HP MGA-82563-BLK, MGA-82563-TR1 Datasheet

0.1– 6 GHz 3 V, 17 dBm Amplifier
Technical Data
MGA-82563

Features

• +17.3 dBm P
+20 dBm P
• Single +3V Supply
• 2.2 dB Noise Figure at
2.0␣ GHz
• 13.2 dB Gain at 2.0 GHz
• Ultra-miniature Package
• Unconditionally Stable
at 2.0 GHz
1 dB
at 2.0 GHz

Applications

• Buffer or Driver Amp for PCS, PHS, ISM, SATCOM and WLL Applications
• High Dynamic Range LNA

Simplified Schematic

OUTPUT
and V
INPUT
3
6
Surface Mount Package SOT-363 (SC-70)

Description

Hewlett-Packard’s MGA-82563 is an economical, easy-to-use GaAs MMIC amplifier that offers excellent power and low noise figure for applications from 0.1 to 6 GHz. Packaged in an ultra­miniature SOT-363 package, it requires half the board space of a SOT-143 package.

Pin Connections and Package Marking

GND
1
GND
2
INPUT
3
Note: Package marking provides
orientation and identification.
d
82
OUTPUT
6
and V
5
GND
4 GND
The input and output of the amplifier are matched to 50␣ (below 2:1 VSWR) across the
d
entire bandwidth, eliminating the expense of external matching. The amplifier allows a wide dynamic range by offering a 2.2 dB NF coupled with a +31 dBm Output IP3.
The circuit uses state-of-the-art PHEMT technology with proven reliability. On-chip bias circuitry allows operation from a single +3␣ V power supply, while resistive feedback ensures stability (K>1) over all frequencies and temperatures.
5965-9685E
GND
1, 2, 4, 5
BIAS
BIAS
6-208

MGA-82563 Absolute Maximum Ratings

Absolute
Symbol Parameter Units Maximum
T
V
V
P
T
V
d
gd
in
in
ch
STG
Device Voltage, RF Output V 5.0 to Ground
Device Voltage, Gate V -6.0 to Drain
Range of RF Input Voltage V +0.5 to -1.0 to Ground
CW RF Input Power dBm +13 Channel Temperature °C 165 Storage Temperature °C - 65 to 150
[1]
Thermal Resistance
θ
= 180°C/W
ch-c
Notes:
1. Permanent damage may occur if any of these limits are exceeded.
= 25°C (TC is defined to be the
2. T
C
temperature at the package pins where contact is made to the circuit board.)
[2]
:
MGA-82563 Electrical Specifications, T
Symbol Parameters and Test Conditions Units Min. Typ. Max. Std Dev
G
NF
NF
test
test
50
Gain in test circuit Noise Figure in test circuit Noise Figure in 50 system f = 0.5 GHz dB 2.3
[1]
[1]
= 25° C, ZO = 50 , Vd = 3 V
C
f = 2.0 GHz 12.0 13.2 0.35 f = 2.0 GHz 2.2 2.9 0.20
[2]
f = 1.0 GHz 2.2 f = 2.0 GHz 2.2 0.20 f = 3.0 GHz 2.2 f = 4.0 GHz 2.4 f = 6.0 GHz 2.7
2
|
|S
21
Gain in 50 system f = 0.5 GHz dB 14.7
f = 1.0 GHz 14.5 f = 2.0 GHz 13.5 0.35 f = 3.0 GHz 12.1 f = 4.0 GHz 10.7 f = 6.0 GHz 8.8
P
1 dB
Output Power at 1 dB Gain Compression f = 0.5 GHz dBm 17.4
f = 1.0 GHz 17.5 f = 2.0 GHz 17.3 0.54 f = 3.0 GHz 17.1 f = 4.0 GHz 17.0 f = 6.0 GHz 16.8
IP
VSWR
VSWR
I
Notes:
1. Guaranteed specifications are 100% tested in the circuit in Figure 10 in the Applications Information section.
2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the initial characterization of this product, and is intended to be used as an estimate for distribution of the typical specification.
Output Third Order Intercept Point f = 2.0 GHz dBm +31 1.0
3
Input VSWR f = 0.2–5.0 GHz 1.8:1
in
Output VSWR f = 0.2–5.0 GHz 1.2:1
out
Device Current mA 63 84 101
d
6-209

MGA-82563 Typical Performance, T

= 25° C, V
C
= 3 V
d
16 14
12 10
(dB)
8
GAIN
6 4
TA = +85°C
= +25°C
T
A
2
= –40°C
T
A
0
034512 6 0 34512 6
FREQUENCY (GHz) FREQUENCY (GHz)
Figure 1. 50 Power Gain vs. Frequency and Temperature.
16 14
12 10
(dB)
8
GAIN
6
Vd = 3.3V
4
= 3.0V
V
d
2
= 2.7V
V
d
0
034512 6
FREQUENCY (GHz)
Figure 4. 50 Power Gain vs. Frequency and Voltage.
5
4
(dB)
3
2
NOISE FIGURE
TA = +85°C
1
= +25°C
T
A
= –40°C
T
A
0
Figure 2. Noise Figure (into 50 ) vs. Frequency and Temperature.
5
4
(dB)
3
2
Vd = 3.3V
NOISE FIGURE
1
= 3.0V
V
d
= 2.7V
V
d
0
034512 6
FREQUENCY (GHz)
Figure 5. Noise Figure (into 50 ) vs. Frequency and Voltage.
19
18
17
(dBm)
1 dB
16
P
TA = +85°C
15
14
= +25°C
T
A
= –40°C
T
A
034512 6
FREQUENCY (GHz)
Figure 3. Output Power @ 1 dB Gain Compression vs. Frequency and Temperature.
19
18
17
(dBm)
1 dB
16
P
Vd = 3.3V
15
= 3.0V
V
d
= 2.7V
V
d
14
034512 6
FREQUENCY (GHz)
Figure 6. Output Power @ 1 dB Gain Compression vs. Frequency and Voltage.
4
3.5
3
2.5
VSWR (n:1)
Input
2
1.5
Output
1
034512 6
FREQUENCY (GHz)
Figure 7. Input and Output VSWR into 50 vs. Frequency.
110 100
90 80
(mA)
70 60 50 40 30
DEVICE CURRENT
20 10
03412
TA = +85°C
= +25°C
T
A
= -40°C
T
A
DEVICE VOLTAGE (V)
Figure 8. Device Current vs. Voltage and Temperature.
6-210
16 14
12
(dB)
10
GAIN and NF
Gain
8 6 4
2 0
NF
034512 6
FREQUENCY (GHz)
Figure 9. Minimum Noise Figure and Associated Gain vs. Frequency.

MGA-82563 Typical Scattering Parameters

Freq. S
11
S
21
[1]
, T
= 25° C, ZO = 50 , Vd = 3 V
C
S
12
S
22
GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor
0.1 0.48 -39 15.71 6.10 164 -23 0.070 27 0.16 -99 1.02
0.2 0.35 -35 14.81 5.50 165 -22 0.076 14 0.12 -134 1.20
0.5 0.29 -37 14.34 5.21 159 -22 0.079 6 0.11 177 1.29
1.0 0.29 -57 13.95 4.98 144 -22 0.080 3 0.11 156 1.33
1.5 0.29 -78 13.50 4.73 128 -22 0.082 2 0.10 142 1.37
2.0 0.29 -99 12.99 4.46 114 -22 0.085 1 0.10 131 1.41
2.5 0.29 -118 12.45 4.19 99 -21 0.089 -1 0.10 124 1.44
3.0 0.28 -138 11.84 3.91 86 -21 0.093 -3 0.11 118 1.48
3.5 0.28 -158 11.24 3.65 74 -21 0.098 -6 0.12 111 1.51
4.0 0.29 -177 10.67 3.42 61 -20 0.103 -9 0.13 106 1.52
4.5 0.30 166 10.11 3.20 50 -20 0.107 -13 0.15 100 1.53
5.0 0.32 151 9.58 3.01 38 -19 0.112 -18 0.16 94 1.54
5.5 0.34 136 9.07 2.84 27 -19 0.117 -23 0.18 87 1.55
6.0 0.36 123 8.57 2.68 16 -19 0.121 -29 0.19 82 1.54
6.5 0.38 110 8.06 2.53 5 -19 0.125 -35 0.22 74 1.55
7.0 0.40 97 7.51 2.37 -5 -18 0.126 -41 0.24 66 1.59
K

MGA-82563 Typical Noise Parameters

[1]
TC = 25° C, ZO = 50 , Vd = 3 V
Frequency NF
O
Γ
opt
GHz dB Mag. Ang.
0.5 2.10 0.15 25 1.20
1.0 2.10 0.15 45 0.60
1.5 2.10 0.14 65 0.29
2.0 2.12 0.15 75 0.27
2.5 2.12 0.15 94 0.25
3.0 2.15 0.144 113 0.23
3.5 2.16 0.14 134 0.21
4.0 2.16 0.15 155 0.19
4.5 2.19 0.17 177 0.18
5.0 2.18 0.20 -166 0.18
5.5 2.19 0.22 -152 0.18
6.0 2.23 0.25 -138 0.19
6.5 2.28 0.27 -125 0.23
7.0 2.39 0.29 -111 0.28
Note:
1. Reference plane per Figure 11 in Applications Information section.
R
/ 50
n
6-211
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