97511_1_12_20130417_1200.sch-1 - Fri May 24 15:20:33 2013
Project : MT6572
REF_SCH TOP LEVEL
Memory
MCP
micro SD
+ hot-plug
CMMB
Camera
Module
2nd Camera
Module
LCD
module
CTP
controller
Motion
Sensor
ALS + PXS
Magnetic
sensor
Gyro
sensor
Keypad
Debug
port
EMI x32
NFI
MSDC 4-bit
EINT
Camera IF
Camera IF
LCD IF
I2C
EINT
I2C
EINT
I2C
EINT
I2C
EINT
I2C
EINT
JTAG
UART
I2C
EMI
NFI
MSDC1
SPI
CAM
(MIPI / Parallel)
i2C_0
LCD
(MIPI / Parallel)
i2C_1
MT6572
ABB
USB
BPI, APC
RF IQ
BSI ctrl
26M_BB
26M_CN
CONN IQ
CONN ctrl
32K_BB
AUD I/F
SPI
BC1.1
USB 2.0
26M_AUD
POWER
MT6166
DCXO ctrl
26M_CN
MT6627
MT6323
Power
Management
Charger
Audio
Speech
Charger
BJT
RTC
FEM
TX
RX
balun
26M
TCXO
32K
Headset
(HPL, HPR, AU_VIN1)
Class D/AB
Receiver
AU_VIN0
SIM2
SIM1
VIB
Celullar ANT
RX
Connectivity ANT
SIM2
SIM1
Battery
micro USB
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VIO18_PMU
VIO18_PMU
VUSB_PMU
cap Close to BB IC
C101
100nF
C107
100nF
dedicate VSS ball, must return to cap then to main GND:
1. REFN(G6) => C109
2. DVSS18_MIPIRX(U25) => C107
3. DVSS18_MIPITX(P25) => C101
VIO18_PMU
VIO18_PMU
VUSB_PMU
1uF
C113
C104
100nF
T25
U25
R25
P25
H23
G24
G23
REFP
1uF
C109
DVDD18_MIPIRX
DVSS18_MIPIRX
DVDD18_MIPITX
DVSS18_MIPITX
AVDD18_USB
AVDD33_USB
AVSS33_USB
BG
F6
REFP
G6
REFN
BGA428-10.7X10.7-0.4E0.25B(MT6572)
U101-H
AVDD28_DAC
AVDD18_AP
DVDD18_PLLGP
AVDD18_MD
AVSS18_MD
AVSS18_MD
AVSS18_MD
AVSS18_MD
cap Close to BB IC
VTCXO_PMU
F1
E5
VIO18_PMU
U9
D3
A1
A4
C3
E2
C108
100nF
100nF
C128
0.1uF
C112
100nF
C122
VTCXO_PMU
VIO18_PMU
VIO18_PMU
U101-B
VCCIO_EMI
VCC
VCCIO_EMI
Memory
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
VSS
VSS
VSS
VSS
VSS
VSS
DUMMY
DVDD
Peripheral
VCC
CPU
VCC
Core
VCCIO_EMI
VCCIO_EMI
VCCIO_EMI
DVDD18_MC0
DVDD18_CAM
DVDD18_VIO_1
DVDD18_VIO_2
DVDD18_VIO_3
DVDD18_LCD
DVDD3_MC1
DVDD3_LCD
DVDD28_BPI
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
VCCK_CPU
AC21
AD11
AF13
AB11
AC8
AB5
AB14
W26
T15
W23
T14
AF26
G3
K21
L11
L12
L14
L15
L16
M5
M11
M12
M13
M14
M15
M16
N10
N8
N9
N11
N12
N13
N14
N15
N16
P10
N22
P11
P12
P13
P14
P15
P16
R10
R11
R12
R13
R14
R15
R16
T10
T11
T12
T13
AF1
U10
U11
V13
W11
Y21
A26
BGA428-10.7X10.7-0.4E0.25B(MT6572)
C405
100nF
1uF
1uF
1uF
C135
C134
C120
4mil - defferential - GND shielding
1uF
C119
VIO_EMI
C406
VMC_PMU
VIO28_PMU
2.2uF
C136
If double-sided SMT, put C405 & C406 below BB.
100nF
If single-sided SMT, put C405 & C406 around memory.
C121
1uF_NF
120mil
10uF
10uF
10uF
C111
2.2uF
C137
C103
C106
C102
4.7uF
HT1
GND
HT2
0
R119
Based on your system level
design , if better FM performance
is needed on your system ,
please refer to FM desense
performance enhance proposal
Vproc remote sense :
differential 4mil with good shielding, from the BB to PMIC
VIO18_PMU
1uF
C126
VPROC_PMU
[3]
[4]GND_VPROC_FB
[4]VPROC_FB
[3]
[2,4]VPROC_PMU
[3]
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1.8V IO for DDR1
W9
W12
1.2V IO for DDR2
W14
W16
W19
C124
AA1
K20
L3
J19
H13
AB24
K24
W24
C10
P6
T7
P7
P8
P9
R6
R7
R8
R9
T6
U6
T9
T8
U7
J9
VCCK
J15
VCCK
M9
VCCK
K6
VCCK
K7
VCCK
K8
VCCK
K9
VCCK
K11
VCCK
K14
VCCK
K15
VCCK
M10
VCCK
K16
VCCK
K17
VCCK
U17
VCCK
M17
VCCK
L7
VCCK
L8
VCCK
L9
VCCK
L17
VCCK
M6
VCCK
M7
VCCK
M8
VCCK
J17
VCCK
J16
VCCK
R17
VCCK
T16
VCCK
L6
VCCK
K12
VCCK
T17
VCCK
J10
VCCK
J11
VCCK
U12
VCCK
U13
VCCK
U14
VCCK
U15
VCCK
U16
VCCK
J8
VCCK
J14
VCCK
100nF
VIO18_PMU
VIO18_PMU
VIO18_PMU
VIO18_PMU
VIO18_PMU
DVDD18_LCD
VMC_PMU
DVDD18_LCD
VIO28_PMU
1uF
C117
Close to BB IC, recommand < 150mil
100nF
100nF
100nF
C114
C118
C115
100nF
C116
97511_1_12_20130417_1200.sch-3 - Fri May 24 15:20:34 2013
[13]
[13]
[13]
[13]
100-ohm differential
100-ohm differential
close to BB
U101-A
D2
[6]
[7]RX_I_P
DL_I_P
C2
[6]
[7]RX_I_N
DL_I_N
B1
[6]
[7]RX_Q_P
DL_Q_P
C1
[6]
[7]RX_Q_N
DL_Q_N
A2
[6]
[7]TX_I_P
UL_I_P
B2
[6]
[7]TX_I_N
UL_I_N
B4
[6]
[7]TX_Q_P
UL_Q_P
B3
[6]
[7]TX_Q_N
UL_Q_N
A8
VM1
[7]TXBPI
[8]VAPC1
MIPI_TDN2
MIPI_TDP2
R202
1.5k
A7
D5
F2
F3
[11]GPIO_CMPDN2
[11]GPIO_CMRST2
[11]GPIO_CMPDN
[11]GPIO_CMRST
[11]MIPI_RDN0
[11]MIPI_RDP0
[11]MIPI_RDN1
[11]MIPI_RDP1
[11]MIPI_RCN
[11]MIPI_RCP
[10]MIPI_TDN0
[10]MIPI_TDP0
[10]MIPI_TDN1
[10]MIPI_TDP1
[10]MIPI_TCN
[10]MIPI_TCP
MIPI_VRT
VM0
VM1
TXBPI
APC
VBIAS
BGA428-10.7X10.7-0.4E0.25B(MT6572)
[8] VM0
[8]
[6]
[6]
[13]
[13]
[13]
[13]
[13]
[13]
[12]
[12]
[12]
[12]
[12]
[12]
BPI_BUS0
BPI_BUS1
BPI_BUS2
BPI_BUS3
BPI_BUS4
BPI_BUS5
BPI_BUS6
BPI_BUS7
BPI_BUS8
BPI_BUS9
BPI_BUS10
BPI_BUS11
BPI_BUS12
BPI_BUS13
BPI_BUS14
BPI_BUS15
BSI_DATA2
BSI_DATA1
BSI_DATA0
BSI_EN
BSI_CLK
U101-G
L25
CMPDN2
K25
CMRST2
H22
CMPDN
J22
CMRST
R24
RDN0
MIPI_CAM
R23
RDP0
R22
RDN1
R21
RDP1
R26
RCN
T26
RCP
P19
TDN0
MIPI_LCD
P20
TDP0
N25
TDN1
N26
TDP1
P23
TDN2
P24
TDP2
N20
TCN
N19
TCP
P26
VRT
BGA428-10.7X10.7-0.4E0.25B(MT6572)
B12
B11
C12
A11
D11
C11
A13
A10
B10
D10
E9
E8
B9
B8
E7
D7
D6
C7
F9
F11
G11
Based on your system level design , if better
desense performance is needed on your
system , please refer to desense
performance enhance proposal
MIPI_2nd_CAM
Parallel 8-bit
CMMCLK
CMPCLK
RCN_A
RCP_A
RDN1_A
RDP1_A
RDN0_A
RDP0_A
CMDAT3
CMDAT2
CMDAT1
CMDAT0
[6]
[7,8]BPI_0
[6]
[7,8]BPI_1
[6]
[7,8]BPI_2
[6]
[7,8]BPI_3
[6]EINT_HP
[5]
[8]
W_PA_B1_EN
[8]
W_PA_B2_EN
[8]W_PA_B8_EN
[80]
[16]EINT_MAG
[16]EINT_ALPXS
[16]EINT_ACC
[16]EINT8_ACC1
[6]
[7]BSI-A_DAT2
[6]
[7]BSI-A_DAT1
[6]
[7]BSI-A_DAT0
[6]
[7]BSI-A_EN
[6]
[7]BSI-A_CK
Y22
[11]CMMCLK
Y23
[11]CMPCLK
V25
W25
V24
[11]CMDAT7
V23
[11]CMDAT6
U22
[11]CMDAT5
U21
[11]CMDAT4
Y26
[11]CMDAT3
Y25
[11]CMDAT2
AA25
[11]CMDAT1
AB25
[11]CMDAT0
[3]
[4]AUD_MISO
[3]
[4]AUD_CLK
[3]
[4]AUD_MOSI
[3]
90-ohm differential
[9]USB_DM
[9]USB_DP
close to BB
[3,4]
[3,6]
[6]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[4] BAT_ID_ADC
[4,7]SRCLKENA
[4]EINT_PMIC
[3,4]SIM1_SCLK
[4]SIM1_SIO
[4]SIM2_SCLK
[4]SIM2_SIO
[7]CLK1_BB
[4]CLK32K_BB
[4]RESETB
[3]
[3]
R203
5.1K
[13]
[13]
[12,21]
[12,21]
SPI_MISO
[80]
SPI_MOSI
[80]
SPI_SCK
[80]
SPI_CSB
[80]
[18]
[18]
[18]
[18]
[18]
[18]
[12]GPIO_GPS_LNA_EN
[21]
[21]
[13]
[13]
[13]
[11]CMVSYNC
[13]
[11]CMHSYNC
[13]
[13]
[13]
[13]
[13]
[13]
[13]
[13]
[14]
[14]
[4,5]PMIC_SPI_CS
[4,5]WATCHDOG
[10]LCD_ID_ADC
[4]PMIC_SPI_MOSI
[4]PMIC_SPI_MISO
[4]PMIC_SPI_SCK
[4]CHD_DP
[4]CHD_DM
USB_VRT
[3,11]SCL_0
[3,11]SDA_0
[3,10,16]SCL_1
[3,10,16]SDA_1
[14]MC1CMD
[14]MC1CK
[14]MC1DAT0
[14]MC1DAT1
[14]MC1DAT2
[14]MC1DAT3
U101-D
J1
AUD_DAT_MISO
K5
AUD_CLK_MOSI
K1
AUD_DAT_MOSI
L2
PMIC_SPI_MOSI
L5
PMIC_SPI_MISO
L4
PMIC_SPI_SCK
K2
PMIC_SPI_CSN
G2
WATCHDOG
H4
SRCLKENA
J2
EINTX
H5
SIM1_SCLK
M3
SIM1_SIO
J5
SIM2_SCLK
M1
SIM2_SIO
BGA428-10.7X10.7-0.4E0.25B(MT6572)
U101-E
E1
CLK26M
H2
CLK32K_IN
M2
SYSRSTB
G4
TESTMODE
AC24
FSOURCE
J26
CHD_DP
J25
CHD_DM
G26
USB_DM
G25
USB_DP
H25
USB_VRT
C25
SCL_0
C26
SDA_0
B24
SCL_1
B23
SDA_1
F24
SPI_MISO
F25
SPI_MOSI
F23
SPI_SCK
E23
SPI_CS
K23
MC1_CMD
L21
MC1_CK
K22
MC1_DAT0
M22
MC1_DAT1
M25
MC1_DAT2
L26
MC1_DAT3
B7
AUX_IN0
B6
AUX_IN1
C5
AUX_IN2_XP
B5
AUX_IN3_YP
C4
AUX_IN4_XM
A5
AUX_IN5_YM
SYSTEM
BC 1.1
USB 2.0
i2C
SPI
T-flash
ADC
reserve for JTAG debug
VIO18_PMU
R210
[3,4]SIM1_SCLK
20K_NF
Normal : NC
JTAG : 20K
Reserve R footprint
for JTAG debugging
D12
PWM_A
PWM
E12
PWM_B
LCD
N1
LPD17
Parallel
N2
LPD16
N3
LPD15
P2
LPD14
N4
LPD13
R2
LPD12
N5
LPD11
R1
LPD10
P5
LPD9
T1
LPD8
R5
LPD7
T2
LPD6
T5
LPD5
U2
LPD4
T3
LPD3
U5
LPD2
T4
LPD1
V2
LPD0
AD25
LPCE0B
AB26
LPTE
AC26
LRSTB
AA22
LPRDB
AB23
LPA0
AC25
LPWRB
B25
KROW0
KP
A24
KROW1
B26
KROW2
C24
KCOL0
D24
KCOL1
A25
KCOL2
E25
UTXD1
UART
D25
URXD1
E26
UTXD2
F26
URXD2
EINT_CMMB
GPIO_TV_RST
KROW1
[15]KCOL1
[11]GPIO_FLASH_EN
[80]
[12]
[10]EINT_CTP
[10]LCD_BL_CTL
[80]
[14]MC1_INS
[18]
[80]
[16]EINT_GY
[12]
[10]LPTE
[12]
[10]GPIO_LRSTB
[11]GPIO_FLASH_SEL
[80]
[80]
[10]GPIO_CTP_RSTB
[12]
[20]
[15]KROW0
[20]
[20]
[9,15]KCOL0
MT6572 support JTAG from below :
1. KP (recommand)
KROW2
2. MC1
KCOL2
3. CAM
for JTAG pin out from MC1/CAM, refer
to HW design notice
UTXD1
URXD1
KROW2
TP205
KCOL2
TP206
TP201
TP202
VCAMD_IO_PMU
2.2K
2.2K
R204
[12,21]
[12,21]
[13]
[13]
R205
Power by CAM_IO
[3,11]SCL_0
[3,11]SDA_0
VIO18_PMU
2.2K
2.2K
R207
R206
[3,10,16]SCL_1
[3,10,16]SDA_1
Power by CTP, MEMS sensor
BGA428-10.7X10.7-0.4E0.25B(MT6572)
TITLE:
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COMPANY:
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02_MT6572_BASEBAND
Hardware DEPT.
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97511_1_12_20130417_1200.sch-4 - Fri May 24 15:20:36 2013
Before you select BJT , please take power dissipation into consideration.
Refer to MT6323 design notice
Charger
VBUS
1. Close to Battery Connector.
(Rsense (R328) <10mm)
2. Main path should be 40mil.
(VBUS -> U303's E, -> U303's C -> R328 -> VBAT)
3. Star connection from R328 to BAT Connector
BATTERY
CON301
CONNECTOR
BBATTCON-BAC3290400
TP9
1
TP-1.0MM
cap rating depends on
Phone OVP spec.
C
C
16
TP-1.0MM
TP310
1
2
3
4
5
6
Based on your system level design , if
better ESD performance is needed on
your system, please refer to ESD
performance enhance proposal
VR310
VIBR_PMU
Vibra
1uF
52
E
C
U303
40mils
BC
34
Rsense
TP-1.0MM
TP312
TP-1.0MM
TP311
1
1
40mils 40mils
VR301
VR302
R360
1K
1
AUDIO-CON_SPK(MIC-RE-MOT)
C311
1
AUDIO-CON_SPK(MIC-RE-MOT)
R329
330K
1uF
C329
40mils
40mils
4mil
40mils
0.2
R328
SR0805
4mil
40mils
AUXADC_REF
1
R334
16.9K
R335
27K
[2,3,4,5,7,10,14,16]
VIO18_PMU
R361
20K
BAT_ID_ADC
[4]VCDT
VCDT rating: 1.268V
VCDT rating: 1.268V
R324
39K
R331
3.3K
1
G
U305
3
D
2
[4]VDRV
S
FET-N-2SK3541T2L
HT303
Differential
HT304
[6]
[4,7]AUXADC_REF
R317
1K
R334,R335 must to be close to
PMIC AUXADC_REF pin
if battery NTC is 10kohm, R334=16.9K, R335=27K
if battery NTC is 47kohm, R334=61.9K, R335=100K
Refer to MT6323 HW design notic
[3]
[4]ISENSE
[4]BATSNS
VBAT
[6]
[4,7,8,10,11,15]VBAT
[4]BAT_ON
e
[4]CHR_LDO
[6]
Add Zenar Diode
Place on the path
from VBAT to IC
(Battery connector
or test point or IO
connector)
VF : 4.85V~5.36V
Between IC and IO port
Refer to MT6323 design
notice for Zener selection
CON3
CON4
VBAT
80mil
500mW
10uF
C310
D302
21
Refer to MT6323 design notice
for Buck GND layout rule
C330
Based on your system level design , if
better EOS performance is needed on your
system, please refer to EOS performance
enhance proposal
10uF_NF
VSYS_PMU
VIO18_PMU
ISENSE/BSTSNS 4mil
[6]
[4]BATSNS
differential to Rsense
[4]ISENSE
[4]BAT_ON
[4]VCDT
[4]VDRV
[4]CHR_LDO
1uF
C316
Close to PMIC
40mil
4mil (VPA no use)
15mil
20mil
20mil
20mil
20mil
10uF
C301
VBAT
VBAT
VBAT
VBAT
VBAT
10uF
C303
1uF
10uF
10uF
C304
C306
C309
refer to system analog LDO
performance improve proposal
Refer to GPS co-clock layout rule
VBAT
VA_PMU
C322 must to be close
to PMIC AUXADC_TSX pin
1uF
1uF
C350
4.7uF
Connect TSX/XTAL GND
to AUXADC_GND first
C307
C308
than connect to main GND
CHARGER
VBAT INPUT
SIM LVS
AUDIO
AUXADC
H10
U301
K1
[9]AU_SPKP
SPK_P
SPK_N
AU_HSP
AU_HSN
AU_HPL
AU_HPR
ISINK0
DRIVER
ISINK1
ISINK2
ISINK3
BUCK OUTPUT
VPROC
VPROC
VPROC
VPROC_FB
GND_VPROC_FB
VPA
VPA
VPA_FB
VSYS
ALDO OUTPUT
VA
VCN28
VTCXO
VCAMA
VCN33
AVDD33_RTC
DLDO OUTPUT
VM
VRF18
VIO18
VIO28
VCN18
VCAMD
VCAM_IO
VEMC_3V3
VMC
VMCH
VUSB
VSIM1
VSIM2
VGP1
VIBR
VGP2
VGP3
VCAM_AF
VREF
GND_VREF
RTC_32K1V8
RTC
RTC_32K2V8
XIN
XOUT
GND_ISINK
GND_VSYS
GND_VPA
GND_VPROC
GND_VPROC
GND_VPROC
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDO
GND_LDOG8GND_LDOG9GND_LDOH6GND_LDOH7GND_LDOJ9GND_LDOJ8GND_LDOJ7GND_LDOJ6GND_LDO
GND_LDOH9GND_LDO
GND_LDO
GND_LDO
H8
H5
G7
[5]
L1
[9]AU_SPKN
[5]
H1
[6]AU_HSP
[5]
G1
[6]AU_HSN
[5]
H4
[6]AU_HPL
[5]
J4
[6]AU_HPR
[5]
E9
ISINK0
[12]
C9
ISINK1
[12]
E10
ISINK2
[12]
C10
[15]ISINK3
[12]
Please use inductor recommand by MTK
Refer to MT6323 design notice
C14
D14
E14
B12
C12
A14
B14
D12
H14
M3
N3
L4
P3
M6
C3
J13
H11
L12
M4
J12
K14
L13
P7
L6
P4
N6
P9
N9
L8
M7
N8
L14
N7
P14
N14
D5
C4
A3
A4
B10
G11
E13
E11
F11
F10
K6
K8
F5
F6
F7
F8
F9
G5
G6
VPA_PMU
C355
VSYS_SW
VREF
32K_IN
32K_OUT
VA_PMU
VCN_2V8_PMU
VTCXO_PMU
VCAMA_PMU
VCN_3V3_PMU
VRTC
1uF
VM_PMU
VRF18_PMU
VCN_1V8_PMU
VCAMD_PMU
VCAMD_IO_PMU
VEMC_3V3_PMU
VMC_PMU
VMCH_PMU
VUSB_PMU
VSIM1_PMU
VSIM2_PMU
VGP1_PMU
VIBR_PMU
VGP3_PMU
VCAM_AF_PMU
C320
L301
0.68UH
2
1
A
C
NF
D301
L305
2.2UH
L303
0.68UH
2
1
A
C
NF
D303
C331
100nF
VIO18_PMU
VIO28_PMU
dedicate VSS ball, must return to cap then to main GND:
100nF
1. GND_VREF(N14) => C320
[3]CLK32K_BB
[2]
X301
RTC 32K : X301+C324+C319=> mount, R333=> NC
32K-less: X301+C324=> remove, C319+R333=> 0R
12
18PF
XTAL-32.768K-KYOCERA
C324
Close to chip
VRTC
1K
C325
2.2uF
C337
12
R312
22uF
VPROC_PMU
[1]
[2,4]
VPROC_PMU
[2]VPROC_FB
[1]
[1]
VPA_PMU
C354
GND_VPROC_FB
[2]
VSYS_PMU
VEMC_3V3_PMU
0.1uF
VPA_SW
2
1
2
1
靠近L305
VBAT
D306
D305
SOD-323
0.1uF
C345
SOD-323
RTC
18PF
C319
R333
0_NF
12
GB301
3V_NF
[7]DCXO_32K
[6]
BGA145-5.8X5.8-0.4E0.25B(MT6323)
C313
P1
AUXADC_REF
AUXADC_TSX
[7]GND_AUXADC
[2]
[2]
[19]
[19]
[19]
[19]
[19]
[19]
2.2uF
BATSNS
ISENSE
BAT_ON
VCDT
VDRV
CHR_LDO
[3]AUD_CLK
[3]
[3,5]PMIC_SPI_CS
[3]PMIC_SPI_MOSI
[3]PMIC_SPI_MISO
GND_AUXADC
[3]SIM1_SCLK
[3]SIM1_SIO
[3]SIM2_SCLK
[3]SIM2_SIO
VBAT_SPK
L2
GND_SPK
F2
AU_MICBIAS0
G2
AU_MICBIAS1
E4
[6]AU_VIN0_P
AU_VIN0_P
F4
[6]AU_VIN0_N
AU_VIN0_N
G3
[6]AU_VIN1_P
AU_VIN1_P
G4
[6]AU_VIN1_N
AU_VIN1_N
D2
AU_VIN2_P
D1
AU_VIN2_N
J2
AVDD28_ABB
D3
AVDD28_AUXADC
H2
GND_ABB
E2
ACCDET
E1
CLK26M
P13
BATSNS
P12
ISENSE
K3
BATON
A12
VCDT
M13
VDRV
N13
CHRLDO
CONTROL SIGNAL
M2
PWRKEY
A1
SYSRSTB
K4
RESETB
A9
FSOURCE
A7
[3]EINT_PMIC
INT
N12
EXT_PMIC_EN
N2
PMU_TESTMODE
E7
[3]AUD_MOSI
AUD_MOSI
E8
AUD_CLK
B6
[3]AUD_MISO
AUD_MISO
A2
[3,7]SRCLKENA
SRCLKEN
M1
[4]FCHR_ENB
FCHR_ENB
D9
SPI_CLK
B7
SPI_CSN
D8
SPI_MOSI
B8
SPI_MISO
F13
VBAT_VPROC
F14
VBAT_VPROC
G13
VBAT_VPROC
A13
VBAT_VPA
H13
VBAT_VSYS
P8
VBAT_LDOS3
P6
VBAT_LDOS3
P5
VBAT_LDOS2
P2
VBAT_LDOS1
J14
AVDD22_BUCK
M14
AVDD22_BUCK
A8
DVDD18_DIG
A5
DVDD18_IO
C2
AUXADC_VREF18
B1
AUXADC_AUXIN_GPS
B2
AVSS28_AUXADC
BC 1.1
A10
[3]CHD_DM
CHG_DM
A11
[3]CHD_DP
CHG_DP
B5
SIM1_AP_SCLK
M11
SIMLS1_AP_SIO
E6
SIM1_AP_SRST
C5
SIM2_AP_SCLK
K11
SIMLS2_AP_SIO
D6
SIM2_AP_SRST
M9
[13]SCLK
SIMLS1_SCLK
N11
[13]SIO
SIMLS1_SIO
M10
[13]SRST
SIMLS1_SRST
K9
[13]SCLK2
SIMLS2_SCLK
L11
[13]SIO2
SIMLS2_SIO
K10
[13]SRST2
SIMLS2_SRST
GND_LDO
J10
VBAT
MICBIAS0
[20]
[2]
[2]
[3]RESETB
TP301
[4,7]AUXADC_REF
[6]
[7]AUXADC_TSX
[6]
1uF
C314
[15]PWRKEY
100nF
[3,5]WATCHDOG
C323
VA_PMU
1uF
C312
[5]
[6]
R316
DVDD18_DIG_PMIC
VIO18_PMU
[6]
1uF
[2,4]
HT301
[2]
[2]
[2]
C322
MICBIAS1
[5]
[5]
[5]
[5]
[6]ACCDET
[7]CLK4_AUDIO
[2]
[2]
[2]
[2]
[2,6]
[4]FCHR_ENB
PMIC_SPI_SCK
[2]
[2]
[2]
[2]
1K
==> for longer RTC time sustain after battery remove,
please refer to RTC design notice
TITLE:
DOCUMENT NO.:
DEPARTMENT:
COMPANY:
<DESIGNER> SHEET:
DESIGNER:
<TITLE>
03_MT6323
Hardware DEPT.
Last Saved Date:
2013-5-10
<REV>
REV:
SIZED:
A1
OF
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97511_1_12_20130417_1200.sch-5 - Fri May 24 15:20:37 2013
U101-F
DRAM
DRAM
Data
Ctrl
ED31
ED30
ED29
ED28
ED27
ED26
ED25
ED24
ED23
ED22
ED21
ED20
ED19
ED18
ED17
ED16
ED15
ED14
ED13
ED12
ED11
ED10
ED9
ED8
ED7
ED6
ED5
ED4
ED3
ED2
ED1
ED0
NAND I/F
VREF1
VREF0
DRAM
Address
EA18
EA17
EA16
EA15
EA14
EA13
EA12
EA11
EA10
EA9
EA8
EA7
EA6
EA5
EA4
EA3
EA2
EA1
EA0
ERESET
BGA428-10.7X10.7-0.4E0.25B(MT6572)
ECS0_B
ECS1_B
ERAS_B
ECAS_B
EDQS0_B
EDQS1_B
EDQS2_B
EDQS3_B
EDCLK0_B
EDCLK0
EDCLK1_B
EDCLK1
EWR_B
EDQM0
EDQM1
EDQM2
EDQM3
EDQS0
EDQS1
EDQS2
EDQS3
GPIO47
AF22
AF19
AF21
[5]EA3
AD21
[5]EA7
AB20
[5]EA5
AD24
ECKE
AB13
AD12
EDQM0
AD8
AE12
AA14
Y13
Y8
AA9
Y14
AA13
AA8
EDQS3_B
Y9
Y18
AA18
AA19
EDCLK_B
Y19
AA2
ND0
NLD1
Y2
NLD8
ND1
W1
NLD3
ND2
W3
ND3
NLD13
AB1
ND4
ND5
ND6
ND7
ND8
ND9
ND10
ND11
ND12
ND13
ND14
ND15
NCEB
NWRB
NREB
NCLE
NALE
NRNB
[5]NLD10
AD2
[5]
NLD5
W4
NLD12
AE1
[5]NLD14
W2
NLD9
Y3
NLD6
AC2
[5]
NLD4
AC1
[5]NREB
Y4
NLD0
V5
NLD2
AE2
[5]NLD7
V1
NLD15
W5
NCEB
Y5
NWRB
AB2
GPIO46
AC3
AD3
AE3
AB3
[5] EVREF
[5] ECS1_B
BA[1:0] =
[5] ECS0_B
EA[15:14]
(LPDDR1)
[5]
[5] ED8
[5] ED10
[5] ED14
[5] ED9
[5] ED13
[5] ED15
[5] ED11
[5] ED26
[5] ED25
[5] ED28
[5] ED30
[5] ED29
[5] ED27
[5] ED31
[5] ED24
[5] ED7
[5] ED0
[5] ED1
[5] ED6
[5] ED2
[5] ED3
[5] ED5
[5] ED4
[5] ED17
[5] ED22
[5] ED18
[5] ED21
[5] ED16
[5] ED19
[5] ED20
[5] ED23
[5] ECKE
[5] EA4
[5] EA6
[5] EA8
[5] EA2
[5] EA9
[5] EA0
[5] EA1
AF6
ED12
AE6
AF8
AE7
AE8
AC9
AC7
AB9
AF5
AE5
AD5
AC5
AE4
AF3
AF2
AB6
AE11
AD15
AE10
AE9
AF12
AF11
AF9
AC13
AE16
AE13
AE15
AE14
AF15
AF16
AC15
AB16
AB17
AC11
AB18
AE18
AE17
AE21
AB19
AE22
AC23
AD22
AD18
AE25
AE23
AF25
AE24
AF24
AE26
AC18
AE19
AE20
AF18
AC22
Please make sure the ball map is
match to the MCP type you selected
[2,3]
[3,4] PMIC_SPI_CS
HW trapping PIN
20K: VM=1.8V
NC : VM=1.2V
VM_PMU VIO_EMI
[5]EDQM2
[5]
[5]EDQM3
[5]EDQM1
[5]EDQS2
[5]EDQS0
[5]EDQS3
[5]EDQS1
[5]EDQS2_B
[5]EDQS0_B
[5]
[5]EDQS1_B
[5]
[5]EDCLK
R454
2
1
R455
2
1
240
240
[5]
[5]NCLE
[5]NALE
[5]NRNB
[5]NLD11
0
R401
U3
[5]EA0
CA0
T3
[5]EA1
CA1
R3
[5]EA2
CA2
R2
[5]EA3
CA3
R1
[5]EA4
CA4
K2
[5]EA5
CA5
J2
[5]EA6
CA6
J3
[5]EA7
CA7
H3
[5]EA8
CA8
H2
[5]EA9
CA9
[5]ED0
T8
DQ0
[5]ED1
R8
DQ1
[5]ED2
R7
DQ2
[5]ED3
R9
DQ3
[5]ED4
R6
[5]ED5
P7
[5]ED6
P8
[5]ED7
P9
[5]ED8
K9
[5]ED9
K8
[5]ED10
K7
[5]ED11
J6
[5]ED12
J9
[5]ED13
J7
[5]ED14
J8
[5]ED15
H8
[5]ED16
W7
[5]ED17
U6
[5]ED18
W8
[5]ED19
T5
[5]ED20
U7
[5]ED21
W9
[5]ED22
V8
[5]ED23
T6
[5]ED24
H6
[5]ED25
F8
[5]ED26
E9
[5]ED27
G7
[5]ED28
H5
[5]ED29
E8
[5]ED30
G6
[5]ED31
E7
G3
F3
F6
F9
G10
H10
J5
K10
M5
P10
R5
T10
U10
V6
V9
T1
M1
H1
B9
E1
F2
F5
G1
L2
M8
U1
V2
V5
C3
A1
A2
A9
A10
B1
B10
E10
W1
W10
Y1
Y2
Y9
Y10
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
ZQ0
ZQ1/NC
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSQ
VSSCA
VSSCA
VSSCA
VSSM
VSSM
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSSQM
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
LP-DDR2
eMMC
Power
CS1#/NC
CKE1/NC
VREFCA
VREFDQ
Memory MCP
VIO18_PMU
C421
12
4.7uF
C422
EMMC_VDDI
12
100nF
VIO_EMI
Put C402 & C403 between BB & memory.
[5]NREB
[5]NLD10
[5]NRNB
[5]NALE
[5]NCLE
[5]NLD4
[5]NLD5
[5]NLD7
[5]NLD14
[5]NLD11
[5]NWPB
[5]ECS0_B
[5]ECS1_B
[5]ECKE
[5]EDCLK
[5]EDCLK_B
[5]EDQS0
[5]EDQS0_B
[5]EDQS1
[5]EDQS1_B
[5]EDQS2
[5]EDQS2_B
[5]EDQS3
[5]EDQS3_B
[5]EDQM0
[5]EDQM1
[5]EDQM2
[5]EDQM3
[5]EVREF
U402
E6
VDD1
F1
VDD1
V1
VDD1
W6
VDD1
E5
VDD2
G2
VDD2
K1
VDD2
M7
VDD2
U2
VDD2
W5
VDD2
F7
VDDQ
F10
VDDQ
G5
VDDQ
H9
VDDQ
J10
VDDQ
L6
VDDQ
M6
VDDQ
N6
VDDQ
R10
VDDQ
T9
VDDQ
U5
VDDQ
V7
VDDQ
V10
VDDQ
J1
VDDCA
L1
VDDCA
T2
VDDCA
A8
VCC
B2
VCC
B8
VCCQ
A5
VDDI
B5
CLKM
C1
RST
C5
CMD
B4
DAT7
A4
DAT6
A6
DAT5
B6
DAT4
A7
DAT3
B7
DAT2
B3
DAT1
A3
DAT0
P1
CS0#
P2
N1
CKE0
N2
M3
CLK
L3
CLK#
P6
DQS0
P5
DQS0#
K6
DQS1
K5
DQS1#
U8
DQS2
U9
DQS2#
G8
DQS3
G9
DQS3#
N5
DM0
L5
DM1
T7
DM2
H7
DM3
K3
M9
C2
NC
C4
NC
C6
NC
D1
NC
D2
NC
D3
NC
D4
NC
D5
NC
D6
NC
E2
NC
E3
NC
M2
NC
N3
NC
P3
NC
V3
NC
W2
NC
W3
NC
Hynix H9TP32A4GDMCPR;H9TP32A8JDMCPR-KGM;Micron MT29PZZZ4D4TKETF-25
100nF
12
[5]EVREF
C410
4.7uF
12
C401
100nF
C402
12
100nF
C403
1uF
12
C129
12
4.7uF
C110
1uF
12
VIO_EMI
1
10K
R452
2
1
10K
R453
2
12
C404
C453
12
VEMC_3V3_PMU
VIO18_PMU
4.7uF
C412
12
100nF
0_NF
R412
2
1
[5]NWPB
2
1
R413
0
[3,4]WATCHDOG
GPIO46
<REV>
2013-5-10
REV:
SIZED:
A1
OF
5
17
TITLE:
DOCUMENT NO.:
DEPARTMENT:
COMPANY:
DESIGNER:
<TITLE>
04_MEMORY_EMMC_LPDDR2
Hardware DEPT.
Last Saved Date:
<DESIGNER> SHEET:
97511_1_12_20130417_1200.sch-6 - Fri May 24 15:20:38 2013
Based on your system level design , if better
desense performance is needed on your
system , please refer to desense
performance enhance proposal
Receiver
close to connectorclose to IC
[4]
AU_HSP
[3]
[3]
[4]
AU_HSN
R520
0
R521
0
Handset Microphone 1
C511
[4] AU_VIN0_P
[4] AU_VIN0_N
if you use digital MIC,
please change cap
(C511,C512) to 1.0uF
0.1uF
0.1uF
C512
together then single via to main GND
MICBIAS0
R514
R515
C513
4.7uF
R516
1K
Earphone Audio
Reserve bead+C footprint for FM
performance tuning
1800ohm
BEAD503
C519
[4]AU_HPL
[3]
1800ohm
BEAD504
C520
[4]AU_HPR
J502
VR502
C506
33PF
C505
100PF
C504
33PF
VR503
1
2
REC-NOG-93045-WQM2000000
J503
1
2
REC-NOG-93045-WQM2000000
[3]
Based on your system level design , if better ESD
performance is needed on your system, please
refer to ESD performance enhance proposal
10uF
close to IC
close to connector
NF
NF
C530
10uF
C529
HP_MP3L
33
R507
33
R508
HP_MP3R
33PF
C521
same power domain
[6]
HP_MIC
33PF
C522
VR505
VR504
VIO28_PMU
[3]
VR506
EINT_HP
R505
470K
47K
R506
1800ohm
BEAD501
1800ohm
BEAD502
1800ohm
BEAD505
12
VR501
470
470
R509
R510
100NH
R501
1
0
L502
R502
1
0
[6]HP_MIC-1
[6]HP_MP3L-1
[6]
EAR_DET
[6]HP_MP3R-1
[6]FM_ANT-1
2
2
[10]
[12]FM_ANT
[10]
[12]FM_RX_N_6572
[6] HP_MIC-1
[6]
FM_ANT-1
[6] HP_MP3R-1
HP_MP3L-1
[6]
[6] EAR_DET
J501
1
2
3
4
5
6
AUDIO-EAR-PH8-5B05F35A
Single via to GND plane
1K
Close to
Close to
BB
1.5K
1.5K
R517
VR508
MIC
Analog MIC
C508
100PF
33PF
33PF
C509
C510
VR509
R522
R523
0
0
AUDIO-MIC-OB-F15PD44-26-C10C33EP
CON502
1
2
Earphone MICPHONE
Close to BB Close to MIC
100nF
C523
[4] AU_VIN1_N
100nF
C524
[4] AU_VIN1_P
[4] ACCDET
AU_VIN1_N1
MICBIAS1
1K
GND of C(4.7uF) and headset
should tie together and single
R511
4.7uF
via to GND plane
C531
Close to EarJack
1K
GND
[6]HP_MIC
together then single
via to main GND
R512
C526
33PF
1.5K
100PF
C527
C525
33PF
R513
TITLE:
DOCUMENT NO.:
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<TITLE>
05_AUDIO
Hardware DEPT.
Last Saved Date:
<DESIGNER> SHEET:
2013-5-10
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