Huawei MG323 User Manual

HUAWEI MG323 GSM M2M Module

Hardware Guide

Issue 06 Date 2013-06-13

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HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

History

About This Document

Version Date Chapter Descriptions

01 Creation 02 2010-10-25 1 Deleted “1.2 Related Documents”

3.1 Deleted “Charging Inter face (TBD)”

3.6.1 Revised “Table 3-5 UA RT 1 int er f ace signals”

3.8

2011-07-18 2.2

3.5.2 Added the maximum time of TERM_ON

3.6

5.2

5.4

5.5.2

Deleted “Charging Inter face (TBD)” Added “Audio Interface”

Revised “Figure 7-1 Circuits of typical interfaces in the MG323 mo dule”

Added authentication information-CCC, GCF and mode of audio services

Added signal of the RING w hil e receiving a message and a voice call

Revised “Table 5-1 Extreme working conditions for the MG323 module”

Revised “Table 5-3 Sequence numbers of pins and definitions o f signals on the B2B interface” and “Table 5-4 Electrical features of application interfaces”

Revised “Table 5-6 Working current of the MG323 module”

04 2011-08-22 3.2

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6.3

6.4 Revised “Figure 6-5 Structure fixing hole”

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Specified the mode of the 50-pin B2B connector

Revised “Figure 3-1 Sequence and definitions of pins on the B2 B signal interface”

HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

Version Date Chapter Descriptions

05 2013-03-22 2.2 Updated Table 2-1 Feature

2.3

Updated Figure 2-1 App lic at ion block diagram of the MG323 modul e

2.4

Updated Figure 2-2 Circ ui t block diagram of the MG323 module

3.2

Updated Table 3-1 Definiti ons of pins on the BEB connector

3.3.2 Updated VBAT interface

3.3.3 Updated Figure 3-3 VCO IN interface circuit

3.4.3 Updated Figure 3-5 Power-off time sequence

3.5.2

Updated Figure 3-6 Connections of the TERM_ON and RESET pins

3.5.3 Updated Figure 3-7 Driv in g circ u it

3.6.2

Added the description for the level of UART interface

3.8.3

Updated Figure 3-13 External circuit for 32 Ω handsets/16 Ω headsets

3.8.3

Updated Figure 3-14 External circuit for the microphone interface

5.2

Updated extreme working conditions of MG323 module

5.4

Updated Table 5-4 Elect rical featur es of application interfaces

5.2.2 Updated working current of MG323 module

6.4

Updated Figure 6-6 MG323 module installation

Updated Figure 7-1 Circuits of typical interfaces in the MG323 mo dule

06 2013-06-13 3.2 Updated Table 3-1

3.4.2 Updated Figure 3-4 Power-on time sequence

3.6.1 Updated Chapter 3.6.1 Overview

3.7.3

Deleted Chapter 3.7.3 ESD Protection for the SIM Card Interface

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HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

Version Date Chapter Descriptions

3.8 Updated Chapter 3.8 Audi o Interface

4.6

Updated Table 4-3 Recommended specifications of the antenna interface

Updated Figure 7-1 Circuits of typical interfaces in the MG323 mo dule

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Contents

1 Introduction.................................................................................................................................... 8

1.1 Overview .......................................................................................................................................... 8

2 Overall Description ...................................................................................................................... 9

2.1 About This Chapter ........................................................................................................................... 9

2.2 Function Overview............................................................................................................................ 9

2.3 Application Block Diagram .............................................................................................................. 11

2.4 Circuit Block Diagram ...................................................................................................................... 11

3 Description of the Application Interfaces .............................................................................. 13

3.1 About This Chapter ......................................................................................................................... 13

3.2 B2B Connector Interface ................................................................................................................ 13

3.3 Power Interface .............................................................................................................................. 16

3.3.1 Overview ................................................................................................................................ 16

3.3.2 VBAT Interface ....................................................................................................................... 17

3.3.3 VCOIN Interface .................................................................................................................... 18

3.3.4 VIO Interface ......................................................................................................................... 18

3.4 Power-On and Power-Off Time Sequence ..................................................................................... 18

3.4.1 Overview ................................................................................................................................ 18

3.4.2 Power-On Time Sequence .................................................................................................... 19

3.4.3 Power-Off Time Sequence .................................................................................................... 20

3.4.4 RESET ................................................................................................................................... 20

3.5 Signal Control Interface .................................................................................................................. 20

3.5.1 Overview ................................................................................................................................ 20

3.5.2 Input Signal Control Pins ....................................................................................................... 21

3.5.3 Output Signal Control Pin ...................................................................................................... 22

3.6 UART Interface ............................................................................................................................... 23

3.6.1 Overview ................................................................................................................................ 23

3.6.2 Circuit Recommended for the UART Interface ...................................................................... 24

3.7 SIM Card Interface ......................................................................................................................... 25

3.7.1 Overview ................................................................................................................................ 25

3.7.2 Circuit Recommended for the SIM Card Interface ................................................................ 26

3.8 Audio Interface ............................................................................................................................... 27

4 Antenna Interface ........................................................................................................................ 29

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Contents

4.1 About This Chapter ......................................................................................................................... 29

4.2 Antenna Installation ........................................................................................................................ 29

4.3 Coaxial Cable and RF Connector .................................................................................................. 30

4.4 ESD Protection for the Antenna Interface ...................................................................................... 32

4.5 RF Specifications of the Antenna Interface .................................................................................... 32

4.6 Specifications of the Antenna Interface .......................................................................................... 34

5 Electrical and Reliability Features ........................................................................................... 35

5.1 About This Chapter ......................................................................................................................... 35

5.2 Extreme Working Conditions .......................................................................................................... 35

5.3 Operating and Storage Temperatures and Humidity ...................................................................... 36

5.4 Electrical Criteria of Application Interfaces ..................................................................................... 36

5.5 Power Supply Features .................................................................................................................. 40

5.5.1 Input Power Supply ............................................................................................................... 40

5.5.2 Working Current .................................................................................................................... 40

5.6 Reliability Features ......................................................................................................................... 42

5.7 ESD Features ................................................................................................................................. 44

6 Mechanical Specifications ......................................................................................................... 45

6.1 Overview ........................................................................................................................................ 45

6.2 Dimensions ..................................................................................................................................... 45

6.3 Dimensions of the B2B Connector ................................................................................................. 46

6.4 MG323 Module Installation Desc r ipt ion ......................................................................................... 48

6.5 Specification Selection for Fasteners ............................................................................................. 50

7 Appendix A Circuits of Typical Interfaces ............................................................................ 52

8 Appendix B Acronyms and Abbreviations ............................................................................ 53

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Introduction

1.1 Overview

This document describes the hardware application interfaces and air interfaces that are provided when the Hu aw ei MG 323 GSM M2M module (hereinafter referred to as the MG323 module) is used.

1 Introduction

This document helps you to understand the interface specifications, electrical features, and related product information of the MG323 module.

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

2.1 About This Chapter

This chapter gives a gener al description of the MG323 module and provides:



Function Overview



Application Block Diagram



Circuit Blo ck Diagram

2 Overall Description

2.2 Function Overview

Table 2-1 Feature

Feature Description

Working bands

Maximum transmission power

Receiver sensitivity

Operating Temperature

Ambient temperature for storage

Four supported frequenc y bands: GSM850 MHz/900 MHz/1800 MHz/1900 MHz

GSM850 Class 4 (2 W) EGSM900 Class 4 (2 W) DCS1800 Class 1 (1 W) PCS1900 Class 1 (1 W) < –107 dBm

Normal operating temperature: –20°C to +70°C Extended operating te mp er at ur e

–40°C to +85°C

[1]

: –30°C to +75°C

Power voltage 3.3 V to 4.8 V (3.8 V is recommended. )

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

Feature Description

Power

Power-off current: 50 µA consumption (current)

Average

DRX=2 < 3.0 mA

standby current

DRX=5 < 2.5 mA DRX=9 < 2.0 mA

GPRS Class 10 (maximum): 455 mA Protocols GSM/GPRS Phase2/2+ AT commands

See the HUAWEI MG323 Seri es Wireless Module AT Command

Interface Specification.

Application

UART1 (supporting 8-wire UART) interface (50pin B2B connector)

One standard Subscriber Identity Module (SIM) card interface

(Class B or Class C)

Interfaces for two analog audio channels

Power Interface

Network status light-emitting diode (LED) control inter face Antenna

Hirose U.FL-R-SMT-1(80) 50 Ω antenna connector interface

Antenna pad Voice services Two analog voice channels SMS

New message alert, text message receiving, an d text message

sending

Management of text messages: read messages, delete

messages, storage status, and m essage list

Support for the protocol data unit (PDU) mode GPRS GPRS CL AS S 10

Encoding schemes: CS 1, CS 2, CS 3, and CS 4

Maximum downlink trans m ission rate: 85.6 kbps

Maximum uplink transm ission rate: 42.8 kbps

Packet Broadcast Control Channel (PBCCH)

Embedded with TCP/IP pr ot ocols, supporting multipl e link s Circuit

CSD data services at the maximum rate of 9.6 kbit/s Switched Data (CSD) data services

Physical features



Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm



Weight: 5.8 g

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description

Feature Description

Certification information

Restriction of the use of cer t ain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC), CMIIT, China Compulsory Certification

(CCC), GCF (GSM Certification Forum)

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate from 3GPP TS 45.005 specifications.

2.3 Application Block Diagram

Figure 2-1 shows the application bloc k d ia gr am of the MG323 module.

Figure 2-1 Application block diagram of the MG323 module

2.4 Circuit Block Diagram

The circuit block diagram and major functional units of the MG323 module con tain the following part s:



Baseband controller

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description



Power management



Multi-chip package (MCP) memory



Radio frequency (RF) tr ansceiver



26 MHz clock



32 kHz clock



RF front-end modules



Receive filter

Figure 2-2 Circuit block diagram of the MG323 module

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Description of the Application Interfaces

1 2

49 50

3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly descr ibes the external applicat io n int er f aces of the MG323 module, including:



B2B Connector Interface



Power Interface



Power-On and Power-Of f T ime Sequence



Signal Control Interface



UART Interface



SIM Card Interface



Audio Interface

3.2 B2B Connector Interface

The MG323 module uses a 50-pin B2B connector as it s ext er nal interface. For det ai ls about the model and dimensions of the B2B connector, see “ 6.3 Dimensio ns of the B2B Connector”.

Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B sign al interface of the MG323 m odule.

Figure 3-1 Sequence and definitions of pins on the B2B signal interface

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the B2B connector

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

1 SIM_CLK - O

2 INTEAR_N - AO

3 VSIM - P

4 INTEAR_P - AO

5 SIM_DATA - I/O

6 EXTEAR_P - AO

7 SIM_RST - O

Clock signal of the SIM card

Negative pole of the output of h

speaker

andset

Power supply of the SIM card

Positive pole of the output of h

speaker

andset

Data signal of the SIM card

Positive pole of the output of headset

speaker

Reset signal of the SIM card

- 1.80/2.90 -

- - -

- 1.80/2.90 -

- - -

- 1.80/2.90 -

- - -

- 1.80/2.90 -

8 EXTEAR_N - AO

9 NC - -

Negative pole of the output of

speaker

headset

Not connected, please

- - -

keep this pin open

10 INTMIC_N - AI

Negative pole of the input of h

microphone

andset

- - -

11 GND - - Ground - - 12 INTMIC_P - AI

13 NC - -

Positive pole of the input of h

microphone

andset

Not connected, please

- - -

keep this pin open

14 EXTMIC_P - AI

15 NC - -

Positive pole of the input of h

microphone

eadset

Not connected, please

- - -

keep this pin open

16 EXTMIC_N - AI

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Negative pole of the input of h

microphone

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eadset

- - -

HUAWEI MG323 GSM M2M Module

Hardware Guide

Description of the Application Interfaces

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

17 NC - -

Not connected, please

- - -

keep this pin open 18 GND - - Ground - - 19 NC - -

Not connected, please

- - -

keep this pin open 20 TERM_ON - I

21 NC - -

Power on/power off

control

Not connected, please

- - -

internal pulled up

keep this pin open 22 RESET - I Hardware res et –0.40 2.80 3.20 23 NC - -

Not connected, please

- - -

keep this pin open 24 UART1_DCD - O DCE data carrier detect –0.40 2.80 3.20 25 LED_STATUS - O

Network status

–0.40 2.80 3.20

indication 26 NC - -

Not connected, please

- - -

keep this pin open 27 NC - -

Not connected, please

- - -

keep this pin open 28 UART1_CTS - O DCE clear to send –0.40 2.85 3.25 29 UART1_RD - O DCE transmit data –0.40 2.85 3.25 30 NC - -

Not connected, please

- - -

keep this pin open 31 NC - -

Not connected, please

- - -

keep this pin open 32 UART1_DTR - I

DCE data terminal

–0.40 2.80 3.20

ready 33 UART1_TD - I DCE receive data –0.40 2.80 3.20 34 UART1_RTS - I DCE request to send –0.40 2.85 3.25 35 VCOIN - P

Standby power input of

2.00 3.00 3.15

the RTC 36 UART1_DSR - O DCE data set ready –0.40 2.80 3.20 37 NC - -

38 UART1_RING - O DCE ring indicator –0.40 2.80 3.20

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Not connected, please

- - -

keep this pin open

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HUAWEI MG323 GSM M2M Module

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Description of the Application Interfaces

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

39 NC - -

Not connected, please

- - -

keep this pin open 40 VIO - P External power output 2.70 2.80 2.95 41 GND - - Ground - - 42 VBAT - P Power supply input 3.30 3.80 4.80 43 GND - - Ground - - 44 VBAT - P Power supply input 3.30 3.80 4.80 45 GND - - Ground - - 46 VBAT - P Power supply input 3.30 3.80 4.80 47 GND - - Ground - - 48 VBAT - P Power supply input 3.30 3.80 4.80 49 GND - - Ground - - 50 VBAT - P Power supply input 3.30 3.80 4.80



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal input.



The NC (Not Connected) pins are internally connected to the module. Therefore, these pins should not be used, otherwis e they may cause problems. Please contact us for more details about this information.

3.3 Power Interface

3.3.1 Overview

The power supply part of the B2B interface of the M G 323 module contains:



VBAT interface for the power supply



VCOIN interface for the standby power supply of the real-time clock (RTC)



VIO interface for external power output

Table 3-2 lists the definitions of the pins on the power supply interface.

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Description of the Application Interfaces

Module

(DCE)

VBAT

100 nF

10 μF

220μF

Table 3-2 Definitions of the pins on the power supply interface

Pin No. Signal Name I/O Description

42, 44, 46, 48, 50 VBAT P Pins for Power supply in put 41, 43, 45, 47, 49 GND - GND 35 VCOIN P

40 VIO P Pin for external power output

3.3.2 VBAT Interface

When the MG323 module works normally, power is supplied through the V BAT pins and the voltage ranges from 3.3 V to 4.8 V (typical value: 3. 8 V) . The 50-pin B2B connector provides fiv e VB AT pins and five GND pi ns for ext ernal power input. To ensure that the MG323 module works normally, all the pins must be used ef f iciently.

When the MG323 module is used for different ex t er nal applications, pay special attention to the design for t he pow er supply. When the MG323 m odule transmits signals at the maximum p ow er, the transient current may reach the t r ansient peak value of about 2.0 A due to the differe nces in actual network environments. In this case, the VBAT voltage greatly drops. Make sure that t he voltage does not decrease below 3.3 V in any case. Otherwise, exceptions such as r estart of the MG323 module may occur.

A low-dropout (LDO) regulator or switch pow er with current output of more t han 2 A is recommended for exter nal power supply. Furthermore, At least five 220 µF storage capacitors should be connected in parallel at the power interface of the MG323 module. In addition, to reduce the im pact of channel impedance on voltage dro p, you are recommended to try to shorten the power supply circuit of the VBAT interface.

Pin for standby power inp ut of the RTC

It is recommended to employ a ferrite bead in series on VBAT power circuit to improve the EMI performanc e. And the rated current of the ferrite bead is required at least 2 A.

Figure 3-2 shows the recommended pow er circuit of MG323 module.

Figure 3-2 Recommended power circuit of MG323 module

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