Huawei MC509 CDMA LGA User Manual

HUAWEI MC509 CDMA LGA Module

Hardware Guide

Issue

01

Date

2011-04-08

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters.

Huawei Technologies Co., Ltd.

Huawei Industrial Base, Bantian, Longgang, Shenzhen 518129, People’s Republic of China Tel: +86-755-28780808 Global Hotline: +86-755-28560808 Website: www.huawei.com E-mail: mobile@huawei.com Please refer color and shape to product. Huawei reserves the right to make changes or improvements to any of the products without prior notice.

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Notice

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HUAWEI MC509 CDMA LGA Module Hardware Guide

About This Document

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History

Version

Date

Chapter

Descriptions

01

2011-04-08

Creation

About This Document

HUAWEI MC509 CDMA LGA Module Hardware Guide

About This Document

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4

Summary

Chapter

Details

1 Introduction

Describes the short introduction of the product.

2 Overall Description

Describes the Function overview, Circuit Block Diagram and Application Block Diagram of the product.

3 Description of the Application Interfaces

Describes the external application interfaces of the product.

4 RF Specifications

Describes the RF specifications of the product.

5 Electrical and Reliability Features

Describes the electrical and reliability features of the interfaces in the product.

6 Mechanical Specifications

Describes the Dimensions, Label and Packing System of the product.

7 Certifications

Describes the certifications of the product.

8 Safety Information

Lists the safety information of using the product.

9 Appendix A Circuit of Typical InterfacesI

Lists the circuit of typical interface of the product.

10 Appendix B Acronyms and Abbreviations

Lists the acronyms and abbreviations mentioned in this document.

This document provides information about the major functions, supported services, system architecture, and technical references of HUAWEI MC509 CDMA LGA Module.



Packing System



Certifications



Environmental Protection Certification and Test



National Compulsory Certification

The following table lists the contents of this document.

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Content

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Content

1 Introduction.................................................................................................................................... 8

2 Overall Description ...................................................................................................................... 9

2.1 About This Chapter ........................................................................................................................... 9

2.2 Function Overview............................................................................................................................ 9

2.3 Circuit Block Diagram ...................................................................................................................... 11

2.4 Application Block Diagram ............................................................................................................. 12

3 Description of the Application Interfaces .............................................................................. 13

3.1 About This Chapter ......................................................................................................................... 13

3.2 LGA Interface ................................................................................................................................. 13

3.3 Power Interface .............................................................................................................................. 22

3.3.1 Overview ................................................................................................................................ 22

3.3.2 VBAT Interface ....................................................................................................................... 23

3.3.3 VCOIN Interface .................................................................................................................... 24

3.3.4 Output Power Supply Interface ............................................................................................. 25

3.4 Signal Control Interface .................................................................................................................. 26

3.4.1 Overview ................................................................................................................................ 26

3.4.2 Input Signal Control Pins ....................................................................................................... 27

3.4.3 Output Signal Control Pin (TBD) ........................................................................................... 30

3.4.4 WAKEUP_IN Signal............................................................................................................... 30

3.4.5 WAKEUP_OUT Signal............................................................................................................. 30

3.5 UART Interface ............................................................................................................................... 31

3.5.1 Overview ................................................................................................................................ 31

3.5.2 Circuit Recommended for the UART Interface ...................................................................... 32

3.6 USB Interface ................................................................................................................................. 33

3.7 UIM Card Interface ......................................................................................................................... 35

3.7.1 Overview ................................................................................................................................ 35

3.7.2 Circuit Recommended for the UIM Card Interface ................................................................ 35

3.7.3 ESD Protection for the UIM Card Interface ........................................................................... 37

3.8 Audio Interface ............................................................................................................................... 37

3.8.1 Analogue Audio ...................................................................................................................... 37

3.8.2 Digital Audio ........................................................................................................................... 39

3.9 General Purpose I/O Interface ....................................................................................................... 40

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3.10 JTAG Interface ............................................................................................................................. 41

3.11 RF Antenna Interface.................................................................................................................... 41

3.12 NC Pins ........................................................................................................................................ 42

4 RF Specifications ......................................................................................................................... 43

4.1 About This Chapter ......................................................................................................................... 43

4.2 Antenna Installation Guidelines ...................................................................................................... 43

4.3 Operating Frequencies ................................................................................................................... 43

4.4 Conducted RF Measurement ......................................................................................................... 44

4.4.1 Test Environment ................................................................................................................... 44

4.4.2 Test Standards ....................................................................................................................... 44

4.5 Conducted Rx Sensitivity and Tx Power ........................................................................................ 44

4.5.1 Conducted Receive Sensitivity .............................................................................................. 44

4.5.2 Conducted Transmit Power ................................................................................................... 45

4.6 Antenna Design Requirements ...................................................................................................... 45

4.6.1 Antenna Design Indicators..................................................................................................... 45

4.6.2 Interference ........................................................................................................................... 47

4.6.3 CDMA Antenna Requirements............................................................................................... 47

4.6.4 Radio Test Environment ........................................................................................................ 48

5 Electrical and Reliability Features ........................................................................................... 49

5.1 About This Chapter ......................................................................................................................... 49

5.2 Extreme Working Conditions .......................................................................................................... 49

5.3 Working and Storage Temperatures and Humidity ........................................................................ 50

5.4 Electrical Features of Application Interfaces .................................................................................. 50

5.5 Power Supply Features .................................................................................................................. 51

5.5.1 Input Power Supply ............................................................................................................... 51

5.5.2 Power Consumption .............................................................................................................. 52

5.6 Reliability Features ......................................................................................................................... 52

5.7 EMC and ESD Features ................................................................................................................. 54

6 Mechanical Specifications ......................................................................................................... 55

6.1 About This Chapter ......................................................................................................................... 55

6.2 Dimensions and interfaces ............................................................................................................. 55

6.3 PCB Pad Design ............................................................................................................................ 56

6.4 Label ............................................................................................................................................... 57

6.5 Packing System.............................................................................................................................. 58

7 Certifications ................................................................................................................................ 59

7.1 About This Chapter ......................................................................................................................... 59

7.2 Environmental Protection Certification and Test ............................................................................ 60

7.2.1 RoHS ..................................................................................................................................... 60

7.2.2 WEEE .................................................................................................................................... 61

7.2.3 PVC-free ................................................................................................................................ 62

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7.3 National Compulsory Certification .................................................................................................. 62

7.3.1 Product Certification .............................................................................................................. 62

7.3.2 Importance of Product Certification ....................................................................................... 62

7.3.3 Product Certification Test Items ............................................................................................. 62

7.3.4 Product Certification Classifications ...................................................................................... 63

7.3.5 Certification Modes ................................................................................................................ 63

7.3.6 Certification Types ................................................................................................................. 64

7.3.7 Guide to Product Certification ............................................................................................... 72

7.4 GCF and PTCRB............................................................................................................................ 73

7.4.1 GCF Certification ................................................................................................................... 73

7.4.2 PTCRB Certification .............................................................................................................. 75

7.4.3 Overall-System Certification .................................................................................................. 75

8 Safety Information ...................................................................................................................... 79

8.1 Interference .................................................................................................................................... 79

8.2 Medical Device ............................................................................................................................... 79

8.3 Area with Inflammables and Explosives ......................................................................................... 79

8.4 Traffic Security ................................................................................................................................ 80

8.5 Airline Security ................................................................................................................................ 80

8.6 Safety of Children ........................................................................................................................... 80

8.7 Environment Protection .................................................................................................................. 80

8.8 WEEE Approval .............................................................................................................................. 80

8.9 RoHS Approval ............................................................................................................................... 80

8.10 Laws and Regulations Observance ............................................................................................. 81

8.11 Care and Maintenance ................................................................................................................. 81

8.12 Emergency Call ............................................................................................................................ 81

8.13 Specific Absorption Rate (SAR) ................................................................................................... 81

8.14 Regulatory Information ................................................................................................................. 82

8.14.1 CE Approval (European Union) ........................................................................................... 82

8.14.2 FCC Statement .................................................................................................................... 82

9 Appendix A Circuit of Typical Interfaces .............................................................................. 83

10 Appendix B Acronyms and Abbreviations .......................................................................... 85

HUAWEI MC509 CDMA LGA Module Hardware Guide

Introduction

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1 Introduction

Product name

RF Band

Bandwidth

MC509

CDMA/EVDO 1900/800 MHz

Data only

Telematics

Analog voice input function

×

√

Analog voice output function

×

√ PCM voice function

×

√

This document describes the hardware application interfaces and air interfaces that are provided when the HUAWEI MC509 CDMA LGA Module (hereinafter referred to as the MC509 module) is used.

This document helps you to understand the interface specifications, electrical features, and related product information of the MC509 module. To facilitate its use in different fields, relevant development guide documents are also provided with the module, which can be obtained from the Huawei website.



CDMA/EVDO 1900/800 MHz（Data only or Telematics）

MC509 model has two editions: Data only or Telematics. Data only does not support the voice function.

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Overall Description

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2.1 About This Chapter

Feature

Description

Physical Features

Dimensions (L × W × H): 30mm×30mm×2.6mm

Weight about 5.5g

Working Bands

CDMA2000 1x, CDMA2000 EV-DO Rev 0, CDMA2000 EV-DO Rev A

Supports BC0(800MHz band), BC1(1900MHz band) (Data only or Telematics)

Working Temperature

Normal working temperature: –20°C ~ +70°C

Extreme working temperatures: –30°C ~ –20°C and +70°C ~ +75°C

Ambient Temperature for Storage

–40°C ~ 85°C

Power Voltage

3.3V ~ 4.2V (3.8V is recommended.)

AT Commands

See the HUAWEI MC509 CDMA LGA Module AT Command

Interface Specification.

This chapter gives a general description of the MC509 module and provides:



Function Overview



Circuit Block Diagram



Application Block Diagram

2 Overall Description

2.2 Function Overview

Table 2-1 Feature

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Overall Description

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Feature

Description

Application Interface (145pin LGA interface)

Universal Asynchronous Receiver-Transmitter (UART)

Supporting 8-wire UART

One standard user interface Module (UIM) card (3V or 1.8V)

Audio (OPTION): (only telematics version supports this function)

For detailed information about the working bands supported, see 错误！未找到引用源。.



2×Micphone in



1×Speaker out



1×handset out



1×PCM

USB 2.0(full speed)

Power on/off

Reset

Wakeup In

Wakeup out (TBD)

Light-emitting Diode (LED)

Configurable General-purpose I/O (GPIO)

RF pad

Power

SMS

New message alert, text message receiving, and text message sending

Management of text messages: read messages, delete messages, storage status, and message list

Support for the Protocol Data Unit (PDU) mode

Data Services

CDMA2000 1X: UL/DL: 153.6kbps

CDMA2000 1X/EVDO rev.0: UL 153.6kbps DL 2.4Mbps

CDMA2000 1X/EVDO rev A: UL 1.8Mbps DL 3.1Mbps

Security

(TBD)

Internet Protocols

TCP/IP, UDP/IP, PPP protocol Applications

(TBD)

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Overall Description

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Feature

Description

Certification Information



Restriction of the use of certain Hazardous Substances (RoHS)



Federal Communications Commission (FCC)



China Compulsory Certification(CCC)



China Telecommunications Equipment Network Access Approval(CTA)



Waste Electrical and Electronic Equipment Directive(WEEE)

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the MC509 module. The application block diagram and major functional units of the MC509 module contain the following parts:



Qualcomm QSC chip



Multi-chip package (MCP) memory



RF Circuit

Figure 2-1 Circuit block diagram of the MC509 module

Only telematics version supports the audio function.

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2.4 Application Block Diagram

UART Interface：

The module supports 3-line or 5-line or full serial port interface.

USB Interface：

The USB interface supports USB 2.0 full speed standard.

UIM Interface：

The UIM interface provides the interface for a UIM card. The UIM card can be inserted into the host side.

Power Supply：

DC 3.8V is recommended.

Audio Interface：

The module supports one speaker output, two microphone, one handset, one speaker and one PCM interface (only telematics version supports the audio function).

Figure 2-2 Application block diagram of the MC509 module

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Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the MC509 module, including:



LGA Interface



Power Interface



Signal Control Interface



UART Interface



USB Interface



UIM Card Interface



Audio Interface



General Purpose I/O Interface



JTAG Interface



RF Antenna Interface



NC Pins

3.2 LGA Interface

The MC509 module uses a 145-pin LGA as its external interface. For details about the module and dimensions of the LGA, see “6.2 Dimensions and interfaces”.

If DTE supports Huawei LGA module, such as module with system of CDMA, TDSCDMA or HSPA +, you can refer to Huawei LGA Migration Guide to get the details.

Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MC509 module.

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Table 3-1 Definitions of pins on the LGA interface

PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

1

NC - -

Not connected, please keep this pin open

- - -

2

NC - -

Not connected, please keep this pin open

- - -

3

NC - -

Not connected, please keep this pin open

- - -

4

NC - -

Not connected, please keep this pin open

- - 5

PCM_SYNC

GPIO

I/O

PCM interface sync

-0.3

2.6

2.9 6 PCM_DIN

GPIO

I

PCM I/F data in

-0.3

2.6

2.9 7 PCM_DOUT

GPIO

O

PCM I/F data out

-0.3

2.6

2.9 8 PCM_CLK

GPIO

I/O

PCM interface clock

-0.3

2.6

2.9

9

NC - -

Not connected, please keep this pin open

- - -

10

NC - -

Not connected, please keep this pin open

- - 11

WAKEUP_IN

GPIO

I

Host to wake up Module

-0.3

2.6

2.9

12

VBAT

- P Power supply input

3.3

3.8

4.2

13

VBAT

- P Power supply input

3.3

3.8

4.2

14

PS_HOLD

-

This input high to keep power on, low to shut down.

-

1.8

-

15

Reserved

- - - - -

-

16

NC - -

Not connected, please keep this pin open

- - -

17

NC - -

Not connected, please keep open

- - -

18

NC - -

Not connected, please keep this pin open

- - -

19

NC - -

Not connected, please keep this pin open

- - -

20

NC - -

Not connected, please keep this pin open

- - -

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

21

NC - -

Not connected, please keep this pin open

- - -

22

NC - -

Not connected, please keep this pin open

- - -

23

NC - -

Not connected, please keep this pin open

- - -

24

NC - -

Not connected, please keep this pin open

- - -

25

NC - -

Not connected, please keep this pin open

- - -

26

NC - -

Not connected, please keep this pin open

- - -

27

NC - -

Not connected, please keep this pin open

- - 28

Reserved

- - - - -

-

29

Reserved

- - - - -

-

30

JTAG_TMS

- I JTAG Test mode select

-0.3

2.6

2.9

31

VCC_EXT2

- P 2.6V POWER output

-

2.6

-

32

VCC_EXT1

- P 1.8V POWER output

-

1.8

-

33

NC - -

Not connected, please keep this pin open

- - -

34

UIM_VCC

-

P

Power supply for UIM card

-0.3

1.8/2.8 5

2.1/3.1 5

35

VCOIN

- P Coin cell input

1.5

3.0

3.25

36

JTAG_TRST_N

-

I

JTAG reset

-0.3

2.6

2.9

37

NC - -

Not connected, please keep this pin open

- - -

38

MIC2_P

-

I

(Only telematics version supports audio function, Data only version does not support this function) Positive pole of the input of audio interface 2

- - -

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

39

MIC2_N

-

I

(Only telematics version supports audio function, Data only version does not support this function) Negative pole of the input of audio interface 2

- - -

40

MIC1_P

-

I

(Only telematics version supports audio function , Data only version does not support this function) Positive pole of the input of audio interface 1

- - -

41

MIC1_N

-

I

(Only telematics version supports audio function , Data only version does not support this function) Negative pole of the input of audio interface 1

- - -

42

JTAG_TCK

-

I

JTAG clock input

-0.3

2.6

2.9

43

Reserved

- - - - -

-

44

GPIO

-

I/O

General I/O pin. The function of these pins has not been defined

-0.3

2.6

2.9 45

W_DISABLE

-

I

Close wireless communications

-0.3

2.6

2.9

46

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined

-0.3

2.6

2.9 47

NC - -

Not connected, please keep this pin open

- - 48

GND

- - GND

- - -

49

GND

- - GND

- - -

50

GND

- - GND

- - -

51

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined

-0.3

2.6

2.9

52

GND

- - GND

- - -

53

GND

- - GND

- - -

54

GND

- - GND

- - -

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Description of the Application Interfaces

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

55

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined

-0.3

2.6

2.9

56

GND

- - GND

- - -

57

GND

- - GND

- - -

58

GND

- - GND

- - -

59

GND

- - GND

- - -

60

NC - -

Not connected, please keep this pin open

- - -

61

NC - -

Not connected, please keep this pin open

- - -

62

NC - -

Not connected, please keep this pin open

- - -

63

NC - -

Not connected, please keep this pin open

- - -

64

NC - -

Not connected, please keep this pin open

- - -

65

NC - -

Not connected, please keep this pin open

- - -

66

NC - -

Not connected, please keep this pin open

- - -

67

NC - -

Not connected, please keep this pin open

- - -

68

NC - -

Not connected, please keep this pin open

- - -

69

NC - -

Not connected, please keep this pin open

- - -

70

NC - -

Not connected, please keep this pin open

- - -

71

WAKEUP_OUT

GPIO

O

Module to wake up the host

-0.3

2.6

2.9 72

JTAG_TDO

- Z JTAG test data output

-0.3

2.6

2.9

73

UART_DSR

GPIO

O

UART Data Set Ready

-0.3

2.6

2.9

74

UART_RTS

GPIO

O

UART Ready for receive

-0.3

2.6

2.9

75

UART_DCD

GPIO

O

UART Data Carrier Detect

-0.3

2.6

2.9

76

UART_TX

GPIO

O

UART transmit output

-0.3

2.6

2.9

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

77

UART_RING

GPIO

O

UART Ring Indicator

-0.3

2.6

2.9

78

UART_RX

GPIO

I

UART receive data input

-0.3

2.6

2.9

79

UART_DTR

GPIO

I

Data Terminal Ready

-0.3

2.6

2.9

80

UART_CTS

GPIO

I

UART Clear to Send

-0.3

2.6

2.9

81

POWER_ON_OFF

-

I

System power-on or power-off

-

Pulled up on chip

-

82

NC - -

Not connected, please keep this pin open

- - -

83

NC - -

Not connected, please keep this pin open

- - -

84

NC - -

Not connected, please keep this pin open

- - 85

USB_DM

-

I/O

Full-speed USB D-

- - -

86

USB_DP

-

I/O

Full-speed USB D+

- - -

87

JTAG_TDI

-

I

JTAG test data input

-0.3

2.6

2.9

88

UIM_RESET

- O UIM reset

-0.3

1.8/2.8 5

2.1/3.1 5

89

UIM_DATA

-

I/O

UIM Data

-0.3

1.8/2.8 5

2.1/3.1 5

90

UIM_CLK

- O UIM Clock

-0.3

1.8/2.8 5

2.1/3.1 5

91

LED_STATUS

-

I

Status indicator SINK current source Driver strength: 10mA

- - 92

NC - -

Not connected, please keep this pin open

- - 93

JTAG_RTCK

- I JTAG return clock

-0.3

2.6

2.9

94

NC -

Not connected, please keep this pin open

- - -

95

NC -

Not connected, please keep this pin open

- - -

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

96

EAR_OUT_N

-

O

(Only telematics version supports audio function , Data only version does not support this function) Negative pole of the output of Earphone interface

- - 97

EAR_OUT_P

-

O

(Only telematics version supports audio function , Data only version does not support this function) Positive pole of the output of Earphone interface

- - -

98

SPKR_OUT_P

-

O

(Only telematics version supports audio function, Data only version does not support this function) Positive pole of the output of speaker interface

- - -

99

SPKR_OUT_N

-

O

(Only telematics version supports audio function, Data only version does not support this function) Negative pole of the output of speaker interface

- - -

100

RESIN_N

- I Reset module.

-0.3

1.8

2.1

101

LED_MODE

- I Mode indicator

SINK current source

Driver strength: 10 mA

- - -

102

NC - -

Not connected, please keep this pin open

- - -

103

NC - -

Not connected, please keep this pin open

- - -

104

NC - -

Not connected, please keep this pin open

- - -

105

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined.

-0.3

2.6

2.9

106

GND

- - GND

- - -

107

MAIN_ANT

-

RF main antenna interface

- - -

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

108

GND

- - GND

- - -

109

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined

-0.3

2.6

2.9

110

GND

- - GND

- - -

111

GPS_ANT

-

RF GPS antenna interface

- - 112

GND

- - GND

- - -

113

GPIO

-

I/O

General I/O pins. The function of these pins has not been defined

-0.3

2.6

2.9

114

GND

- - GND

- - -

115

AUX_ANT

-

RF divert antenna interface

- - 116

GND

- - GND

- - -

117

NC

-

Not connected, please keep this pin open

- - 118

NC

-

Not connected, please keep this pin open

- - 119

NC

-

Not connected, please keep this pin open

- - 120

NC

-

Not connected, please keep this pin open

- - 121

GND

- - GND

- - -

122

GND

- - GND

- - -

123

GND

- - GND

- - -

124

GND

- - GND

- - -

125

GND

- - GND

- - -

126

GND

- - GND

- - -

127

GND

- - GND

- - -

128

GND

- - GND

- - -

129

GND

- - GND

- - -

130

GND

- - GND

- - -

131

GND

- - GND

- - -

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PIN No.

Pin Name

I/O

Description

DC Characteristics (V)

Normal

MUX

Min

Typical

Max

132

GND

- - GND

- - -

133

GND

- - GND

- - -

134

GND

- - GND

- - -

135

GND

- - GND

- - -

136

GND

- - GND

- - -

137

GND

- - GND

- - -

138

GND

- - GND

- - -

139

GND

- - GND

- - -

140

GND

- - GND

- - -

141

GND

- - GND

- - -

142

GND

- - GND

- - -

143

GND

- - GND

- - -

144

GND

- - GND

- - -

145

GND

- - GND

- - -



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital signal output.



The NC (Not Connected) pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact us for more details about this information.



When the MC509 module works on master mode, PCM_CLK and PCM_SYNC pins are in the output status

Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MC509 module.

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Figure 3-1 Bottom view of sequence of LGA interface pins

3.3 Power Interface

3.3.1 Overview

The power supply part of the MC509 module contains:



VBAT PIN for the power supply



VCOIN PIN for the standby power supply of the real-time clock (RTC)



VCC_EXT1 PIN for external power output



VCC_EXT2 PIN for external power output



UIM_VCC PIN for UIM card power output

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Table 3-2 lists the definitions of the pins on the power supply interface.

Pin No.

Signal Name

I/O

Description

DC Characteristics (V)

Min

Typical

Max

12, 13

VBAT

P

Pins for power voltage input

3.3

3.8

4.2

48, 49, 50, 52, 53, 54, 56, 57, 58, 59, 106, 108, 110, 112, 114, 116

GND

-

GND

- - -

35

VCOIN

P

Pin for standby power input of the RTC

1.5

3.0

3.25 32

VCC_EXT1

P

Pin for external power output

-

2.6 - 31

VCC_EXT2

P

Pin for external power output

-

1.8 - 34

UIM_VCC

P

Power supply for UIM card

-0.3

1.8/2.85

2.1/3.15

121~145

GND

-

Thermal Ground Pad

- - -

Table 3-2 Definitions of the pins on the power supply interface

3.3.2 VBAT Interface

When the MC509 module works normally, power is supplied through the VBAT pins and the voltage ranges from 3.3V to 4.2V (typical value: 3.8V). The 145-pin LGA provides two VBAT pins and sixteen GND pins for external power input. To ensure that the MC509 module works normally, all the pins must be used efficiently.

When the MC509 module is used for different external applications, pay special attention to the design for the power supply. When the MC509 module transmits signals at the maximum power, the transient current may reach the transient peak value of about 1.5A due to the differences in actual network environments. In this case, the VBAT voltage drops. Make sure that the voltage does not decrease below

3.3V in any case. Otherwise, exceptions such as restart of the MC509 module may occur.

A low-dropout (LDO) regulator or switch power with current output of more than 1.5A is recommended for external power supply. Furthermore, a 220uF or above energy storage capacitor is connected in parallel at the power interface of the MC509 module.

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SMPL timer setting

Capacitor value

Capacitor package

0.5 sec

1.5μF

0805

1.0 sec

3.3μF

0805

1.5 sec

4.7μF

0805

2.0 sec

6.8μF

1206

For detailed information about power supply design and printed circuit board (PCB) design, see the HUAWEI Module Power Supply Design Guide and the HUAWEI LGA Module PCB

Interconnection Design Guide

3.3.3 VCOIN Interface

VCOIN pin of MC509 module is used as backup power from the 3 V coin cell for SMPL, RTC, and 32 kHz crystal oscillator backup; a capacitor (rather than a coin cell) can be used if only SMPL is supported. Used as an analog output for coin cell or capacitor charging.

Sudden momentary power loss

If the monitored VBAT drops out-of-range (<3.3V nominal), the SMPL feature may initiate a power-on sequence without software intervention, and then VBAT returns inrange within a programmable interval of between 0.5 and 2.0 seconds. SMPL achieves immediate and automatic recovery from momentary power loss. A valid voltage on VCOIN is required to run the SMPL timer. If a capacitor is used instead of a coin, it must be connected between VCOIN and the ground. The capacitor must be charged to operate properly as the SMPL power source. The capacitor value depends on the SMPL timer setting.

Table 3-3 Keep-alive capacitor values vs.SMPL timer settings

If the SMPL counter expires without VBAT returning to its valid range, the MC509 must undergo the normal power-on sequence whenever the VBAT is detected.

Real-time clock

If RTC is used, a manganese-lithium rechargeable battery is recommended, for example, the SII Micro Parts HB-414 and the Panasonic ML-series. Two sets of coin cell specifications are compared in Table 3-4 . When the MC509 is off, RTC and its oscillator source are still active, provided by a coin cell battery which is installed. This allows continued monitoring of RTC alarms programmed via software.

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Table 3-4 Coin cell characteristics

Parameter

Specifications

HB-414

ML-series

Nominal voltage

3V

Nominal capacity

0.3mAh

3.4mAh

Continuous standard load

5mA

10mA Operating temperature

-20℃ ~ +60℃

Diameter

4.8mm

6.8mm

Height

1.4mm

1.45mm

Weight

0.07g

0.17g

Module

(DCE)

R

2.2k

100nF

VCOIN

Coin Cell+

-

An interrupt is generated if the coin cell voltage drops too low (and the main battery is not present). If this interrupt occurs, the RTC might be corrupted. A different interrupt is generated if the crystal oscillator stops; this signifies that handset timing is no longer accurate. Again, the RTC is corrupted.

When the VBAT power supply of the MC509 is normal, the coin cell charging is powered from VBAT. The MC509 reads the coin cell voltage and monitors the charging. During normal operation, the VCOIN pin voltage will stay above 2.2V, even when the coin cell charger is turned off. Figure 3-2 shows the reference RTC circuit.

Figure 3-2 VCOIN interface circuit

3.3.4 Output Power Supply Interface

Output Power Supply Interface includes VCC_EXT1 PIN, VCC_EXT2 PIN and UIM_VCC PIN.

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Through the Output Power Supply interface, the MC509 module can supply 2.6V and

Pin No.

Pin Name

I/O

Description

DC Characteristics (V)

Min

Typical

Max

81

POWER_ON_OF F

I

Pin for controlling power-on and poweroff

-

Pulled up on chip

100

RESIN_N

I

Pin for resetting the hardware

-0.3

1.8

2.1

91

LED_STATUS

I

Pin for network status LED

- - -

101

LED_MODE

I

Pin for network mode LED

- - -

11

WAKEUP_IN

I

H: DTE wakeup MC509.

L: DTE set MC509 to sleep mode.

-0.3

2.6

2.9

71

WAKEUP_OUT

O

H: MC509 wakeup DTE

L: MC509 set DTE to sleep mode.

-0.3

2.6

2.9

1.8V power externally with an output current of 20mA (typical value) for external level conversion or other applications.

If the MC509 module is in Sleep mode, the Output Power Supply interface is in the low power consumption state (< 500μA). If the MC509 module is in Power Down mode, the Output Power Supply is in the disabled state.

3.4 Signal Control Interface

3.4.1 Overview

The signal control part of the interface in the MC509 module consists of the following:



Power-on/off (POWER_ON_OFF) pin



Hardware reset (RESIN_N) pin



Network status LED (LED_STATUS/LED_MODE) pin



WAKEUP_IN Signal (WAKEUP_IN) pin



WAKEUP_OUT Signal (TBD)

Table 3-5 lists the pins on the signal control interface.

Huawei MC509 CDMA LGA User Manual

About This Document

1 Introduction

2.1 About This Chapter

2 Overall Description

2.2 Function Overview

Table 2-1 Feature

2.3 Circuit Block Diagram

Figure 2-1 Circuit block diagram of the MC509 module

2.4 Application Block Diagram

Figure 2-2 Application block diagram of the MC509 module

3 Description of the Application Interfaces

3.1 About This Chapter

3.2 LGA Interface

Table 3-1 Definitions of pins on the LGA interface

Figure 3-1 Bottom view of sequence of LGA interface pins

3.3 Power Interface

3.3.1 Overview

Table 3-2 Definitions of the pins on the power supply interface

3.3.2 VBAT Interface

3.3.3 VCOIN Interface

Sudden momentary power loss

Table 3-3 Keep-alive capacitor values vs.SMPL timer settings

Real-time clock

Table 3-4 Coin cell characteristics

Figure 3-2 VCOIN interface circuit

3.3.4 Output Power Supply Interface

3.4 Signal Control Interface

3.4.1 Overview

Table 3-5 Pins on the signal control interface