HP ProLiant DL760 Generation 2 Maintenance and Service Guide

HP ProLiant DL760 Generation 2 Server

Maintenance and Service Guide

February 2004 (Third Edition)

Part Number 201262-003

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft, Windows, and Windows NT are U.S. registered trademarks of Microsoft Corporation. Intel, Pentium, and Itanium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. UNIX is a registered trademark of The Open Group. Linux is a U.S. registered trademark of Linus Torvalds.

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

February 2004 (Third Edition) Part Number 201262-003

About This Guide

Audience Assumptions............................................................................................................................... vii

Technician Notes........................................................................................................................................ vii

Where to Go for Additional Help.............................................................................................................. viii

Integrated Management Log............................................................................................................... viii

Telephone Numbers............................................................................................................................ viii

Chapter 1

Illustrated Parts Catalog

System Chassis.......................................................................................................................................... 1-2

Media Module ........................................................................................................................................... 1-4

Processor and Memory Module................................................................................................................. 1-6

I/O Module ................................................................................................................................................ 1-8

Miscellaneous.......................................................................................................................................... 1-10

Chapter 2

Service Preparation

Safety Considerations................................................................................................................................ 2-1

Electrostatic Discharge Information ................................................................................................... 2-1

Rack Warnings and Precautions ......................................................................................................... 2-2

Server Warnings and Precautions ....................................................................................................... 2-2

Server Modules.......................................................................................................................................... 2-4

Preparation Procedures.............................................................................................................................. 2-7

System Interconnect LEDs ................................................................................................................. 2-8

Hot-Plug Procedures ........................................................................................................................... 2-8

Non-Hot-Plug Procedures................................................................................................................... 2-8

Power-On Self-Test .......................................................................................................................... 2-11

Re-entering the Server Serial Number .................................................................................................... 2-15

Chapter 3

Chassis Components Removal and Replacement Procedures

I/O Lid....................................................................................................................................................... 3-1

Hot-Plug Power Supply............................................................................................................................. 3-2

System Midplane Assembly...................................................................................................................... 3-5

Cable Management Arm ........................................................................................................................... 3-7

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide iii

Contents

Chapter 4

Media Module Removal and Replacement Procedures

Media Module............................................................................................................................................4-2

Media Module Bezel..................................................................................................................................4-4

Integrated Management Display ................................................................................................................4-5

Hot-Plug Hard Drives ................................................................................................................................4-7

Hard Drive Blank ................................................................................................................................4-7

Hot-Plug Hard Drive Replacement Guidelines ...................................................................................4-8

Integrated Diskette Drive and CD-ROM .................................................................................................4-10

Media Module Cable Routing Diagram...................................................................................................4-12

Power On/Standby Switch Assembly................................................................................................4-13

Chapter 5

Processor and Memory Module Removal and Replacement Procedures

Shipping Screws.........................................................................................................................................5-1

Security Screw ...........................................................................................................................................5-2

Processor and Memory Module................................................................................................................. 5-3

Processor Boards and Processors...............................................................................................................5-5

Identifying ...........................................................................................................................................5-5

Removing Processor Boards and Processors.......................................................................................5-6

Memory Cartridge....................................................................................................................................5-10

Identifying .........................................................................................................................................5-10

Removing the Memory Cartridge......................................................................................................5-11

Opening the Memory Cartridge.........................................................................................................5-12

DIMM Overview .....................................................................................................................................5-12

Identifying .........................................................................................................................................5-13

SDRAM Memory Bus Configuration ...............................................................................................5-14

Installing DIMMs into the Cartridge.................................................................................................5-15

Memory Riser Board................................................................................................................................5-17

Chapter 6

I/O Module Removal and Replacement Procedures

I/O Module.................................................................................................................................................6-1

Removing the Cable Management Arm:.............................................................................................6-1

Removing the I/O Module...................................................................................................................6-4

I/O Expansion Boards................................................................................................................................6-6

Locating the I/O Expansion Slots........................................................................................................6-6

I/O Expansion Slot Cover....................................................................................................................6-7

Non-Hot Plug Expansion Boards ........................................................................................................6-8

PCI Hot Plug I/O Expansion Boards.................................................................................................6-10

PCI Hot Plug LED Indicators............................................................................................................6-12

PCI Hot Plug Operating System Support ..........................................................................................6-13

Adding PCI Hot Plug Expansion Boards ..........................................................................................6-14

Removing or Replacing a PCI Hot Plug Expansion Board...............................................................6-16

Hot-Plug Fans ..........................................................................................................................................6-18

Fan Cage Assembly .................................................................................................................................6-20

11-slot Hot-Plug Basket...........................................................................................................................6-22

Internal Battery ........................................................................................................................................6-24

iv HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Chapter 7

Diagnostic Tools

Diagnostic Tools Utility Overview ........................................................................................................... 7-2

For More Information................................................................................................................................ 7-4

Chapter 8

Connectors, Switches, and LED Indicators

Connectors................................................................................................................................................. 8-1

Rear Connectors.................................................................................................................................. 8-1

I/O Board Components ....................................................................................................................... 8-2

Host Board .......................................................................................................................................... 8-3

Switches..................................................................................................................................................... 8-4

LED Indicators .......................................................................................................................................... 8-5

System Power LED Indicator ............................................................................................................. 8-6

Auxiliary Power LED Indicator.......................................................................................................... 8-6

System Interconnect LED Indicators.................................................................................................. 8-7

System Attention LED Indicators....................................................................................................... 8-8

Hot-Plug SCSI Hard Drive LED Indicators........................................................................................ 8-9

Power Supply LED Indicators .......................................................................................................... 8-11

Hot-Plug Fan LED Indicators ........................................................................................................... 8-12

PCI Hot Plug LED Indicators ........................................................................................................... 8-13

Memory Cartridge LED Indicators................................................................................................... 8-15

Contents

Chapter 9

Physical, Operating, and Performance Specifications

Server Specifications................................................................................................................................. 9-2

Power Supply Specifications..................................................................................................................... 9-3

Dual Inline Memory Module (DIMM) Specifications .............................................................................. 9-4

1.44-MB Diskette Drive Specifications .................................................................................................... 9-4

DVD-ROM Drive Specifications .............................................................................................................. 9-5

24X Max IDE CD-ROM Drive Specifications.......................................................................................... 9-7

Hot-Plug U320 SCSI Hard Drives ............................................................................................................ 9-9

Hot-Plug Ultra3 SCSI Hard Drives ......................................................................................................... 9-10

Smart Array 5i Controller Specifications................................................................................................ 9-11

NC7770 PCI-X Gigabit Server Adapter Specifications .......................................................................... 9-12

NC7170 Dual Port PCI-X Gigabit Server Adapter Specifications.......................................................... 9-13

Index

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide v

This maintenance and service guide can be used for reference when servicing the HP ProLiant DL760 Generation 2 server.

WARNING: To reduce the risk of personal injury from electric shock and hazardous energy levels, only authorized service technicians should attempt to repair this equipment. Improper repairs can create conditions that are hazardous.

Audience Assumptions

This guide is for service technicians. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazard in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.

Technician Notes

WARNING: Only authorized technicians trained by HP should attempt to repair this equipment. All troubleshooting and repair procedures are detailed to allow only subassembly/module-level repair. Because of the complexity of the individual boards and subassemblies, no one should attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create a safety hazard.

WARNING: To reduce the risk of personal injury from electric shock and hazardous energy levels, do not exceed the level of repairs specified in these procedures. Because of the complexity of the individual boards and subassemblies, do not attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create conditions that are hazardous.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Disconnect power from the system by unplugging all power cords from the power

supplies.

• Do not disable the power cord grounding plug. The grounding plug is an important

safety feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily

accessible at all times.

About This Guide

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide vii

About This Guide

CAUTION: To properly ventilate the system, you must provide at least 7.6 cm (3.0 in.) of clearance at the front and back of the server.

CAUTION: The computer is designed to be electrically grounded (earthed). To ensure proper operation, plug the AC power cord into a properly grounded AC outlet only.

NOTE: Any indications of component replacement or printed wiring board modifications may void any warranty.

Where to Go for Additional Help

In addition to this guide, the following information sources are available:

• User documentation

• Service Quick Reference Guide

• Service training guides

• Service advisories and bulletins

• QuickFind information services

• Insight Manager software

Integrated Management Log

The server includes an integrated, nonvolatile management log that contains fault and management information. The contents of the Integrated Management Log (IML) can be viewed with Insight Manager.

Telephone Numbers

For the name of the nearest HP authorized reseller:

• In the United States, call 1-800-345-1518.

• In Canada, call 1-800-263-5868.

For HP technical support:

• In the United States and Canada, call 1-800-652-6672.

• Outside the United States and Canada, refer to

www.hp.com

viii HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

This chapter provides the illustrated parts breakdown and a spare parts list for the HP ProLiant DL760 server. Refer to the table following each illustration for the names of referenced spare parts.

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-1

Illustrated Parts Catalog

System Chassis

Figure 1-1: System chassis exploded view

1-2 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

Table 1-1: System Chassis Spare Parts List

Item Description Spare Part Number

System Chassis

1 System chassis

2 I/O lid 122214-001

3 Processor and memory module (without processors) 278466-001

4 Media module 319945-001

Heatsink *

Ramp*

Memory module bezel*

5 I/O module with PCI-X I/O board 339661-001

System Components

6 Hot-plug power supply 1150 W 122235-001

7 System midplane assembly 316747-001

*Not shown

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-3

Illustrated Parts Catalog

Media Module

Figure 1-2: Media module exploded view

1-4 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

Table 1-2: Media Module Spare Parts List

Item Description Spare Part Number

Media Module Components

1 Media module

a) Drive tray module*

b) Drive cage assembly*

c) Media module bezel

2 IMD with cable, panel, LED 271930-001

3 Power switch assembly with LED 122233-001

Mass Storage

4 Wide Ultra3 hard drive with tray, 18.2-GB, 1-inch, 10000 rpm 152190-001

Wide Ultra3 hard drive with tray, 36.4-GB, 1-inch, 10000 rpm* 177986-001

Wide Ultra3 hard drive with tray, 18.2-GB, 1-inch, 15000 rpm* 189395-001

U320 Universal hard drive with tray, 36.4-GB, 1-inch, 10000 rpm 289041-001

U320 Universal hard drive with tray, 72.8-GB, 1-inch, 10000 rpm 289042-001

U320 Universal hard drive with tray, 146.8-GB, 1-inch, 10000 rpm 289044-001

U320 Universal hard drive with tray, 18.2-GB, 1-inch, 15000 rpm 289240-001

U320 Universal hard drive with tray, 36.4-GB, 1-inch, 15000 rpm 289241-001

U320 Universal hard drive with tray, 72.8-GB, 1-inch, 15000 rpm 289243-001

5 LVDS 1-inch hard drive blank 313046-001

6 1.44-MB diskette drive 233409-001

7 CD-ROM drive 263243-001

319945-001

8 DVD drive*

*Not shown

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-5

339811-001 356326-001

Illustrated Parts Catalog

Processor and Memory Module

Figure 1-3: Processor and memory module exploded view

1-6 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

Table 1-3: Processor and Memory Module Spare Parts List

Item Description Spare Part Number

Processor and Memory Module Components

1 Processor and memory module 278466-001

2 Processor board 314379-001

3 Processor cover 320104-001

4 Processor board air baffle and label 323754-001

5 Memory riser board 278467-001

Processors

6 Processor (1.5 GHz with 1-MB cache), clip, and heatsink 319952-001

Processor (2.0 GHz with 1-MB cache), clip, and heatsink* 327839-001

Processor (2.0 GHz with 2-MB cache), clip, and heatsink* 319953-001

Processor (2.2 GHz with 2-MB cache), clip, and heatsink* 352311-001

Processor (2.5 GHz with 1-MB cache), clip, and heatsink* 327840-001

Processor (2.7 GHz with 2-MB cache), clip, and heatsink* 352312-001

Processor (2.8 GHz with 2-MB cache), clip, and heatsink* 327841-001

Processor (3.0 GHz with 4-MB cache), clip, and heatsink* 352313-001

Memory

7 Hot-plug memory cartridge 278470-001

8 Memory module, 256MB, PC133, 128Mb, ECC SDRAM DIMM 159377-001

Memory module, 512MB, PC133, 256Mb, ECC SDRAM DIMM* 177628-001

Memory module, 1GB, PC133, 256Mb, LP, ECC SDRAM DIMM* 321851-001

Memory module, 2GB, PC133, 512Mb, ECC SDRAM DIMM* 321852-001

*Not shown

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-7

Illustrated Parts Catalog

I/O Module

Figure 1-4: I/O module exploded view

1-8 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

Table 1-4: I/O Module Spare Parts List

Item Description Spare Part Number

I/O Module Components

1 I/O module

a) PCI-X I/O board

b) PCI-X Hot Plug switch board cable

2 Array enabler board 122232-001

3 Hot-plug 11-slot basket with dividers (quantity 10) and puller assembly

(quantity 10)

4 NC7770 PCI-X Gigabit Server Adapter 10/100/1000 TX UTP NIC 284848-001

NC7170 Dual Port PCI-X Gigabit Server Adapter* 313586-001

5 Hot-plu g fan 278469-001

6 PCI-X Hot Plug switch board kit 278463-001

7 Remote Insight Lights-Out Edition II (RILOE)* 232386-001

8 SCSI cable board* 146447-003

278457-001

323753-001

Miscellaneous

9 SCSI cable* 278470-001

*Not shown

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-9

Illustrated Parts Catalog

Miscellaneous

Table 1-5: Miscellaneous Spare Parts List

Item Description Spare Part Number

1 Miscell aneous plastics*

a) Cover, rack rail

b) Retainer, cardguide, double

c) Retain er, cardguide

d) Gear, ejector, processor/memory riser

e) Guide, card, processor

f) Guide, fan, left

g) Guide, fan, right

h) Plenum, fan cage

i) PCA, SW/LED 11-slot hot-plug PCI

j) Cover, cartridge

k) Bezel, top memory cage

l) Hot-plug 11-slot basket with dividers (quantity 10) and puller assemblies (qua ntity 10)

m) Fiber Optic SISI LED

n) Processor memory ejector kit

o) Air ramp, host PCA

p) Air ramp, F8

q) Light pipe, plate

r) Light pipe, SISI

s) Light pipe, DIMM

278460-001

continued

1-10 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Illustrated Parts Catalog

Table 1-5: Miscellaneous Spare Parts List continued

Item Description Spare Part Number

2 Lever ejector kit, miscellaneous*

Lever, memory cartridge

Latch, memory cartridge

Lever, processor PCA

Spring, processor board / memory riser board and right lever

Latch, processor board / memory riser board

Lever, ejector, memory riser board

Spring, memory cartridge, ZINC

b) Ejector, right, I/O drawer

c) Ejector, left, I/O drawer

Assembly, ejector, drive cage, right, graphite

Assembly, ejector, drive cage, left, graphite

Gear, ejector, processor board / memory riser board

Assembly, PCI, latch and base, CBN, HP (quantity 5)

Ejector, right, processor drawer

Ejector, left, processor drawer

3 Heatsink, F8 chipset* 278472-001

4 Spares, rail kit* 339977-001

5 Return kit* 123189-001

6 Ethernet loopback RJ-45* 317465-001

7 Internal battery* 175115-001

8 Country kit* 152406-001

9 Integrated Management Display 340405-001

278461-001

*Not shown

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 1-11

Safety Considerations

Before performing service procedures, review the following safety information.

Electrostatic Discharge Information

A discharge of static electricity can damage static-sensitive devices or microcircuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. To prevent electrostatic damage, observe the following precautions:

• Transport products in static-safe containers, such as conductive tubes, bags, or boxes.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free

stations.

• Cover workstations with approved static-dissipating material. Use a wrist strap connected

to the work surface and properly grounded tools and equipment.

Service Preparation

• Keep the work area free of nonconductive materials, such as ordinary plastic assembly

aids and foam packing.

• Make sure you are always properly grounded when touching a static-sensitive component

or assembly.

• Avoid touching pins, leads, or circuitry.

• Always place drives PCB assembly-side down.

• Use conductive field service tools.

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-1

Service Preparation

Rack Warnings and Precautions

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure

that:

• The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizers are attached to the rack if it is a single-rack installation.

• The racks are coupled in multiple-rack installations.

• Only one component is extended at a time. A rack may become unstable if more

than one component is extended for any reason.

CAUTION: Always begin by mounting the heaviest item on the bottom of the rack. Continue

to populate the rack from the bottom to the top.

Server Warnings and Precautions

WARNING: The ProLiant DL760 G2 server weighs 73 kilograms (161 pounds) when fully assembled. To reduce the risk of personal injury or damage to the equipment:

63-73 kg

140-161 lb

• Observe local health and safety requirements and guidelines for manual material

handling.

• Obtain adequate assistance to lift and stabilize the product during installation or

removal.

• Remove all modules and power supplies to reduce the overall weight of the

product.

WARNING: To reduce the risk of personal injury from hazardous energy or damage to the equipment when working on energized servers:

• Remove all watches, rings, and any other loose-fitting jewelry.

• Do not use conductive tools inside the server that could bridge live parts.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Do not disable the power cord grounding plug. The grounding plug is an important

safety feature.

• Plug the power cord into a grounded electrical outlet that is easily accessible at all

times.

• Install the power supply before connecting the power cord to the power supply.

• Unplug the power cord before removing the power supply from the server.

• If the system has multiple power supplies, disconnect power from the system by

unplugging all power cords from the power supplies.

2-2 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Service Preparation

WARNING: To reduce the risk of personal injury from hot surfaces, allow the internal system components to cool before touching them.

CAUTION: Because the ProLiant DL760 G2 server does not have safety interlocks, it is

possible for a unit to be operated without the cover and air baffles properly installed. This could cause thermal damage in the system and could void the warranty. The rack-mountable ProLiant DL760 G2 server should always be operated with the system unit cover on. Proper cooling cannot be achieved if the system unit cover is removed for extended periods of time.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply (UPS). This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-3

Service Preparation

Server Modules

In the ProLiant DL760 G2 server, options and accessories are easily accessed through a sliding I/O lid and three removable modules: the media module, processor and memory module, and the I/O module. Refer to Figure 2-1, Figure 2-2, and Figure 2-3 for identification of these modules and other components.

Figure 2-1: Front modules

Item Description

1 Processor and memory module

2 Media module

2-4 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Service Preparation

Figure 2-2: Front module components

Item Description

1 Processor area and air intake

2 Hot-plug hard drives

3 IDE CD-ROM drive

4 1.44-MB diskette drive

5 Integrated Management Display (IMD)

6 Hot Plug RAID Memory cartridge

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-5

Service Preparation

Figure 2-3: Rear components

Item Description

1 I/O module with system fans

2 Hot-plug power supply #1

3 Hot-plug power supply #2

For details on cable connections, refer to Chapter 6, “Cabling the S erver” in the HP ProLiant DL760 Generation 2 Server User Guide.

2-6 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Service Preparation

Table 2-1: Module and Bay Components and Access describes the contents of the modules and how to access the components.

Table 2-1: Module and Bay Components and Access

Module Contents Access Method

I/O module with system fans

Processor and memory module

Media module

Preparation Procedures

To access some components and perform certain service procedures, you must do one or more of the following:

• Extend the server from the rack.

PCI Hot Plug expansion slots Slide the I/O lid toward the

front of the server.

Configuration switches Slide the I/O lid toward the

front of the server.

Fans 1 and 2 Slide the I/O lid toward the

front of the server.

Processor (CPU) sockets Remove the Processor and

Memory Module and the processor board.

Memory (DIMMs) Remove the memory cartridge.

CD-ROM/ Diskette/IMD

Hot-plug hard drives Access directly at the front of

Access directly at the front of the server.

the server.

If you are performing service procedures in an HP rack or third-party rack cabinet, you can user the locking feature of the rack rails to support the server and gain access to internal components.

• Power down the server.

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Remove the server from the rack.

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

To service the ProLiant DL760 G2 server, you might need the following:

• Flat-blade screwdriver (4 millimeter)

• Torx T-15 screwdriver

• Phillips screwdriver

• HP SmartStart CD:

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-7

Service Preparation

— Drive Array Advanced Diagnostics (DAAD) software — Array Diagnostics Utility (ADU) software — ROM-Based Inspect — ROM-Based Diagnostics

System Interconnect LEDs

The system interconnect LEDs on the ProLiant DL760 G2 server provide a closed-loop checking mechanism for verifying proper component mating and interconnections between critical server components. LEDs on the I/O lid provide visual assistance in isolating components to check if the server will not power up due to a component or module that is not fully installed. If a status indicator light is on, reseat the component represented by the indicator. Refer to the hood labels for component location. Refer to Chapter 8 for more information.

Hot-Plug Procedures

You can perform some service procedures without powering down the server. Before performing hot-plug procedures, observe the following guidelines:

• For hot-plug fan procedures, ensure that the fan zone is fully populated.

• For hot-plug power supply procedures, ensure that a redundant power supply is installed

and connected to a power source.

• For hot-plug drive procedures, determine whether the drive is part of an array. For more

information, refer to the “Hot Plug SCSI Hard Drive Replacement Guidelines” in the HP Servers Troubleshooting Guide.

• For hot-plug expansion board procedures, ensure that the proper drivers for the PCI Hot

Plug functionality are installed. For more information, refer to the HP ProLiant DL760 Generation 2 Server User Guide.

The access panels can be removed while the server is powered on without causing a system shutdown. When the server is in standby mode, portions of the power supply, auxiliary power (+5V), and some internal circuitry remain active.

Non-Hot-Plug Procedures

You must power down the server to perform non-hot-plug procedures.

WARNING: To reduce the risk of electric shock or damage to the equipment, disconnect power from the server by unplugging all power cords from either the electrical outlet or the server. In systems with multiple power supplies, you must disconnect all the power cords to completely remove power from the system.

IMPORTANT: It is necessary to be knowledgeable about electrostatic discharge information before

conducting the preparation procedures. For electrostatic discharge information, refer to “Electrostatic Discharge Information” in this chapter.

2-8 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

Powering Down the Server

The system power in the ProLiant DL760 G2 server does not shut off completely with the front panel Power On/Standby switch. The two switch modes are on and standby, rather than on and off. The Standby position removes power from most of the electronics and the drives, but portions of the power supply, the IMD, the system interlock circuitry, and some internal circuitry remain active. To completely remove all power from the system, you must disconnect all power cords from the server.

WARNING: To reduce the risk of electric shock or damage to the equipment, disconnect power from the server by unplugging all power cords from either the electrical outlet or the server.

To power off the server:

1. Back up the server data.

2. Shut down the operating system as directed by the operating system instructions. If the server is in a rack, press the UID button.

3. Press the Power On/Standby switch (2) to standby. This action places the server in standby, thereby disabling the main power supply output and providing auxiliary power (+ 5V) to the server. Standby does not disable main output power.

Service Preparation

4. Be sure that the system power LED (1) on the front panel, near the Power On/Standby switch, becomes dark and fan noise abates.

5. Disconnect all power cords from the server to disable power to the server.

Figure 2-4: System power LED and Power On/Standby switch

For some removal and replacement procedures, you must remove the server from the rack and place it on a sturdy table or workbench. Refer to the HP ProLiant DL760 Generation 2 Server User Guide for further instructions.

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-9

Service Preparation

Powering Up the Server

When you power up the server, it should go through the following sequence. Record any discrepancies and any error messages that occur. Be sure that the server is safely installed in an adequate environment before powering up for the first time.

Be sure that power is supplied to each power supply on the back of the server. The IMD is illuminated if the machine has power.

1. Turn on the machine by pressing the Power On/Standby switch.

2. Check the system power LED: — The system power LED (1) as shown in Figure 2-4, should blink to indicate that the

system is trying to power up. If the LED does not blink when the power button is pressed, then either one of the system components is improperly installed, or there is no main power applied to the system power supplies.

— If the system power LED is amber or if the interconnect check lights are illuminated,

check the system interconnect status indicators (located on the top of the server). For more information, refer to the “System I nterconnect LEDs” section of this chapter.

— The system power LED will blink every one to two seconds between a power-down

and power-up condition or immediately after applying power to the system. This action indicates that the Power/On Standby switch has been pressed and that the system will power up momentarily.

3. Check the power supplies on the back of the server. The following settings indicate that the power switch is on and the power supply is in a “power-on del ay” mode:

— Top LED begins blinking (green) — Bottom LED is on (solid green) If the power supply top LED does not begin blinking (the server will not power up), refer

to the “System Interconnect LEDs” section in this chapter. When the top LED illuminates solid green, listen for the fans to start.

4. Check the hard drive and CD-ROM drive LEDs on the front of the server. The hard drive and CD-ROM drive LEDs should blink. If the LEDs do not light, verify that the hard drives are fully installed in the system and the array bypass is initialized.

5. Check the memory cartridge LEDs. The memory cartridge attention and power LEDs will illuminate solid and then go out in sequence beginning with memory cartridge 1 and ending with memory cartridge 5 (left to right cartridge 1, 2, 3, 4, 5).

6. Check the DIMM status LEDs. The DIMM status LEDs for each cartridge will illuminate solid and then go out in sequence beginning with cartridge 1 and ending with cartridge 5 (left to right cartridge 1, 2, 3, 4, 5).

2-10 HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide

7. Watch for memory system initialization. Memory system initializes as the memory

cartridge power LEDs on all five memory cartridges begin blinking. After the memory system is initialized, all memory cartridges power LEDs will illuminate solid.

8. The server begins the Power-On Self-Test (POST) sequence. The Integrated Management

Display (IMD) displays each step of the POST sequence.

Power-On Self-Test

As the POST process continues during server power-up:

1. Check for the IMD messages about the following:

a. Server name b. LCD firmware c. System initialization d. PCI auto configuration e. Video f. Processors

Service Preparation

2. Check the IMD video initialization message. If there is a monitor connected, refer to the

HP initialization screen.

3. Check the IMD memory test message. The monitor displays the memory initialization,

memory detected, and redundant memory.

4. Check the IMD processors message. The monitor displays the number, speed, and cache

size of the processors.

5. Check for IMD messages about the following:

a. Diskette drive b. Option ROM c. SCSI devices

HP ProLiant DL760 Generation 2 Server Maintenance and Service Guide 2-11

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