Page 1
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDisplay E232e 23-inch Monitor
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Batteries
All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 2
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #1
Crossing
Screw Driver
M3
Description #2
Crossing
Screw Driver
M2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
Below action which may easily damage product .please notice it
Lay the
Monitor on
the desk, tack
out the stand
with hand
N/A
1
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, tack out the stand with hand
2. Unlock the 4 PCS screws
3. Take out the back cover with hand.
4. Take out the Keypad line with hand.
5. Take out the tapes with hand and take out the LED line
6. Take out the foils with hand
7. Take out the tape and take out the LVDS
8. Take out the chassis ASM with hand
9. Take out the foil with handTake out the panel and Bezel ASM
10. Take out the top chassis mylar with hand
11. Unlock the 2 screws and take out the keypad
12. Unlock the 3 Screws
13. Unlock the 1 Screws and take out the USB cover ASM
14. Take out the USB line
15. Unlock the 2 screws and take out the USB board
16. Take out the mylar
17. Unlock the 7 screws and take out the PCBA with hand
18. Take out the lines with hand
19. Take out the rubber cap and mylars with hand
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 3
Unlock the
4 PCS
screws
#1
Cross
ing
Scre
w
Drive
r
2
Take out the
back cover
with hand.
N/A
3
Take out the
Keypad line
with hand.
N/A
4
Take out the
tapes with
hand and take
out the LED
line
N/A
5
Take out the
foils with
hand
N/A
6
Take out the
tape and
take out the
LVDS
N/A
7
Take out the
chassis
ASM with
hand
N/A 8
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 4
EL-MF877-00 Page 4
Take out the
foil with
hand
N/A
9
Take out the
panel and
Bezel ASM
N/A
10
Unlock the
2 screws
and take out
the keypad
#2
Cross
ing
Scre
w
Drive
r
11
Unlock the
3 Screws
#1
Cross
ing
Scre
w
Drive
r
12
Unlock the
1 Screws
and take out
the USB
cover ASM
#1
Cross
ing
Scre
w
Drive
r
13
Take out
the USB
line
N/A
14
Unlock the
2 screws
and take
out the
USB board
#1
Cross
ing
Scre
w
Drive
r
15
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 5
Take out
the mylar
N/A
16
Unlock the
7 screws
and take
out the
PCBA with
hand
#1
Cross
ing
Scre
w
Drive
r
17
Take out
the lines
with hand
N/A 18
Take out
the rubber
cap and
mylars with
hand
N/A 19
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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