HP KP721AV, dc7900 User Manual

Technical Reference Guide

HP Compaq dc7900 Series Business Desktop Computers

Document Part Number: 506665-001

September 2008

This document provides information on the design, architecture, function, and capabilities of the HP Compaq dc7900 Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.

Microsoft, MS-DOS, Windows, and Windows NT are trademarks of Microsoft Corporation in the U.S. and other countries.

Intel, Intel Core 2 Duo, Intel Core 2 Quad, Pentium Dual-Core, Intel Inside, and Celeron are trademarks of Intel Corporation in the U.S. and other countries.

Adobe, Acrobat, and Acrobat Reader are trademarks or registered trademarks of Adobe Systems Incorporated.

The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

This document contains proprietary information that is protected by copyright. No part of this document may be photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard Company.

Technical Reference Guide

HP Compaq dc7900 Series Business Desktop Computers

First Edition (September 2008) Document Part Number: 506665-001

Contents

1Introduction

1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.3 Model Numbering Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.4 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.1 Special Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.2 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.6 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

2 System Overview

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1

2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2

2.3 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

2.3.1 Intel Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–6

2.3.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7

2.3.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8

2.3.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.3.6 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.3.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.3.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9

2.3.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

2.3.10 Audio Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

2.4 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11

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Contents

3 Processor/Memory Subsystem

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

3.2 Intel Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.1 Intel Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.2 Processor Changing/Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3

3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4

3.3.1 Memory Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5

3.3.2 Memory Mapping and Pre-allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5

4 System Support

4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3

4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4

4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5

4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7

4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–7

4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10

4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10

4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10

4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12

4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–12

4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–13

4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14

4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14

4.6.2 GPIO Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–16

5 Input/Output Interfaces

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2 SATA/eSATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

5.5.1 SATA Inteerface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2

5.5.2 eSATA Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3

5.3 Diskette Drive Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4

5.4 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6

5.5 Parallel Interface Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7

5.5.4 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8

5.6 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.6.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

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5.6.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10

5.6.3 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10

5.7 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.7.1 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.7.2 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12

5.8 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13

5.8.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.3 Audio Multistreaming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.8.4 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15

5.9 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16

5.9.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.9.4 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18

5.9.5 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18

6 Integrated Graphics Subsystem

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1

6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2

6.3 Display Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4

6.4 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5

6.5 Monitor Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6

6.5.1 Analog Monitor Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6

6.5.2 DisplayPort Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–7

Contents

7 Power and Signal Distribution

7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2.1 USDT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2.2 SFF/CMT Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2

7.2.3 Energy Star Compliancy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6

7.3 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6

7.3.1 Power Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–6

7.3.2 Wake Up Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8

7.3.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–9

7.4 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10

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Contents

8SYSTEM BIOS

8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1

8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4

8.4 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5

8.4.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6

8.4.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6

8.5 SMBIOS support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7

8.6 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8

8.7 Management Engine Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8

A Error Messages and Codes

Index

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1.1 A bo u t th i s G u i d e

This guide provides technical information about HP Compaq dc7900 Business PC personal computers that feature Intel processors and the Intel Q45 Express chipset. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information.

The chapters of this guide primarily describe the hardware and firmware elements and primarily deal with the system board and the power supply assembly. The appendices contain general data such as error codes and information about standard peripheral devices such as keyboards, graphics cards, and communications adapters.

This guide can be used either as an online document or in hardcopy form.

1.1.1 O n li ne V i ew in g

Online viewing allows for quick navigating and convenient searching through the document. A color monitor will also allow the user to view the color shading used to highlight differential data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format at the following URL:

www.hp.com

Introduction

Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe Systems, Inc. at the following URL:

www.adobe.com

1.1. 2 H ar d co py

A hardcopy of this guide may be obtained by printing from the .pdf file. The document is designed for printing in an 8 ½ x 11-inch format.

1.2 Additional Information Sources

For more information on components mentioned in this guide refer to the indicated manufacturers' documentation, which may be available at the following online sources:

■ HP Corporation: www.hp.com

■

Intel Corporation: www.intel.com

■

Serial ATA International Organization (SATA-IO): www.serialATA.org.

■

USB user group: www.usb.org

Technical Reference Guide www.hp.com 1-1

Introduction

1. 3 S e ri a l N um b e r

The serial number is located on a sticker placed on the exterior cabinet. The serial number is also written into firmware and may be read with HP Diagnostics or Insight Manager utilities.

1.4 Notational Conventions

The notational guidelines used in this guide are described in the following subsections.

1.4.1 Special Notices

The usage of warnings, cautions, and notes is described as follows:

WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily

harm or loss of life.

CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to

equipment or loss of information.

Text set off in this manner provides information that may be helpful.

✎

1.4.2 Values

Differences between bytes and bits are indicated as follows:

MB = megabytes

Mb = megabits

1.4.3 Ranges

Ranges or limits for a parameter are shown using the following methods:

Example A: Bits <7..4> = bits 7, 6, 5, and 4.

Example B: IRQ3-7, 9 = IRQ signals 3 through 7, and IRQ signal 9

1-2 www.hp.com Technical Reference Guide

1.5 Common Acronyms and Abbreviations

Table 1-1 lists the acronyms and abbreviations used in this guide.

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Aampere

AC alternating current

ACPI Advanced Configuration and Power Interface

A/D analog-to-digital

ADC Analog-to-digital converter

ADD or ADD2 Advanced digital display (card)

AGP Accelerated graphics port

AHCI SATA Advanced Host controller Interface

AMT Active Management Technology

Introduction

API application programming interface

APIC Advanced Programmable Interrupt Controller

APM advanced power management

AOL Alert- On-LAN™

ASIC application-specific integrated circuit

ASF Alert Standard Format

AT 1. attention (modem commands) 2. 286-based PC architecture

ATA AT attachment (IDE protocol)

ATAPI ATA w/packet interface extensions

AVI audio -video i nterl eaved

AVGA Advanc ed VGA

AWG American Wire Gauge (specification)

BAT Basic assurance test

BCD binary-coded decimal

BIOS basic input/output system

bis second/new revision

BNC Bayonet Neill-Concelman (connector type)

bps or b/s bits per second

BSP Bootstrap processor

BTO Built to order

CAS column address strobe

CD compact disk

CD-ROM compact disk read-only memory

Technical Reference Guide www.hp.com 1-3

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

CDS compact disk system

CGA color graphics adapter

Ch Channel, chapter

cm centimeter

CMC cache/memory controller

CMOS complimentary metal-oxide semiconductor (configuration memory)

Cntlr controller

Cntrl control

codec 1. coder/decoder 2. compressor/decompressor

CPQ Compaq

CPU central processing unit

CRIMM Continuity (blank) RIMM

CRT cathode ray tube

CSM 1. Compaq system management 2. Compaq server management

DAC digital-to-analog converter

DC direct current

DCH DOS compatibility hole

DDC Display Data Channel

DDR Double data rate (memory)

DIMM dual inline memory module

DIN Deutche IndustriNorm (connector type)

DIP dual inline package

DMA direct memory access

DMI Desktop management interface

dpi dots per inch

DRAM dynamic random access memory

DRQ data request

DVI Digital video interface

dword Double word (32 bits)

EDID extended display identification data

EDO extended data out (RAM type)

EEPROM electrically erasable PROM

EGA enhanced graphics adapter

EIA Electronic Industry Association

1-4 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

EISA extended ISA

EPP enhanced parallel port

EIDE enhanced IDE

ESCD Extended System Configuration Data (format)

EV Environmental Variable (data)

ExCA Exchangeable Card Architecture

FIFO first in/first out

FL flag (register)

FM frequency modulation

FPM fast page mode (RAM type)

FPU Floating point unit (numeric or math coprocessor)

FPS Frames per second

ft Foot/feet

Introduction

GB gigabyte

GMCH Graphics/memory controller hub

GND ground

GPIO general purpose I/O

GPOC general purpose open-collector

GART Graphics address re-mapping table

GUI graphic user interface

hhexadecimal

HDD hard disk drive

HW hardware

hex hexadecimal

Hz Hertz (cycles-per-second)

ICH I/O controller hub

IDE integrated drive element

IEEE Institute of Electrical and Electronic Engineers

IF interrupt flag

I/F interface

IGC integrated graphics controller

in inch

INT interrupt

I/O input/output

IPL initial program loader

Technical Reference Guide www.hp.com 1-5

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

IrDA Infrared Data Association

IRQ interrupt request

ISA industry standard architecture

Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)

Kb/s kilobits per second

kg kilogram

KHz kilohertz

kV kilovolt

lb pound

LAN local area network

LCD liquid crystal display

LED light-emitting diode

LPC Low pin count

LSI large scale integration

LSb/LSB least significant bit/least significant byte

LUN logical unit (SCSI)

m Meter

MCH Memory controller hub

MMX multimedia extensions

MPEG Motion Picture Experts Group

ms millisecond

MSb/MSB most significant bit/most significant byte

mux multiplex

MVA motion video acceleration

MVW motion video window

n variable parameter/value

NIC network interface card/controller

NiMH nickel-metal hydride

NMI non-maskable interrupt

NRZI Non-return-to-zero inverted

ns nanosecond

NT nested task flag

NTSC National Television Standards Committee

NVRAM non-volatile random access memory

1-6 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

ODD optical disk drive

OS operating system

PAL 1. programmable array logic 2. phase alternating line

PATA Parallel ATA

PC Personal computer

PCA Printed circuit assembly

PCI peripheral component interconnect

PCI-E PCI Express

PCM pulse code modulation

PCMCIA Personal Computer Memory Card International Association

PEG PCI express graphics

PFC Power factor correction

PIN personal identification number

Introduction

PIO Programmed I/O

PN Part number

POST power-on self test

PROM programmable read-only memory

PTR pointer

RAID Redundant array of inexpensive disks (drives)

RAM random access memory

RAS row address strobe

rcvr receiver

RDRAM (Direct) Rambus DRAM

RGB red/green/blue (monitor input)

RH Relative humidity

RMS root mean square

ROM read-only memory

RPM revolutions per minute

RTC real time clock

R/W Read/Write

SATA Serial ATA

SCSI small computer system interface

SDR Singles data rate (memory)

SDRAM Synchronous Dynamic RAM

Technical Reference Guide www.hp.com 1-7

Introduction

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

SDVO Serial digital video output

SEC Single Edge-Connector

SECAM sequential colour avec memoire (sequential color with memory)

SF sign flag

SGRAM Synchronous Graphics RAM

SIMD Single instruction multiple data

SIMM single in-line memory module

SMART Self Monitor Analysis Report Technology

SMI system management interrupt

SMM system management mode

SMRAM system management RAM

SPD serial presence detect

SPDIF Sony/Philips Digital Interface (IEC-958 specification)

SPN Spare part number

SPP standard parallel port

SRAM static RAM

SSD solid state disk (drive)

SSE Streaming SIMD extensions

STN super twist pneumatic

SVGA super VGA

SW software

TAD telephone answering device

TAFI Temperature-sensing And Fan control Integrated circuit

TCP tape carrier package, transmission control protocol

TF trap flag

TFT thin-film transistor

TIA Telecommunications Information Administration

TPE twisted pair ethernet

TPI track per inch

TTL transistor-transistor logic

TV television

TX transmit

UART universal asynchronous receiver/transmitter

UDMA Ultra DMA

1-8 www.hp.com Technical Reference Guide

Table 1-1 (Continued)

Acronyms and Abbreviations

Acronym or Abbreviation Description

URL Uniform resource locator us/µs microsecond

USB Universal Serial Bus

UTP unshielded twisted pair

Vvolt

VAC Volts alternating current

VDC Volts direct current

VESA Video Electronic Standards Association

VGA video graphics adapter

VLSI very large scale integration

VRAM Video RAM

Wwatt

WOL Wake -On-LAN

Introduction

WRAM Windows RAM

ZF zero flag

ZIF zero insertion force (socket)

Technical Reference Guide www.hp.com 1-9

Introduction

1-10 www.hp.com Technical Reference Guide

2.1 Introduction

The HP Compaq dc7900 Business PC personal computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise environments. Based on the Intel processor with the Intel Q45 Express chipset, these systems emphasize performance along with industry compatibility. These models feature a similar architecture incorporating both PCI 2.3 and PCIe 1.1 buses. All models are easily upgradeable and expandable to keep pace with the needs of the office enterprise.

System Overview

HP dc7900 USDT

Figure 2-1. HP Compaq dc7900 Business PCs

This chapter includes the following topics:

■ Features (2.2)

■ System architecture (2.3)

■ Specifications (2.4)

HP dc7900 SFF

HP dc7900 CMT

Technical Reference Guide www.hp.com 2-1

System Overview

2.2 Features

The following standard features are included on all models unless otherwise indicated:

■ Intel processor in LGA775 (Socket T) package

■ Integrated graphics controller with dual monitor support:

❏ One VGA connector

❏ One DisplayPort (DP) connector with Multimode support

■ PC2-6400 and PC2-5300 (DDR2) DIMM support

■ Hard drive fault prediction

■ Eight USB 2.0-compliant ports

■ High definition (HD) audio processor with one headphone output, at least one microphone

input, one line output, and one line input

■ Network interface controller providing 10/100/1000Base T support

■ Plug 'n Play compatible (with ESCD support)

■ Intelligent Manageability support

■ Management/security features including:

❏ Flash ROM Boot Block

❏ Diskette drive disable, boot disable, write protect

❏ Power-on password

❏ Administrator password

❏ Serial port disable (SFF and CMT form factors only)

❏ Smart Cover (hood) Sense

❏ Smart Cover (hood) Lock (SFF and CMT form factors only)

❏ USB port disable

❏ Intel Standard Manageability support

❏ Intel vPro Technology

❏ HP Virtual Safe Browser

■ PS/2 enhanced keyboard

■ PS/2 optical scroll mouse

■ Energy Star compliancy met by all USDT form factors (Energy Star-qualified configurations

of SFF and CMT form factors are available).

2-2 www.hp.com Technical Reference Guide

System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor:

Table 2-1

Feature Difference Matrix by Form Factor

USDT SFF CMT

Processor types supported Intel Celeron,

Pentium dual-core,

Core 2 Duo

Processor wattage (max) 65 W 95 W 95 W

Memory:

# & type of sockets Maximum memory

Serial ports 0 1 std., 1 opt. [1] 1 std., 1 opt. [1]

Parallel ports 0 optional optional

Drive bays:

Externally accessible Internal

Drive types supported 1 HDD,

PCIe slots:

x16 graphics (PCIe 2.0) x1 connector x4 (x16 connector)

2 SODIMM

8 GB

1 1

1 slimline ODD

1 [2]

Intel Celeron,

Pentium dual-core,

Core 2 Duo,

Core 2 Quad

4 DIMM

16 G B

2 1

2 HDDs,

1ODD,

RAID1

1 [3, 4]

1 [3]

1 [3, 4]

Intel Celeron,

Pentium dua l-core,

Core 2 Duo,

Core 2 Quad

4 DIMM

16 G B

4 2

2 HDDs,

2 ODDs,

RAID1

1 1 1

PCI 2.3 32-bit 5-V slots 0 1 half-height

2 full-height [5]

Power Supply Unit:

Module type power rating

NOTES:

[1] 2nd serial port requires optional cable/bracket assembly. [2] PCIe Mini Card slot. [3] Supports low-profile card in standard configuration. Not accessible if PCI riser card field option

is installed. [4] Accepts low-profile PCIe card: height = 2.5 in., length = 6.6 in. [5] Full-height PCI slots require installation of PCI riser card field option (full-height dimensions: height

= 4.2 in., length = 6.875 in).

Technical Reference Guide www.hp.com 2-3

external

13 5 - w a t t

internal

240 -watt

full-height

internal

365-watt

System Overview

2.3 System Architecture

The systems covered in this guide feature an architecture based on the Intel Q45 Express chipset (Figure 2-2). All systems covered in this guide include the following key components:

■ Intel Pentium Dual-Core, Core 2 Duo, Core 2 Quad, or Celeron processor.

■ Intel Q45 Express chipset - Includes Q45 GMCH and 82801 ICH10-DO

■ Super I/O (SIO) controller supporting PS/2 keyboard and mouse peripherals

■ AD1884A audio controller supporting line in, line out, microphone in, and headphones out

■ Intel 82567LM GbE network interface controller

The Q45 chipset provides a major portion of system functionality. Designed to complement the latest Intel processors, the Q45 GMCH integrates with the processor through a 800/1066/1333-MHz Front-Side Bus (FSB) and communicates with the ICH10-DO component through the Direct Media Interface (DMI). The integrated graphics controller of the Q45 on SFF and CMT systems can be upgraded through a PCI Express (PCIe) x16 graphics slot. All systems include a serial ATA (SATA) hard drive in the standard configuration.

Table 2-2 lists the differences between models by form factor.

Table 2-2.

Architectural Differences By Form Factor

Function USDT SFF CMT

Memory sockets 2 SODIMMs 4 DIMMs 4 DIMMs

PCIe 2.0 x16 graphics slot No 1 [1] 1

PCIe x4 (x16 connector) graphics slot No 1 [1] 1

# of PCIe 1.1 x1 slots 0 1 [1] 1

# of PCI 2.3 slots 0 1 [3] 3

Serial port 0 1 [4] 1 [4]

Parallel ports 0 optional optonal

SATA interfaces 2 3 4

eSATA capability [2] No Yes Yes

Notes:

[1] Low-profile slot. Not accessible if PCI riser is installed. [2] Requires optional bracket/cable assembly. [3] Low-profile slot in standard configuration. 2 full-height slots supported with optional PCI riser. [4] 2nd serial port possible with optional adapter.

2-4 www.hp.com Technical Reference Guide

Intel

Processor

800/1066/1333-MHz FSB

System Overview

Analog Mon.

Digital Mon.

PCI Express

x16 slot (PEG) [2]

SATA

Hard Drive

Additional

SATA

Devices

AD1884A

Audio

Subsystem

VGA

DisplayPort

Switch

SATA

SATA/eSATA

Graphics

Cntlr.

SATA I/F [1]

Audio I/F

NIC

I/F

Q45

GMCH

DMI

82801 ICH10

PCI Cntlr.

PCIe x1 slots [4]

SDRAM

Cntlr

USB

I/F

LPC I/F

PCI 2.3 slots [3]

Ch A DDR2

SDRAM

Ch B DDR2

SDRAM

USB 2.0 Ports (10) [5]

Serial I/F [2]

SIO Controller

Kybd-Mouse I/F

Keyboard

Mouse

Parallel I/F [2]

Diskette I/F [2]

Diskette [2]

PCIe x4 (x16 conn.) [2]

Power Supply

Notes:

[1] 2 SATA ports in USDT, 3 SATA ports in SFF, 4 SATA ports in CMT, and 1 eSATA port in SFF and CMT. [2] SFF and CMT only [3] 0 slots in USDT, 1 or 2 slots in SFF, 3 slots in CMT [4] 1 MiniCard slot in USDT, 1 slot in SFF and CMT [5] 8 ports accessible externally, 2 ports accessible internally

Figure 2-2. HP Compaq dc7900 Business PC Architecture, Block diagram

Technical Reference Guide www.hp.com 2-5

System Overview

2.3.1 Intel Processor Support

The models covered in this guide are designed to support the following processor types:

■ Intel Celeron: single- and dual-core performance

■ Intel Pentium Dual-Core: Dual core performance

■ Intel Core2 Duo: energy-efficient dual-core performance

■ Intel Core2 Quad: energy efficient quad-core design

These processors are backward-compatible with software written for earlier x86 microprocessors and include streaming SIMD extensions (SSE, SSE2, and SSE3) for enhancing 3D graphics and speech processing performance. Intel processors with vPro Technology include hardware-based tools that allow corporate IT organizations to remotely manage and protect systems.

The system board includes a zero-insertion-force (ZIF) Socket-T designed for mounting an LGA775-type processor package.

CAUTION: The USDT form factor can support a processor rated up to 65 watts. The SFF and CMT form factors can support a processor rated up to 95 watts. Exceeding these limits can result in system damage and loss of data.

The processor heatsink/fan assembly mounting differs between form factors. Always use the

✎

same assembly or one of the same type when replacing the processor. Refer to the applicable Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan assembly and the processor.

2-6 www.hp.com Technical Reference Guide

2.3.2 Chipset

The Intel Q45 Express chipset consists of a Graphics Memory Controller Hub (GMCH) and an enhanced I/O controller hub (ICH10-DO). Table 2-3 compares the functions provided by the chipsets.

Components Function

Q45 GMCH Intel Graphics Media Accelerator 4500 (integrated graphics controller)

82801 ICH10-DO PCI 2.3 bus I/F

System Overview

Table 2-3

Chipset Components and Functionality

PCIe 2.0 x16 graphics interface (1) SDRAM controller supporting unbuffered, non-ECC PC2-6400 DDR2

DIMMs or SODIMMs 800-, 1066-, or 1333-MHz FSB

PCI Express x1 LPC bus I/F SMBus I/F SATA I/F HD audio interface RTC/CMOS IRQ controller Power management logic USB 1.1/2.0 controllers supporting 12 ports

(these systems provide 8 external, 3 internal)

Gigabit Ethernet controller

The I/O controller hub (ICH10-DO) supports Intel vPro, which uses Active Management Technology (AMT). AMT is a hardware/firmware solution that operates on auxiliary power to allow 24/7 support of network alerting and management of the unit without regard to the power state or operating system. AMT capabilities include:

■ System asset recovery (hardware and software configuration data)

■ OS-independent system wellness and healing

■ Software (virus) protection/management

Technical Reference Guide www.hp.com 2-7

System Overview

2.3.3 Support Components

Input/output functions not provided by the chipset are handled by other support components. Some of these components also provide “housekeeping” and various other functions as well. Table 2-4 shows the functions provided by the support components.

Support Component Functions

Component Name Function

WPCD376H SIO Controller Keyboard and pointing device I/F

Diskette I/F [1] Serial I/F (COM1and COM2) [2] Parallel I/F (LPT1, LPT2, or LPT3) [3] PCI reset generation Interrupt (IRQ) serializer Power button and front panel LED logic GPIO ports Processor over temperature monitoring Fan control and monitoring Power supply voltage monitoring SMBus and Low Pin Count (LPC) bus I/F

Table 2-4

Intel 82567LM Network Interface Controller

AD1884A HD Audio Codec Audio mixer

NOTE:

[1] Not used in USDT form factor. [2] Com1 supported only on SFF and CMT form factors. COM2 requires external bracket/cable assembly. [3] Supported only on SFF and CMT form factors, requires external bracket/cable assembly.

2.3.4 System Memory

These systems implement a dual-channel Double Data Rate (DDR2) memory architecture. All models support DDR2 800- and 667-MHz DIMMs. The USDT system provides two SODIMM sockets supporting up to eight gigabytes of memory while the SFF and CMT form factors provide four DIMM sockets and support a total of 16 gigabytes of memory.

DDR and DDR2 DIMMs are NOT interchangeable.

✎

SODIMM and DIMM components are NOT interchangeable.

✎

10/100/1000 Fast Ethernet network interface controller.

Two digital-to-analog stereo converters Two analog-to-digital stereo converters Analog I/O Supports stereo (two-channel) audio streams

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2.3.5 Mass Storage

All models support at least two mass storage devices, with one being externally accessible for removable media. These systems provide the following interfaces for internal storage devices:

USDT: two SATA interfaces

SFF: three SATA interfaces and one eSATA port

CMT: four SATA interfaces and one eSATA port

These systems may be preconfigured or upgraded with a SATA hard drive and one removable media drive such as a CD-ROM drive.

2.3.6 Serial Interface

The SFF and CMT form factors include a serial port accessible at the rear of the chassis. The SFF and CMT form factors may be upgraded with a second serial port option. The serial interface is RS-232-C/16550-compatible and supports standard baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K.

2.3.7 Universal Serial Bus Interface

System Overview

All models provide ten Universal Serial Bus (USB) ports. Two ports are accessible at the front of the unit, six ports are accessible on the rear panel, and two ports are accessible through a header on the system board. The SFF and CMT form factors support a media card reader module that connects to the internal header. These systems support USB 1.1 and 2.0 functionality on all ports.

BIOS Setup allows for the disabling of USB ports individually or in groups. In order to secure the system against a physical attack, ports may be disabled even if there is nothing physically connected to them, such as the two front ports for the media card reader module when the module is not present.

2.3.8 Network Interface Controller

All models feature an Intel gigabit Network Interface Controller (NIC) integrated on the system board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or 1000BASE-T operation with a local area network and includes power-down, wake-up, Alert-On-LAN (AOL), Alert Standard Format (ASF), and AMT features. An RJ-45 connector with status LEDs is provided on the rear panel.

Technical Reference Guide www.hp.com 2-9

System Overview

2.3.9 Graphics Subsystem

These systems use the Q45 GMCH component, which includes an integrated graphics controller that can drive both an external VGA monitor and a DisplayPort digital display. The controller implements Dynamic Video Memory Technology (DVMT 3.0) for video memory. Table 2-5 lists the key features of the integrated graphics subsystem.

Integrated Graphics Subsystem Statistics

Recommended for Hi 2D, Entry 3D

Bus Type Int. PCI Express

Memory Amount 32 MB pre-allocated

Memory Type DVMT 3.0

DAC Speed 400 MHz

Table 2-5

Q45 GMCH

Integrated Graphics Controller

Maximum 2D Resolution 2048x1536 @ 85 Hz

Hardware Acceleration Quick Draw,

Outputs 1 VGA, 1 DisplayPort 1.1 [see text]

All systems include a legacy VGA connector and a DisplayPort connector and support dual monitor operation. The DisplayPort includes a multimode feature that allows a DVI or VGA adapter to be connected to the DisplayPort.

These systems also include two PCIe graphics slots (one x16, one x4/x16 connector) to ensure full graphics upgrade capabilities.

2.3.10 Audio Subsystem

These systems use the integrated High Definition audio controller of the chipset and the ADI AD1884A High Definition audio codec. HD audio provides enhanced audio performance with higher sampling rates, refined signal interfaces, and audio processors with increased signal-to-noise ratio. The audio line input jack can be re-configured as a microphone input, and multi-streaming is supported. These systems include a 1.5-watt output amplifier driving an internal speaker, which can be muted with the F10 BIOS control. All models include front panel-accessible stereo microphone input and headphone output audio jacks.

DirectX 9,

Direct Draw,

Direct Show,

Open GL 1.45,

MPEG 1-2,

Indeo

2-10 www.hp.com Technical Reference Guide

2.4 Specifications

This section includes the environmental, electrical, and physical specifications for the systems covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice.

Environmental Specifications (Factory Configuration)

Parameter Operating Non-operating

System Overview

Table 2-6

Ambient Air Temperature 50

to 95o F (10o to 35o C, max.

rate of change <

10°C/Hr)

-22

to 140o F (-30o to 60o C, max. rate of change <

Shock (w/o damage) 5 Gs [1] 20 Gs [1]

Vibration 0.000215 G

Humidity 10-90% Rh @ 28

wet bulb temperature

/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz

C max.

5-95% Rh @ 38.7o C max.

wet bulb temperature

Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]

NOTE:

[1] Peak input acceleration during an 11 ms half-sine shock pulse. [2] Maximum rate of change: 1500 ft/min.

Table 2-7

Power Supply Electrical Specifications

Parameter Value

Input Line Voltage: Nominal: Maximum

100–240 VAC

90–264 VAC

20°C/Hr)

Input Line Frequency Range: Nominal Maximum

50–60 Hz 47–63 Hz

Energy Star 4.0 with 80Plus Bronze-level compliancy

USDT SFF & CMT

Standard Optional

Maximum Continuous Power:

USDT SFF CMT

NOTE: Energy Star 4.0 with 80Plus Bronze-level compliancy option available for SFF and CMT form factors.

135 w a t t s 240 watts 365 watts

Technical Reference Guide www.hp.com 2-11

System Overview

Parameter USDT [2] SFF [2] CMT [3]

Table 2-8

Physical Specifications

Height 2.60 in

(6.60 cm)

Width 9.90 in

(25.15 cm)

Depth 10.0 in

(25.40 cm)

Weight [1] 7.0 lb

(3.18 kg)

Load-bearing ability of chassis [4]

NOTES:

[1] System configured with 1 hard drive, 1 diskette drive (SFF and CMT only), and no PCI cards. [2] Desktop (horizontal) configuration. [3] Minitower configuration. For desktop configuration, swap Height and Width dimensions. [4] Applicable to unit in desktop orientation only and assumes reasonable type of load such as a monitor.

77.1 lb

(35 kg)

3.95 in

(10.03 c m)

13. 3 i n

(33.78 cm)

14.9 in

(37.85 cm)

18 . 75 l b

(8.50 kg)

77.1 lb

(35 kg)

17. 6 3 i n

(44.8 cm)

7.0 i n

(16. 8 c m )

17.8 in

(45.21 cm)

26.2 lb

(11. 89 kg )

77.1 lb

(35 kg)

2-12 www.hp.com Technical Reference Guide

System Overview

Table 2-9

Optical Drive Specifications

HP SuperMulti LightScribe

Parameter DVD-ROM CD-RW/DVD-ROM Combo

Interface Type SATA [1] SATA [1] SATA [1]

Combo

Max. read/write speeds by media type

Maximum Transfer Rate (Reads)

DVD-RAM: 4x/na DVD+RW: 8x/na

DVD-RW: 8x/na DVD+R DL: 8x/na DVD-R DL: 8x/na DVD-ROM: 16x/na

DVD+R: 8x/na DVD-R: 8x/na

CD-ROM: 48x/na CD-RW: 32x/na CD-R: 48x/na

DVD:, 21.6 KB/s;

CD: 7.2 KB/s

DV D - R A M : 12 x / 12 x DVD+RW: 8x/8x

DVD-RW: 8x/6x DVD+R DL: 8x/8x DVD-R DL: 8x/8x DVD-ROM: 16x/na

DVD-ROM DL: 8x/na DV D + R : 16 x / 16 x

DV D - R : 16 x / 16 x CD-ROM: 48x/na CD-RW: 32x/32x CD-R: 48x/48x

DVD:, 21.6 KB/s;

CD: 7.2 KB/s

DV D - R A M : 12 x / 12 x DVD+RW: 8x/8x

DVD-RW: 8x/6x DVD+R DL: 8x/8x DVD-R DL: 8x/8x DVD-ROM: 16x/na

DVD-ROM DL: 8x/na DVD+R: 16x/16x

DVD-R: 16x/16x CD-ROM: 48x/na CD-RW: 32x/32x CD-R: 48x/48x

DVD:, 21.6 KB/s;

CD: 7.2 KB/s

Media Capacity (DVD) DL: 8.5 GB, Std: 4.7 GB DL: 8.5 GB, Std: 4.7 GB DL: 8.5 GB, Std: 4.7 GB

Average Access Time: Random Full Stroke

DVD: <140 ms, CD: <125

DVD: <140 ms, CD: <125 ms DVD: <250 ms, CD: <210 ms

DVD: <140 ms, CD: <125 ms

DVD: <250 ms, CD: <210 ms

DVD: <250 ms, CD: <210

Media lable creation? No No Yes [2]

NOTE [1] USDT models use “slim” drive. [2] Requires special label-etchable media.

Technical Reference Guide www.hp.com 2-13

System Overview

Parameter 80 GB 160 GB 250 GB [4]

Drive Size 2.5 & 3.5 in.[1] 2.5 & 3.5 in [1] 3.5 in

Interface SATA SATA SATA

Transfer Rate 1.5 & 3.0 Gb/s [2] 1.5 & 3.0 Gb/s [2] 3.0 Gb/s

Table 2-10

Hard Drive Specifications

Drive Protection System Support?

Typical Seek Time (w/settling) Single Track Average Full Stroke

Disk Format (logical blocks) 156,301,488 320,173,056 488,397,168

Rotation Speed 5400/7200/

Drive Fault Prediction SMART IV SMART IV SMART IV

NOTES: [1] USDT supports 2.5-in. drives only. [2] USDT supports 1.5 Gb/s drives only. [3] USDT supports up to 7200-RPM drives only. [4] Supported by SFF and CMT form factors only.

Yes Yes Yes

0.8 ms 9 ms

17 ms

10K R PM [ 3 ]

0.8 ms 9 ms

17 ms

5400/7200/

10K R PM [ 3 ]

1.0 m s 11 ms

18 ms

7200 RPM

2-14 www.hp.com Technical Reference Guide

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