• Compatible with Infrared
and Vapor Phase Reflow
Solder Processes
• Packaged in 12 mm or 8 mm
tape on 7" or 13" Diameter
Reels
• EIA Standard Package
• Low Package Profile
• Nondiffused Package
Excellent for Backlighting
and Coupling to Light Pipes
Description
These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement
equipment. A glue pad is provided
for adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering and conductive
epoxy attachment processes.
The package size and configuration conform to the EIA-535
BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
permit dense placement and
provide an external solder joint
for ease of inspection.
These devices are nondiffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.
Device Selection Guide
DH ASHighHigh
AlGaAsEfficiencyPerformanceEmerald
RedRedOrangeYellowGreenGreen
HSMH-HSMS-HSMD-HSMY-HSMG-HSME-Description
T400T400T400T400T400T40012 mm Tape, 7" Reel,
2000 Devices
T500T500T500T500T500T50012 mm Tape, 13" Reel,
8000 Devices
T600T600T600T600T600T6008 mm Tape, 7" Reel,
2000 Devices
T700T700T700T700T700T7008 mm Tape, 13" Reel,
8000 Devices
1-204
5964-9359E
Package Dimensions
3.5 ± 0.2
(0.138 ± 0.008)
2.8 ± 0.2
(0.110 ± 0.008)
0.7
(0.028)
0.8 ± 0.3
(0.031 ± 0.012)
(2 PLACES)
MIN.
(0.087)
3.1
(0.122)
(0.004)
NOM.
2.2
0.1
1.3
(0.050)
MIN.
NOM.
NOM.
Tape and Reel
Specifications
Hewlett Packard surface mount
LEDs are packaged tape and reel
in accordance with EIA-481A,
Taping of Surface Mount
2.7
NOM.
(0.106)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
CATHODE NOTCH
1.9 ± 0.2
(0.075 ± 0.008)
2.2 ± 0.1
(0.087 ± 0.004)
Components for Automatic
Placement. This packaging
system is compatible with tapefed automatic pick and place
systems. Each reel is sealed in a
vapor barrier bag for added
protection. Bulk packaging in
vapor barrier bags is available
upon special request.
CATHODE
PITCH: 4 mm (0.157 IN.)
CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
USER FEED
DIRECTION
HEWLETT
hp
PACKARD
REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)
1-205
Absolute Maximum Ratings at T
= 25°C
A
DH ASHighHigh
AlGaAsEfficiencyPerf.Emerald
ParameterRedRedOrangeYellowGreenGreenUnits
DC Forward303030303030mA
Current
[1]
Peak Forward3009090609090mA
Current
[2]
Average202525202525mA
Forward
Current
[2]
LED Junction95°C
Temperature
Transient
Forward
Current
[3]
(10 µs Pulse)500mA
Reverse Voltage5V
(IR = 100 mA)
Operating-40 to +85-20 to +85°C
Temperature
Range
Storage-40 to +85°C
Temperature
Range
Reflow Soldering
Temperature
Convective IR235°C Peak, above 185°C for 90 seconds.
Vapor Phase 215°C for 3 minutes.
Notes:
1. Derate dc current linearly from 50°C: For AlGaAs red, high efficiency red, and green devices at 0.67 mA/°C. For yellow devices at
0.44 mA/°C.
2. Refer to Figure 5 showing Maximum Tolerable Peak Current vs. Pulse duration to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
wire bond. The device should not be operated at peak currents above the Absolute Maximum Peak Forward Current.