HP AT-32011, AT-32033 User Manual

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Low Current, High Performance
NPN Silicon Bipolar Transistor

Technical Data

AT-32011
AT-32033

Features

• High Performance Bipolar
Transistor Optimized for
Low Current, Low Voltage
Operation

• 900 MHz Performance:

AT-32011: 1 dB NF, 14 dB G
AT-32033: 1 dB NF, 12.5 dB G

• Characterized for End-Of­Life Battery Use (2.7 V)

• SOT-23 and SOT-143 SMT
Plastic Packages

• Tape-And-Reel Packaging
Option Available

[1]

Outline Drawing

EMITTER COLLECTOR

320

BASE EMITTER

SOT-143 (AT-32011)

COLLECTOR

320

Description

Hewlett Packard’s AT-32011 and
AT-32033 are high performance
NPN bipolar transistors that have
been optimized for maximum ft at
low voltage operation, making

A

them ideal for use in battery
powered applications in wireless

A

markets. The AT-32033 uses the
3␣ lead SOT-23, while the AT-320 11
places the same die in the higher
performance 4 lead SOT-143. Both
packages are industry standard,
and compatible with high volume
surface mount assembly
techniques.

The 3.2 micron emitter-to-emitter
pitch and reduced parasitic design
of these transistors yields
extremely high performance
products that can perform a
multiplicity of tasks. The
20␣ emitter finger interdigitated
geometry yields an easy to match
to and extremely fast transistor
with moderate power, low noise
resistance, and low operating
currents.

Optimized performance at 2.7 V
makes these devices ideal for use
in 900 MHz, 1.8 GHz, and 2.4 GHz
battery operated systems as an
LNA, gain stage, buffer, oscillator,
or active mixer. Typical amplifier
designs at 900 MHz yield 1.2 dB
noise figures with 12 dB or more
associated gain at a 2.7 V, 2 mA
bias, with noise performance
being relatively insensitive to
input match. High gain capability
at 1 V, 1 mA makes these devices a
good fit for 900 MHz pager
applications. Voltage breakdowns
are high enough for use at 5 volts.

The AT-3 series bipolar transistors
are fabricated using an optimized
version of Hewlett Packard’s
10␣ GHz ft, 30 GHz f
Aligned-Transistor (SAT) process.
The die are nitride passivated for
surface protection. Excellent
device uniformity, performance
and reliability are produced by the
use of ion-implantation, self­alignment techniques, and gold
metalization in the fabrication of
these devices.

MAX

Self-

BASE EMITTER

SOT-23 (AT-32033)

Note:

1. Refer to “Tape-and-Reel Packaging for Semiconductor Devices.”

4-53

5965-8920E

AT-32011, AT-32033 Absolute Maximum Ratings

Absolute

Symbol Parameter Units Maximum

V
V
V

T

EBO

CBO

CEO

I

C

P

T

STG

T

j

Emitter-Base Voltage V 1.5
Collector-Base Voltage V 11
Collector-Emitter Voltage V 5.5
Collector Current mA 32
Power Dissipation

[2, 3]

mW 200

Junction Temperature °C 150
Storage Temperature °C -65 to 150

[1]

Thermal Resistance

[2]

:

θjc = 550 °C/W

Notes:

1. Operation of this device above any one
of these parameters may cause permanent
damage.

2. T

Mounting Surface

3. Derate at 1.82 mW/°C for TC > 40°C.

= 25°C.

Electrical Specifications, T

= 25°C

A

AT-32011 AT-32033

Symbol Parameters and Test Conditions Units Min. Typ. Max. Min. Typ. Max.

NF Noise Figure

14

[1]

[1]

VCE = 2.7 V, IC = 2 mA f = 0.9 GHz dB 1.0

G

h

FE

Associated Gain

A

VCE = 2.7 V, IC = 2 mA f = 0.9 GHz dB 12.5

Forward Current Transfer Ratio

[1]

1.3

[1]

11

[2]

1.0

12.5

[2]

1.3

[2]

VCE = 2.7 V, IC = 2 mA – 70 300 70 300

I

CBO

Collector Cutoff Current

VCB = 3 V µA 0.2 0.2

I

EBO

Emitter Cutoff Current

VEB = 1 V µA 1.5 1.5

Notes:

1. Test circuit A, Figure 1. Numbers reflect device performance de-embedded from circuit losses. Input loss = 0.3 dB;
output loss = 0.3 dB.

2. Test circuit B, Figure 1. Numbers reflect device performance de-embedded from circuit losses. Input loss = 0.3 dB;
output loss = 0.3 dB.

1000 pF

RF IN

TEST CIRCUIT
BOARD MATL = 0.062" FR-4 (ε = 4.8)

V

BB

W = 10 L = 1870

W = 10
CKT A: L = 380
CKT B: L = 380

W = 30
L = 60

W = 30

L = 60

CKT A: W = 30 L = 50 x 2
CKT B: W = 30 L = 60

W = 10 L = 1870

NOT TO SCALE

V

CC

CKT A: 25 Ω
CKT B: 5 Ω

W = 10
CKT A: L = 105
CKT B: L = 850

1000 pF

RF OUT

[2]

DIMENSIONS IN MILS

Figure 1. Test Circuit for Noise Figure and Associated Gain.
This circuit is a compromise match between best noise figure, best gain, stability, and a practical

synthesizable match.

4-54

Characterization Information, T

= 25°C

A

AT-32011 AT-32033

Symbol Parameters and Test Conditions Units Typ. Typ.

P

1dB

Power at 1 dB Gain Compression (opt tuning)

VCE = 2.7 V, IC = 20 mA f = 0.9 GHz dBm 13 13

G

1dB

Gain at 1 dB Gain Compression (opt tuning)

VCE = 2.7 V, IC = 20 mA f = 0.9 GHz dB 16.5 15

IP

3

Output Third Order Intercept Point (opt tuning)

VCE = 2.7 V, IC = 20 mA f = 0.9 GHz dBm 24 24

2

|S21|

Gain in 50 Ω System

E

VCE = 2.7 V, IC = 2 mA f = 0.9 GHz dB 13 11.5

2

1.5

1

0.5

NOISE FIGURE (dB)

0

0

0.5 2.5
FREQUENCY (GHz)

1 1.5

1 mA
2 mA
5 mA
10 mA
20 mA

2

Figure 2. AT-32011 and AT-32033
Minimum Noise Figure vs. Frequency
and Current at VCE␣ = 2.7 V.

20

15

10

5

P 1dB (dBm)

2 mA

0

5 mA
10 mA
20 mA

-5

0.5 2.5

0

1.0 1.5

FREQUENCY (GHz)

2.0

25

20

15

Ga (dB)

10

1 mA
2 mA
5 mA

5

10 mA
20 mA

0

0.5 2.5

0

1.0 1.5

FREQUENCY (GHz)

2.0

Figure 3. AT-32011 Associated Gain at
Optimum Noise Match vs. Frequency
and Current at VCE␣ = 2.7 V.

20

15

10

G 1dB (dB)

2 mA

5

5 mA
10 mA
20 mA

0

0

1.0 1.5

0.5 2.5
FREQUENCY (GHz)

2.0

20

15

10

Ga (dB)

1 mA
2 mA

5

5 mA
10 mA
20 mA

0

0

1.0 1.5

0.5 2.5
FREQUENCY (GHz)

2.0

Figure 4. AT-32033 Associated Gain at
Optimum Noise Match vs. Frequency
and Current at VCE␣ = 2.7 V.

20

15

10

G 1dB (dB)

2 mA

5

5 mA
10 mA
20 mA

0

0

1.0 1.5

0.5 2.5
FREQUENCY (GHz)

2.0

Figure 5. AT-32011 and AT-32033
Power at 1 dB Gain Compression vs.
Frequency and Current at VCE␣ = 2.7 V.

Figure 6. AT-32011 1 dB Compressed
Gain vs. Frequency and Current at
VCE␣ = 2.7 V.

4-55

Figure 7. AT-32033 1 dB Compressed
Gain vs. Frequency and Current at
VCE␣ = 2.7 V.