Huawei MG323 User Manual

HUAWEI MG323 GSM M2M Module

Hardware Guide

Issue 06 Date 2013-06-13

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HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

History

About This Document

Version Date Chapter Descriptions

01 Creation 02 2010-10-25 1 Deleted “1.2 Related Documents”

3.1 Deleted “Charging Inter face (TBD)”

03

3.6.1 Revised “Table 3-5 UA RT 1 int er f ace signals”

3.8

7

2011-07-18 2.2

3.5.2 Added the maximum time of TERM_ON

3.6

5.2

5.4

5.5.2

Deleted “Charging Inter face (TBD)” Added “Audio Interface”

Revised “Figure 7-1 Circuits of typical interfaces in the MG323 mo dule”

Added authentication information-CCC, GCF and mode of audio services

Added signal of the RING w hil e receiving a message and a voice call

Revised “Table 5-1 Extreme working conditions for the MG323 module”

Revised “Table 5-3 Sequence numbers of pins and definitions o f signals on the B2B interface” and “Table 5-4 Electrical features of application interfaces”

Revised “Table 5-6 Working current of the MG323 module”

04 2011-08-22 3.2

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6.3

6.4 Revised “Figure 6-5 Structure fixing hole”

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Specified the mode of the 50-pin B2B connector

Revised “Figure 3-1 Sequence and definitions of pins on the B2 B signal interface”

3

HUAWEI MG323 GSM M2M Module

Hardware Guide

About This Document

Version Date Chapter Descriptions

05 2013-03-22 2.2 Updated Table 2-1 Feature

2.3

Updated Figure 2-1 App lic at ion block diagram of the MG323 modul e

2.4

Updated Figure 2-2 Circ ui t block diagram of the MG323 module

3.2

Updated Table 3-1 Definiti ons of pins on the BEB connector

3.3.2 Updated VBAT interface

3.3.3 Updated Figure 3-3 VCO IN interface circuit

3.4.3 Updated Figure 3-5 Power-off time sequence

3.5.2

Updated Figure 3-6 Connections of the TERM_ON and RESET pins

3.5.3 Updated Figure 3-7 Driv in g circ u it

3.6.2

Added the description for the level of UART interface

3.8.3

Updated Figure 3-13 External circuit for 32 Ω handsets/16 Ω headsets

3.8.3

Updated Figure 3-14 External circuit for the microphone interface

5.2

Updated extreme working conditions of MG323 module

5.4

Updated Table 5-4 Elect rical featur es of application interfaces

5.2.2 Updated working current of MG323 module

6.4

Updated Figure 6-6 MG323 module installation

7

Updated Figure 7-1 Circuits of typical interfaces in the MG323 mo dule

06 2013-06-13 3.2 Updated Table 3-1

3.4.2 Updated Figure 3-4 Power-on time sequence

3.6.1 Updated Chapter 3.6.1 Overview

3.7.3

Deleted Chapter 3.7.3 ESD Protection for the SIM Card Interface

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HUAWEI MG323 GSM M2M Module

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About This Document

Version Date Chapter Descriptions

3.8 Updated Chapter 3.8 Audi o Interface

4.6

7

Updated Table 4-3 Recommended specifications of the antenna interface

Updated Figure 7-1 Circuits of typical interfaces in the MG323 mo dule

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Contents

1 Introduction.................................................................................................................................... 8

1.1 Overview .......................................................................................................................................... 8

2 Overall Description ...................................................................................................................... 9

2.1 About This Chapter ........................................................................................................................... 9

2.2 Function Overview............................................................................................................................ 9

2.3 Application Block Diagram .............................................................................................................. 11

2.4 Circuit Block Diagram ...................................................................................................................... 11

3 Description of the Application Interfaces .............................................................................. 13

3.1 About This Chapter ......................................................................................................................... 13

3.2 B2B Connector Interface ................................................................................................................ 13

3.3 Power Interface .............................................................................................................................. 16

3.3.1 Overview ................................................................................................................................ 16

3.3.2 VBAT Interface ....................................................................................................................... 17

3.3.3 VCOIN Interface .................................................................................................................... 18

3.3.4 VIO Interface ......................................................................................................................... 18

3.4 Power-On and Power-Off Time Sequence ..................................................................................... 18

3.4.1 Overview ................................................................................................................................ 18

3.4.2 Power-On Time Sequence .................................................................................................... 19

3.4.3 Power-Off Time Sequence .................................................................................................... 20

3.4.4 RESET ................................................................................................................................... 20

3.5 Signal Control Interface .................................................................................................................. 20

3.5.1 Overview ................................................................................................................................ 20

3.5.2 Input Signal Control Pins ....................................................................................................... 21

3.5.3 Output Signal Control Pin ...................................................................................................... 22

3.6 UART Interface ............................................................................................................................... 23

3.6.1 Overview ................................................................................................................................ 23

3.6.2 Circuit Recommended for the UART Interface ...................................................................... 24

3.7 SIM Card Interface ......................................................................................................................... 25

3.7.1 Overview ................................................................................................................................ 25

3.7.2 Circuit Recommended for the SIM Card Interface ................................................................ 26

3.8 Audio Interface ............................................................................................................................... 27

4 Antenna Interface ........................................................................................................................ 29

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Contents

4.1 About This Chapter ......................................................................................................................... 29

4.2 Antenna Installation ........................................................................................................................ 29

4.3 Coaxial Cable and RF Connector .................................................................................................. 30

4.4 ESD Protection for the Antenna Interface ...................................................................................... 32

4.5 RF Specifications of the Antenna Interface .................................................................................... 32

4.6 Specifications of the Antenna Interface .......................................................................................... 34

5 Electrical and Reliability Features ........................................................................................... 35

5.1 About This Chapter ......................................................................................................................... 35

5.2 Extreme Working Conditions .......................................................................................................... 35

5.3 Operating and Storage Temperatures and Humidity ...................................................................... 36

5.4 Electrical Criteria of Application Interfaces ..................................................................................... 36

5.5 Power Supply Features .................................................................................................................. 40

5.5.1 Input Power Supply ............................................................................................................... 40

5.5.2 Working Current .................................................................................................................... 40

5.6 Reliability Features ......................................................................................................................... 42

5.7 ESD Features ................................................................................................................................. 44

6 Mechanical Specifications ......................................................................................................... 45

6.1 Overview ........................................................................................................................................ 45

6.2 Dimensions ..................................................................................................................................... 45

6.3 Dimensions of the B2B Connector ................................................................................................. 46

6.4 MG323 Module Installation Desc r ipt ion ......................................................................................... 48

6.5 Specification Selection for Fasteners ............................................................................................. 50

7 Appendix A Circuits of Typical Interfaces ............................................................................ 52

8 Appendix B Acronyms and Abbreviations ............................................................................ 53

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Introduction

1.1 Overview

This document describes the hardware application interfaces and air interfaces that are provided when the Hu aw ei MG 323 GSM M2M module (hereinafter referred to as the MG323 module) is used.

1 Introduction

This document helps you to understand the interface specifications, electrical features, and related product information of the MG323 module.

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HUAWEI MG323 GSM M2M Module

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Overall Description

2.1 About This Chapter

This chapter gives a gener al description of the MG323 module and provides:



Function Overview



Application Block Diagram



Circuit Blo ck Diagram

2 Overall Description

2.2 Function Overview

Table 2-1 Feature

Feature Description

Working bands

Maximum transmission power

Receiver sensitivity

Operating Temperature

Ambient temperature for storage

Four supported frequenc y bands: GSM850 MHz/900 MHz/1800 MHz/1900 MHz

GSM850 Class 4 (2 W) EGSM900 Class 4 (2 W) DCS1800 Class 1 (1 W) PCS1900 Class 1 (1 W) < –107 dBm

Normal operating temperature: –20°C to +70°C Extended operating te mp er at ur e

–40°C to +85°C

[1]

: –30°C to +75°C

Power voltage 3.3 V to 4.8 V (3.8 V is recommended. )

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Overall Description

Feature Description

Power

Power-off current: 50 µA consumption (current)

Average

DRX=2 < 3.0 mA

standby current

DRX=5 < 2.5 mA DRX=9 < 2.0 mA

GPRS Class 10 (maximum): 455 mA Protocols GSM/GPRS Phase2/2+ AT commands

See the HUAWEI MG323 Seri es Wireless Module AT Command

Interface Specification.

Application

UART1 (supporting 8-wire UART) interface (50pin B2B connector)

One standard Subscriber Identity Module (SIM) card interface

(Class B or Class C)

Interfaces for two analog audio channels

Power Interface

Network status light-emitting diode (LED) control inter face Antenna

Hirose U.FL-R-SMT-1(80) 50 Ω antenna connector interface

Antenna pad Voice services Two analog voice channels SMS

New message alert, text message receiving, an d text message

sending

Management of text messages: read messages, delete

messages, storage status, and m essage list

Support for the protocol data unit (PDU) mode GPRS GPRS CL AS S 10

Encoding schemes: CS 1, CS 2, CS 3, and CS 4

Maximum downlink trans m ission rate: 85.6 kbps

Maximum uplink transm ission rate: 42.8 kbps

Packet Broadcast Control Channel (PBCCH)

Embedded with TCP/IP pr ot ocols, supporting multipl e link s Circuit

CSD data services at the maximum rate of 9.6 kbit/s Switched Data (CSD) data services

Physical features



Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm



Weight: 5.8 g

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HUAWEI MG323 GSM M2M Module

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Overall Description

Feature Description

Certification information

Restriction of the use of cer t ain Hazardous Substances (RoHS),

European Conformity (CE), Federal Communications

Commission (FCC), CMIIT, China Compulsory Certification

(CCC), GCF (GSM Certification Forum)

.

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate from 3GPP TS 45.005 specifications.

2.3 Application Block Diagram

Figure 2-1 shows the application bloc k d ia gr am of the MG323 module.

Figure 2-1 Application block diagram of the MG323 module

2.4 Circuit Block Diagram

The circuit block diagram and major functional units of the MG323 module con tain the following part s:



Baseband controller

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Overall Description



Power management



Multi-chip package (MCP) memory



Radio frequency (RF) tr ansceiver



26 MHz clock



32 kHz clock



RF front-end modules



Receive filter

Figure 2-2 Circuit block diagram of the MG323 module

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Description of the Application Interfaces

1 2

49 50

3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly descr ibes the external applicat io n int er f aces of the MG323 module, including:



B2B Connector Interface



Power Interface



Power-On and Power-Of f T ime Sequence



Signal Control Interface



UART Interface



SIM Card Interface



Audio Interface

3.2 B2B Connector Interface

The MG323 module uses a 50-pin B2B connector as it s ext er nal interface. For det ai ls about the model and dimensions of the B2B connector, see “ 6.3 Dimensio ns of the B2B Connector”.

Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B sign al interface of the MG323 m odule.

Figure 3-1 Sequence and definitions of pins on the B2B signal interface

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Description of the Application Interfaces

Table 3-1 Definitions of pins on the B2B connector

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

1 SIM_CLK - O

2 INTEAR_N - AO

3 VSIM - P

4 INTEAR_P - AO

5 SIM_DATA - I/O

6 EXTEAR_P - AO

7 SIM_RST - O

Clock signal of the SIM card

Negative pole of the output of h

speaker

andset

Power supply of the SIM card

Positive pole of the output of h

speaker

andset

Data signal of the SIM card

Positive pole of the output of headset

speaker

Reset signal of the SIM card

- 1.80/2.90 -

- - -

- 1.80/2.90 -

- - -

- 1.80/2.90 -

- - -

- 1.80/2.90 -

8 EXTEAR_N - AO

9 NC - -

Negative pole of the output of

speaker

headset

Not connected, please

- - -

keep this pin open

10 INTMIC_N - AI

Negative pole of the input of h

microphone

andset

- - -

11 GND - - Ground - - 12 INTMIC_P - AI

13 NC - -

Positive pole of the input of h

microphone

andset

Not connected, please

- - -

keep this pin open

14 EXTMIC_P - AI

15 NC - -

Positive pole of the input of h

microphone

eadset

Not connected, please

- - -

keep this pin open

16 EXTMIC_N - AI

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Negative pole of the input of h

microphone

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eadset

- - -

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Description of the Application Interfaces

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

17 NC - -

Not connected, please

- - -

keep this pin open 18 GND - - Ground - - 19 NC - -

Not connected, please

- - -

keep this pin open 20 TERM_ON - I

21 NC - -

Power on/power off

control

Not connected, please

-

- - -

internal pulled up

-

keep this pin open 22 RESET - I Hardware res et –0.40 2.80 3.20 23 NC - -

Not connected, please

- - -

keep this pin open 24 UART1_DCD - O DCE data carrier detect –0.40 2.80 3.20 25 LED_STATUS - O

Network status

–0.40 2.80 3.20

indication 26 NC - -

Not connected, please

- - -

keep this pin open 27 NC - -

Not connected, please

- - -

keep this pin open 28 UART1_CTS - O DCE clear to send –0.40 2.85 3.25 29 UART1_RD - O DCE transmit data –0.40 2.85 3.25 30 NC - -

Not connected, please

- - -

keep this pin open 31 NC - -

Not connected, please

- - -

keep this pin open 32 UART1_DTR - I

DCE data terminal

–0.40 2.80 3.20

ready 33 UART1_TD - I DCE receive data –0.40 2.80 3.20 34 UART1_RTS - I DCE request to send –0.40 2.85 3.25 35 VCOIN - P

Standby power input of

2.00 3.00 3.15

the RTC 36 UART1_DSR - O DCE data set ready –0.40 2.80 3.20 37 NC - -

38 UART1_RING - O DCE ring indicator –0.40 2.80 3.20

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Not connected, please

- - -

keep this pin open

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Description of the Application Interfaces

Pin Name I/O Description DC Characteristics (V)

No.

Normal MUX Min. Tpy. Max

39 NC - -

Not connected, please

- - -

keep this pin open 40 VIO - P External power output 2.70 2.80 2.95 41 GND - - Ground - - 42 VBAT - P Power supply input 3.30 3.80 4.80 43 GND - - Ground - - 44 VBAT - P Power supply input 3.30 3.80 4.80 45 GND - - Ground - - 46 VBAT - P Power supply input 3.30 3.80 4.80 47 GND - - Ground - - 48 VBAT - P Power supply input 3.30 3.80 4.80 49 GND - - Ground - - 50 VBAT - P Power supply input 3.30 3.80 4.80



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal input.



The NC (Not Connected) pins are internally connected to the module. Therefore, these pins should not be used, otherwis e they may cause problems. Please contact us for more details about this information.

3.3 Power Interface

3.3.1 Overview

The power supply part of the B2B interface of the M G 323 module contains:



VBAT interface for the power supply



VCOIN interface for the standby power supply of the real-time clock (RTC)



VIO interface for external power output

Table 3-2 lists the definitions of the pins on the power supply interface.

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Description of the Application Interfaces

Module

(DCE)

VBAT

100 nF

10 μF

+

220μF

+

220μF

+

220μF

+

220μF

+

220μF

Table 3-2 Definitions of the pins on the power supply interface

Pin No. Signal Name I/O Description

42, 44, 46, 48, 50 VBAT P Pins for Power supply in put 41, 43, 45, 47, 49 GND - GND 35 VCOIN P

40 VIO P Pin for external power output

3.3.2 VBAT Interface

When the MG323 module works normally, power is supplied through the V BAT pins and the voltage ranges from 3.3 V to 4.8 V (typical value: 3. 8 V) . The 50-pin B2B connector provides fiv e VB AT pins and five GND pi ns for ext ernal power input. To ensure that the MG323 module works normally, all the pins must be used ef f iciently.

When the MG323 module is used for different ex t er nal applications, pay special attention to the design for t he pow er supply. When the MG323 m odule transmits signals at the maximum p ow er, the transient current may reach the t r ansient peak value of about 2.0 A due to the differe nces in actual network environments. In this case, the VBAT voltage greatly drops. Make sure that t he voltage does not decrease below 3.3 V in any case. Otherwise, exceptions such as r estart of the MG323 module may occur.

A low-dropout (LDO) regulator or switch pow er with current output of more t han 2 A is recommended for exter nal power supply. Furthermore, At least five 220 µF storage capacitors should be connected in parallel at the power interface of the MG323 module. In addition, to reduce the im pact of channel impedance on voltage dro p, you are recommended to try to shorten the power supply circuit of the VBAT interface.

Pin for standby power inp ut of the RTC

It is recommended to employ a ferrite bead in series on VBAT power circuit to improve the EMI performanc e. And the rated current of the ferrite bead is required at least 2 A.

Figure 3-2 shows the recommended pow er circuit of MG323 module.

Figure 3-2 Recommended power circuit of MG323 module

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Description of the Application Interfaces

3.3.3 VCOIN Interface

VCOIN is an interface for standby power input of the RTC in the MG323 module. If the VBAT interface is ready for power supp ly, it on priority suppli es t he RTC with power . If the VBAT interface is not ready, the VCOIN interface provides standby power input for the RTC. In this case, the MG323 m odule needs 5 µA to maintain the RTC function.

You can use an external battery to supply power t hr ough the VCOIN interface. The recommended volt age is 3 V. You can also use an external capacitor if you do not use a battery. The capacitance d et ermines the duration of the RTC when the VBAT interface is not ready.

The MG323 module supports charging exter nal standby batteries. When the VBAT voltage is 3.8 V, the charging current is about 0.6 mA (typical value). Figure 3-3 shows two types of circuits for your reference.

Figure 3-3 VCOIN interface circuit

3.3.4 VIO Interface

Through the VIO interface , the MG323 module can supply 2. 8 V pow er ext er nally with an output current of 10 mA (typical value) for external level conv er sion or other applications.

If the MG323 module is in slee p mode, the VIO interface is in the l ow power consumption state (< 500 µA). If the MG323 module is in power down mode, the VIO is in the disabled state. If VIO pin is not in use, disc onnect the pin and make sure it is not grounded.

3.4 Power-On and Power-Off Time Sequence

3.4.1 Overview

The power-on, power-off, and reset control parts of the B2B i nt er face of the MG323 module includes power-on/power-off interface signal (TERM_ON) and the hardware reset interface signal (RESET). Table 3-3 lists the definitions of the interface pins.

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Description of the Application Interfaces

250 ms (min)

VBAT

TERM_ON

VIO

Fetch Ext Code

6.6 ms

6.3 ms

V

io

is set

Sampling period used to select V

gpio/Vmem

2.8 V

2.3 V

1s

130 ms

185 ms

HW Init

Power-Key SW Debouncing

Nominal SW

High-Z

Table 3-3 Definitions of pins of the power-on/power-off and reset interfaces

Pin No. Signal Name I/O Description

20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardwar e

3.4.2 Power-On Time Sequence



Make sure that the MG32 3 mo dule is powered on at the v oltage and operating temperature in the recommended range. Otherwise, the module may get damaged or work improper ly.



External application inter f ac es must be powered on after t he module is powered on.

You can power on the MG323 module through the TERM_ON interface. The software will report relevant information according to the act ual set t i ngs after the module is powered on. For example, the AT command automatically reports ^SYSSTART[1]. In this case, the external VI O inter face is enabled and supplies 2. 8 V pow er.

[1] For specific setting information about the power-on/power-off software, see the HUAWEI

MG323 Series Wireless Module AT Command Interface Specification.

Figure 3-4 shows the power-on time sequence.

Figure 3-4 Power-on time sequence

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Description of the Application Interfaces



Fetch Ext Code in the figure is a file system in the MG323 module.



Before powering on the MG323, make sure that TERM_ON is in High-Z condition.

3.4.3 Power-Off Time Sequence

The MG323 module supports power-off through the TERM_ON interface or the

AT^SMSO command. Figure 3-5 shows the power-off time sequence.

Figure 3-5 Power-off time sequence



The processing of the power-off event depends on the normal stop time of the file system in the MG323 module. The processing varies with the capacity of the file system.



Do not suddenly turn off the VBAT power when the module is working. It is recommended to power-off the module before turning off the VBAT power.

3.4.4 RESET

The MG323 module supports hardware reset fun c t i on. If the software of the MG 323 module stops responding, you can reset the hardware through the RESET signal. After the hardware is reset, the software starts powering on the m odule and reports relevant information according to the actual settings. For example, the AT command automatically report s ^SYSSTART. In this case, the external VI O int er f ace is enabled and supplies 2.8 V power.

3.5 Signal Control Interface

3.5.1 Overview

The signal control part of the B2B interface in the MG323 module consists of:



Power-on/off (TE RM_ON) pin



Hardware reset (RESET) pin

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Description of the Application Interfaces



Network status LED (LED_STATUS) pin

Table 3-4 lists the pins on the signal control interface .

Table 3-4 Pins on the signal control interface

Pin No. Signal Name I/O Description

20 TERM_ON I Pin for controlling power-on and power-off 22 RESET I Pin for resetting the hardware 25 LED_STATUS O Pin for network status LED

3.5.2 Input Signal Control Pins

The MG323 module implements power-on and power-off and resets the hardware through the input signal contr ol pins.

The TERM_ON pin is used to implement power-on and power-off. If the TE RM_ON pin is pulled down for 1 second to 2 seconds, the module is pow er ed on; if the TERM_ON p in is pulled down for 1 secon d t o 2 seconds again, the module is powered off.

The RESET pin is used t o reset the hardware. When the software st ops responding, the RESET pin can be pulled down for at least 10 ms to reset the hardware.

As the RESET and TERM_ON signals are relatively sensitive, it is recommended that you install a 10 nF capacitor near t he R ESET and T ER M _ON pins of the B2B interface for filtering. I n addition, when you design a circuit on the PCB of the interface board, it is reco m m ended that the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need t o w r ap t he ar ea adjacent to the signal wire with a gr ound wire. Otherwise, the module may be reset due to interference.

Figure 3-6 shows the con nect ions of the TERM_O N and RESET pins.

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Description of the Application Interfaces

Application Device

(Host）

2.2 kΩ

RESET

TERM_ON

2.2 kΩ

10 nF

b

c

e

c

e

HUAWEI Module (Modem)

Figure 3-6 Connections of the TERM_ON and RESET pins

3.5.3 Output Signal Control Pin

The MG323 module provides a network status LED pin LED_STAT US. The pulse signal output through this pin controls the status LED on the user interface board to display the network status.

Different blinking modes of the status L ED indicate different net w ork status. Table 3-5 describes the status of the LED_STA TUS pin.

Table 3-5 Status of the LED_STATUS pin

Working or Network Status Output Status of the LED_STATUS Pin

Sleep mode A low-level signal is output continuously. Network-searching or non-network

status (including the cas e when the

A high-level signal is output for 0.1s in a

period of 1s. SIM card is not inserted and t he case when the PIN number is unblocked)

Registered with a 2G network

A high-level signal is output for 0.1s in a

period of 3s. GPRS data service

A high-level signal is output for 0.1s in a

period of 0.125s. Voice call

A high-level signal is output

continuously.

In practical application, t he LED_STATUS pin cannot be directly used to dr iv e the status LED. The LED_STATUS p in needs to be used with a triode. To select a suitable current-limiting resistor for t he LED, check the actual volt age drop and rated

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current of the LED. Figure 3-7 shows the driving circuit.

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Figure 3-7 Driving circuit

3.6 UART Interface

3.6.1 Overview

The MG323 module provides the UART1 (8-wire UART) interface for one asynchronous communication channel. As the UART1 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is perfor m ed t hr ough the UART1 interface. The UAR T1 has the following features:



Full-duplex



Baud rate clock generated by the system clock



Direct me mory access (DMA) transmission



Baud rate ranging from 9600 bit/s to 230400 bit/s (115200 bit/s by default)



Self-adapted baud rate ranging from 9600 bit/s t o 115200 bit/s

Table 3-6 lists the UART1 interface signals.

Table 3-6 UART1 interface signals

Pin No. Signal Name Description Feature Direction

29 UART1_RD

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DCE transmit data

The data terminal equipment (DTE) receives serial data.

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Data circuitterminating equipment (DCE) to DTE

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Pin No. Signal Name Description Feature Direction

33 UART1_TD

38 UART1_RING

32 UART1_DTR

34 UART1_RTS

36 UART1_DSR

28 UART1_CTS

24 UART1_DCD

DCE receive data

DCE ring indicator

DCE data terminal ready

DCE request to send

DCE data set ready

DCE clear to send

DCE data carrier detect

The DTE transmits

DTE to DCE

serial data. The DCE notifies

DCE to DTE the DTE of a remote call.

The DTE is ready. DTE to DCE

The DTE requests

DTE to DCE the DCE to send data.

The DCE is ready. DCE to DTE

The DCE has

DCE to DTE switched to the data receiving mode.

A data link is set

DCE to DTE up.

3.6.2 Circuit Recommended for the UART Interface

Figure 3-8 shows the con nect ion of the UART1 int erface in the MG323 modul e ( DC E) with the host (DTE).

Figure 3-8 Connection of the UART1 interface in the MG323 module (DCE) with the host (DTE)

When an MG323 module receives a n SM ( Short Message), a low-level signal i s output through the RING ( pin 3 8) for 1s, as s hown in Figure 3-9 .

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1s 1s 1s

4s 4s 4s

Figure 3-9 The signal through the RING after the MG323 receives an SM

When an MG323 Module receives a v oice call, a periodical low lev el si gnal for 1s and a high level signal for 4s are out put by RING, as shown in Figure 3-10 .

Figure 3-10 The signal through the RING after the MG323 receives a voice call



For detailed application of the MG323 UART1 interface, see HUAWEI Module UART Serial

Port Design Guide.



The maximum level of UART1_DCD, UART1_RING, UART1_DSR and UART1_DTR signals is 3.2 V, and the maximum level of UART1_TD, UART1_RD, UART1_CTS and UART1_RTS signals is 3.25 V. Therefore, if the UART signals need to be connected the signal with 3.3 V, a level conversion curcuit is required.



UART1 interface must be powered on after the module is powered on to avoid the wind blow in which may cause the module cannot work properly.



The level of RS-232 Transceivers must match that of the MG323 module.

3.7 SIM Card Interface

3.7.1 Overview

The MG323 module provides a SIM card interface c om plying with the ISO 7816-3 standard and suppor ts automatic detection of a Class B SIM card or a Class C SIM card. Table 3-7 lists the SIM card interface signals.

Table 3-7 SIM card interface signals

Pin No. Signal Name I/O Description

1 SIM_CLK O Clock signal of the SIM card 3 VSIM P Power supply of the SIM card 5 SIM_DATA I/O Data signal of the SIM card 7 SIM_RST O Reset signal of the SIM ca r d

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VSIM

SIM_RST

SIM_CLK

SIM_DATA

GND

0.1µF

33 pF 33 pF 33 pF

ESD protection

SIM Card

Socket

HUAWEI Module (Modem)

Pin No. Signal Name I/O Description

11 GND - Ground signal of the SIM card

3.7.2 Circuit Recommended for the SIM Card Interface

As the MG323 module is not equipped with a SIM card socket, you need to place a SIM card socket on the user interface board. The SIM c ard s ig nals are transmitted outwards through the 50-p in B 2B connector interface. Figure 3-11 shows the circuit of the SIM card interface.

Figure 3-11 Circuit of the SIM card interface

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INTEAR_P/

EXTEAR_P INTEAR_N/

EXTEAR_N

ESD protection

33 pF

ferrite bead

Speaker

33 pF

100 pF

+

-

HUAWEI Module (Modem)



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic compatibility (EMC) authentication, the SIM card socket should be placed near the B2B connector interface (it is recommended that t he PC B circuit connecting the B2B connector interface and the SIM card socket not exceed 100 mm), becau s e a long circuit may lead to wave distortion, thus aff ect ing signal quality.



It is recommended that you w r ap t he ar ea adjacent to the SIM_CLK and SIM_DATA signal wires wit h a gr ound wire. The GND pi n of the SIM card socket and the GND pin of the SI M car d m ust be w ell connected to the power GND pin supplying power to the MG323 module.



A 0.1 µF c apacitor or a 0.22 µF capacitor is placed betw een the VSIM and GND pins in parallel. Three 33 pF capacitors are placed respectively between the SIM_DATA and GND pins, t he SIM_RST an d G ND pins, and the SIM_CLK and GND pins in p ar allel to filter interference from RF signals.



You do not need to pull the SIM_DATA pin up during design as a 15 kΩ resistor is used to connect the SIM_ D ATA pin to the VSIM pin.



It is recommended to ta ke electr ostatic discharge (ESD) protection measures near the SIM card socket. The TVS diode with Vrwm of 5 V and junction capacita nce less than 10 pF must be placed as close as possible to the SIM socket, and the Ground pin of the ESD protection component is well conn ected to the power Ground pin that supplies p ow er to the MG323 module.

3.8 Audio Interface

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The MG323 module provides two types of audio int er fac es: one is for handsets, the other is for headsets. The audio interfaces of the MG323 module suppor t input from handset microphones and headset microphones, and provide output that supports 32

Ω handsets and 16 Ω headsets. Differential signal lines are recommended for the

microphone interface an d the speaker interface. Single-ended signal lines ar e not recommended. The reception gain can be adjusted by using software.

Figure 3-12 External circuit for 32 Ω handsets/16 Ω headsets

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33 pF capacitors are added for filtering radio frequency interference.

Figure 3-13 External circuit for the microphone interface

33 pF capacitors are added for filtering radio frequency interference.

It is recommended that ESD components be added to the external circuit of the audio interface to protect the modul e.

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Antenna Interface

4.1 About This Chapter

An RF connector or an antenna pad can be used as the connection method of an antenna interface. When the MG323 module works properly, only one of the preceding connection methods is used. In addition, t he ant enna interface must be used with coaxial cables w it h 50 Ω characteristic im pedance.

4 Antenna Interface

4.2 Antenna Installation

The MG323 module supports the following t w o ant enna c onnection methods: buckled RF connector U.FL-R-SMT-1(80) manufactured by Hirose, and antenna pad. It is recommended that y ou use t he buckled RF connector.

When the MG323 module works properly, only one antenna connection method can be used; otherwise, the RF performance may det er iorate.

If a buckled RF connector is used, it is recommended t hat you use a 50 Ω coaxial cable in the U.FL series. The height of the connector increases by 0.8 mm when this cable is used.

If an antenna pad is used, you need to connect the coaxia l cable core to the pad. I n addition, you need to con nect t he s hi el d ground of the coaxial ca ble to t he r eference ground near the pad. You can ch oose a suitable direction to weld the RF cable t o meet the installation r equirements according to the actual applicatio n.

When trying to shorten the opening between the coaxial cable core and the shield ground, you also need to prev ent a short circuit.

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Antenna Interface

The properties of major mat er ials of the MG323 modul e are as follows:



PCB: FR4



Antenna pad: cheminal nickel-gold pad

4.3 Coaxial Cable and RF Connector

The U.FL-R-SMT-1(80) RF connector manufactured by Hirose is used as the antenna interface in the MG323 module. Figure 4-1 shows the RF connector dimens i ons.

Figure 4-1 RF connector dimensions

Table 4-1 lists the major specifications of the RF connector.

Table 4-1 Major specifications of the RF connector

Rated Condition

Environmental Condition

Frequency range

Characteristic

Direct current (DC) to 6 GHz

Temperature range

50 Ω Cable core

impedance

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–40°C to +90°C

Type Material

Shell

Insulating material

Phosphor and copper plated with silver

Gold-plated copper wire

Socket: liquid crystal polyester (LCP)

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You can visit http://www.hirose.com for more information about t he specifications of the U.FL-R-SMT-1(80) R F connector.

It is recommended that you use the Hirose coaxial cable with the RF connector. Figure 4-2 shows the specifications of the coaxial cable working with the RF connector.

Figure 4-2 Specifications of the coaxial cable working with the RF connector

You can visit http://www.hirose.com for more det ai led information about the coaxial cable working with the RF connector.

Figure 4-3 shows the connection between the R F connector and the U.FL-LP-040 cable.

Figure 4-3 Connection between the RF connector and the U.FL-LP-040 cable

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RF switch

HUAWEI Module (Modem)

4.4 ESD Protection for the Antenna Interface

In practical application, pay attention to the ESD protection for the antenna interface of the MG323 module. Incorrect operat i on may result in permanent damage to the RF components.

Figure 4-4 shows the ESD protection circuit recommended for the antenna interface.

Figure 4-4 ESD protection circuit recommended for the antenna interface

4.5 RF Specifications of the Antenna Interface

Table 4-2 RF specifications of the antenna interface in the MG323 module

Specification

Uplink frequency range (Mobile station to base transceiver

station)

It is recommended that you pay attention to the junction capacitance of the TVS diode when you choose the mo del of the TVS diode. Ensure t hat t he junction capacitance of the TVS diode is lower than 1 pF.

Table 4-2 lists the RF specifications of the antenna interface in the MG323 module.

Minimum Value

GSM 850 824 849 MHz E-GSM 900 880 915 MHz GSM 1800 1710 1785 MHz

Typical Value

Maximum Value

Unit

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Specification

Minimum Value

Typical Value

Maximum Value

Unit

GSM 1900 1850 1910 MHz

Downlink frequency range (Base transceiver stat ion to mobile

station)

GSM 850 869 894 MHz E-GSM 900 925 960 MHz GSM 1800 1805 1880 MHz

GSM 1900 1930 1990 MHz

Transmission power range GSM 850 31 33 35 dBm

E-GSM 900 31 33 35 dBm GSM 1800 28 30 32 dBm

GSM 1900 28 30 32 dBm

Number of carrier frequencies GSM 850 124

E-GSM 900 174 GSM 1800 374 GSM 1900 299

Duplex spacing GSM 850 25 MHz

E-GSM 900 45 MHz GSM 1800 95 MHz

GSM 1900 80 MHz Carrier spacing 200 kHz Multiplex and duplex modes

Frequency division duplexing–time division

multiple access (FDD-TDMA) Time slots of each TDMA fra me 8 Frame duration 4.615 ms Time slot duration 577 µs Modulation scheme Gaussian minimum shift keying (GMSK) Receiver sensitivity GSM-850 –108.5 dBm

EGSM-900 –108.5 dBm GSM-1800 –108 dBm

GSM-1900 –108 dBm

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Antenna Interface

4.6 Specifications of the Antenna Interface

Table 4-3 lists the recommended specifications of the antenna interface.

Table 4-3 Recommended specifications of the antenna interface

Working bands 824 MHz–960 MHz and 1710 MHz–1990 MHz Port impedance 50 Ω Voltage standing

wave ratio (VSWR) Maximum gain > 2.5 dBi Antenna efficiency Polarization Linear polarization Pattern Omnidirectional

< 3:1

> 40% @824 MHz–960 MHz; 50% @1710 MHz–1990 MHz

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5 Electrical and Reliability Features

5.1 About This Chapter

This chapter describes the elect rical and reliability features of the interfaces in the MG323 module, including:



Extreme Working Conditions



Operating and St orage Temperatur es and Hu midity



Electrical Criteria of Application Interfaces



Power Supply Features



Reliability Features



ESD Features

5.2 Extreme Working Conditions

Table 5-1 lists the extreme working conditions for the MG323 module. Using the MG323 module beyond th ese conditions may result in per m anent damage to the module.

Table 5-1 Extreme working conditions for the MG323 module

Symbol Specification Minimum Value Maximum Value Unit

VBAT External power voltage –0.40 6.00 V VCOIN

VI Digital pin voltage –0.40 VI+0.40 V

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Input voltage of standby power for the RTC

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2.00 3.15 V

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VI is 2.85 V or 2.8 V, which is the voltage of the digital I/O pin. For the details about VI, please see Table 3-1 .

5.3 Operating and Storage Temperatures and Humidity

Table 5-2 lists the operating and storage temperatures and humidity for the MG323 module.

Table 5-2 Operating and storage temperatures and humidity for the MG323 module

Specification Minimum Value Maximum Value Unit

Normal operating

–20 70 °C

temperatures Extended temperatures Extended temperatures Ambient temperature for

[1]

–30 –20 °C

[1]

70 75 °C

–40 85 °C

storage Moisture 5 95 %

[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate from 3GPP TS 45.005 specifications.

5.4 Electrical Criteria of Application Interfaces

Table 5-3 lists the sequence numbers of pins and definitions of signals on the 50-pin B2B interface of the MG323 module.

Table 5-3 Sequence numbers of pins and definitions of signals on the B2B interface

Pin No. Signal Name Pin No. Signal Name

1 SIM_CLK 2 INTEAR_N 3 VSIM 4 INTEAR_P 5 SIM_DATA 6 EXTEAR_P 7 SIM_RST 8 EXTEAR_N 9 NC 10 INTMIC_N

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Pin No. Signal Name Pin No. Signal Name

11 GND 12 INTMIC_P 13 NC 14 EXTMIC_P 15 NC 16 EXTMIC_N 17 NC 18 GND 19 NC 20 TERM_ON 21 NC 22 RESET 23 NC 24 UART1_DCD 25 LED_STATUS 26 NC 27 NC 28 UART1_CTS 29 UART1_RD 30 NC 31 NC 32 UART1_DTR 33 UART1_TD 34 UART1_RTS 35 VCOIN 36 UART1_DSR 37 NC 38 UART1_RING 39 NC 40 VIO 41 GND 42 VBAT 43 GND 44 VBAT 45 GND 46 VBAT 47 GND 48 VBAT 49 GND 50 VBAT

Table 5-4 lists electrical features (typical values) measured when no externa l device is connected to the MG32 3 mo dule through the 50-pin B2B interface.

Table 5-4 Electrical features of application interfaces

Function Signal Name I/O

Waveform and Level

Remarks

Power supply

VBAT P

interface

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=3.30 V to 4.80

V

I

V

=3.80 V

V

Itypical

Pins 42, 44, 46, 48, and 50 are pow er supply pins used to supply the MG 323 module with power. When the module t r ansmits signals at the maximum power, the transient current can reach about 2 A, which may result in VBAT voltage great drop. The VBAT power voltage for the MG323 module sh oul d not be lower than 3.3 V.

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Function Signal Name I/O

GND -

External

VIO P V power voltage interface

Interface for

VCOIN P V standby power input of the RTC

Waveform and Level

=2.70 V

omin

V

=2.80 V

otype

=2.95 V

V

omax

=10.00 mA

I

omax

=3.00 V

omax

V

=2.00 V

Imin

=3.00 V

V

Itype

=3.15 V

V

Imax

=5.00 μA at

I

Itype

VBAT=0 V

Remarks

Pins 41, 43, 45, 47, and 49 are pow er GND pins.

Pin 40 is a pin for supplying external devices with power from the MG3 23 m odule. Ensure that the external peaks an d burst do not damage the VIO interface.

If the MG323 module is in Sleep mode, the VIO pin is in the enabled low consu m pt ion state (< 500 uA). If the MG323 module is in Power Down mode, the VIO pin is in the disabled state.

This pin can be left open if it is not used. Pin 35 is a pin for standby power inp ut of t he

RTC. When the VBAT is not ready for power supply, the RTC can be supplied with power through an external coin bat tery or capacitor.

This pin can be left openif it is not used.

Power pin TERM_ON I V

Reset pin RESET I V

Signal of the network

LED_STATU

S

O V status LED SIM card

SIM_RST O V interface (Class B)

SIM_DATA I/O V

=0.40 V

ILmax

The signal can be detected when low level keeps effective for one second or more.

=0.40 V

ILmax

The signal can be detected when low level keeps effective for 10 milliseconds or more.

=2.70 V

oHmin

=2.32 V

oHmin

=0.58 V

V

oLmax

=2.03 V

oHmin

V

=0.40 V

oLmax

=0.58 V

V

ILmax

=2.03 V

V

IHmin

Pin 20 is a pin for powering on the module. Low level is effective.

Pin 22 is a pin for restarting the module. Low level is effective.

This pin can be left open if it is not used.

Pin 25 is a pin for controlling the net work status LED.

This pin can be left open if it is not used. Reset signal of the SIM ca r d

Data signal of the SIM card

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Function Signal Name I/O

SIM_CLK O V

VSIM P V

GND - GND of the SIM card SIM card

SIM_RST O V interface (Class C)

SIM_DATA I/O V

SIM_CLK O V

VSIM P V

Waveform and Level

=2.03 V

oHmin

V

=0.58 V

oLmax

=3.00 V

oHmax

=2.90 V

V

otype

=2.75 V

V

oHmin

=1.44 V

oHmin

=0.36 V

V

oLmax

=1.26 V

oHmin

V

=0.3 V

oLmax

=0.36 V

V

ILmax

=1.26 V

V

IHmin

=1.26V

oHmin

V

=0.36V

oLmax

=1.95 V

oHmax

V

=1.80 V

otype

=1.65 V

V

oHmin

Remarks

Clock signal of the SIM card

Power voltage of the SIM card

Reset signal of the SIM card

Data signal of the SIM card

Clock signal of the SIM card

Power voltage of the SIM card

UART1 communicatio n interface

Analog audio interface

GND - GND of the SIM card

UART1_RD O V

UART1_TD I

UART1_RIN

O

G

V V V

oLmax oHmin ILmax IHmin

=0.10 V

=2.70 V

=0.40 V

=2.40 V

This interface can be used to transmit AT commands and data.

UART1_DSR O

UART1_RTS I

UART1_DTR I

UART1_CTS O

UART1_DCD O

EXTMIC_N AI

Negative end of differentia l headset MIC input through channel 2

EXTMIC_P AI

Positive end of differentia l headset MIC input through channel 2

INTMIC_P AI

Positive end of differentia l handset MIC input through channel 1

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Function Signal Name I/O

INTMIC_N AI

EXTEAR_N AO

EXTEAR_P AO

INTEAR_P AO

INTEAR_N AO

NC pin NC

P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output; AI indicates pins for analog s ignal input; AO indicates pins for analog signal output.

Waveform and Level

Remarks

Negative end of differentia l handset MIC input through channel 1

Negative end of differentia l speaker output through channel 2

Positive end of differentia l speaker output through channel 2

Positive end of differentia l speaker audio output through channel 1

Negative end of differentia l speaker audio output through channel 1

Pins 9, 13, 15, 17, 19, 21, 23, 26, 27, 30, 31, and 39 are internal pins. These pins need to be left floating when they are used.

5.5 Power Supply Features

5.5.1 Input Power Supply

Table 5-5 lists the requir ements for input pow er of the MG323 module.

Table 5-5 Requirements for input power of the MG323 module

Parameter Minimum Value Typical Value Maximum Value Unit

VBAT 3.30 3.80 4.80 V VCOIN 2.00 3.00 3.15 V

5.5.2 Working Current

Table 5-6 lists the working cur r ent of t he MG323 module.

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Table 5-6 Working current of the MG323 module

Working Mode Typical value Unit Remark

Power-off mode 50.00 µA

VBAT is powered on, yet the module is in power-off state.

Sleep mode 1.50 mA MFRMS=2

0.89 mA MFRMS=5

0.85 mA MFRMS=9

Idle mode 50.00 mA MFRMS=5



Current in the sleep mode indicates that module enters in the sleep mode (AT+CFUN=0), and the serial port cannot be used.



The typical values are the average of some test samples.



In idle mode, the module is registered to the network; no voice or data service is ongo ing and the serial port can be used.

Table 5-7 Working current of the MG323-B module (for GPRS mode)

Band

Typical

Unit PCL Configuration

value

GPRS850 242 mA 5 1 Up/1 Down

438 2 Up/1 Down 136 mA 10 1 Up/1 Down 220 2 Up/1 Down

GPRS900 252 mA 5 1 Up/1 Down

455 2 Up/1 Down 138 mA 10 1 Up/1 Down 225 2 Up/1 Down

GPRS1800 185 mA 0 1 Up/1 Down

340 2 Up/1 Down 85 mA 10 1 Up/1 Down 127 2 Up/1 Down

GPRS1900 181 mA 0 1 Up/1 Down

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336 2 Up/1 Down

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Band

Typical value

81 mA 10 1 Up/1 Down 123 2 Up/1 Down

The typical values are the average of some test samples.

5.6 Reliability Features

Table 5-8 lists the test conditions and results of the mechanical reliabilit y of the MG323 module.

Table 5-8 Test conditions and results of the mechanical reliability of the MG323 module

Item Test Condition Standard

Low-temperature storage

Unit PCL Configuration

Temperature: –40ºC±2ºC Test duration: 24 h

IEC60068

High-temperature storage

Low-temperature working

High-temperature working

Temperature: 85ºC±2ºC Test duration: 24 h

Temperature: –30ºC±2ºC Test duration: 24 h

Temperature: 75ºC±2ºC Test duration: 24 h

Damp heat cycling High temperature: 55ºC±2ºC

Low temperature: 25ºC ±2ºC Humidity: 95% Repetition times: 4 Test duration: 12 h+12 h

Temperature shock Low temperature: –40ºC±2ºC

High temperature: 85ºC±2ºC Temperature change interval: < 30s Test duration: 15 min Repetition times: 100

IEC60068

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HUAWEI MG323 GSM M2M Module

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Electrical and Reliabilit y Features

Item Test Condition Standard

Condensation test Temperature: –40º ±2°C

Time for keeping condens ed: 2 h Recovery temperature: 25ºC±2°C Recovery time: 5 min Repetition times: 6

Dust test Dust density: 2 kg/m3

Dust type: dry talcum powder Size requirement: < 75 µm Duration: 8 h

Salty fog test Temperature: 35°C

Density of the NaCl solution: 5±1% Spraying interval: 8 h Duration of exposing the mo dule to

the temperature of 35°C: 16 h

Sun exposure Radiation strength: 1120 W/m2

Duration: 20 h Repetition time: 3

Sine vibration Frequency range: 5 Hz to 200 Hz

Acceleration: 10 m/s

2

Frequency scan rate: 1 oct/min Test period: 3 axial directi ons. Five

circles for each axial direct ion.

IEC60068

Shock test Half-sine wave shock

Peak acceleration: 300 m/s Shock duration: 11 ms Test period: 6 axial directi ons. O ne

shock for each axial direction.

Clash test

Half-sine wave Peak acceleration: 180 m/s Pulse duration: 6 ms Repetition time: 6 directions. 1000

times for each direction.

IEC60068

2

IEC60068

2

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Electrical and Reliabilit y Features

Item Test Condition Standard

Drop test

5.7 ESD Features

Pay great attention to ESD prot ection when using the MG323 module. To ensure that the working reference GN D is c onnected to the MG323 module and user interface board properly, you are recommended not to spray a coated insulation on the structure fixing hole (connecting with the main ref er ence GND of the user interface board) and connect the hole wit h t he M G 323 module through the metal fastener or other low-resistance fastener. For specific installation method and fastener specification, see “ 6.4 MG323 Module Installation Description."

First case: 0.3 m in height. Drop t he MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested.

Second case: 0.8 m in height . Dr op the MG323 module on the marble terrace with one surface facing downwards twice. Six surfaces should be tested.

IEC60068

Table 5-9 lists the test res ults of the ESD performance of the MG323 module according to the EN61000-4-2 standard.

Table 5-9 ESD performance

ESD Test Standard Contact Discharge Air Discharge

EN61000-4-2 ±4 kV ±8 kV

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HUAWEI MG323 GSM M2M Module

Hardware Guide

Mechanical Specifications

6.1 Overview

This chapter describes the dimensions of the MG32 3 mo dule, including:

   

6 Mechanical Specifications

Dimensions Dimensions of the B2B Connector MG323 Module Instal lation Description Specification Selection for Fasteners

6.2 Dimensions

Dimensions (L x W x H): 35 mm x 32.5 mm x 3.05 mm Figure 6-1 shows the dimensions. Weight: 5.8 g

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Mechanical Specifications

Figure 6-1 Dimensions of the MG323 module (unit: mm)

6.3 Dimensions of the B2B Connector

The MG323 module uses t he 50-pin B2B connector whose model is DF12C(3.0)50DS-0.5V(81) and whos e pin spacing is 0.5 mm to work with the conne ct or DF12E (3.0)-50DP-0.5V (81) of the DF12 series (both conn ect or s ar e manufactured by Hirose). For specific models, access http://www.hirose.com.

Figure 6-2 DF12C (manufactured by Hirose) used on the MG323 module

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Mechanical Specifications

Figure 6-3 DF12E (manufactured by Hirose) recommended to be used with the MG323 module on the user interface board

Table 6-1 Ordered connector model and DF12 product series working with the MG323 module

Item Model

Connector model used with the MG323 module

Connector model recommended to be used

DF12C(3.0)-50DS-

0.5V(81) DF12E(3.0)-50DP-

0.5V(81) on the user interface board

Stacking

HRS Number

Height (mm)

3.0 537-0694-9-81

3.0 537-0834-6-**

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Mechanical Specifications

Figure 6-4 Dimensions of the connector used on the MG323 module (unit: mm)

6.4 MG323 Module Installation Description

Three structure fixing hole s ( diameter: 2 mm) are reserv ed in the M G323 module. The holes are not sprayed w it h a coat ed i ns ulation and connected with the main reference GND of the module, as shown in Figure 6-5 .

Figure 6-5 Structure fixing hole

You can insert machine screws through the st r ucture fixing holes and metal fasteners and fasten with nuts to f irm ly c onnect t he M G 323 module to the user interface board [1]. The metal fastener is placed between the MG323 module and user interface

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HUAWEI MG323 GSM M2M Module

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Mechanical Specifications

board and functions as a brace an d c onnects the MG323 module and user interface board through the reference GND. Below the user interface board, the nuts are used to fasten the screws. Figure 6-6 shows the MG323 module installation.

Figure 6-6 MG323 module installation

[1]: Pay great attention to ESD protection when using the MG323 module. To ensure that the working reference GND is connected to the MG323 module and user interface board properly, you are recommended not to spray a coated insulation on the structure fixing hole (connecting with the main reference GND of the user interfac e board) and connect the hole with the MG323 module through the metal fastener or other low-resistance fastener.

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Mechanical Specifications

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6.5 Specification Selection for Fasteners

Protecting

from Screw

Loosening

To ensure that the MG323 module is firmly fixed on the interface board when using the MG323 module, you are recommended to you use the M1.6 or M1.8 machine screw. You can also customize the screws. The fastener components in the following figures are recommended. The machine screw dimensions are M1.6×7.5×3.0×1.0. It is recommended that you plate gold on the metal fastener. Figure 6-7 shows the specific dimensions for the fastener components.

Figure 6-7 Machine screw dimensions

HUAWEI MG323 GSM M2M Module

Hardware Guide

Mechanical Specifications

Figure 6-8 Nut dimensions

Figure 6-9 Metal fastener dimensions

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Appendix A Circuits of Typical Interfaces

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7 Appendix A Circuits of Typical Interfaces

22 μF

1μF100 nF330pF

Ferrite bea d

+

220 μF

+ + + +

220 μF 220 μF 220 μF 220 μF

LED_STA TUS

LED_STAT US

nF

VBAT

c

e

b

470Ω

2.2K

0.1u

VCCA

VCCB

A1

B1

B2

B3 B4

A2

A3 A4

GND OE

UART1_DTR_MCU

UART1_TD_MCU

UART1_RD_MCU

UART1_RTS_MCU

UART1_DTR_MCU

UART1_TD_MCU

UART1_RD_MCU

UART1_RTS_MCU

UART1_DTR

UART1_TD

UART1_RD

UART1_RTS

UART1_ R TS

100nf 1uf

VGPIO

10K

VGPIO

VIO

b

c

e

b

c

e

0

RESET

Figure 7-1 Circuits of typical interfaces in the MG323 module

HUAWEI MG323 GSM M2M Module

Hardware Guide

Appendix B Acronyms and Abbreviations

8 Appendix B Acronyms and Abbreviations

Acronym or Abbreviation Expansion

B2B Board-to-Board CE European Conformity CS Coding Scheme CSD Circuit Switched Data DC Direct Current DCE Data Circuit-terminating Equipment DMA Direct Memory Access DTE Data Terminal Equipment EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FCC Federal Communications Commission FDD-TDMA

GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service ISO International Standards Organization

Frequency Division Duplexing–time Division Multiple Access

LCP Liquid Crystal Polyester LDO Low-Dropout LED Light-emitting Diode MCP Multi-chip Package NTC Negative Temperature Coefficient

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Appendix B Acronyms and Abbreviations

Acronym or Abbreviation Expansion

PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit RF Radio Frequency RoHS

Restriction of the Use of Certain Hazardous

Substances RTC Real-time Clock SIM Subscriber Identity Module TTL Transistor-transistor Logic TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver-transmitter VSWR Voltage Standing Wave Ratio

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Huawei MG323 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Introduction

1.1 Overview

2.1 About This Chapter

2 Overall Description

2.2 Function Overview

2.3 Application Block Diagram

2.4 Circuit Block Diagram

3 Description of the Application Interfaces

3.1 About This Chapter

3.2 B2B Connector Interface

3.3 Power Interface

3.3.1 Overview

3.3.2 VBAT Interface

3.3.3 VCOIN Interface

3.3.4 VIO Interface

3.4 Power-On and Power-Off Time Sequence

3.4.1 Overview

3.4.2 Power-On Time Sequence

3.4.3 Power-Off Time Sequence

3.4.4 RESET

3.5 Signal Control Interface

3.5.1 Overview

3.5.2 Input Signal Control Pins

3.5.3 Output Signal Control Pin

3.6 UART Interface

3.6.1 Overview

3.6.2 Circuit Recommended for the UART Interface

3.7 SIM Card Interface

3.7.1 Overview

3.7.2 Circuit Recommended for the SIM Card Interface

3.8 Audio Interface

4.1 About This Chapter

4 Antenna Interface

4.2 Antenna Installation

4.3 Coaxial Cable and RF Connector

4.4 ESD Protection for the Antenna Interface

4.5 RF Specifications of the Antenna Interface

4.6 Specifications of the Antenna Interface

5 Electrical and Reliability Features

5.1 About This Chapter

5.2 Extreme Working Conditions

5.3 Operating and Storage Temperatures and Humidity

5.4 Electrical Criteria of Application Interfaces

5.5 Power Supply Features

5.5.1 Input Power Supply

5.5.2 Working Current

5.6 Reliability Features

5.7 ESD Features

6.1 Overview

6 Mechanical Specifications

6.2 Dimensions

6.3 Dimensions of the B2B Connector

6.4 MG323 Module Installation Description

6.5 Specification Selection for Fasteners

7 Appendix A Circuits of Typical Interfaces

8 Appendix B Acronyms and Abbreviations