HP EliteDesk 880 G2 Disassembly Instructions Manual
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 880 G2 TWR Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
Item Description Notes
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin
Mercury-containing components For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords Power cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent
With a surface greater than 10 sq cm 2
or button style batteries
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel 400W EPA92(C4,C49,C50) 3
of items
included
in product
1
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including liquids, semi-liquids (gel/paste) and toner chambers, and service station s.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Micro shear 170II
Screwdriver PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
Disconnect the cables.(see Figure 2-5 below)
2.
3.
Remove the HDD from cage.(see Figure 6 below)
Remove PSU from chassis.(see Figure 7~11 below)
4.
Remove system fan.(see Figure 12&13 below
5.
6
. Remove the Memory card from the board.(see Figure 14&15 below)
7.
emove the HeatSink.(see Figure 16 below)
R
Remove the CPU from the board .(see Figure 17-18 below)
8.
)
9. Remove the battery from the system board.(see Figure 19 below)
10
Remove M/B from chassis.(see Figure 20&21 below
.
Remove front panel.(see Figure 22 below)
11.
12
.
Remove slim ODD from chassis.(see Figure 23&24 below)
)
13.Remove Front I/O cable, power LED cable and speaker.(see Figure 25~30 below)
14.
15
. Rem
ove HDD/Slim ODD/5.25'' bay's Latch from chassis.(see Figure 31-36 below)
Rem
ove PSU cover.(see Figure 37&38 below)
16. Unscrew and remove Fan and Inlet from case.(see Figure 39&40 below)
17
. Rem
18
.
ove the thin-film plastic sheet and PCA.(see Figure 41&42below)
Remove bulk cap(electrolytic capacitor) from PCB.(see Figure 43 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Figure 1 Remove the side panel: Figure 2 Disconnect the cables from the board
Figure 3 Disconnect PSU cables from the board Figure 4 Disconnect the cables from the ODD
Figure 5 Disconnect the cables from the HDD Figure 6 Remove the HDD from cage
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