HP ProOne 490 G3, ProOne 440 G3 Disassembly Instructions Manual

Product Category: Personal Computers
Marketing Name / Model [List multiple models if applicable.]
HP ProOne 490 G3 Non-Touch All-in-One Business PC
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm Motherboard, RAM*2, Transform board
4
Batteries
All types including standard alkaline and lithium coin or button style batteries RTC battery
1
Mercury-containing components
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps LCD
1 Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB /PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
External electrical cables and cords
EPS and power cord
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within t he product which require selective treatment in the right column, as applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items included
EL-MF877-00 Page 1 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point whe re components
Tool Description
Tool Size (if applicable)
Description #1 Screwdiver
TORX T8
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be f oll owed to remove components and materials requiring selective treatment:
1. Removed Stand base
2. Removed Rear Cover
3. Removed Hinge
4. Removed Converter board & ot hers
5. Removed HDD module
6. Remove MB Shielding
7. Removed Thermal module
8. Removed Fan module
9. Removed Base pan
10. Removed MB
11. Removed Speaker module
12. Removed Camera module
13. Removed Speaker Grill
14. Removed LCD panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective t reat ment (with descriptions and arrows identify i ng l ocat i ons).
1. Removed Stand base
EL-MF877-00 Page 2 Template Revision B
PSG instructions for this template are available at EL-MF877-01
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