Datasheet SPW47N60C3 Datasheet (INFINEON)

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A
A
j
g
SPW47N60C3
Cool MOS™ Power Transistor
Feature
New revolutionary high voltage technology
Worldwide best R
DS(on
Ultra low gate charge
Periodic avalanche rated
Extreme dv/dt rated
Ultra low effective capacitances
Type Package Ordering Code
SPW47N60C3 P-TO247 Q67040-S4491
in TO 247
VDS @ T
Marking
47N60C3
R
DS(on
650 V
0.07
I
D
47 A
P-TO247
Maximum Ratings
Parameter Symbol Value Unit
Continuous drain current
T
= 25 °C
C
T
= 100 °C
C
Pulsed drain current, tp limited by T
Avalanche energy, single pulse
I
= 10 A, V
D
Avalanche energy, repetitive t
I
= 20 A, V
D
Avalanche current, repetitive t
= 50 V
DD
= 50 V
DD
limited by T
AR
limited by T
R
jmax
I
I
E
1
E
I
Gate source voltage static V
Gate source voltage AC (f >1Hz)
Power dissipation, T
= 25°C
C
V P
Operating and storage temperature T
D
D puls
AS
AR
R
GS GS tot
T
,
47
30
141
1800 mJ
1
20 A
±20
±30
415 W
st
-55... +150
A
V
°C
Page 1
2003-11-06
SPW47N60C3
)
S
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope
V
= 480 V, I
DS
= 47 A, T
D
= 125 °C
j
dv/dt 50 V/ns
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
Soldering temperature,
R
thJC
R
thJA
T
- - 260 °C
sold
- - 0.3 K/W
- - 62
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage
Drain-Source avalanche
V
(BR)DSS
V
(BR)DS
V
=0V, ID=0.25mA 600 - - V
GS
V
=0V, ID=20A - 700 -
GS
breakdown voltage
Gate threshold voltage V
Zero gate voltage drain current I
Gate-source leakage current I
Drain-source on-state resistance R
Gate input resistance
R
GS(th
DSS
GSS
DS(on)
G
I
=2700µΑ, VGS=V
D
VDS=600V, V T
=25°C,
j
T
=150°C
j
VGS=30V, V V
=10V, ID=30A,
GS
T
=25°C
j
T
=150°C
j
f=1MHz, open Drain - 0.62 -
=0V,
GS
=0V - - 100 nA
DS
2.1 3 3.9
D
-
0.5
-
-
-
0.06
0.16
25
-
250
0.07
µA
-
Page 2
2003-11-06
SPW47N60C3
j
Electrical Characteristics , at T
= 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Transconductance g
Input capacitance C Output capacitance C Reverse transfer capacitance C
Effective output capacitance,
2)
C
energy related
Effective output capacitance,
3)
C
fs
iss oss rss
o(er)
o(tr)
VDS≥2*I
I
D
VGS=0V, V f=1MHz
V V
D*RDS(on)max
=30A
=0V,
GS
=0V to 480V
DS
=25V,
DS
,
- 40 - S
- 6800 - pF
- 2200 -
- 145 -
- 193 - pF
- 412 -
time related
Turn-on delay time t Rise time t Turn-off delay time t Fall time t
d(on) r d(off) f
VDD=380V, V
I
=47A, RG=1.8,
D
T
=125
j
=0/13V,
GS
- 18 - ns
- 27 -
- 111 165
- 8 12
Gate Charge Characteristics
Gate to source charge Q Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
1
Repetitve avalanche causes additional power losses that can be calculated as P
2
C
is a fixed capacitance that gives the same stored energy as C
o(er)
3
C
is a fixed capacitance that gives the same charging time as C
o(tr)
gs gd
g
(plateau)
V
=350V, ID=47A - 24 - nC
DD
V
=350V, ID=47A,
DD
V
=0 to 10V
GS
V
=350V, ID=47A - 5.5 - V
DD
while V
oss
while V
oss
- 121 -
- 252 320
=EAR*f.
AV
is rising from 0 to 80% V
DS
is rising from 0 to 80% V
DS
DSS
DSS
.
.
Page 3
2003-11-06
SPW47N60C3
j
Electrical Characteristics, at T
= 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
T
Inverse diode continuous
I
S
=25°C - - 47 A
C
forward current
Inverse diode direct current,
I
SM
- - 141
pulsed
V
Inverse diode forward voltage V
Reverse recovery time t Reverse recovery charge Q Peak reverse recovery current I
Peak rate of fall of reverse
dirr/dt
SD
rr
rr
rrm
=0V, IF=IS - 1 1.2 V
GS
V
=350V, IF=IS ,
R
di
/dt=100A/µs
F
- 580 - ns
- 23 - µC
- 73 - A
- 900 - A/µs
recovery current
Typical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
typ. typ.
Thermal resistance
R
th1
R
th2
R
th3
R
th4
R
th5
R
th6
P
tot
0.002689 K/W
0.005407
0.011
0.054
0.071
0.036
T
R
j T
th1
(t)
C
th1
C
th2
Thermal capacitance
C
th1
C
th2
C
th3
C
th4
C
th5
C
th6
R
th,n
C
th,n
T
case
amb
External Heatsink
0.001081
0.004021
0.005415
0.014
0.025
0.158
Ws/K
Page 4
2003-11-06
SPW47N60C3
1 Power dissipation
P
= f (T
tot
tot
P
500
W
400
350
300
250
200
150
100
50
)
C
SPW47N60C3
0
0 20 40 60 80 100 120
°C
2 Safe operating area
ID = f ( VDS )
parameter : D = 0 , T
3
10
A
2
10
D
1
I
10
0
10
tp = 0.001 ms tp = 0.01 ms
-1
10
-2
160
T
C
10
10
tp = 0.1 ms tp = 1 ms DC
0
10
=25°C
C
1
10
2
V
V
DS
10
3
3 Transient thermal impedance
Z
= f (tp)
thJC
parameter: D = tp/T
1
10
K/W
0
10
thJC
-1
Z
10
10
10
10
-2
-3
-4
10
-7
-6
-5
10
10
10
-4
D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse
-3
10
10
4 Typ. output characteristic
I
= f (VDS); T
D
parameter: t
280
A
200
D
I
160
120
80
40
-2
t
0
10
s
p
0
0 4 8 12 16 20
=25°C
j
= 10 µs, V
p
GS
20V
7.5V
7V
6.5V
6V
5.5V
5V
4.5V
V
V
26
DS
Page 5
2003-11-06
SPW47N60C3
5 Typ. output characteristic
I
= f (VDS); T
D
parameter: t
160
A
120
D
100
I
80
60
40
20
0
0 4 8 12 16 20
=150°C
j
= 10 µs, V
p
GS
V
V
20V
6.5V
6V
5.5V
5V
4.5V
4V
DS
26
6 Typ. drain-source on resistance
R
DS(on)
parameter: Tj=150°C, V
=f(I
)
D
0.5
0.4
DS(on)
0.35
R
0.3
0.25
0.2
0.15
0.1 0 20 40 60 80 100 120
4.5V4V
5V
GS
5.5V
6V
6.5V
A
I
20V
160
D
7 Drain-source on-state resistance
R
DS(on)
parameter : I
R
= f (Tj)
= 47 A, V
D
SPW47N60C3
0.38
0.32
0.28
DS(on)
0.24
0.2
0.16
0.12
0.08
0.04
0
-60 -20 20 60 100
98%
GS
typ
= 10 V
°C
8 Typ. transfer characteristics
ID= f ( VGS ); V
DS
2 x I
D
x R
DS(on)max
parameter: tp = 10 µs
280
A
200
D
I
160
120
80
40
180
T
j
0
0 1 2 3 4 5 6 7 8
25°C
V
V
150°C
10
GS
Page 6
2003-11-06
SPW47N60C3
9 Typ. gate charge
V
GS
= f (Q
Gate
)
parameter: ID = 47 A pulsed
SPW47N60C3
16
V
12
0.2
V
DS max
10
0.8 V
DS max
8
6
4
2
0
0 40 80 120 160 200 240 280 320
V
GS
nC
Q
400
Gate
10 Forward characteristics of body diode
IF = f (VSD)
parameter: Tj , tp = 10 µs
3
SPW47N60C3
10
A
2
10
F
I
1
10
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
0
10
0 0.4 0.8 1.2 1.6 2 2.4
3
V
V
SD
11 Typ. drain current slope
di/dt = f(RG), inductive load, T par.: VDS=380V, V
6000
A/µs
4000
di/dt
3000
2000
1000
di/dt(off)
0
0 2 4 6 8 10 12 14 16
=0/+13V, ID=47A
GS
di/dt(on)
= 125°C
j
R
12 Typ. switching time
t = f (RG), inductive load, T par.: VDS=380V, V
3
10
td(off)
ns
2
10
t
1
10
0
20
G
10
td(on)
0 2 4 6 8 10 12 14 16
=0/+13V, ID=47 A
GS
=125°C
j
tf
tr
20
R
G
Page 7
2003-11-06
SPW47N60C3
13 Typ. switching time
t = f (I
), inductive load, T
D
=125°C
j
par.: VDS=380V, VGS=0/+13V, RG=1.8
3
10
ns
2
10
t
1
10
0
10
-1
10
0 10 20 30
tf
tr
td(off)
td(on)
A
I
D
50
14 Typ. drain source voltage slope
dv/dt = f(RG), inductive load, T par.: VDS=380V, V
80
V/ns
dv/dt(off)
60
50
dv/dt
40
30
20
dv/dt(on)
10
0
0 2 4 6 8 10 12 14 16
=0/+13V, ID=47A
GS
= 125°C
j
R
20
G
15 Typ. switching losses
E = f (I
), inductive load, T
D
=125°C
j
par.: VDS=380V, VGS=0/+13V, RG=1.8
0.4
*) Eon includes SDP06S60 diode commutation losses.
mWs
E
0.2
0.1
0
0 10 20 30
Eoff
Eon*
A
I
D
50
16 Typ. switching losses
E = f(RG), inductive load, T par.: VDS=380V, V
1.4
*) Eon includes SDP06S60 diode commutation losses.
mWs
1
E
0.8
0.6
0.4
0.2
Eoff
0
0 2 4 6 8 10 12 14 16
=0/+13V, ID=47A
GS
=125°C
j
Eon*
R
20
G
Page 8
2003-11-06
SPW47N60C3
17 Avalanche SOA
IAR = f (tAR)
par.: Tj 150 °C
20
A
16
14
AR
I
12
10
8
6
4
2
0
-3
-2
10
10
10
-1
10 0 10 1 10
18 Avalanche energy
E
= f (T
AS
par.: I
1800
mJ
1400
1200
AS
E
1000
800
600
400
200
2
t
µs
AR
10
4
)
j
= 10 A, V
D
0
25 50 75 100
DD
= 50 V
°C
T
150
j
19 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (T
SPW47N60C3
720
V
680
660
640
620
600
580
560
540
-60 -20 20 60 100
)
j
°C
20 Avalanche power losses
P
= f (f )
AR
parameter: E
500
-
AV
P
300
200
100
0
180
T
j
10
4
AR
=1mJ
10
5
Hz
10
6
f
Page 9
2003-11-06
SPW47N60C3
21 Typ. capacitances
C = f (V parameter: V
10
pF
10
C
10
10
10
)
DS
=0V, f=1 MHz
GS
5
Ciss
4
3
Coss
2
Crss
1
0 100 200 300 400
V
V
DS
600
22 Typ. C
E
=f(V
oss
30
µJ
20
oss
E
15
10
5
0
0 100 200 300 400
stored energy
oss
)
DS
V
V
600
DS
23 Typ. gate threshold voltage
V
parameter: VGS = VDS ; I
= f (Tj)
GS(th)
D
4.25
V
3.25
GS(th)
V
2.75
min.
2.25
1.75
1.25
-75 -50 -25 0 25 50 75 100 125
typ.
= 2.7 mA
max.
°C
T
175
j
Page 10
2003-11-06
Definition of diodes switching characteristics
SPW47N60C3
Page 11
2003-11-06
P-TO-247-3-1
15.9
6.35
ø3.61
SPW47N60C3
5.03
2.03
4.37
6.17
9.91
20.9
1.75
D
1.14
0.243
General tolerance unless otherwise specified: Leadframe parts: ±0.05
D 7
2.97 x 0.127
16
1.2 2
2.92
5.46
5.94
Package parts: ±0.12
20˚
41.22
0.762 MAX.
+0.05
2.4
Page 12
2003-11-06
SPW47N60C3
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 13
2003-11-06
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