WAFER-MARK 3.5” Embedded SBC
WAFER-MARK 3.5” Embedded SBC
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WAFER-MARK 3.5” Embedded SBC
Revision
Date Version Changes
2007.09 1.12 1. Changed to new format.
2. Notified that JP3 is an optional jumper.
2006.07 1.10 Changed connector pinouts and jumper setting in Chapter 3 and Chapter 4.
2005.11 1.0 Initial Release
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WAFER-MARK 3.5” Embedded SBC
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
Copyright
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
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WAFER-MARK 3.5” Embedded SBC
Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-MARK or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-MARK. Cautions are easy to recognize. The word “caution” is
written as “CAUTION,” both capitalized and bold and is followed. The italicized text is the
cautionary message. A caution message is shown below:
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WAFER-MARK 3.5” Embedded SBC
CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-MARK.
Please take caution messages seriously.
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-MARK. Please
take note messages seriously.
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WAFER-MARK 3.5” Embedded SBC
Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-MARK from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
The items listed below should all be included in the WAFER-MARK package.
1 x WAFER-MARK single board computer
1 x Audio cable
1 x IDE flat cable 44p/44p
1 x Keyboard/Mouse Y cable
2 x SATA cable
1 x SATA power cable
1 x Dual port serial port cable
1 x Mini jumper pack
1 x Utility CD
1 x QIG (quick installation guide)
Images of the above items are shown in Chapter 3.
sales@iei.com.tw.
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WAFER-MARK 3.5” Embedded SBC
Table of Contents
1 INTRODUCTION..................................................................................................... 1
1.1 WAFER-MARK OVERVIEW...................................................................................... 2
1.1.1 W AFER-MARK Boar d Variations...................................................................... 2
1.1.2 W AFER-MARK Applications ............................................................................. 3
1.1.3 W AFER-MARK Benefits..................................................................................... 3
1.1.4 W AFER-MARK Featur es.................................................................................... 3
1.2 WAFER-MARK OVERVIEW...................................................................................... 4
1.2.1 W AFER-MARK Connectors............................................................................... 5
1.2.2 Technical Specifications..................................................................................... 6
2 DETAILED SPECIFICATIONS............................................................................. 9
2.1 OVERVIEW ............................................................................................................... 10
2.2 DIMENSIONS ............................................................................................................ 10
2.2.1 Board Dimensions............................................................................................ 10
2.2.2 External Interface Panel Dimensions.............................................................. 10
2.3 DATA FLOW...............................................................................................................11
2.4 CPU SUPPORT.......................................................................................................... 12
2.4.1 VIA MARK Overview....................................................................................... 12
2.4.2 VIA MARK Memory Support............................................................................ 12
2.4.3 VIA MARK Integration..................................................................................... 12
2.4.4 VIA MARK S3 Graphics ProSavage4 Graphics Core...................................... 13
2.4.5 VIA MARK VIA PadLock Security Engine....................................................... 13
2.5 SYSTEM CHIPSET ..................................................................................................... 13
2.5.1 VIA VT82C686B A TA-6 Controller.................................................................. 14
2.5.2 VIA VT82C686B Flash Interface ..................................................................... 14
2.5.3 VIA VT82C686B Audio Codec 97 (AC’97) Controller.................................... 15
2.5.4 VIA VT82C686B USB Controller..................................................................... 16
2.5.5 VIA VT82C686B Serial Communications........................................................ 16
2.5.6 VIA VT82C686B Infrared Interface................................................................. 16
2.5.7 VIA VT82C686B Parallel Port Communications ............................................ 16
2.5.8 VIA VT82C686B Keyboard and Mouse ........................................................... 17
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2.5.9 VIA VT82C686B Real Time Clock ................................................................... 17
2.5.10 BIOS............................................................................................................... 17
2.6 PCI BUS................................................................................................................... 18
2.6.1 Overview.......................................................................................................... 18
2.6.2 10/100M Ethernet ............................................................................................ 18
2.6.3 SATA Drive Controller..................................................................................... 19
2.7 ENVIRONMENTAL AND POWER SPECIFICATIONS ....................................................... 19
2.7.1 System Monitoring........................................................................................... 19
2.7.2 Operating Temperature and Temperature Control........................................... 19
2.7.3 Power Consumption......................................................................................... 20
3 UNPACKING .......................................................................................................... 21
3.1 ANTI-STATIC PRECAUTIONS...................................................................................... 22
3.2 UNPACKING.............................................................................................................. 22
3.2.1 Unpacking Precautions.................................................................................... 22
WAFER-MARK 3.5” Embedded SBC
3.3 UNPACKING CHECKLIST........................................................................................... 23
3.3.1 Package Contents............................................................................................. 23
3.3.2 Optional Components ...................................................................................... 24
4 CONNECTOR PINOUTS...................................................................................... 25
4.1 PERIPHERAL INTERFACE CONNECTORS .................................................................... 26
4.1.1 W AFER-MARK Layout .................................................................................... 26
4.1.2 Peripheral Interface Connectors ..................................................................... 27
4.1.3 External Interface Panel Connectors............................................................... 28
4.2 INTERNAL PERIPHERAL CONNECTORS...................................................................... 29
4.2.1 AT Power Connector........................................................................................ 29
4.2.2 ATX Power Supply Enable Connector............................................................. 30
4.2.3 Audio Connector .............................................................................................. 31
4.2.4 Audio CD In Connector................................................................................... 32
4.2.5 Backlight Inverter Connector .......................................................................... 33
4.2.6 Battery Connector............................................................................................ 34
4.2.7 Compact Flash Socket...................................................................................... 35
4.2.8 Fan Connector................................................................................................. 37
4.2.9 Floppy Disk Connector (Optional).................................................................. 38
4.2.10 GPIO Connector............................................................................................ 40
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WAFER-MARK 3.5” Embedded SBC
4.2.11 IDE Connector ............................................................................................... 41
4.2.12 Infrared Interface Connector......................................................................... 43
4.2.13 Keyboard/Mouse Connector.......................................................................... 44
4.2.14 LED Connector.............................................................................................. 45
4.2.15 Parallel Port Connector ................................................................................ 46
4.2.16 PC/104 Slot.................................................................................................... 47
4.2.17 PC/104 Power Input Connector..................................................................... 50
4.2.18 Power Button Connector................................................................................ 51
4.2.19 Reset Button Connector ................................................................................. 51
4.2.20 SATA Drive Connectors ................................................................................. 52
4.2.21 Serial Port Connector (RS-422/485) ............................................................. 53
4.2.22 TFT LCD LVDS Connector............................................................................ 54
4.2.23 TFT LCD TTL Connector............................................................................... 56
4.2.24 USB Connector (Internal).............................................................................. 58
4.3 EXTERNAL PERIPHERAL INTERFACE CONNECTORS .................................................. 59
4.3.1 External Peripheral Interface Connector Overview........................................ 59
4.3.2 RJ-45 Ethernet Connector ............................................................................... 59
4.3.3 Keyboard/Mouse Connector (Optional).......................................................... 60
4.3.4 Serial Port Connector (COM 1) ...................................................................... 61
4.3.5 USB Combo Port.............................................................................................. 62
4.3.6 VGA Connector................................................................................................ 63
5 INSTALLATION .................................................................................................... 65
5.1 ANTI-STATIC PRECAUTIONS...................................................................................... 66
5.2 INSTALLATION CONSIDERATIONS ............................................................................. 67
5.2.1 Installation Notices.......................................................................................... 67
5.2.2 Installation Checklist....................................................................................... 68
5.3 SO-DIMM INST ALLATION AND CF CARD INSTALLATION........................................ 69
5.3.1 SO-DIMM Installation..................................................................................... 69
5.3.2 CF Card Installation........................................................................................ 70
5.4 JUMPER SETTINGS.................................................................................................... 71
5.4.1 Clear CMOS Jumper........................................................................................ 72
5.4.2 COM 2 Function Select Jumper....................................................................... 73
5.4.3 LCD Voltage Selection..................................................................................... 74
5.4.4 COM 1/2 Pin 9 Setting Jumper (Optional)...................................................... 75
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5.5 CHASSIS INSTALLATION ........................................................................................... 77
5.5.1 Airflow.............................................................................................................. 77
5.5.2 Motherboard Installation................................................................................. 77
5.6 INTERNAL PERIPHERAL DEVICE CONNECTIONS........................................................ 77
5.6.1 Peripheral Device Cables................................................................................ 77
5.6.2 Audio Kit Installation....................................................................................... 78
5.6.3 ATA Flat Cable Connection ............................................................................. 79
5.6.4 ATX Power Connection.................................................................................... 80
5.6.5 Dual RS-232 Cable Connection....................................................................... 82
5.6.6 Keyboard/Mouse Y-cable Connector ............................................................... 83
5.6.7 SATA Drive Connection ................................................................................... 84
5.7 EXTERNAL PERIPHERAL INTERFACE CONNECTION................................................... 86
5.7.1 LAN Connection............................................................................................... 86
5.7.2 Serial Device Connection ................................................................................ 87
WAFER-MARK 3.5” Embedded SBC
5.7.3 USB Connection............................................................................................... 88
6 AWARD BIOS ......................................................................................................... 91
6.1 INTRODUCTION ........................................................................................................ 92
6.1.1 Starting Setup................................................................................................... 92
6.1.2 Using Setup...................................................................................................... 92
6.1.3 Getting Help..................................................................................................... 93
6.1.4 Unable to Reboot After Configuration Changes.............................................. 93
6.1.5 Main BIOS Menu ............................................................................................. 93
6.2 STANDARD CMOS FEATURES.................................................................................. 96
6.2.1 IDE Primary Master/Slave .............................................................................. 97
6.3 ADVANCED BIOS FEATURES.................................................................................. 100
6.4 ADVANCED CHIPSET FEATURES.............................................................................. 102
6.5 INTEGRATED PERIPHERALS .................................................................................... 104
6.6 POWER MANAGEMENT SETUP................................................................................ 109
6.6.1 Wake Up Events...............................................................................................110
6.7 PNP/PCI CONFIGURATIONS ....................................................................................112
6.8 PC HEALTH STATUS ................................................................................................115
7 SOFTWARE DRIVERS........................................................................................117
7.1 AVAILABLE SOFTWARE DRIVERS .............................................................................118
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WAFER-MARK 3.5” Embedded SBC
7.2 VIA 4 IN 1 CHIPSET DRIVER INSTALLATION (VIA SERVICE PACK V4.3) .................118
7.3 REALTEK AUDIO DRIVER INSTALLATION............................................................... 125
7.3.1 LAN Driver Installation................................................................................. 131
A BIOS OPTIONS.................................................................................................... 135
B GPIO CONNECTION.......................................................................................... 139
B.1 DIO INTERFACE INTRODUCTION ........................................................................... 140
B.2 DIO CONNECTOR PINOUTS ................................................................................... 140
B.3 ASSEMBLY LANGUAGE SAMPLES........................................................................... 141
B.3.1 Enable the DIO Input Function..................................................................... 141
B.3.2 Enable the DIO Output Function.................................................................. 141
C WA TCHDOG TIMER .......................................................................................... 143
D ADDRESS MAPPING.......................................................................................... 147
D.1 ADDRESS MAP ...................................................................................................... 148
D.2 1ST MB MEMORY ADDRESS MAP ......................................................................... 148
D.3 IRQ MAPPING TABLE ............................................................................................ 149
D.4 DMA CHANNEL ASSIGNMENTS............................................................................. 149
E EXTERNAL AC’97 AUDIO CODEC ................................................................. 151
E.1 INTRODUCTION...................................................................................................... 152
E.1.1 Accessing the AC’97 CODEC ....................................................................... 152
E.1.2 Driver Installation......................................................................................... 152
E.2 SOUND EFFECT CONFIGURATION ........................................................................... 153
E.2.1 Accessing the Sound Effects Manager........................................................... 153
E.2.2 Sound Effect Manager Configuration Options.............................................. 154
F RAID SETUP ........................................................................................................ 157
F.1 INTRODUCTION ...................................................................................................... 158
F.1.1 Precautions.................................................................................................... 158
F.2 FEA TURES AND BENEFITS....................................................................................... 159
F .3 ACCESSING THE ALI RAID UTILITY...................................................................... 159
F.4 RAID OPTIONS:..................................................................................................... 161
F.4.1 Create RAID 0 Striping for Performance ...................................................... 161
F.4.2 Create RAID 1 Mirroring for Reliability ....................................................... 163
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F.4.3 Create JBOD for Integrated Capacity........................................................... 165
F.4.4 Stripe Size....................................................................................................... 166
F.4.5 Delete RAID Setting & Partition ................................................................... 167
F.4.6 Delete All RAID Setting & Partition.............................................................. 167
F.4.7 Rebuild RAID Array....................................................................................... 168
F.4.8 Select Boot Drive ........................................................................................... 168
G INDEX.................................................................................................................... 169
WAFER-MARK 3.5” Embedded SBC
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WAFER-MARK 3.5” Embedded SBC
List of Figures
Figure 1-1: WAFER-MARK Embedded SBC................................................................2
Figure 1-2: WAFER-MARK Overview...........................................................................4
Figure 1-3: WAFER-MARK Solder Side Overview......................................................5
Figure 2-1: WAFER-MARK Dimensions (mm) ..........................................................10
Figure 2-2: External Interface Panel Dimensions (mm)...........................................11
Figure 2-3: Data Flow Block Diagram........................................................................11
Figure 4-1: Connector and Jumper Locations .........................................................26
Figure 4-2: Connector and Jumper Locations (Solder Side)..................................27
Figure 4-3: AT Power Connector Location...............................................................30
Figure 4-4: ATX Power Supply Enable Connector Location...................................31
Figure 4-5: Audio Connector Pinouts (10-pin) .........................................................32
Figure 4-6: Audio CD In Connector Pinouts (4-pin).................................................33
Figure 4-7: Panel Backlight Connector Pinout Locations.......................................34
Figure 4-8: Battery Connector Location ...................................................................35
Figure 4-9: CF Card Socket Location........................................................................36
Figure 4-10: +5V Fan Connector Location................................................................38
Figure 4-11: 26-Pin FDD Connector Location...........................................................39
Figure 4-12: GPIO Connector Pinout Locations ......................................................40
Figure 4-13: Secondary IDE Device Connector Locations......................................42
Figure 4-14: Infrared Connector Pinout Locations..................................................43
Figure 4-15: Keyboard/Mouse Connector Location.................................................44
Figure 4-16: LED Connector Locations.....................................................................45
Figure 4-17: Parallel Port Connector Location.........................................................46
Figure 4-18: PC/104 Slot Location.............................................................................48
Figure 4-19: PC/104 Power Input Connector Pinouts..............................................50
Figure 4-20: Power Button Connector Location ......................................................51
Figure 4-21: Reset Button Connector Locations .....................................................52
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Figure 4-22: SATA Drive Connector Locations........................................................53
Figure 4-23: Serial Port Connector Pinout Locations .............................................54
Figure 4-24: TFT LCD LVDS Connector Pinout Locations......................................55
Figure 4-25: TFT LCD TTL Connector Pinout Locations.........................................57
Figure 4-26: USB Connector Pinout Locations........................................................58
Figure 4-27: WAFER-MARK On-board External Interface Connectors..................59
Figure 4-28: J7 Connector..........................................................................................60
Figure 4-29: PS/2 Pinout and Configuration.............................................................61
Figure 4-30: COM1 Pinout Locations........................................................................62
Figure 4-31: VGA Connector......................................................................................63
Figure 5-1: SO-DIMM Installation...............................................................................69
Figure 5-2: CF Card Installation.................................................................................71
Figure 5-3: Clear CMOS Jumper................................................................................73
WAFER-MARK 3.5” Embedded SBC
Figure 5-4: COM 2 Function Select Jumper Location .............................................74
Figure 5-5: LCD Voltage Selection Jumper Location..............................................75
Figure 5-6: COM 1/2 Pin 9 Setting Jumper Location ...............................................76
Figure 5-7: Audio Kit Cable Connection...................................................................78
Figure 5-8: IDE Cable Connection.............................................................................80
Figure 5-9: Power Cable to Motherboard Connection.............................................81
Figure 5-10: Connect ATX Power Adapter Cable to Power Supply .......................81
Figure 5-11: Connect ATX Power Cable to Motherboard........................................82
Figure 5-12: Dual RS-232 Cable Installation.............................................................83
Figure 5-13: Keyboard/mouse Y-cable Connection.................................................84
Figure 5-14: SATA Drive Cable Connection .............................................................85
Figure 5-15: SATA Power Drive Connection ............................................................86
Figure 5-16: LAN Connection.....................................................................................87
Figure 5-17: Serial Device Connector .......................................................................88
Figure 5-18: USB Connector ......................................................................................89
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Figure 7-1: Access the 4in1_Extreme Folder ........................................................ 119
Figure 7-2: Setup Utility Icon .................................................................................. 119
Figure 7-3: VIA Chipset Driver Installation Welcome Screen.............................. 119
Figure 7-4: Readme Information............................................................................. 120
WAFER-MARK 3.5” Embedded SBC
Figure 7-5: VIA Chipset Driver Installation Type................................................... 121
Figure 7-6: Driver Selection .................................................................................... 122
Figure 7-7: VIA PCI IDE Bus Driver Selection ....................................................... 123
Figure 7-8: AGP Driver Selection............................................................................ 124
Figure 7-9: Restart the Computer........................................................................... 125
Figure 7-10: Access the Audio Driver Folder........................................................ 125
Figure 7-11: Setup Utility Icon ................................................................................ 126
Figure 7-12: Audio Driver Install Shield Wizard Starting ..................................... 126
Figure 7-13: Audio Driver Setup Preparation........................................................ 127
Figure 7-14: Audio Driver Welcome Screen.......................................................... 128
Figure 7-15: Audio Driver Software Configuration............................................... 128
Figure 7-16: Audio Driver Digital Signal ................................................................ 129
Figure 7-17: Audio Driver Installation Begins....................................................... 130
Figure 7-18: Audio Driver Installation Complete................................................... 131
Figure 7-19: Access the LAN Driver Folder........................................................... 131
Figure 7-20: Setup Utility Icon ................................................................................ 132
Figure 7-21: LAN Driver Welcome Screen............................................................. 132
Figure 7-22: LAN Driver Installation Complete ..................................................... 133
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WAFER-MARK 3.5” Embedded SBC
List of Tables
Table 1-1: WAFER-MARK Board Variations ...............................................................2
Table 1-2: Technical Specifications ............................................................................8
Table 2-1: Supported HDD Specifications................................................................14
Table 2-2: Power Consumption .................................................................................20
Table 3-1: Package List Contents..............................................................................24
Table 3-2: Optional Components...............................................................................24
Table 4-1: Peripheral Interface Connectors..............................................................28
Table 4-2: Rear Panel Connectors.............................................................................29
Table 4-3: AT Power Connector Pinouts...................................................................30
Table 4-4: ATX Power Supply Enable Connector Pinouts......................................31
Table 4-5: Audio Connector Pinouts (10-pin)...........................................................32
Table 4-6: Audio CD In Connector Pinouts...............................................................33
Table 4-7: Panel Backlight Connector Pinouts ........................................................34
Table 4-8: Battery Connector Pinouts.......................................................................35
Table 4-9: CF Card Socket Pinouts ...........................................................................37
Table 4-10: +5V Fan Connector Pinouts ...................................................................38
Table 4-11: 26-pin FDD Connector Pinouts..............................................................40
Table 4-12: GPIO Connector Pinouts........................................................................40
Table 4-13: Secondary IDE Connector Pinouts........................................................43
Table 4-14: Infrared Connector Pinouts....................................................................44
Table 4-15: Keyboard/Mouse Connector Pinouts....................................................45
Table 4-16: LED Connector Pinouts..........................................................................46
Table 4-17: Parallel Port Connector Pinouts............................................................47
Table 4-18: PC/104 Slot Connector Pinouts .............................................................50
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Table 4-19: PC/104 Power Input Connector Pinouts ...............................................51
Table 4-20: Power Button Connector Pinouts..........................................................51
Table 4-21: Reset Button Connector Pinouts...........................................................52
WAFER-MARK 3.5” Embedded SBC
Table 4-22: SATA Drive Connector Pinouts .............................................................53
Table 4-23: Serial Port Connector Pinouts...............................................................54
Table 4-24: TFT LCD LVDS Port Connector Pinouts...............................................56
Table 4-25: TFT LCD TTL Port Connector Pinouts..................................................58
Table 4-26: USB Port Connector Pinouts .................................................................59
Table 4-27: RJ-45 Ethernet Connector Pinouts........................................................60
Table 4-28: LAN Connector LEDs..............................................................................60
Table 4-29: Keyboard Connector Pinouts.................................................................61
Table 4-30: RS-232 Serial Port (COM 1) Pinouts......................................................62
Table 4-31: USB Connector Pinouts..........................................................................63
Table 4-32: VGA Connector Pinouts .........................................................................63
Table 5-1: Jumpers..........................................................................................................
...................................................................................................................................
Table 5-2: Clear CMOS Jumper Settings ..................................................................73
Table 5-3: COM 2 Function Select Jumper Settings................................................74
Table 5-4: LCD Voltage Selection Jumper Settings.................................................75
Table 5-5: COM 1/2 Pin 9 Setting Jumper Settings..................................................76
Table 5-6: IEI Provided Cables...................................................................................78
Table 6-1: BIOS Navigation Keys...............................................................................93
72
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WAFER-MARK 3.5” Embedded SBC
BIOS Menus
BIOS Menu 1: Award BIOS CMOS Setup Utility.......................................................94
BIOS Menu 2: Standard CMOS Features ..................................................................96
BIOS Menu 3: Advanced BIOS Features................................................................ 100
BIOS Menu 4: Advanced Chipset Features ........................................................... 103
BIOS Menu 5: Integrated Peripherals..................................................................... 105
BIOS Menu 6: Power Management Setup.............................................................. 109
BIOS Menu 7: Wake Up Events............................................................................... 111
BIOS Menu 8: PnP/PCI Configurations.................................................................. 113
BIOS Menu 9: PC Health Status.............................................................................. 115
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WAFER-MARK 3.5” Embedded SBC
Glossary
AC ’97 Audio Codec 97
ACPI Advanced Configuration and Power
Interface
APM Advanced Power Management
ARMD ATAPI Removable Media Device
ASKIR Shift Keyed Infrared
ATA Advanced Technology Attachments
BIOS Basic Input/Output System
CFII Compact Flash Type 2
CMOS Complementary Metal Oxide
Semiconductor
CPU Central Processing Unit
Codec Compressor/Decompressor
COM Serial Port
DAC Digital to Analog Converter
DDR Double Data Rate
DIMM Dual Inline Memory Module
LCD Liquid Crystal Display
LPT Parallel Port Connector
LVDS Low Voltage Differential Signaling
MAC Media Access Controller
OS Operating System
PCI Peripheral Connect Interface
PIO Programmed Input Output
PnP Plug and Play
POST Power On Self Test
RAM Random Access Memory
SATA Serial ATA
S.M.A.R.T Self Monitoring Analysis and
Reporting Technology
SPD Serial Presence Detect
S/PDI Sony/Philips Digital Interface
SDRAM Synchronous Dynamic Random
Access Memory
DIO Digital Input/Output
DMA Direct Memory Access
EIDE Enhanced IDE
EIST Enhanced Intel SpeedStep
Technology
FFIO Flexible File Input/Output
FIFO First In/First Out
FSB Front Side Bus
IrDA Infrared Data Association
HDD Hard Disk Drive
IDE Integrated Data Electronics
I/O Input/Output
L1 Cache Level 1 Cache
L2 Cache Level 2 Cache
SIR Serial Infrared
UART Universal Asynchronous
Receiver-transmitter
USB Universal Serial Bus
VGA Video Graphics Adapter
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WAFER-MARK 3.5” Embedded SBC
Chapter
1
1 Introduction
Page 1
1.1 WAFER-MARK Overview
Figure 1-1: WAFER-MARK Embedded SBC
WAFER-MARK 3.5” Embedded SBC
The WAFER-MARK is a highly integrated embedded computer specifically optimized for
multimedia applications requiring minimum installation space. The WAFER-MARK
supports a full range of functionality for an AT/ATX-compatible industrial computer in a
space-saving 3.5” profile. The WAFER-MARK is equipped with a low-power consumption
and high performance VIA processor on board. It also contains an SDRAM SO-DIMM
socket that supports up to 512MB memory in size.
1.1.1 WAFER-MARK Board Variations
Four IEI WAFER-MARK models are available. The models are listed in Table 1-1.
WAFER-MARK CPU Clock Speed IDE Flash Module and OS
-533-R11
-800-R11
-WINXPE
-WINCE050
VIA Mark 533MHz No
VIA Mark 800MHz No
VIA Mark 533MHz/800MHz IFM 512MB with Windows XPE image
VIA Mark 533MHz/800MHz IFM 32MB with Windows CE 5.0 image
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Table 1-1: WAFER-MARK Board Variations
WAFER-MARK 3.5” Embedded SBC
1.1.2 WAFER-MARK Applications
The WAFER-MARK is designed for applications in the following areas:
Kiosks and Point of Sales
Restaurants
Human Machine Interface (HMI) applications
Marine, GPS and transportation applications
Financial, retail and kiosk applications
1.1.3 WAFER-MARK Benefits
Some of the WAFER-MARK benefits include:
Reduced hardware costs
Reduced software costs
Reduced maintenance costs
Client crash prevention
Central resource control
Security protection
1.1.4 WAFER-MARK Features
Some of the WAFER-MARK features are listed below:
3.5” form factor
RoHS compliant
VIA Mark 533 M Hz/800MHz processor installed
Dual-independent display functionality
Low power consumption
Two high performance 10/100 megabit Ethernet controllers on-board
Two SAT A channels with transfer rates up to 150MB/s on-board
Four USB 1.1 devices on-board
Integrated audio
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1.2 WAFER-MARK Overview
WAFER-MARK 3.5” Embedded SBC
Figure 1-2: WAFER-MARK Overview
Page 4
WAFER-MARK 3.5” Embedded SBC
Figure 1-3: WAFER-MARK Solder Side Overview
1.2.1 WAFER-MARK Connectors
The WAFER-MARK has the following connectors on-board:
1 x AT power connector
1 x ATX power supply enable connector
1 x Audio connector
1 x Audio CD in connector
1 x Backlight inverter connector
1 x Battery connector
1 x Compact Flash (CF) connector
1 x Fan connector
1 x FDD connector (optional)
1 x GPIO connector
1 x IDE Interface connector
1 x Infrared Interface connector
Page 5
1 x Keyboard/Mouse connector
1 x LED connector
1 x Parallel port connector
1 x PC/104 slot
1 x PC/104 power connector
1 x Power button connector
1 x Reset button connector
2 x SATA connectors
1 x Serial port connector
1 x SO-DIMM socket
1 x TFT LCD LVDS connector
1 x TFT LCD TTL connector
1 x USB connector
WAFER-MARK 3.5” Embedded SBC
The WAFER-MARK has the following connectors on the board rear panel:
2 x Ethernet connectors
2 x USB connectors
1 x Keyboard/Mouse connector (optional)
1 x Serial port connector
1 x VGA connector
The WAFER-MARK has the following on-board jumpers:
Clear CMOS
Serial port select
COM1/2 Pin 9 Setting (optional)
LCD voltage select
1.2.2 Technical Specifications
WAFER-MARK technical specifications are listed in Table 1-2. Detailed descriptions of
each specification can be found in Chapter 2.
Page 6
WAFER-MARK 3.5” Embedded SBC
Specification WAFER-MARK
Form Factor
CPU
Southbridge
Display
Memory
BIOS
Super I/O
SSD
3.5” form factor
Embedded VIA Mark CoreFusion Low Voltage processor at
533MHz/800MHz
VIA VT82C686B
VGA integrated in VIA Mark
24-bit TTL
18-bit dual channel LVDS
Supports one 512MB DDR PC100/133MHz 144-pin SO-DIMM
SDRAM module
Award BIOS
VT82C686B
One CompactFlash® (CF) Type II slot
Audio
LAN
COM
USB2.0
IDE
Watchdog Timer
Digital I/O
Expansion
Power Supply
Temperature
AC'97 Codec Realtek ALC6 55
10/100 Base-T dual RTL8100C Ethernet chipsets
Two RS-232 or
One RS-232 and one RS-422/RS-485
Four USB 1.1 devices supported
One 44-pin IDE connects to two Ultra ATA33/66/100 devices
Software programmable 1-255 sec. by supper I/O
One GPIO connector
One PC/104 slot
+5V only, A T/ATX power support
0ºC - 60ºC
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WAFER-MARK 3.5” Embedded SBC
Humidity (operating)
Dimensions
Weight (GW/NW)
Table 1-2: Technical Specifications
5%~95% non-condensing
146mm x 102mm
700g/260g
Page 8
WAFER-MARK 3.5” Embedded SBC
Chapter
2
2 Detailed Specifications
Page 9
2.1 Overview
This chapter describes the specifications and on-board features of the WAFER-MARK in
detail.
2.2 Dimensions
2.2.1 Board Dimensions
The dimensions of the board are listed below:
Length: 146mm
Width: 102mm
WAFER-MARK 3.5” Embedded SBC
Figure 2-1: WAFER-MARK Dimensions (mm)
2.2.2 External Interface Panel Dimensions
External peripheral interface connector panel dimensions are shown in Figure 2-2.
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WAFER-MARK 3.5” Embedded SBC
Figure 2-2: External Interface Panel Dimensions (mm)
2.3 Data Flow
The WAFER-MARK motherboard comes with a VIA Mark CPU and a VIA VT82C686B
Southbridge.
other components installed on the motherboard.
Figure 2-3 shows the data flow between the system chipset, the CPU and
Figure 2-3: Data Flow Block Diagram
Page 11
2.4 CPU Support
The WAFER-MARK series motherboards all come with a preinstalled 500MHz or 800MHz
VIA Mark CPU.
2.4.1 VIA MARK Overview
The specifications for the VIA Mark CPU are listed below
533MHz or 800MHz CPU frequency
133MHz processor front side frequency
6W or 8W maximum thermal design power
0.13u process technology
HSBGA desig n package
MMX, SSE and 3DNow 3D instruction sets
WAFER-MARK 3.5” Embedded SBC
RNG and AES built in security feature s
133MHz SDR memory support
S3 Graphics ProSavage4 integrated graphics
Integrated L V DS transmitter
Dual independent display supported
ISA support
2.4.2 VIA MARK Memory Support
The VIA Mark CoreFusion processor supports a single PC100MHz or PC13 3MHz SDRAM
SO-DIMM module with a maximum memory of 512MB.
2.4.3 VIA MARK Integration
The VIA Mark CoreFusion processor comes with rich x86 integration and combines the
VIA 'Nehemiah' processor core architecture with a feature rich Northbridge in a single
package. The VIA Mark CoreFusion processor offers full legacy support, advanced
Page 12
integrated graphics, a military-grade hardware security engine and unparalleled
connectivity.
WAFER-MARK 3.5” Embedded SBC
2.4.4 VIA MARK S3 Graphics ProSavage4 Graphics Core
The VIA Mark CoreFusion has the following graphics and display support.
Integrated S3 Graphics ProSavage4 Graphics Core
o Integrated with CPU with 2D/3D/Video controllers
o Optimized Shared Memory Architecture (SMA)
o Full internal AGP 4x performance
o Significant internal architecture upgrades from original S3 ProSavage4
standalone product
o 8/16/32MB frame buffer using system memory
o Works with VIA VT82C686A/B PCI-to-ISA Southbridge for advanced
power management.
Dual independent display support
An integrated LVDS/DVI transmitter
A video capture port
Display resolutions of up to 1600 x 1200 pixels.
2.4.5 VIA MARK VIA PadLock Security Engine
The VIA PadLock Security Engine embedded on the VIA Mark CoreFusion processor
platform integrates an AES cipher engine and a quantum based random number
generator to help protect stored and exchanged data. Please visit the VIA website for
more information (
http://www.via.com.tw/en/initiatives/padlock/index.jsp).
2.5 System Chipset
The WAFER-MARK series motherboards all have a preinstalled VIA VT82C686B chipset.
The system chipset features are listed below.
Integrated AC'97 audio
Integrated MC'97 modem
Integrated Super I/O
Hardware monitoring capabilities
USB 1.1 controller
Page 13
2.5.1 VIA VT82C686B ATA-6 Controller
The single WAFER-MARK IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra
ATA/100) compliant IDE controller on the VIA VT82C686B has a maximum transfer rate of
100MB/s. ATA-6 includes advancements in error checking and ATA-6 drives are
compatible with future interface additions.
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s
Ultra A T A/66, with data transfer rates up to 66MB/s
Ultra A T A/33, with data transfer rates up to 33MB/s
WAFER-MARK 3.5” Embedded SBC
Specification
IDE devices
PIO Mode
PIO Max Transfer Rate
DMA/UDMA designation
DMA/UDMA Max Transfer
Controller Interface
Ultra A T A/100 Ultra ATA/66 Ultra AT A/33
2 2 2
0 – 4 0 – 4 0 – 4
16.6 MB/s 16.6 MB/s 16.6 MB/s
UDMA 3 - 4 UDMA 3 – 4 UDMA 2
100MB/s 66MB/s 33MB/s
5V 5V 5V
Table 2-1: Supported HDD Specifications
2.5.2 VIA VT82C686B Flash Interface
The WAFER-MARK CompactFlash socket supports standard CF Type I and CF Type II
cards. The chipset flash interface is multiplexed with an IDE interface and can be
Page 14
connected to an array of industry standard NAND Flash or NOR Flash devices.
WAFER-MARK 3.5” Embedded SBC
2.5.3 VIA VT82C686B Audio Codec 97 (AC’97) Controller
The AC’97 specification v2.3 compliant controller on the chipset is interfaced to a 16-bit
full-duplex AC'97 2.3 RealTek ALC655 codec. The ALC655 is then connec ted to a 10-pin
audio connector to which an audio kit can easily be connected. The codec meets
performance requirements for audio on PC99/2001 systems. Some of the codec features
are listed below.
Meets Microsoft WHQL/WLP 2.0 audio requirements
16-bit Stereo full-duplex CODEC with 48KHz sampling rate
Complies with AC'97 2.3 specifications
o Front-Out, Surround-Out, MIC-In and LINE-In Jack Sensing
o 14.318MHz -> 24.576MHz PLL to eliminate crystal
o 12.288MHz BITCLK input
o Interrupt capability
Three analog line-level stereo inputs with 5-bit volume control, LINE_IN, CD,
AUX
High-quality differential CD input
Two analog line-level mono inputs: PCBEEP, PHONE-IN
Two software selectable MIC inputs
Dedicated Front-MIC input for front panel applications (software selectable)
Boost preamplifier for MIC input
LINE input shared with surround output; MIC input shared with Center and
LFE output
Built-in 50mW/20ohm amplifier for both Front-out and Surround-Out
External Amplifier Power Down (EAPD) capability
Power management and enhanced power saving features
Supports Power-Off CD function
Adjustable VREFOUT control
Supports 48KHz S/PDIF output, complying with AC'97 Rev 2.3 specifications
Supports 32K/44.1K/48KHz S/PDIF input
Power support: Digital: 3.3V; Analog: 3.3V/5V
Standard 48-pin LQFP package
EAX™ 1.0 & 2.0 compatible
Direct Sound 3D™ compatible
Page 15
A3D™ compatible
I3DL2 compatible
HRTF 3D positional audio
Sensaura™ 3DPA enhancement (optional)
10-band software equalizer
Voice can cellation and key shifting in Karaoke mode
AVRack® Media Player
Configuration Panel for improved user convenience
2.5.4 VIA VT82C686B USB Controller
Four internal USB ports on the WAFER-MARK board are interfaced via the PCI bus to the
VIA VT82C686B chipset USB 1.1 controller. Four USB 1.1 devices can be connected
simultaneously to the WAFER-MARK.
WAFER-MARK 3.5” Embedded SBC
2.5.5 VIA VT82C686B Serial Communications
Two high-speed UART RS-232 serial port connectors, one internal and one external, are
connected to the system chipset integrated Super I/O on the chipset. The specifications
for the serial ports are listed below.
16C550 UART with 16-byte FIFO buffer
115.2Kbps transmission rate
2.5.6 VIA VT82C686B Infrared Interface
A single TX/RX infrared (IrDA) interface connector is connected to the system chipset
integrated Super I/O on the chipset. The following the IrDA interfaces are supported.
Serial Infrared (SIR)
Shift Keyed Infrared (ASKIR)
Page 16
WAFER-MARK 3.5” Embedded SBC
2.5.7 VIA VT82C686B Parallel Port Communications
One internal parallel port connector on the WAFER-MARK board is connected to the VIA
VT82C686B through the integrated Super I/O. The parallel port is bi-directional and
supports the following parallel port modes:
SPP
EPP
ECP
2.5.8 VIA VT82C686B Keyboard and Mouse
An internal keyboard/mouse connector and an external PS/2 keyboard connector are both
connected to the VIA VT82C686B chipset through the integrated Super I/O. A PS/2
keyboard/mouse Y-cable is shipped with the WAFER-MARK and is connected to the
internal keyboard/mouse connector. For more details refer to Chapter 3 and Chapter 5.
2.5.9 VIA VT82C686B Real Time Clock
The system chipset has a battery backed up 256-byte real-time clock (RTC) with CMOS
RAM.
2.5.10 BIOS
The BIOS flash memory chip on the WAFER-MARK has a licensed copy of AWARD BIOS
loaded onto it. The BIOS flash memory chip is connected to the VIA VT82C686B system
chipset. The flash BIOS features are listed below:
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-Boot Execution Environment) support
USB booting support
Page 17
2.6 PCI Bus
2.6.1 Overview
The PCI bus provides a PCI interface between the VIA Mark and the VIA VT82C686B.
The PCI bus provides also provides a communication interface between the USB
connectors and the USB 1.1 controller on the VIA VT82C686B. The SATA drives and the
single RJ-45 Ethernet connector are also interfaced to the VIA Mark and VIA VT82C686B
through the PCI bus. Some of the features of the PCI bus are listed below:
33MHz Revision 2.3 is implemented
Up to six external bus masters are supported
Maximum throughput: 133MB/sec
Master devices: Maximum of six with three implemented
WAFER-MARK 3.5” Embedded SBC
One PCI REQ/GNT pair can be given higher arbitration priority
44-bit addressing using the DAC protocol supported
2.6.2 10/100M Ethernet
A highly integrated and cost-effective single-chip, fast RealTek RTL8100C 10/100Mbps
Ethernet controller is interfaced through first the PCI bus a to the CPU and system chipset.
The RealTek RTL8100C controller provides 10Mbps or 100Mbps Ethernet connectivity to
the WAFER-MARK. Some of the features of the RealTek RTL8100C are listed below.
10Mbps and 100Mbps operation
Supports 10Mbps and 100Mbps N-way auto-negotiation
Supports 25MHz Crystal or 25MHz OSC as the internal clock source
Complies with PC99/PC2001 standards
Supports ACPI power management
Provides PCI bus master data transfer
Provides PCI memory space or I/O space mapped data transfer
Page 18
Supports PCI clock speed of 16.75MHz-40MHz
Advanced power saving mode
Supports Wa ke-on-LAN and remote wake-up
Half/Full duplex capability
WAFER-MARK 3.5” Embedded SBC
Supports Full Duplex Flow Control (IEEE 802.3x)
Provides interface to 93C46 EEPROM to store resource configuration and ID
parameters
Provides PCI clock run pin
Provides LED pins for network operation status indication
2.5/3.3V power supply with 5V tolerant I/Os
2.6.3 SATA Drive Controller
An ALi M5283 SATA drive controller is connected to two SATA drive connectors and
interfaced to the system through the PCI bus. The ALi M5283 SATA drive controller has
the following features:
SATA specification revision 1.0 compliant
PCI specification revision 2.2 compliant
PCI Bus Power Management Specification revision 1.1 compliant
Two indepen dent channels to connect up to two SATA hard drive
Up to 1.5Gb/s SATA data transfer rate
Built-in 256 byte FIFO for each SATA port ensures fast read/write operations
32bit wide, 66MHz PCI bus supported
2.7 Environmental and Power Specifications
2.7.1 System Monitoring
The WAFER-MARK is capable of self-monitoring various aspects of its operating status
including:
Different component voltages including the CPU, chipset, and battery
RPM of cooling fans
CPU and system temperatures (by the corresponding embedded sensors)
2.7.2 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-MARK are listed
below.
Page 19
Minimum Operating Temperature: 0ºC (32°F)
Maximum Operating Temperature: 60°C (140°F)
The system is shipped with a preinstalled heat sink. When running the system do not
remove the heat sink. If the heat sink is changed, make sure thermal paste is placed on
the bottom of the heat sink to facilitate improved heat convection from the CPU surface to
the heat sink.
2.7.3 Power Consumption
Table 2-2 shows the power consumption parameters for a WAFER-MARK with a 533MHz
CPU onboard and 800MHz CPU onboard.
CPU Speed Onboard Memory Voltage Current
WAFER-MARK 3.5” Embedded SBC
VIA MARK 800MHz
VIA MARK 533MHz
Table 2-2: Power Consumption
128MB PC133
128MB PC133
+5V 2.75A
+5V 2.58A
Page 20
WAFER-MARK 3.5” Embedded SBC
Chapter
3
3 Unpacking
Page 21
3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-MARK may result in permanent damage to the
WAFER-MARK and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-MARK. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the WAFER-MARK, or any other electrical component is
handled, the following anti-static precautions are strictly adhered to.
WAFER-MARK 3.5” Embedded SBC
Wear an anti-static wristband: Wearing a simple ant i-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-MARK, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-MARK.
Only handle the edges of the PCB: When handling the PCB, hold the PCB
by the edges.
3.2 Unpacking
3.2.1 Unpacking Precautions
When the WAFER-MARK is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 3.1.
Page 22
Make sure the packing box is facing upwards so the WAFER-MARK does not
fall out of the box.
Make sure all the components shown in Section 3.3 are present.
WAFER-MARK 3.5” Embedded SBC
3.3 Unpacking Checklist
NOTE:
If some of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-MARK from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
sales@iei.com.tw.
3.3.1 Package Contents
The WAFER-MARK is shipped with the following components:
Quantity Item Image
1 WAFER-MARK single board computer
1 Audio cable (P/N: 32000-072100-RS)
1 IDE cable (P/N: 32200-000009-RS)
1 Keyboard/Mouse Y cable
(P/N: 32000-023800-RS)
2 SATA cable (P/N: 32000-062800-RS)
1 SATA power cable
(P/N: 32100-088600-RS)
Page 23
1 Dual ports serial port cable
(P/N: 32200-026500-RS)
1 Mini jumper Pack
(P/N: 33100-000079-RS)
1 Quick Installation Guide
1 Utility CD
WAFER-MARK 3.5” Embedded SBC
Table 3-1: Package List Contents
3.3.2 Optional Components
The following optional components are available from IEI.
Item and Part Number
ATX power adapter cable (P/N: 32100-052100)
LPT cable (P/N: 32200-015100)
Table 3-2: Optional Components
Image
Page 24
WAFER-MARK 3.5” Embedded SBC
Chapter
4
4 Connector Pinouts
Page 25
WAFER-MARK 3.5” Embedded SBC
4.1 Peripheral Interface Connectors
Section 4.1.2 shows peripheral interface connector locations. Section 4.1.2 lists all the
peripheral interface connectors seen in Section
4.1.2.
4.1.1 WAFER-MARK Layout
Figure 4-1 shows the on-board peripheral connectors, rear panel peripheral connectors
and on-board jumpers.
Page 26
Figure 4-1: Connector and Jumper Locations
WAFER-MARK 3.5” Embedded SBC
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-MARK.
Detailed descriptions of these connectors can be found below.
Connector Type Label
AT power connector 4-pin wafer connector CN1
ATX power supply enable connector 3-pin wafer connector CN2
Audio connector 10-pin box header CN8
Audio CD in connector 4-pin header CN9
Backlight inverter connector 5-pin wafer connector CN3
Battery connector 2-pin wafer connector CN7
Compact Flash (CF) connector 50-pin slot CN32
Page 27
Fan connector 3-pin wafer connector CN4
FDD connector (optional) 26-pin connector CN31
GPIO connector 10-pin header CN14
IDE Interface connector 44-pin box header CN30
Infrared Interface connector 5-pin wafer connector CN27
Keyboard/Mouse connector 6-pin wafer connector CN17
LED connector 6-pin wafer connector CN5
Parallel port connector 26-pin header CN15
PC/104 slot 104-pin slot CN10
PC/104 power connector 3-pin wafer connector CN11
WAFER-MARK 3.5” Embedded SBC
Power button connector 2-pin wafer connector CN13
Reset button connector 2-pin wafer connector CN12
SATA connector 7-pin connector CN23
SATA connector 7-pin connector CN25
Serial port connector 14-pin header CN16
SO-DIMM socket 144-pin socket CN6
TFT LCD LVDS connector 30-pin crimp connector CN29
TFT LCD TTL connector 40-pin crimp connector CN28
USB connector 8-pin header CN24
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Page 28
Table 4-2 lists the rear panel connectors on the WAFER-MARK. Detailed descriptions of
these connectors can be found in Section
4.3.
WAFER-MARK 3.5” Embedded SBC
Connector Type Label
Ethernet connector RJ-45 CN20
Ethernet connector RJ-45 CN21
Keyboard/Mouse connector PS/2 CN18
RS-232 serial port connector 9-pin male CN22
Dual port USB port USB port CN19
VGA port connector 15-pin female CN26
Table 4-2: Rear Panel Connectors
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of
all the internal, peripheral connectors on the WAFER-MARK.
4.2.1 AT Power Connector
CN Label: CN1
CN Type:
CN Location: See
CN Pinouts: See
The 4-pin AT power connector is connected to an AT power supply.
4-pin AT power connector (1x4)
Figure 4-3
Table 4-3
Page 29
WAFER-MARK 3.5” Embedded SBC
Figure 4-3: AT Power Connector Location
PIN NO. DESCRIPTION
1 +12V
2 GND
3 GND
4 +5V
Table 4-3: AT Power Connector Pinouts
4.2.2 ATX Power Supply Enable Connector
CN Label: CN2
CN Type:
CN Location: See
CN Pinouts: See
A jumper cap is installed on pin 1 and pin 2 as factory default (pin1=+5VSB; pin2=+5V).
If the WAFER-MARK is connected to an AT power, let the jumper stay on pin 1 and pin 2.
If connected to an ATX power source, remove the jumper cap.
3-pin wafer (1x3)
Figure 4-4
Table 4-4
Page 30
If an ATX power supply is used, use an ATX-to-4P power cable to connect the AT power
connector (CN1) and ATX power supply enable connector (CN2). Also connect a power
WAFER-MARK 3.5” Embedded SBC
on/off switch to the power button connector (CN13). Please refer to Section 5.6.4 for more
details. Note that the ATX power supply should provide a 10mA load on the 5V source
standby lead for this function to take effect.
Figure 4-4: ATX Power Supply Enable Connector Location
PIN NO. DESCRIPTION
1 +5VSB
2 NC
3 PS-ON
Table 4-4: ATX Power Supply Enable Connector Pinouts
4.2.3 Audio Connector
CN Label: CN8
CN Type:
CN Location: See
CN Pinouts: See
10-pin box header
Figure 4-5
Table 4-5
The 10-pin audio connector is connected to external audio devices including speakers a nd
microphones for the input and output of audio signals to and from the system.
Page 31
WAFER-MARK 3.5” Embedded SBC
Figure 4-5: Audio Connector Pinouts (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Line out R 2 Line in R
3 GND 4 GND
5 Line out L 6 Line in L
7 GND 8 GND
9 MIC in 10 NC
Table 4-5: Audio Connector Pinouts (10-pin)
4.2.4 Audio CD In Connector
CN Label: CN9
CN Type:
CN Location: See
CN Pinouts: See
The 4-pin audio CD in connector is connected to an external audio CD device for the input
4-pin header
Figure 4-6
Table 4-6
Page 32
and output of audio signals from a CD player to the system.
WAFER-MARK 3.5” Embedded SBC
Figure 4-6: Audio CD In Connector Pinouts (4-pin)
PIN NO. DESCRIPTION
1 CD Signal (Left)
2 Ground
3 Ground
4 CD Signal (Right)
Table 4-6: Audio CD In Connector Pinouts
4.2.5 Backlight Inverter Connector
CN Label: CN3
CN Type:
CN Location: See
CN Pinouts: See
5-pin wafer (1x5)
Figure 4-7
Table 4-7
The backlight inverter connector provides the backlight on the LCD display connected to
the WAFER-MARK with +12V of power.
Page 33
WAFER-MARK 3.5” Embedded SBC
Figure 4-7: Panel Backlight Connector Pinout Locations
PIN NO. DESCRIPTION
1
2 GROUND
3 +12V
4 GROUND
5 BACKLIGHT ENABLE
LCD_Adj [GND (Fixed mode): Maximum Brightness]
Table 4-7: Panel Backlight Connector Pinouts
4.2.6 Battery Connector
CN Label: CN7
CN Type:
CN Location: See
CN Pinouts: See
The battery connector is connected to a backup battery. The battery connector is also
2-pin wafer (1x2)
Figure 4-8
Table 4-8
Page 34
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
WAFER-MARK 3.5” Embedded SBC
Figure 4-8: Battery Connector Location
PIN NO. DESCRIPTION
1 Battery+
2 Ground
Table 4-8: Battery Connector Pinouts
4.2.7 Compact Flash Socket
CN Label: CN32 (solder side)
CN Type:
CN Location: See
CN Pinouts: See
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the
WAFER-MARK.
50-pin slot (2x25)
Figure 4-9
Table 4-9
Page 35
WAFER-MARK 3.5” Embedded SBC
Page 36
Figure 4-9: CF Card Socket Location
WAFER-MARK 3.5” Embedded SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 26 CFD2
2 SDD3 27 SDD11
3 SDD4 28 SDD12
4 SDD5 29 SDD13
5 SDD6 30 SDD14
6 SDD7 31 SDD15
7 SDCS1# 32 SDCS3#
8 GROUND 33 N/C
9 GROUND 34 SDIOR#
10 GROUND 35 SDIOW#
11 GROUND 36 VCC
12 GROUND 37 IRQ15
13 VCC 38 VCC
14 GROUND 39 MASTER/SLAVE
15 GROUND 40 N/C
16 GROUND 41 RESET#
17 GROUND 42 SIORDY
18 SDA2 43 SDDREQ
19 SDA1 44 SDDACK#
20 SDA0 45 HD_LED2
21 SDD0 46 PDIAG#
22 SDD1 47 SDD8
23 SDD2 48 SDD9
24 N/C 49 SDD10
25 CFD1 50 GROUND
Table 4-9: CF Card Socket Pinouts
4.2.8 Fan Connector
CN Label: CN4
CN Type:
3-pin wafer (1x3)
Page 37
WAFER-MARK 3.5” Embedded SBC
CN Location: See Figure 4-10
CN Pinouts: See
Table 4-10
The cooling fan connector provides a 5V, 500mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
Figure 4-10: +5V Fan Connector Location
PIN NO. DESCRIPTION
1 Rotation Signal
2 +5V
3 GND
Table 4-10: +5V Fan Connector Pinouts
4.2.9 Floppy Disk Connector (Optional)
CN Label: CN31 (solder side)
CN Type:
CN Location: See
CN Pinouts: See
26-pin connector (1 x 26)
Figure 4-11
Table 4-11
Page 38
WAFER-MARK 3.5” Embedded SBC
The floppy disk connector is connected to a floppy disk drive.
Figure 4-11: 26-Pin FDD Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 +5V 2 INDEX3 +5V 4 DISKSEL0-
5 +5V 6 DSKCHG7 N/C 8 N/C
9 N/C 10 MTR011 N/C 12 DIR-
13 N/C 14 STEP15 GROUND 16 WDATA-
17 GROUND 18 WGATE19 GROUND 20 TRAK0-
21 GROUND 22 WRTPRT23 GROUND 24 RDATA-
25 GROUND 26 HDSEL-
Page 39
Table 4-11: 26-pin FDD Connector Pinouts
4.2.10 GPIO Connector
CN Label: CN14
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
10-pin header (2x5)
Figure 4-12
Table 4-12
The GPIO connector can be connected to external I/O control devices including sensors,
lights, alarms and switches.
Figure 4-12: GPIO Connector Pinout Locations
Page 40
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 2 +5V
3 OUTPUT1 4 OUTPUT2
5 OUTPUT3 6 OUTPUT4
7 INPUT1 8 INPUT2
9 INPUT3 10 INPUT4
Table 4-12: GPIO Connector Pinouts
WAFER-MARK 3.5” Embedded SBC
4.2.11 IDE Connector
CN Label: CN30
CN Type:
CN Location: See
CN Pinouts: See
One 44-pin IDE device connector on the WAFER-MARK su ppo rt s conn ectivity to two hard
disk drives.
44-pin box header (2x22)
Figure 4-13
Table 4-13
Page 41
WAFER-MARK 3.5” Embedded SBC
Figure 4-13: Secondary IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15
19 GROUND 20 N/C
21 DRQ 22 GROUND
23 IOW# 24 GROUND
25 IOR# 26 GROUND
Page 42
27 CHRDY 28 (PULL LOW TO GND)
29 DACK# 30 GROUND
31 INTERRUPT 32 N/C
WAFER-MARK 3.5” Embedded SBC
33 SA1 34 N/C
35 SA0 36 SA2
37 HDC CS1# 38 HDC CS3#
39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC
43 GROUND 44 N/C
Table 4-13: Secondary IDE Connector Pinouts
4.2.12 Infrared Interface Connector
CN Label: CN27
CN Type:
CN Location: See
CN Pinouts: See
5-pin wafer (1x5)
Figure 4-14
Table 4-14
The infrared interface connector supports both Serial Infrared (SIR) and Amplitude Shift
Key Infrared (ASKIR) interfaces.
Figure 4-14: Infrared Connector Pinout Locations
Page 43
PIN NO. DESCRIPTION
1 VCC
2 NC
3 IR-RX
4 GND
5 IR-TX
Table 4-14: Infrared Connector Pinouts
4.2.13 Keyboard/Mouse Connector
CN Label: CN17
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
6-pin wafer (1x6)
Figure 4-15
Table 4-15
The keyboard and mouse connector can be connected to a standard PS/2 cable or PS/2
Y-cable to add keyboard and mouse functionality to the system.
Figure 4-15: Keyboard/Mouse Connector Location
Page 44
PIN NO. DESCRIPTION
1 +5V
2 MS DATA
3 MS CLK
4 KB DATA
WAFER-MARK 3.5” Embedded SBC
5 KB CLK
6 GROUND
Table 4-15: Keyboard/Mouse Connector Pinouts
4.2.14 LED Connector
CN Label: CN5
CN Type:
CN Location: See
CN Pinouts: See
6-pin wafer (1x6)
Figure 4-16
Table 4-16
The LED connector connects to an HDD indicator LED and a power LED on the system
chassis to inform the user about HDD activity and the power on/off status of the system.
Figure 4-16: LED Connector Locations
PIN NO. DESCRIPTION
1 +5V (VCC)
2 GROUND
3 LED+ (VCC)
4 LED- (GROUND)
5 IDE_LED+ (VCC)
Page 45
6 IDE _ LED-
Table 4-16: LED Connector Pinouts
4.2.15 Parallel Port Connector
CN Label: CN15
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
26-pin header
Figure 4-17
Table 4-17
The 26-pin parallel port connector connects to a parallel port connector interface or some
other parallel port device such as a printer.
Page 46
Figure 4-17: Parallel Port Connector Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 STROBE# 2 AUTO FORM FEED #
3 DATA 0 4 ERROR#
5 DATA 1 6 INITIALIZE
7 DATA 2 8 PRINTER SELECT LN#
9 DATA 3 10 GROUND
11 DATA 4 12 GROUND
WAFER-MARK 3.5” Embedded SBC
13 DATA 5 14 GROUND
15 DATA 6 16 GROUND
17 DATA 7 18 GROUND
19 ACKNOWLEDGE 20 GROUND
21 BUSY 22 GROUND
23 PAPER EMPTY 24 GROUND
25 PRINTER SELECT 26 N/C
Table 4-17: Parallel Port Connector Pinouts
4.2.16 PC/104 Slot
CN Label: CN10
CN Type:
CN Location: See
CN Pinouts: See
104-pin PC/104 slot
Figure 4-18
Table 4-18
The PC/104 slot enables a PC/104 compatible expansion module to be connected to the
board.
Page 47
WAFER-MARK 3.5” Embedded SBC
Page 48
Figure 4-18: PC/104 Slot Location
WAFER-MARK 3.5” Embedded SBC
Pin No. Column A Column B Column C Column D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
IOCHK- GROUND GROUND GROUND
SD7 RSTDRV SBHE- MCS16SD6 +5V SA23 IOCS16SD5 IRQ9 SA22 IRQ10
SD4 -5V SA21 IRQ11
SD3 DREQ2 SA20 IRQ12
SD2 -12V SA19 IRQ15
SD1 ZWS- SA18 IRQ14
SD0 +12V SA17 DACK0IOCHRDY GROUND MEMR- DREQ0
AEN SMEMW- MEMW- DACK5SA19 SMEMR- SD8 DRREQ5
SA18 IOW- SD9 DACK6 SA17 IOR-
SD10
DREQ6
SA16 DACK3- SD11 DACK7-
16
17
18
19
20
21
22
23
24
25
26
27
28
29
SA15 DREQ3 SD12 DREQ7
SA14 DACK1- SD13 +5V
SA13 DREQ1 SD14 MASTERSA12 REFRESH- SD15 GROUND
SA11 ISACLK NC GROUND
SA10 IRQ7
SA9 IRQ6
SA8 IRQ5
SA7 IRQ4
SA6 IRQ3
SA5 DACK2SA4 TC
SA3 BALE
SA2 +5V
Page 49
WAFER-MARK 3.5” Embedded SBC
30
31 SA0 GROUND
32 GROUND GROUND
SA1 ISA_OSC
Table 4-18: PC/104 Slot Connector Pinouts
4.2.17 PC/104 Power Input Connector
CN Label: CN11
CN Type:
CN Location: See
CN Pinouts: See
The PC/104 power input connector provides power to the PC/104 expansion module
installed on the PC/104 slot.
3-pin wafer (1x3)
Figure 4-19
Table 4-19
Figure 4-19: PC/104 Power Input Connector Pinouts
PIN NO. DESCRIPTION
1 -5V
2 GND
3 -12V
Page 50
WAFER-MARK 3.5” Embedded SBC
Table 4-19: PC/104 Power Input Connector Pinouts
4.2.18 Power Button Connector
CN Label: CN13
CN Type:
CN Location: See
CN Pinouts: See
The power button connector is connected to a power switch on the system chassis to
enable users to turn the system on and off.
2-pin wafer (1x2)
Figure 4-20
Table 4-20
Figure 4-20: Power Button Connector Location
PIN NO. DESCRIPTION
1 Power Button
2 GND
Table 4-20: Power Button Connector Pinouts
4.2.19 Reset Button Connector
CN Label: CN12
CN Type:
CN Location: See
2-pin wafer (1x2)
Figure 4-21
Page 51
CN Pinouts: See Table 4-21
The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e
users to reboot the system when the system is turned on.
WAFER-MARK 3.5” Embedded SBC
Figure 4-21: Reset Button Connector Locations
PIN NO. DESCRIPTION
1 Reset Button
2 GND
Table 4-21: Reset Button Connector Pinouts
4.2.20 SATA Drive Connectors
CN Label: CN23 and CN25
CN Type:
CN Location: See
CN Pinouts: See
The two SATA drive connectors are each connected to a first generation SATA drive. First
generation SATA drives transfer data at speeds as high as 150Mb/s. The SATA drives can
be configured in a RAID configuration.
7-pin SATA drive connectors
Figure 4-22
Table 4-22
Page 52
WAFER-MARK 3.5” Embedded SBC
Figure 4-22: SATA Drive Connector Locations
PIN NO. DESCRIPTION
1 GND
2 TX+
3 TX4 GND
5 RX6 RX+
7 GND
Table 4-22: SATA Drive Connector Pinouts
4.2.21 Serial Port Connector (RS-422/485)
CN Label: CN16
CN Type:
CN Location: See
CN Pinouts: See
14-pin header (2x20)
Figure 4-23
Table 4-23
The 14-pin serial port connector connects to the COM 2 serial communications channels.
COM 2 is a multi function channel. In default mode COM 2 is an RS-232 serial
communication channel but, with the COM 2 function select jumper, can be configured as
either an RS-422 or RS-485 serial communications channel.
Page 53
WAFER-MARK 3.5” Embedded SBC
Figure 4-23: Serial Port Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD 2 DSR
3 RXD 4 RTS
5 TXD 6 CTS
7 DTR 8 RI
9 GND 10 GND
11 TX+ 12 TX13 RX+ 14 RX-
Table 4-23: Serial Port Connector Pinouts
4.2.22 TFT LCD LVDS Connector
CN Label: CN29
CN Type:
CN Location: See
CN Pinouts: See
The 30-pin TFT LCD LVDS can be connected to a TFT LCD screen directly.
30-pin crimp (2x15)
Figure 4-24
Table 4-24
Page 54
WAFER-MARK 3.5” Embedded SBC
Figure 4-24: TFT LCD LVDS Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GROUND 2 GROUND
3 LVDSA_Y0+ 4 LVDSA_Y05 LVDSA_Y1+ 6 LVDSA_Y17 LVDSA_Y2+ 8 LVDSA_Y29 LVDSA_CLK+ 10 LVDSA_CLK11 N/C 12 N/C
13 GROUND 14 GROUND
15 LVDSB_Y0+ 16 LVDSB_Y017 LVDSB_Y1+ 18 LVDSB_Y1-
Page 55
19 LVDSB_Y2+ 20 LVDSB_Y221 LVDSB_CLK+ 22 LVDSB_CLK23 N/C 24 N/C
25 GROUND 26 GROUND
27 VCC_LVDS 28 VCC_LVDS
29 VCC_LVDS 30 VCC_LVDS
Table 4-24: TFT LCD LVDS Port Connector Pinouts
4.2.23 TFT LCD TTL Connector
CN Label: CN28
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
40-pin crimp (2x20)
Figure 4-25
Table 4-25
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
Page 56
WAFER-MARK 3.5” Embedded SBC
Figure 4-25: TFT LCD TTL Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC_FP 2 VCC_FP
3 GROUND 4 GROUND
5 VCC_FP 6 VCC_FP
7 N/C 8 GROUND
9 B0 10 B1
11 B2 12 B3
13 B4 14 B5
15 B6 16 B7
17 G0 18 G1
19 G2 20 G3
21 G4 22 G5
23 G6 24 G7
25 R0 26 R1
26 R2 28 R3
29 R4 30 R5
Page 57
31 R6 32 R7
33 GROUND 34 GROUND
35 FPCLK 36 FPVS
37 FPDE 38 FPHS
39 N/C 40 ENVEE
Table 4-25: TFT LCD TTL Port Connector Pinouts
4.2.24 USB Connector (Internal)
CN Label: CN24
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
8-pin header (2x4)
Figure 4-26
Table 4-26
The 2x4 USB pin connectors each provide connectivity to two USB 1.1 ports. Each USB
connector can support two USB devices. Additional external USB ports are found on the
rear panel. The USB ports are used for I/O bus expansion.
Page 58
Figure 4-26: USB Connector Pinout Locations
WAFER-MARK 3.5” Embedded SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC 8 GROUND
2 DATA2- 7 DATA3+
3 DATA2+ 6 DATA34 GROUND 5 VCC
Table 4-26: USB Port Connector Pinouts
4.3 External Peripheral Interface Connectors
4.3.1 External Peripheral Interface Connector Overview
The WAFER-MARK external peripheral interface connectors are listed below and shown
in
Figure 4-27:
2 x RJ-45 Ethernet connectors
1 x Keyboard/Mouse connector
1 x Serial communications port
2 x USB ports
1 x VGA port
Figure 4-27: WAFER-MARK On-board External Interface Connectors
4.3.2 RJ-45 Ethernet Connector
CN Label: CN20, CN21
CN Type:
RJ-45
CN Location: See
CN Pinouts: See
Figure 4-27
Table 4-27
Page 59
WAFER-MARK 3.5” Embedded SBC
The RJ-45 Ethernet connector on the WAFER-MARK provides connectivity to a 10/100
megabits Ethernet connection between the WAFER-MARK and a Local Area Network
(LAN) through a network hub.
PIN DESCRIPTION PIN
1 TX+ 8 N/C
2 GROUND 9 ACT_LED3 TX- 10 ACT_LED+
4 RX+ 11 LINK_LED 5 GROUNG 12 LINK_LED+
6 RX- 13 GROUND
7 N/C 14 GROUND
Table 4-27: RJ-45 Ethernet Connector Pinouts
DESCRIPTION
Figure 4-28: J7 Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green
LED indicates activity on the port and the yellow LED indicates the port is linked.
ACTIVITY LED LINK LED
Status Description Status Description
GREEN
Activity
YELLOW
Table 4-28: LAN Connector LEDs
4.3.3 Keyboard/Mouse Connector (Optional)
CN Label: CN18
Page 60
ON: Linked
WAFER-MARK 3.5” Embedded SBC
CN Type:
CN Pinouts: See
PS/2
Figure 4-29 and Table 4-29
The WAFER-MARK keyboard and mouse connector is a standard PS/2 connector.
Figure 4-29: PS/2 Pinout and Configuration
PIN DESCRIPTION
1 KB DATA
2 MS DATA
3 GND
4 +5V
5 KB CLOCK
6 MS CLOCK
Table 4-29: Keyboard Connector Pinouts
4.3.4 Serial Port Connector (COM 1)
CN Label: CN22
CN Type:
CN Location: See
CN Pinouts: See
The 9-pin DB-9 COM 1 serial port connector is connected to RS-232 serial
communications devices.
DB-9 connector
Figure 4-27
Table 4-30 and Figure 4-30
Page 61
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD1 2 RXD1
3 TXD1 4 DTR1
5 GND 6 DSR1
7 RTS1 8 CTS1
9 COM_RI1
Table 4-30: RS-232 Serial Port (COM 1) Pinouts
WAFER-MARK 3.5” Embedded SBC
Figure 4-30: COM1 Pinout Locations
4.3.5 USB Combo Port
CN Label: CN19
CN Type:
CN Location: See
CN Pinouts: See
The two USB combo ports provide connectivity to USB devices. The USB ports support
USB 1.1.
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
USB Combo port
Figure 4-27
Table 4-31
Page 62
1 VCC 5 VCC
WAFER-MARK 3.5” Embedded SBC
2 DATA0- 6 DATA13 DATA0+ 7 DATA1+
4 GROUND 8 GROUND
Table 4-31: USB Connector Pinouts
4.3.6 VGA Connector
CN Label: CN26
CN Type:
CN Location: See
CN Pinouts: See
DB15
Figure 4-27
Figure 4-31 and Table 4-32
The standard 15-pin female DB15 VGA connector connects to a CRT or LCD monitor
directly.
PIN DESCRIPTION PIN DESCRIPTION PIN DESCRIPTION
1 RED 6 GROUND 11
2 GREEN 7 GROUND 12
3 BLUE 8 GROUND 13
4 NC 9 NC 14
5 GROUND 10
GROUND 15
NC
DDCDAT
HSYNC
VSYNC
DDCCLK
Table 4-32: VGA Connector Pinouts
Figure 4-31: VGA Connector
Page 63
WAFER-MARK 3.5” Embedded SBC
THIS PAGE IS INTENTIONALLY LEFT BLANK
Page 64
WAFER-MARK 3.5” Embedded SBC
Chapter
5
5 Installation
Page 65
5.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-MARK may result in permanent damage to the
WAFER-MARK and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-MARK. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the WAFER-MARK, or any other electrical component is
handled, the following anti-static precautions are strictly adhered to.
WAFER-MARK 3.5” Embedded SBC
Wear an anti-static wristband: Wearing a simple ant i-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-MARK, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-MARK.
Only handle the edges of the PCB: When handling the PCB, hold the PCB
by the edges.
Page 66
WAFER-MARK 3.5” Embedded SBC
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should be
read and understood before the WAFER-MARK is installed. All installation
notices pertaining to the installation of the WAFER-MARK should be strictly
adhered to. Failing to adhere to these precautions may lead to severe
damage of the WAFER-MARK and injury to the person installing the
motherboard.
5.2.1 Installation Notices
WARNING:
The installation instructions described in this manual should be carefully
followed in order to prevent damage to the WAFER-MARK, WAFER-MARK
components and injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o The user manual provides a complete description of the WAFER-MARK
installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-MARK on an antistatic pad:
o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-MARK off:
Page 67
o When working with the WAFER-MARK, make sure that it is disconnected
from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-MARK DO NOT:
Remove any of the stickers on the PCB board. These stickers are required for
warranty validation.
Use the product before verifying all the cables and power connectors are
properly connected.
Allow screws to come in contact with the PCB circuit, connector pins, or its
components.
5.2.2 Installation Checklist
The following checklist is provided to ensure the WAFER-MARK is properly installed.
WAFER-MARK 3.5” Embedded SBC
All the items in the packing list are present (see Chapter 4)
A compatible memory module is properly inserted into the slot (see Chapter
2)
The CF Type I or CF Type II card is properly installed into the CF socket
The jumpers have been properly configured
The WAFER-MARK is installed into a chassis with a dequate ventilation
The correct power supply is being used
The following devices are properly connected
o Audio cable
o Power supply
o Serial port cables
o SATA drives
o Keyboard/Mouse cable
The following external peripheral devices are properly connected to the
chassis:
o LAN device
o VGA screen
Page 68
o RS-232 serial communications device
o USB devices
WAFER-MARK 3.5” Embedded SBC
5.3 SO-DIMM Installation and CF Card Installation
5.3.1 SO-DIMM Installation
WARNING:
Using an incorrectly specified SO-DIMM may cause permanent
damage to the WAFER-MARK. Please make sure the purchased
SO-DIMM complies with the memory specifications of the
WAFER-MARK. SO-DIMM specifications compliant with the
WAFER-MARK are listed in Chapter 2.
To install a SO-DIMM into a SO-DIMM socket, please follow the steps below and refer
Figure 5-1.
Figure 5-1: SO-DIMM Installation
Step 1: Locate the SO-DIMM socket. Place the WAFER-MARK on an anti-static pad
with the solder side facing up.
Step 2: Align the SO-DIMM with the socket. The SO-DIMM must be orien ted in such a
way that the notch in the middle of the SO-DIMM must be aligned with the
plastic bridge in the socket.
Page 69
Step 3: Insert the SO-DIMM. Push the SO-DIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SO-DIMM socke t arms. Gentl y pull the arms of the SO-DIMM socket
WAFER-MARK 3.5” Embedded SBC
out and push the rear of the SO-DIMM down. (See
Step 5: Secure the SO-DIMM. Release the arm s on the SO-DIMM socket. They clip into
place and secure the SO-DIMM in the socket.Step 0:
Figure 5-1)
5.3.2 CF Card Installation
NOTE:
The WAFER-MARK can support both CF Type I cards and CF Type II
cards. For the complete specifications of the supported CF cards
please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-MARK, please follow the
steps below:
Page 70
Step 1: Locate the CF card socket. Place th e W A FER-MARK on an anti-st atic p ad with
the solder side facing up. Locate the CF card.
Step 2: Align the CF card. Make sure the CF card is properl y aligned with the CF
socket.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See
Figure 5-2. Step 0:
WAFER-MARK 3.5” Embedded SBC
Figure 5-2: CF Card Installation
5.4 Jumper Settings
NOTE:
A jumper is a met al bridge t hat is used to
close an electrical circuit. It consists of
two metal pins and a small metal clip
(often protected by a plastic cover) that
slides over the pins to connect them.
To CLOSE/SHORT a jumper means
connecting the pins of the jumper with
the plastic clip and to OPEN a jumper
means removing the plastic clip from a
Jumper
jumper.
Page 71
Before the WAFER-MARK is installed in the system, the jumpers must be set in
accordance with the desired configuration. The jumpers on the WAFER-MARK are listed
in
Table 5-1.
Description Label Type
Clear CMOS JP1 2-pin header
Serial port select JP2 6-pin header
COM1/2 Pin 9 Setting (optional) JP3 5-pin header
LCD voltage select JP4 3-pin header
Table 5-1: Jumpers
5.4.1 Clear CMOS Jumper
WAFER-MARK 3.5” Embedded SBC
Jumper Label:
Jumper Type:
Jumper Settings:
Jumper Location:
If the WAFER-MARK fails to boot due to improper BIOS settings, the CMOS can be
cleared using the battery connector. Disconnect the battery from the connector for a few
seconds then reconnect the battery. The CMOS should be cleared.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
Enter the correct CMOS setting
Load Optimal Defaults
Load Failsafe Defaults.
JP1
2-pin header
Table 5-2
See
Figure 5-3
See
Page 72
After having done one of the above, save the changes and exit the CMOS Setup menu.
WAFER-MARK 3.5” Embedded SBC
The clear CMOS jumper settings are shown in Table 5-2.
Clear CMOS Description
Open Keep CMOS Setup Default
Short Clear CMOS Setup
Table 5-2: Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-3 below.
Figure 5-3: Clear CMOS Jumper
5.4.2 COM 2 Function Select Jumper
Jumper Label:
Jumper Type:
Jumper Settings:
Jumper Location:
The COM 2 Function Select jumper sets the communication protocol used by the second
serial communications port (COM 2) as RS-232, RS-422 or RS -485. The COM 2 Function
Select settings are shown in
JP2
6-pin header
Table 5-3
See
Figure 5-4
See
Table 5-3.
Page 73
COM 2 Function Select Description
Short 1-2 RS-232 Default
Short 3-4 RS-422
Short 5-6 RS-485
Table 5-3: COM 2 Function Select Jumper Settings
The COM 2 Function Select jumper location is shown in Figure 5-4.
WAFER-MARK 3.5” Embedded SBC
Figure 5-4: COM 2 Function Select Jumper Location
5.4.3 LCD Voltage Selection
WARNING:
Permanent damage to the screen and WAFER-MARK may occur if the
wrong voltage is selected with this jumper. Please refer to the user
guide that came with the monitor to select the correct voltage.
Jumper Label:
Jumper Type:
Jumper Settings:
JP4
3-pin header
Table 5-4
See
Page 74
WAFER-MARK 3.5” Embedded SBC
See
Jumper Location:
Figure 5-5
The LCD Voltage Selection jumper allows the LCD screen voltage to be set. The LCD
Voltage Selection jumper settings are shown in
LCD Voltage Select Description
Short 1-2 +3.3V LVDS Default
Short 2-3 +5V LVDS
Table 5-4.
Table 5-4: LCD Voltage Selection Jumper Settings
The LCD Voltage Selection jumper location. is shown in Figure 5-5.
Figure 5-5: LCD Voltage Selection Jumper Location
5.4.4 COM 1/2 Pin 9 Setting Jumper (Optional)
Jumper Label:
Jumper Type:
Jumper Settings:
JP3
10-pin header
Table 5-5
See
Page 75
See
Jumper Location:
Figure 5-6
WAFER-MARK 3.5” Embedded SBC
The COM 1/2 Pin 9 Setting jumper configures pin 9 on COM 1 (CN22) and COM 2 (CN16)
as either a +5V, +12V power source or as a ring-in (RI) line. The COM 1/2 Pin 9 Setting
jumper selection options are shown in
COM 1/2 RI Pin Description
Short 1 – 3 COM 1 RI Pin use +12V
Short 3 – 5 COM 1 RI Pin use +5V
Short 7 – 9 COM 1 RI Pin use RI Default
Short 2 – 4 COM 2 RI Pin use +12V
Short 4 – 6 COM 2 RI Pin use +5V
Short 8 – 10 COM 2 RI Pin use RI Default
Table 5-5.
Table 5-5: COM 1/2 Pin 9 Setting Jumper Settings
The COM 1/2 Pin 9 Setting jumper location is shown in Figure 5-6 below.
Page 76
Figure 5-6: COM 1/2 Pin 9 Setting Jumper Location
WAFER-MARK 3.5” Embedded SBC
5.5 Chassis Installation
5.5.1 Airflow
WARNING:
Airflow is critical to the cooling of the CPU and other onboard
components. The chassis in which the WAFER-MARK must have air
vents to allow cool air to move into the system and hot air to move out.
The WAFER-MARK must be installed in a chassis with ventilation holes on the sides
allowing airflow to travel through the heat sink surface. In a system with an individual
power supply unit, the cooling fan of a power supply can also help generate airflow
through the board surface.
5.5.2 Motherboard Installation
To install the WAFER-MARK motherboar d into the chassis please refer to the reference
material that came with the chassis.
5.6 Internal Peripheral Device Connections
5.6.1 Peripheral Device Cables
The cables listed in Table 5-6 are shipped with the WAFER-MARK.
Quantity Type
1 ATA 44p/44p flat cable
1 Audio cable
1 Dual port COM port cable
1 Keyboard/Mouse Y cable
2 SATA cable
Page 77
1 SATA power cable
Table 5-6: IEI Provided Cables
5.6.2 Audio Kit Installation
The Audio Kit that came with the WAFER-MARK connects to the 10-pin audio connec tor
on the WAFER-MARK. The audio kit consists of three audio jacks. One au dio jack, Mi c In,
connects to a microphone. The remaining two audio jacks, Line-In and Line-Out, connect
to two speakers. To install the audio kit, please refer to the steps below:
Step 1: Locate the audio conne ctor. The location of the 10-pin audio connector is
shown in Chapter 3.
Step 2: Align pin 1. Align pin 1 on the onboard connector with pin 1 on the audio kit
WAFER-MARK 3.5” Embedded SBC
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-7.
Figure 5-7: Audio Kit Cable Connection
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Step 3: Connect the audio dev ices. Connect one sp eaker to the line-in audio jack, one
speaker to the line-out audio jack and a microphone to the mic-in audio jack.
WAFER-MARK 3.5” Embedded SBC
Step 0:
5.6.3 ATA Flat Cable Connection
The IDE flat cable connects to the WAFER-MARK to one or two IDE devices. To connect
an IDE HDD to the WAFER-MARK please follow the instructions below.
Step 1: Locate the IDE connecto r. The location/s of the IDE device connector/s is/are
shown in Chapter 3.
Step 2: Insert the connector. Con nect the IDE cable connector to the onboard
connector. See
can only be inserted in one direction.
Figure 5-8. A key on the front of the cable connector ensures it
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Figure 5-8: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable
corresponds to pin 1 on the connectorStep 0:
5.6.4 ATX Power Connection
Follow the instructions below to connect the WAFER-MARK to an ATX power supply.
WARNING:
Disconnect the power supply power cord from its AC power source to
prevent a sudden power surge to the WAFER-MARK.
WAFER-MARK 3.5” Embedded SBC
Step 1: Connect an ATX power button switch to the power button connector (CN13)
on the motherboard.
Step 2: Locate the Power Adapter Cable. The power adapter cable is shown in the
packing list in Chapter 3.
Step 3: Connect the Power Adapter Cable to the AT Power Connector. Connect the
4-pin (1x4) Molex type power adapter cable connector to the AT power
connector (CN1) on the motherboard. See
Figure 5-9.
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