HP t310 G2 Disassembly Instructions Manual

Product Category: Thin Client

Marketing Name / Model
[List multiple models if applicabl e.]

HP t310 G2 Zero Client

1.0 Items Requiring Selective Treatment

Quantity

in product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

1

Batteries

All types including standard alkaline and lithium coin
Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Includes background illum inate d dis plays with gas
discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing
refractory ceramic fibers

Components, parts and materials containing
radioactive substances

Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

Item Description Notes

or button style batteries

of items
included

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

Tool Description

Tool Size (if
applicable)

Description #1: Phillips screwdriver

Description #2: Diagonal cutting plier

Description #3 Nipper

3.0 Product Disassembly Proc ess

and materials requiring selective treatment can be removed.

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove chassis labels on label mylar tab

2. Remove chassis rubber and screws

3. Remove upper plastic and m etal chassis

4. Remove EMI contact fingers and heatsink EMI gasket from the upper metal chassis

5. Remove light shielding rubber from the upper plastic chassis

6. Separate upper metal chassis from upper plastic chassis

7. Separate PCBA board from the chassis using the screwdriver

8. Separate lower metal chassis from lower plastic chassis

9. Remove label mylar tab

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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