Intel BLKDX79SI, BOXDX79SI, DX79SI Technical Product Specification
Intel® Desktop Board
DX79SI
Technical Product Specification
March 2012
Order Number: G31801-003
The Intel® Desktop Board DX79SI may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DX79SI Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DX79SI Technical Product
Specification
-002 Specification Change January 2012
-003 Specification Clarification March 2012
This product specification applies to only the standard Intel® Desktop Board DX79SI with BIOS
identifier SIX7910J.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
Copyright © 2011, 2012 Intel Corporation. All rights reserved.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
November 2011
ii
Board Identification Information
Basic Desktop Board DX79SI Identification Information
AA Revision BIOS Revision Notes
G288087-600 SIX7910J.0281 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The X79 PCH used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82X79 PCH C0 SLJHW
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DX79SI.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2012 Spec Change Added Section 11.13.2.10 Power Supervisor
March 2012 Spec Clarification Updated Figure 13 on page 48 to correct the pin numbering on
the Front panel USB 3.0 connector
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DX79SI Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DX79SI.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DX79SI and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DX79SI
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DX79SI Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview........................................................................................ 11
1.1.1 Feature Summary
1.1.2 Board Layout
1.1.3 Block Diagram
1.2 Legacy Co
1.3 O
nline Support ................................................................................ 16
nsiderations ...................................................................... 16
1.4 Processor ....................................................................................... 16
1.4.1 PCI Express x16 Graphics
1.5 System Memory
.............................................................................. 17
1.5.1 Memory Configurations
®
1.6 Intel
X79 Express Chipset ............................................................... 21
1.6.1 USB ................................................................................... 21
1.6.2 SATA Interfaces
1.7 Real-Time Clock
1.8 Legacy I/O
Controller ....................................................................... 23
Subsystem .............................................................. 23
1.8.1 Consumer Infrared
1.9 Audio Subsystem
............................................................................ 24
1.9.1 Audio Subsystem Software
1.9.2 Audio Subsystem Components
1.10LAN Su
1.10.1 Intel
bsystem ............................................................................... 26
®
82579L and Intel 82574L Gigabit Ethernet Controllers ...... 26
1.10.2 LAN Subsystem Software
1.10.3 RJ-45
1.11Bluet
ooth*/WiFi Module .................................................................... 28
LAN Connector with Integrated LEDs .............................. 27
1.11.1 Bluetooth Technology
1.11.2 WiFi 802.
11 Wireless ............................................................ 29
1.12Hardware Management
1.12.1 Hardware Monitoring
1.12.2 Fan Monitoring ..................................................................... 30
1.12.3 Chassis
Intrusion and Detection ............................................. 30
1.12.4 Thermal Monitoring
1.13Power Management
1.13.1 ACPI
................................................................................... 32
......................................................................... 32
1.13.2 Hardware Support
1.14Onboard Power and
Reset Buttons ..................................................... 41
................................................................ 11
....................................................................... 13
..................................................................... 15
...................................................... 17
......................................................... 19
................................................................... 21
(CIR) ....................................................... 23
.................................................... 24
............................................... 24
...................................................... 27
........................................................... 28
Subsystem .................................................... 29
and Fan Control ...................................... 29
.............................................................. 31
................................................................ 35
vii
Intel Desktop Board DX79SI Technical Product Specification
2 Technical Reference
2.1 Memory Resources
2.1.1 Addre
2.1.2 Memo
2.2 Connect
ors and Headers ................................................................... 45
ssable Memory ............................................................. 43
ry Map ........................................................................ 45
2.2.1 Back Panel
2.2.2 Component-side Connectors
2.3 Jumper Block
.................................................................................. 58
2.4 Mechanical Considerations
2.4.1 Form
2.5 Electr
ical Considerations ................................................................... 61
Factor ......................................................................... 60
2.5.1 Power Supply Considerations
2.5.2 Fan Header Curren
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
2.7 Reliability ....................................................................................... 65
2.8 Environmental ................................................................................ 65
.......................................................................... 43
Connectors .......................................................... 46
and Headers ................................ 48
................................................................ 60
................................................. 61
t Capability ................................................ 62
.................................................. 62
.................................................................... 63
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 67
3.2 BIOS
3.3 Resource Configuration
3.4 System
3.5 Legacy USB Support
3.6 BIOS Updates
3.7 BIOS
3.8 Boot
3.9 Adjusting Boot
3.10BIOS Security Features .................................................................... 74
3.11BIOS Performance Features
Flash Memory Organization ....................................................... 68
.................................................................... 68
3.3.1 PCI Autoconfiguration
........................................................... 68
Management BIOS (SMBIOS) ................................................. 69
........................................................................ 69
................................................................................. 70
3.6.1 Language Support
3.6.2 Custom Splash
................................................................ 70
Screen .......................................................... 71
Recovery ................................................................................ 71
Options ................................................................................... 72
3.8.1 Optical Drive Boot
3.8.2 Networ
k Boot ....................................................................... 72
................................................................ 72
3.8.3 Booting Without Attached Devices .......................................... 72
3.8.4 Changing the
Default Boot Device During POST ........................ 72
Speed ....................................................................... 73
3.9.1 Peripheral
3.9.2 BIOS Boot Optimizations
Selection and Configuration .................................... 73
....................................................... 73
.............................................................. 75
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 77
4.2 BIOS Beep
4.3 Front-panel Power
4.4 BIOS Error Messages
4.5 Port 80h
viii
Codes ............................................................................ 77
POST Codes ....................................................................... 79
LED Blink Codes .................................................... 78
....................................................................... 78
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regula
5.1.1 Safety Standards ................................................................. 85
5.1.2 European
5.1.3 Product Ecology Statements
5.1.4 EMC Regulations
5.1.5 ENERGY STAR* 5.
5.1.6 Regula
5.2 Batte
tory Compliance ..................................................................... 85
Union Declaration of Conformity Statement ................ 86
.................................................. 87
.................................................................. 89
0, e-Standby, and ErP Compliance ................. 92
tory Compliance Marks (Board Level) ............................. 93
ry Disposal Information ............................................................. 94
Figures
1. Major Board Components ................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations ............................................................ 27
6. Bluetooth/WiFi Module ..................................................................... 28
7. Thermal Sensors and Fan Headers ..................................................... 31
8. Location of Board Status LEDs ........................................................... 39
9. Location of the Onboard Power and Reset Buttons ................................ 41
10. Detailed System Memory Address Map ............................................... 44
11. Back Panel Connectors ..................................................................... 46
12. I/O Shield Reference Diagram ........................................................... 47
13. Component-side Connectors and Headers ........................................... 48
14. Connection Diagram for Front Panel Header ........................................ 55
15. Connection Diagram for Front Panel USB 2.0 Headers ........................... 57
16. Location of the Jumper Block ............................................................ 58
17. Board Dimensions ........................................................................... 60
18. Localized High Temperature Zones ..................................................... 64
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. Audio Jack Support .......................................................................... 24
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power
7. Power States and Targeted
8. Wake-up Devices and Events ............................................................ 34
9. Board Status LEDs ........................................................................... 40
10. System Memory Map ....................................................................... 45
11. Component-side Connectors and Headers Shown in Figure 13 ................ 49
12. Front Panel Audio Header for Intel HD Audio
13. Front Panel Audio Header for AC ’97 Audio
Switch .................................................. 32
System Power .......................................... 33
....................................... 50
.......................................... 50
ix
Intel Desktop Board DX79SI Technical Product Specification
14. IEEE 1394a Header .......................................................................... 51
15. SATA Connectors ............................................................................. 51
16. S/PDIF Header ................................................................................ 51
17. USB 2.0 Headers ............................................................................. 51
18. USB 3.0 Connector .......................................................................... 52
19. Chassis Intrusion Header .................................................................. 52
20. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 52
21. Processor Core Power Connector........................................................ 54
22. Main Power Connector ...................................................................... 54
23. Front Panel Header .......................................................................... 55
24. States for a One-Color Power LED ...................................................... 56
25. States for a Two-Color Power LED ...................................................... 56
26. BIOS Setup Configuration Jumper
27. Recommended Power Supply C
Settings.......................................... 59
urrent Values ....................................... 61
28. Fan Header Current Capability ........................................................... 62
29. Thermal Considerations for Components ............................................. 64
30. Environmental Specifications ............................................................. 65
31. BIOS Setup Program Menu Bar .......................................................... 68
32. BIOS Setup Program
33. Acceptable Drives/Media Types for BIOS Recovery
Function Keys ................................................... 68
............................... 71
34. Boot Device Menu Options ................................................................ 72
35. Supervisor and User Password Functions ............................................ 74
36. BIOS Beep Codes ............................................................................ 77
37. Front-panel Power LED Blink Codes
.................................................... 78
38. BIOS Error Messages ....................................................................... 78
39. Port 80h POST Code Ranges ............................................................. 79
40. Port 80h POST Codes ....................................................................... 80
41. Typical Port 80h POST Sequence ....................................................... 84
42. Safety Standards ............................................................................. 85
43. EMC Regulations ............................................................................. 89
44. Regulatory Compliance Marks ........................................................... 93
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
Wireless Module
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
• Intel
• Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 64 GB of system memory with eight DIMMs using 4 Gb
• Support for non-ECC and ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
• Support for manual memory over clocking (voltage, clock, ratio)
Intel
Hub (PCH)
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two front panel USB 3.0 ports are implemented through one internal connector
• Fourteen USB 2.0 ports:
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel X79 Express
• Four internal SATA 3.0 Gb/s interfaces through the Intel X79 Express Chipset
• Two IEEE 1394a ports:
• Separate module that provides both Bluetooth* and WiFi is included
Core™ i7 and Intel® Xeon® processors in an LGA 2011 socket:
― Two PCI Express 3.0 x16 graphics interfaces
― One PCI Express 3.0 x16 graphics interface (x8 electrical)
― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)
arranged as four channels
1066 MHz DIMMs
memory technology
®
X79 Express Chipset consisting of the Intel
(blue)
― Six ports are implemented with stacked back panel connectors (black)
― Eight front panel ports implemented through four internal headers
Chipset with Intel
with Intel Rapid Storage Technology RAID support (black)
― One port via a back panel connector
― One port via a front-panel header (blue)
®
Rapid Storage Technology RAID support (blue)
®
X79 Platform Controller
continued
11
Intel Desktop Board DX79SI Technical Product Specification
Table 2. Feature Summary (continued)
®
BIOS
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Fast Boot
• Support for advanced over clocking
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
Dual-Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Intel
• Two PCI Express 3.0 x16 connectors
• One PCI Express 3.0 x16 connector (x8 electrical)
• Two PCI Express 2.0 x1 bus add-in card connectors from the PCH
• One Conventional PCI bus add-in card connector from the PCH
• Hardware monitoring and fan control through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers for processor, front,
• Support for Platform Environmental Control Interface (PECI)
BIOS resident in the SPI Flash device
and SMBIOS
®
82574L Gigabit Ethernet Controllers
rear, and auxiliary) with selectable support in BIOS for 3 wire fans
®
82579L and
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DX79SI.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
13
Intel Desktop Board DX79SI Technical Product Specification
Table 3. Components Shown in Figure 1
Label Description
A Front panel audio header
B PCI Express x1 add-in card connector
C S/PDIF out header
D PCI Express 3.0 x16 add-in card connector (x8 electrical)
E Piezoelectric speaker
F Conventional PCI add-in card connector
G PCI Express 3.0 x16 add-in card connector
H PCI Express x1 add-in card connector
I PCI Express 3.0 x16 add-in card connector
J Rear chassis fan header
K Battery
L Back panel connectors
M Processor fan header
N DIMM 1 (Channel A, DIMM 0)
O DIMM 5 (Channel B, DIMM 0)
P DIMM 2 (Channel A, DIMM 1)
Q DIMM 6 (Channel B, DIMM 1)
R LGA 2011 processor socket
S 12 V processor core voltage connector (2 x 4 pin)
T DIMM 8 (Channel D, DIMM 1)
U DIMM 4 (Channel C, DIMM 1)
V DIMM 7 (Channel D, DIMM 0)
W DIMM 3 (Channel C, DIMM 0)
X Main power connector (2 x 12 pin)
Y Remote thermal probe header
Z Front chassis fan header
AA 3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA connectors (blue)
BB Intel X79 Express Chipset
CC Front panel USB 2.0 headers (4)
DD Consumer IR emitter (output) header
EE BIOS Setup configuration jumper block
FF Power Fault LED
GG Front panel USB 3.0 connector
HH Alternate front panel power LED header
II Consumer IR receiver (input) header
JJ Voltage measurement test points
KK Front panel header
LL Post Code LED display
MM Front panel IEEE 1394a header
NN Onboard Reset button
OO Onboard Power button
PP Chassis intrusion header
QQ Auxiliary fan header
RR Board Status LEDs
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DX79SI Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DX79SI http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DX79SI
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support Intel Core i7 and Intel Xeon processors in an
LGA 2011 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W with margin to allow for greater than
200 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Intel Desktop Board DX79SI. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 61 for information on power supply requirements for this board.
16
Product Description
1.4.1 PCI Express x16 Graphics
Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express
add-in graphics cards via the board’s PCI Express x16 connectors. These processors
support the following generations of PCI Express:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a bandwidth of 16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a bandwidth of 8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
1.5 System Memory
The board has eight DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)
• Four independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 64 GB maximum total system memory (using 4 Gb memory technology). Refer to
Section 2.1.1 on page 43 for information on the total amount of addressable
memory.
• Minimum to
• Non-ECC and ECC DIMMs
• Serial Presence Detect
• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
• XMP performance profile support for memory speeds above 1600 MHz
• Full support for over clocking memory (see
www.intel.com/support/motherboards/desktop
information about over clocking)
• DIMM slots are numbered in installation order
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.
tal system memory: 1 GB using 512 MB x16 module
/sb/CS-031689.htm for more
17
Intel Desktop Board DX79SI Technical Product Specification
CAUTION
1.5 V is the recommended and default setting for DDR3 memory voltage. The other
memory voltage settings in the BIOS Setup program are provided for performance
tuning purposes only. Altering the memory voltage may (i) reduce system stability
and the useful life of the system, memory, and processor; (ii) cause the processor
and other system components to fail; (iii) cause reductions in system performance;
(iv) cause additional heat or other damage; and (v) affect system data integrity.
Intel has not tested and does not warranty the operation of the processor beyond its
specifications. For information on the processor warranty, refer to
http://www.intel.com/support/processors/sb/CS-
020033.htm?wapkw=(processor+warranty).
Intel assumes no responsibility that the memory installed on the desktop board, if
used with altered clock frequencies and/or voltages, will be fit for any particular
purpose. Check with the memory manufacturer for warranty terms and additional
details.
Table 4 lists the supported DIMM configurations.
Table
DIMM
Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
4. Supported Memory Configurations
(Note)
single-sided memory modules (containing one row of SDRAM).
SDRAM
Density
025414.htm
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
18
Product Description
1.5.1 Memory Configurations
The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
• Quad channel (Interleaved) mode. This mode offers the highest throughput for
real world applications.
• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
• Dual channel (Interleaved) mode. Dual channel mode is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DX79SI Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory into the blue DIMM memory
sockets if installing four DIMMs or less in your configuration.
20
Product Description
1.6 Intel
The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI
Express interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel X79 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
X79 Express Chipset
1.6.1 USB
The board supports up to 14 USB 2.0 ports and four USB 3.0 ports.
The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The four
USB 3.0 ports are provided by two NEC* UPD720200 controllers. The port
arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Two USB 3.0 front panel ports implemented through one internal connector (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Eight USB 2.0 front panel ports implemented through four internal headers
All 18 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 11, page 46
The location of the front panel USB headers Figure 13, page 48
1.6.2 SATA Interfaces
The board provides six SATA connectors through the PCH which support one device
per connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• Four internal SATA 3.0 Gb/s connectors (black)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used
for host to device connections.
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Intel Desktop Board DX79SI Technical Product Specification
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7
operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.
For information about Refer to
The location of the SATA connectors Figure 13, page 48
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives) levels
via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also,
during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
22
Product Description
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
23
Intel Desktop Board DX79SI Technical Product Specification
1.9 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
Table 5 lists the supported functions of the front pa
Table 5. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctrl panel
Rear Black Default
Rear Orange Default
Microphone
Head-
phones
Front
Speaker Line In
nel and back panel audio jacks.
Rear
Surround
Center/
Sub
Side
Surround
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.9.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel X79 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
24
Item Description
A Rear surround
B Center channel and LFE
(subwoofer)
C Line in
D Line out/front speakers
E Mic in/side surround
F S/PDIF digital audio out
(optical)
Product Description
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 13, page 48
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 50
The back panel audio connectors Section 2.2.1, page 46
25
Intel Desktop Board DX79SI Technical Product Specification
1.10 LAN Subsystem
The Intel GbE Dual LAN subsystem consists of the following:
• Intel 82579L and Intel 82574L Gigabit Ethernet Controllers (10/100/1000 Mbits/s)
• Intel X79 Express Chipset
• RJ-45 LAN connectors with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities (only the Intel 82579L Gigabit Ethernet Controller
supports PXE)
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.10.1 Intel
®
82579L and Intel 82574L Gigabit Ethernet
Controllers
The Intel 82579L and Intel 82574L Gigabit Ethernet Controllers support the following
features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state
⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
• Provides lower power usage to meet Energy Star 5.0 and ErP specifications
26
Product Description
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
C Link LED (Green)
D Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
27
Intel Desktop Board DX79SI Technical Product Specification
1.11 Bluetooth*/WiFi Module
The Bluetooth*/WiFi module is supplemental hardware that is included (see Figure 6).
Figure 6. Bluetooth/WiFi Module
1.11.1 Bluetooth Technology
The Bluetooth/WiFi Module enables the user to connect with a variety of Bluetooth
enabled devices. Driver support is provided by Microsoft operating systems like
Microsoft Vista and Microsoft Windows 7. The basic Bluetooth driver stack is supplied
by Microsoft but additional features are available using the driver supplied with the
motherboard.
• CSR Bluetooth module (BC0401PC08)
• Maximum data rate 3.0 Mb/s
• Forward and backward compatibility with Bluetooth v1.1, v1.2, v2.0, and v2.1
• Integrated antenna
• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit
and 64 bit)
For information about Refer to
Obtaining Bluetooth information and drivers http://downloadcenter.intel.com
http://msdn.microsoft.com/enus/library/aa362932(VS.85).aspx
28
Product Description
1.11.2 WiFi 802.11 Wireless
The Bluetooth/WiFi Module enables the user to connect with a variety of WiFi enabled
networks, access points and allows peer to peer connections. Driver support is
provided by Microsoft operating systems like Microsoft Vista and Microsoft Windows 7
with additional support provided by the supplied WiFi driver included on the Driver
DVD and online.
• Ralink WiFi 802.11 (RT8070)
• Range up to 300 meters
• Supports the following:
⎯ IEEE 802.11B supports up to 11 Mb/s data rate
⎯ IEEE 802.11G supports up to 54 Mb/s data rate
⎯ IEEE 802.11N supports up to 150 Mb/s data rate
• Integrated Antenna
• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit
and 64 bit)
For information about Refer to
Obtaining WiFi information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
http://downloadcenter.intel.com
1.12 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.12.1 Hardware Monitoring and Fan Control
The hardware monitoring and fan control subsystem is based on the Winbond
W83677HG-I device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and
+VCCP
• SMBus interface
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Intel Desktop Board DX79SI Technical Product Specification
1.12.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Extreme Tuning Utility, Intel®
Desktop Utility, or third-party software.
For information about Refer to
The functions of the fan headers Section 1.13.2.2, page 36
1.12.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 13, page 48
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