HP E1399A User Manual

Contents

HP E1399A Breadboard Module User’s Manual

Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

WARNINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Safety Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Reader Comment Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1. HP E1399A Int roduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Manual Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Specification Compliance/Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

HP E1399A Descrip tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

General Module Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Backplane Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

HP E1 399A Ha rdware Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2. Configuring the HP E1399A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Reducing Risk of Stat ic Discharge Damag e . . . . . . . . . . . . . . . . . . . . . 16

Hardware Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Backplane Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Module Dim en sions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Cooling Requiremen ts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Terminal Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Backplane Interface C ircui tr y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Address Lines and Regi ster Decoding . . . . . . . . . . . . . . . . . . . . . . . . 22

Data Bus Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Status Regist er . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Device Type Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

DTACK, Interrupt, and Control . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

User Access Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

3. Using the HP E1399A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Reading Data From Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Status Regist er Bit Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Reading the Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Writing Dat a to Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Control Regi ster Bit Definit i ons . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Writing to Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

Using Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Configuring for Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Generating Interrupt Requests . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

HP E1399A Breadboard Module User’s Manual Contents 1

Notes

Resetting the Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Hardware Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Detecting Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Using Other Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

A. HP E1399A Bre adboard Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

B. HP E1399A Parts List/Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Terminal Block Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Breadboard Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Backplane Interface Sch ematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

2 HP E1399A Breadboard Module User’s Manual Contents

Certification

Hewlett-Pac kard Compa ny certif ies that this product m et its published sp ecifi cation s at the time of shipment from the factory. H ewlett­Packard further certifies that its calibration measurements are traceable to the United Stat es Nation al Instit ute of Stand ard s and Tech­nology (for m erl y Nat ional Bur ea u of Standar ds ), to the ex tent allo wed by that orga ni zati on’ s cal ib rat ion f ac ili t y, and t o th e calibrat i o n
facilities of ot her International Standards Organizat i on members.

Warranty

This Hewlet t-Pa ck ar d product is warr ante d agai nst de fect s in mate rials and w orkmansh ip for a period of three years from date of ship­ment. Duration and conditi ons of warranty for this product may be superse ded when the pr oduct i s i nt egrated into (becomes a part of)
other HP product s. Du ring the warranty period, Hewlett-Pa ckard Company will, at its option, eith er rep ai r or re pl ace pr oducts which
prove to be defective.

For warranty se r vice or repair, this product mu st be r eturned to a service fa ci l ity designated by Hewl et t -Packard (HP). Buyer sha l l pr e­pay shipping cha rges to HP and HP shall pay shipping charges t o re tu rn the product to Buyer. However, Bu yer shall pay all shipping
charges, duties, and taxe s for products returned to HP from anot her count r y.

HP warrants that its softwar e and firmwar e designa ted b y HP for use with a product will execute its programmin g instru cti ons wh en
properly installe d on that product. HP does not warrant that the operat ion of the product, or software , or firmware will be uninterrupted
or er ro r f r ee.

Limitation Of Warrant y

The foreg oin g warra nt y sh al l not apply t o defects resulting from improper or inadequate maintenance by Buyer, Buyer-supplied prod­ucts or interfacing, unauthori ze d m odificati on or misus e, operation outside of the environmenta l specificat i ons for the product, or im­proper site prep arat i on or maint ena nce.

The design and imp le mentation of any circuit on this product is the s ole responsibility of the B uyer. HP does not warrant the Buyer’s
circuitr y or malfunctions of HP products that result from the Bu yer’s circuitry. In addition, HP does not warrant an y damage that oc­curs as a result of the B uyer’s circuit or an y defects that re sult from Buyer-supplied product s.

NO OTHER WARRANTY IS EXPRESSED OR IMPLIED. HP SPECIFICALLY DISCLAIMS THE IMPLIED W ARRANT IES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.

Exclusive Remedie s

THE REMED IES PROVIDED HEREIN ARE BUYER’S SOLE AND EXCLUSIVE REMEDIES. HP SHALL NOT BE LIABLE
FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, WHETHER BASED ON CON­TRACT, TORT, OR ANY OTHER LEGAL THEORY.

Notice

The information contained in this document is subject to change without notice. HEWLETT-PACKARD (HP) MAKES NO WAR­RANTY OF ANY KIND W ITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WAR­RANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. HP shall not be liable for errors contained
herein or for incidental or consequential damages in connection with the furnishing, performance or use of this material. This docu­ment c ontains proprietary informati on which is prote ct ed by copyright. A ll rights are reserved. No part of thi s document may be photo­copied, reproduced, or translate d to another lan guage wit h out the prior written consent of Hewlett -Packar d C ompany. HP assumes no
responsibility for the use or reliability of its software on equipment that is not furnished by HP.

Restricted Rights Legen d

Use, dupli ca tion or discl osu re by the U. S. Go vernme nt is subje ct to rest rict i ons as set fort h in subparagraph (c)(1) (ii ) of the Rights in
Technical Data and Comp uter Softwa re clause in D F ARS 252.227-701 3.

Hewlett-Packar d Company
3000 Hanover Street
Palo Alto, Cal if ornia 943 04 U.S. A.

Rights for non-DOD U.S. Government Departments and Agen ci es are as set f orth in F AR 52.227 -19 (c) (1,2).

HP E1399A Register Based Breadboard Module User’s Manual

Copyright © 1995 He wle tt-Pa cka rd Company. All Right s Reser ve d.

Edition 2

HP E1399A Register Based Breadboard Module User’s Manual 3

Documentatio n History

All Editions and Updates of this manual and their creation date are listed below. The first Edition of the manual is Edition 1. The Edi­tion number increment s by 1 whenever the manua l is revised . Updates , which are issued betw een Edi ti ons, c ontain repla ce ment pa ges
to correct or add additional information to the current Edition of the manual. Whenever a new Edition is created, it wil l contain all of
the Update inf ormat ion for the pre viou s Editi on. Each new Ed iti on or Update also incl ude s a revis ed c op y of this documentation his­tory page.

Edition 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Novemberr, 1989

Update 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . November, 1989

Edition 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . April, 1995

Safety Symbols

Instruction manual symbol affixed to prod­uct. Indicat es that the us er must refer t o t he
manual for specific WARNING or CAU­TION information to avoid personal injury
or damage to the product.

Indicates the field wiring terminal that must
be connected to earth ground before operat­ing the equipment—protects against electri­cal shock in case of fault.

Frame or chassis ground termi nal — t ypi-

or

cally connects to the equipment’s metal
frame.

WARNING

CAUTION

Alternating current (AC).

Direct curren t (DC).

Indicate s ha za rdous voltages.

Calls at te nt i on t o a pr ocedure, practi ce, or
condition that could cause bodily injury or
death.

Calls at te nt i on t o a pr ocedure, practi ce, or con­dition that could possibly cause damage to
equipme nt or perma nen t los s of data.

WARNINGS

The following ge ner al safet y prec aut ions mus t be observed du ring al l phas es of oper ation , ser vice , and repai r of this pr oduct.
Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design,
manufacture, and inten ded use of the product. Hewlett-Packar d Company assumes no liability for the cust o mer’s fai lure to
comply with these requirements.

Ground the equipment: For Safety Cl as s 1 equipmen t (equ ipment ha vin g a protective ea rth ter mi nal) , an unint erru ptib le sa fety earth

ground must be provide d from the ma in s power sour ce to the produ ct input wi rin g termi nals or suppli ed power cable .

DO NOT operate the produc t in an explosive at mospher e or in the presen ce of flammable gases or fume s.

For continued protect ion a gainst fire, repl ace the line fuse (s) only with fuse(s) of the same voltage and current rating and type .
DO NOT use repaired fuses or short-circui ted fuse holders.

Keep away from live circuits: Operatin g personnel must not remove equipment covers or shields. Procedures involving the removal
of covers or shields are for use by service-trained personnel onl y. Under certain conditions , danger ous v oltage s m ay exist even with the
equipment switched off. To avoid dangerous ele ctrical shock , DO NOT perf orm procedures involving cover or shield removal unless
you are qualified to do so.

DO NOT operate damaged equipment: Whene ver it i s p ossibl e tha t the sa fe ty protection features bui l t int o thi s pr oduct have been im­paired, eithe r t hr ough physical damage, excessive mois t ure , or any other reason, REMOVE POWER and do not use the product until
safe operation can be verified by service-trained personnel. If necessary, return the produ ct to a Hewlett-P ackar d Sale s and Ser vice Of­fice for service and repair to ensure that safety features are maintaine d.

DO NOT service or adjust alon e: Do not attempt internal service or adjustment unless another person, capable of rendering first aid
and resuscitation, is present.

DO NOT substitute parts or modify equipment: Becaus e of the danger of introducin g additional hazards , do not install substitute
parts or perform any unauthorized modifica tion to the product. Retur n the product to a Hewlet t-P ackar d Sales and Ser vice O ffice for
service and repair to ensure that safety features are maintained.

4 HP E1399A Register Based Breadboard Module User’s Manual

Declaration of Conformity

according to ISO/IEC Guide 22 and EN 45014

Manufacturer’s Name: Hewlett-Pa ckar d C ompany

Loveland Manufacturing Center

Manufact urer’s Addre s s: 815 14th Street S.W.

Loveland, Colorado 80537

declares, that the product:

Product Name: Register Bas ed Bread boa rd Module

Model Number : E1399A

Produc t Opt ion s: All

conforms to the following Pr od uct Spe cifi cati ons :

Safety: IEC 1010-1 (1990) Incl . Amend 1 (1992) /E N610 10-1 (1993)

CSA C22.2 #1010.1 (1 992)
UL 1244

EMC: CISPR 11:1990/EN55011 (1991): Group1 Class A

IEC 801-2:1991/ E N5008 2-1 (1 992) : 4kVCD, 8k VA D
IEC 801-3:1984/ E N5008 2-1 (1 992) : 3 V/m
IEC 801-4:1988/ E N5008 2-1 (1 992) : 1kV P ower Lin e
.5kV Signal Lines

Supplementary Information: The product her ewi th c ompl ies wit h th e requirements of the Low Voltage Dire ctive
73/23/EEC and the EMC Directive 89/336/ EEC and carri es the CE-mark ing acc ordingly.

Tested in a typical configurat ion in an HP B-Size VXI m ai nframe.

April, 1995 Jim White, QA Manager

European conta ct: Your loca l He wlett-Pa cka rd Sales a nd Servi ce O ffic e or Hewlett- Packa rd GmbH, Departm ent
HQ-TRE, Herr en ber ger Straße 130, D- 71034 Böblingen, Germ any (FAX [phone]).

HP E1399A Register Based Breadboard Module User’s Manual 5

Notes

6 HP E1399A Register Based Breadboard Module User’s Manual

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HP E1399A Register Based Breadboard Module U ser’s Manual

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8 HP E1399A Register Based Breadboard Module User’s Manual

Manual Contents

Chapter 1

HP E1399A Introduction

This manual has three chapters and two appendixes:

• Chapter 1 - Introduction summarizes manu a l c on tents, warran ty

status, and specificati on complia nce. It also includes an over al l
description of the module.

• Chapter 2 - Configuring the HP E1399A describes module

hardware and dimensio ns, an d discusses operation of the backplane
interface circuits on the module. It also provides a typical application
example showing user circuits connected to the backplane interface
circuits.

• Chapter 3 - Using the HP E1399A shows how to use the module in

a VXIbus system.

• Appendix A - HP E1399A Breadboard Specifications lists t he

hardware specifications for the HP E1399A module.

• Appendix B - HP E1399A Parts List/Schematic prov ides HP part

numbers and descriptions of all parts required by the HP E1399A. It
also includes a complete schematic of the E1399 A digital backplane
interface.

Specification Compliance/Warranty

The HP E1399A Breadboard Module is designed in full compliance with
the VMEbus Specificat io n (Revis ion C.1) and the VXIbus specificat ion
(Revision 1.3).

The HP E1399 A warran ty statement, loca ted at the front of th is manual, is
different from the standard Hewlett-Packard warranty for the HP
E1300A/E130 1A mainframe and ot her plug-in modules. Hewlett-Pac kard is
only responsible for defTects in materials and workmanship of the blank
circuit board and supplied hardware.

Warning Hewlett-Packard is not responsible for the performance of your

Chapter 1 HP E1399A Introduction 9

custom-designed circuitry. Hewlett-Packard is not responsible
for damage to or improper operation of your VXI mainframe or
other plug-in modules caused by the HP E1399A Breadboard
Module.

HP E1399A Description

The HP E1399A Breadboard Module is a B-size register-based device that
provides a convenient interface to a VXI mainframe backplane. It allows
you to construct your own custom hardware for use wit h the mainframe.

General Module

Features

Back plane Interf ac e

Feat u res

Note For hardware operation, a mnemonic suffixed with an asterisk (such as

The module is supplied with all interface components loaded and soldered.

Your VXI mainframe can communicate with this module configured as an
A16/D16 device. The breadboard module interface circuitry is implemented
and accessible according to the requirements outlined in the VXIbus
Specification.

Users can still provide cus t om ex tensions to expand module add ressing
capability to A24 or A32 by adding approp riate circuitry according to the
VMEbus and VXIbus specificatio ns.

An overview of the HP E1399 A interface features follows. Figure 1-1
shows a block diagram of this interface.

WRITE *) indicat es invers e lo gic (0 or low = true; 1 or high = false). A high
state (1) is defined as a positive voltage (usually +5 V) and a low state (0) is
defined as zero V (ground) at the specified signal point.

The HP E1399A interface features are:

• Address Lines and Register Decoding. The module implements 15

address lines (A1-A15) to all ow for: 1. decodi ng one of 255
switch-selectable logical device addresses in the upper fourth of the
A16 VME address space, and 2. selecting one of the breadboard
configuration registers for read/write operations. The module
decodes the Address M odif ier lines AM 0 - AM5 and acts on codes

and 2D16 only.

29

16

• Data Lines. Data lines D0-D15 are available for use on the

Breadboard module. These 16 lines are buffered by data bus drivers
and used for writing to, and reading from, the configuration registers
(Status, ID, Device Type, and Control) via a n internal data bus
(DB0-DB15).

10 HP E1399A Introduction Chapter 1

Figure 1-1. Digital Backp lane Interface Block Diag ra m

Chapter 1 HP E1399A Introduction 11

• Status Register. A read of this 8-bit register provides inform ation

about the status o f t he bre adboard module. Implemented signals are
"Extended*" and "Passed". There ar e also p r o visions for
implementing device-dependent sta tus bits.

• ID Register. A read of this 16-bit register identifies the

Manufacture r ID number, th e Devic e Class, and the addressing mode
of the Breadboard. This register is implemented as a
Hewlett-Packard A 16 r egister bassed device.

• Device Type Register. A read of this 8-bit register identifies the

unique ca r d mo del as defined by the de v i ce man u f acturer. T he car d
model nu mb er is switc h selecta b le.

• Control Register. A write to this 8-bit register causes specific

actions to be executed by the device. "Reset" and "System Fail
Inhibit" are implemented. Other device-depend ent control bits may
be impleme nted by the user.

• Read/Write Operations. Using the backplane interface circuitry

provided, it is possibl e to read the contents of t he Status, ID, or
Device Typ e Registers ont o the data bus (D0- D15), or to write
information in to the Control Register from the data bus.

• DTACK. The interface contains the circuitry required for generating

a delayed DTACK* (data transfer acknowledge) signal.

• Interrupt Interface. The breadboard module has D16 interrupter

capability. It do es not contain an int errupt handle r. Interrupt pri ority
is jumper-selectable for pulling the appropria t e int errupt r eq u est line
IRQ1* - IRQ7*. Interrupts are gen erat ed by t he IRQ state machine
on the Interface IC (U6). The daisy-chained IACKIN*/IACKOUT*
signal pair is implemented.

• Module Reset. Both hardware and software reset signals are

provided to initialize the backplane interface circuitry and your own
custom-designed circuitry to a known state.

• Backplane Buffering. Buffering is provided for all signals that

interface with the VXIbus backplane.

• Power Supply. The following power supply voltages (all unfiltered)

are available:

– +5 VDC, fused at 4 Amps
– + 12VAC, fus ed at 4 Amps
– -12VAC, unfused
– +5VDC standby, unfused

12 HP E1399A Introduction Chapter 1

HP E1 399A

Hardware Feat ure s

An overview of the HP E1399 A hardware features follows.

• Connectors. Two 96-pin DIN connectors are provided with the

module. P1 connects to the VXI backplane, while J1 allows
connectio n of devices from the front of the board, or co nnect ion of
an E1399A terminal card.

• Co mponent Area. An ar ea of ap pr ox ima tely 220 cm

available on the module to install your own custom circuitry. This
area does not include the portion of the circuit board r equired by the
backplane interface components.

2

(34 in2) is

• Component Heig ht/ L ead Le ngth. The maximum component height

allowed ab ove the circuit board is 12.7 mm (0.5 in). The maximum
component lea d length allowed below the circuit board is 1.3mm
(0.05 in).

Warning Since the inputs to the HP1399A Breadboard Module are

through a 96-pin connector and a terminal card assembly, limit
voltage to 250Vdc/250Vrms .

Chapter 1 HP E1399A Introduction 13

14 HP E1399A Introduction Chapter 1

This Chapter contains a detailed hardware description of the breadboard
module and discu sses the backplane interface circuitry. It also s hows a
sample application to control 16 relays on the module.

Handling Precautions

WARNINGS, CAUTIONS, and guidelines to reduce the risk of static
discharge damage to the HP E1399A follow.

Warning SHOCK HAZARD. Only qualified, service-trained personnel who

are aware of the hazards involved should install, remove, or
configure any module. Before removing any installed module,
turn off all power to the mainframe and to all external devices
connected to the mainframe or to any of the modules.

Chapter 2

Configuring the HP E1399A

For electrical shock protection, ensure that the module face
plate is securely tightened against the mainframe.

Warning Since the inputs to the HP 1399A Breadboard Module are

through a 96 pin connector and a terminal card assembly, limit
voltage to 250Vdc/250Vrms .

Caution STATIC SENSITIV ITY. The back p lane interfac e circu itr y

described in this Chapter uses static-sensitive CMOS
integrated circuit devices. If you implement the circuitry
described herein, you must use clean-handling and anti-static
techniques when handling the module to protect the sensitive
components from damage due to electro-static discharge (ESD).

Chapter 2 Configuring the HP E1399A 15

Redu cing Ri sk of

Static Dis charg e

Damage

The smallest static voltage most people can feel is about 3500 V. It takes
less than one-tenth of that (about 300 V) to destroy or severely damage
static-sensitive circuits. Often, static damage does not immediately cause a
malfunction, but significantly reduces the component’s life. Adhering to the
follo wing precautions will redu ce the risk of static disc harge da ma ge .

• Keep the module in its conductive plastic bag when not installed in a

VXIbus mainframe. Save the bag for future module storage.

• Before handling the module, select a work area where potential static

sources are minimized. Avoid working in carpeted areas and
non-conductive chairs. Keep body movement to a minimum. If
possible, use a static-controlled workstation.

• Avoid touching an y components or edge connectors. When you are

ready to configure the module, remove it from its protective bag and
lay it on top of the bag while keeping your free hand in contact with
the bag. This t ec hnique maintains you r b ody and the module at t he
same static potential.

• When you install the module, keep one hand in contact with the

protective bag as you pick up the mo dule with your other hand.
Then, b efor e insta lling the module, move your free hand to a me ta l
surface on th e mainframe, t hus bringing you, th e module, and the
mainframe to the same static potential.

Hardware Description

Figure 2-1 shows the module with interface circuit components installed. As
shown, the module consists of a circuit board with one backplane connector
(P1) and a front pan el connector (J1). Approximately one-third of the circuit
board contains traces for installing the backplane interface circuitry. See
"Backplane Interface Circuitry" for interface circuitry installation.

Backplan e

Connections

Module Dimensions Figure 2-2 shows the dimensi ons of the module and the compone nt heig ht

The breadboard module interfaces your custom circuits to a standard B-size
VXIbus backplane (connector P1). This enables you to access the backplane
control signals, data lin es, address lines, and power suppli es. Figure 2-1
shows backplane connect or (P1) which connects to the VXIbus backplane.

and lead length restrictions. The maximum component height allowed
above the circuit board is 12.7mm (0.5in). The maximum c ompon ent lead
length allowed below the circu it board is 1.3mm (0.05in). Do not mo unt
components closer than 4mm (0.16in) to the extreme upper or lower edges
of the circuit board. This space is used to guide the module into the
mai nframe m odu le slo t . An area o f 2 2 0 c m
module to install your own circuitry.

2

(34 in2) is availab l e on the

16 Configuring the HP E1399A Chapter 2

Figure 2-1. HP E1399A Breadboard Module & Connecto r Pinou t

Chapter 2 Configuring the HP E1399A 17

18 Configuring the HP E1399A Chapter 2

Figure 2-2. HP E1399A Dimen sions