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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 880 G2 TWR Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
Item Description Notes
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin
Mercury-containing components For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords Power cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent
With a surface greater than 10 sq cm 2
or button style batteries
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel 400W EPA92(C4,C49,C50) 3
of items
included
in product
1
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including liquids, semi-liquids (gel/paste) and toner chambers, and service station s.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Micro shear 170II
Screwdriver PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
Disconnect the cables.(see Figure 2-5 below)
2.
3.
Remove the HDD from cage.(see Figure 6 below)
Remove PSU from chassis.(see Figure 7~11 below)
4.
Remove system fan.(see Figure 12&13 below
5.
6
. Remove the Memory card from the board.(see Figure 14&15 below)
7.
emove the HeatSink.(see Figure 16 below)
R
Remove the CPU from the board .(see Figure 17-18 below)
8.
)
9. Remove the battery from the system board.(see Figure 19 below)
10
Remove M/B from chassis.(see Figure 20&21 below
.
Remove front panel.(see Figure 22 below)
11.
12
.
Remove slim ODD from chassis.(see Figure 23&24 below)
)
13.Remove Front I/O cable, power LED cable and speaker.(see Figure 25~30 below)
14.
15
. Rem
ove HDD/Slim ODD/5.25'' bay's Latch from chassis.(see Figure 31-36 below)
Rem
ove PSU cover.(see Figure 37&38 below)
16. Unscrew and remove Fan and Inlet from case.(see Figure 39&40 below)
17
. Rem
18
.
ove the thin-film plastic sheet and PCA.(see Figure 41&42below)
Remove bulk cap(electrolytic capacitor) from PCB.(see Figure 43 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Figure 1 Remove the side panel: Figure 2 Disconnect the cables from the board
Figure 3 Disconnect PSU cables from the board Figure 4 Disconnect the cables from the ODD
Figure 5 Disconnect the cables from the HDD Figure 6 Remove the HDD from cage
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Figure 7 Take the CPU Power cable out of the
hooks.
Figure 9 Loose the screws from PSU Figure 10 Press the baffle and slide the PSU
Figure 8 Take the cables out of the hooks.
Figure 11 Remove PSU. Figure 12 Loose the screws from system fan
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Figure 13 Remove system fan Figure 14 Release the clip.
Figure 15 Remove the Mem ory card from the board Figure16 Loose the screws and remove HeatSink.
Figure 17 Rotate the handle and open it up Figure 18 Remove the CPU from the board
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Figure 19 Remove the battery from the system board
Figure 21 Remove M/B from chassis Figure 22 Release the hooks and remove front panel.
Figure 20 Loose the screws from board
Figure 23 Release slim ODD latch.
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Figure 24 Remove slim ODD from chassis
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Figure 25 Loose the scre ws. Figure 26 Remove Front I/O cable.
Figure 27 Release the hook . Figure 28 Remove power LED cable.
Figure 29 Loose the screws of speaker. Figure 30 Remove speaker
.
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Figure 31 Release the hooks and slide it towards left.
Figure 33 Release the metal sheet structure.
Figure 32 Remove HDD latch from chassis.
Figure 34 Remove 5.25'' bay's latch
Figure 35 Release the slim ODD latch from slim
ODD.
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Figure 36 Remove slim ODD latch from slim ODD.
PSG instructions for this template are available at EL-MF877-01
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Figure 37 Release the screw. （Acbel 400W
EPA92）
Figure 39 Release scew of Fan and remove the fan
from case
Figure 38 Slid cover to the left.
Figure 40 Release scew of Inlet and remove the Inlet
from case.
.
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Figure 41 Remove the thin-film plastic sheet. Figure 42 Unscrew and remove PCB from c ase.
Figure 43 Remove bulk cap(electrolytic capacitor)
from PCB.
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age 10
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