Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G3 Tower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
Item Description Notes
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin
Mercury-containing components For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
greater than 2.5 cm in diameter or height
External electrical cables and cords 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent
With a surface greater than 10 sq cm 2
or button style batteries
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel STD 3
of items
included
in product
1
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including liquids, semi-liquids (gel/paste) and toner chambers, and service station s.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
ove the memory from MB.(see Figure 14 below)
Remove ODD from chassis.(see Figure 15-16 below)
Remove FIO/PSU/Speaker/SATA power/system fan cables from the MB.(see Figure 17-24 below)
Remove system fan from chassis.(see Figure 25 below)
11. Remove the heatsink from MB.(see Figure 26- 27 below)
12.Separate the fan from CPU heatsink .(see Figure 28-29 below)
13
.
Remove the CPU from the MB(see Figure 30-31 below)
14. Remove the battery from the MB.(see Figure 32 below)
15.Remove M/B from chassis.(see Figure 33-34 below)
16. Remove front panel from chassis.(see Figure 35 below)
17.
emove FIO/Speaker from chass i s. (see Fig ur e 36 -3 8 be low)
R
18
. Rmo
19
. Rem
ve HDD from HDD cage.(see Figure 39 below)
ove PSU cover.(see Figure 40-46 below)
20. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 47-52 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Figure 1 Press access panel latch remove access panel Figure 2 Remove the cable from the hook
Figure 3 Press the latch on ODD cage Figure 4 Disconnect HDD Power cable from HDD
Figure 5 Disconnect SATA cable from HDD Figure 6 Remove HDD cage
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Figure 7 Disconnect FIO USB2.0 cable from the MB Figure 8 Disconnect FIO Type A cable from the MB
Figure 9 Disconnect FIO Type C cable from the MB Figure 10 Disconnect HDD SATA cable from the MB
Figure 11 Disconnect PSU P2 cable from the MB Figure 12 Disconnect ODD power cable from ODD
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Figure 13 Disconnect SATA cable from ODD Figure 14 Remove the Memory card from the board
Figure 15 Press the ODD’s latch on ODD cage Figure 16 Remove the ODD from ODD cage
Figure 17 Disconnect SATA power cable from the MB Figure 18 Disconnect MB PSU cable from the MB
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Figure 19 Disconnect FIO LEDs/Switch cable from the MBFigure 20 Disconnect Speaker cable from the MB
Figure 21 Disconnect FIO audio cable from the MB Figure 22 Disconnect CPU Power cable from the MB
Figure 23 Disconnect ODD SATA cable from the MB
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Figure 24 Disconnect system fan cable from the MB
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Figure 25 Use PH1 screwdriver to remove system fan
from chassis
Figure 27 Use T-15 screwdriver to loose the screws and
remove heatsink
Figure 26 Disconnect heatsink fan cable from MB
Figure 28 Use PH1 screwdriver to loose the screws and
remove the fan
Figure 29 Separate the fan from CPU heat sink Figure 30 Rotate the handle and open it up
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Figure 31 Remove the CPU from the board Figure 32 Remove the battery from the system board
Figure 33 Use T-15 screwdriver to loose the screws of MB
from board
Figure 35 Remove front panel from chassis Figure 36 Use T-15 screwdriver loose the screws of FIO
Figure 34 Remove MB from chassis
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Figure 37 Remove FIO Figure 38 Use T-15 screwdriver loose the screws of speaker
and remove it
Figure 39 Remove the HDD from HDD cage Figure 40 Use T-15 screwdriver remove the screws on the
PSU chassis
Figure 41 Press the PSU’s latch on chassis Figure 42 Remove the Power supply from chassis
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Figure 43 Use Micro shear 170II to cut the cable tie
Figure 45 Use PH1 screwdriver to remove screw for top Figure 46 Remove cover
Figure 44
Use PH1 screwdriver to remove screw for bottom
Figure 47 Use PH1 screwdriver to remove FG screw Figure 48 Use Micro shear 170II to cut the cable tie of fan
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Figure 49 Disconnect fan connector and inlet connector
Figure 50 Use PH1 screwdriver to remove PCB1 screw
Figure51 Use PH1 screwdriver to remove AC inlet & Fan
screw
Figure 52 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it
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age 11
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