HP V194bz Disassembly Instructions Manual
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP V194bz 18.5 inch LED Backlit Monitor
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB /PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
2 Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within t he product which require selective treatment in the right column, as
applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point whe re components
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be f oll owed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface. .
2. Remove the screw in red to remov e the stand.
3. Remove the aluminum foil/the black tape and remove the key board.
4. Remove the pin.
5. Remove the screws.
6. Remove the mainframe
7. Remove the MYLAR and tape.
8. Remove the screws in the red to remove the main board and power board
9. Remove the connect pin
10. Remove the MYLAR
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the item s
contained in the product that require selective t reat ment (with descriptions and arrows identify i ng l ocat i ons).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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