HP c3700 User Manual

design power

Pure pr oce ssing power. The HP W or kst ati ons c37 00 and c3750 are ultimate uni-pr oce ss or RI SC-based UNIX workstation with a single PA-87 00 750-MHz or PA-8 700+ 875-MHz processor deliver ing leader ship 3D graphics performance, expandability and value. Engineers and sc ientis ts working in the automotive , aerospace, and EDA mar kets will particularl y appreciate the compute pow er to help slash product cycle times and shorten time to market. Team the power o f the PA-RISC processor w ith the capacity to support up to 8-GB RAM, 146-GB internal disk, and six PCI cards, and you hav e a workstation that breaks through traditional bottle-necks of computation and desktop 3D desi gn .

hp wor kstations

c3700 and c3750

data sheet

3D graphics performance , expandability and value

features

750-MHz PA-8 700 or 875-MHz PA-8700+ processor

2.25-MB on-chip cache

four-wa y s et as sociative cache

8-GB SDRAM capacity

hp fxe graphics card

hp fx

pro graphics card

hp fx

pro graphics card

hp Fire GL-UX graphics card

rack mountable

expansive tower with 6 industrystandard PCI slots

binary compatibility with future PA-RISC and Intel

Itanium

processors

benefits

delivers applicati on perf or mance to complete your designs faster

minimize s s ystem latency with large on-chip cac he, enhances system perfor mance with greater application speed and throughput

decreases the miss r ate o f direct mapped cache – requiring less disk-to-cache access for instructions and data, providing higher performance

delivers the lar ge st RAM capac ity a v ailable on any uniprocessor wo rks tati on f or hi gher appli cati on perf or mance with less disk access, supports inter ac tive work with complex 3D designs and digital pr ototype s

prov ide s f ull-f eatur ed, 3D capability for univer sal acce ss to all types of data acro ss diverse, c ross-functional teams

delivers mid-range 3D graphics performance f or mechanical design wor k with faster visuali zation of midsize as semble s

delivers high-end 3D graphics performance for mechani cal design and analysis fo r gr eater u ser productivity and performance

delivers fas te st 3D UNI X graphics performance f or mechanical design and analy sis with greatest user productiv ity and perfor mance

supports on-side configuration as well as u pr i ght, desktop placement for space optimization when deployed in your computer rooms

prov ide s more capacity for PCI I/O car ds f or f le xibility to expand your s y s tem

ensures smooth transition to hp’s next-generation highperformance sys tems , protects your inves tment in applications, data and systems

hp workstation c3700 and c3750 technical specifications

processor hp c3700 hp c3750

type PA-8700 PA-8700+ clock frequency 750-MHz 875-MHz number of processors 1 1

cache (on-chip)

total cache 2.25-MB

instruction 0.75-MB data 1.50-MB

main memory

bus bandwidth 1.9-GB/s RAM type 120-MHz SDRAM capacity 512-MB to 8-GB memory slots 8 DIMMs

storage bays 1 floppy, 1 optical, 2 Ultra 2 SCSI LVD internal storage (2 bays) up to 2 devices, 146-GB maximum

Ultra 2 SCSI LVD, 80 pin SCA connector 18-GB (10K RPM) 36-GB (10K RPM) 73-GB (10K RPM) 36-GB (15K RPM)

external storage

NSE SCSI (HD50) 1 port - up to 7 devices Ultra2 SCSI LVD 1 port - up to 13 devices

removable media

floppy drive 1 floppy drive (3.5 inch/1.44-MB) optical drive 1 DVD or CD-RW

expansion slots (6 total)

PCI 1X (half card) 2 slots PCI 2X (full size) 3 slots PCI 4X (full size) 1 slot

integrated networking

LAN data rate 10/100-Mb/s

built-in I/O

serial interface 9-pin DIN 2 ports parallel interface 25-pin DIN 1 port USB (Universal Serial Bus) Series A 2 ports (keyboard and mouse only)

audio

type integrated, CD-quality stereo inputs stereo line-in, MIC-in outputs stereo line-out, internal speaker,

headphones

environmental specifications

altitude

– operating 0-3000 m (0-10,000 ft) – non-operating 0-4500 m (0-15,000 ft)

temperature

– operating 5 to +40 degrees C – non-operating -40 to +70 degrees C

humidity

– operating 15 to 80% (non condensing)

vibration

– operating random 0.21 G rms, 5-500-Hz – swept sine survival 0.5 G peak, 5-500-Hz – random survival 2.09 G rms, 5-500-Hz

safety UL1950, CUL to CSA C22.2#950,

and TUV GS, Mark to EN60950/IEC950

emissions FCC and CISPR Class A

and VCCI Class A

physical dimensions deskside configuration

height 44.5 cm (17.5 inches) width 22.9 cm (9.0 inches) depth 49.5 cm (19.5 inches)

racked configuration

height 6 EIA units width 48.3 cm (19 inches) depth 66.5 cm (25.8 inches) rack orientation system racks on its side

net weight

minimum configuration 20.9 kg (45.9 lbs.) fully loaded 25.4 kg (55.8 lbs.)

power requirements

input current 7.4 amps RMS max @ 100-120 V

3.8 amps RMS max @ 220-240 V line frequency 50-60-Hz maximum power input 805 watts @120 VAC, 60-Hz

supported operating systems

hp-ux 11i TCOE (Technical Computing Operating Environment) hp-ux 11i MTOE (Minimal Technical Operating Environment) hp-ux 11.0

monitors

hp L2025 20 inch LCD, flat-panel hp L1825 18 inch LCD, flat-panel hp wide-aspect 24 inch CRT, flat-screen, wide aspect hp p1130 21 inch CRT, flat-screen hp p920 19 inch CRT, flat-screen

leadership graphics—entry 3D

hp fxe 4 maximum, 24-MB FB memory,

9.5-MB maximum texture memory at

1280 x 1024 resolution

leadership graphics—mid-range 3D

hp fx

pro 1 maximum, 64-MB FB memory,

48-MB maximum texture memory at 1280 x 1024 resolution

leadership graphics—high-end 3D

hp fx

pro 1 maximum, 128-MB FB memory,

110-MB maximum texture memory at 1280 x 1024 resolution

leadership graphics—extreme 3D

hp Fire GL-UX 1 maximum, 128-MB FB memory,

110-MB maximum texture memory at 1280 x 1024 resolution

For more information about the HP leadership graphics program:

www.hp.com/go/leadershipgraphics

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be trademarks of their respective companies. Information in the document is subject to change without notice.