HTC Gene Service manual

Gene

Service Manual

HTC Proprietary

Confidential T reatment Requested

Rev. A08

Nov 26, 2008

HTC Corp.

Engineering Mobility

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Revision Control Table

Rev Date Contents Dept. Revised App Dept Stage/Per

A01 2006/12/08 First Draft PSE A02 2006/12/21 Update disassemble procedure PSE A03 2007/03/09 Add pictures on chapter 5.1 PSE Budiman Cheng GSD MP A04 2007/04/10 Add battery rundown on chapter 6 PSE Budiman Cheng GSD MP

A05 2007/05/08

A06 2007/07/23

A07 2007/08/06 Add 75H00566-00M on chapter 9.2 PSE Budiman Cheng GSD MP

A08 2008/11/26

Add more description at the

PSE Budiman Cheng GSD MP

“Location” column on chapter 9.2 Add more spare parts and location

PSE Budiman Cheng GSD MP

on Chapter 9

Add FRU M/B additional parts

PSE Budiman Cheng GSD MP

location on chapter 9.3

Jerry W. Lin Jerry W. Lin

GSD PVT GSD MV

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TABLE OF CONTENTS

CHAPTER 1 – INTRODUCTION.................................................................................................................................................... 5

1.1 PRODUCTION SPECIFICATION...................................................................................................................................................5

CHAPTER 2 – SERVICEING TOOLS............................................................................................................................................9

2.1 REPAIR LEVEL DEFINITION......................................................................................................................................................9

2.2 LIST OF SERVICING TOOLS........................................................................................................................................................9

CHAPTER 3 – ASSEMBLING AND DISASSEMBLING............................................................................................................10

3.1 DISASSEMBLING ......................................................................................................................................................................10

3.2 ASSEMBLING............................................................................................................................................................................ 16

CHAPTER 4 – DIAGNOSTIC PROGRAM..................................................................................................................................21

4.1 LIST OF DIAGNOSTIC / WINCE TEST ITEMS........................................................................................................................... 21

4.2 TEST PROCEDURE....................................................................................................................................................................22

CHAPTER 5 –SOFTWARE UPGRADE PRCEDURE.................................................................................................................24

5.1 RUU (RE-FLASH UPGRADE UTILITY).....................................................................................................................................24

5.2 SD CARD UPGRADE..................................................................................................................................................................28

CHAPTER 6 –LEAKAGE CURRENT MEASURE MENT..........................................................................................................30

BA TTERY RUNDOWN TEST PROCEDURE..............................................................................................................................34

TEST PROCEDURE................................................................................................................................................................... 34

CHAPTER 7 – COSMETIC INSPECTION CRITERIA..............................................................................................................39

7.1 CLASSES DEFINITION OF INSPECTIVE AREA............................................................................................................................39

7.2. MAIN UNIT INSPECTION..........................................................................................................................................................40

CHAPTER 8 –TROUBLESHOOTING AND REP AIR.................................................................................................................41

CHAPTER 9 –GENERIC SPARE PART LIST.............................................................................................................................46

9.1 SPL FOR REPAIR......................................................................................................................................................................46

9.2 BOARD LEVEL .........................................................................................................................................................................47

9.3

FRU M/B ADDITIONAL PARTS LOCATION ...............................................................................................................................47

APPENDIX........................................................................................................................................................................................49

A. GENERIC LABELING PLAN .......................................................................................................................................................50

B. RF ANTENNA TEST SPECIFICATION.........................................................................................................................................51

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CHAPTER 1 – INTRODUCTION

1.1 Production Specification

¾ Platform

• PDA form factor integrated quad-band GSM/EDGE

• OS: Microsoft Windows Mobile 5.0-PocketPC Phone Edition

¾ Dimension

• 109mm (L) x 58mm (W) x 17.65/18.15mm around camera(T)

• 126g with bat tery pack

¾ Processor/Chipset

• TI OMAP 850

¾ Memory

• Flash ROM: 128MB (for program and users’ storage)

• SDRAM: 64MB DDR S DR A M

¾ LCD Module

• Main LCD Module

- 2.8”, 240x320 dots resolution

- 64K-color TFT LED with backlight

- Sensitive Touch Screen

¾ GSM/EDGE Functional

• Internal Antenna

• GSM/GPRS/EDGE:

- Quad-band (850/900/1800/1900MHz)

• Auto Band Switching

• Global roaming

• Audio codec: AMR, EFR, FR, HR

• SMS (MO, MT), concatenated SMS (640 characters)

• Generic services

- Call holding, waiting, forwarding and barring

- CLI (Call Line Identity)

- Display own number

- Network selection

- Cell broadcast

- Multi-party conference capability

- Network lock

- Phase 2+ unstructured supplementary service data

- CPHS

• E-GPRS Function

- EGPRS Class B

- Multi-slot Standard Class 10

- MO/MT SMS over GPRS

- PBCCH

• SIM

- 3V of SIM

- SIM application tool kit release 98 class 3 and 99(Patial)

- Over the Air (OTA) programming

- FDN (Fixed Dialing Number)

- ADN (Abbreviated Dialing Number)

- Security PIN 1&2 control

¾ Keyboard/Button/Switch

• Button

- Power button(Short Press: system sleep on/off, Long Press: power on/off)

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- 5-way navigation pad

- Send/Hands-free button(Long Press during call: Hand-free On/Off)

- End button,

- Ok button

- Voice comm and / Voice record button(Short Press: voice command, Long Press: voice record)

- 2 soft-keys button (Calendar and Contact)

- Start button

- Volume Up & Down

- Camera capture button

- Reset

¾ Notification

• One bi-color(red & green) LED for GSM standby, GSM message, GSM network status, and charging status

• One blue LED for Bluetooth notification

• Notification by LED, sound, Vibration, message on the display

¾ Audio

• Build-in Microphone

• Receiver

• Loud speaker for Hands-free supported

• Full duplex

• AMR/AACWAV/WMA//MP3 codec

• 16 bit s with 8KHz, 11KHz, 22KHz, 44.1KHz

¾ Camera

• 2 mega-pixel CMOS

¾ Bluetooth

• Compliant wit h V2.0 withou t EDR

• Class 2 transmit power

• Supported profiles:

- Generic Access Profile

- Serial Port Profile

- Headset Profile

- Object Push Profile

- PAN

- Heads-free Profile

- Generic Object Exchange Profile

- Advanced Audio Distribution Profile (A2DP)

- Audio/Video Remote Control Profile (AVRCP)

- SIM Access Profile for hTC

- Human Interface Device Profile

- Service discovery application profile

¾ Interface

• 3V SIM card

• 11-pin min-USB (USB 1.1) client/audio jack in one

• SDIO/MMC card slot (support SD2.0 or SDHC)

• External antenna connecto r

¾ Power

• Removable recharg eable Lithium Polymer battery

• Capacity: 1250mAh

• Charging time: 3 hours

• Talk-Time: 3.5~5 hours

• Standby Time: 150~200 hours

• Playing WMV 12 hours

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• Playing WMA 8 hours

• AC Adapter.

- AC input rating: 100-240Vac, 50-60 Hz.

- DC output: 5V / 1A

¾ Hanger Hole

• Stylish hanger r to wear phone with neck strap as pendant or to attach various phone hangers.

¾ Accessories

• Inbox

- AC adapter with mini-USB power plug

- Sync. Cable (mini-USB)

- Battery (rechargeable and replaceable)

- Stylus

- Carrying case

- Stereo-wired headset with microphone

• Optional

- Car adapter.

- Car Holder

- BT keyboard

- Travel Charger

¾ Microsoft Windows Mobile 5.0 Applications

• Pocket Outlook: Calendar, Contacts, Messaging, Tasks, and Voice Notes

• FirectPushl

• Internet Explorer Mobile

• Office Mobile: Word, Excel & PowerPoint Mobile

• Windows Media Player 10 Mobile

• Pictures & Videos

• ActiveSync Client

• Pocket MSN

• Device Management

• OTA Provisioning

• Internet Sharing

• Set-ip Wizard for E-mail

• Terminal Service Client

• Calculator

• Games

¾ Value Added Application

• Camera/Camcorder

• Picture Enhancement for Pictures & Videos

• Polyphonic M I DI Ringtone

• Audio/Video enhancement for WMP

• ZIP

• Smart Dialing

• MMS Client: MMS 1.1 supported

• Voice Dial & Command

• Document Viewer – PDF

• OMA DRM 1.0 supported

• SIM Manager

• Comm. Manager

• Smart Dial

• STK

• Audio Manager

• Ringtone Trimmer

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• Task Manager

• Bluetooth FTP

¾ Carrier Specific Applications

• Java virtual machine (J2ME,CLDC 1.1, MIDP 2.0)

• SPB GPRS Monitor (for hTC)

• Bluetooth SAP (for hTC)

¾ Regulatory

• R&TTE: EMC/EMI, Safety SAR

• FCC Approval

• FCC HAC

• PDCRB Approval

• BQB (Bluetooth Qualification Body) certification

• Microsof t Windows Mobile Logo (NTSL)

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CHAPTER 2 – SERVICEING TOOLS

2.1 Repair Level Definition

Unit L0 Accessory test and unit swap L1 Unit Test and ROM Re-flash L2 Refurbishment and Module Swap +L1 L2.5 M/B Repair(connecter, button, MIC…) +L2

Note : These level is for reference only depends on service model

2.2 List of Servicing Tools

level No. Item Use for Remark

L 1

1 Mini USB DATA interface

Cable

Check for mini USB

communication; RUU re-flash 2 Earphone Headset For Audio test. 3 AC Adapter Transfer AC to DC for Unit 4 SD Card with Diagnostic test

For unit diagnostic test HTC design

program (must be encoded by HTC)

5 128MB SD memory card

( must be encoded by HTC)

6 Unit current consumption test

fixture

For unit ROM code transfer to

SD card for re-flash

Measure Unit current

HTC design

consumption

7 Power supply 8 Current Meter 9 Mobile tester

For RF test

Local purchase Local purchase Local purchase

10 Special Made Plastic Stick Assembly & Disassembly

11 Hand tools Assembly & Disassembly 12 Label printer Print agency label if replacing

HTC special tools Local purchase Local purchase

L 2

M/B

13 Lead-free Soldering station Board level repair

L 2.5 14 Air heater Board level repair

Local purchase Local purchase

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CHAPTER 3 – ASSEMBLING AND DISASSEMBLING

3.1 Disassembling

Tools needed for Assembling and Disassembling

1. Torx Screw Driver T4X30

2. Flat Plastic Stick

1 2

1. Take out the Stylus.

2. Remove the SD card if any.

Push the battery cover to open.

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Remove the battery by simply pull up the plastic

ribbon.

Warning: To reduce risk of fire or

burns, do not disassemble, crush, puncture,

short external contacts, or dispose of in fire

or water. Replace only with specified batteries. Recycle or dispose of used batteries properly

2

Release 2 screws on housing.

1. Insert the flat plastic stick into the gap

1

between the bezel and the housing on the left and right of the LCD to release the hooks.

2. Separate the housing and the bezel.

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Loosen and take out 2 screws from the housing.

Remove the main board from the housing (start from the top side)

Use Stylus to lift up vibrator from the housing.

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UNPLUG VIBRATOR FROM THE MAIN BOARD.

Unplug speaker connector from its connector on the M/B.

Remove the kapton tape from the LCM connector.

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Unlock the LCM connector and then release the LCM FPC.

Loosen 2 screws from LCD bracket.

Remove microphone rubber.

Be careful of the rubber

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Separate the LCD bracket from the M/B then separate the LCM from LCD bracket.

Unlock 2 antenna hooks to remove the antenna from the main board.

Disconnect the camera module.

The Disassembly process is finished.

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3.2 Assembling

A

Connect the Camera module.

1. Install the speaker into the antenna cover.

2. Assemble the antenna on the M/B.

Connect the speaker connector

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