Product Description
1.6 Intel
The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI
Express interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel X79 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
X79 Express Chipset
1.6.1 USB
The board supports up to 14 USB 2.0 ports and two USB 3.0 ports.
The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by an NEC* UPD720200 controller. The port arrangement
is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Eight USB 2.0 front panel ports implemented through four internal headers
All 16 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 44
The location of the front panel USB headers Figure 12, page 46
1.6.2 SATA Interfaces
The board provides six SATA connectors through the PCH which support one device
per connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• Four internal SATA 3.0 Gb/s connectors (black)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used
for host to device connections.
21
Intel Desktop Board DX79TO Technical Product Specification
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7
operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 12, page 46
.
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
22
Product Description
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
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Intel Desktop Board DX79TO Technical Product Specification
1.9 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctrl panel
Microphone
Head-
phones
Front
Speaker Line In
Side
Surround
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.9.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel X79 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• 3-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
24
Item Description
A Line in
B Line out/front speakers
C Mic in/side surround
Figure 4. Back Panel Audio Connectors
Product Description
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header Figure 12, page 46
The signal names of the front panel audio header Section 2.2.2.1, page 48
The back panel audio connectors Section 2.2.1, page 44
25
Intel Desktop Board DX79TO Technical Product Specification
1.10 LAN Subsystem
The Intel GbE LAN subsystem consists of the following:
• Intel 82579L Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel X79 Express Chipset
• RJ-45 LAN connectors with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.10.1 Intel
The Intel 82579L Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state
⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
• Provides lower power usage to meet Energy Star 5.0 and ErP specifications
®
82579L Gigabit Ethernet Controller
26
Product Description
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
27
Intel Desktop Board DX79TO Technical Product Specification
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The hardware monitoring and fan control subsystem is based on the Winbond
W83677HG-I device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and
+VCCP
• SMBus interface
1.11.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Extreme Tuning Utility, Intel®
Desktop Utility, or third-party software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 34
1.11.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 12, page 46
28
1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Product Description
Item Description
A Rear chassis fan header
B Processor fan header
C Thermal diode, located on processor die
D Front chassis fan header
E Intel X79 Express Chipset
F Auxiliary fan header
Figure 6. Thermal Sensors and Fan Headers
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