INFINEON BSP89 User Manual

Rev. 1.21
)
j
g
BSP89
SIPMOSÒ Small-Signal-Transistor
Feature
· N-Channel
· Enhancement mode
· Logic Level
· dv/dt rated
Pb-free lead plating; RoHS compliant
Type
BSP89
BSP89
Package
P-SOT-223
PG-SOT-223
Tape and Reel Information
E6327: 1000 pcs/reel
L6327: 1000 pcs/reel
Marking
BSP89
BSP89
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Product Summary
DS
R
DS(on
I
D
240 V
6 W
0.35 A
PG-SOT-223
4
1
3
2
VPS05163
Parameter
Continuous drain current
TA=25°C
T
=70°C
A
Pulsed drain current
TA=25°C
Reverse diode dv/dt
IS=0.35A, VDS=192V, di/dt=200A/µs, T
jmax
=150°C
Gate source voltage V
Symbol Value Unit
I
D
0.35
0.28
I
D puls
dv/dt
GS
1.4
6 kV/µs
±20
ESD Sensitivity (HBM) as per MIL-STD 883 Class 1
Power dissipation
TA=25°C
Operating and storage temperature T
P
tot
,
T
st
1.8 W
-55... +150
IEC climatic category; DIN IEC 68-1 55/150/56
A
V
°C
Page 1
2006-09-27
Rev. 1.21
BSP89
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - soldering point
R
thJS
- - 25 K/W
(Pin 4)
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
115
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=250µA
Gate threshold voltage, VGS = V
I
=108µA
D
Zero gate voltage drain current
VDS=240V, VGS=0, Tj=25°C
DS
(BR)DSS
GS(th)
I
DSS
240 - - V
0.8 1.4 1.8
-
-
0.1
µA
V
=240V, VGS=0, Tj=150°C
DS
Gate-source leakage current
VGS=20V, VDS=0
Drain-source on-state resistance
VGS=4.5V, ID=0.32A
Drain-source on-state resistance
VGS=10V, ID=0.35A
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
I
GSS
R
DS(on)
R
DS(on)
-
-
10
- - 10 nA
- 4.9 7.5
- 4.2 6
2006-09-27
W
Rev. 1.21
)
)
f
g
g
(p
)
BSP89
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Gate Charge Characteristics
Gate to source charge Q
Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
fs
iss
oss
rss
d(on
r
d(off
g
s
d
lateau
VDS³2*ID*R
I
=0.28A
D
VGS=0, VDS=25V,
f=1MHz
DS(on)max
,
0.18 0.36 - S
- 80 140 pF
- 11.2 16.8
- 5.2 7.8
VDD=120V, VGS=10V,
I
=0.35A, RG=6W
D
- 4 6 ns
- 3.5 5.3
- 15.9 23.8
- 18.4 27.6
VDD=192V, ID=0.35A - 0.2 0.3 nC
- 2 3
VDD=192V, ID=0.35A,
V
=0 to 10V
GS
VDD=192V, ID = 0.35 A - 3.1 - V
- 4.3 6.4
Reverse Diode
Inverse diode continuous
I
forward current
Inv. diode direct current, pulsedI
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
S
SM
SD
rr
rr
TA=25°C - - 0.35 A
- - 1.4
VGS=0, IF = I
VR=120V, I
di
/dt=100A/µs
F
Page 3
F
S
=
lS,
- 0.85 1.2 V
- 67 100 ns
- 123 184 nC
2006-09-27
Loading...
+ 5 hidden pages