HP Envy Recline23 TouchSmart Beats SE, ENVY Touch 23, Envy TouchSmart 23, Envy TouchSmart 27 Disassembly Instructions Manual
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicabl e.]
HP Envy Recline23 TouchSmart Beats SE All-in-One PC
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
With a surface greater than 10 sq cm
Module, TP Board, WLAN Card, RAM Module (x2)
8
Batteries
All types including standard alkaline and lithium coin
or button style batteries RTC Battery
1
Mercury-containing components
For example, mercury in lamps, display back lights ,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illum inate d dis plays with gas
discharge lamps Touch LCD display
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Assemblies (PCA)
weighing > 25 grams (not including PCBs or PCAs
Mother Board, USB Board, Power Board, Touchpad
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template a r e a vailable at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #Screwdiver
TORX T8
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Proc ess
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassembly Ram Door
2. Disassembly HDD & Dongle
3. Disassembly Ram Shielding
4. Disassembly DDR Ram*2
5. Disassembly Rear cover sub assay
6. Disassembly Camera Module, PCB modules
7. Disassembly Thermal module Fan
8. Disassembly Mother board shielding
9. Disassembly WLAN Card
10. Disassembly Thermal module
11. Disassembly CPU
12. Disassembly Hinge Cap L&R
13. Disassembly Stand unit
14. Disassembly Support bridge
15. Disassembly Mother Board + USB 3.0 PCB and RTC battery
16. Disassembly Separate the USB 3.0 PCB from M/B
17. Disassembly Speaker left & right side
18. Disassembly Base Pan sub assay
19. Disassembly Loosen FPC
20. Disassembly LCD Panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Disassembly Ram Door 3.22 Disassembly HDD & Dongle
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template a r e a vailable at EL-MF877-01
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