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DisplayPort™ 1.2 digital video output
Power memory activity indicator LED light
HDMI digital video output
2 x USB-A 3.1 Gen 1 ports for keyboard/mouse
VESA 100 mounting points located underneath the
system’s rubber foot pads
RJ45 Gigabit Ethernet interface
1 x USB-C™ port, supporting DisplayPort™ over USB-C™
and USB Power Delivery
USB-A 3.1 Gen 1 port for accessories

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• Intel® Celeron® Processor N4000; 1.1 – 2.6 GHz dual-core processor
• Intel® Celeron® Processor N4020; 1.1 – 2.8 GHz dual-core processor
3
• Embedded DDR4 single-channel SDRAM system memory
o HP ThinPro models configured with minimum of 2 GB
o Windows models configured with 4 GB
• Embedded solid-state flash memory storage
o HP ThinPro models configured with minimum of 16 GB
o Windows models configured with 32 GB
• 1 x DisplayPort™, 1 x HDMI and 1 x DisplayPort™ over USB-C™ digital video outputs supporting up to Ultra High Definition
(UHD)/4K (3840 x 2160) resolutions.
• Active thermal management technology monitors component operating temperatures, throttles SOC processor if
appropriate, and prevents unit thermal shutdown
• Gigabit Ethernet (GbE) network connection supported via an integrated Realtek GbE NIC module and presented with an
RJ45 connector on the rear I/O panel
• Optional Wi-Fi/Bluetooth® adapter including antennas integrated internally in the chassis
1
.
• USB ports located on the back and side panels, including a USB-C™ 3.1 Gen 1 port that supports DisplayPort™ over USB-C™
and USB Power Delivery
• 3.5 mm headset audio port on side panel that will support a headset, headphones or an external speaker system
• Integrated VESA 100 mounting system; the four threaded holes are conveniently located under the unit’s rubber foot pads
• TCG certified Trusted Platform Module (TPM) chipset on Windows models; other security features include a system UEFI
designed to address NIST SP 800-147 guidelines, cable lock slot, and power cord retention clip to prevent accidental power
cord disconnects
• ENERGY STAR® certified and EPEAT® Gold registered in the United States. See http://www.epeat.net for registration status
in other countries
• Post-consumer recycled plastics content greater than 25% total unit plastics (by weight)
• Low halogen
2
material content
1
Wireless access point and Internet access is required; availability of public wireless access points is limited
2
This product is low halogen except for power cords, cables and peripherals; service parts obtained aftermarket may not be low halogen
3
Windows configurations with N4020 are compatible with Win 10 IoT 64 Enterprise LTSC 2019
HP Customer Support: limited three-year hardware limited warranty in most regions; HP Care Packs are extended service contracts
that go beyond your standard limited warranties; for more details visit http://www.hp.com/go/cpc

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HP ThinPro, including HP Smart Zero Core
Microsoft Windows 10 IoT Enterprise
Intel® Celeron®
Processor N4000
Intel® Celeron®
Processor N4020
NOTE 1: CPU Maximum frequency is based on Intel® Turbo Boost Technology
NOTE 2: Windows configurations with N4020 are compatible with Win 10 IoT 64 Enterprise LTSC 2019
Number of displays supported:
One or two displays.
NOTE: a maximum of two displays are supported.
1 x HDMI port
1 x DisplayPort™
1 x DisplayPort™ over USB-C™
NOTE: dual displays are supported using the following video output combinations:
• HDMI + DisplayPort™
• HDMI + DisplayPort™ over USB-C™
Video Resolution Support Matrix
≤2 x FHD
1920 x 1080 @ 60Hz
1 x UHD/4K
3840 x 2160 @ 60Hz
2 x UHD/4K
3840 x 2160 @ 30Hz
1080p 30fps (or below) video
≤2 x FHD
1920 x 1080 @ 60Hz
1 x UHD/4K
3840 x 2160 @ 60Hz
2 x UHD/4K
3840 x 2160 @ 30Hz

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1080p 30fps (or below) video
NOTES:
• 4K video playback is not supported over Virtual Desktop Infrastructure (VDI)
• Only 1 Citrix session can be launched
Single channel DDR4 SDRAM
Data Transfer Rate (speed):
Peak Transfer Rate (bandwith):
0 slots; memory is embedded
Memory Capacity (Minimum):
2 GB on ThinPro models
4 GB on Windows models
256 MB (default), 512 MB or 1 GB
NOTE: The system’s Graphics Processing Unit (GPU) uses part of total system memory. System memory dedicated to graphics
performance is not available for use by other programs
UEFI (Unified Extensible Firmware Interface)
• UEFI Specification Revision: 2.6
• Meets requirements for Common Criteria, an independent third-party certification of trustworthiness
• Meets requirements for FIPS 140-2, a standard for cryptographic integrity
• Designed to address NIST SP800-147 guidelines
TRUSTED PLATFORM MODULE (TPM)
• Trusted Computing Group (TCG) certified TPM 2.0 on Windows 10 IoT Enterprise models
NOTE: HP ThinPro models do not include a TPM

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NAND flash memory; non-volatile
0 slots; flash storage is embedded
Storage Capacity
(Minimum):
16 GB on HP ThinPro models
32 GB on Windows models
1 x USB-C™ featuring DisplayPort™ over USB-C™ and USB Power Delivery
3 x USB-A 3.1 Gen 1 ports; 2 x rear ports, 1 x side port
1 x DisplayPort™ 1.2
1 x HDMI
1 x DisplayPort™ over USB-C™
1 x RJ45 GbE interface
1 x 3.5mm headset jack
NOTE: only 2 video outputs can be used simultaneously
3.5 mm headset jack supporting a headset, headphones or and external speaker
Audio CODECs include MP3, AAC stereo, HE AAC
Includes hardware acceleration support
MPEG-4 part 2 (DivX, Xvid)
MPEG-4 part 10 (H.264), Advanced Video Coding (AVC) (H.264 encode)
MPEG-H part 2, High Efficiency Video Coding (HEVC) (H.265. decode)
WMV 7/8/9 VC-1 & ASF Demuxer
Includes hardware acceleration support
• Security lock support (cable lock sold separately)
• Trusted Platform Module (TPM) on Windows models
Realtek Gigabit Ethernet (GbE)
Wake on LAN
PXE
TCP/IP with DNS DHCP
Secure Socket Tunneling Protocol (SSTP); supported with a Microsoft operating system
Intel® Wireless-AC 9260 with Bluetooth®; M.2 module with integrated internal Wi-Fi antenna system
NOTE: Wireless access point and Internet access required. Availability of public wireless access point may be limited. Wireless
features, performance and support may vary depending on environmental variables such as placement, settings and firmware of
the access point. Contact your wireless vendor for support.

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HP ThinPro
HP Smart Zero Core
Microsoft Remote Desktop Services
RDP, PCoIP, Blast Extreme
HP ThinPro
HP Smart Zero Core
Microsoft Remote Desktop Client
VMware® Horizon View™ Client
HP TeemTalk Terminal Emulator
HP ThinPro
HP Smart Zero Core
HP ThinPro
HP Smart Zero Core
Read-only operating system
Operating system write filter
HP Write Manager
Microsoft Unified Write Filter
HP ThinPro
HP Smart Zero Core

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HP Smart Zero Client Services
HP ThinPro
HP Smart Zero Core
NOTE: Software performance and support may vary depending on customer environment and backend.
HP ThinPro
HP Smart Zero Core
MPEG-4 part 2
(DivX, Xvid,
H.263)
MPEG-4 part 10
(H.264, AVC)
WMV 7/8/9/ VC-1
& ASF Demuxer
NOTE: Software performance and support may vary depending on customer environment and backend.
Recommended TC config for Microsoft Teams media optimization
VMware Teams Optimization
Citrix Teams Optimization

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- Not recommended, ✓ recommended
0.74 kg (1.63 lb) (Weight will vary depending on configuration)
NOTE: All measurements are approximate; the addition of optional modules will increase the weight
45W external power adapter
Worldwide auto-sensing 100-240 VAC, 50-60 Hz
Energy saving automatic power-down
Surge tolerant
Section 508 Accessibility. VPAT report available
Environmental Stewardship:
Worldwide (ENERGY STAR®, EPEAT®, ROHS, ERP, TCO, MEPS, CECP, HP GSE, etc.)
Worldwide (UL, CB, GS, CCC, etc.)
Electromagnetic Compliance (EMC):
Worldwide(FCC/CISPR/EN/VCCI/ICES/AS/NZS/CNS/KCC) “Class B” EMI regulations

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Operating Temperature Range:
50° to 104° F (10° to 40° C)
Non-operating Temperature Range:
-22° to 140° F (-30° to 60° C)
Humidity:
Condensing: 20% to 80%
Non-condensing: 10% to 90%
NOTE: Specifications are at sea level with altitude derating of 1° C/300m (1.8° F/1000ft) to a maximum of 3 Km (10,000 ft), with
no direct, sustained sunlight. Upper limit may be limited by the type and number of options installed.
Eco-Label Certifications & declarations
This product has received or is in the process of being certified to the following
approvals and may be labeled with one or more of these marks:
• ENERGY STAR®
• EPEAT® Gold registered in the United States. See http://www.epeat.net for
registration status in your country.
• IT ECO declaration
Energy Consumption
(in accordance with US ENERGY STAR®
test method)
Normal Operation (Short idle)
Normal Operation (Long idle)
Normal Operation (Short idle)
Normal Operation (Long idle)
NOTE:Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.
• This product is in compliance with the Restrictions of Hazardous Substances
(RoHS) directive -2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic
Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of
California; Safe Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT®) standard at the gold
level, see www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO
11469 and ISO1043.
• This product contains 5.65 % post-consumer recycled plastic (by wt.)
• This product is 93.1 % recycle-able when properly disposed of at end of life.

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HP Inc. is committed to compliance with all applicable environmental laws and
regulations, including the European Union Restriction of Hazardous Substances (RoHS)
Directive. HP’s goal is to exceed compliance obligations by meeting the requirements
of the RoHS Directive on a worldwide basis. By July 1, 2006, RoHS substances will be
virtually eliminated (virtually = to levels below legal limits) for all HP electronic
products subject to the RoHS Directive, except where it is widely recognized that there
is no technically feasible alternative (as indicated by an exemption under the EU RoHS
Directive).
This product does not contain any of the following substances in excess of regulatory
limits (refer to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specificat
ions.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants
in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be
frequently handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail
packaging has been voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

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HP follows these guidelines to decrease the environmental impact of product
packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and
cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging
materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging
materials.
• Use readily recyclable packaging materials such as paper and corrugated
materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120
standards.
End-of-life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many
geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-
recycle or contact your nearest HP sales office. Products returned to HP will be
recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment
information for each product type for use by treatment facilities. This information
(product disassembly instructions) is posted on the HP Inc. web site at:
http://www.hp.com/go/recyclers. These instructions may be used by recyclers and
other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell
HP equipment.
HP, Inc. Corporate Environmental
Information
For more information about HP’s commitment to the environment:
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ec
olabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

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Input/Output, Weights & Dimensions
Software support for VMware Horizon
WEIGHTS & DIMENSIONS section

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© 2021 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties
for HP products and services are set forth in the express limited warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or
omissions contained herein. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. DisplayPort™ and the DisplayPort™
logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the United States and other countries.
Amazon Web Services, the “Powered by Amazon Web Services” logo, and Amazon WorkSpaces are trademarks of Amazon.com,
Inc. or its affiliates in the United States and/or other countries. Bluetooth® is a trademark owned by its proprietor and used by HP
Inc. under license. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency. Linux® is the
registered trademark of Linus Torvalds in the U.S. and other countries. Microsoft and Windows are either registered trademarks
or trademarks of Microsoft Corporation in the United States and/or other countries. Intel® is a trademark of Intel Corporation in
the U.S and other countries. VMware Horizon and VMware Horizon View are registered trademarks or trademarks of VMware, Inc.
in the United States and/or other jurisdictions. Citrix and Citrix Receiver are trademarks of Citrix Systems, Inc. and/or one more of
its subsidiaries, and may be registered in the United States Patent and Trademark Office and in other countries.