IEI WAFER-LX2 User Manual

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WAFER-LX2 3.5” Embedded SBC
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Revision
Date Version Changes
2007-08-15 1.01 Released as WAFER-LX2_UMN_v1.101
Corrected Section 5. installation
Added “Appendix G: HAZARDOUS MATERIALS DISCLOSURE”
2006-11-15 1.0 Initial release (Released as WAFER-LX2_UMN_v1.0)
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WAFER-LX2 3.5” Embedded SBC

Manual Conventions

WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result in personal injury. Warnings should be taken seriously. Warnings are easy to recognize. The word “warning” is written as “WARNING,” both capitalized and bold and is followed by text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning messages may result in permanent damage to the WAFER-LX2 or personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or damaging the WAFER-LX2. Cautions are easy to recognize. The word “caution” is written as “CAUTION,” both capitalized and bold and is followed. The italicized text is the cautionary message. A caution message is shown below:
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CAUTION:
This is an example of a caution message. Failure to adhere to cautions messages may result in permanent damage to the WAFER-LX2. Please take caution messages seriously.
WAFER-LX2 3.5” Embedded SBC
NOTE:
These messages inform the reader of essential but non-critical information. These messages should be read carefully as any directions or instructions contained therein can help avoid making mistakes. Notes are easy to recognize. The word “note” is written as “NOTE,” both capitalized and bold and is followed by text. The text is the cautionary message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read. Notes contain critical information about the WAFER-LX2. Please take note messages seriously.
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WAFER-LX2 3.5” Embedded SBC
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to improve reliability, design and function and does not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.

Copyright

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.
TRADEMARKS
IBM PC is a registered trademark of International Business Machines Corporation. INTEL is a registered trademark of INTEL Corporation. Other product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective owners.
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WAFER-LX2 3.5” Embedded SBC

Packing List

NOTE:
If any of the components listed in the checklist below are missing, please do not proceed with the installation. Contact the IEI reseller or vendor you purchased the WAFER-LX2 from or contact an IEI sales representative directly. To contact an IEI sales representative, please send an email to
The items listed below should all be included in the WAFER-LX2 package.
1 x WAFER-LX2 single board computer 1 x Audio cable 1 x IDE flat cable 44p/44p 2 x 4 COM port cable1 x Mini jumper pack 1 x Utility CD 1 x QIG (quick installation guide)
Images of the above items are shown in Chapter 3.
sales@iei.com.tw.
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WAFER-LX2 3.5” Embedded SBC

Table of Contents

1 INTRODUCTION..................................................................................................... 1
1.1 WAFER-LX2 OVERVIEW .......................................................................................... 2
1.1.1 W AFER-LX2 Applications.................................................................................. 2
1.1.2 W AFER-LX2 Benefits......................................................................................... 2
1.1.3 W AFER-LX2 Featur es........................................................................................ 2
1.2 WAFER-LX2 OVERVIEW .......................................................................................... 3
1.2.1 W AFER-LX2 Connectors ................................................................................... 4
1.2.2 Technical Specifications..................................................................................... 5
2 DETAILED SPECIFICATIONS............................................................................. 7
2.1 OVERVIEW ................................................................................................................. 8
2.2 DIMENSIONS .............................................................................................................. 8
2.2.1 Board Dimensions.............................................................................................. 8
2.2.2 External Interface Panel Dimensions................................................................ 8
2.3 DATA FLOW................................................................................................................ 9
2.4 CPU SUPPORT.......................................................................................................... 10
2.4.1 AMD® Geode™ LX 800 500MHz Overview.................................................... 10
2.4.2 AMD® Geode™ LX 800 Memory Support........................................................11
2.4.3 AMD® Geode™ LX 800 500MHz Display Support..........................................11
2.4.4 AMD® Geode™ LX 800 500MHz Graphics processor.....................................11
2.4.5 AMD® Geode™ LX 800 500MHz Power Management................................... 13
2.5 SYSTEM CHIPSET ..................................................................................................... 13
2.5.1 GeodeLink™ Interface Unit............................................................................. 13
2.5.2 AMD® Geode™ CS5536 ATA-6 Controller..................................................... 14
2.5.3 AMD® Geode™ CS5536 Audio Codec 97 (AC’97) Controller....................... 14
2.5.4 AMD® Geode™ CS5536 Flash Interface ........................................................ 16
2.5.5 AMD® Geode™ CS5536 USB Controller........................................................ 16
2.5.6 AMD® Geode™ CS5536 Serial Communications........................................... 16
2.5.7 AMD® Geode™ CS5536 Real Time Clock ...................................................... 17
2.5.8 BIOS................................................................................................................. 17
2.6 GEODELINK™ PCI BRIDGE..................................................................................... 17
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2.6.1 Overview.......................................................................................................... 17
2.6.2 10/100M Ethernet ............................................................................................ 18
2.6.3 PCI to ISA Bridge ............................................................................................ 19
2.7 ENVIRONMENTAL AND POWER SPECIFICATIONS ....................................................... 19
2.7.1 System Monitoring........................................................................................... 19
2.7.2 Operating Temperature and Temperature Control........................................... 20
2.7.3 Power Consumption......................................................................................... 20
3 UNPACKING .......................................................................................................... 21
3.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 22
3.2 UNPACKING.............................................................................................................. 22
3.2.1 Unpacking Precautions.................................................................................... 22
3.3 UNPACKING CHECKLIST ........................................................................................... 23
3.3.1 Package Contents............................................................................................. 23
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4 CONNECTOR PINOUTS...................................................................................... 25
4.1 PERIPHERAL INTERFACE CONNECTORS .................................................................... 26
4.1.1 W AFER-LX2 Layout......................................................................................... 26
4.1.2 Peripheral Interface Connectors ..................................................................... 27
4.1.3 External Interface Panel Connectors............................................................... 28
4.2 INTERNAL PERIPHERAL CONNECTORS ...................................................................... 29
4.2.1 AT Power Connector........................................................................................ 29
4.2.2 ATX Power Supply Enable Connector............................................................. 30
4.2.3 Audio Connector (10-pin)................................................................................ 31
4.2.4 Backlight Inverter Connector .......................................................................... 32
4.2.5 Battery Connector............................................................................................ 33
4.2.6 Compact Flash Socket...................................................................................... 34
4.2.7 GPIO Connector.............................................................................................. 36
4.2.8 IDE Connector(44-pin).................................................................................... 37
4.2.9 LED Connector................................................................................................ 39
4.2.10 PC/104 Slot.................................................................................................... 40
4.2.11 PC/104 Power Input Connector..................................................................... 44
4.2.12 Power Button Connector................................................................................ 45
4.2.13 Reset Button Connector ................................................................................. 46
4.2.14 Serial Port Connector (COM 2, COM 3 and COM 4)................................... 47
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4.2.15 Serial Port Connector (COM 5, COM 6, COM 7 and COM 8)..................... 49
4.2.16 TFT LCD LVDS Connector............................................................................ 51
4.2.17 TFT LCD TTL Connector............................................................................... 52
4.3 EXTERNAL PERIPHERAL INTERFACE CONNECTORS .................................................. 54
4.3.1 External Peripheral Interface Connector Overview........................................ 54
4.3.2 RJ-45 Ethernet Connector ............................................................................... 55
4.3.3 Serial Port Connector (COM 1) ...................................................................... 56
4.3.4 USB Combo Port.............................................................................................. 57
4.3.5 VGA Connector................................................................................................ 58
5 INSTALLATION .................................................................................................... 59
5.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 60
5.2 INSTALLATION CONSIDERATIONS ............................................................................. 61
5.2.1 Installation Notices.......................................................................................... 61
5.2.2 Installation Checklist....................................................................................... 62
5.3 SODIMM INSTALLATION AND CF CARD INSTALLATION.......................................... 63
5.3.1 SODIMM Installation ...................................................................................... 63
5.3.2 CF Card Installation........................................................................................ 64
5.4 JUMPER SETTINGS .................................................................................................... 65
5.4.1 AT Power Select Jumper Settings..................................................................... 66
5.4.2 Clear CMOS Jumper........................................................................................ 67
5.4.3 COM 1 Pin 9 Setting Jumper........................................................................... 68
5.4.4 COM 2 Function Select Jumper....................................................................... 69
5.4.5 LCD Voltage Selection..................................................................................... 71
5.4.6 LCD Clock Select Jumper................................................................................ 72
5.5 CHASSIS INSTALLATION ........................................................................................... 73
5.5.1 Airflow.............................................................................................................. 73
5.5.2 Motherboard Installation................................................................................. 74
5.6 INTERNAL PERIPHERAL DEVICE CONNECTIONS........................................................ 74
5.6.1 Peripheral Device Cables................................................................................ 74
5.6.2 ATA Flat Cable Connection ............................................................................. 74
5.6.3 Audio Kit Installation....................................................................................... 75
5.6.4 Four Serial Port Connector Cable .................................................................. 76
5.7 EXTERNAL PERIPHERAL INTERFACE CONNECTION ................................................... 77
6 AWARD BIOS ......................................................................................................... 79
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6.1 INTRODUCTION ........................................................................................................ 80
6.1.1 Starting Setup................................................................................................... 80
6.1.2 Using Setup...................................................................................................... 80
6.1.3 Getting Help..................................................................................................... 81
6.1.4 Unable to Reboot After Configuration Changes.............................................. 81
6.1.5 Main BIOS Menu ............................................................................................. 81
6.2 STANDARD CMOS FEATURES.................................................................................. 84
6.2.1 IDE Primary Master/Slave .............................................................................. 86
6.3 ADVANCED BIOS FEATURES .................................................................................... 89
6.4 ADVANCED CHIPSET FEATURES ................................................................................ 95
6.4.1 Flat Panel Configuration................................................................................. 97
6.5 INTEGRATED PERIPHERALS .................................................................................... 100
6.5.1 IT8888 ISA Decode IO................................................................................... 104
6.5.2 IT8888 ISA Decode Memory.......................................................................... 107
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6.6 POWER MANAGEMENT SETUP................................................................................ 109
6.7 PNP/PCI CONFIGURATIONS ....................................................................................112
7 SOFTWARE DRIVERS........................................................................................119
7.1 AVAILABLE SOFTWARE DRIVERS ............................................................................ 120
7.2 VGA DRIVER ......................................................................................................... 122
7.3 AUDIO DRIVER INSTALLATION ............................................................................... 132
7.4 LAN DRIVER ......................................................................................................... 139
7.5 ISA DRIVER ........................................................................................................... 143
A BIOS OPTIONS.................................................................................................... 151
B GPIO CONNECTION.......................................................................................... 156
B.1 GPIO SETTINGS AND DEFAULT VALUES ................................................................ 157
B.1.1 GPIO Settings................................................................................................ 157
B.1.2 Default Settings ............................................................................................. 157
B.2 ASSEMBLY LANGUAGE SAMPLES........................................................................... 158
B.2.1 GPIO Initialization Procedure ...................................................................... 158
B.2.2 General Purpose Output Procedure.............................................................. 158
B.2.3 General Purpose Input Procedure................................................................. 159
C WA TCHDOG TIMER .......................................................................................... 160
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D ADDRESS MAPPING.......................................................................................... 164
D.1 ADDRESS MAP ...................................................................................................... 165
D.2 1ST MB MEMORY ADDRESS MAP ......................................................................... 165
D.3 IRQ MAPPING TABLE............................................................................................ 166
D.4 DMA CHANNEL ASSIGNMENTS............................................................................. 166
E EXTERNAL AC’97 AUDIO CODEC ................................................................. 168
E.1 INTRODUCTION ...................................................................................................... 169
E.1.1 Accessing the AC’97 CODEC ....................................................................... 169
E.1.2 Driver Installation......................................................................................... 169
E.2 SOUND EFFECT CONFIGURATION ........................................................................... 169
E.2.1 Accessing the Sound Effects Manager........................................................... 169
E.2.2 Sound Effect Manager Configuration Options.............................................. 171
F HAZARDOUS MATERIALS DISCLOSURE................................................... 174
F.1 HAZARDOUS MATERIAL DISCLOSURE TABLE FOR IPB PRODUCTS CERTIFIED AS
ROHS COMPLIANT UNDER 2002/95/EC WITHOUT MERCURY..................................... 175
G INDEX.................................................................................................................... 178
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List of Figures

Figure 1-1: WAFER-LX2 Overview...............................................................................3
Figure 1-2: WAFER-LX2 Solder Side Overview..........................................................4
Figure 2-1: WAFER-LX2 Dimensions (mm).................................................................8
Figure 2-2: External Interface Panel Dimensions (mm).............................................9
Figure 2-3: Data Flow Block Diagram........................................................................10
Figure 4-1: Connector and Jumper Locations .........................................................26
Figure 4-2: Connector and Jumper Locations (Solder Side)..................................27
Figure 4-3: AT Power Connector Location...............................................................29
Figure 4-4: ATX Power Supply Enable Connector Location...................................30
Figure 4-5: Audio Connector Pinouts (10-pin).........................................................31
Figure 4-6: Panel Backlight Connector Pinout Locations.......................................32
Figure 4-7: Battery Connector Location ...................................................................33
Figure 4-8: CF Card Socket Location........................................................................35
Figure 4-9: GPIO Connector Pinout Locations ........................................................37
Figure 4-10: Secondary IDE Device Connector Locations......................................38
Figure 4-11: LED Connector Locations.....................................................................40
Figure 4-12: PC/104 Slot Location.............................................................................42
Figure 4-13: PC/104 Power Input Connector Pinouts..............................................44
Figure 4-14: Power Button Connector Location ......................................................45
Figure 4-15: Reset Button Connector Locations.....................................................46
Figure 4-16: COM 2 to COM 4 Connector Pinout Locations...................................48
Figure 4-17: COM 5 to COM 8 Connector Pinout Locations...................................50
Figure 4-18: TFT LCD LVDS Connector Pinout Locations......................................52
Figure 4-19: TFT LCD TTL Connector Pinout Locations.........................................53
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Figure 4-20: WAFER-LX2 On-board External Interface Connectors......................55
Figure 4-21: J7 Connector..........................................................................................56
Figure 4-22: COM1 Pinout Locations........................................................................57
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Figure 4-23: VGA Connector......................................................................................58
Figure 5-1: SODIMM Installation................................................................................63
Figure 5-2: CF Card Installation.................................................................................65
Figure 5-3: AT Power Select Jumper Location ........................................................67
Figure 5-4: CN22 Clear CMOS Jumper......................................................................68
Figure 5-5: COM 1 Pin 9 Setting Jumper Location ..................................................69
Figure 5-6: COM 2 Function Select Jumper Location .............................................70
Figure 5-7: LCD Voltage Selection Jumper Location..............................................72
Figure 5-8: LCD Clock Select Jumper Select Jumper Location.............................73
Figure 5-9: IDE Cable Connection.............................................................................75
Figure 5-10: IDE Cable Connection...........................................................................76
Figure 5-11: Four Serial Port Connector Cable Connection...................................77
Figure 7-1: AMD LX/GX CD Main Menu.................................................................. 121
Figure 7-2: AMD LX/GX CD Driver Menu................................................................ 122
Figure 7-3: Access Windows Control Panel.......................................................... 123
Figure 7-4: Double Click the System Icon ............................................................. 124
Figure 7-5: Double Click the Device Manager Tab................................................ 125
Figure 7-6: Device Manager List............................................................................. 126
Figure 7-7: Expand the Display Adapters Category............................................. 127
Figure 7-8: Update Driver ........................................................................................ 128
Figure 7-9: Upgrade Device Driver Wizard............................................................ 129
Figure 7-10: Search for Suitable Driver.................................................................. 130
Figure 7-11: Locate Driver Files.............................................................................. 131
Figure 7-12: Location Browsing Window............................................................... 132
Figure 7-13: Access Windows Control Panel........................................................ 133
Figure 7-14: Double Click the System Icon ........................................................... 134
Figure 7-15: Double Click the Device Manager Tab.............................................. 135
Figure 7-16: Device Manager List........................................................................... 136
Figure 7-17: Search for Suitable Driver.................................................................. 137
Figure 7-18: Locate Driver Files.............................................................................. 138
Figure 7-19: Location Browsing Window............................................................... 139
Figure 7-20: Locate the Setup Program Icon ........................................................ 140
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Figure 7-21: Preparing Setup Screen..................................................................... 140
Figure 7-22: Install Wizard Welcome Screen......................................................... 141
Figure 7-23: Installing Screen................................................................................. 142
Figure 7-24: Restart the Computer......................................................................... 143
Figure 7-25: Access Windows Control Panel........................................................ 144
Figure 7-26: Double Click the System Icon ........................................................... 145
Figure 7-27: Double Click the Device Manager Tab.............................................. 146
Figure 7-28: Device Manager List........................................................................... 147
Figure 7-29: Search for Suitable Driver.................................................................. 148
Figure 7-30: Locate Driver Files.............................................................................. 149
Figure 7-31: Location Browsing Window............................................................... 150
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Table 1-1: Technical Specifications ............................................................................6
Table 2-1: Geode LX Graphics Features...................................................................13
Table 2-2: Supported HDD Specifications................................................................14
Table 2-3: Power Consumption .................................................................................20
Table 3-1: Package List Contents..............................................................................24
Table 4-1: Peripheral Interface Connectors..............................................................28
Table 4-2: Rear Panel Connectors.............................................................................28
Table 4-3: AT Power Connector Pinouts ..................................................................30
Table 4-4: ATX Power Supply Enable Connector Pinouts......................................31

List of Tables

Table 4-5: Audio Connector Pinouts (10-pin)...........................................................32
Table 4-6: Panel Backlight Connector Pinouts........................................................33
Table 4-7: Battery Connector Pinouts.......................................................................34
Table 4-8: CF Card Socket Pinouts ...........................................................................36
Table 4-9: GPIO Connector Pinouts..........................................................................37
Table 4-10: Secondary IDE Connector Pinouts........................................................39
Table 4-11: LED Connector Pinouts..........................................................................40
Table 4-12: PC/104 Slot Connector Pinouts.............................................................44
Table 4-13: PC/104 Power Input Connector Pinouts ...............................................45
Table 4-14: Power Button Connector Pinouts..........................................................46
Table 4-15: Reset Button Connector Pinouts...........................................................47
Table 4-16: COM 2 to COM 4 Connector Pinouts.....................................................49
Table 4-17: COM 5 to COM 8 Connector Pinouts.....................................................51
Table 4-18: TFT LCD LVDS Port Connector Pinouts...............................................52
Table 4-19: TFT LCD TTL Port Connector Pinouts..................................................54
Table 4-20: RJ-45 Ethernet Connector Pinouts........................................................55
Table 4-21: J7 Connector LEDs.................................................................................56
Table 4-22: RS-232 Serial Port (COM 1) Pinouts......................................................57
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Table 4-23: USB Connector Pinouts..........................................................................58
Table 4-24: VGA Connector Pinouts .........................................................................58
Table 5-1: Jumpers..........................................................................................................
66
Table 5-2: AT Power Select Jumper Settings...........................................................66
Table 5-3: CN22 Clear CMOS Jumper Settings........................................................68
Table 5-4: COM 1 Pin 9 Setting Jumper Settings.....................................................69
Table 5-5: COM 2 Function Select Jumper Settings................................................70
Table 5-6: LCD Voltage Selection Jumper Settings.................................................71
Table 5-7: LCD Clock Select Jumper Settings.........................................................72
Table 5-8: IEI Provided Cables...................................................................................74
Table 6-1: BIOS Navigation Keys...............................................................................81
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BIOS Menu 1: Award BIOS CMOS Setup Utility.......................................................82
BIOS Menu 2: Standard CMOS Features ..................................................................84
BIOS Menu 3: Advanced BIOS Features...................................................................89
BIOS Menu 4: Advanced Chipset Features..............................................................95
BIOS Menu 5: Flat Panel Configuration....................................................................98
BIOS Menu 6: Integrated Peripherals..................................................................... 101
BIOS Menu 7: IT8888 ISA Decode IO...................................................................... 105
BIOS Menu 8: IT8888 ISA Decode Memory............................................................ 107
BIOS Menu 9: Power Management Setup.............................................................. 109

BIOS Menus

BIOS Menu 10: PnP/PCI Configurations................................................................ 113
BIOS Menu 11: IRQ Resources............................................................................... 114
BIOS Menu 12: Memory Resources........................................................................ 116
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Glossary
AC ’97 Audio Codec 97 ACPI Advanced Configuration and
Power Interface
APM Advanced Power Management ARMD ATAPI Removable Media Device ASKIR Shift Keyed Infrared ATA Advanced Technology
Attachments
BIOS Basic Input/Output System CFII Compact Flash Type 2 CMOS Complementary Metal Oxide
Semiconductor
CPU Central Processing Unit Codec Compressor/Decompressor COM Serial Port DAC Digital to Analog Converter DDR Double Data Rate
IDE Integrated Data Electronics I/O Input/Output ICH4 I/O Controller Hub 4 L1 Cache Level 1 Cache L2 Cache Level 2 Cache LCD Liquid Crystal Display LPT Parallel Port Connector LVDS Low Voltage Differential Signaling MAC Media Access Controller OS Operating System PCI Peripheral Connect Interface PIO Programmed Input Output PnP Plug and Play POST Power On Self Test RAM Random Access Memory SATA Serial ATA
S.M.A.R.T Self Monitoring Analysis and DIMM Dual Inline Memory Module DIO Digital Input/Output DMA Direct Memory Access EIDE Enhanced IDE EIST Enhanced Int el SpeedStep
Technology FFIO Flexible File Input/Output FIFO First In/First Out FSB Front Side Bus IrDA Infrared Data Association HDD Hard Disk Drive
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Reporting Technology SPD Serial Presence Detect S/PDI Sony/Philips Digital Interface SDRAM Synchronous Dynamic Random
Access Memory SIR Serial Infrared UART Universal Asynchronous
Receiver-transmitter USB Universal Serial Bus VGA Video Graphics Adapter
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Chapter
1

1 Introduction

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1.1 WAFER-LX2 Overview
The 3.5” WAFER-LX2 AMD Geode LX800 low power single board computer (SBC) is fully equipped with advanced multi-mode I/Os. The WAFER-LX2 has eight serial ports and a PC/104 for expansion and increased connectivity. The WAFER-LX2 is designed for system manufacturers, integrators, and VARs that want performance, reliability, and quality at a reasonable price.
1.1.1 WAFER-LX2 Applications
The WAFER-LX2 is designed for applications in the following areas:
Kiosks and Point of Sales Restaurants Human Machine Interface (HMI) applications
WAFER-LX2 3.5” Embedded SBC
Marine, GPS and transportation applications Financial, retail and kiosk applications
1.1.2 WAFER-LX2 Benefits
Some of the WAFER-LX2 benefits include:
Reduced hardware costs Reduced software costs Reduced maintenance costs Client crash prevention Central resource control Security protection
1.1.3 WAFER-LX2 Features
Some of the WAFER-LX2 features are listed below:
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3.5” form factor RoHS compliant AMD LX-800 processor installed Dual-independent display functionality
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Low power consumption (6 Watts) Two high performance 10/100 megabit Ethernet controllers on-board Two SATA channels with transfer rates up to 150MB/s on-board Four USB 2.0 devices on-board Integrated audio
1.2 WAFER-LX2 Overview
Figure 1-1: WAFER-LX2 Overview
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Figure 1-2: WAFER-LX2 Solder Side Overview
1.2.1 WAFER-LX2 Connectors
The WAFER-LX2 has the following connectors on-board:
1 x AT power connector 1 x ATX power function connector 1 x Audio connector 1 x Battery connector 1 x Compact Flash (CF) connector (solder side) 1 x External LED connector 1 x Fan connector 1 x General purpose input/output (GPIO) connector 1 x IDE Interface connectors (44-pin) 1 x Inverter power connector 1 x Parallel port connector
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1 x PC/104 slot 1 x PC/104 power connector 1 x Reset button connector
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2 x Serial port connectors 1 x Suspend power input connector 1 x TFT LCD LVDS interface connector 1 x TFT LCD TFT interface connector 1 x SO-DIMM socket
The WAFER-LX2 has the following connectors on the board rear panel:
1 x Ethernet connectors 2 x Dual USB connector 1 x Serial port connector 1 x VGA connector
The WAFER-LX2 has the following on-board jumpers:
COM-1 pin-9 signal select LCD Vcc select COM-2 function select AT Power select LCD clock select
1.2.2 Technical Specifications
WAFER-LX2 technical specifications are listed in Table 1-1. Detailed descriptions of each specification can be found in Chapter 2.
Specification WAFER-LX2
Form Factor
CPU
Southbridge Chipset
Display
3.5” form factor
AMD® Geode™ LX800 500Mhz
AMD® Geode™ CS5536
CRT integrated in AMD® Geode™ LX800
TTL/LVDS
24-bit TTL or 18-bit single channel LVDS
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Supports one 1GB DDR 333/400 200-pin SO-DIMM
Memory
SDRAM module
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BIOS
SSD
Audio
LAN
COM
USB2.0
IDE
Watchdog Timer
Digital I/O
Expansion
Award BIOS
Compact Flash (CF)
AC'97 Codec Realtek ALC2 03
10/100 Base-T dual RTL8100C
Eight RS-232 or Seven RS-232 and one RS-422/RS-485
Four USB 1.1 or USB 2.0 devices supported
One 44-pin IDE connects to two Ultra ATA33/66/100 devices
Software programmable 1-255 sec. by supper I/O
One GPIO connector
One PC/104 slot
Power Supply
Temperature
Humidity (operating)
Dimensions
Weight (GW/NW)
Table 1-1: Technical Specifications
+5V ± 5% AT/A TX power support
0ºC - 60ºC
5%~95% non-condensing
145mm x 102mm
670g/230g
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Chapter
2

2 Detailed Specifications

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2.1 Overview
This chapter describes the specifications and on-board features of the WAFER-LX2 in detail.
2.2 Dimensions
2.2.1 Board Dimensions
The dimensions of the board are listed below:
Length: 146.06mm Width: 102mm
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Figure 2-1: WAFER-LX2 Dimensions (mm)
2.2.2 External Interface Panel Dimensions
External peripheral interface connector panel dimensions are shown in Figure 2-2.
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Figure 2-2: External Interface Panel Dimensions (mm)
2.3 Data Flow
The WAFER-LX2 motherboard comes with an AMD® Geode™ LX800 CPU and an AMD® Geode™ CS5536 linked together by the GeodeLink™ Interface Unit. the data flow between the system chipset, the CPU and other components installed on the motherboard.
Figure 2-3 shows
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Figure 2-3: Data Flow Block Diagram
2.4 CPU Support
The WAFER-LX2 series motherboards all come with a preinstalled AMD® Geode™ LX 800 500MHz CPU.
2.4.1 AMD® Geode™ LX 800 500MHz Overview
The specifications for the 500MHz AMD® Geode™ LX 800 are listed below
x86/x87-compatible core Processor frequency up to 500 MHZ 64K I/64K D L1 cache and 128K L2 cache Split I/D cache/TLB (Translation Look-Aside Buffer) Integrated FPU that supports the Intel MMX® and AMD 3DNow!™
Technology instruction sets
9 GB/s internal GeodeLink™ Interface Unit (GLIU)
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Security Block
o 128-bit AES (CBC/ECB)
True Random Number Generator
2.4.2 AMD® Geode™ LX 800 Memory Support
The AMD® Geode™ LX 800 supports 64-bit DDR memory modules with freq uencie s u p to 400MHz. The WAFER-LX2 has one 200-pin DDR SO-DIMM SDRAM socket that supports one 64-bit 333 MHz or 400MHz DDR SO-DIMM memory module with a maximum ca pacity of 1GB.
2.4.3 AMD® Geode™ LX 800 500MHz Display Support
The AMD® Geode™ LX 800 supports both CRT and TFT in a dual display mode. The following display specifications.
Supported Standards
o High Definition (HD) o Standard Definition (SD)
Supported Resolution
o 1920x1440 in CRT mode o 1600x1200 in TFT mode
VESA 1.1 and 2.0 VIP/VDA support
2.4.4 AMD® Geode™ LX 800 500MHz Graphics processor
The AMD® Geode™ LX 800 BitBLT/vector engine graphics processor supports pattern generation, source expansion, pattern/source transparency, 256 ternary raster operations, alpha blenders to support alpha- BLTs, incorporated BLT FIFOs, a GeodeLink interface and the ability to throttle BLTs according to video timing. New features added to the Graphics Processor include:
Command buffer interface Hardware accelerated rotation BLTs Color depth conversion Paletized color
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Full 8x8 color pattern buffer Separate base addresses for all channels Monochrome inversion
WAFER-LX2 3.5” Embedded SBC
Table 2-1: Geode LX Graphics Features lists a complete list of Geode LX graphics features. For more details, please refer to the AMD website or the Geode LX series data book available from AMD.
Feature AMD Geode™ LX Processor
Color Depth 8, 16, 32 bpp (A) RGB 4 and 8-bit indexed ROPs 256 (2-src, dest and pattern) BLT Buffers FIFOs in Graphics Processor BLT Splitting Managed by hardware Video Synchronized BLT/Vector Throttle by VBLANK Bresenham Lines Yes Patterned (stippled) Lines Yes Screen to Screen BLT Yes Screen to Screen BLT with mono expansion Yes Memory to Screen BLT Yes (throttled rep movs writes)
Accelerated Text No Pattern Size (Mono) 8x8 pixels Pattern Size (Color) 8x8 pixels Monochrome Pattern Yes (with inversion) Dithered Pattern (4 color) No Color Pattern 8, 16, 32 bpp Transparent Pattern Monochrome Solid Fill Yes Pattern Fill Yes
Transparent Source Monochrome Color Key Source Transparency Y with mask
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Variable Source Stride Yes Variable Destination Stride Yes Destination Write Bursting Yes Selectable BLT Direction Vertical and Horizontal
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WAFER-LX2 3.5” Embedded SBC
Alpha BLT VGA Support Decodes VGA Register Pipeline Depth Unlimited Accelerated Rotation BLT 8, 16, 32 bpp Color Depth Conversion 5:6:5, 1:5:5:5, 4:4:4:4, 8:8:8:8
Yes (constant α, α/pix, or sep. α channel)
Table 2-1: Geode LX Graphics Features
2.4.5 AMD® Geode™ LX 800 500MHz Power Management
The power management for the 500MHz AMD® Geode™ LX 800 is listed below:
1.8W Typical (3.9W TDP) @ 500MHz GeodeLink active hardware power management Hardware support for standard ACPI software power management I/O companion SUSP#/SUSPA# power controls Lower power I/O Wakeup on SMI/INTR
2.5 System Chipset
The WAFER-LX2 series motherboards all have a preinstalled AMD® Geode™ CS5536 system chipset. The system chipset fe atures are listed below.
82xx Legacy Devices System Management Bus (SMB) Controller 8 Multi-Function General Purpose Timers (MFGPTs) Power Management Controller ACPI v2.0 compliant
2.5.1 GeodeLink™ Interface Unit
o 64-bit, 66MHz operation o PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
o Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
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2.5.2 AMD® Geode™ CS5536 ATA-6 Controller
The single WAFER-LX2 IDE connector supports two ATA-6 HDDs. An ATA-6 (Ultra ATA/100) compliant IDE controller on the AMD transfer rate of 100MB/s. ATA-6 includes advancements in error checking and ATA-6 drives are compatible with future interface additions.
The onboard ATA-6 controller is able to support the following IDE HDDs:
Ultra A T A/10 0, with data transfer rates up to 100MB/s Ultra A T A/66, with data transfer rates up to 66MB/s Ultra A T A/33, with data transfer rates up to 33MB/s
WAFER-LX2 3.5” Embedded SBC
®
Geode™ CS5536 has a maximum
Specification
IDE devices
PIO Mode
PIO Max Transfer Rate
DMA/UDMA designation
DMA/UDMA Max Transfer
Controller Interface
Table 2-2: Supported HDD Specifications
Ultra A T A/100 Ultra ATA/66 Ultra A T A/100
2 2 2
0 – 4 0 – 4 0 – 4
16.6 MB/s 16.6 MB/s 16.6 MB/s
UDMA 3 - 4 UDMA 3 – 4 UDMA 2
100MB/s 66MB/s 33MB/s
5V 5V 5V
2.5.3 AMD® Geode™ CS5536 Audio Codec 97 (AC’97) Controller
The AC’97 specification v2.3 compliant controller on the chipset is interfaced to a 20-bit DAC and 18-bit ADC full-duplex AC'97 2.3 stereo RealTek ALC203 codec. The ALC203 is
Page 14
then connected to a 10-pin audio connector to which an audio kit can easily be conne cted. The codec meets performance requirements for audio on PC99/2001 systems. Some of the codec features are listed below.
Meets Microsoft WHQL/WLP 2.0 audio requirements 20-bit DAC and 18-bit ADC resolution
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WAFER-LX2 3.5” Embedded SBC
18-bit Stereo full-duplex CODEC with independent and variable sampling rate Complies with AC'97 2.3 specifications
o LINE/HP-OUT, MIC-IN and LINE-IN sensing o 14.318MHz -> 24.576MHz PLL saves crystal o 12.288MHz BITCLK input can be consumed o Integrated PCBEEP generator to save buzzer o Interrupt capability o Page registers and Analog Plug & Play
Support of S/PDIF out is fully compliant with AC'97 rev2.3 specifications Three analog line-level stereo inputs with 5-bit volume control: LINE_IN, CD,
AUX
High quality differential CD input Two analog line-level mono input: PCBEEP, PHONE-IN Supports double sampling rate (96KHz) of DVD audio playback Two software selectable MIC inputs +6/12/20/30dB boost preamplifier for MIC input Stereo output with 6-bit volume control Mono output with 5-bit volume control Headphone output with 50mW/20Ohm amplifier 3D Stereo Enhanceme nt Multiple CODEC extension capability External Amplifier Power Down (EAPD) capability Power management and enhanced power saving features Stereo MIC record for AEC/BF application DC Voltage volume control Auxiliary power to support Power Off CD Adjustable VREFOUT control 2 GPIO pins with smart GPIO volume control 2 Universal Audio Jacks (UAJ)® for front panel Supports 32K/44.1K/48K/96KHz S/PDIF output Supports 32K/44.1K/48KHz S/PDIF input Power support: Digital: 3.3V; Analog: 3.3V/5V Standard 48-Pin LQFP Package EAX™ 1.0 & 2.0 compatible Direct Sound 3D™ compatible
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A3D™ compatible I3DL2 compatible HRTF 3D Positional Audio Sensaura™ 3D Enhancement (optional) 10 Bands of Software Equalizer Voice Can cellation and Key Shifting in Kareoke mode AVRack® Media Player
2.5.4 AMD® Geode™ CS5536 Flash Interface
The WAFER-LX2 CompactFlash socket supports standard CF Type I and CF Type II cards. The chipset flash interface is multiplexed with an IDE interface and can be connected to an array of industry standard NAND Flash or NOR Flash devices.
2.5.5 AMD® Geode™ CS5536 USB Controller
WAFER-LX2 3.5” Embedded SBC
Four external USB ports on the WAFER-LX2 board are interfaced to the chipset USB controller. Four USB 1.1 or USB 2.0 devices can be connected simultaneously to the WAFER-LX2. The chipset USB controller has the following specifications:
o 4 USB ports o USB 1.1 and USB 2.0 compliant o 3 host ports o 1 host/device
2.5.6 AMD® Geode™ CS5536 Serial Communications
Eight high-speed UART serial port connectors, seven RS-232 and one that can be configured as RS-232, RS-422 or RS-485, are connected to the system chipset low pin count (LPC) port via the LPC bus. The specifications for the serial ports are listed below.
16C550 UART with 16-byte FIFO buffer 115.2Kbps transmission rate
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WAFER-LX2 3.5” Embedded SBC
2.5.7 AMD® Geode™ CS5536 Real Time Clock
The system chipset has a battery backed up 256-byte real-time clock (RTC) with CMOS RAM.
2.5.8 BIOS
The BIOS flash memory chip on the WAFER-LX2 has a licensed copy of AWARD BIOS loaded onto it. The BIOS flash memory chip is connected to the chipset via the LPC bus. The flash BIOS features are listed below:
SMIBIOS (DMI) compliant Console redirection function support PXE (Pre-Boot Execution Environment) support USB booting support
2.6 GeodeLink™ PCI Bridge
2.6.1 Overview
The GeodeLink™ PCI Bridge (GLPCI) module provides a PCI interface for GeodeLink Interface Unit-based designs. The GLPCI module is composed of six major blocks:
GeodeLink Interface FIFO/Synchronization Transaction Forwarding PCI Bus Interface PCI Arbiter
The GeodeLink and PCI Bus Interface blocks provide adaptation to the respective buses. The Transaction Forwarding block provides bridging logic. Some of the features of the GeodeLink™ PCI Bridge are listed below:
PCI Version 2.2 compliance 32-bit, 66 MHz PCI bus operation Target support for fast back-to-back transactions Arbiter support for three external PCI bus masters
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Write gathering and write posting for in-bound write requests Virtual PCI header support Delayed transactions for in-bound read requests Zero wait state operation within a PCI burst Dynamic clock stop/start support for GLIU and PCI clock domains (this is not
CLKRUN support)
Capable of handling out of bound transactions immediately after reset
2.6.2 10/100M Ethernet
A highly integrated and cost-effective single-chip, fast RealTek RTL8100C 10/100M Ethernet controller is interfaced through first the PCI bus and then through the GeodeLink™ PCI Bridge to the CPU and system chipset. The RealTek RTL8100C controller provides 10Mbps or 100Mbps Ethernet connectivity to the WAFER-LX2. Some of the features of the RealTek RTL8100C are listed below.
WAFER-LX2 3.5” Embedded SBC
10Mbps and 100Mbps operation Supports 10Mbps and 100Mbps N-way auto-negotiation Supports 25MHz Crystal or 25MHz OSC as the internal clock source Complies with PC99/PC2001 standards Supports ACPI power management Provides PCI bus master data transfer Provides PCI memory space or I/O space mapped data transfer Supports PCI clock speed of 16.75MHz-40MHz Advanced power saving mode Supports Wa ke-on-LAN and remote wake-up (AMD Magic Packet™, Link
Change, and Microsoft® Wake -up frame)
Half/Full duplex capability Supports Full Duplex Flow Control (IEEE 802.3x) Provides interface to 93C46 EEPROM to store resource configuration and ID
parameters
Provides PCI clock run pin Provides LED pins for network operation status indication
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2.5/3.3V power supply with 5V tolerant I/Os
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WAFER-LX2 3.5” Embedded SBC
2.6.3 PCI to ISA Bridge
An ITE IT8888G PCI to ISA bridge single function device connects the onboard WAFER-LX2 ISA bus PC/104 connector and the GPIO connector to the GeodeLink™ PCI bridge. The IT8888G has a PCI specification v2.1 compliant 32-bit PCI bus interface and supports both PCI Bus master and slave. The PCI interface supports both programmable positive and full subtractive decoding schemes. Some of the features of the IT8888G PCI to ISA bridge are listed below.
PCI Interface Programmable PCI Address Decoders PC/PCI DMA Controller Distributed DMA Controller ISA Interface SM Bus 1 analog line-level mono output: MONO_OUT Power-on Serial Bus Configuration Serial IRQ Versatile power-on strapping options Supports NOGO function Single 33 MHz Clock Input +3.3V PCI I/F with +5V tolerant I/O buffers +5V ISA I/F and core Power Supply
2.7 Environmental and Power Specifications
2.7.1 System Monitoring
The WAFER-LX2 is capable of self-monitoring various aspects of its operating status including:
CPU, chipset, and battery voltage, +3.3V, +5V, and +12V RPM of cooling fans CPU and board temperatures (by the corresponding embedded sensors)
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WAFER-LX2 3.5” Embedded SBC
2.7.2 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-LX2 are listed below.
Minimum Operating Temperature: 0ºC (32°F) Maximum Operating Temperature: 60°C (140°F)
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks are also mounted on the northbridge and southbridge chipsets to ensure the operating temperature of these chips remain low.
2.7.3 Power Consumption
Table 2-3 shows the power consumption parameters for the WAFER-LX2 when an AMD
Geode LX 800 processor is running with one 512MB DDR333 memory module.
Voltage Current
+5V 1.33A
Table 2-3: Power Consumption
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WAFER-LX2 3.5” Embedded SBC
Chapter
3

3 Unpacking

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3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the WAFER-LX2 may result in permanent damage to the WAFER-LX2 and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components, including the WAFER-LX2. Dry climates are especially susceptible to ESD. It is therefore critical that whenever the WAFER-LX2, or any other electrical component is handled, the following anti-static precautions are strictly adhered to.
WAFER-LX2 3.5” Embedded SBC
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-LX2, place it on an
antic-static pad. This reduces the possibility of ESD damaging the WAFER-LX2.
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
3.2 Unpacking
3.2.1 Unpacking Precautions
When the WAFER-LX2 is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 3.1.
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Make sure the packing box is facing upward s so the W A FER-LX2 does not fall
out of the box.
Make sure all the components shown in Section 3.3 are present.
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WAFER-LX2 3.5” Embedded SBC
3.3 Unpacking Checklist
NOTE:
If some of the components listed in the checklist below are missing, please do not proceed with the installation. Contact the IEI reseller or vendor you purchased the WAFER-LX2 from or contact an IEI sales representative directly. To contact an IEI sales representative, please send an email to
sales@iei.com.tw.
3.3.1 Package Contents
The WAFER-LX2 is shipped with the following components:
Quantity Item Image
1 WAFER-LX2
1 Audio Cable
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1 IDE cable
2 4 COM Port Cable
WAFER-LX2 3.5” Embedded SBC
1 mini jumper Pack
1 Quick Installation Guide
1 Utility CD
Table 3-1: Package List Contents
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WAFER-LX2 3.5” Embedded SBC
Chapter
4

4 Connector Pinouts

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4.1 Peripheral Interface Connectors
Section 4.1.2 shows peripheral interface connector locations. Section 4.1.2 lists all the
WAFER-LX2 3.5” Embedded SBC
peripheral interface connectors seen in Section
4.1.2.
4.1.1 WAFER-LX2 Layout
Figure 4-1 shows the on-board peripheral connectors, rear panel peripheral connectors
and on-board jumpers.
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Figure 4-1: Connector and Jumper Locations
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WAFER-LX2 3.5” Embedded SBC
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-LX2. Detailed
descriptions of these connectors can be found below.
Connector Type Label
AT power connector 4-pin header CN17
ATX enable connector 3-pin header CN16
Power button connector 2-pin header CN19
Audio connector 10-pin header CN15
Battery connector 2-pin header CN22
Compact Flash (CF) connector 50-pin header CN24
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GPIO connector 10-pin header CN14
IDE Interface connector 44-pin header CN13
Inverter power connector 5-pin header CN18
LED connector 6-pin header CN21
PC/104 power input connector 3-pin header CN10
PC/104 slot 104-pin slot CN12
Reset button connector 2-pin header CN20
Serial port connector (COM 2 – COM 4) 40-pin header CN9
Serial port connector (COM 5 – COM 8) 40-pin header CN11
TFTLCD LVDS connector 20-pin header CN2
WAFER-LX2 3.5” Embedded SBC
TFT LCD TTL connector 40-pin header CN4
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-LX2. Detailed descriptions of these connectors can be found in Section
Connector Type Label
Ethernet connector RJ-45 CN5
RS-232 serial port connector 9-pin male CN3
USB port USB port CN7
USB port USB port CN8
VGA port connector 15-pin female CN1
4.3 on page 54.
Page 28
Table 4-2: Rear Panel Connectors
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WAFER-LX2 3.5” Embedded SBC
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible when the motherboard is outside of the chassis. T his se ction h as complet e d esc ription s of all the internal, peripheral connectors on the WAFER-LX2.
4.2.1 AT Power Connector
CN Label: CN17
CN Type:
CN Location: See
CN Pinouts: See
The 4-pin AT power connector is connected to an AT power supply.
4-pin AT power connector (1x4)
Figure 4-3
Table 4-3
Figure 4-3: AT Power Connector Location
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PIN NO. DESCRIPTION
1 +5V 2 GND
3 GND 4 +12V
Table 4-3: AT Power Connector Pinouts
4.2.2 ATX Power Supply Enable Connector
CN Label: CN16
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
3-pin wafer (1x3)
Figure 4-4
Table 4-4
The ATX power supply enable connector enables the WAFER-LX2 to be connected to an ATX power supply. In default mode, the WAFER-LX2 can only us an AT power supply. To enable an ATX power supply the AT Power Select jumper must also be configured. Please refer to Chapter 3 for more details.
Page 30
Figure 4-4: ATX Power Supply Enable Connector Location
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 +5VSB 2 NC
3 PSON#
Table 4-4: ATX Power Supply Enable Connector Pinouts
4.2.3 Audio Connector (10-pin)
CN Label: CN15
CN Type:
CN Location: See
CN Pinouts: See
10-pin header
Figure 4-5
Table 4-5
The 10-pin audio connector is connected to external audio devices including speakers an microphones for the input and output of audio signals to and from the system.
Figure 4-5: Audio Connector Pinouts (10-pin)
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 Line out R 2 Line in R 3 GND 4 GND
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5 Line out L 6 Line in L
7 GND 8 GND 9 MIC in 10 NC
Table 4-5: Audio Connector Pinouts (10-pin)
4.2.4 Backlight Inverter Connector
CN Label: CN18
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
5-pin wafer (1x5)
Figure 4-6
Table 4-6
The backlight inverter connector provides the backlight on the LCD display connected to the WAFER-LX2 with +12V of power.
Page 32
Figure 4-6: Panel Backlight Connector Pinout Locations
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 2 GROUND 3 +12V 4 GROUND 5 BACKLIGHT ENABLE
LCD_Adj
Table 4-6: Panel Backlight Connector Pinouts
4.2.5 Battery Connector
CN Label: CN22
CN Type:
CN Location: See
CN Pinouts: See
The battery connector is connected to a backup battery. The battery connector is also
2-pin wafer (1x2)
Figure 4-7
Table 4-7
used to reset the CMOS memory if the incorrect BIOS settings have been made and the system cannot boot up.
Figure 4-7: Battery Connector Location
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PIN NO. DESCRIPTION
1 Battery+
2 Ground
Table 4-7: Battery Connector Pinouts
4.2.6 Compact Flash Socket
CN Label: CN24 (solder side)
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
A CF Type I or Type II memory card is inserted to the CF socket on the solder side of the WAFER-LX2.
50-pin header (2x25)
Figure 4-8
Table 4-8
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WAFER-LX2 3.5” Embedded SBC
Figure 4-8: CF Card Socket Location
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
49 PIDE_D10 50 Ground
47 PIDE_D8 48 PIDE_D9 45 PDASP# 46 IDE_CABLEID
43 PIDE_DRQ 44 PIDE_ACK#
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41 PIDE_RST# 42 PIDE_RDY
39 VCC5 40 N/C 37 PIDE_INTRQ 38 VCC5
35 PIDE_IOW# 36 VCC5 33 N/C 34 PIDE_IOR#
31 PIDE_D15 32 PIDE_CS#1 29 PIDE_13 30 PIDE_D14
27 PIDE_D11 28 PIDE_D12 25 Ground 26 Ground
23 PIDE_D2 24 N/C 21 PIDE_D0 22 PIDE_D1
19 PIDE_A1 20 PIDE_A0 17 Ground 18 PIDE_A2
15 Ground 16 Ground
WAFER-LX2 3.5” Embedded SBC
13 VCC5 14 Ground
11 Ground 12 Ground 9 Ground 10 Ground
7 PIDE_CS#0 8 Ground 5 PIDE_D6 6 PIDE_D7
3 PIDE_D4 4 PIDE_D5 1 Ground 1 2 PIDE_D3
Table 4-8: CF Card Socket Pinouts
4.2.7 GPIO Connector
CN Label: CN14
CN Type:
CN Location: See
CN Pinouts: See
10-pin header (2x5)
Figure 4-9
Table 4-9
Page 36
The GPIO connector can be connected to external I/O control devices including sensors, lights, alarms and switches.
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WAFER-LX2 3.5” Embedded SBC
Figure 4-9: GPIO Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 +5V 3 GP0 4 GP1 5 GP2 6 GP3 7 GP4 8 GP5 9 GP6 10 GP7
Table 4-9: GPIO Connector Pinouts
4.2.8 IDE Connector(44-pin)
CN Label:
CN Type:
CN Location:
CN Pinouts:
One 44-pin IDE device connector on the WAFER-LX2 supports connectivity to two hard
CN13
44-pin header (2x22)
Figure 4-10
See
Table 4-10
See
disk drives.
Page 37
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WAFER-LX2 3.5” Embedded SBC
Page 38
Figure 4-10: Secondary IDE Device Connector Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 RESET# 2 GROUND
3 DATA 7 4 DATA 8 5 DATA 6 6 DATA 9
7 DATA 5 8 DATA 10
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WAFER-LX2 3.5” Embedded SBC
9 DATA 4 10 DATA 11
11 DATA 3 12 DATA 12 13 DATA 2 14 DATA 13
15 DATA 1 16 DATA 14 17 DATA 0 18 DATA 15
19 GROUND 20 N/C 21 IDE DRQ 22 GROUND
23 IOW# 24 GROUND 25 IOR# 26 GROUND
27 IDE CHRDY 28 GROUND 29 IDE DACK 30 GROUND–DEFAULT
31 INTERRUPT 32 N/C 33 SA1 34 N/C
35 SA0 36 SA2 37 HDC CS0# 38 HDC CS1#
39 HDD ACTIVE# 40 GROUND 41 VCC 42 VCC
43 GROUND 44 N/C
Table 4-10: Secondary IDE Connector Pinouts
4.2.9 LED Connector
CN Label: CN21
CN Type:
CN Location: See
CN Pinouts: See
The LED connector connects to an HDD indicator LED and a power LED on the system chassis to inform the user about HDD activity and the power on/off status of the system.
6-pin wafer (1x6)
Figure 4-11
Table 4-11
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WAFER-LX2 3.5” Embedded SBC
Figure 4-11: LED Connector Locations
PIN NO. DESCRIPTION
1 +5V 2 GND 3 Power LED+ 4 Power LED­5 HDD LED+ 6 HDD LED-
Table 4-11: LED Connector Pinouts
4.2.10 PC/104 Slot
CN Label: CN10
Page 40
CN Type:
104-pin PC/104 slot
CN Location: See
Figure 4-12
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WAFER-LX2 3.5” Embedded SBC
CN Pinouts: See Table 4-12
The PC/104 slot enables a PC/104 compatible expansion module to be connected to the board.
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WAFER-LX2 3.5” Embedded SBC
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Figure 4-12: PC/104 Slot Location
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WAFER-LX2 3.5” Embedded SBC
Pin No. Column A Column B Column C Column D
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
IOCHK- GROUND GROUND GROUND SD7 RSTDRV SBHE- MCS16­SD6 +5V SA23 IOCS16­SD5 IRQ9 SA22 IRQ10 SD4 -5V SA21 IRQ11 SD3 DREQ2 SA20 IRQ12 SD2 -12V SA19 IRQ15 SD1 ZWS- SA18 IRQ14 SD0 +12V SA17 DACK0­IOCHRDY GROUND MEMR- DREQ0 AEN SMEMW- MEMW- DACK5­SA19 SMEMR- SD8 DRREQ5 SA18 IOW- SD9 DACK6­ SA17 IOR-
SD10
DREQ6
SA16 DACK3- SD11 DACK7-
16
17
18
19
20
21
22
23
24
25
26
27
28
29
SA15 DREQ3 SD12 DREQ7 SA14 DACK1- SD13 +5V SA13 DREQ1 SD14 MASTER­SA12 REFRESH- SD15 GROUND SA11 ISACLK NC GROUND SA10 IRQ7 SA9 IRQ6 SA8 IRQ5 SA7 IRQ4 SA6 IRQ3 SA5 DACK2­SA4 TC SA3 BALE SA2 +5V
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WAFER-LX2 3.5” Embedded SBC
30
31 SA0 GROUND 32 GROUND GROUND
SA1 ISA_OSC
Table 4-12: PC/104 Slot Connector Pinouts
4.2.11 PC/104 Power Input Connector
CN Label: CN12
CN Type:
CN Location: See
CN Pinouts: See
The PC/104 power input connector provides power to the PC/104 expansion module installed on the PC/104 slot.
3-pin wafer (1x3)
Figure 4-13
Table 4-13
Page 44
Figure 4-13: PC/104 Power Input Connector Pinouts
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 -5V 2 GND
3 -12V
Table 4-13: PC/104 Power Input Connector Pinouts
4.2.12 Power Button Connector
CN Label: CN19
CN Type:
CN Location: See
CN Pinouts: See
2-pin wafer (1x2)
Figure 4-14
Table 4-14
The power button connector is connected to a power switch on the system chassis to enable users to turn the system on and off.
Figure 4-14: Power Button Connector Location
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PIN NO. DESCRIPTION
1 Power Switch
2 GND
Table 4-14: Power Button Connector Pinouts
4.2.13 Reset Button Connector
CN Label: CN20
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
The reset button connector is connected to a reset switch o n the syst em chassi s to enabl e users to reboot the system when the system is turned on.
2-pin wafer (1x2)
Figure 4-15
Table 4-15
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Figure 4-15: Reset Button Connector Locations
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION
1 Reset Switch
2 GND
Table 4-15: Reset Button Connector Pinouts
4.2.14 Serial Port Connector (COM 2, COM 3 and COM 4)
CN Label: CN9
CN Type:
CN Location: See
CN Pinouts: See
40-pin header (2x20)
Figure 4-16
Table 4-16
The 40-pin serial port connector contains the following three serial ports, COM 2, COM 3 and COM 4. COM 3 and COM 4 are RS-232 serial communications channels. COM 2 is a multi function channel. In default mode COM 2 is an RS-232 serial communication channel but, with the COM 2 function select jumper, can be configured as either an RS-422 or RS-485 serial communications channel. The serial port locations are specified below.
COM 2 is located on pin 1 to pin 20 COM 3 is located on pin 21 to pin 30 COM 4 is located on pin 31 to pin 40
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WAFER-LX2 3.5” Embedded SBC
Figure 4-16: COM 2 to COM 4 Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 TXD485- 2 N/C 3 TXD485+ 4 N/C 5 RXD485+ 6 N/C 7 RXD485- 8 N/C 9 GND 10 GND 11 DCD2 12 DSR2 13 RXD2 14 RTS2 15 TXD2 16 CTS2 17 DTR2 18 RI2 19 GND 20 GND 21 DCD3 22 DSR3 23 RXD3 24 RTS3
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25 TXD3 26 CTS3 27 DTR3 28 RI3 29 GND 30 GND
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WAFER-LX2 3.5” Embedded SBC
31 DCD4 32 DSR4 33 RXD4 34 RTS4 35 TXD4 36 CTS4 37 DTR4 38 RI4 39 GND 40 GND
Table 4-16: COM 2 to COM 4 Connector Pinouts
4.2.15 Serial Port Connector (COM 5, COM 6, COM 7 and COM 8)
CN Label: CN11
CN Type:
CN Location: See
CN Pinouts: See
40-pin header (2x20)
Figure 4-16
Table 4-16
The 40-pin serial port connector contains the following four serial ports, COM 5, COM 6, COM 7 and COM 8. All four serial ports are RS-232 serial communications channels. The serial port locations are specified below.
COM 5 is located on pin 1 to pin 10 COM 6 is located on pin 11 to pin 20 COM 7 is located on pin 21 to pin 30 COM 8 is located on pin 31 to pin 40
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WAFER-LX2 3.5” Embedded SBC
Figure 4-17: COM 5 to COM 8 Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD5 2 DSR5 3 RXD5 4 RTS5 5 TXD5 6 CTS5 7 DTR5 8 RI5 9 GND 10 GND 11 DCD6 12 DSR6 13 RXD6 14 RTS6 15 TXD6 16 CTS6 17 DTR6 18 RI6 19 GND 20 GND 21 DCD7 22 DSR7 23 RXD7 24 RTS7
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25 TXD7 26 CTS7 27 DTR7 28 RI7 29 GND 30 GND
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WAFER-LX2 3.5” Embedded SBC
31 DCD8 32 DSR8 33 RXD8 34 RTS8 35 TXD8 36 CTS8 37 DTR8 38 RI8 39 GND 40 GND
Table 4-17: COM 5 to COM 8 Connector Pinouts
4.2.16 TFT LCD LVDS Connector
CN Label: CN2
CN Type:
CN Location: See
CN Pinouts: See
The 20-pin TFT LCD LVDS can be connected to a TFT LCD screen directly.
20-pin crimp (2x10)
Figure 4-18
Table 4-18
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WAFER-LX2 3.5” Embedded SBC
Figure 4-18: TFT LCD LVDS Connector Pinout Locations
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 GND 2 GND 3 D0+ 4 D0­5 D1+ 6 D1­7 D2+ 8 D2­9 CLK+ 10 CLK­11 NC 12 NC 13 GND 14 GND 15 SDATA 16 SCLK 17 LCD_Vcc 18 LCD_Vcc 19 LCD_Vcc 20 LCD_Vcc
Table 4-18: TFT LCD LVDS Port Connector Pinouts
4.2.17 TFT LCD TTL Connector
CN Label: CN4
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CN Type:
40-pin crimp (2x20)
CN Location: See
Figure 4-19
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WAFER-LX2 3.5” Embedded SBC
CN Pinouts: See Table 4-19
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
Figure 4-19: TFT LCD TTL Connector Pinout Locations
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 LCD_Vcc 2 LCD_Vcc 3 GND 4 GND 5 LCD_Vcc 6 LCD_Vcc 7 SDA 8 GND 9 B0 10 B1 11 B2 12 B3 13 B4 14 B5 15 B6 16 B7 17 G0 18 G1 19 G2 20 G3 21 G4 22 G5 23 G6 24 G7 25 R0 26 R1 26 R2 28 R3 29 R4 30 R5 31 R6 32 R7 33 GND 34 GND 35 CLK 36 VSYNC 37 LCD_EN 38 HSYNC 39 SCL 40 DISP_EN
Table 4-19: TFT LCD TTL Port Connector Pinouts
4.3 External Peripheral Interface Connectors
4.3.1 External Peripheral Interface Connector Overview
The WAFER-LX2 external peripheral interface connectors are listed below and shown in Figure 4-20:
1 x RJ-45 Ethernet connector
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1 x Serial communications port 2 x USB combo port 1 x VGA port
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WAFER-LX2 3.5” Embedded SBC
Figure 4-20: WAFER-LX2 On-board External Interface Connectors
4.3.2 RJ-45 Ethernet Connector
CN Label: CN5
CN Type:
CN Location: See
CN Pinouts: See
RJ-45
Figure 4-20
Table 4-20
The RJ-45 Ethernet connector on the WAFER-LX2 provides connectivity to a 10/100 megabit Ethernet connection between the WAFER-LX2 and a Local Area Network (LAN) through a network hub.
PIN NO. DESCRIPTION
1 TX+
2 N/C 3 TX-
4 RX+ 5 N/C
6 RX­7 N/C
8 N/C
Table 4-20: RJ-45 Ethernet Connector Pinouts
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WAFER-LX2 3.5” Embedded SBC
Figure 4-21: J7 Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green LED indicates activity on the port and the yellow LED indicates the port is linked.
SPEED LED LINK LED
Status Description Status Description
GREEN
Table 4-21: J7 Connector LEDs
ON: 100MB OFF: 10MB
YELLOW
ON: Linked Flashing: Activity
4.3.3 Serial Port Connector (COM 1)
CN Label: CN3
CN Type:
CN Location: See
CN Pinouts: See
The 9-pin DB-9 COM 1 serial port connector is connected to RS-232 serial communications devices.
DB-9 connector
Figure 4-20
Table 4-22 and Figure 4-22
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WAFER-LX2 3.5” Embedded SBC
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 DCD1 2 RXD1 3 TXD1 4 DTR1 5 GND 6 DSR1 7 RTS1 8 CTS1 9 COM_RI1
Table 4-22: RS-232 Serial Port (COM 1) Pinouts
Figure 4-22: COM1 Pinout Locations
4.3.4 USB Combo Port
CN Label: CN7 and CN8
CN Type:
CN Location: See
CN Pinouts: See
The two USB combo ports provide connectivity to USB devices. The USB port support both USB 1.1 and USB 2.0.
PIN NO. DESCRIPTION PIN NO. DESCRIPTION
1 VCC_USB 2 DATA1­3 DATA1+ 4 GND
USB Combo port
Figure 4-20
Table 4-23
5 VCC_USB 6 DATA2-
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7 DATA2+ 8 GND
Table 4-23: USB Connector Pinouts
4.3.5 VGA Connector
CN Label: CN1
WAFER-LX2 3.5” Embedded SBC
CN Type:
CN Location: See
CN Pinouts: See
The standard 15-pin female DB15 VGA connector connects to a CRT or LCD monitor directly.
PIN DESCRIPTION PIN DESCRIPTION PIN DESCRIPTION
1 RED 6 GROUND 11 NC 2 GREEN 7 GROUND 12 DDCDAT 3 BLUE 8 GROUND 13 HSYNC 4 NC 9 NC 14 VSYNC 5 GROUND 10 GROUND 15 DDCCLK
Table 4-24: VGA Connector Pinouts
DB15
Figure 4-20
Figure 4-23 and Table 4-24
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Figure 4-23: VGA Connector
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WAFER-LX2 3.5” Embedded SBC
Chapter
5

5 Installation

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5.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the WAFER-LX2 may result in permanent damage to the WAFER-LX2 and severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components, including the WAFER-LX2. Dry climates are especially susceptible to ESD. It is therefore critical that whenever the WAFER-LX2, or any other electrical component is handled, the following anti-static precautions are strictly adhered to.
WAFER-LX2 3.5” Embedded SBC
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the WAFER-LX2, place it on an
antic-static pad. This reduces the possibility of ESD damaging the WAFER-LX2.
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
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WAFER-LX2 3.5” Embedded SBC
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should be read and understood before the WAFER-LX2 is installed. All installation notices pertaining to the installation of the WAFER-LX2 should be strictly adhered to. Failing to adhere to these precautions may lead to severe damage of the WAFER-LX2 and injury to the person installing the motherboard.
5.2.1 Installation Notices
WARNING:
The installation instructions described in this manual should be carefully followed in order to prevent damage to the WAFER-LX2, WAFER-LX2 components and injury to the user.
Before and during the installation please DO the following:
Read the user manual:
o The user manual provides a complete description of the WAFER-LX2
installation instructions and configuration options.
Wear an electrostatic discharge cuff (ESD):
o Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
Place the WAFER-LX2 on an antistatic pad:
o When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
Turn all power to the WAFER-LX2 off:
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o When working with the WAFER-LX2, make sure that it is disconnected
from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-LX2 DO NOT:
Remove any of the stickers on the PCB board. These stickers are required for
warranty validation.
Use the product before verifying all the cables and power connectors are
properly connected.
Allow screws to come in contact with the PCB circuit, connector pins, or its
components.
5.2.2 Installation Checklist
The following checklist is provided to ensure the WAFER-LX2 is properly installed.
WAFER-LX2 3.5” Embedded SBC
All the items in the packing list are present (see Chapter 4) A compatible memory module is properly inserted into the slot (see Chapter
2)
The CF Type I or CF Type II card is properly installed into the CF socket The jumpers have been properly configured The WAFER-LX2 is installed into a chassis with adequate ventilation The correct power supply is being used The following devices are properly connected
o Audio kit o Power supply o Serial port cables
The following external peripheral devices are properly connected to the
chassis:
o VGA screen o RS-232 serial communications device o USB devices
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WAFER-LX2 3.5” Embedded SBC
5.3 SODIMM Installation and CF Card Installation
5.3.1 SODIMM Installation
WARNING:
Using an incorrectly specified SODIMM may cause permanent damage to the WAFER-LX2. Please make sure the purchased SODIMM complies with the memory specifications of the WAFER-LX2. SODIMM specifications compliant with the WAFER-LX2 are listed in Chapter 2.
To install a SODIMM into a SODIMM socket, please follow the steps below and refer Figure 5-1.
Figure 5-1: SODIMM Installation
Step 1: Locate the SODIMM socket. Place the WAFER-LX2 on an anti-static pad with
the solder side facing up.
Step 2: Align the SODIMM with the socket. The SODIMM must be oriented in such a
way that the notch in the middle of the SODIMM must be aligned with the plastic bridge in the socket.
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Step 3: Insert the SODIMM. Push the SODIMM chip into the socket at an angle. (See
Figure 5-1)
Step 4: Open the SODIMM socket arms. Gently pull the arms of the SODIMM socket
WAFER-LX2 3.5” Embedded SBC
out and push the rear of the SODIMM down. (See
Step 5: Secure the SODIMM. Release the arms on the SODIMM socket. They clip into
place and secure the SODIMM in the socket.Step 0:
Figure 5-1)
5.3.2 CF Card Installation
Note:
The WAFER-LX2 can support both CF Type I cards and CF Type II cards. For the complete specifications of the supported CF cards please refer to Chapter 2.
To install the a CF card (Type 1 or Type 2) onto the WAFER-LX2, please follow the steps below:
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Step 1: Locate the CF card socket. Place the WAFER-LX2 on an anti-static pad with
the solder side facing up. Locate the CF card.
Step 2: Align the CF card. Make sure the CF card is properly aligned with the CF
socket.
Step 3: Insert the CF card. Gently insert the CF card into the socket making sure the
socket pins are properly inserted into the socket. See
Figure 5-2. Step 0:
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WAFER-LX2 3.5” Embedded SBC
Figure 5-2: CF Card Installation
5.4 Jumper Settings
NOTE:
A jumper is a met al bridge t hat is used to close an electrical circuit. It consists of two metal pins and a small metal clip (often protected by a plastic cover) that slides over the pins to connect them. To CLOSE/SHORT a jumper means connecting the pins of the jumper with the plastic clip and to OPEN a jumper means removing the plastic clip from a
Jumper
jumper.
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Before the WAFER-LX2 is installed in the system, the jumpers must be set in accordance
WAFER-LX2 3.5” Embedded SBC
with the desired configuration. The jumpers on the WAFER-LX2 are listed in
Description Label Type
AT power select JP4 2-pin header
COM 1 Pin 9 setting JP1 5-pin header
COM 2 function select JP3 5-pin header
LCD voltage select JP2 3-pin header
LCD clock select JP5 3-pin header
Table 5-1: Jumpers
5.4.1 AT Power Select Jumper Settings
Jumper Label: JP4
Table 5-1.
Jumper Type:
Jumper Settings: See
Jumper Location: See
The AT Power Select jumper specifies the systems power mode as AT or ATX. AT Power Select jumper settings are shown in connected to an ATX power supply, the system will automatically turn on.
AT Power Select Description
Short Use AT power Default
Open Use ATX power
Table 5-2: AT Power Select Jumper Settings
The location of the AT Power Select jumper is shown in Figure 5-3 below.
2-pin header
Table 5-2
Figure 5-3
Table 5-2. If the AT power is used and the system is
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WAFER-LX2 3.5” Embedded SBC
Figure 5-3: AT Power Select Jumper Location
5.4.2 Clear CMOS Jumper
Jumper Label: CN22
Jumper Type:
Jumper Settings: See
Jumper Location: See
If the WAFER-LX2 fails to boot due to improper BIOS settings, the CMOS can be cleared using the battery connector. Disconnect the battery from the connector for a few seconds then reconnect the battery. The CMOS should be cleared.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
2-pin header
Table 5-3
Figure 5-4
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the following:
Enter the correct CMOS setting
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Load Optimal Defaults Load Failsafe Defaults.
After having done one of the above, save the changes and exit the CMOS Setup menu.
WAFER-LX2 3.5” Embedded SBC
The clear CMOS jumper settings are shown in
AT Power Select Description
Short Keep CMOS Setup Default
Open Clear CMOS Setup
Table 5-3: CN22 Clear CMOS Jumper Settings
The location of the clear CMOS jumper is shown in Figure 5-4 below.
Table 5-3.
Figure 5-4: CN22 Clear CMOS Jumper
5.4.3 COM 1 Pin 9 Setting Jumper
Jumper Label: JP1
5-pin header
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Jumper Type:
Jumper Settings: See
Jumper Location: See
Table 5-4
Figure 5-5
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WAFER-LX2 3.5” Embedded SBC
The COM 1 Pin 9 Setting jumper configures pin 9 on COM 1 as either a +5V, +12V power source or as a ring-in (RI) line. The COM 1 Pin 9 Setting jumper selection options are shown in
Table 5-4.
COM 1 RI Pin Description
Short 1 – 2 COM 1 RI Pin use RI Default
Short 2 – 3 COM 1 RI Pin use +5V
Short 3 – 4 COM 1 RI Pin use +5V
Short 4 – 5 COM 2 RI Pin use +12V
Table 5-4: COM 1 Pin 9 Setting Jumper Settings
The COM 1 Pin 9 Setting jumper location is shown in Figure 5-5 below.
Figure 5-5: COM 1 Pin 9 Setting Jumper Location
5.4.4 COM 2 Function Select Jumper
Jumper Label: JP3
Jumper Type:
3-pin header
Jumper Settings: See
Jumper Location: See
Table 5-7
Figure 5-8
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The COM 2 Function Select jumper sets the communication protocol used by the second serial communications port (COM 2) as RS-232, RS-422 or RS -485. The COM 2 Function
WAFER-LX2 3.5” Embedded SBC
Select settings are shown in
COM 2 Function Select Description
Short 1-2 RS-232 Default
Short 2-3 RS-422
Short 3-4 RS-422
Short 4-5 RS-485
Table 5-5: COM 2 Function Select Jumper Settings
The COM 2 Function Select jumper location is shown in Figure 5-8.
Table 5-7.
Figure 5-6: COM 2 Function Select Jumper Location
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WAFER-LX2 3.5” Embedded SBC
5.4.5 LCD Voltage Selection
WARNING:
Permanent damage to the screen and WAFER-LX2 may occur if the wrong voltage is selected with this jumper. Please refer to the user guide that came with the monitor to select the correct voltage.
Jumper Label: JP2
Jumper Type:
Jumper Settings: See
Jumper Location: See
The LCD Voltage Selection jumper allows the LCD screen voltage to be set. The LCD Voltage Selection jumper settings are shown in
AT Power Select Description
Short 1-2 +3.3V LVDS Default
Short 2-3 +5V LVDS
Table 5-6: LCD Voltage Selection Jumper Settings
The LCD Voltage Selection jumper location. is shown in Figure 5-7.
3-pin header
Table 5-6
Figure 5-7
Table 5-6.
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WAFER-LX2 3.5” Embedded SBC
Figure 5-7: LCD Voltage Selection Jumper Location
5.4.6 LCD Clock Select Jumper
Jumper Label: JP5
Jumper Type:
Jumper Settings: See
Jumper Location: See
The LCD Clock Select jumper enables the LCD clock to be inverted. The LCD Clock Select settings are shown in
LCD Clock Select Description
Short 1-2 Normal LCD Clock Default
3-pin header
Table 5-7
Figure 5-8
Table 5-7.
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Short 2-3 Inverted LCD Clock
Table 5-7: LCD Clock Select Jumper Settings
The LCD Clock Select jumper location is shown in Figure 5-8.
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WAFER-LX2 3.5” Embedded SBC
Figure 5-8: LCD Clock Select Jumper Select Jumper Location
5.5 Chassis Installation
5.5.1 Airflow
WARNING:
Airflow is critical to the cooling of the CPU and other onboard components. The chassis in which the WAFER-LX2 must have air vents to allow cool air to move into the system and hot air to move out.
The WAFER-LX2 must be installed in a chassis with ventilation holes on the sides allowing airflow to travel through the heat sink surface. In a system with an individual power supply unit, the cooling fan of a power supply can also help generate airflow through the board surface.
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WAFER-LX2 3.5” Embedded SBC
5.5.2 Motherboard Installation
To install the WAFER-LX2 motherboard into the chassis please refer to the reference material that came with the chassis.
5.6 Internal Peripheral Device Connections
5.6.1 Peripheral Device Cables
The cables listed in Table 5-8 are shipped with the WAFER-LX2.
Quantity Type
1 ATA 66/100 flat cable
1 Audio cable
2 Four COM port cable
Table 5-8: IEI Provided Cables
5.6.2 ATA Flat Cable Connection
The ATA 66/100 flat cable connects to the WAFER-LX2 to one or two IDE devices. To connect an IDE HDD to the WAFER-LX2 please follow the instructions below.
Step 1: Locate the IDE connector. The location/s of the IDE device connector/s is/are
shown in Chapter 3..
Step 2: Insert the connector. Connect the IDE cable connector to the onboard
connector. See can only be inserted in one direction.
Figure 5-9. A key on the front of the cable connector ensures it
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WAFER-LX2 3.5” Embedded SBC
Figure 5-9: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable corresponds to pin 1 on the connectorStep 0:
5.6.3 Audio Kit Installation
The Audio Kit that came with the WAFER-LX2 connects to the 10-pin audio connector on the WAFER-LX2. The audio kit consists of three audio jacks. One audio jack, Mic In, connects to a microphone. The remaining two audio jacks, Line-In and Line-Out, connect to two speakers. To install the audio kit, please refer to the steps below:
Step 1: Locate the audio connector. The location of the 10-pin audio connector is
shown in Chapter 3.
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Step 2: Align pin 1. Align pin 1 on the onboard connector with pin 1 on the audio kit
connector. Pin 1 on the audio kit connector is indicated with a white dot. See
Figure 5-10.
WAFER-LX2 3.5” Embedded SBC
Figure 5-10: IDE Cable Connection
Step 3: Connect the cable to an IDE device. Connect the two connectors on the other
side of the cable to one or two IDE devices. Make sure that pin 1 on the cable corresponds to pin 1 on the connectorStep 0:
5.6.4 Four Serial Port Connector Cable
The WAFER-LX2 is shipped with two four serial port connector cables. The four serial port connector cable connects four serial port connectors on the cable to the 40 pin serial port connectors on the WAFER-LX2. To connect the four serial port connector cable please follow the steps below.
Step 1: Locate the serial port connector. The location of the 40-pin serial port
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WAFER-LX2 3.5” Embedded SBC
connector is shown in Chapter 3.
Step 2: Align the connectors. Correctly align pin 1 on the cable connector with pin 1 on
the WAFER-LX2 serial port COM connector. See
Step 3: Insert the cable connectors. Once the cable connector is properly aligned with
the serial port COM connector on the WAFER-LX2, conne ct the cable connector to the onboard connectors. See
Figure 5-11.
Figure 5-11.
Figure 5-11: Four Serial Port Connector Cable Connection
Step 4: Attach DB-9 serial port connectors to the chassis. The four DB-9 serial port
connectors can be inserted into four preformed holes in the chassis. Once, inserted the DB-9 connectors should be secured to the chassis with the retention screws.Step 0:
5.7 External Peripheral Interface Connection
The following external peripheral devices can be connected to the external peripheral interface connectors.
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Serial port devices USB devices VGA monitors RJ-45 Ethernet cable connectors
WAFER-LX2 3.5” Embedded SBC
To install these devices, connect the corresponding cable connector from the actual device to the corresponding WAFER-LX2 external peripheral interface connector making sure the pins are properly aligned.
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WAFER-LX2 3.5” Embedded SBC
Chapter
6

6 AWARD BIOS

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6.1 Introduction
A licensed copy of Phoenix Award BIOS is preprogrammed into the ROM BIOS. The BIOS setup program allows users to modify the basic system configuration. This chapter describes how to access the BIOS setup program and the configuration options that may be changed.
6.1.1 Starting Setup
The Phoenix Award BIOS is activated when the computer is turned on. The setup program can be activated in one of two ways.
WAFER-LX2 3.5” Embedded SBC
1. Press the D
2. Press the D appears on the screen.
If the message disappears, restart the computer and try again.
ELETE key as soon as the system is turned on or ELETE key when the “Press Del to enter SETUP” message
6.1.2 Using Setup
Use the arrow keys to highlight items, press ENTER to select, use the PAGEUP and P
AGEDOWN keys to change entries, press F1 for help and press ESC to quit. Navigation
keys are shown below.
Key Function
Up arrow Move to the item above Down arrow Move to the item below Left arrow Move to the item on the left hand side Right arrow Move to the item on the right hand side
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+/Page up Increase the numeric value or make changes
-/Page down Decrease the numeric value or make changes Esc Main Menu – Quit and do not save changes into CMOS
Status Page Setup Menu and Option Page Setup Menu -­Exit current page and return to Main Menu
F1 General help, only for Status Page Setup Menu and Option
Page Setup Menu
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WAFER-LX2 3.5” Embedded SBC
F2 Item help F5 Previous values for the page menu items F6 Fail-safe defaults for the current page menu items F7 Optimized default s for the current page menu items F9 Menu in BIOS F10 Save changes and Exit BIOS
Table 6-1: BIOS Navigation Keys
6.1.3 Getting Help
When F1 is pressed a small help window describing the appropriate keys to use and the possible selections for the highlighted item appears. To exit the Help Window press E the F1 key again.
SC or
6.1.4 Unable to Reboot After Configuration Changes
If the system cannot be booted after changes are made, restore the CMOS defaults. The CPU card should come with a restore CMOS settings jumper. Refer to Section ?? for more information.
6.1.5 Main BIOS Menu
Once the BIOS opens, the main menu (BIOS Menu 1) appears.
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BIOS Menu 1: Award BIOS CMOS Setup Utility
WAFER-LX2 3.5” Embedded SBC
NOTE:
The following sections will completely describe the menus listed below and the configuration options available to users.
The following menu options are seen in BIOS Menu 1.
Standard CMOS Features: Changes the basic system configuration. Advanced BIOS Features: Changes the advanced system settings. Advanced Chipset Features: Changes the chip set configuration features. Integrated Peripherals: Changes the settings for integrated peripherals. Power Management Setup: Configures power saving options. PnP/PCI Configurations: Changes the advanced PCI/PnP settings.
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The following user configurable options are also available in
BIOS Menu 1:
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