In today’s business environment, customers require powerful servers with fault-tolerant features
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to keep their businesses running 24 h ours a da y, 7 days a week. The Compaq ProLiant 7000
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Server provides breakthrough high-performance and high-availability technologies that keep the
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server up and running in t he most demanding 7x24 environmen ts. This technology brief explains
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the features of the new ProLiant 7000 Servers that support Penti um II Xeon processors, and how
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previously purchased ProLiant 7000 Servers can be upgraded to support up to four Pentium II
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Xeon processors. This upgra de path provides investment protection and gives customers
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confidence of a long life for the ProLiant 7000.
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This technology brief also describes the management technologies of the ProLiant 7000 Server.
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Many of these technologies are covered in more detail in separate technology briefs, which are
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referenced in this document.
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IGH-PERFORMANCE TECHNOLOGIES
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Pentium II X eo n Processor Techn o logy
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The P enti u m II Xeon processor uses t he same core architectu re as p revious Penti um II p rocessors ,
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and it continues the same 32-bit technology line, which makes it fully software compatible with
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all current Pentium Pro and Pentium II processors. Like the Pentium Pro and Pentium II
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processors, the Pentium II Xeon uses dynamic execution techniques and a dual independent bus
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structure. Th e dual independent bus structure provides a separate bus between the processor and
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the s econdary level 2 (L2 ) cache. S ee the t echnol og y brief
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Technology
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Pentium II Xeon processor.
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The Pentium II Xeon processor provides higher levels of performance through architectural
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enhan cem ents incl u din g :
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100-MHz AGTL+ System Bus
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An important enhancement is the move from the 66-MHz GTL+ bus used by the Pentium Pro and
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Pentium II processors to the higher frequency 100-MHz AGTL+ bus. This provides faster data
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pathways between t he processor and ran d om access memory (RAM), an d bet ween th e p rocessor
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and system peripherals.
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400- and 450-MHz Core Processor Frequencies
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One of the most significant differences between the Pentium II Xeon processor and current
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Pentium Pro processors is the much higher processor frequency. Pentium II Xeon processors,
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currently at 400 MHz, are expected to reach 450 MHz by the end of 1998, and to incr ease beyond
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450 MHz in later versions.
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, document number ECG050/0698 for more details on the IA32 architecture and the
100-MHz AGTL+ system bus
Processor frequencies starting at 400 MHz and i ncreasing to 450 MHz and beyond
Full - s p eed L2 cach e bus
L2 cache configurations starting at 512 KB an d 1MB and increasing to 2 MB
Slot 2 cartridge
Support for up to 64 GB of cacheable system memory
MMX technology
(cont.)
Deschutes Family Processor
Pentium II Xeon (Slot 2
cartridge)
Pentium II (Slot 1 cartridge.
ECG078/0698
ECHNOLOGY BRIEF
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Larger Cache Sizes
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The Pentium II Xeon processor supports larger L2 caches than previous Intel processors.
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Pentium II Xeon processors are initially available in 512-KB and 1-MB configurations with future
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plans for a 2-MB cache. I n cont rast, the Pen tium P ro pr ocess or ha s a max imum 1 - M B ca che.
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The la rge r data c ach e provides a si gnificant performance boost, es pecially in s ym metric
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multiprocessing (SMP) configurations and systems used in memory-intensive applications, such
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as on-line transaction processing.
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Full-Speed L2 Cache Bus
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Previou s P enti u m II processors have a hal f-s p eed L2 cache bus that connect s the ca che mem ory
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and the centr a l processing unit (CPU) core. Thi s mean s a 266-MHz Pentium II actual ly transfers
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data between the L2 cache and CPU core at 133 MHz. In contrast, the Pentium II Xeon processor
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has a full-speed cache bus, which means that a 400-MHz Pentium II Xeon processor transfers
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data between the L2 cache and pr ocessor core at a full 400 MHz. The combination of the full-
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speed cache bus and t he la rger cache size greatly enha nces the performa nce of th e P enti u m II
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Xeon processor relative to the Pentium Pro and previous Pentium II processors, especially in
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larger SMP configurations and memory-intensive applications.
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Slot 2 Cartridge
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Pent ium II processors ar e packa g ed in a s ingle edge con tact ( S EC) cartridge. The SEC ca rtridg e
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for a Pentium II processor inserts into the Slot 1 connector on the motherboard, while the Pentium
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II Xeon ’ s SEC cartridge inserts i nto the Slot 2 connector. The for m factor of the Slot 2 cartridg e
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is larger than that of the Slot 1. Compared with the Slot 1 cartridge, the Slot 2 cartridge has
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The lar g er cartridge and corres p onding mot herboa rd con nector for th e P enti u m II Xeon process or
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require more pins. The additional pins on the Slot 2 cartridge provide support for a four-
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processor (4P) multiprocessing system bus. Load and signal integrity modifications in the new
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design allow a Pentium II Xeon processor to drive up to four main loads on the AGTL+ bus—
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three other processors and a memory and I/O controller. This allows the Pentium II Xeon to scale
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to 4P configurations. The extra pins also provide the additional power and ground connections
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needed to support th e larger, full-speed L2 cache.
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64-GB Cacheable Address Space
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The Pentium II Xeon processor is able to access up to 64 GB of RAM; however, the memory
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controller chipset determines the actual size of supported memory. Initial Pentium II Xeon
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chipsets support memory configurations up to 8 GB.
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MMX Technol ogy
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The Pentium II Xeon processor supports MMX instructions, which allow certain applications to
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operate on multiple data locations with a single instruction call to the processor. The MMX
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functions are primarily used in multimedia applications such as audio and video manipulation;
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however, increasing numbers of specialized business applications are being written to take
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advantage of MMX capabilities.
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More pins (330 pins versus 242 pins for the Slot 1).
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Support for a four-processor multiprocessing bus.
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Load and signal integrity modifications.
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The ability to deliver more power to support the larger, full-speed L2 cache.
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ECG078/0698
ECHNOLOGY BRIEF
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Pentium II Xeon Performance
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Compaq tested performan ce of Pentium II Xeon processors in the ProLiant 7000 server usin g two
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industry-standar d benchma rks: the TPC-C benchmark test and the TPC-D version 1.3.1
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benchmark test. The TPC-C benchmark measures performance in an on-line transaction
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processing environment, while the T P C - D benchm ark repr es ents a broad range of decisi on
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support (DS) applications that r equire complex, long-runnin g quer i es against large complex data
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structures. Real-world business questions were written against this model, resulting in 17
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complex queries.
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Tables 1 and 2 show the configurations used for these benchmark tests and t he performance
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results, which set new industry-wide performance levels for a single-node Intel-based system. For
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a full discussion of these benchmark results in comparison to published benchmark results for
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other 4-way and 8-way systems, read the Compaq Benchmark Summaries available at
Speed/L2 Cache
TPC-C Throughput
Price:Performance
OS
Database
Compaq ProLiant 7000 Server
4
Pentium II Xeon
400 MHz/1 MB
18,127 tpmC
$27 per tpmC
Windows NT Server 4.0 Enterprise Edit i on
Microsoft SQL Server 7.0 Enterprise Edit i on
Table 2: Results of TPC-D Benchmark Test
System
No. of Processors
Processor Type
Speed/L2 Cache
TPC-D Power
TPC-D Throughput
Price:Performance
OS
Database
Compaq ProLiant 7000 Server
4
Pentium II Xeon
400 MHz/1 MB
1694.6 QPPD @100 GB
553.1 QthD @100 GB
$390.65 per QphD @ 100 GB
Windows NT 4.0
Oracle 8.0.4
ECG078/0698
ECHNOLOGY BRIEF
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Thermal Design
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Compaq has designed an innovative thermal cooling solution for the Pentium II Xeon processor
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that contributes to increased system reliability and future performance scalability to 8-way
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archit ectures . Heat pipes transfer heat away from the Slot 2 cart rid g e thermal pla te to cooling
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fins mounted atop the cartridge (Figur e 1).
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This top-mounted position and the direction of the cooling fins are advantageous in two important
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ways. First, this design cools efficiently regardless of the direction of air flow (vertical or
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horizontal). Therefore, the same Slot 2 cartridge and heat sink combination used in the ProLiant
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7000 4-way configuration can also be used in future 8-way configurations by simply reorienting
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the p rocessor s. Second , because t he heat fins are top mou nted, th e redundant p rocessor p ower
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module can be placed in its optimal position, next to the processor, to maintain short signal trace
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lengths across the 100-MHz system bus (Figure 2). The resulting improvements to power supply
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regulation and system bus signal quality increase system reliability. Moreover, the smaller
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spacing between processor sockets makes possible future upgrades to 8-way Pentium II Xeon
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archit ectures u s ing the same ch assis d esign.
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Figure 1: Heat pipes and fins for the Pentium II Xeon processor cartridge.
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Pentium II Xeon
Processor Cartridge
Heat
Fins
Heat Pipes
ECG078/0698
ECHNOLOGY BRIEF
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7
Memory Expansion
Board Slots
Processor
Sockets
ProLiant 7000 Architecture
The ProLiant 7000 ar ch it ecture all ows customers to scale the processor and memory subsystems
to run their mission-critical applications. The following sections describe the ProLiant 7000
architecture—the processor board, memory expansion boards, input/output (I/O) board, and
standard per i pheral board.
Processor Board
The p rocessor board (F i gure 2 ) ha s four sockets for Pentium II Xeon p rocessor s, four sock ets for
redundant processor power modules, and two slots for memory expansion boards. The redundan t
processor power modules maintain the precise voltage requirements of the processors. The
memory expansion boards allow customers to scale system memory up to 8 GB. The ProLiant
7000 ships with one Pentium II Xeon processor, one redundant processor power module, and two
memory expansion boards. Processor terminator cards are also provided with the server. A
processor terminator card mus t rem ain in ea ch pr ocess or socket not occupi ed by a processor.
Memory Expansion Boards
The ProLiant 7000 ships with t wo memory expansion boards instal l ed on th e pr ocessor board. As
shown in Figur e 3, each memory expansion board has si x teen m emory sockets ( four ban ks of four
sockets) for Dual In-Line Memory Modules, or DIMMs. The DIMMs must be installed in sets of
(cont.)
1
Redundant
Processor Power
Module Sockets
Figure 2: Processor Board.
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