IBM 7380E1U, x3500 M3 Datasheet

IBM Systems and Technology
Data Sheet
Highlights
Enables high availability with enhanced RAID support and integrated systems management tools
Leverages latest Intel® Xeon® technol- ogy for faster processing speeds and energy-smart design
System x
IBM System x3500 M3
High-performance, flexible tower server that provides an all-in-one IT solution beside your desk
Grow at your own pace
A high-performance dual-socket tower server, the IBM System x3500 M3 provides generous bandwidth, storage and expanded memory capacity up to 192 GB. Start with a single Intel Xeon six-core processor, and add a second to double your processing capability. You can even add processors, storage and memory independently of one another for maximum configu­ration flexibility.
Stay up and running
The x3500 M3 is designed to run your most demanding business applica­tions reliably. It offers new 6 Gbps RAID, storage, memory and I/O flexi­bility, and high availability, while integrated systems management tools provide remote control of resources for simplified serviceability.
Build on the latest technology
The x3500 M3 takes advantage of the latest Intel Xeon technology with extreme processing power and superior energy efficiency. Low-voltage memory, cooling features and energy-smart design enable lower power, lower heat and less noise. At the same time, IBM Systems Director Active Energy Manager™ can help you keep costs down and track, monitor and measure power consumption.
Select configurations of the x3500 M3 are part of the IBM Express Advantage® Portfolio designed to meet the needs of midsized businesses. Easy to manage, Express® models and configurations vary by country.
IBM System x3500 M3 at a glance
Form factor/height
Processor (max)
Number of processors (std/max)
Cache (max)
Memory (ma x)
Expansion slots
Disk bays
(total/hot-swap)
Maximum internal storage
Network interface
RAID support
Systems management
Operating systems supported
Tower/5U (rack-mountable)
Intel Xeon 5500/5600 processors (six-core Intel Xeon X5690 3.46 GHz or four-core Intel Xeon X5687 3.60 GHz up to
6.4 GTps QPI system speed)
1/2
12 MB
16 DIMM slots maximum, 192 GB with DDR-3 1333 MHz RDIMMs or 48 GB with DDR-3 1333 MHz UDIMMs
Six PCIe and one PCI standard; additional two PCI-X available via configure to order and requires removal of one PCIe slot
8/8 or 16/16 2.5" hot-swap standard; 24/24 2.5" hot-swap or 8/8 3.5" hot-swap or 4/0 3.5" simple swap (available via con­figure to order only)
24 TB
1
of 2.5" hot-swap SAS/SATA
(HDD upgrade options required) or
16.0 TB of 3.5" hot-swap SAS/SATA (via configure to order only)
Broadcom 5709S onboard NIC with dual Gigabit Ethernet ports with TOE
Integrated 6 Gbps or 3 Gbps hardware RAID-0, -1, -1E, optional RAID-5, -6, -10,
-50, -60
Automatic Server Restart; Predictive Failure Analysis on hard disk drives, processors, voltage regulator modules (VRMs), fans and memory; light path diag­nostics; integrated management module; remote presence; IBM Systems Director and IBM Systems Director Activ
e Energy
Manager
Microsoft® Windows® Server 2008 R2, Red Hat Enterprise Linux
®, SUSE Linux
Enterprise, VMware ESX and ESXi
Limited warranty 3-year customer replaceable unit and
onsite limited warranty
1
© Copyright IBM Corporation 2011
IBM Systems and Technology Group Route 100 Somers, New York 10589
Produced in the United States of America February 2011 All Rights Reserved
IBM, the IBM logo, ibm.com and System x are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the web at “Copyright and trademark information” at
Intel and Intel Xeon are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
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Available in 2Q 2011.
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