Intel 945GZ, 945GC, 945P, 945G, 945PL User Manual

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Intel® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family

Thermal and Mechanical Design Guidelines (TMDG)

-For the Intel® 82945G/82945GZ/82945GC Graphics Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH)

February 2008

Document Number: 307504-004

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® 82945G/82945GZ/82945GC GMCH and Intel® 82945P/82945PL MCH may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others. Copyright © 2005–2008, Intel Corporation. All rights reserved.

2

Thermal and Mechanical Design Guidelines

Contents

1

Introduction .....................................................................................................

 

7

 

1.1

Terminology ..........................................................................................

8

 

1.2

Reference Documents .............................................................................

9

2

Product Specifications......................................................................................

11

 

2.1

Package Description..............................................................................

11

 

 

2.1.1

Non-Grid Array Package Ball Placement ......................................

11

 

2.2

Package Loading Specifications...............................................................

12

 

2.3

Thermal Specifications ..........................................................................

13

 

2.4

Thermal Design Power (TDP)..................................................................

13

 

 

2.4.1

Methodology...........................................................................

14

 

 

2.4.2

Application Power....................................................................

14

 

 

2.4.3

Specifications .........................................................................

14

3

Thermal Metrology ..........................................................................................

15

 

3.1

Case Temperature Measurements ...........................................................

15

 

 

3.1.1

Thermocouple Attach Methodology.............................................

15

 

3.2

Airflow Characterization ........................................................................

16

4

Reference Thermal Solution..............................................................................

19

 

4.1

Operating Environment .........................................................................

19

 

 

4.1.1

ATX Form Factor Operating Environment ....................................

19

 

 

4.1.2

Balanced Technology Extended (BTX) Form Factor Operating

 

 

 

 

Environment...........................................................................

20

 

4.2

Mechanical Design Envelope...................................................................

21

 

4.3

Thermal Solution Assembly....................................................................

21

 

4.4

Environmental Reliability Requirements ...................................................

24

Appendix A

Enabled Suppliers ...........................................................................................

25

Appendix B

Mechanical Drawings .......................................................................................

27

Thermal and Mechanical Design Guidelines

3

Figures

Figure 1. (G)MCH Non-Grid Array ......................................................................

12

Figure 2. 0° Angle Attach Methodology (top view, not to scale)..............................

16

Figure 3. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom

 

view shown, not to scale)...........................................................................

16

Figure 4. Airflow Temperature Measurement Locations .........................................

17

Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an

ATX Platform............................................................................................

20

Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a

 

Balanced Technology Extended (BTX) Platform..............................................

21

Figure 7. ATX GMCH Heatsink Installed on Board.................................................

22

Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board...

23

Figure 9. (G)MCH Package Drawing ...................................................................

28

Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platforms .................

29

Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology

 

Extended (BTX) Platforms ..........................................................................

30

Figure 12. (G)MCH Reference Heatsink for ATX Platforms – Sheet 1 .......................

31

Figure 13. (G)MCH Reference Heatsink for ATX Platforms – Sheet 2 .......................

32

Figure 14. (G)MCH Reference Heatsink for ATX Platforms – Anchor ........................

33

Figure 15. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ..

34

Figure 16. (G)MCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ..

35

Figure 17. (G)MCH Reference Heatsink for ATX Platforms – Wire Preload Clip ..........

36

Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)

 

Platforms.................................................................................................

37

Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)

 

Platforms – Clip ........................................................................................

38

Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX)

 

Platforms – Heatsink Assembly ...................................................................

39

Tables

Table 1. (G)MCH Loading Specifications..............................................................

12

Table 2. (G)MCH Case Temperature Specifications .............................................

13

Table 3.

(G)MCH Thermal Design Power Specifications........................................

14

Table 4.

Reference Thermal Solution Environmental Reliability Requirements .........

24

Table 5.

(G)MCH ATX Intel Reference Heatsink Enabled Suppliers.........................

25

Table 6.

(G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink

 

Enabled Suppliers .....................................................................................

26

4

Thermal and Mechanical Design Guidelines

Revision History

Revision

Description

Date

Number

 

 

 

 

 

-001

•Initial Release

May 2005

 

 

 

-002

•Added Intel® 82945PL specifications

October 2005

-003

•Added Intel® 82945GZ specifications

December

 

 

2005

 

 

 

-004

•Added Intel® 82945GC specifications

February 2008

§

Thermal and Mechanical Design Guidelines

5

6

 

Thermal and Mechanical Design Guidelines

Introduction

1 Introduction

As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal solution.

The simplest and most cost-effective method to improve the inherent system cooling characteristics of the (G)MCH is through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 82945G/82945GZ/82945GC GMCH or 82945P/82945PL MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of these components.

Note: Unless otherwise specified, the information in this document applies to the Intel® 82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and the Intel® 82945P/82945PL Memory Controller Hub (MCH). The term (G)MCH refers to the 82945G GMCH, 82945GZ GMCH, 82945GC GMCH, 82945P MCH, and 82945PL MCH.

Note: Unless otherwise specified, ICH7 refers to the Intel® 82801GB ICH7 and 82801GR ICH7R I/O Controller Hub 7 components.

Thermal and Mechanical Design Guidelines

7

Introduction

1.1Terminology

 

Term

Description

 

 

 

 

BGA

Ball Grid Array. A package type defined by a resin-fiber substrate where a die is

 

 

mounted and bonded. The primary electrical interface is an array of solder balls

 

 

attached to the substrate opposite the die and molding compound.

 

 

 

 

FC-BGA

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a

 

 

die is mounted using an underfill C4 (Controlled Collapse Chip Connection)

 

 

attach style. The primary electrical interface is an array of solder balls attached

 

 

to the substrate opposite the die. Note that the device arrives at the customer

 

 

with solder balls attached.

 

 

 

 

Intel® ICH7

Intel® I/O Controller Hub 7. The chipset component that contains the primary

 

 

PCI interface, LPC interface, USB, ATA, and/or other legacy functions.

 

 

 

 

GMCH

Graphic Memory Controller Hub. The chipset component that contains the

 

 

processor and memory interface and integrated graphics device.

 

 

 

 

MCH

Memory Controller Hub. The chipset component that contains the processor

 

 

and memory interface. It does not contain an integrated graphics device.

 

 

 

 

TA

The measured ambient temperature locally to the component of interest. The

 

 

ambient temperature should be measured just upstream of airflow for a

 

 

passive heatsink or at the fan inlet for an active heatsink.

 

 

 

 

TC

The measured case temperature of a component. For processors, TC is

 

 

measured at the geometric center of the integrated heat spreader (IHS). For

 

 

other component types, it is generally measured at the geometric center of the

 

 

die or case.

 

 

 

 

TC-MAX

The maximum case/die temperature with an attached heatsink. This

 

 

temperature is measured at the geometric center of the top of the package

 

 

case/die.

 

 

 

 

TC-MIN

The minimum case/die temperature with an attached heatsink. This

 

 

temperature is measured at the geometric center of the top of the package

 

 

case/die.

 

 

 

 

TDP

Thermal Design Power. TDP is specified as the highest sustainable power level

 

 

of most or all of the real applications expected to be run on the given product,

 

 

based on extrapolations in both hardware and software technology over the life

 

 

of the component. Thermal solutions should be designed to dissipate this target

 

 

power level.

 

 

 

 

TIM

Thermal Interface Material. TIM is the thermally conductive material installed

 

 

between two surfaces to improve heat transfer and reduce interface contact

 

 

resistance.

 

 

 

 

lfm

Linear Feet per Minute. Unit of airflow speed.

 

 

 

 

ΨCA

Case-to-ambient thermal characterization parameter (Psi). This is a measure of

 

 

thermal solution performance using total package power. It is defined as (TC

 

 

TA) / Total Package Power. Heat source size should always be specified for Ψ

 

 

measurements.

 

 

 

8

 

Thermal and Mechanical Design Guidelines

Introduction

1.2

Reference Documents

 

 

 

 

 

 

 

Document

Comments

 

 

 

 

 

 

Intel® 945G/945GZ/945P/945PL Express Chipset Family

http://developer.intel.com/des

 

 

Datasheet

ign/chipsets/datashts/307502.

 

 

 

htm

 

 

 

 

 

 

Intel® I/O Controller Hub 7 (ICH7) Datasheet

http://developer.intel.com//de

 

 

 

sign/chipsets/datashts/30701

 

 

 

3.htm

 

 

 

 

 

 

Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines

http://developer.intel.com//de

 

 

 

sign/chipsets/designex/30701

 

 

 

5.htm

 

 

 

 

 

 

Intel® Pentium® 4 Processor 670, 660, 650, 640, and 630 and

http://developer.intel.com

 

 

Intel® Pentium® 4 Processor Extreme Edition Datasheet

/design/pentium4/datashts

 

 

 

/306382.htm

 

 

 

 

 

 

Intel® Pentium®4 Processors 570/571, 560/561,

http://developer.intel.com

 

 

550/551,540/541, 530/531 and 520/521 Supporting Hyper-

/design/Pentium4/datashts

 

 

Threading Technology Datasheet

/302351.htm

 

 

 

 

 

 

Intel® Pentium® D Processor 840, 830 and 820 Datasheet

http://developer.intel.com

 

 

 

/design/PentiumD//datasht

 

 

 

s/307506.htm

 

 

 

 

 

 

Intel® Pentium® 4 Processor on 90 nm Process in the 775–

http://developer.intel.com

 

 

Land LGA Package Thermal and Mechanical Design Guidelines

/design/Pentium4/guides/3

 

 

 

02553.htm

 

 

 

 

 

 

Intel® Pentium® D® Processor and Intel® Pentium® Processor

http://developer.intel.com/

 

 

Extreme Edition 830 Thermal and Mechanical Design Guidelines

design/pentiumXE/designe

 

 

 

x/306830.htm

 

 

 

 

 

 

LGA775 Socket Mechanical Design Guide

http://developer.intel.com/

 

 

 

design/pentium4/guides/3

 

 

 

02666.htm

 

 

 

 

 

 

Various System Thermal Design Suggestions

http://www.formfactors.or

 

 

 

g

 

 

 

 

§

Thermal and Mechanical Design Guidelines

9

Introduction

10

Thermal and Mechanical Design Guidelines

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