2006-11-15 1.0 Initial release (Released as WAFER-LX2_UMN_v1.0)
6.4: Four Serial Port Connector Cable
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WAFER-LX2 3.5” Embedded SBC
Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-LX2 or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-LX2. Cautions are easy to recognize. The word “caution” is written
as “CAUTION,” both capitalized and bold and is followed. The italicized text is the
cautionary message. A caution message is shown below:
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CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-LX2.
Please take caution messages seriously.
WAFER-LX2 3.5” Embedded SBC
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-LX2. Please take
note messages seriously.
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WAFER-LX2 3.5” Embedded SBC
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
Copyright
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
IBM PC is a registered trademark of International Business Machines Corporation. INTEL
is a registered trademark of INTEL Corporation. Other product names mentioned herein
are used for identification purposes only and may be trademarks and/or registered
trademarks of their respective owners.
Page v
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WAFER-LX2 3.5” Embedded SBC
Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX2 from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
The items listed below should all be included in the WAFER-LX2 package.
1 x WAFER-LX2 single board computer
1 x Audio cable
1 x IDE flat cable 44p/44p
2 x 4 COM port cable1 x Mini jumper pack
1 x Utility CD
1 x QIG (quick installation guide)
BIOS Menu 1: Award BIOS CMOS Setup Utility.......................................................82
BIOS Menu 2: Standard CMOS Features ..................................................................84
BIOS Menu 3: Advanced BIOS Features...................................................................89
BIOS Menu 4: Advanced Chipset Features..............................................................95
BIOS Menu 5: Flat Panel Configuration....................................................................98
BIOS Menu 6: Integrated Peripherals..................................................................... 101
BIOS Menu 7: IT8888 ISA Decode IO...................................................................... 105
BIOS Menu 8: IT8888 ISA Decode Memory............................................................ 107
BIOS Menu 9: Power Management Setup.............................................................. 109
BIOS Menus
BIOS Menu 10: PnP/PCI Configurations................................................................ 113
BIOS Menu 11: IRQ Resources............................................................................... 114
BIOS Menu 12: Memory Resources........................................................................ 116
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WAFER-LX2 3.5” Embedded SBC
Glossary
AC ’97 Audio Codec 97
ACPI Advanced Configuration and
Power Interface
APM Advanced Power Management
ARMD ATAPI Removable Media Device
ASKIR Shift Keyed Infrared
ATA Advanced Technology
Attachments
BIOS Basic Input/Output System
CFII Compact Flash Type 2
CMOS Complementary Metal Oxide
Semiconductor
CPU Central Processing Unit
Codec Compressor/Decompressor
COM Serial Port
DAC Digital to Analog Converter
DDR Double Data Rate
IDE Integrated Data Electronics
I/O Input/Output
ICH4 I/O Controller Hub 4
L1 Cache Level 1 Cache
L2 Cache Level 2 Cache
LCD Liquid Crystal Display
LPT Parallel Port Connector
LVDS Low Voltage Differential Signaling
MAC Media Access Controller
OS Operating System
PCI Peripheral Connect Interface
PIO Programmed Input Output
PnP Plug and Play
POST Power On Self Test
RAM Random Access Memory
SATA Serial ATA
S.M.A.R.T Self Monitoring Analysis and
DIMM Dual Inline Memory Module
DIO Digital Input/Output
DMA Direct Memory Access
EIDE Enhanced IDE
EIST Enhanced Int el SpeedStep
Technology
FFIO Flexible File Input/Output
FIFO First In/First Out
FSB Front Side Bus
IrDA Infrared Data Association
HDD Hard Disk Drive
Page xviii
Reporting Technology
SPD Serial Presence Detect
S/PDI Sony/Philips Digital Interface
SDRAM Synchronous Dynamic Random
Access Memory
SIR Serial Infrared
UART Universal Asynchronous
Receiver-transmitter
USB Universal Serial Bus
VGA Video Graphics Adapter
Page 19
WAFER-LX2 3.5” Embedded SBC
Chapter
1
1 Introduction
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Page 20
1.1 WAFER-LX2 Overview
The 3.5” WAFER-LX2 AMD Geode LX800 low power single board computer (SBC) is fully
equipped with advanced multi-mode I/Os. The WAFER-LX2 has eight serial ports and a
PC/104 for expansion and increased connectivity. The WAFER-LX2 is designed for
system manufacturers, integrators, and VARs that want performance, reliability, and
quality at a reasonable price.
1.1.1 WAFER-LX2 Applications
The WAFER-LX2 is designed for applications in the following areas:
Kiosks and Point of Sales
Restaurants
Human Machine Interface (HMI) applications
WAFER-LX2 3.5” Embedded SBC
Marine, GPS and transportation applications
Financial, retail and kiosk applications
Low power consumption (6 Watts)
Two high performance 10/100 megabit Ethernet controllers on-board
Two SATA channels with transfer rates up to 150MB/s on-board
Four USB 2.0 devices on-board
Integrated audio
1.2 WAFER-LX2 Overview
Figure 1-1: WAFER-LX2 Overview
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WAFER-LX2 3.5” Embedded SBC
Figure 1-2: WAFER-LX2 Solder Side Overview
1.2.1 WAFER-LX2 Connectors
The WAFER-LX2 has the following connectors on-board:
1 x AT power connector
1 x ATX power function connector
1 x Audio connector
1 x Battery connector
1 x Compact Flash (CF) connector (solder side)
1 x External LED connector
1 x Fan connector
1 x General purpose input/output (GPIO) connector
1 x IDE Interface connectors (44-pin)
1 x Inverter power connector
1 x Parallel port connector
Page 4
1 x PC/104 slot
1 x PC/104 power connector
1 x Reset button connector
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WAFER-LX2 3.5” Embedded SBC
2 x Serial port connectors
1 x Suspend power input connector
1 x TFT LCD LVDS interface connector
1 x TFT LCD TFT interface connector
1 x SO-DIMM socket
The WAFER-LX2 has the following connectors on the board rear panel:
1 x Ethernet connectors
2 x Dual USB connector
1 x Serial port connector
1 x VGA connector
The WAFER-LX2 has the following on-board jumpers:
COM-1 pin-9 signal select
LCD Vcc select
COM-2 function select
AT Power select
LCD clock select
1.2.2 Technical Specifications
WAFER-LX2 technical specifications are listed in Table 1-1. Detailed descriptions of each
specification can be found in Chapter 2.
Specification WAFER-LX2
Form Factor
CPU
Southbridge Chipset
Display
3.5” form factor
AMD® Geode™ LX800 500Mhz
AMD® Geode™ CS5536
CRT integrated in AMD® Geode™ LX800
TTL/LVDS
24-bit TTL or 18-bit single channel LVDS
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Supports one 1GB DDR 333/400 200-pin SO-DIMM
Memory
SDRAM module
WAFER-LX2 3.5” Embedded SBC
BIOS
SSD
Audio
LAN
COM
USB2.0
IDE
Watchdog Timer
Digital I/O
Expansion
Award BIOS
Compact Flash (CF)
AC'97 Codec Realtek ALC2 03
10/100 Base-T dual RTL8100C
Eight RS-232 or
Seven RS-232 and one RS-422/RS-485
Four USB 1.1 or USB 2.0 devices supported
One 44-pin IDE connects to two Ultra ATA33/66/100 devices
Software programmable 1-255 sec. by supper I/O
One GPIO connector
One PC/104 slot
Power Supply
Temperature
Humidity (operating)
Dimensions
Weight (GW/NW)
Table 1-1: Technical Specifications
+5V ± 5% AT/A TX power support
0ºC - 60ºC
5%~95% non-condensing
145mm x 102mm
670g/230g
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WAFER-LX2 3.5” Embedded SBC
Chapter
2
2 Detailed Specifications
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2.1 Overview
This chapter describes the specifications and on-board features of the WAFER-LX2 in
detail.
2.2 Dimensions
2.2.1 Board Dimensions
The dimensions of the board are listed below:
Length: 146.06mm
Width: 102mm
WAFER-LX2 3.5” Embedded SBC
Figure 2-1: WAFER-LX2 Dimensions (mm)
2.2.2 External Interface Panel Dimensions
External peripheral interface connector panel dimensions are shown in Figure 2-2.
The WAFER-LX2 motherboard comes with an AMD® Geode™ LX800 CPU and an AMD®
Geode™ CS5536 linked together by the GeodeLink™ Interface Unit.
the data flow between the system chipset, the CPU and other components installed on the
motherboard.
Figure 2-3 shows
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WAFER-LX2 3.5” Embedded SBC
Figure 2-3: Data Flow Block Diagram
2.4 CPU Support
The WAFER-LX2 series motherboards all come with a preinstalled AMD® Geode™ LX
800 500MHz CPU.
2.4.1 AMD® Geode™ LX 800 500MHz Overview
The specifications for the 500MHz AMD® Geode™ LX 800 are listed below
x86/x87-compatible core
Processor frequency up to 500 MHZ
64K I/64K D L1 cache and 128K L2 cache
Split I/D cache/TLB (Translation Look-Aside Buffer)
Integrated FPU that supports the Intel MMX® and AMD 3DNow!™
Technology instruction sets
9 GB/s internal GeodeLink™ Interface Unit (GLIU)
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WAFER-LX2 3.5” Embedded SBC
Security Block
o 128-bit AES (CBC/ECB)
True Random Number Generator
2.4.2 AMD® Geode™ LX 800 Memory Support
The AMD® Geode™ LX 800 supports 64-bit DDR memory modules with freq uencie s u p to
400MHz. The WAFER-LX2 has one 200-pin DDR SO-DIMM SDRAM socket that supports
one 64-bit 333 MHz or 400MHz DDR SO-DIMM memory module with a maximum ca pacity
of 1GB.
2.4.3 AMD® Geode™ LX 800 500MHz Display Support
The AMD® Geode™ LX 800 supports both CRT and TFT in a dual display mode. The
following display specifications.
The AMD® Geode™ LX 800 BitBLT/vector engine graphics processor supports pattern
generation, source expansion, pattern/source transparency, 256 ternary raster operations,
alpha blenders to support alpha- BLTs, incorporated BLT FIFOs, a GeodeLink interface
and the ability to throttle BLTs according to video timing. New features added to the
Graphics Processor include:
Command buffer interface
Hardware accelerated rotation BLTs
Color depth conversion
Paletized color
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Full 8x8 color pattern buffer
Separate base addresses for all channels
Monochrome inversion
WAFER-LX2 3.5” Embedded SBC
Table 2-1: Geode LX Graphics Features lists a complete list of Geode LX graphics
features. For more details, please refer to the AMD website or the Geode LX series data
book available from AMD.
Feature AMD Geode™ LX Processor
Color Depth 8, 16, 32 bpp (A) RGB 4 and 8-bit indexed
ROPs 256 (2-src, dest and pattern)
BLT Buffers FIFOs in Graphics Processor
BLT Splitting Managed by hardware
Video Synchronized BLT/Vector Throttle by VBLANK
Bresenham Lines Yes
Patterned (stippled) Lines Yes
Screen to Screen BLT Yes
Screen to Screen BLT with mono expansion Yes
Memory to Screen BLT Yes (throttled rep movs writes)
Accelerated Text No
Pattern Size (Mono) 8x8 pixels
Pattern Size (Color) 8x8 pixels
Monochrome Pattern Yes (with inversion)
Dithered Pattern (4 color) No
Color Pattern 8, 16, 32 bpp
Transparent Pattern Monochrome
Solid Fill Yes
Pattern Fill Yes
Transparent Source Monochrome
Color Key Source Transparency Y with mask
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Variable Source Stride Yes
Variable Destination Stride Yes
Destination Write Bursting Yes
Selectable BLT Direction Vertical and Horizontal
The power management for the 500MHz AMD® Geode™ LX 800 is listed below:
1.8W Typical (3.9W TDP) @ 500MHz
GeodeLink active hardware power management
Hardware support for standard ACPI software power management
I/O companion SUSP#/SUSPA# power controls
Lower power I/O
Wakeup on SMI/INTR
2.5 System Chipset
The WAFER-LX2 series motherboards all have a preinstalled AMD® Geode™ CS5536
system chipset. The system chipset fe atures are listed below.
82xx Legacy Devices
System Management Bus (SMB) Controller
8 Multi-Function General Purpose Timers (MFGPTs)
Power Management Controller
ACPI v2.0 compliant
2.5.1 GeodeLink™ Interface Unit
o 64-bit, 66MHz operation
o PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
o Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
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2.5.2 AMD® Geode™ CS5536 ATA-6 Controller
The single WAFER-LX2 IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra
ATA/100) compliant IDE controller on the AMD
transfer rate of 100MB/s. ATA-6 includes advancements in error checking and ATA-6
drives are compatible with future interface additions.
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s
Ultra A T A/66, with data transfer rates up to 66MB/s
Ultra A T A/33, with data transfer rates up to 33MB/s
The AC’97 specification v2.3 compliant controller on the chipset is interfaced to a 20-bit
DAC and 18-bit ADC full-duplex AC'97 2.3 stereo RealTek ALC203 codec. The ALC203 is
Page 14
then connected to a 10-pin audio connector to which an audio kit can easily be conne cted.
The codec meets performance requirements for audio on PC99/2001 systems. Some of
the codec features are listed below.
Meets Microsoft WHQL/WLP 2.0 audio requirements
20-bit DAC and 18-bit ADC resolution
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WAFER-LX2 3.5” Embedded SBC
18-bit Stereo full-duplex CODEC with independent and variable sampling rate
Complies with AC'97 2.3 specifications
o LINE/HP-OUT, MIC-IN and LINE-IN sensing
o 14.318MHz -> 24.576MHz PLL saves crystal
o 12.288MHz BITCLK input can be consumed
o Integrated PCBEEP generator to save buzzer
o Interrupt capability
o Page registers and Analog Plug & Play
Support of S/PDIF out is fully compliant with AC'97 rev2.3 specifications
Three analog line-level stereo inputs with 5-bit volume control: LINE_IN, CD,
AUX
High quality differential CD input
Two analog line-level mono input: PCBEEP, PHONE-IN
Supports double sampling rate (96KHz) of DVD audio playback
Two software selectable MIC inputs
+6/12/20/30dB boost preamplifier for MIC input
Stereo output with 6-bit volume control
Mono output with 5-bit volume control
Headphone output with 50mW/20Ohm amplifier
3D Stereo Enhanceme nt
Multiple CODEC extension capability
External Amplifier Power Down (EAPD) capability
Power management and enhanced power saving features
Stereo MIC record for AEC/BF application
DC Voltage volume control
Auxiliary power to support Power Off CD
Adjustable VREFOUT control
2 GPIO pins with smart GPIO volume control
2 Universal Audio Jacks (UAJ)® for front panel
Supports 32K/44.1K/48K/96KHz S/PDIF output
Supports 32K/44.1K/48KHz S/PDIF input
Power support: Digital: 3.3V; Analog: 3.3V/5V
Standard 48-Pin LQFP Package
EAX™ 1.0 & 2.0 compatible
Direct Sound 3D™ compatible
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A3D™ compatible
I3DL2 compatible
HRTF 3D Positional Audio
Sensaura™ 3D Enhancement (optional)
10 Bands of Software Equalizer
Voice Can cellation and Key Shifting in Kareoke mode
AVRack® Media Player
2.5.4 AMD® Geode™ CS5536 Flash Interface
The WAFER-LX2 CompactFlash socket supports standard CF Type I and CF Type II
cards. The chipset flash interface is multiplexed with an IDE interface and can be
connected to an array of industry standard NAND Flash or NOR Flash devices.
2.5.5 AMD® Geode™ CS5536 USB Controller
WAFER-LX2 3.5” Embedded SBC
Four external USB ports on the WAFER-LX2 board are interfaced to the chipset USB
controller. Four USB 1.1 or USB 2.0 devices can be connected simultaneously to the
WAFER-LX2. The chipset USB controller has the following specifications:
o 4 USB ports
o USB 1.1 and USB 2.0 compliant
o 3 host ports
o 1 host/device
2.5.6 AMD® Geode™ CS5536 Serial Communications
Eight high-speed UART serial port connectors, seven RS-232 and one that can be
configured as RS-232, RS-422 or RS-485, are connected to the system chipset low pin
count (LPC) port via the LPC bus. The specifications for the serial ports are listed below.
The system chipset has a battery backed up 256-byte real-time clock (RTC) with CMOS
RAM.
2.5.8 BIOS
The BIOS flash memory chip on the WAFER-LX2 has a licensed copy of AWARD BIOS
loaded onto it. The BIOS flash memory chip is connected to the chipset via the LPC bus.
The flash BIOS features are listed below:
SMIBIOS (DMI) compliant
Console redirection function support
PXE (Pre-Boot Execution Environment) support
USB booting support
2.6 GeodeLink™ PCI Bridge
2.6.1 Overview
The GeodeLink™ PCI Bridge (GLPCI) module provides a PCI interface for GeodeLink
Interface Unit-based designs. The GLPCI module is composed of six major blocks:
The GeodeLink and PCI Bus Interface blocks provide adaptation to the respective buses.
The Transaction Forwarding block provides bridging logic. Some of the features of the
GeodeLink™ PCI Bridge are listed below:
PCI Version 2.2 compliance
32-bit, 66 MHz PCI bus operation
Target support for fast back-to-back transactions
Arbiter support for three external PCI bus masters
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Write gathering and write posting for in-bound write requests
Virtual PCI header support
Delayed transactions for in-bound read requests
Zero wait state operation within a PCI burst
Dynamic clock stop/start support for GLIU and PCI clock domains (this is not
CLKRUN support)
Capable of handling out of bound transactions immediately after reset
2.6.2 10/100M Ethernet
A highly integrated and cost-effective single-chip, fast RealTek RTL8100C 10/100M
Ethernet controller is interfaced through first the PCI bus and then through the
GeodeLink™ PCI Bridge to the CPU and system chipset. The RealTek RTL8100C
controller provides 10Mbps or 100Mbps Ethernet connectivity to the WAFER-LX2. Some
of the features of the RealTek RTL8100C are listed below.
WAFER-LX2 3.5” Embedded SBC
10Mbps and 100Mbps operation
Supports 10Mbps and 100Mbps N-way auto-negotiation
Supports 25MHz Crystal or 25MHz OSC as the internal clock source
Complies with PC99/PC2001 standards
Supports ACPI power management
Provides PCI bus master data transfer
Provides PCI memory space or I/O space mapped data transfer
Supports PCI clock speed of 16.75MHz-40MHz
Advanced power saving mode
Supports Wa ke-on-LAN and remote wake-up (AMD Magic Packet™, Link
Change, and Microsoft® Wake -up frame)
Half/Full duplex capability
Supports Full Duplex Flow Control (IEEE 802.3x)
Provides interface to 93C46 EEPROM to store resource configuration and ID
parameters
Provides PCI clock run pin
Provides LED pins for network operation status indication
Page 18
2.5/3.3V power supply with 5V tolerant I/Os
Page 37
WAFER-LX2 3.5” Embedded SBC
2.6.3 PCI to ISA Bridge
An ITE IT8888G PCI to ISA bridge single function device connects the onboard
WAFER-LX2 ISA bus PC/104 connector and the GPIO connector to the GeodeLink™ PCI
bridge. The IT8888G has a PCI specification v2.1 compliant 32-bit PCI bus interface and
supports both PCI Bus master and slave. The PCI interface supports both programmable
positive and full subtractive decoding schemes. Some of the features of the IT8888G PCI
to ISA bridge are listed below.
PCI Interface
Programmable PCI Address Decoders
PC/PCI DMA Controller
Distributed DMA Controller
ISA Interface
SM Bus
1 analog line-level mono output: MONO_OUT
Power-on Serial Bus Configuration
Serial IRQ
Versatile power-on strapping options
Supports NOGO function
Single 33 MHz Clock Input
+3.3V PCI I/F with +5V tolerant I/O buffers
+5V ISA I/F and core Power Supply
2.7 Environmental and Power Specifications
2.7.1 System Monitoring
The WAFER-LX2 is capable of self-monitoring various aspects of its operating status
including:
CPU, chipset, and battery voltage, +3.3V, +5V, and +12V
RPM of cooling fans
CPU and board temperatures (by the corresponding embedded sensors)
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WAFER-LX2 3.5” Embedded SBC
2.7.2 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-LX2 are listed below.
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the northbridge and southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.7.3 Power Consumption
Table 2-3 shows the power consumption parameters for the WAFER-LX2 when an AMD
Geode LX 800 processor is running with one 512MB DDR333 memory module.
VoltageCurrent
+5V 1.33A
Table 2-3: Power Consumption
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WAFER-LX2 3.5” Embedded SBC
Chapter
3
3 Unpacking
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3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-LX2 may result in permanent damage to the WAFER-LX2 and
severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX2. Dry climates are especially susceptible to ESD. It is therefore
critical that whenever the WAFER-LX2, or any other electrical component is handled, the
following anti-static precautions are strictly adhered to.
WAFER-LX2 3.5” Embedded SBC
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-LX2, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-LX2.
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
3.2 Unpacking
3.2.1 Unpacking Precautions
When the WAFER-LX2 is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 3.1.
Page 22
Make sure the packing box is facing upward s so the W A FER-LX2 does not fall
out of the box.
Make sure all the components shown in Section 3.3 are present.
Page 41
WAFER-LX2 3.5” Embedded SBC
3.3 Unpacking Checklist
NOTE:
If some of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX2 from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to
sales@iei.com.tw.
3.3.1 Package Contents
The WAFER-LX2 is shipped with the following components:
Quantity Item Image
1 WAFER-LX2
1 Audio Cable
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1 IDE cable
2 4 COM Port Cable
WAFER-LX2 3.5” Embedded SBC
1 mini jumper Pack
1 Quick Installation Guide
1 Utility CD
Table 3-1: Package List Contents
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WAFER-LX2 3.5” Embedded SBC
Chapter
4
4 Connector Pinouts
Page 25
Page 44
4.1 Peripheral Interface Connectors
Section 4.1.2 shows peripheral interface connector locations. Section 4.1.2 lists all the
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-LX2. Detailed
descriptions of these connectors can be found below.
Connector Type Label
AT power connector 4-pin header CN17
ATX enable connector 3-pin header CN16
Power button connector 2-pin header CN19
Audio connector 10-pin header CN15
Battery connector 2-pin header CN22
Compact Flash (CF) connector 50-pin header CN24
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GPIO connector 10-pin header CN14
IDE Interface connector 44-pin header CN13
Inverter power connector 5-pin header CN18
LED connector 6-pin header CN21
PC/104 power input connector 3-pin header CN10
PC/104 slot 104-pin slot CN12
Reset button connector 2-pin header CN20
Serial port connector (COM 2 – COM 4) 40-pin header CN9
Serial port connector (COM 5 – COM 8) 40-pin header CN11
TFTLCD LVDS connector 20-pin header CN2
WAFER-LX2 3.5” Embedded SBC
TFT LCD TTL connector 40-pin header CN4
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-LX2. Detailed descriptions of
these connectors can be found in Section
Connector Type Label
Ethernet connector RJ-45 CN5
RS-232 serial port connector 9-pin male CN3
USB port USB port CN7
USB port USB port CN8
VGA port connector 15-pin female CN1
4.3 on page 54.
Page 28
Table 4-2: Rear Panel Connectors
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WAFER-LX2 3.5” Embedded SBC
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of
all the internal, peripheral connectors on the WAFER-LX2.
4.2.1 AT Power Connector
CN Label: CN17
CN Type:
CN Location: See
CN Pinouts: See
The 4-pin AT power connector is connected to an AT power supply.
4-pin AT power connector (1x4)
Figure 4-3
Table 4-3
Figure 4-3: AT Power Connector Location
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PIN NO. DESCRIPTION
1 +5V
2 GND
3 GND
4 +12V
Table 4-3: AT Power Connector Pinouts
4.2.2 ATX Power Supply Enable Connector
CN Label: CN16
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
3-pin wafer (1x3)
Figure 4-4
Table 4-4
The ATX power supply enable connector enables the WAFER-LX2 to be connected to an
ATX power supply. In default mode, the WAFER-LX2 can only us an AT power supply. To
enable an ATX power supply the AT Power Select jumper must also be configured. Please
refer to Chapter 3 for more details.
Page 30
Figure 4-4: ATX Power Supply Enable Connector Location
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 +5VSB
2 NC
3 PSON#
Table 4-4: ATX Power Supply Enable Connector Pinouts
4.2.3 Audio Connector (10-pin)
CN Label: CN15
CN Type:
CN Location: See
CN Pinouts: See
10-pin header
Figure 4-5
Table 4-5
The 10-pin audio connector is connected to external audio devices including speakers an
microphones for the input and output of audio signals to and from the system.
Figure 4-5: Audio Connector Pinouts (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Line out R 2 Line in R
3 GND 4 GND
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5 Line out L 6 Line in L
7 GND 8 GND
9 MIC in 10 NC
Table 4-5: Audio Connector Pinouts (10-pin)
4.2.4 Backlight Inverter Connector
CN Label: CN18
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
5-pin wafer (1x5)
Figure 4-6
Table 4-6
The backlight inverter connector provides the backlight on the LCD display connected to
the WAFER-LX2 with +12V of power.
One 44-pin IDE device connector on the WAFER-LX2 supports connectivity to two hard
CN13
44-pin header (2x22)
Figure 4-10
See
Table 4-10
See
disk drives.
Page 37
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WAFER-LX2 3.5” Embedded SBC
Page 38
Figure 4-10: Secondary IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8
5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
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WAFER-LX2 3.5” Embedded SBC
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12
13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14
17 DATA 0 18 DATA 15
19 GROUND 20 N/C
21 IDE DRQ 22 GROUND
23 IOW# 24 GROUND
25 IOR# 26 GROUND
27 IDE CHRDY 28 GROUND
29 IDE DACK 30 GROUND–DEFAULT
31 INTERRUPT 32 N/C
33 SA1 34 N/C
35 SA0 36 SA2
37 HDC CS0# 38 HDC CS1#
39 HDD ACTIVE# 40 GROUND
41 VCC 42 VCC
43 GROUND 44 N/C
Table 4-10: Secondary IDE Connector Pinouts
4.2.9 LED Connector
CN Label: CN21
CN Type:
CN Location: See
CN Pinouts: See
The LED connector connects to an HDD indicator LED and a power LED on the system
chassis to inform the user about HDD activity and the power on/off status of the system.
6-pin wafer (1x6)
Figure 4-11
Table 4-11
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WAFER-LX2 3.5” Embedded SBC
Figure 4-11: LED Connector Locations
PIN NO. DESCRIPTION
1 +5V
2 GND
3 Power LED+
4 Power LED5 HDD LED+
6 HDD LED-
Table 4-11: LED Connector Pinouts
4.2.10 PC/104 Slot
CN Label: CN10
Page 40
CN Type:
104-pin PC/104 slot
CN Location: See
Figure 4-12
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WAFER-LX2 3.5” Embedded SBC
CN Pinouts: See Table 4-12
The PC/104 slot enables a PC/104 compatible expansion module to be connected to the
board.
The PC/104 power input connector provides power to the PC/104 expansion module
installed on the PC/104 slot.
3-pin wafer (1x3)
Figure 4-13
Table 4-13
Page 44
Figure 4-13: PC/104 Power Input Connector Pinouts
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 -5V
2 GND
3 -12V
Table 4-13: PC/104 Power Input Connector Pinouts
4.2.12 Power Button Connector
CN Label: CN19
CN Type:
CN Location: See
CN Pinouts: See
2-pin wafer (1x2)
Figure 4-14
Table 4-14
The power button connector is connected to a power switch on the system chassis to
enable users to turn the system on and off.
Figure 4-14: Power Button Connector Location
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PIN NO. DESCRIPTION
1 Power Switch
2 GND
Table 4-14: Power Button Connector Pinouts
4.2.13 Reset Button Connector
CN Label: CN20
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e
users to reboot the system when the system is turned on.
2-pin wafer (1x2)
Figure 4-15
Table 4-15
Page 46
Figure 4-15: Reset Button Connector Locations
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 Reset Switch
2 GND
Table 4-15: Reset Button Connector Pinouts
4.2.14 Serial Port Connector (COM 2, COM 3 and COM 4)
CN Label: CN9
CN Type:
CN Location: See
CN Pinouts: See
40-pin header (2x20)
Figure 4-16
Table 4-16
The 40-pin serial port connector contains the following three serial ports, COM 2, COM 3
and COM 4. COM 3 and COM 4 are RS-232 serial communications channels. COM 2 is a
multi function channel. In default mode COM 2 is an RS-232 serial communication
channel but, with the COM 2 function select jumper, can be configured as either an
RS-422 or RS-485 serial communications channel. The serial port locations are specified
below.
COM 2 is located on pin 1 to pin 20
COM 3 is located on pin 21 to pin 30
COM 4 is located on pin 31 to pin 40
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WAFER-LX2 3.5” Embedded SBC
Figure 4-16: COM 2 to COM 4 Connector Pinout Locations
4.2.15 Serial Port Connector (COM 5, COM 6, COM 7 and COM 8)
CN Label: CN11
CN Type:
CN Location: See
CN Pinouts: See
40-pin header (2x20)
Figure 4-16
Table 4-16
The 40-pin serial port connector contains the following four serial ports, COM 5, COM 6,
COM 7 and COM 8. All four serial ports are RS-232 serial communications channels. The
serial port locations are specified below.
COM 5 is located on pin 1 to pin 10
COM 6 is located on pin 11 to pin 20
COM 7 is located on pin 21 to pin 30
COM 8 is located on pin 31 to pin 40
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WAFER-LX2 3.5” Embedded SBC
Figure 4-17: COM 5 to COM 8 Connector Pinout Locations
The RJ-45 Ethernet connector on the WAFER-LX2 provides connectivity to a 10/100
megabit Ethernet connection between the WAFER-LX2 and a Local Area Network (LAN)
through a network hub.
PIN NO. DESCRIPTION
1 TX+
2 N/C
3 TX-
4 RX+
5 N/C
6 RX7 N/C
8 N/C
Table 4-20: RJ-45 Ethernet Connector Pinouts
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WAFER-LX2 3.5” Embedded SBC
Figure 4-21: J7 Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green
LED indicates activity on the port and the yellow LED indicates the port is linked.
SPEED LED LINK LED
Status Description Status Description
GREEN
Table 4-21: J7 Connector LEDs
ON: 100MB
OFF: 10MB
YELLOW
ON: Linked
Flashing: Activity
4.3.3 Serial Port Connector (COM 1)
CN Label: CN3
CN Type:
CN Location: See
CN Pinouts: See
The 9-pin DB-9 COM 1 serial port connector is connected to RS-232 serial
communications devices.
The two USB combo ports provide connectivity to USB devices. The USB port support
both USB 1.1 and USB 2.0.
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC_USB 2 DATA13 DATA1+ 4 GND
USB Combo port
Figure 4-20
Table 4-23
5 VCC_USB 6 DATA2-
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7 DATA2+ 8 GND
Table 4-23: USB Connector Pinouts
4.3.5 VGA Connector
CN Label: CN1
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
The standard 15-pin female DB15 VGA connector connects to a CRT or LCD monitor
directly.
PIN DESCRIPTION PINDESCRIPTIONPINDESCRIPTION
1 RED 6 GROUND 11 NC
2 GREEN 7 GROUND 12 DDCDAT
3 BLUE 8 GROUND 13 HSYNC
4 NC 9 NC 14 VSYNC
5 GROUND 10 GROUND 15 DDCCLK
Table 4-24: VGA Connector Pinouts
DB15
Figure 4-20
Figure 4-23 and Table 4-24
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Figure 4-23: VGA Connector
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WAFER-LX2 3.5” Embedded SBC
Chapter
5
5 Installation
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5.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-LX2 may result in permanent damage to the WAFER-LX2 and
severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX2. Dry climates are especially susceptible to ESD. It is therefore
critical that whenever the WAFER-LX2, or any other electrical component is handled, the
following anti-static precautions are strictly adhered to.
WAFER-LX2 3.5” Embedded SBC
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-LX2, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-LX2.
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
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WAFER-LX2 3.5” Embedded SBC
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should
be read and understood before the WAFER-LX2 is installed. All
installation notices pertaining to the installation of the WAFER-LX2
should be strictly adhered to. Failing to adhere to these precautions
may lead to severe damage of the WAFER-LX2 and injury to the
person installing the motherboard.
5.2.1 Installation Notices
WARNING:
The installation instructions described in this manual should be carefully
followed in order to prevent damage to the WAFER-LX2, WAFER-LX2
components and injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o The user manual provides a complete description of the WAFER-LX2
installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-LX2 on an antistatic pad:
o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-LX2 off:
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o When working with the WAFER-LX2, make sure that it is disconnected
from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-LX2 DO NOT:
Remove any of the stickers on the PCB board. These stickers are required for
warranty validation.
Use the product before verifying all the cables and power connectors are
properly connected.
Allow screws to come in contact with the PCB circuit, connector pins, or its
components.
5.2.2 Installation Checklist
The following checklist is provided to ensure the WAFER-LX2 is properly installed.
WAFER-LX2 3.5” Embedded SBC
All the items in the packing list are present (see Chapter 4)
A compatible memory module is properly inserted into the slot (see Chapter
2)
The CF Type I or CF Type II card is properly installed into the CF socket
The jumpers have been properly configured
The WAFER-LX2 is installed into a chassis with adequate ventilation
The correct power supply is being used
The following devices are properly connected
o Audio kit
o Power supply
o Serial port cables
The following external peripheral devices are properly connected to the
chassis:
o VGA screen
o RS-232 serial communications device
o USB devices
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WAFER-LX2 3.5” Embedded SBC
5.3 SODIMM Installation and CF Card Installation
5.3.1 SODIMM Installation
WARNING:
Using an incorrectly specified SODIMM may cause permanent damage
to the WAFER-LX2. Please make sure the purchased SODIMM
complies with the memory specifications of the WAFER-LX2. SODIMM
specifications compliant with the WAFER-LX2 are listed in Chapter 2.
To install a SODIMM into a SODIMM socket, please follow the steps below and refer
Figure 5-1.
Figure 5-1: SODIMM Installation
Step 1: Locate the SODIMM socket. Place the WAFER-LX2 on an anti-static pad with
the solder side facing up.
Step 2: Align the SODIMM with the socket. The SODIMM must be oriented in such a
way that the notch in the middle of the SODIMM must be aligned with the plastic
bridge in the socket.
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Step 3: Insert the SODIMM. Push the SODIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SODIMM socket arms. Gently pull the arms of the SODIMM socket
WAFER-LX2 3.5” Embedded SBC
out and push the rear of the SODIMM down. (See
Step 5: Secure the SODIMM. Release the arms on the SODIMM socket. They clip into
place and secure the SODIMM in the socket.Step 0:
Figure 5-1)
5.3.2 CF Card Installation
Note:
The WAFER-LX2 can support both CF Type I cards and CF Type II
cards. For the complete specifications of the supported CF cards
please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-LX2, please follow the steps
below:
Page 64
Step 1: Locate the CF card socket. Place the WAFER-LX2 on an anti-static pad with
the solder side facing up. Locate the CF card.
Step 2: Align the CF card. Make sure the CF card is properly aligned with the CF
socket.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See
Figure 5-2. Step 0:
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WAFER-LX2 3.5” Embedded SBC
Figure 5-2: CF Card Installation
5.4 Jumper Settings
NOTE:
A jumper is a met al bridge t hat is used to
close an electrical circuit. It consists of
two metal pins and a small metal clip
(often protected by a plastic cover) that
slides over the pins to connect them.
To CLOSE/SHORT a jumper means
connecting the pins of the jumper with
the plastic clip and to OPEN a jumper
means removing the plastic clip from a
Jumper
jumper.
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Before the WAFER-LX2 is installed in the system, the jumpers must be set in accordance
WAFER-LX2 3.5” Embedded SBC
with the desired configuration. The jumpers on the WAFER-LX2 are listed in
Description Label Type
AT power select JP4 2-pin header
COM 1 Pin 9 setting JP1 5-pin header
COM 2 function select JP3 5-pin header
LCD voltage select JP2 3-pin header
LCD clock select JP5 3-pin header
Table 5-1: Jumpers
5.4.1 AT Power Select Jumper Settings
Jumper Label: JP4
Table 5-1.
Jumper Type:
Jumper Settings: See
Jumper Location: See
The AT Power Select jumper specifies the systems power mode as AT or ATX. AT Power
Select jumper settings are shown in
connected to an ATX power supply, the system will automatically turn on.
AT Power Select Description
Short Use AT power Default
Open Use ATX power
Table 5-2: AT Power Select Jumper Settings
The location of the AT Power Select jumper is shown in Figure 5-3 below.
2-pin header
Table 5-2
Figure 5-3
Table 5-2. If the AT power is used and the system is
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WAFER-LX2 3.5” Embedded SBC
Figure 5-3: AT Power Select Jumper Location
5.4.2 Clear CMOS Jumper
Jumper Label: CN22
Jumper Type:
Jumper Settings: See
Jumper Location: See
If the WAFER-LX2 fails to boot due to improper BIOS settings, the CMOS can be cleared
using the battery connector. Disconnect the battery from the connector for a few seconds
then reconnect the battery. The CMOS should be cleared.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
2-pin header
Table 5-3
Figure 5-4
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
Enter the correct CMOS setting
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Load Optimal Defaults
Load Failsafe Defaults.
After having done one of the above, save the changes and exit the CMOS Setup menu.
WAFER-LX2 3.5” Embedded SBC
The clear CMOS jumper settings are shown in
AT Power Select Description
Short Keep CMOS Setup Default
Open Clear CMOS Setup
Table 5-3: CN22 Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-4 below.
Table 5-3.
Figure 5-4: CN22 Clear CMOS Jumper
5.4.3 COM 1 Pin 9 Setting Jumper
Jumper Label: JP1
5-pin header
Page 68
Jumper Type:
Jumper Settings: See
Jumper Location: See
Table 5-4
Figure 5-5
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WAFER-LX2 3.5” Embedded SBC
The COM 1 Pin 9 Setting jumper configures pin 9 on COM 1 as either a +5V, +12V power
source or as a ring-in (RI) line. The COM 1 Pin 9 Setting jumper selection options are
shown in
Table 5-4.
COM 1 RI Pin Description
Short 1 – 2 COM 1 RI Pin use RI Default
Short 2 – 3 COM 1 RI Pin use +5V
Short 3 – 4 COM 1 RI Pin use +5V
Short 4 – 5 COM 2 RI Pin use +12V
Table 5-4: COM 1 Pin 9 Setting Jumper Settings
The COM 1 Pin 9 Setting jumper location is shown in Figure 5-5 below.
Figure 5-5: COM 1 Pin 9 Setting Jumper Location
5.4.4 COM 2 Function Select Jumper
Jumper Label: JP3
Jumper Type:
3-pin header
Jumper Settings: See
Jumper Location: See
Table 5-7
Figure 5-8
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The COM 2 Function Select jumper sets the communication protocol used by the second
serial communications port (COM 2) as RS-232, RS-422 or RS -485. The COM 2 Function
WAFER-LX2 3.5” Embedded SBC
Select settings are shown in
COM 2 Function Select Description
Short 1-2 RS-232 Default
Short 2-3 RS-422
Short 3-4 RS-422
Short 4-5 RS-485
Table 5-5: COM 2 Function Select Jumper Settings
The COM 2 Function Select jumper location is shown in Figure 5-8.
Table 5-7.
Figure 5-6: COM 2 Function Select Jumper Location
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WAFER-LX2 3.5” Embedded SBC
5.4.5 LCD Voltage Selection
WARNING:
Permanent damage to the screen and WAFER-LX2 may occur if the
wrong voltage is selected with this jumper. Please refer to the user
guide that came with the monitor to select the correct voltage.
Jumper Label: JP2
Jumper Type:
Jumper Settings: See
Jumper Location: See
The LCD Voltage Selection jumper allows the LCD screen voltage to be set. The LCD
Voltage Selection jumper settings are shown in
AT Power Select Description
Short 1-2 +3.3V LVDS Default
Short 2-3 +5V LVDS
Table 5-6: LCD Voltage Selection Jumper Settings
The LCD Voltage Selection jumper location. is shown in Figure 5-7.
3-pin header
Table 5-6
Figure 5-7
Table 5-6.
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WAFER-LX2 3.5” Embedded SBC
Figure 5-7: LCD Voltage Selection Jumper Location
5.4.6 LCD Clock Select Jumper
Jumper Label: JP5
Jumper Type:
Jumper Settings: See
Jumper Location: See
The LCD Clock Select jumper enables the LCD clock to be inverted. The LCD Clock
Select settings are shown in
LCD Clock Select Description
Short 1-2 Normal LCD Clock Default
3-pin header
Table 5-7
Figure 5-8
Table 5-7.
Page 72
Short 2-3 Inverted LCD Clock
Table 5-7: LCD Clock Select Jumper Settings
The LCD Clock Select jumper location is shown in Figure 5-8.
Airflow is critical to the cooling of the CPU and other onboard
components. The chassis in which the WAFER-LX2 must have air
vents to allow cool air to move into the system and hot air to move out.
The WAFER-LX2 must be installed in a chassis with ventilation holes on the sides
allowing airflow to travel through the heat sink surface. In a system with an individual
power supply unit, the cooling fan of a power supply can also help generate airflow
through the board surface.
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WAFER-LX2 3.5” Embedded SBC
5.5.2 Motherboard Installation
To install the WAFER-LX2 motherboard into the chassis please refer to the reference
material that came with the chassis.
5.6 Internal Peripheral Device Connections
5.6.1 Peripheral Device Cables
The cables listed in Table 5-8 are shipped with the WAFER-LX2.
Quantity Type
1 ATA 66/100 flat cable
1 Audio cable
2 Four COM port cable
Table 5-8: IEI Provided Cables
5.6.2 ATA Flat Cable Connection
The ATA 66/100 flat cable connects to the WAFER-LX2 to one or two IDE devices. To
connect an IDE HDD to the WAFER-LX2 please follow the instructions below.
Step 1: Locate the IDE connector. The location/s of the IDE device connector/s is/are
shown in Chapter 3..
Step 2: Insert the connector. Connect the IDE cable connector to the onboard
connector. See
can only be inserted in one direction.
Figure 5-9. A key on the front of the cable connector ensures it
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WAFER-LX2 3.5” Embedded SBC
Figure 5-9: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable
corresponds to pin 1 on the connectorStep 0:
5.6.3 Audio Kit Installation
The Audio Kit that came with the WAFER-LX2 connects to the 10-pin audio connector on
the WAFER-LX2. The audio kit consists of three audio jacks. One audio jack, Mic In,
connects to a microphone. The remaining two audio jacks, Line-In and Line-Out, connect
to two speakers. To install the audio kit, please refer to the steps below:
Step 1: Locate the audio connector. The location of the 10-pin audio connector is
shown in Chapter 3.
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Step 2: Align pin 1. Align pin 1 on the onboard connector with pin 1 on the audio kit
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-10.
WAFER-LX2 3.5” Embedded SBC
Figure 5-10: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable
corresponds to pin 1 on the connectorStep 0:
5.6.4 Four Serial Port Connector Cable
The WAFER-LX2 is shipped with two four serial port connector cables. The four serial port
connector cable connects four serial port connectors on the cable to the 40 pin serial port
connectors on the WAFER-LX2. To connect the four serial port connector cable please
follow the steps below.
Step 1: Locate the serial port connector. The location of the 40-pin serial port
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WAFER-LX2 3.5” Embedded SBC
connector is shown in Chapter 3.
Step 2: Align the connectors. Correctly align pin 1 on the cable connector with pin 1 on
the WAFER-LX2 serial port COM connector. See
Step 3: Insert the cable connectors. Once the cable connector is properly aligned with
the serial port COM connector on the WAFER-LX2, conne ct the cable connector
to the onboard connectors. See
Figure 5-11.
Figure 5-11.
Figure 5-11: Four Serial Port Connector Cable Connection
Step 4: Attach DB-9 serial port connectors to the chassis. The four DB-9 serial port
connectors can be inserted into four preformed holes in the chassis. Once,
inserted the DB-9 connectors should be secured to the chassis with the
retention screws.Step 0:
5.7 External Peripheral Interface Connection
The following external peripheral devices can be connected to the external peripheral
interface connectors.
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Serial port devices
USB devices
VGA monitors
RJ-45 Ethernet cable connectors
WAFER-LX2 3.5” Embedded SBC
To install these devices, connect the corresponding cable connector from the actual
device to the corresponding WAFER-LX2 external peripheral interface connector making
sure the pins are properly aligned.
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WAFER-LX2 3.5” Embedded SBC
Chapter
6
6 AWARD BIOS
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6.1 Introduction
A licensed copy of Phoenix Award BIOS is preprogrammed into the ROM BIOS. The BIOS
setup program allows users to modify the basic system configuration. This chapter
describes how to access the BIOS setup program and the configuration options that may
be changed.
6.1.1 Starting Setup
The Phoenix Award BIOS is activated when the computer is turned on. The setup program
can be activated in one of two ways.
WAFER-LX2 3.5” Embedded SBC
1. Press the D
2. Press the D
appears on the screen.
If the message disappears, restart the computer and try again.
ELETE key as soon as the system is turned on or
ELETE key when the “Press Del to enter SETUP” message
6.1.2 Using Setup
Use the arrow keys to highlight items, press ENTER to select, use the PAGEUP and
P
AGEDOWN keys to change entries, press F1 for help and press ESC to quit. Navigation
keys are shown below.
Key Function
Up arrow Move to the item above
Down arrow Move to the item below
Left arrow Move to the item on the left hand side
Right arrow Move to the item on the right hand side
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+/Page up Increase the numeric value or make changes
-/Page down Decrease the numeric value or make changes
Esc Main Menu – Quit and do not save changes into CMOS
Status Page Setup Menu and Option Page Setup Menu -Exit current page and return to Main Menu
F1 General help, only for Status Page Setup Menu and Option
Page Setup Menu
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WAFER-LX2 3.5” Embedded SBC
F2 Item help
F5 Previous values for the page menu items
F6 Fail-safe defaults for the current page menu items
F7 Optimized default s for the current page menu items
F9 Menu in BIOS
F10 Save changes and Exit BIOS
Table 6-1: BIOS Navigation Keys
6.1.3 Getting Help
When F1 is pressed a small help window describing the appropriate keys to use and the
possible selections for the highlighted item appears. To exit the Help Window press E
the F1 key again.
SC or
6.1.4 Unable to Reboot After Configuration Changes
If the system cannot be booted after changes are made, restore the CMOS defaults. The
CPU card should come with a restore CMOS settings jumper. Refer to Section ?? for
more information.
6.1.5 Main BIOS Menu
Once the BIOS opens, the main menu (BIOS Menu 1) appears.
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BIOS Menu 1: Award BIOS CMOS Setup Utility
WAFER-LX2 3.5” Embedded SBC
NOTE:
The following sections will completely describe the menus listed below
and the configuration options available to users.
The following menu options are seen in BIOS Menu 1.
Standard CMOS Features: Changes the basic system configuration.
Advanced BIOS Features: Changes the advanced system settings.
Advanced Chipset Features: Changes the chip set configuration features.
Integrated Peripherals: Changes the settings for integrated peripherals.
Power Management Setup: Configures power saving options.
PnP/PCI Configurations: Changes the advanced PCI/PnP settings.
Page 82
The following user configurable options are also available in
BIOS Menu 1:
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