HP t420, t419 Troubleshooting Guide
Troubleshooting Guide
HP t420 Thin Client
© Copyright 2015 Hewlett-Packard
Development Company, L.P. The information
contained herein is subject to change without
notice.
Microsoft and Windows are U.S. registered
trademarks of the Microsoft group of
companies. Linux® is the registered trademark
of Linus Torvalds in the U.S. and other
countries.
The only warranties for HP products and
services are set forth in the express warranty
statements accompanying such products and
services. Nothing herein should be construed
as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or
omissions contained herein.
This document contains proprietary
information that is protected by copyright. No
part of this document may be photocopied,
reproduced, or translated to another language
without the prior written consent of HewlettPackard Company.
First Edition (July 2015)
Document Part Number: 806118-001
Product notice
This guide describes features that are common
to most models. Some features may not be
available on your computer.
About This Book
WARNING! Text set o in this manner indicates that failure to follow directions could result in bodily harm or
loss of life.
CAUTION: Text set o in this manner indicates that failure to follow directions could result in damage to
equipment or loss of information.
NOTE: Text set o in this manner provides important supplemental information.
iii
iv About This Book
Table of contents
1 Product features ........................................................................................................................................... 1
Hardware features ................................................................................................................................................. 1
Front panel components ........................................................................................................................................ 2
Rear panel components ......................................................................................................................................... 3
Removing the rubber feet ...................................................................................................................................... 4
Serial number location .......................................................................................................................................... 4
2 Hardware changes ......................................................................................................................................... 5
Warnings and cautions .......................................................................................................................................... 5
Removing and replacing the access panel ............................................................................................................ 6
Removing the access panel ................................................................................................................. 6
Replacing the access panel ................................................................................................................. 7
Locating internal components ............................................................................................................................... 8
Removing and replacing the USB 3.0 ash drive .................................................................................................. 9
Removing the USB 3.0 ash drive ....................................................................................................... 9
Replacing the USB 3.0 ash drive ..................................................................................................... 10
Removing and replacing the battery ................................................................................................................... 11
Appendix A Computer Setup (F10) Utility, BIOS Settings .................................................................................... 13
Computer Setup (F10) Utilities ............................................................................................................................ 13
Using Computer Setup (F10) Utilities ................................................................................................ 13
Computer Setup—File ....................................................................................................................... 15
Computer Setup—Storage ................................................................................................................ 16
Computer Setup—Security ............................................................................................................... 17
Computer Setup—Power .................................................................................................................. 18
Computer Setup—Advanced ............................................................................................................. 19
Changing BIOS Settings from the HP BIOS Congure Utility (HPBCU) ................................................................ 20
Appendix B Diagnostics and Troubleshooting ................................................................................................... 22
LEDs ..................................................................................................................................................................... 22
Wake-on LAN ....................................................................................................................................................... 22
Power-On Sequence ............................................................................................................................................ 23
Resetting the Setup and power-on Passwords ................................................................................................... 23
Power-On Diagnostic Tests .................................................................................................................................. 24
Interpreting POST Diagnostic Front Panel LEDs and Audible Codes ................................................................... 24
POST Numeric Codes and Text Messages ............................................................................................................ 26
v
Troubleshooting ................................................................................................................................................... 28
Basic Troubleshooting ....................................................................................................................... 28
Diskless (No-Flash) Unit Troubleshooting ........................................................................................ 29
Conguring a PXE Server ..................................................................................................................................... 30
Appendix C HP ThinUpdate (add-on only) ......................................................................................................... 31
Appendix D Device management ...................................................................................................................... 32
Appendix E Adding an Image Restore Tool ........................................................................................................ 33
Appendix F System BIOS ................................................................................................................................. 34
Updating or restoring a BIOS ............................................................................................................................... 34
Appendix G Power cord set requirements ......................................................................................................... 35
General requirements .......................................................................................................................................... 35
Japanese power cord requirements .................................................................................................................... 35
Country-specic requirements ............................................................................................................................ 36
Appendix H Statement of Volatility ................................................................................................................. 37
Appendix I Electrostatic discharge ................................................................................................................... 39
Preventing electrostatic damage ........................................................................................................................ 39
Grounding methods ............................................................................................................................................. 39
Appendix J Specications ............................................................................................................................... 40
Index ............................................................................................................................................................. 41
vi
1 Product features
This guide describes the features of the thin client. For a complete list of the hardware and software installed
on a specic model, go to http://www.hp.com/go/quickspecs and search for your specic thin client model.
Various options are available for your thin client. For more information about available options, go to the HP
website at http://www.hp.com and search for your specic thin client model.
NOTE: Your computer model may look dierent than the model in the following illustrations.
Hardware features
●
Compact 0.88 liter thin client; convenient horizontal orientation with xed rubber feet; mount almost
anywhere with an integrated VESA 100 mounting system.
●
AMD GX-209JA System-on-Chip (SOC), including a 1.0 GHz dual core APU and discrete-level GPU.
●
Integrated 2 GB DDR3L SDRAM system memory; 1,066 MT/s data transfer rate.
●
8 GB or 16 GB capacity ash memory storage on internal Super Speed USB 3.0 modules.
●
Active thermal management monitors component operating temperatures, throttles SOC operation if
appropriate, and prevents unit thermal shutdown.
●
Integrated Gigabit Ethernet LAN module; rear access RJ-45 modular jack.
●
Optional 802.11n 2x2 dual band Wi-Fi Adapter with Bluetooth.
●
One VGA analog video output and one DVI-D digital video output.
●
Two Hi-Speed USB 2.0 front access ports and two Hi-Speed USB 2.0 rear access ports. The two rear
access ports are typically utilized by the keyboard and mouse.
●
Front access headset jack.
●
ENERGY STAR® certied and EPEAT® Gold registered in the United States. Post-consumer recycled
plastics content greater than 25% total unit plastics (by weight).
●
Low halogen materials.
Hardware features 1
Front panel components
For more information, go to http://www.hp.com/go/quickspecs and search for your specic thin client model
to nd the model-specic QuickSpecs.
(1) Power button (3) Headset jack
This connector supports audio out
(speakers and headphones) or a
headset (with headphones and a
microphone).
(2) Hi-Speed universal serial bus (USB)
2.0 connectors (2)
NOTE: The thin client does not include an internal PC speaker; it requires the addition of an external speaker device to produce audio.
2 Chapter 1 Product features
Rear panel components
For more information, go to http://www.hp.com/go/quickspecs and search for your specic thin client model
to nd the model-specic QuickSpecs.
(1) Cable lock slot (4) VGA connector
(2) Power connector (5) Hi-Speed universal serial bus (USB)
2.0 connectors (2)
These ports are typically used to
connect the mouse and keyboard.
(3) DVI-D connector (6) Ethernet RJ-45 connector
Rear panel components 3
Removing the rubber feet
The thin client comes with rubber feet installed. The rubber feet help keep the thin client safely in place.
CAUTION: If you use the thin client in a horizontal orientation without the rubber feet, it may slide and
result in equipment damage.
The rubber feet may be removed, if required.
Serial number location
Every thin client includes a unique serial number located as shown in the following illustration. Have this
number available when contacting HP customer service for assistance.
4 Chapter 1 Product features
2 Hardware changes
Warnings and cautions
Before performing upgrades be sure to carefully read all of the applicable instructions, cautions, and
warnings in this guide.
WARNING! To reduce the risk of personal injury or equipment damage from electric shock, hot surfaces, or
re:
Disconnect the power cord from the power outlet and allow the internal system components to cool before
you touch them.
Do not plug telecommunications or telephone connectors into the network interface controller (NIC)
receptacles.
Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
Plug the power cord into a grounded (earthed) outlet that is easily accessible at all times.
To reduce the risk of serious injury, read the Safety & Comfort Guide. It describes proper workstation setup,
posture, and health and work habits for computer users, and provides important electrical and mechanical
safety information. The Safety & Comfort Guide is located on the HP website at http://www.hp.com/ergo.
WARNING! Energized parts inside.
Disconnect power to the equipment before removing the enclosure.
Replace and secure the enclosure before re-energizing the equipment.
CAUTION: Static electricity can damage the electrical components of the thin client or optional equipment.
Before beginning the following procedures, be sure that you are discharged of static electricity by briey
touching a grounded metal object. See Preventing electrostatic damage on page 39 for more information.
When the thin client is plugged into an AC power source, voltage is always applied to the system board. To
prevent damage to internal components, you must disconnect the power cord from the power source before
opening the thin client.
Warnings and cautions 5
Removing and replacing the access panel
Removing the access panel
WARNING! To reduce the risk of personal injury or equipment damage from electric shock, hot surfaces, or
re, ALWAYS operate the thin client with the access panel in place. In addition to enhancing safety, the access
panel may provide important instructions and identication information, which may be lost if the access
panel is not used. DO NOT use any access panel except the one that is provided by HP for use with this thin
client.
Before removing the access panel, be sure that the thin client is turned o and the power cord is disconnected
from the electrical outlet.
To remove the access panel:
1. Remove/disengage any security devices that prohibit opening the thin client.
2. Remove all removable media, such as USB ash drives, from the thin client.
3. Turn o the thin client properly through the operating system, and then turn o any external devices.
4. Disconnect the power cord from the power outlet, and disconnect any external devices.
CAUTION: Regardless of the power-on state, voltage is always present on the system board as long as
the system is plugged into an active AC outlet. You must disconnect the power cord to avoid damage to
the internal components of the thin client.
5. Lay the unit at on a stable surface with the right side up.
6. Remove the two screws from the back I/O panel (1).
7. Slide the access panel approximately 6 mm (.24 in) toward the back of the chassis, and then lift the
panel o of the thin client (2).
6 Chapter 2 Hardware changes
Replacing the access panel
To replace the access panel:
1. Align the tabs on each side of the access panel with the slots in the chassis. Set the access panel on the
chassis, approximately 6 mm (.24 in) inside the edge of the chassis, and then slide the panel toward the
front of the chassis (1) into place.
2. Fasten the two screws into the ends of the back I/O panel to secure the access panel (2).
Removing and replacing the access panel 7
Locating internal components
1 PCIe mini card for the Wi-Fi module 4 512 MB SDRAM memory chips
2 USB 3.0 module holder with module installed 5 System on a Chip (SOC)
This thin client has four 512 MB SDRAM memory chips soldered
to the system board: two on this side and two directly below
them on the other side.
The SOC is soldered to the system board.
3 Battery
8 Chapter 2 Hardware changes
Removing and replacing the USB 3.0 ash drive
Before returning the thin client to HP for exchange, you may choose to remove and safeguard the USB 3.0
ash drive.
Removing the USB 3.0 ash drive
WARNING! Before removing the access panel, be sure that the thin client is turned o and the power cord is
disconnected from the electrical outlet.
To remove the USB 3.0 ash drive, perform the following steps:
1. Remove/disengage any security devices that prohibit opening the thin client.
2. Remove all removable media, such as USB ash drives, from the thin client.
3. Turn o the thin client properly through the operating system, and then turn o any external devices.
4. Disconnect the power cord from the power outlet, and disconnect any external devices.
CAUTION: Regardless of the power-on state, voltage is always present on the system board as long as
the system is plugged into an active AC outlet. You must disconnect the power cord to avoid damage to
the internal components of the thin client.
5. Lay the thin client down with the right side up.
6. Remove the thin client access panel. See Removing the access panel on page 6.
7. Locate the USB 3.0 ash drive on the system board.
8. Lift the USB holder and push it toward the USB 3.0 ash drive (1).
9. Carefully pull the ash drive out of the socket (2).
Store the USB 3.0 ash drive carefully until it can be installed in the returned thin client.
10. Replace and secure the access panel. See Replacing the access panel on page 7.
Removing and replacing the USB 3.0 ash drive 9
Loading...