HP HBCC-1580, HBCC-1570, HBCC-1590 Datasheet

Optical Reflective Sensors

Technical Data

HBCC-1570 HBCC-1580 HBCC-1590

Features

• Focused Emitter and Detector in a Single Package

• TO-5 Miniature Sealed Package

• Photodiode Output

• Choice of Resolutions (0.13 mm, 0.178 mm, 0.33 mm)

• Two Wavelengths Available; 655 nm, 820 nm

(see selection guide)

Description

The HBCC-15XX series sensors are fully integrated modules designed for applications requiring optical reflective sensing. The modules contain a 655 nm (or 820 nm) LED emitter and a photodiode. A bifurcated aspheric lens is used to image the active areas of the emitter and detector to a single spot 4.27 mm (0.168 in.) in front of the package. The output signal is a current generated by the photodiode.

Applications

The HBCC-15XX sensors are intended for use with the HewlettPackard HBCC-0500 and HBCC0600 low current digitizer ICs, or

Selection Guide

Sensor Part Number HBCC-1570 HBCC-1580 HBCC-1590

LED Resolution 0.33 mm (0.013 in.) 0.185 mm (0.007 in.) 0.13 mm (0.005 in.)

LED Wavelength 655 nm 655 nm 820 nm

Package Dimensions

MAXIMUM SIGNAL POINT – MSP

REFERENCE PLANE

5.08

(0.200)

9.40

8.51

(0.370) (0.335)

S.P.

12.0

(0.473)

R.P.

O.D.

5.08

(0.200)

NOTES: A. ALL DIMENSIONS IN MILLIMETERS AND (INCHES). B. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY. C. THE REFERENCE PLANE (R.P.) IS THE TOP SURFACE OF THE PACKAGE. D. NICKEL CAN AND GOLD PLATED LEADS. 

(0.168) ± (0.010)

4.27

0.25

± 

5965-5942E

1.14

0.73

0.86

0.73

(0.045) (0.029)

(0.034) (0.029)

E. S.P. = SEATING PLANE. F. THE LEAD DIAMETER IS 0.45 mm (0.018 in.) TYP. G. O.D. = OUTSIDE DIAMETER OF CAN MEASURED IN REGION ABOVE  WELD FLANGE TO MIDWAY OF CAN LENGTH.

15.24

12.70

(0.600) (0.500)

11.50

11.22

(0.453) (0.442)

8.33

8.12

(0.328) (0.320)

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with suitable PCB assemblies

EMITTER



BAFFLE

EPOXY SEAL

SENSING

AREA

GLASS

LENS

DETECTOR 

provided by HP for use with these sensors. The HBCC-15XX sensors have been characterized for use only with Hewlett-Packard’s digitizer IC technology. Use of these sensors in designs or applications other than those stated is at the customer’s risk.

Mechanical Considerations

The HBCC-15XX series are packaged in a high profile 8 pin TO-5 metal can with a glass window. The LED and photodiode are mounted on a header at the base of the package. Positioned above these active elements is a bifurcated aspheric acrylic lens that focuses them to the same point.

The sensor can be rigidly secured by commercially available TO-5 style heat sinks or 8 pin 0.200 inch diameter pin circle sockets. These fixtures provide a stable reference platform for affixing the HBCC15XX sensors to a circuit board.

HBCC-1570, 1580 Optical System

HBCC-1590 Optical System

SILICON

BAFFLE

EMITTER

0.089 mm DIA. JUNCTION 

OPTICAL APERTURE BAFFLE

EPOXY SEAL

SENSING

AREA

In applications requiring contact scanning (such as bar code reading), protective focusing tips are available. Focusing tips are available in either metal or polycarbonate packages using a sapphire ball as the contact surface. The Hewlett-Packard part numbers are HBCS-2999, HBCS4999, HBCS-A998, and HBCS-A999.

Electrical Operation

The sensor detector is a pn photodiode. The LED cathode is physically and electrically connected to the case-substrate of the sensor.

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DETECTOR

0.406 mm SQUARE 

The HBCC-15XX sensors are characterized for use with HewlettPackard’s low current digitizer ICs. The digitizer IC part numbers are HBCC-0500 and HBCC-0600. Data Sheets including circuit diagrams are available.

GLASS

LENS

Absolute Maximum Ratings

TA = 25°C unless specified otherwise (unless specified separately, data applies to all sensors)

Parameter Symbol Min. Max. Units Notes

Storage Temperature T

Operating Temperature T

Lead Soldering Temperature 260 °C1 (1.6 mm from Seating Plane) (for 10 seconds)

Average LED Forward Current I

Peak LED Forward Current I

Reverse LED Input Voltage V

Photodiode Bias V

Notes:

1. CAUTION: The thermal constraints of the acrylic lens will not permit conventional wave soldering procedures. The typical preheat and post-soldering cleaning procedures and dwell times can subject lens to thermal stresses beyond the absolute maximum ratings and can cause it to defocus.

2. These sensors are specified for use with the drive conditions provided by the HBCC-0500 and HBCC-0600 Digitizer IC ONLY.

3. When used with HBCC-0500 or HBCC-0600 digitizer ICs.

4. At all combinations of pulse width and duty cycle.

5. Voltage differential between Pin 1 and Pin 8 with Pin 8 taken as reference. Exceeding maximum conditions may cause permanent damage to photodiode or to chip metallization.

-40 +75 °C

-20 +75 °C

125 mA 3 (HBCC-1570) 100 mA 3 (HBCC-1580)

40 mA 4 (HBCC-1590)

5.0 V

2.5 V HBCC-1590 Only

-0.3 6.0 V 5

REFERENCE

PLANE

REFLECTOR

LED

CASE, SUBSTRATE

SCHEMATIC DIAGRAM CONNECTION DIAGRAM

Rs = CHARACTERISTIC NOT DEFINED

TOP VIEW

LED

PIN#

1

2 6 8

FUNCTION PHOTODIODE CATHODE HEADER GROUND LED ANODE PHOTODIODE ANODE 

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