Confidential computer software. Valid license from Hewlett Packard Enterprise required for possession, use, or copying. Consistent with FAR
12.211 and 12.212, Commercial Computer Software, Computer Software Documentation, and Technical Data for Commercial Items are licensed
to the U.S. Government under vendor's standard commercial license.
Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard Enterprise has no control over and is not
responsible for information outside the Hewlett Packard Enterprise website.
Acknowledgments
Intel®, Itanium®, Pentium®, Intel Inside®, and the Intel Inside logo are trademarks of Intel Corporation in the United States and other countries.
Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
UNIX® is a registered trademark of The Open Group.
Page 3
Contents
About This Document...........................................................................................14
Parts List...........................................................................................................................................258
B Upgrades.........................................................................................................262
This document describes how to troubleshoot and diagnose server problems, and remove and
replace servercomponents for the HPE Integrity rx6600, Regulatory Model Number: RSVLA-0405.
The document publication date and part number indicate the document’s current edition. The
publication date changes when an updated edition is issued. Minor changes may be made without
changing the publication date. The document part number changes when extensive changes
are made.
Document updates may be issued between editions to correct errors or document product
changes. To ensure that you receive the updated or new editions, you should subscribe to the
appropriate product support service. See your Hewlett Packard Enterprise sales representative
for details.
The latest version of this document can be found online at http://www.hpe.com/info/Integrity_Servers-docs.
Intended Audience
This document is intended to provide technical product and support information for authorized
service providers, customer system administrators, and Hewlett Packard Enterprise support
personnel.
New and Changed Information in This Edition
•Updated behaviour of Hot-Pluggable disk drive LEDs in RAID and Standalone HBA mode.
Publishing History
Table 1 lists the publishing history for this document.
Table 1 Publishing History Details
Publication DateDocument Manufacturing Part Number
September 2006AB464-9002A
February 2007AB464-9002B
November 2007AB464-9002C
August 2008AB464-9002C_ed4
December 2008AB464-9002C_ed5
January 2009AB464-9002C_ed6
April 2009AB464-9002C_ed7
January 2010AB464-9002C_ed8
July 2010AB464-9002C_ed9
November 2011AB464-9002D
Document Organization
This guide is divided into several chapters; each chapter contains information about servicing
the Integrity rx6600 server. The appendixes contain supplemental information.
14
November 2012AB464-9003E
February 2016AB464-9003F
Page 15
“Overview” (page 16)Use this chapter to develop a high-level understanding of
the major server subsystems.
“System Specifications” (page 38)This chapter contains server specifications, including
features and weights.
“Installing the System” (page 43)Use this chapter to learn how to install the system.
“Booting and Shutting Down the
Operating System” (page 117)
This chapter provides information on how to boot and shut
down the operating systems supported on the server.
“Troubleshooting” (page 134)Use this chapter to help troubleshoot and diagnose server
problems.
“Removing and Replacing Server
Components” (page 174)
“Customer Replaceable Units
Use this chapter to learn how to remove and replace server
components.
This appendix lists the field replaceable units (FRU).
Information” (page 257)
“Upgrades” (page 262)Use this appendix to learn upgrade procedures.
“Core I/O Card Utilities” (page 282)Use this appendix for information on core I/O cards that
need additional configuration.
“Utilities” (page 315)This appendixprovides information on Extensible Firmware
Interface (EFI) Boot Manager.
Document Organization15
Page 16
1 Overview
The Integrity rx6600 server is a high performance, high availability server that provides the
following features:
•Form factor — 7U rack- or pedestal-installed
•Internal peripherals — serial-attached SCSI (SAS) hard drives and a DVD orDVD+RW drive
power supplies, and hot-pluggable PCI-X or PCIe cards and SAS drives
•Processors — up to four dual-core Intel® Itanium® processors
•Memory — up to 384 GB of memory
Server Subsystems
I/O
The server may contain either a 10-slot PCI/PCI-X IOBP or a 10-slot PCI/PCI-X/PCIe IOBP. The
PCI/PCI-X/PCIe interfaces are classified under two major categories: public and private.
Public interfaces
Public interfaces are PCI slot connectors that are left available to the customer for the I/O-card
adapters which they wish to install, based on their application needs, provided the adapter is
supported in the slot. All public slots support Hewlett Packard Enterprise server traditional OL*
hot-plug operations.
Private interfaces
Private interfaces are interfaces dedicated to meeting the core I/O system requirements. There
are two types of core-I/O: fast-core and slow-core, also known as the UCIO (Unified Core-I/O).
The Private slots and UCIO are not hot-pluggable.
Hot-plug
PCI/PCI-X/PCIe hot-pluggable operations enable you to add or remove a PCI/PCI-X/PCIe card
while the server is powered on. Each slot is physically separated with a divider that contains a
card extraction mechanism and a mechanical retention latch (MRL). Slots 3 - 10 on the 10 slot
PCI/PCI-X IOBP and slots 5 - 10 on the 10 slot PCI/PCI-X/PCIe IOBP support Hewlett Packard
Enterprise-server traditional OL* "hot-plug" operations. PDHP slots rely on the facilities of DHPC
(Dual Hot-plug Controller) FPGAs to enable OL* hot-plug functionality. See Table 2 (page 18)
and Table 3 (page 18) .
LEDs
Attention LEDs, doorbell buttons, and power LEDs for each hot-pluggable PCI/PCI-X/PCIe slot
are located on the PCI bulkhead at the rear of the server chassis.
Wake on LAN
Wake on LAN, a hardware feature that enables the remote power on of computers through special
network packets, is enabled in core PCI/PCI-X slots one and two.
Ropes
Ropes is a Hewlett Packard Enterprise-proprietary, custom bus interface. It clocks data packets
across long-length nets using source synchronous clocking schemes. There are eighteen signals
bundled per Ropes group, of which there are a total of 16 in the server. Each group is capable
of 0.5GB/s peak bandwidth. Table 2 (page 18) and Table 3 (page 18) display the association of
the Ropes group(s) to the PCI slot / HBA to which they connect.
Figure 1 (page 17) is a block diagram of the I/O subsystem.
16Overview
Page 17
Figure 1 I/O Subsystem Block Diagram
Figure 2 (page 17) is a block diagram of the PCI/PCI-X/PCIe I/O subsystem.
On the 10 slot PCI/PCI-X IOBP there are a total 8 Public slots (PCI-X mode1/2), 2 Private Fast-core
slots (PCI-X mode1), and 1 Private Slow-core UCIO slot (PCI 32-bit/33-MHz). The eight Public
slots are further subdivided into three speed/bandwidth configurations:
•Four PDHP (Public Dual Hot-plug), which operate at 64-bit/66-MHz PCI-X
•Two PSHP-SDR (Public Single Hot-plug - Single Data Rate), operating at 64-bit/133-MHz
PCI-X
•Two PSHP-DDR (Public Single Hot-plug - Double Data Rate), at 64-bit/266-MHz (133-MHz
double clocked) PCI-X mode2
Server Subsystems17
Page 18
Four 66-MHz PCI/PCI-X slots are shared in groups of two. Shared slots have many speed and
mode change restrictions during hot-plug add or remove operations. For more information on
PCI/PCI-X card configuration and restrictions, see “PCI/PCI-X/PCIe Configurations” (page 194).
Four of the server PCI/PCI-X slots are not shared. Two of the nonshared slots are 133 MHz
PCI/PCI-X, and two of the slots are 266-MHz PCI/PCI-X. Shared slots have many speed and
mode change restrictions during hot-plug add or remove operations.
Table 2 PCI/PCI-X I/O Rope Groups
Slot #
3
4
5
6
Physical
Rope
Numbers
(Quad
Bandwidth)
(Quad
Bandwidth)
Bandwidth)
Bandwidth)
PCI/PCI-X/PCIe IOBP
Rope
Numbers
FunctionSpeedBitsPCI BusLogical
266 MHz642712, 13, 14, 15
(Public)
266 MHz64334, 5, 6, 7
(Public)
133 MHz644610, 11 (Dual
(Public)
133 MHz64522, 3 (Dual
(Public)
66 MHz646597, 8
(Public)
66 MHz647119, 10
(Public)
Hot Swap
/ OL*
NCore I/O (Private)66 MHz641481, 2
YPCI-X 2.0, DDR
YPCI-X 2.0, DDR
YHigh-Speed PCI-X
YHigh-Speed PCI-X
YGeneral PCI-X
YGeneral PCI-X
NUCIO (Private)33 MHz32000-
On the 10 slot PCI/PCI-X/PCIe IOBP there are a total of eight Public slots (four PCI-X mode 1
and four PCIe), two Private Fast-core slots (PCI/PCI-X mode 1 64-bit/66-MHz), and one Private
Slow-core UCIO slot (PCI 32-bit/33-MHz). The eight Public slots are further divided into three
speed/bandwidth configurations:
•Two PDHP, which operate at 64-bit/66-MHz PCI-X
•Two PSHP, operating at 64-bit/133-MHz PCI-X
•Four PCIe 8-lane (x8) 2.5 Gbps, two of which are switched
The two 66 MHz PCI/PCI-X slots are shared. Shared slots have many speed and mode change
restrictions during hot-plug add or remove operations.
Table 3 PCI/PCI-X/PCIe I/O Rope Groups
Physical
Rope
NumbersSlot #
5
15
Logical Rope
Numbers
2.5 Gbpsx8610, 113, 4
Private depending upon
Core I/O)
Hot
Swap/OLRFunctionSpeedBits
NCore I/O (Private)66 MHz64481, 2
NPCIe x8 (Public or
YPCIe x8 (Public)2.5 Gbpsx8712, 13, 14,
18Overview
Page 19
Table 3 PCI/PCI-X/PCIe I/O Rope Groups (continued)
Physical
Rope
NumbersSlot #
Logical Rope
Numbers
Hot
Swap/OLRFunctionSpeedBits
YPCIe x8 (Public)2.5 Gbpsx834, 5, 6, 76
133 MHz6422, 37
(Public)
133 MHz64598
(Public)
YHigh-Speed PCI-X
YHigh-Speed PCI-X
YGeneral PCI-X (Public)66 MHz64119, 10
NUCIO (Private)33 MHz3200-
PCIe MPS Optimization
For PCIe-based systems, each PCIe device has a configurable MPS (maximum payload size)
parameter. Larger MPS values can enable the optimization to gain higher performance. MPS
Optimization is supported on PCIe systems running HP-UX, OpenVMS, and Linux. System
firmware level greater than 02.03 performs an optimization during boot time to set the MPS value
to the largest size supported by both a PCIe root port and the devices below it.
The default server state is optimization disabled. When disabled system firmware sets MPS to
the minimum value on each PCIe device.
The info io command will display the current PCIe MPS optimization setting. See “info”
(page 326).
To enable PCIe MPS optimization, use the ioconfig mps_optimize command. See “ioconfig”
(page 324).
For non-PCIe systems, ioconfig and info io will not display the MPS optimization policy
setting. The Set PCIe MPS Optimization boot manager menu also will not be displayed. Running
the ioconfig mps_optimize [on|off] command from a non-PCIe system, the following
output will be displayed:
------------Shell> ioconfig mps_optimize
ioconfig: PCIe MPS optimization is not supported.
Shell> ioconfig mps_optimize on
ioconfig: PCIe MPS optimization is not supported.
Exit status code: Unsupported
Shell>
-----------------
To restore MPS to the default values, use the default clear command. See “default”
(page 325).
Processor
The server processor subsystem accommodates one, two, three, or four dual-core Itanium
processor modules. The processor subsystem consists of the following components:
•zx2 CEC front side bus, memory, and I/O controller
•System clock generation and distribution
•Circuitry for manageability and fault detection
The zx2 CEC and the processor modules are located on the processor board assembly. Each
processor connects to the processor board through a zero insertion force (ZIF) socket. The
Server Subsystems19
Page 20
Memory
processor board is mounted on a removable carrier tray that is attached to the processor board
access door. Access this assembly from the front of the server after the memory carrier is removed.
The server DIMMS are seated on memory boards that are enclosed in an extractable memory
carrier assembly.
Figure 3 Memory Carrier Assembly
The memory boards plug directly into sockets on the processor board when the memory carrier
assembly is fully seated.
The server supports the following DIMM sizes:
•512 MB
•1 GB
•2 GB
•4 GB
•8 GB
Table 4 lists the memory carrier configurations, the minimum and maximum memory for each
configuration.
20Overview
Page 21
Table 4 Memory Carrier Configurations
Carrier
24-DIMM
48-DIMM
Add-On Memory
To locate the Hewlett Packard Enterprise part number, look at the Hewlett Packard Enterprise
Security/CT Label located on the DIMM.
AB565A (4 x 2 GB DIMMs) memory with the Hewlett Packard Enterprise part number AB565DX
cannot be mixed on the same physical rank as 2 GB memory with the AB565BX or AB565AX
Hewlett Packard Enterprise part number.
IMPORTANT:Earlier versions of system firmware do not support the installation of this
replacement memory and can result in de-allocation of the entire quad or pair.
Firmware Updates
HPE Integrity servers require system firmware version 03.01 or later to support the following
Memory Add-On products:
•AH350A 2 GB DDR2 Memory Pair (2 x 1 GB DIMMs)*
(mux)-based board
(mux)-based boards
Minimum ConfigurationMemory BoardsMemory
2 GB (one quad: four 512-MB DIMMS)One 24-DIMM memory multiplexer
2 GB (one quad: four 512-MB DIMMS)Two 24-DIMM memory multiplexer
Maximum
Configuration
192 GB (six quads:
24x8-GB DIMMs)
384 GB (12 quads:
48x8-GB DIMMs)
•AB564A 4 GB DDR2 Memory Pair (4 x 1 GB DIMMs)
•AB565A 8 GB DDR2 Memory Pair (4 x 2 GB DIMMs)
•AB566A 16 GB DDR2 Memory Pair (4 x 4 GB DIMMs)
* supported in HPE Integrity rx3600 servers with 8-DIMM memory carrier only
Before installing any of these memory products, verify the server firmware version is equal to or
higher than the version listed above for your product. On Integrity servers, you can determine
the firmware version using the following EFI Shell info fw command:
* Indicates active system firmware image. In this case =>3.02 indicates that this server does not
need system firmware updated to use the memory modules described in this document.
The firmware upgrade instructions are included in the Release Notes on the firmware package
download page for your server product. To locate the drivers for a particular server.
1.Go tothe Hewlett Packard Enterprise Support Center website: http://www.hpe.com/support/hpesc.
2.Under Select your HPE product, enter the HPE Integrity server name and click Go.
3.Select the link for your server product.
After the firmware has been downloaded, you can install the memory. To install DIMMs, see
“Installing Memory” (page 211).
There are six system fans assemblies that cool the server. The fans are hot-swappable,
interchangeable and serviced through the top and rear of the chassis. The fan rotors are N+1,
meaning that the server has 12 fan rotors (six fans), but can operate for a limited time with 11 or
10 fan rotors running, see Table 5 (page 22). If the time threshold is reached, the server
automatically shuts down to prevent an overtemperature condition.
Table 5 Fan Events
ActionEvent
Server chassis top cover removed
Two or more fan motors fail or are too
slow
One or more fan units removed
1
NOTE:Although the fans speed up to provide cooling when the top cover is removed, Hewlett Packard Enterprise
recommends replacing the top cover within 15 seconds.
2
NOTE:Hewlett Packard Enterprise recommends replacing fans within 20 seconds.
All rotors to maximum speed
All remaining rotors to maximum speedOne fan rotor fails or is too slow
All remaining rotors to maximum speed and hard shut down after two
minutes of continuous failure
All remaining rotors to maximum speed and hard shut down after two
minutes of continuous failure
1
2
Airflow enters through the front and exhausts out the rear. Airflow baffles might be required to
optimize air circulation within the enclosure. Fans are monitored by the system to indicate
performance.
The airflow strategy contains two thermal zones with three fan units in the bottom zone, and
three fan units in the upper zone along with two power supplies that provide their own individual
cooling. Depending on the configuration, certain component locations will need filler panels.
These installed airflow filler panels and blockers ensure airflow and EMI integrity. Internally, the
system may require a CPU airflow baffle and a memory airflow baffle. Rear I/O bulkhead covers
are required in unoccupied slots.
22Overview
Page 23
Figure 4 Fan Units
The server has the following cooling components:
Power
•Thermal sensor in the front panel [0xd8] that measures inlet ambient air temperature.
•Up to four dual processors each with its own thermal register [0xd9, 0xda], measuring internal
die temperature.
•Intrusion sensor, located on the common display pca, and held in contact mode by the top
cover.
•Power supplies, each with its own pair of fans running at full speed and its own (virtual)
health sensor [0x40, 0x41].
•Fan units 1 through 6 consisting of 2 individual fans rotors [0xe0 to 0xe9].
The server power subsystem is designed to provide high availability with 1+1 power supply
redundancy. Figure 5 (page 24) is a block diagram of the power subsystem, including voltage
labels for each main server subsystem that requires power.
Server Subsystems23
Page 24
Figure 5 Power Subsystem Block Diagram
Two hot-swappable AC/DC power supplies generate main system power and standby power
voltage. One active power supply is sufficient to operate the system at maximum load. Each
power supply receives AC power through the integrated AC inlet. The system can operate at
180-264 V AC and achieve 1+1 redundancy. The power supplies are power factor corrected and
the maximum dc power output of the power system is 1600 W. Service the hot-swappable power
supplies by sliding them out the rear of the chassis.
Power Button
The Power button on the server is a momentary contact push button. The BMC polls the front
panel Power button at a rate of at least 2 Hz. The Power button is an input to the System Power
State Management. If the system is off, a single button press will turn on the system. If the system
has booted to an OS, and a short button press is detected, a graceful-shutdown request will be
sent to the system by pulsing ACPI_PWR_BTN_L; when the ACPI bits are set to note the OS
has shut down, the BMC will perform a hard power down. If the system has not booted to an OS,
or if a long (5 second) button press is detected, the system will do an immediate hard power off.
System Power State Management
The system power may be controlled from the Power button, an IPMI Chassis command,
Wake-On-LAN, loss or gain of AC.
Applying System Power in normal customer usage, the server runs on 180 to 264V. Standby
power will be supplied on either; hence the BMC will power up when the power supplies are
plugged in. The BPS0_AC_OK and BPS1_AC_OK signals indicate whether the AC voltage to
the power supplies is within the required range. If neither BPS0_AC_OK nor BPS1_AC_OK is
asserted, then the BMC should log an event and prevent the system from turning on.
Procedure 1 Power On Sequence
1.Update the cache of DIMM SPD information.
2.Ensure that the memory board is detected and that the cpu board has a processor in socket
0. If these FRUs are not detected, the BMC logs an event against the Missing Device sensor
(sensor 0x15).
24Overview
Page 25
3.Check for a BPS0_AC_OK or a BPS1_AC_OK signal. If neither is asserted, then the AC
supply has a problem.
4.If any FRUs are missing or both AC supplies are not valid, then return to power off state.
5.Initialize I/O Expander settings prior to turning on power.
6.Set Power Sequencer Order. Set system frequency in Power Sequencer.
7.Pulse BMC_PWR_CMD to tell the Power Sequencer to enable the voltages in the system.
8.Wait for SEQ_MPON to know the power sequencer has finished and check if
SEQ_STATUS=0 for a fault condition. If a fault has occurred, scan sensors for the cause
and generate events.
9.Perform any pre-Reset Hardware Setup needed while power is on.
10. Release Reset by setting MPON=1.
Front Display Panel, DVD, and Diagnostic Panel
The front display panel, DVD, and diagnostic panel are supported on a single board, called the
display board, located in the front of the chassis. Service the display board from the top of the
chassis. The front display panel consists of the system status LEDs and a power switch. Use
the front display panel to determine the power status of the server and monitor the server as it
progresses through the boot cycle. Use the various LED states to assist with troubleshooting
system problems.
A slimline DVD drive, or optional DVD+RW drive, is located above the hard disk drives in the
horizontal orientation of the front panel. There is a USB 2.0 port positioned between the DVD
drive and the front display panel.
Each customer replaceable unit (CRU), with the exception of the power supplies, has a unique
set of status indicators located on a diagnostic panel that you view through the top cover. CRUs
include components such as individual memory DIMMs, processors, and fans. LEDs that
correspond to each CRU illuminate when there is a problem.
Figure 6 Front Panel Display Card Location
Mass Storage
The server mass storage subsystem (SAS) features the following SAS components:
•Hard drives
•Cables
Server Subsystems25
Page 26
•Backplane board
•Core I/O cards
The server supports up to 16 SAS hard drives, each with LEDs that indicate drive activity and
device status, and an LED used to locate each drive. Additionally, there is a set of slot availability
LEDs positioned in the middle of the disk drive bays on the front of the chassis. The illuminated
LEDs indicate connection and power from a SAS controller to the bank of SAS disk drive slots.
The disk drives plug directly into the SAS backplane board. The server ships standard with two
SAS backplane boards and one SAS core I/O card. Two cables connect from the SAS backplane
board to the SAS core I/O card located in PCI/PCI-X slot 1. An optional second SAS core I/O
card is available. Service the SAS backplane board and SAS core I/O card from the top of the
chassis.
IMPORTANT:The number and type of SAS core I/O cards determines the SAS configuration.
The SAS configuration affects the location of the LAN core I/O card. In a single SAS core I/O
card configuration, the secondary set of SAS cables connect to the secondary SAS backplane,
but are routed through the server I/O backplane area.
Firmware consists of many individually linked binary images that are bound together by a single
framework at run time. Internally, the firmware employs a software database called a device tree
to represent the structure of the hardware platform and to provide a means of associating software
elements with hardware functionality.
The firmware incorporates the following main interfaces:
Processor Abstraction Layer (PAL)PAL provides a seamless firmware abstraction between
System Abstraction Layer (SAL)SAL provides a uniform firmware interface, and initializes
Extensible Firmware Interface (EFI)EFI provides an interface between the operating system
Advanced Configuration and Power
Interface (ACPI)
Slot 10Slots 1 and 22
Slot 2Slots 1 and 32
Slot 2Slot 31
Slot 2Slots 3 and 42
the processor and system software and platform firmware.
and configures the platform.
and the platform firmware. EFI uses data tables that contain
platform-related information, and boot and run-time service
calls that are available to the operating system and its
loader to provide a standard environment for booting.
ACPI provides a standard environment for configuring and
managing server systems. ACPI moves system power
configuration and management from the system firmware
to the operating system, and abstracts the interface
between the platform hardware and the operating system
software. This enables each to evolve independently of
the other.
26Overview
Page 27
The firmware supports HP-UX 11i version 2, June 2006 release, Linux®, Windows®, and
OpenVMS 8.3 operating systems through the Itanium processor family standards and extensions,
and has no operating system-specific functionality included. All operating systems are presented
with the same interface to system firmware, and all features are available to the operating system.
User Interface
The Itanium processor family firmware employs a user interface defined by a Hewlett Packard
Enterprise standard called Pre-OS System Startup Environment (POSSE). The POSSE shell is
based on the EFI standard shell. Several commands were added to the standard EFI Shell to
support Hewlett Packard Enterprise value-added functionality.
Event IDs for Errors and Events
The system firmware generates event IDs for errors, events, and forward progress to the iLO 2
MP through common shared memory. The iLO 2 MP interprets and stores event IDs. Reviewing
these events helps you diagnose and troubleshoot problems with the server.
Controls, Ports, and LEDs
This section provides a basic description of the controls, ports, and LEDs found on the front panel
and rear panel of the server. For more information on LED functions and descriptions, see
Chapter 5: “Troubleshooting” (page 134).
Front Panel
The front panel of the server includes the controls, ports, and LEDs commonly used when the
server is operational.
Figure 7 shows the control, port, and LED locations on the server front panel.
Controls, Ports, and LEDs27
Page 28
Figure 7 Front Panel Control, Port, and LED Locations
Table 7 lists the front panel controls and LED states.
Table 7 Front Panel Controls and LEDs
Power ButtonFull power is onGreen
UID Button
Init Button
System Health LED
on and off.
server within a rack of
servers. You can remotely
activate this button using
various system utilities.
Resets the system;
irrecoverably halts all
system processing and I/O
activity and restarts the
server.
the system status.
1
StatusStatesFunctionLED
No AC powerOffManually powersthe server
Standby power is onYellow
UID button is not activatedOffHelps locate a particular
UID button is activatedBlue
——
System is offOffProvides information about
Normal operationGreen
WarningFlashing amber
28Overview
System faultFlashing red
Page 29
Table 7 Front Panel Controls and LEDs (continued)
internal serviceable
components. This LED
maintains its state whenthe
system is in standby mode
(system power turned off
but AC power still applied
Internal Health LED
to the system). When the
internal health LED is lit, the
corresponding failed
component LEDilluminates
on the diagnostic panel.
See Chapter 5 (page 134)
for more details on the
internal health LEDs.
StatusStatesFunctionLED
System is offOffIndicates the status of
System health is goodGreen
System health is degradedFlashing amber
System health is criticalFlashing red
External Health LED
external serviceable
components. When the
external health LED is lit,
the corresponding failed
component LEDilluminates.
1
There is an additional UID LED and button located on the rear panel of the server. Both UID LEDs illuminate when
you activate either the front or rear UID buttons.
System is offOffIndicates the status of
System health is goodGreen
System health is degradedFlashing amber
System health is criticalFlashing red
Figure 8 shows the front control panel LEDs.
Figure 8 Front Control Panel LEDs
Storage and Media Devices
The server can contain up to 16 hot-pluggable SAS disk drives and one DVD or DVD-RW drive.
Storage and media devices have LEDs that indicate activity and device status. Hot-pluggable
SAS disk drives also have an LED used to locate a particular drive. SAS disk drive slots map to
LEDs that indicate whether a slot is available for use.
Hot-Pluggable Disk Drive LEDs
The hot-pluggable disk drives have two LEDs per drive (Figure 9):
•Drive Status LED
•Drive Activity LED
Controls, Ports, and LEDs29
Page 30
Figure 9 Hot-Pluggable Disk Drive LEDs
Table 8 lists the hot-pluggable disk drive LEDs and states in RAID mode.
Table 8 Behaviour of Hot-Pluggable Disk Drive LEDs in RAID mode
Disk Drive StateStatus LEDActivity LED
Offline or not configuredOffOff
Normal operation; no activityOffSolid green
Normal operation; disk read or write activityOffFlickering green
Off
1 Hz
Solid green
1 Hz
Flickering green
1 Hz
Off
constant 1 Hz
1
The Drive Status LED is blue when you use various software utilities, such as online diagnostics and SAS drive
configuration tools.
1
Offline, no activity; predictive failureFlashing amber at constant
Online, no activity; predictive failureFlashing amber at constant
Disk activity; predictive failureFlashing amber at constant
Offline; no activity; critical faultSolid amberOff
Offline; drive selected by locator functionSolid blue
Drive rebuildingOffFlashing green at
Table 9 lists the hot-pluggable disk drive LEDs and states in Standalone HBA mode.
Table 9 Behaviour of Hot-Pluggable Disk Drive LEDs in Standalone HBA mode
Disk Drive StateStatus LEDActivity LED
Offline or not configuredOffOff
Normal operation; no activityOffOff
Normal operation; disk read or write activityOffFlickering green
Off
Solid green
Flickering green
Off
constant 1 Hz
30Overview
1 Hz
1 Hz
1 Hz
Offline, no activity; predictive failureFlashing amber at constant
Online, no activity; predictive failureFlashing amber at constant
Disk activity; predictive failureFlashing amber at constant
Offline; no activity; critical faultSolid amberOff
1
Offline; drive selected by locator functionSolid blue
Drive rebuildingOffFlashing green at
Page 31
1
The Drive Status LED is blue when you use various software utilities, such as online diagnostics and SAS drive
configuration tools.
Hot-Pluggable Disk Drive Slot Availability LEDs
The hot-pluggable disk drive slot availability LEDs are located on the front bezel in the center of
the two groups of eight SAS disk drive slots (Figure 10). The illuminated LEDs indicate connection
and power of the group of SAS disk drive slots to a SAS controller.
Figure 10 shows the hot-pluggable disk drive slot availability LEDs for one group of eight disk
drives.
Figure 10 Hot-Pluggable Disk Drive Slot Availability LEDs
DVD Drive
The server has one DVD drive or one DVD-RW drive. This device has one activity LED.
Figure 11 DVD Drive
Diagnostic Panel
The diagnostics panel provides a single location to view the LEDs that provide location information
for internal system components that have a detectable failure. The LEDs illuminate solid amber
only when a failure occurs and otherwise do not illuminate. The LEDs are visible through the
diagnostic panel on the outside of the top cover. The diagnostics panel is oriented similar to the
layout of the components in the system. Diagnostic LEDs are providedfor each internal serviceable
component in the system, including all DIMMs.
Figure 12 shows the diagnostic panel label and LEDs.
Controls, Ports, and LEDs31
Page 32
Figure 12 Diagnostic Panel Label and LEDs
Rear Panel
The server rear panel includes communication ports, I/O ports, AC power connectors, and the
locator LED/button. LEDs located on the rear panel of the server indicate the operational status
of the following components:
•iLO 2 MP
•System LAN
•Power supply
•PCI/PCI-X/PCIe slots
Figure 13 shows the rear panel control, port, and LED locations.
32Overview
Page 33
Figure 13 Rear Panel Control, Port, and LED Locations
iLO 2 MP
The servercontains an iLO 2 MP on the core I/O board thatenables local and remote management
of the server. As long as AC power is present, whether at standby or full power, the iLO 2 MP
can function.
Figure 14 shows the controls, ports, and LEDs on the core I/O board. The figure is oriented
vertically to match the orientation of the core I/O board.
Controls, Ports, and LEDs33
Page 34
Figure 14 Core I/O Board Controls, Ports, and LEDs
1
iLO 2 MP RS-232 Serial
Port (DB-9F to DB-9F
cable)
Connected to emulation
terminal device (PC,
laptop, or ASCII terminal)
2
USB 2.0 Ports
(any USB device)
3
BMC Heartbeat
4
MP Heartbeat
5
VGA Port
(No iLO 2MP access; EFI
only)
6
General Use Serial Port
(Printers, etc.)
7
10 Base-T/100 Base-T
Mode LED
8
iLO 2 MP LAN Port
(10/100 LAN)
9
Link and Activity LED
10
Standby Power
11
MP Self Test
iLO 2 MP Reset Button
The iLO 2 MP Reset button enables you to reset the iLO 2 MP, and optionally reset the
user-specific values to factory default values. To soft reset the iLO 2 MP, press the button
momentarily, then release it. To soft reset the iLO 2 MP and return user-specific values to factory
default values, press the button for more than four seconds, then release it. The following values
are reset to factory default values:
•Serial terminal baud rate settings
•User names and passwords
Core I/O Board Ports
Table 10 lists a description of the core I/O board ports.
Table 10 Core I/O Board Ports
34Overview
DescriptionPort
LAN port dedicated for remote access to the iLO 2 MP10 Base-T/100 Base-T LAN
Local serial port.Auxiliary Serial
Page 35
Table 10 Core I/O Board Ports (continued)
DescriptionPort
Local serial port that provides a console connection to the serverConsole Serial (iLO 2 MP)
USB
VGA (optional)
Two public USB2.0 ports used primarily to connect to a keyboard and mouse
for console input functions (Windows and Linux operating systems only)
VGA port used primarily to connect to amonitor that displays console output
(Windows and Linux operating systems only)
iLO 2 MP Status and LAN LEDs
Table 11 shows the states and status of the iLO 2 MP status and LAN LEDs.
Table 11 iLO 2 MP Status and LAN LEDs
StatusStatesiLO 2 MP LED
Standby power is onSolid greenStandby power
iLO 2 MP Self test
Amber
Link StatusLink with no activitySolid green
iLO 2 MP self test running
Self test completedOff
Operational and functionalFlashing greeniLO 2 MP Heartbeat
Operational and functionalFlashing greenBMC Heartbeat
ActivityBlinking green
No linkOff
1
Link Speed
1
The LED is solid amber when AC power is first applied. It remains solid amber for a few seconds until the iLO 2 MP
completes its self test; the LED then turns off.
System LAN
The system LAN functionality is provided by the LAN core I/O card. The ports on the LAN core
I/O card are two RJ-45 style 10 Base-T/100 Base-T/1000 Base-T system LAN ports.
Table 12 show the system LAN link status and speed LEDs states and status.
Table 12 System LAN Link Status and Speed LEDs
Link statusLink with no activitySolid green
Link speed
100 Mb linkSolid amber
10 Mb linkOff
Link StatusStateLED
ActivityBlinking green
No linkOff
1000 MbSolid orange
100 MbSolid green
10 MbOff
Controls, Ports, and LEDs35
Page 36
Figure 15 LAN Link and Status LEDs
Power Supply
The server can have one or two power supplies, labeled PS0 and PS1. Each power supply has
an AC input receptacle and an LED that shows the power state of the server (Figure 13).
The server has three power states: standby power, full power, and off. Plug the power cord into
the appropriate receptacle on the rear of the chassis to achieve the standby power state. To
bring the server to full power plug the power cord into the appropriate receptacle, and either
activate the power using the iLO 2 MP PC command, or push the Power button. To bring the
server to the off state, unplug the power cords.
Table 13 lists the power supply LED states.
Table 13 Power Supply LED
Figure 16 shows the power LEDs.
Power Supply ConditionPower Supply LED
No AC powerOff
AC power; standby power onBlinking green
Full power on; normal operationSolid green
Power supply failureBlinking amber
36Overview
Page 37
Figure 16 Power LEDs
Rear Panel UID LED and Button
The UID button is used to help locate a particular server within a rack of servers (Figure 13). You
can remotely activate this function using various system utilities.
Table 14 lists the rear panel UID LED states.
Table 14 Rear Panel UID LED
Blue
1
There is an additional UID LED and button located on the front control panel of the server. Both UID LEDs illuminate
when you activate either of the front or rear UID buttons
PCI/PCI-X/PCIe Card Slot
The server has eight public, hot-pluggable PCI/PCI-X/PCIe slots and two private core I/O slots.
Each slot has an attention LED that serves two purposes (Figure 13). It indicates a potential
problem with the slot that requires immediate attention. Additionally, the LED can function as a
locator used to identifya particular PCI/PCI-X/PCIeslot. You can activate the locator functionality
using various software utilities.
CAUTION:Private core I/O slots are not hot-pluggable. Do not remove the cards in these slots
without first powering off the server and unplugging the power cords.
StatusStates
UID button is not activatedOff
UID button is activated
1
Controls, Ports, and LEDs37
Page 38
2 System Specifications
Server Specifications
Table 15 lists the server specifications.
Table 15 Server Specifications
One, two, three, or four Itanium dual-core processors:Processors
• 1.4 GHz / 12 MB cache
• 1.6 GHz / 18 MB cache
• 1.6 GHz / 24 MB cache
SpecificationComponent
rx6600 with PCI/PCI-X/PCIe IOBPrx6600 with PCI/PCI-X IOBP
One to 16 hot-pluggable SAS hard drivesDisk drives
Two private PCI-X 66 MHz slotsPCI slots
Eight Public slots:Eight public PCI-X slots:
• Two PCI-X slots, 66 MHz• Four PCI-X slots, 66 MHz
••Two PCI-X slots, 133 MHzTwo PCI-X slots 133 MHz
••Four PCIe, x8Two PCI-X2 slots, 266 MHz
• Eight port SAS core I/O card (PCI-X)• Eight port SAS core I/O card (PCI-X)
••Eight port SAS core I/O card with RAID
(PCI-X)
Eight portSAS core I/O card with RAID (PCI-X)
• Eight port SAS core I/O card with RAID (PCIe)
• Eight port SAS core I/O card with RAID able to
connect to external storage (PCIe)
Two GigE LAN portsLAN core I/O
Management
core I/O
device
Two serial ports, two USB 2.0 ports, one 10 Base-T/100 Base-T LAN port, and one optional VGA
port
One DVD or DVD+RW driveOptical
One 1600 watt power supply, 1+1 redundancy with second power supplyPower supply
Dimensions and Weight
Table 16 lists the dimensions and weight of the server for a rack- or pedestal-installed configuration
.
38System Specifications
Page 39
Table 16 Rack- or Pedestal-Installed Server Dimensions and Values
estimate)
Rack
Pedestal
Grounding
The site building shall provide a safety ground/protective earth for each AC service entrance to
all cabinets.
Install a PE (protective earthing) conductor that is identical in size, insulation material, and
thickness to the branch-circuit supply conductors. The PE conductor must be green with yellow
stripes. The earthing conductor is to be connected from the unit to the building installation earth
or, if supplied by a separately derived system, at the supply transformer or motor-generator set
grounding point.
ValueDimension
53.4 - 68 kg (120-150 lbs.)Server weight (loaded product weight range
69.6 cm (27.4 in) x 44 cm (17.32 in) x 30.58 cm (12.04 in)Rack dimensions (depth x width x height)
Max: 68.04 kg (150 lbs.)Rack weight
Server takes up 7U in the rackRack unit
69.3 cm (27.3 in) x 48.9 cm (19.3 in) x 42.2 cm (16.7 in)Pedestal dimensions (depth x width x height)
Max: 15.5 kg. (34 lbs.)Pedestal weight
69.9 kg. (154 lbs.)Minimum standalone configuration
83.5 kg. (184 lbs.)Maximum standalone configuration
Electrical Specifications
This section provides electrical specifications for the server.
System Power Specifications
Available power (output) is the maximum dc power that the power supply can supply to the
system.
Maximum input power is what the power supply requires from the AC line to deliver that maximum
dc output (given worst case efficiency and maximum loading).
Maximum input current is the worst case/highest current given the lowest input voltage and the
maximum input power.
Table 17 lists the system power specifications.
Table 17 System Power Specifications
Maximum System Input Current
2
RatingParameter
200-240 V ACAC Voltage
1600 WMaximum dc Output Power
9 A
47 to 63 HzInput frequency
25 W per socketMax. per PCI/PCI-X/PCI-E Sockets
1633 W (5575 BTU)Maximum Configuration
1
Grounding39
Page 40
Table 17 System Power Specifications (continued)
RatingParameter
3
4
1
The infrastructure should be sized such that any single power supply can safely provide all the power required by the
system.
2
Maximum theoretical configuration: (4x) 1.6G/24M CPUs, (48x) 4GB DDRII DIMM memory, (16x) SAS Hard Drives,
(8x) PCI/PCI-X/PCI-E added to public I/O cards.
3
Minimum possible configuration: (1x) Itanium 1.4G/12M or 1.6G/18M or 1.6G/24M CPUs, (4x) 4GB DDRII DIMM
memory, (0x) SAS Hard Drives, (0x) PCI/PCI-X/PCI-E added to public I/O cards.
4
Half-loaded configuration: (2x) Itanium 1.4G/12M or 1.6G/18M or 1.6G/24M CPUs, (24x) 4GB DDRII DIMM memory,
(8x) SAS Hard Drives, (4x) PCI/PCI-X/PCI-E added to public I/O cards.
443 W (1512 BTU)Minimum Configuration
998 W (3407 BTU)Typical Configuration
If an overload triggers the power supply overload protection, the system is immediately powered
off. To reset the power supply unit:
1.Disconnect the power cord
2.Determine what caused the overload by contacting a Hewlett Packard Enterprise support
representative
3.Reconnect the power cord, then reboot the system
If an overload occurs twice, there is an undetected short circuit somewhere.
When you use the front panel Power button to turn off the server, power consumption falls below
the low power consumption, but doesn't reach zero. To reach zero power consumption in “off”
mode, either unplug the server or use a power block with a switch.
Power Consumption and Cooling
Table 18 lists additional component power consumption.
Table 18 Additional Component Power Consumption
Environmental Specifications
This section provides the temperature/humidity requirements, noise emission, and air flow
specifications for the Hewlett Packard Enterprise server.
Operating temperature and humidity ranges may vary depending on the installed mass storage
devices. High humidity levels can cause improper disk operation. Low humidity levels can
aggravate static electricity problems and cause excessive wear of the disk surface.
Table 19 lists environmental specifications.
Table 19 Environmental Specifications (system processing unit with hard disk)
Power ConsumptionComponent
+122 W (417 BTU/hr)Each additional CPU
+31 W (106 BTU/hr)Each additional (4x) DIMM
+17 W (58 BTU/hr)Each additional SAS HD
+29 W (99 BTU/hr)Each additional I/O Card
40System Specifications
ValueParameter
+5° C to +35° C (+41° F to +95° F)Operating temperature
- 40° C to +70° C (-40° F to +158° F)Storage temperature
Page 41
Table 19 Environmental Specifications (system processing unit with hard disk) (continued)
ValueParameter
1
2
+44° C (+111.2° F)Critical over-temperature
+48° C (+118.4° F)Fatal over-temperature shutdown
15% to 80% relative (noncondensing)Operating humidity
90% relative (noncondensing) at + 65° CStorage humidity
Acoustic Noise Emission (ISO 7779)
4
5
Sound Power Level
LWA=6.8 BATypical configuration (disk idle)
LWA =6.8 BAMaximum configuration (disk idle)
5
LWA =6.9 BAMaximum configuration (disk active)
3
Altitude
0 to 3000 m (10,000 ft.) maxOperating altitude
0 to 4572 m (15,000 ft.) maxStorage altitude
1
If this temperature is reached, iLO enters a TEMPERATURE_HIGH_CRITICAL event in the system log, which might
initiate a graceful OS shutdown, dependingon OS configuration (HP-UXenvd(1) might initiate a reboot or shutdown).
2
If this temperature is reached, iLO enters a TEMPERATURE_HIGH_NON_RECOVERABLE event in the system log
and automatically initiates a system shutdown via interruption of internal DC power (the OS halts immediately).
3
Typical configuration at room temperature (25° C).
4
Single processor, one to two SCSI hard disk drives and less than 8GB of memory.
5
Dual processor, three SCSI hard disk drives and more than 8GB of memory.
Table 20 Physical and Environmental Specifications
(1x) Itanium1.4G/12M or 1.6G/18Mor 1.6G/24M
CPUs, (4x)4GB DDRII DIMMmemory, (0x) SAS
Hard Drives, (0x) PCI/PCI-X/PCIe added to
public I/O cards.
Environmental Specifications41
Page 42
Table 20 Physical and Environmental Specifications (continued)
Condition
Typical
Heat
Release
Airflow, Nominal
Voltage
Airflow, Maximun at
35ºC
1
200-240
Vac
Maximum
Configuration
Typical
Configuration
Front to Rear (F-R)
1
Derate maximum dry bulb temperature 1oC/300 m above 900 m.
2
m3/hr=1.7 x CFM
Overall System
Weight
Dimensions
(W X D X H
PedestalRackPedestalRackServer
(4x) 1.6G/24M CPUs, (48x) 4GB DDRII DIMM
memory, (16x) SAS Hard Drives, (8x)
PCI/PCI-X/PCIe added to public I/O cards.
Half-loaded configuration:(2x) Itanium 1.4G/12M
or 1.6G/18M or 1.6G/24M CPUs, (24x) 4GB
DDRII DIMM memory, (8x) SAS Hard Drives,
(4x) PCI/PCI-X/PCIe added to public I/O cards.
42System Specifications
Page 43
3 Installing the System
This chapter provides information and procedures to install the server.
Safety Information
Use care to prevent injury and equipment damage when performing removal and replacement
procedures. Voltages can be present within the server even when it is powered off. Many
assemblies are sensitive to damage by electrostatic discharge (ESD).
Follow the safety precautions listed below to ensure safe handling of components, to prevent
injury, and to prevent damage to the server:
•When removing or installing any server component, follow the instructions provided in this
guide.
•If installing a hot-swappable or hot-pluggable component when power is applied (fans are
running), reinstall the server cover immediately to prevent overheating.
•If installing a hot-pluggable component, complete the required software intervention prior to
removing the component.
•If installing an assembly that is neither hot-swappable nor hot-pluggable, disconnect the
power cable from the external server power receptacle.
WARNING!Ensure that the system is powered off and all power sources are disconnected
from the server prior to removing or installing server hardware unless you are removing or
installing a hot-swappable or hot-pluggable component.
Voltages are present at various locations within the server whenever an AC power source
is connected. This voltage is present even when the main power switch is turned off.
Failure to observe this warning can result in personal injury or damage to equipment.
•Do not wear loose clothing that can snag or catch on the server or on other items.
•Do not wear clothing subject to static charge buildup, such as wool or synthetic materials.
•If installing an internal assembly, wear an antistatic wrist strap and use a grounding mat,
such as those included in the Electrically Conductive Field Service Grounding Kit (HPE
9300-1155).
•Handle accessory boards and components by the edges only. Do not touch any metal-edge
connectors or any electrical components on accessory boards.
Installation Sequence and Checklist
Table 21 lists the server installation steps. Follow these steps in sequence to install the server.
Table 21 Installation Sequence Checklist
1
Unpack and inspect theserver shipping container. Inventory the contents usingthe packing
slip.
Install additional components shipped with the server.2
Install the server into a rack or pedestal mount.3
This section describes procedures you perform before installation. Ensure that you have
adequately prepared your environment for the new server and received all the components you
ordered. Verify that the server and its containers are in good condition after shipment.
Verifying Site Preparation
Verifying site preparation is an essential part of a successful server installation. It includes the
following tasks:
•Gather LAN information. Determine the IP addresses for the iLO MP LAN and the system
LAN.
CompletedDescriptionStep
•Determine a method to physically connect to the server console.
•Verify electrical requirements. Ensure that grounding specifications and power requirements
have been met.
•Validate server physical space requirements.
•Confirm environmental requirements.
For more information on server electrical, physical space, and environmental requirements, see
the Integrity rx6600 Site Preparation Guide.
Inspecting the Shipping Containers for Damage
Hewlett Packard Enterprise shipping containers protect their contents under normal shipping
conditions. After the equipment arrives, carefully inspect each carton for signs of shipping damage.
Shipping damage constitutes moderate to severe damage, such as punctures in the corrugated
carton, crushed boxes, or large dents. Normal wear or slight damage to the carton is not
considered shipping damage. If you find shipping damage to a carton, contact your Hewlett
Packard Enterprise customer service representative immediately.
Unpacking the Server
To unpack a server, follow these steps:
1.Read the instructions printed on the outside top flap of the carton; remove the banding and
the outer carton from the server pallet.
2.Remove all inner accessory cartons and the top foam cushions, leaving only the server.
IMPORTANT:Inspect each carton for shipping damage as you unpack the server.
Checking the Inventory
The sales order packing slip lists all the equipment shipped from Hewlett Packard Enterprise.
Use this packing slip to verify that all the equipment has arrived.
44Installing the System
Page 45
NOTE:To identify each item by part number, refer to the sales order packing slip.
Returning Damaged Equipment
If the equipment is damaged, contact your Hewlett Packard Enterprise customer service
representative immediately. The service representative initiates appropriate action through the
transport carrier or the factory and assists you in returning the equipment.
Unloading the Server with a Lifter
WARNING!Use caution when using a lifter. Because of the weight of the server, you must
center the server on the lifter forks before lifting it off the pallet to avoid injury.
NOTE:Hewlett Packard Enterprise recommends that you follow local guidelines when lifting
equipment.
To unload the server from the pallet using a lifter, follow these steps:
1.Unpack the server.
2.Unroll the bottom corrugated tray on the side where you will place the lifter, and slide the
server as close to that edge of the pallet as possible.
3.Break off any foam packaging that can prevent you from fully inserting the lifter under the
server.
IMPORTANT:Do not remove the foam packaging from the corners of the server. This
foam is required to elevate the server and enable the forks of the lifter to be inserted under
the server.
4.Insert the lifter forks under the server.
5.Roll the lifter forward carefully until it is positioned against the side of the server.
6.Raise the server slowly off the pallet until it clears the pallet cushions.
7.Roll the lifter and server away from the pallet. Do not raise the server any higher than
necessary when moving it to the rack.
Installing Additional Components
This section describes how to install components into the server that are not factory integrated.
Most servers are preconfigured with all components installed prior to shipping from the Hewlett
Packard Enterprise factory. If you do not have additional components to install, you can skip this
chapter and install the server.
Removing and Replacing the Top Cover
NOTE:When the top cover is open or removed, the chassis fan units increase to high speed
to assist cooling. When the top cover is replaced at the end of the operation, the chassis fans
return to normal speed.
Removing the Top Cover
To remove the top cover, follow these steps:
1.Unlock the cover release lever (Figure 17). Turn the cam 90 degrees counterclockwise.
2.Pull up on the cover release lever to disengage the top cover from the chassis (Figure 17).
Installing Additional Components45
Page 46
NOTE:The cover release lever also disengages the memory carrier assembly cover.
The memory carrier assembly cover can remain in place while servicing any components
except for the memory carrier assembly and the processor board assembly.
3.Slide the cover toward the rear of the server until the tabs release from the slots in the
chassis.
4.Lift the cover off the chassis.
Figure 17 Removing and Replacing the Top Cover
Replacing the Top Cover
NOTE:Always replace the memory carrier assembly cover before replacing the top cover.
To replace the top cover, follow these steps:
1.Ensure the memory carrier assembly cover is in place.
2.Ensure the cover release lever is in the unlocked position (Figure 17).
3.Align the tabs of the top cover with the corresponding slots in the chassis. Insert the tabs
into the slots.
4.Slide the cover forward until it is flush with the front of the chassis.
5.Push the cover release lever down into the latched position (Figure 17).
6.Lock the cover release lever. Turn the cam 90 degrees clockwise.
46Installing the System
Page 47
Removing and Replacing the Memory Carrier Assembly Cover
NOTE:When the memory carrier assembly cover is open or removed, the chassis fan units
increase to high speed to assist cooling. When the top cover is replaced at the end of the
operation, the chassis fans return to normal speed.
Removing the Memory Carrier Assembly Cover
To remove the memory carrier assembly cover, follow these steps:
1.Unlock the cover release lever. Turn the cam 90 degrees counterclockwise.
2.Pull up on the cover release lever to disengage the top cover and memory carrier assembly
cover from the chassis (Figure 17).
3.Slide the memory carrier assembly cover toward the left side of the server to free it from the
center of the chassis. Lift the cover off the chassis (Figure 18).
Figure 18 Removing and Replacing the Memory Carrier Assembly Cover
Replacing the Memory Carrier Assembly Cover
To replace the memory carrier assembly cover, follow these steps:
1.Position the cover onto the opening above the memory carrier assembly.
2.Slide the cover toward the right side of the server until it is flush with the center chassis wall.
3.Slide the top cover forward until it is flush with the front of the chassis.
4.Push the cover release lever down into the latched position (Figure 17).
5.Lock the cover release lever. Turn the cam 90 degrees clockwise.
Installing Additional Components47
Page 48
Installing a Hot-Swappable Power Supply
The server can have one or two hot-swappable power supplies. These power supplies are located
at the rear of the server. The supported configuration of the server requires a minimum of one
power supply. You can install or replace a hot-swappable power supply using the procedures in
this section when power is on or off.
CAUTION:Observe all ESD safety precautions before attempting this procedure. Failure to
follow ESD safety precautions can result in damage to the server.
NOTE:A hot-swappable device does not require interaction with the operating system before
the device is removed from or installed into the server.
The dc power to the server does not have to be off to install or replace a hot-swappable power
supply.
Power Supply Loading Guidelines
The supported configuration of the server requires a minimum of one power supply installed in
either slot P0 or slot P1. You can install a second, optional hot-swappable power supply to provide
1+1 capability. The left side (viewed from the rear of the chassis) hot-swappable power supply
is identified as P0, and the second hot-swappable power supply is identified as P1 (Figure 19).
CAUTION:When a second power supply is not used, the empty power supply slot must remain
covered with the supplied metal filler panel. Failure to observe this caution can result in damage
due to overheating
Installing a Power Supply
CAUTION:Install the hot-swappable power supply into the server before attaching the new
power cord. Failure to observe this caution can result in damage to the server
To install a hot-swappable power supply, follow these steps:
1.Remove the metal filler panel if necessary.
2.Support the power supply with both hands, and slide it into the empty slot until it clicks into
place (Figure 19).
IMPORTANT:Ensure the power supply is flush with the adjacent power supply or metal
filler panel.
48Installing the System
Page 49
Figure 19 Removing and Replacing a Hot-Swappable Power Supply
Removing and Replacing Hot-Swappable Disk Drive Fillers
There are disk drive fillers installed for all slots that do not contain a disk drive.
IMPORTANT:For cooling purposes, always leave disk drive fillers in slots that do not contain
a disk drive.
Removing a Hot-Swappable Disk Drive Filler
To remove a hot-swappable disk drive filler, follow these steps:
1.Squeeze the tabs on the front of the filler to release it from the slot in the drive bay.
2.Pull gently until the filler slides out of the chassis.
Installing Additional Components49
Page 50
Figure 20 Removing and Replacing a Hot-Swappable Disk Drive Filler
Replacing a Hot-Swappable Disk Drive Filler
To replace a hot-swappable disk drive filler, perform the following:
1.Orient the disk drive filler so that the release tab is on the left side of the filler, and the airflow
holes are on the right side of the filler.
2.Insert the filler into the slot guides, and slide the filler into the slot until it clicks into place and
is fully seated.
Installing a Hot-Pluggable SAS Hard Drive
There are 16 hot-pluggable disk drives located in the front of the server. You can replace the
hot-pluggable disk drives using the procedures in this section when the server power is on or
off.
CAUTION:Drives are loaded in the factory, starting with number 8, working from right to left
and bottom to top. If you have never changed your SAS configuration before, you can safely
move SAS devices downwards as a block. If you have bays 6, 7, and 8 occupied you can move
them down to bays 1, 2, and 3 without having the hardware paths change during a cold-install
or recovery while the system is shut down, but you must move the disks in order and you cannot
rearrange them. For example, you can move bay 6 to 1, 7 to 2, and 8 to 3. After doing this you
can safely populate the SAS enclosure from bay 4 onwards. The same procedure can be
performed on bays 9 to 16.
Never move devices from Bays 9-16 to Bays 1-8 as they are controlled by different SAS HBAs.
CAUTION:A hot-pluggable device may require interaction with the operating system before
you can safely remove it fromor installit intothe server. Verify that the operating system supports
removing and replacing disk drives while the operating system is running. If the operating system
does not support this feature, shut down the operating system before attempting this procedure.
Failure to observe this caution can result in system failure.
50Installing the System
Page 51
TIP:When you receive an Integrity rx6600 server from Hewlett Packard Enterprise, if you ever
plan to add other SAS devices into the system, you should consider moving the SAS devices so
they start in bay 1 going upwards instead of Bay 8 going downwards.
Installing a Hot-Pluggable Disk Drive
NOTE:The replacement disk drive must have the same product number as the disk drive that
you replace.
To install a hot-pluggable disk drive, follow these steps:
1.Use Figure 22 to determine the next available disk drive installation slot.
2.Remove the disk drive filler if required. See “Removing a Hot-Swappable Disk Drive Filler”
(page 49).
NOTE:Save the disk drive filler for future use. For cooling purposes, always place disk
drive fillers in slots that do not contain a disk drive.
3.Insert the hot-pluggable disk drive into the slot guides, and slide the drive into the slot until
it seats into the socket on the disk backplane.
4.Close the drive ejector handle by pushing it inward until it clicks into place.
Figure 21 Removing and Replacing a Hot-Pluggable Disk Drive
Installing Additional Components51
Page 52
Figure 22 Disk Drive Slot IDs
Installing a PCI/PCI-X/PCIe Card
Figure 23 shows the PCI/PCI-X/PCIe slot identification and card divider locations.
NOTE:Slots one through eight are full-length; slots nine and ten are short-length.
Figure 23 PCI/PCI-X Slot Identification and Card Divider Locations
1
Slot 1
2
Slot 2
3
Slot 3
52Installing the System
5
Slot 5
6
Slot 6
7
Slot 7
9
Slot 9
10
Slot 10
11
Core I/O Board Slot
Page 53
PCI/PCI-X/PCIe Configurations
PCI/PCI-X/PCIe slots are numbered one through ten in the server (Figure 23).
The following describes configuration requirements for slots one through ten on the PCI/PCI-X
I/O backplane:
•PCI-X slots 1 and 2 are reserved for use by the core I/O cards SAS core I/O card in slot 1
and Gigabit Ethernet LAN core I/O card in slot 2. Slots 1 and 2 are not hot-pluggable. Install
only supported PCI-X SAS and LAN core I/O cards in slots 1 and 2. PCIe SAS core I/O is
installed in slots 3 and 4 on the PCI/PCI-X/PCIe IOBP. Depending upon the number and
type of SAS core I/O cards installed on the system, the Gigabit Ethernet LAN core I/O card
may be installed in slot 10.
•Slots 3 and 4 are nonshared slots. The maximum speed for cards in slots 3 and 4 is PCI-X
266 MHz.
•Slots 5 and 6 are nonshared slots. The maximum speed for cards in slots 5 and 6 is PCI-X
133 MHz,
•Slots 7 and 8 are shared slots, and slots, 9 and 10 are shared slots. These four slots are
limited by bus mode or frequency-related incompatibilities.
NOTE:Shared slots have card compatibility restrictions. If one of the shared slots is
occupied, the card added to the second slot is limited by the configuration of the occupied
slot. If the new card has a slower capability than the current bus configuration, it fails. If the
new card has a faster capability than the current bus configuration, it only runs at the slower
bus mode and frequency of the current bus configuration.
1284
Slot 8Slot 4
PCI/PCI-X/PXIe Card
Dividers
The following are common configuration scenarios for cards that use shared slots. These
examples also apply to slots 9 and 10 because they are shared (both use a common bus).
1.If there is a PCI-X 66 MHz card in slot 7, and you hot-plug insert a PCI 33 MHz card
into slot 8, the operation fails. The new PCI 33 MHz card does not initialize and the slot
powers down because you cannot change bus speed during hot-pluggable operations.
The new card has a slower bus speed than the current card.
NOTE:If the server is rebooted in the new configuration, both cards initialize to run
at PCI 33 MHz. This is because the system firmware can only change the bus capability
down to the lowest common value.
2.If there is a PCI 33 MHz card in slot 7, and you hot-plug insert a PCI-X 66 MHz card
into slot 8, the new card works but it runs at PCI 33 MHz.
3.If the server is powered off and you insert a PCI 33 MHz card into slot 7 with a PCI-X
66 MHz card is installed in slot 8), then both cards run at PCI 33 MHz when the server
powers up.
The following describes configuration requirements for slots one through ten on the
PCI/PCI-X/PCIe I/O backplane:
•PCI-X slots 1 and 2 are reserved for use by the core I/O cards SAS core I/O card in slot 1
and Gigabit Ethernet LAN core I/O card in slot 2. Slots 1 and 2 are not hot-pluggable. Install
only supported SAS and LAN core I/O cards in slots 1 and 2.
•Slots 3 and 4 are swtiched PCIe x8
•Slots 5 and 6 are nonswitched PCIe x8.
Installing Additional Components53
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•Slots 7 and 8 are nonshared slots. The maximum speed for cards in slots 7 and 8 is PCI-X
133 MHz.
•Slots 9 and 10 are shared slots. These two slots are limited by bus mode or frequency-related
incompatibilities.
IMPORTANT:Slots 9 and 10 on the PCI/PCI-X/PCIe I/O backplane have the same
configuration limitations as slots 9 and 10 on the PCI/PCI-X/ I/O backplane.
Table 22 lists the PCI/PCI-X card slot frequency and bus mode compatibility for shared slots.
Table 22 PCI/PCI-X Card Slot Frequency and Bus Mode Compatibility for Shared Slots
Cards to be InstalledCurrent PCI Bus
Mode and
Frequency for
the Card in a
Shared Slot
PCI 33 MHz
Compatible
2
Compatible
2
New card
running at PCI
33
Compatible
2
New card running
at PCI 33
Compatible
New card
running at PCI
33
PCI-X 266PCI-X 133PCI-X 66PCI 66PCI 33
2
Compatible
New card running
at PCI 33
1
2
PCI 66 MHz
Incompatible
frequency
PCI-X 66 MHz
Incompatible
frequency
1
The conditions described in this table apply only to shared slots 7, 8, 9, and 10. Slots 1, 2, 3, 4, 5, and 6 are not shared
slots.
2
Compatible: card is accepted and runs at the frequency shown.
3
Incompatible-frequency: card does not work. The new card does not initialize and powers down due to frequency
mismatch.
4
Incompatible bus: Card does not work. The new card does not initialize and powers down due to bus mode mismatch.
Offline Installation of a PCI Card
Ensure that you install the proper drivers for PCI/PCI-X/PCIe cards after you complete the server
installation and power on the server.
To install a PCI/PCI-X/PCIe card with the power off, follow these steps:
1.Remove the top cover from the chassis. See “Removing and Replacing the Top Cover”
(page 45).
2.Select an empty slot that is appropriate for the card you are installing. To locate an appropriate
slot, see “PCI/PCI-X/PCIe Configurations” (page 53) and Figure 23 for more information.
3.Open the MRL.
a.Press the indentation on the MRL to release it from the chassis wall.
b.Lift the edge of the MRL and rotate it upward 90 degrees until it rests against the chassis
wall and the PCI/PCI-X/PCIe card bulkhead filler is fully exposed.
4.Remove the PCI/PCI-X/PCIe bulkhead filler.
2
3
Compatible
New card
running at PCI
Compatible
New card running
at PCI 66
66
Incompatible
3
bus
4
Compatible
New card running
at PCI-X 66
2
Compatible
New card
running at PCI
66
2
Compatible
New card
running at PCI-X
2
Compatible
New card running
at PCI 66
2
Compatible
New card running
at PCI-X 66
2
2
66
54Installing the System
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5.Insert the PCI/PCI-X/PCIe card into the empty slot and exert firm, even pressure to seat the
card in the slot.
CAUTION:Ensure that you fully seat the card into the slot or the card can fail after power
is reapplied to the slot.
6.Connect all internal and external cables to the PCI/PCI-X card.
7.Close the MRL.
a.Rotate the MRL downward 90 degrees.
b.Push the edge of the MRL down until it clicks into place on the PCI/PCI-X/PCIe card
bulkhead.
8.Close the gate latch to secure the end of the card if it is full length.
9.Replace the top cover. See “Removing and Replacing the Top Cover” (page 45).
Removing and Replacing the Memory Carrier Assembly
The memorycarrier assembly encloses the system DIMMs. There is one memory carrier assembly
that is available for the server, the 48-DIMM memory carrier assembly.
The memory carrier assembly has two sides, 0 and 1, each of which contain a 24-DIMM memory
board. System DIMMs seat onto the memory boards.
Table 23 lists the supported memory carrier assembly configurations.
CAUTION:Observe all ESD safety precautions before attempting this procedure. Failure to
follow ESD safety precautions can result in damage to the server.
Removing the Memory Carrier Assembly
WARNING!Ensure that the system is powered off and all power sources have been
disconnected from the server prior to performing this procedure.
Voltages are present at various locations within the server whenever an AC power source is
connected. This voltage is present even when the main power switch is in the off position.
Failure to observe this warning can result in personal injury or damage to equipment.
To remove the memory carrier assembly, follow these steps:
1.Unlatch the cover release lever on the top cover and remove the memory carrier assembly
cover. See “Removing and Replacing the Memory Carrier Assembly Cover” (page 47).
NOTE:You do not need to fully remove the top cover to service this component; however,
the top cover release lever must be open.
1 X 24-DIMM memory board24-DIMM memory carrier (configuration 1)
2 X 24-DIMM memory boards48-DIMM memory carrier (configuration 2)
2.Press the button located in the center of the memory carrier assembly to release the extraction
handles (Figure 24).
CAUTION:Manipulate the extraction handles with care. Failure to observe this caution
can result in damage to the extraction handles.
Installing Additional Components55
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3.Pull up on the extraction handles and rotate them outward 90 degrees (Figure 24) until they
click open.
4.Lift the memory carrier assembly out of the chassis (Figure 24).
NOTE:To avoid damage to the handles, Hewlett Packard Enterprise recommends rotating
the handles inward and snapping them into place when servicing the system DIMMs or any
time the carrier is out of the chassis. Before replacing the memory carrier, press the button
to release the extraction handles. Use the handles to replace the memory carrier into the
chassis.
Figure 24 Removing and Replacing the Memory Carrier Assembly
Replacing the Memory Carrier Assembly
CAUTION:Ensure the processor board assembly is fullyseated before you replace the memory
carrier assembly. The processor board assembly access door must be flush with the front bezel.
To replace the memory carrier assembly, follow these steps:
1.Ensure that the extraction handles are positioned in the outward, unlocked position.
2.Align the memory carrier assembly with the front and rear chassis guide slots.
NOTE:Assembly side 0 is on the left, and assembly side 1 is on the right as viewed from
the front of the chassis.
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3.Slide the memory carrier assembly into the chassis until it begins to seat into the socket
located on the processor board.
CAUTION:Do not apply excessive force when closing the extraction handles and seating
the memory carrier assembly into the socket on the processor board. Manipulate the
extraction handles with care; failure to observe these cautions can result in damage to the
extraction handles and other server components.
4.Rotate the extraction handles inward and press the handles straight down until they snap
into the locked position.
5.Replace the memory carrier assembly cover and latch the top cover release lever. See
“Removing and Replacing the Memory Carrier Assembly Cover” (page 47).
Installing System Memory DIMMs
System memory DIMMs are located on a pair of memory boards inside the memory carrier
assembly.
WARNING!Ensure that the system is powered off and all power sources have been
disconnected from the server prior to performing this procedure.
Voltages are present at various locations within the server whenever an AC power source is
connected. This voltage is present even when the main power switch is in the off position.
Failure to observe this warning can result in personal injury or damage to equipment.
CAUTION:Observe all ESD safety precautions before attempting this procedure. Failure to
follow ESD safety precautions can result in damage to the server.
Figure 25 shows the memory carrier assembly removed from the chassis.
Installing Additional Components57
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Figure 25 Memory Carrier Assembly
Figure 26 shows the memory carrier with the side cover open.
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Figure 26 Memory Carrier Assembly with Side Cover Open
Memory Installation Conventions
Before installing memory, read and understand the following memory installation conventions:
•Supported DIMM sizes and memory configurations
•DIMM load order
•DIMM slot IDs
Supported DIMM Sizes and Memory Configurations
The standard server configuration includes a 48-DIMM memory carrier, which contains one or
two 24-DIMM memory boards.
System DIMMs seat onto the memory boards. The minimum server configuration requires at
least one memory quad, or group of four DIMMs.
The following are the supported DIMM sizes for the server:
•512 MB
•1 GB
•2 GB
•4 GB
•8 GB
Table 24 lists the supported memory configurations for the server.
Installing Additional Components59
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Table 24 Memory Configuration Requirements
Maximum Memory
Configuration
192 GB (six quads:
24x8-GB DIMMs)
384 GB(12 quads: 48x8-GB
DIMMs)
24-DIMM memory carrier
(configuration 1)
48-DIMM memory carrier
(configuration 2)
Memory Boards InstalledMemory Carrier Type
1 X 24-DIMM memory
board
2 X 24-DIMM memory
boards
Minimum Memory
Configuration
2 GB (one quad: four
512-MB DIMMs)
2 GB (one quad: four
512-MB DIMMs)
Memory Load Order
When installing memory, use a minimum of one quad of like-sized DIMMs. Insert additional
DIMMs into the 48-DIMM memory carrier in the next available quad, in order of capacity from
largest to smallest.
Install DIMMs into the appropriate slots on the 48-DIMM memory carrier boards; each slot has
a unique ID. Use Figure 27 to determine where to install DIMMs on the memory carrier board.
CAUTION:Failure to observe these cautions results in system degradation or failure.
•Do not mix DIMM sizes or types within a quad.
•Load DIMM quads in order of size from largest to smallest. For example, if you have a quad
of 2 GB DIMMs and a quad of 1 GB DIMMs, install the quad of 2 GB DIMMs first.
24-DIMM Memory Carrier Load Order
For a single 24-DIMM memory board configuration, load DIMMs in order from quad 0 to quad 5.
48-DIMM Memory Carrier Load Order
The 48-DIMM memory carrier has two sides,labeled side 0 andside 1, each of whichcan contain
a memory carrier board. The 48-DIMM memory carrier can contain up to 12 quads of memory.
DIMM quads are loaded in order of capacity from largest to smallest.
The DIMM slot IDs are the same for both 24-DIMM memory carrier boards. Unique slots are
identified within the carrier by the side in which they reside. For example, slot 0A is identified as
slot 0A, side 0; or slot 0A, side 1.
Figure 27 shows the DIMM slot IDs for the 48-DIMM memory carrier board.
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Figure 27 48-DIMM Memory Carrier Board Slot IDs
Memory Loading Rules and Guidelines
Use the following rules and guidelines when installing memory:
•Install DIMMs in quads.
•Ensure that all DIMMs within a quad are identical.
•Install quads in orderof capacity fromlargest tosmallest. For example,install all 2GB quads
before 1 GB or smaller quads, and install all 1 GB quads before 512 MB quads.
•Side 0 must have equal or greater memory capacity than side 1.
•Install DIMM quads based on the following rules:
Load quads into either side of the memory carrier in order, starting with quad 0 and
1.
ending with quad 5.
2.Install the first quad in side 0, quad 0.
3.Install the second quad in side 1, quad 0.
4.For the remaining quads:
Installing Additional Components61
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a.If both sides of the memory carrier contain the same capacity of memory, install
the next quad in side 0.
b.If side 0 contains more memory capacity, even though it may have less DIMMs
than side 1, install the next quad in side 1.
c.If side 1 is full, install the remaining quads in side 0.
Table 25 shows several examples of proper memory carrier loading order.
IMPORTANT:The number in parenthesis indicates the order in which the quads are loaded.
Table 25 48-DIMM Memory Carrier Loading Examples
Memory Carrier Side 1Memory Carrier Side 0Quad Slot IDsQuad Number
Example 1
2 GB DIMMs (2)2 GB DIMMs (1)0A; 0B; 0C; 0D0
2 GB DIMMs (4)2 GB DIMMs (3)1A; 1B; 1C; 1D1
1 GB DIMMs (6)1 GB DIMMs (5)2A; 2B; 2C; 2D2
1 GB DIMMs (8)1 GB DIMMs (7)3A; 3B; 3C; 3D3
512 MB (10)512 MB (9)4A; 4B; 4C; 4D4
512 MB (12)512 MB (11)5A; 5B; 5C; 5D5
Example 2
Example 3
Installing Memory
1 GB DIMMs (2)2 GB DIMMs (1)0A; 0B; 0C; 0D0
1 GB DIMMs (3)1 GB DIMMs (4)1A; 1B; 1C; 1D1
512 MB (5)512 MB (7)2A; 2B; 2C; 2D2
512 MB (6)512 MB (9)3A; 3B; 3C; 3D3
512 MB (8)4A; 4B; 4C; 4D4
512 MB (10)5A; 5B; 5C; 5D5
512 MB (2)2 GB DIMMs (1)0A; 0B; 0C; 0D0
512 MB (3)512 MB (6)1A; 1B; 1C; 1D1
512 MB (4)512 MB (8)2A; 2B; 2C; 2D2
512 MB (5)3A; 3B; 3C; 3D3
512 MB (7)4A; 4B; 4C; 4D4
512 MB (9)5A; 5B; 5C; 5D5
IMPORTANT:You must pull the AC power plugs on the server every time you modify the
DIMMs. If you do not pull the AC power plugs, the system does not display the correct DIMM
information.
To install memory, follow these steps:
62Installing the System
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1.Unlatch the cover release lever on the top cover and remove the memory carrier assembly
cover. See “Removing and Replacing the Memory Carrier Assembly Cover” (page 47).
NOTE:You do not need to fully remove the top cover to service this component. However,
the top cover release lever must be open.
2.Remove the memory carrier assembly. See “Removing and Replacing the Memory Carrier
Assembly” (page 55).
NOTE:To avoid damage to the handles, Hewlett Packard Enterprise recommends rotating
the handles inward and snapping them into place when servicing the system DIMMs or any
time the carrier is out of the chassis. Before replacing the memory carrier, press the button
to release the extraction handles. Use the handles to replace the memory carrier into the
chassis.
3.Complete the following memory installation prerequisite tasks before installing the memory:
a.Determine the DIMM load order for the 48-DIMM memory carrier. For more information,
see “Memory Load Order” (page 60).
b.Use Figure 27 to determine the DIMM slots to populate.
c.Read, understand, and follow the general guidelines to install memory in the server.
See “Memory Loading Rules and Guidelines” (page 61).
4.Lay the memory carrier assembly on side 0 or side 1 so that the memory carrier side that
contains the DIMM slots that you will install DIMMs into faces upward (Figure 25).
5.Remove the memory carrier assembly side cover.
a.Press the release tabs (Figure 25) on both sides of the extraction handle release button
until the side cover releases from the top center of the assembly.
b.Rotate the side cover slightly to free the tabs from the retaining slots at the base of the
assembly (Figure 26).
c.Lift the side cover off the assembly.
Installing Additional Components63
Page 64
6.Install the DIMMs (Figure 28).
a.Align the DIMM with the slot located on the memory board, and align the key in the
connector with the notch in the DIMM.
b.Push on each end of the DIMM firmly and evenly until it seats into the slot.
c.Ensure that the extraction levers are in the fully closed position.
Figure 28 Inserting a DIMM into the Memory Board Connector
7.Replace the memory carrier assembly side cover.
a.Insert the side cover tabs into the retaining slots at the base of the assembly (Figure 26).
b.Insert the tabs (Figure 25) into the slots on both sides of the extraction handle release
button until the side cover snaps into place.
NOTE:To install DIMMs into slots on the other side of the memory carrier, turn the carrier
over to the opposite side (side 0 or side 1) and repeat the installation procedure.
8.Replace the memory carrier assembly and latch the top cover release lever. See “Removing
and Replacing the Memory Carrier Assembly Cover” (page 47).
Removing and Replacing the Processor Board Assembly
The processor board assembly holds one, two, three, or four dual-core Itanium processors and
is located beneath the disk drives and memory carrier assembly in the bottom service bay. The
64Installing the System
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processor board is mounted onto a removable carrier tray, which is retained in the service bay
by a hinged access door.
WARNING!Ensure that the system is powered off and all power sources have been
disconnected from the server prior to performing this procedure.
Voltages are present at various locations within the server whenever an AC power source is
connected. This voltage is present even when the main power switch is in the off position.
Failure to observe this warning can result in personal injury or damage to equipment.
CAUTION:Observe all ESD safety precautions before attempting this procedure. Failure to
follow ESD safety precautions can result in damage to the server.
Removing the Processor Board Assembly
To remove the processor board assembly, follow these steps:
1.Unlatch the cover release lever on the top cover and remove the memory carrier assembly
cover. See “Removing and Replacing the Top Cover” (page 45). You do not need to fully
remove the top cover to service this component; however, the top cover release lever must
be open.
2.Remove the memory carrier assembly. See “Removing and Replacing the Memory Carrier
Assembly Cover” (page 47).
NOTE:You must remove the memory carrier because it attaches directly to the processor
board.
3.Press the button located on top of the bezel, directly in front of the memory carrier assembly
to release the processor board access door (Figure 29).
CAUTION:The processor board access door opens at a 30 degree angle. Do not force
the door to open to a greater angle. Failure to observe this warning results in damage to
server components.
4.Use the processor board assembly access door as a handle and gently slide the assembly
out of the chassis approximately six inches.
5.Grasp the handholds on the assembly carrier tray with both hands and carefully slide the
assembly out of the chassis (Figure 29).
Installing Additional Components65
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Figure 29 Removing the Processor Board Assembly
Replacing the Processor Board Assembly
To replace the processor board assembly, follow these steps:
1.Remove the processor board assembly.
2.Align the edges of the processor board assembly with the assembly guides in the chassis.
3.Slide the processor board assembly into the chassis until it begins to seat into the socket
located on the midplane board.
4.Push the processor board access door upward until it locks into position.
5.Replace the memory carrier assembly. See “Removing and Replacing the Memory Carrier
Assembly” (page 55).
6.Replace the memory carrier assembly cover and latch the top cover release lever closed.
See “Removing and Replacing the Memory Carrier Assembly Cover” (page 47).
Installing a Dual-Core Processor
The server uses dual-core processors. Each processor contains two cores that function as
separate processors. Dual-core processors double the processing power of the server while
maintaining the physical dimensions of a single processor.
The server can contain one, two, three, or four dual-core processors that provide the following
configuration options:
•1P/2C (One processor/two cores)
•2P/4C (Two processors/four cores)
66Installing the System
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•3P/6C (Three processors/six cores)
•4P/8C (Four processors/eight cores)
If the server has fewer than the maximum number of dual-core processors installed, install the
processors in the appropriate slot.
WARNING!Ensure that the system is powered off and all power sources have been
disconnected from the server prior to performing this procedure.
Voltages are present at various locations within the server whenever an AC power source is
connected. This voltage is present even when the main power switch is in the off position.
Failure to observe this warning can result in personal injury or damage to equipment.
CAUTION:Ensure that processor speed and cache size are identical for all processors. Failure
to observe this caution results in performance degradation or system failure.
To ensure compatibility, Hewlett Packard Enterprise recommends that you use dual-core
processors with identical part numbers.
CAUTION:Observe all ESD safety precautions before attempting this procedure. Failure to
follow ESD safety precautions can result in damage to the server.
Processor Load Order
You can install up to four dual-core processors on the processor board. If fewer than the maximum
number of dual-core processors are installed (one, two, or three in the Integrity rx6600 server),
install them in the designated locations on the processor board.
The slots on the processor board are labeled Module 0, Module 1, Module 2, and Module 3. The
Module 0 and Module 1 slots are located on the top of the processor board assembly, and the
Module 2 and Module 3 slots are located on the underside of the processor board assembly.
IMPORTANT:Use the supplied handholds to turn the processor board assembly over if you
are servicing the Module 2 or Module 3 slots.
Install the first processor in the Module 0 slot. Install the second dual-core processor in the Module
1 socket, and so on. The load sequence is described in Table 26.
Table 26 Processor Load Order
Required Tools
To install and remove processors, use the processor install tool fastened to the processor board.
Installing a Dual-Core Processor
Prior to installing a dual-core processor into the server, read the following instructions carefully
and refer to the figures in this chapter for a complete understanding of this process. To install a
dual-core processor, follow these steps:
1.Remove the memory carrier assembly cover. See “Removing and Replacing the Memory
Carrier Assembly Cover” (page 47). You do not need to fully remove the top cover to service
this component; however, the top cover release lever must be open.
SlotDual-Core Processor
Module 01
Module 12
Module 23
Module 34
Installing Additional Components67
Page 68
2.Remove the memory carrier assembly. See “Removing and Replacing the Memory Carrier
Assembly” (page 55).
NOTE:You must remove the memory carrier assembly because it attaches directly to the
processor board.
3.Remove the processor board assembly. See “Removing and Replacing the Processor Board
Assembly” (page 64).
4.Open the processor cage (Figure 30).
a.Grasp the processor cage handle and rotate the handle upward.
b.Use the handle to rotate the cage closure 90 degrees toward the front of the assembly
until it stops.
IMPORTANT:Ensure the processor slot is entirely exposed. The processor must clear
the cage closure for proper installation.
5.Locate the appropriate processor slot (Module 0 or Module 1) to install the processor into
(Figure 30).
6.Remove the plastic airflow blocker covering the processor slot if required.
7.Remove the ZIF socket cover from the processor socket if required.
8.Ensure that the cam on the processor socket lock is in the unlocked, counterclockwise
position (Figure 32). The ZIF socket for the processor is locked and unlocked by half a turn
of the processor install tool. Rotate the cam counterclockwise 180 degrees (half turn) to
unlock the socket.
CAUTION:Attempting to turn the locking mechanism more than 180 degrees can severely
damage the socket.
9.Remove any protective packaging from the processor.
NOTE:Protective covers are installed to protect connector pins. Save the covers for future
use.
10. Inspect the processor pins and verify that the pins are not bent.
11. Align the alignment holes on the processor with the alignment posts on the processor cage,
and carefully lower the processor onto the processor socket (Figure 32 and Figure 33).
CAUTION:Do not press the processor into the socket. When properly aligned, the
processor pins seat into the socket. No additional pressure is required. You can damage
the pins if you apply too much pressure.
12. Lock the processor into the socket on the processor board (Figure 33).
a.Unfasten the processor installtool (2.5-mm driver) from the tool holderon theprocessor
board.
b.Insert the processor tool into the hole that runs down the side of the heatsink.
c.Rotate the processor tool clockwise 180 degrees.
CAUTION:Attempting to turn the locking mechanism more than 180 degrees can
severely damage the socket.
d.Refasten the processor install tool to the tool holder on the processor board.
13. Reconnect the processor power cable into the connector cable that attaches directly to the
processor board (Figure 31).
68Installing the System
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14. Close the processor cage (Figure 30).
a.Grasp the processor cage handle and rotate the cage closure inward toward the rear
of the assembly until it is completely closed.
b.Push the handle down until it is flush with the cage.
15. Replace the processor board assembly. See “Removing and Replacing the Processor Board
Assembly” (page 64).
16. Replace the memory carrier assembly. See “Removing and Replacing the Memory Carrier
Assembly” (page 55).
17. Replace the memory carrier assembly cover and latch the top cover release lever closed.
See “Removing and Replacing the Memory Carrier Assembly Cover” (page 47).
Figure 30 Installing a Dual-Core Processor on the Processor Board
Figure 31 shows the power connector and cable for the processor.
Installing Additional Components69
Page 70
Figure 31 Processor Power Cable
Figure 32 shows the processor socket lock/unlock mechanism and alignment post locations
without a processor installed.
70Installing the System
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Figure 32 Processor Alignment Posts and Lock/Unlock Mechanism
Figure 33 shows the processor lock/unlock mechanism location and the alignment holes with
the processor installed.
Installing Additional Components71
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Figure 33 Processor Alignment Holes and Lock/Unlock Mechanism
Installing the Server into a Rack or Pedestal Mount
This section provides instructions on how to install the server into a rack or pedestal mount.
Installing the Server into a Rack
The following information describes how to install the server into a Hewlett Packard Enterprise
rack or an approved non-Hewlett Packard Enterprise rack.
Hewlett Packard Enterprise Rack
Hewlett Packard Enterprise servers that are installed into racks are shipped with equipment
mounting slides. An installation guide comes with each set of slides: HPE 3-7U Quick Deploy
72Installing the System
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Rail System Installation Instructions for Hewlett Packard Enterprise Products. Follow the steps
in this installation guide to determine where and how to install the server into the rack.
The following are additional instructions for installing the server into the rack:
1.The cable management arm (CMA) is factory configured to mount on the left side of the
server as viewed from the rear of the chassis. You must switch the CMA to a right-mount
configuration. Mount the CMA on the right side of the server to ensure easy removal of the
power supplies.
2.Remove two T25 screws from the server bezel; one screw from the same location on each
side of the server. The screws are located behind the pull handles.
Non-Hewlett Packard Enterprise Rack
The Guide for Evaluating the Installation of Hewlett Packard Enterprise Equipment in Non-Hewlett
Packard Enterprise Racks enables you to evaluate the installation of Hewlett Packard Enterprise
equipment into non-Hewlett Packard Enterprise racks. Use this guide when you need to qualify
whether you can install, maintain, and service any Hewlett Packard Enterprise equipment in a
non-Hewlett Packard Enterprise rack.
The Guide for Evaluating the Installation of Hewlett Packard Enterprise Equipment in Non-Hewlett
Packard Enterprise Racks is located on the web at http://www.hpe.com/info/rackandpower.
Select mounting information from the menu, then select Mounting in non-HP racks.
Installing the Server into a Pedestal Mount
The server ships with a pedestal mount if you order the rackless configuration option. The pedestal
mount is packaged in a separate carton that is attached to the server carton.
To change the server from a rack mount to a rackless configuration, you need a Server Rackless
Mount Kit. The rackless mount kit comes with the Integrity rx6600 Rack to Pedestal Conversion
Guide . Follow the steps in the Integrity rx6600 Rack to Pedestal Conversion Guide to attach the
pedestal mount to the server.
Connecting the Cables
This section provides information on the cables that power the server and provide LAN connectivity
for the server.
AC Input Power
The server can receive AC input from two different AC power sources. If two separate power
sources are available, you can plug the server into the separate power sources, increasing system
reliability if one power source fails. The power receptacles are located at the rear of the chassis.
They are labeled PWR 0 and PWR 1.
You can install a maximum of two bulk power supplies (BPS) in the server. Installing two BPSs
in the server provides 1+1 redundancy, meaning that if one BPS fails, there is still enough power
supplied to the server for it to remain operational. You must promptly replace the failed BPS to
restore 1+1 functionality.
A minimum of one BPS is required to power the server. There is no 1+1 capability if only one
BPS is present.
Power States
The server has three power states:
•Standby power
•Full power
•Off
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Plug the power cord into the appropriate receptacle on the rear of the chassis to achieve the
standby power state; the front panel Power button is not turned on. Full power occurs when the
power cord is plugged into the appropriate receptacle, and either the power is activated through
the iLO 2 MP PC command, or the Power button is activated. In the off state, the power cords
are not plugged in.
Table 27 lists the server power states.
Table 27 Power States
Power States
Power Cable
Plugged Into
Receptacle
Power Activated through the iLO 2 MP
PC Command or Front Panel Power
Button Activated
AC Voltage
Applied
NOTE:If the power restore feature is set to Always On through the iLO 2 MP PR command,
the server can automatically power on to the full power state.
Attaching the Hook-and-Loop Strap to the Bulk Power Supply and Power Cord
CAUTION:If you do not fasten the hook-and-loop strap to the bulk power supply and the power
cord, the power cord might pop off the back.
To attach the hook-and-loop strap to the bulk power supplies and power cord, follow these steps:
1.Attach the hook-and-loop strap to the handle on the bulk power supply.
2.Attach the other end of the strap to the power cord (Figure 34).
Figure 34 Fastening the Power Supply
DC Voltage
Applied
NoYesNoYesStandby power
YesYesYesYesFull power
NoNoNoNoOff
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Applying Standby Power to the Server
To apply standby power to the server, follow these steps:
1.Locate the appropriate receptacle on the rear of the chassis. Plug the power cord into the
receptacle.
IMPORTANT:If the server has one BPS, plug the power cable into the receptacle labeled
PWR 1.
2.Observe the following LEDs at two different intervals to ensure the server is in the standby
power state:
INTERVAL ONE
After you plug the power cord into the server, the BPS flashes amber and an amber light is
present on the hard disk drives.
INTERVAL TWO
Approximately 30 seconds later, the BPS flashes green and the amber light is still present
on the hard disk drives. Standby power is now on.
LAN
The server has two LAN ports that can provide network connectivity. Figure 35 shows the available
LAN ports for the server.
Figure 35 Rear Panel LAN Ports
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To enable general network connectivity for the server, follow these steps:
1.Obtain valid IP addresses for each LAN port you plan to activate.
2.Connect the LAN cable from an available LAN port to a live connection on the network.
Console Setup
Setting up the console involves the following:
1.Determining the physical access method to connect cables. There are two physical
connections to the Integrity iLO 2 MP:
•RS-232 serial port
•iLO 2 MP LAN port
2.Configuring the Integrity iLO 2 MP and assigning an IP address if necessary. Though there
are several methods to configuring the LAN, DHCP with DNS is the preferred one. DHCP
with DNS comes preconfiguredwith default factory settings,including a defaultuser account
and password. Other options include:
•ARP-Ping
•RS-232 serial port
Overview
A console is a tool consisting of display and input devices used to locally and remotely monitor
and control the server. The console enables interaction with the following manageability,
configuration, and diagnostic tools:
•Integrated Lights-Out 2 Management Processor (iLO 2 MP). Provides a way to connect to
the server and perform administration or monitoring tasks for the server hardware. It controls
power, reset, and Transfer of Control (TOC) capabilities; provides console access; displays
and records system events; and displays detailed information about internal subsystems.
The iLO 2 MP is available whenever the system is connected to a power source, even if the
server main power switch is turned off.
NOTE:For more information on iLO 2, see the HPE Integrity Integrated Lights-Out 2
Operations Guide.
•Extensible Firmware Interface (EFI). Provides an interface between the operating system
and the firmware. Use the EFI to configure options, such as the server boot order, before
the server loads an operating system.
Table 28 lists the elements required to start a console session.
Table 28 Elements Required to Start a Console Session
DescriptionConsole Element
AC power (standby power)
The server must haveAC power to provide consolefunctionality.
See “Applying Standby Power to the Server” (page 75).
Includes the iLO 2 MP and console cable connectors.Server hardware components
Links the server console to the console device.Console cable
Console device
Console emulation software
76Installing the System
Provides display and inputfunctionality using components such
as monitors, keyboards, and mouse devices.
Emulates the output from the server console and displays the
output on the console device screen.
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Setup Checklist
Use the checklist in Table 29 to assist you with the console setup process.
Table 29 Setup Checklist
Standard and Advanced
Preparation11. Determine access method to select and connect cables.
XActionStep
2. Determine LAN configuration method and assign IP address
if necessary.
Configure the iLO 2 MP LAN2
Log on to the iLO 2 MP3
Change default user name and
4
password
Advanced
1
For details on Advanced Pack Features, see the HPE Integrity iLO 2 Operations Guide.
Setup Flowchart
Use this console setup flowchart as a guide to assist in the console setup process.
There are three methods to configure the LAN for iLO 2 MP
access:
• DHCP with DNS
• ARP Ping
• RS-232 serial port
Log into the iLO 2 MPfrom a supported web browseror command
line using the default user name and password.
Change the default user name and password on theadministrator
account to your predefined selections.
Set up the user accounts if using the local accounts feature.Set up user accounts5
Set up the security access settings.Set up security access6
Access the host console using method of choice.Access the host console7
1
Activate advanced features by entering a license key.Activate Advanced Pack Features
Console Setup77
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Figure 36 Setup Flowchart
Preparation
There are several tasks to perform before you can configure the iLO 2 MP LAN.
•Determine the physical access method to select and connect cables.
•Determine the iLO 2 MP LAN configuration method and assign an IP address if necessary.
Determining the Physical iLO 2 MP Access Method
Before you can access the iLO 2 MP, you must first determine the correct physical connection
method. The iLO 2 MP has a separate LAN port from the system LAN port. It requires a separate
LAN drop, IP address, and networking information from that of the port used by the operating
system (Figure 37).
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Figure 37 Server Rear Ports
1
iLO 2 MP RS-232 Serial
Port (DB-9Fto DB-9Fcable)
Connected to emulation
terminal device (PC, laptop,
or ASCII terminal)
2
General Use Serial Port
USB 2.0 Ports
(any USB device)
4
iLO 2 MP LAN Port
(10/100 LAN)
(Printers, etc.)
Use Table 30 to determine your physical connection method. Table 30 lists the appropriate
connection method, required connection components, and connectors to the host console.
Table 30 Physical Connection Matrix
Required Connection ComponentsConnection Method
RS-232 serial port1. Host console
2. RS-232 serial port DB-9F to DB-9F cable
3. Emulation terminal device (for example, a PC, laptop, or ASCII terminal)
10/100 LAN cableLAN port
Determining the iLO 2 MP LAN Configuration Method
To access the iLO 2 MP through the iLO 2 MP LAN, the iLO 2 MP must acquire an IP address.
The way the iLO 2 MP acquires an IP address is dependent upon whether DHCP is enabled or
disabled on the server, and if DHCP and DNS services are available to the server. (See Table 31
for possible scenarios.)
53
VGA Port
No iLO 2 MP access; EFI
only
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Once you have determined the iLO 2 MP access, you must determine how you will configure the
iLO 2 MP LAN in order to acquire an IP address. There are three methods available.
•DHCP/DNS
•ARP Ping
•RS-232 serial port
Table 31 provides all the possible scenarios to consider. Use this table to help you select the
appropriate LAN configuration method to obtain an IP address.
Table 31 LAN Configuration Methods
DNSDHCP
LC command)
LAN Configuration MethodRS-232 Serial Port (MP
DHCPNoYesYes
DHCP or RS-232 serial portYesYesYes
ARP PingNoNoNo
ARP PingNoYesNo
ARP Ping or RS-232YesYesNo
RS-232 serial portYesNoYes
RS-232 serial port or ARP PingYesNoNo
Cannot set up the LAN. Reconsider your criteria.NoNoYes
Once you have determined how you will configure the iLO 2 MP LAN in order to acquire an IP
address, you must configure the iLO 2 MP LAN using the selected method.
Configuring the iLO 2 MP LAN Using DHCP and DNS
DHCP automatically configures all DHCP-enabled servers with IP addresses, subnet masks,
and gateway addresses. All Integrity entry class servers with the iLO 2 MP are shipped from the
factory with DHCP enabled.
Hewlett Packard Enterprise recommends using the DHCP and DNS method to simplify access
to the iLO 2 MP.
NOTE:You can use ARP Ping regardless of the status of DHCP unless an IP address has
ever been acquired using DHCP. Once an IP address is assigned using DHCP, ARP Ping is
permanently disabled.
When you use DHCP and DNS, you can connect to the iLO 2 MP by entering the default host
name in your browser rather than an IP address only if the following applies:
•DHCP must be enabled (DHCP is enabled by default).
•You are using a DHCP server that provides the domain name.
•The primary DNS server accepts dynamic DNS (DDNS) updates.
•The primary DNS server IP address has been configured through the DHCP server.
IMPORTANT:You must know the DNS domainname, which is served outby the DHCPserver,
unless it’s domain is local or the same domain.
To configure the iLO 2 MP using DHCP and DNS, follow these steps:
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1.Obtain the factory-set host name from the iLO 2 MP Media Access Protocol (MAC) address
label on the server. The default host name is 14 characters long, consisting of the letters
mp followed by the 12 characters of the MAC address (example: mp0014c29c064f). This
address is assigned to the iLO 2 MP core IO board. The core IO board has a unique MAC
address that identifies the hardware on the network.
IMPORTANT:Make sure you obtain the MAC address to the core IO board and not the
MAC address to the server core LAN card.
2.Connect the LAN cable from the server to an active network port.
3.Apply AC power to the server.
4.Open a browser, telnet, or SSH client and enter the default host name. The default host
name is the letters mp followed by the 12 characters of the MAC address. The iLO 2 MPLog In window opens.
5.Log in using the default user name and password.
CAUTION:When DHCP is enabled, the system is vulnerable to security risks because anyone
can access the iLO 2 MP until you change the default user name and password.
Hewlett Packard Enterprise strongly recommends you assign user groups and rights before
proceeding.
Configuring the iLO 2 MP LAN Using ARP Ping
NOTE:You can use ARP Ping regardless of the status of DHCP unless an IP address has
ever been acquired using DHCP. Once an IP address is assigned using DHCP, ARP Ping is
permanently disabled. Some DHCP server options can cause the apparent issuance of ARP
Ping to the iLO 2 MP which will negate the DHCP/DDNS method.
The Address Resolution Protocol (ARP) and Packet Internet Grouper (Ping) utility uses ARP
packets to ping, or discover, a device on the local network segment. The IP address you assign
to the server must use the same network segment, or subnet, as the computer assigning the
address. ARP does not work across routed or switched networks.
Use the ARP Ping utility to assign a static IP addresswhen you do not have accessto the RS-232
serial port or when DHCP is not available.
NOTE:ARP Ping operational issues:
•The PC and the server must be on the same physical subnet.
•When a new server is first booted, DHCP is automatically available (factory-set default); but
ARP Ping does not start for three minutes after the iLO 2 MP is booted. This applies to every
subsequent boot of the iLO 2 MP until an IP address is obtained by DHCP or has been
assigned by using the LC command.
•Upon successfully assigning an IP address using ARP Ping, DHCP is automatically disabled.
There are two methods to use the ARP Ping utility:
1.Connect a PC to the network that is on the same physical subnet as the server and run the
ARP Ping commands from the PC.
2.Locate an existing server on the network, log into it, and run the ARP Ping commands from
the server.
Table 32 lists the ARP Ping commands.
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Table 32 ARP Ping Commands
DescriptionARP Command
arp -s
ping
This command assign the IP address to the iLO 2 MP MAC address. This ARP table entry
maps the MAC address of the iLO 2 MP LAN interface to the static IP address designated for
that interface.
This command tests network connections. It verifies the iLO 2 MP LAN port is configured with
the appropriate IP address.
The following procedure explains how to use the ARP Ping utility using a PC that is connected
to the network that is on the same physical subnet as the server.
To configure a static IP address using the ARP Ping utility, follow these steps:
1.Obtain the iLO 2 MP MAC address. To set the IP address using ARP, you must know the
MAC address of the iLO 2 MP LAN. You can find the MAC address of the iLO 2 MP LAN on
a label on the server.
IMPORTANT:Make sure you obtain the MAC address to the iLO 2 MP LAN and not the
MAC address to the server core LAN.
2.Verify that an active LAN cable on the local subnet is connected to the iLO 2 MP LAN port
on the server.
3.Access a PC on the same physical subnet as the server.
4.Open a DOS window on the PC.
5.At the DOS prompt, enter arp -s to assign the IP address to the iLO MAC address.
Syntax
arp -s <IP address you want to assign to the iLO MAC address> <iLO 2
MAC address>
Example from Windows
arp -s 192.0.2.1 00-00-0c-07-ac-00
6.At the DOS prompt, enter ping followed by the IP address to verify that the iLO 2 MP LAN
port is configured with the appropriate IP address. The destination address is the IP address
that is mapped to the iLO MAC address. Perform this task from the PC that has the ARP
table entry.
Syntax
ping <IP address just assigned to the iLO MAC address>
Example from Windows
ping 192.0.2.1
7.Use the IP address to connect to the iLO 2 MP LAN.
8.Use web or telnet access to connect to the iLO 2 MP from a host on the local subnet and
complete the rest of the LAN parameter (gateway, subnet).
Configuring the iLO 2 MP LAN Using the RS-232 Serial Port
To configure the iLO 2 MP LAN using the RS-232 serial port, follow these steps:
IMPORTANT:Do not configure duplicate IP addresses on different servers within the same
network. The duplicate server IP addresses conflict and the servers cannot connect to the network.
The LC command enables you to configure an IP address, host name, subnet mask, and gateway
address.
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IMPORTANT:Ensure you have a console connection through the RS-232 serial port or a
network connection through the LAN to access the iLO 2 MP and use the LC command.
To assign a static IP address using the LC command, follow these steps:
1.Ensure the emulation software device is properly configured. The terminal emulation device
runs software that interfaces with the server. The software emulates console output as it
would appear on an ASCII terminal screen and displays it on a console device screen. To
ensure the emulation software is correctly configured, follow these steps:
a.Verify that the communication settings are configured as follows:
•8/none (parity)
•9600 baud
•None (receive)
•None (transmit)
b.Verify that the terminal type is configured appropriately. Supported terminal types are:
•hpterm
•vt100
•vt100+
•vt-utf8
IMPORTANT:Do not mix hpterm and vt100 terminal types at the same time.
There are many different emulation software applications. Consult the help section of the
emulation software application for instructions on how to configure the software options.
2.Determine the required connection components, and the ports used to connect the server
to the console device.
3.Connect the cables from the appropriate ports to the server.
4.Start the emulation software on the console device.
5.Log in to the iLO 2 MP. See “Logging In to the iLO 2 MP” (page 83).
6.At the MP Main Menu, enter CM and press Enter to select command mode.
7.At the command mode prompt, enter LS and press Enter. The screen displays the default
LAN configuration values. Write down the default values, or log the information to a file. You
may need the information for future troubleshooting.
8.Use the LC command to disable DHCP.
a.From the LC command menu, enter D and press Enter.
b.Follow the instructions on the screen to change the DHCP status from Enabled to
Disabled.
c.Enter XD -R to reset the iLO 2 MP.
9.Use the LC command to enter information for the IP address, host, subnet mask, gateway
parameters, and so on.
10. Enter XD -R to reset the iLO 2 MP.
11. After the iLO 2 MP resets, log in to the iLO 2 MP again and enter CM at the MP:> prompt.
12. Enter LS to confirm that DHCP is disabled and display a list of updated LAN configuration
settings.
Logging In to the iLO 2 MP
To log in to the iLO 2 MP, follow these steps:
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1.Access the iLO 2 MP using the LAN, RS-232 serial port, telnet, SSH, or web method. The
iLO 2 MP login prompt displays.
2.Log in using the default the iLO 2 MP user name and password (Admin/Admin).
TIP:For security reasons, Hewlett Packard Enterprise strongly recommends you modify
the default settings during the initial login session. See “Modifying User Accounts and Default
Password” (page 84).
The following items are available from the MP Main Menu:
iLO MP MAIN MENU:
CO:Console
VFP:Virtual Front Panel
CM:Command Menu
CL:Console Logs
SL:Show Event Logs
SMCLP:Server Management Command Line Protocol
HE:Main Menu Help
X:Exit Connection
See the Integrity iLO 2 Operations Guide for information on the iLO 2 MP menus and commands.
When logging in using the local or remote RS-232 serial ports, the login prompt may not display
if another user is logged in through these ports. To access the MP Main Menu and the iLO 2 MP
prompt (MP>), press Ctrl-B.
Additional Setup
This section provides additional information to setup the iLO 2 MP.
Modifying User Accounts and Default Password
The iLO 2 MP comes preconfigured with default factory settings, including a default user account
and password. The two default user accounts on initial login are:
TIP:For security reasons, Hewlett Packard Enterprise strongly recommends you modify the
default settings during the initial login session.
Make the following changes using any of the iLO 2 MP user interfaces.
To modify default account configuration settings, follow these steps:
1.Log in as the administrator. You must log in as the administrator in order to modify default
user configuration settings
2.To modify default passwords:
a.Access the MP Main Menu.
b.Enter CM at the MP> prompt.
c.Enter UC at the MP:CM> prompt and follow the prompts to modify default passwords.
84Installing the System
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3.To setup user accounts:
a.Access the MP Main Menu.
b.Enter CM at the MP> prompt.
c.Enter UC at the MP:CM> prompt and follow the prompts to modify user accounts.
Setting Up Security
For greater security and reliability, Hewlett Packard Enterprise generally recommends that iLO
2 MP management traffic be on a separate dedicated management network and that only
administrators be granted access to that network. This not only improves performance by reducing
traffic load across the main network, it also acts as the first line of defense against security attacks.
A separate network allows administrators to physically control which workstations are connected
to the network.
Hewlett Packard Enterprise also strongly recommends you modify the default settings during the
initial logon session and determine the security access required and what user accounts and
privileges are needed. Create local accounts or use directory services to control user access.
See “Modifying User Accounts and Default Password” (page 84).
Security Access Settings
Determine the security access required and what user accounts and privileges are needed. The
iLO 2 MP provides options to control user access. Select one of the following options to prevent
unauthorized access to the iLO 2 MP:
•Change the default user name and password. See “Modifying User Accounts and Default
Password” (page 84)).
CAUTION:When DHCP is enabled, the system is vulnerable to security risks because
anyone can access the iLO 2 MP until you change the default user name and password.
Hewlett Packard Enterprise strongly recommends you assign user groups and rights before
proceeding.
•Create local accounts. You can store up to 19 user names and passwords to manage iLO
2 MP access. This is ideal for small environments such as labs and small-to-medium sized
businesses.
•Use directory services. Use the corporate directory to manage iLO 2 MP user access. This
is ideal for environments with a large number of frequently changing users. If you plan to
use directory services, Hewlett Packard Enterprise recommends leaving at least one local
account enabled as an alternate method of access.
Accessing the Host Console
This section provides information on the different methods of accessing the host console of an
Integrity server.
Accessing the iLO 2 MP With the Web Browser
Web browser access is an embedded feature of the iLO 2 MP.
The iLO 2 MP has a separate LAN port from the system LAN port. It requires a separate LAN
drop, IP address, and networking information from that of the port used by the operating system.
IMPORTANT:Make sure you use the MAC address to the iLO 2 MP LAN and not the MAC
address to the server core LAN.
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Before starting this procedure, you must have the following information:
•IP address for the iLO 2 MP LAN
•Host name (this is used when messages are logged or printed)
To interact with the iLO 2 MP through the web GUI, follow these steps:
1.Open a web browser and enter the host name or the IP address for the iLO 2 MP.
2.Log in using your user account name and password at the login page. (Figure 38).
Figure 38 Web Login Page
3.Click Sign In. The Status Summary page (Figure 39) displays after login.
Figure 39 Status Summary Page
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1.Select the web interface functions by clicking the Function tabs at the top of the page. Each
function lists options in the Navigation Bar on the left side of the page.
2.Click an option link to display data in the Display screen; and click Refresh to update the
display.
3.Click the Remote Console tab. The remote console provides the following options to access
the console:
•A serial console that behaves similarly to the TUI of the following section
•The virtual KVM console
Help
The iLO 2 MP web interface has a robust help system. To launch iLO 2 MP help, click the Help
tab in the Display screen or click the ? at the top right corner of each page to display help about
that page.
Accessing the Host Console With the TUI - CO Command
This section provides the steps to access the host console using the text user interface (TUI).
To access the host console through the iLO 2 MP, follow these steps:
1.Log in using your user account name and password at the login page.
2.At the iLO 2 MP login prompt (MP>), enter the CO command to switch the console terminal
from the MP Main Menu to mirrored/redirected console mode. All mirrored data is displayed.
3.To return to the iLO 2 MP command interface, press Ctrl-B, or Esc and +.
Accessing the Host Console With vKVM - Integrated Remote Console
For information on how to access the host console using the vKVM feature through the Integrated
Remote Console (IRC), see the Integrity iLO 2 Operations Guide.
Accessing the Host Console with the SMASH SM CLP
For information on how to access the host console using the SMASH SM CLP, see the Integrity
iLO 2 Operations Guide.
Accessing the Graphic Console Using VGA
VGA is a method you can use to access the graphic console.
NOTE:You cannot access iLO 2 using VGA.
This method requires three elements:
•Monitor (VGA connector)
•Keyboard (USB connector)
•Mouse (USB connector)
The graphic console output displays on the monitor screen.
IMPORTANT:The server console output does not display on the console device screen until
the server boots to the EFI Shell. Start a console session using the RS-232 serial port method
to view console output prior to booting to the EFI Shell or to access the iLO 2 MP. See “Configuring
the iLO 2 MP LAN Using the RS-232 Serial Port” (page 82).
To access the graphic console with VGA, follow these steps:
1.Perform preparation tasks.
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2.Connect the cables. See your user service guide for specific port information.
a.Connect the monitor VGA cable to the appropriate VGA port on your server.
b.Connect the keyboard USB cable to the appropriate USB port on your server.
c.Connect the mouse USB cable to the appropriate USB port on your server.
3.Power on the server. The EFI Shell prompt displays.
Powering Off and Powering On the Server
This section provides information and procedures for powering off and powering on the server.
For more information, see the operating system documentation.
Server Power Button
Figure 40 shows the server Power button.
Figure 40 Server Power Button
Power States
The server has three power states:
Standby powerPlug the power cord into the appropriate receptacle on the rear of the
Full powerFull power occurs when you plug the power cord into the appropriate
OffUnplug the power cords.
Table 33 lists the server power states.
88Installing the System
chassis; the front panel Power button is not turned on.
receptacle, and either activate the power using the iLO 2 MP PC command,
or press the Power button.
Page 89
Table 33 Power States
Power States
Power Cable
Plugged into
Receptacle
Powered On with the iLO 2 MP PC
Command, or Front Panel Power
Button Pressed
NOTE:If the power restore feature is set to Always On through the iLO 2 MP PR command,
the server can automatically power on to the full power state.
Powering Off the Server
Power off the server using the following methods:
•iLO 2 MP PC command
•Power button
Powering Off the Server Using the iLO 2 MP
To power off the server using the iLO 2 MP, follow these steps:
1.Gracefully shut down the operating system.
2.Initiate a console session and access the MP Main Menu.
3.Enter CM to enable command mode.
4.Enter PC to use the remote power control command.
5.Enter OFF to power off the server, and enter YES when prompted to confirm the action.
AC Voltage
Applied
DC Voltage
Applied
NoYesNoYesStandby power
YesYesYesYesFull power
NoNoNoNoOff
IMPORTANT:The main dc voltage is now removed from the system; however, AC voltage
for standby power is still present in the server.
6.Unplug all power cables from the receptacles on the rear panel of the server.
Powering Off the Server Manually
To manually power off the server, follow these steps:
1.Gracefully shut down the operating system.
2.Press the Power button to power off the server.
IMPORTANT:The main dc voltage is now removed from the system; however, AC voltage
for standby power is still present in the server.
3.Unplug all power cables from the receptacles on the rear panel of the server.
Powering On the Server
Power on the server to full power using the following methods if the server is in the standby power
state:
•iLO 2 MP PC command
•Power button
Powering On the Server Using the iLO 2 MP
NOTE:If the power restore feature is set to Always On through the iLO 2 MP PR command,
the server can automatically power on to the full power state.
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To power on the server using the iLO 2 MP, follow these steps:
1.Plug all power cables into the receptacles on the rear panel of the server.
2.Initiate a console session and access the MP Main Menu.
3.Enter CMto enable command mode.
4.Enter PC to use the remote power control command.
5.Enter ON to power on the server, and enter YES when prompted to confirm the action.
6.Start the operating system.
Powering On the Server Manually
NOTE:If the power restore feature is set to Always On through the iLO 2 MP PR command,
the server can automatically power on to the full power state.
To manually power on the server, follow these steps:
1.Plug all power cables into the receptacles on the rear panel of the server.
2.Press the Power button to start the server.
3.Start the operating system.)
Core I/O Card Configuration
This section provides information on core I/O cards that need to be configured during installation.
Integrated RAID
Use Integrated RAID (IR) where either storage capacity, redundancy, or both of a RAID
configuration are required. Two components of IR are:
•Integrated Mirror (IM)
•Global Hot Spare
To flash firmware, use the mptutil command. To configure and maintain the IR functionality
of the SAS controller on the Integrity server, use the drvcfg and cfggen EFI commands. If you
are scripting multiple devices, use thecfggencommand.
Integrated Mirror
The advantage of an IM is there is always a mirrored copy of the data. An IM provides data
protection for the system boot volume to safeguard critical information such as the operating
system on servers and high performance workstations. An IM supports two simultaneous mirrored
volumes, making an array, providing fault-tolerant protection for critical data. Typically, one of
these volumes is the boot volume. If a disk in an IM fails, the hot swap capability enables the
volume to be easily restored by replacing the failed disk. The firmware then automatically re-mirrors
to the replaced disk.
Global Hot Spare
Each SAS controller can have one global hot spare disk available to automatically replace a
failed disk in the one or two IM volumes configured on the controller. The hot spare makes the
IM array more fault tolerant. Up to two IM volumes are supported per SAS controller plus the hot
spare.
HPE 8 Internal Port SAS HBA (SAS Controller)
The following information is provided to assist you in configuring the 8 Internal Port SAS HBA
controller during installation.
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MPTUTIL Utility
The mptutil utility enables you to update the adapter flash memory with the EFI driver and
HBA firmware. New versions of these images are released periodically.
IMPORTANT:Do not store the files in this package on a SAS device. If you store these files
on a SAS device and the update fails, these files will not be accessible.
To update firmware, follow these steps:
1.Insert the HPE IPF Offline Diagnostics and Utilities CD in the drive and boot to the EFI Shell.
NOTE:You can also download the firmware image file and update utility from the Hewlett
Packard Enterprise Support Centre website: http://www.hpe.com/support/hpesc.
IMPORTANT:When you boot the EFI enabled systems, the CD containing the utility must
be in the drive to allow device mapping. The EFI utility and firmware image files are located
in the root directory or in a subdirectory on the CD.
2.The CD drive displays in the list of mapped devices as fs0. To change to this device, enter
fs0:
shell>fs0:\>
fs0:\>
3.To determine the current version of the firmware, follow these steps.
a.At the EFI Shell, enter mptutil from the directory that contains mptutil.efi. The
following example indicates that the EFI Serial Attached SCSI card utility version is
4.To update the firmware, use the mptutil command.
5.Reset the controller.
fs0:\> reset
The mptutil commands and functions are listed in Table 34 and described in the following
sections.
Table 34 mptutil Commands and Functions
FunctionCommand
Updating HBA RISC firmware on the controllermptutil -f <firmware_file>
Updating EFI driver on first controllermptutil -o -g <x86_file> <fcode_file>
Viewing VPD informationmptutil -o -vpd -c 0
Parameters in < > are optional. A space is required between command line options and their parameters.
The following sections describe the mptutil commands and functions.
Flashing Firmware on First Controller
To update the HBA RISC firmware on the first controller, follow these steps:
1.At the fs0:\> prompt, enter mptutil -f <firmware_file> -c 0.
Core I/O Card Configuration91
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2.At the fs0:\> prompt, enter reset.
The filename is optional and you are prompted for a filename if omitted.
Another way for the firmware to be flashed is done without your knowledge. When mptutil is
executed, and a SAS HBA is in any state other than ready or operational, mptutil immediately
performs a firmware download boot. The firmware provided by you to do the firmware download
boot is immediately flashed after the firmware download boot has completed. mptutil does
this because the firmware only moves to the operational state if it is running from flash and not
memory. Operational state is needed to do everything else provided in the utility.
Flashing BIOS and EFI Driver on the First Controller
To update the EFI driver on the first controller, follow these steps:
1.At the fs0:\> prompt, enter mptutil -o -g <Bios_File> <EFI_driver_file>
-c 0.
2.At the fs0:\> prompt, enter reset.
The filename is optional and you are prompted for a filename if omitted.
Common Questions About Flashing Firmware
QuestionAfter I update firmware on my SAS HBA, why doesn't the version string change in
the menu?
AnswerThe firmware you just flashed on the HBA does not run until a diagnostic reset
occurs. If you exit the utility and reenter it, the version string is updated.
QuestionThis image does not contain a valid nvdata when I try to flash the firmware, why?
AnswerYou are expected to concatenate a proper nvdata image on to the firmware.
mptutil keeps you from flashing an image without one. To concatenate nvdata
and firmware you need to run the mptutil -o -d
64it__l.fw,sas106x.dat,output.fw command. .
•64it__l.fw is the firmware image without a nvdata image
•sas106x.dat is the nvdata image. This file depends on the type or revision
of HBA on which the firmware is used
•output.fw is the name of the file created with the firmware and nvdata
concatenated. This concatenated image can be used for all boards of this type
or revision.
QuestionHow do I program multiple cards in a system from the command line?
Answermptutil (EFI) does not support this.
QuestionCan I program a new flash and option ROM in the same command line argument?
AnswerYes. Run the mptutil -f <firmware_name> -b <option_rom_name>
command.
Viewing the VPD Information for EFI Driver and RISC Firmware
To view the VPD information for the EFI driver and RISC firmware, enter mptutil -o -vpd
-c 0 at the fs0:\> prompt.
EFI Commands
To configure an Integrated Mirror (IM) Array on the SAS Controller, use the following EFI
commands:
•drvcfg(GUI interface)
•cfggen(command line interface)
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NOTE:If you are not using the IM functionality, do not follow these procedures.
DRVCFG Utility
To configure an IM on the SAS controller, follow these steps:
Starting the DRVCFG Utility
To start the drvcfg configuration utility, follow these steps:
1.Select the EFI Shell from the console menu.
2.Enter drvcfg -s and press Enter.
Using the DRVCFG Utility
The configuration utility uses several input keys (F1, F2, HOME, END, and so on) that may not
be supported by all terminal emulation programs. Each of these keys has an alternate key that
performs the same function. Review the terminal emulation program documentation to verify
which input keys are supported. If problems occur using any of the function keys or
HOME/END/PGUP/PGDN, it is recommended that the alternate keys be used.
There are general key inputs throughout the configuration utility that apply on all screens:
F1 HelpContext sensitive help for the cursor-resident field.
Arrow KeysSelect Item - Up, down, left, right movement to position the cursor.
Home/EndSelect Item - Up, down, left, right movement to position the cursor.
+/-Change Item - Items with values in [ ] brackets are modifiable. Numeric keypad
+ and numeric keypad - (minus) update a modifiable field to its next relative
value.
EscAbort/Exit - Escapeaborts the current context operation and/or exits the current
screen. User confirmation is solicited as required if changes have been made
by user. If you are using a serial console, pressing Esc causes a delay of several
seconds before it takes effect. This is normal system behavior and is not an
error.
EnterExecute <item> - Executable items are indicated by highlighted text and a
different background color. Press Enter to execute the field's associated function.
Configuration Utility Screens
All SAS BIOS configuration utility screens contain the following areas, starting at the top of the
screen:
Header areaIdentifies the utility and version number.
Menu areaGives the title of the current screen, and on screens other than the Adapter
List screen also identifies the adapter.
Main areaThe main area for presenting data. This area has a cursor for item selection,
and horizontal and vertical scroll bars if necessary.
Footer areaProvides general help information text.
Figure 41 provides a map of how screens are accessed in the drvcfg utility.
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Figure 41 Accessed Screens in the drvcfg Utility
DRVCFG Screens
Adapter List Screen
The Adapter List screen displays when the configuration utility is first started. This screen displays
a scrolling list of up to 256 SAS controllers in the system, and information about each of them.
Use the arrow keys to select a SAS controller, and press Enter to view and modify the selected
SAS controller's properties.
You can view and modify the SAS controller whether it is enabled or disabled. You can use the
Boot Support setting in the Adapter Properties menu to change the status of this setting. You
must reconnect the EFI Driver in order for a new Boot Support setting to take effect.
The following are the descriptions for the Adapter List screen.
AdapterIndicates the specific SAS Controller type.
PCI BusIndicates the PCI Bus number assigned by the system BIOS to an adapter
(0x00 - 0xFF, 0 - 255 decimal)
PCI DevIndicates the PCI Device assigned by the system BIOS to an adapter (range
0x00 - 0x1F, 0 - 31 decimal)
PCI FncIndicates the PCI Function assigned by the system BIOS to an adapter (range
0x00 - 0x7, 0 - 7 decimal)
FW RevisionDisplays the Fusion MPT firmware version and type (IR or IT)
StatusIndicates whether the adapter is or is not eligible for software control (enabled,
disabled or error)
EnabledIndicates the EFI Driver is either currently controlling the adapter,
or will attempt to control the adapter upon reload.
DisabledIndicates the EFI Driver is either not controlling the adapter, or
will discontinue control of the adapter upon reload.
ErrorIndicates that the EFI Driver encountered a problem with the
adapter. Viewing and modifying settings for the adapter is
allowed but the information and functionality available may be
limited.
Adapter Properties Screen
The Adapter Properties screen enables you to view and modify adapter settings. To scan the
SAS controller’s devices, select a SAS controller and press Enter. The Adapter Properties screen
displays.
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Figure 42 Adapter Properties Screen
Use the arrow keys to select RAID Properties, and press Enter to view the Select New Array
Type screen.
To access the following screens, use the arrow keys to select the screen, and press Enter on
the appropriate field:
•RAID Properties
•SAS Topology
•Advanced Adapter Properties
The following are the descriptions for the Adapter Properties screen.
AdapterIndicates the specific SAS Controller type.
PCI AddressDisplays the PCI Address assigned by the system BIOS to the adapter.
•Bus value range 0x00 - 0xFF, 0 - 255 decimal
•Device value range 0x00 - 0x1F, 0 - 31 decimal
•Function range 0x00 - 0x7, 0 - 7 decimal
FW RevisionDisplays the MPT firmware version and type in the format (x.xx.xx.xx- yy),
where x.xx.xx.xx refers to the FW version and yy refers to the type. The
currently supported type is IR.l).
SAS AddressDisplays the SAS Address assigned to this adapter.
FW RevisionDisplays the Fusion MPT firmware version and type (IR or IT)
StatusIndicates whether an adapter is eligible for configuration utility software
control or is reserved for control by other software (Enabled, Disabled or
Error).
EnabledIndicates the EFI Driver is either currently controlling the
adapter, or will attempt to control the adapter upon reload.
DisabledIndicates the EFI Driver is either not controlling the adapter,
or will discontinue control of the adapter upon reload.
ErrorIndicates that the EFI Driver encountered a problem with the
adapter. Viewing and modifying settings for the adapter is
allowed but the information and functionality available may be
limited.
Core I/O Card Configuration95
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Boot SupportSpecifies whether an adapter is eligible for configuration utility software
control or is reserved for control by other software (Enabled BIOS & OS,
Enabled BIOS Only, Enabled OS Only or Disabled).
•Enabled BIOS & OS - SAS controller is controlled by both the BIOS and
OS driver.
•Enabled BIOS Only - SAS controller is controlled only by the BIOS. This
setting may not be supported by all OS drivers. For example, it is not
possible to disable an adapter in a Windows driver.
•Enabled OS Only - SAS controller is controlled only by the OS driver.
•Disabled - SAS controller is not controlled by the BIOS when the SAS
controller is loaded. However, the adapter is still visible through the
configuration protocol.
Changes to the Boot Support setting are reflected in the Status field of the
Adapter List menu. The new setting will do not take effect until the BIOS is
reloaded (system reboot).
RAID Properties Screens
There are four screens within RAID properties. To access the screens, select RAID Properties
from the Adapter Properties screen. The Select New Array Type screen displays.
Figure 43 Select New Array Type Screen
Select New Array Type Screen
The Select New Array Type screen enables you to view an existing array or create an Integrated
Mirror array of two disks, plus an optional hot spare.
•To go to the Create New Array screen, select Create IM Volume.
•To go to the View Array screen, select View an Existing Array.
Create New Array Screen
The Create New Array screen enables you to create a new array. To access the Create New
Array screen, press Enter on the Create IM Volume field from the Select New Array Type screen.
To create a new array, follow these steps:
1.Select one of the following options:
To migrate to an IM array, press M. This keeps the existing data, and the disk is synchronized.
To delete all data on all the disks in the array, press D. This overwrites existing data when
creating a new IM array, and the disk is not synchronized.
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2.To create the array after the volume is configured, press C. The system prompts you to save
changes, which creates the array. During the creation process, the utility pauses. You are
then taken back to the Adapter Properties screen.
The following are the descriptions for the Create New Array screen.
Array TypeIndicates the type of array being created.
Array SizeIndicates the size of the array in MegaBytes.
BayDisplays the bay in which devices are located.
Device IdentifierDisplays the device identifier.
RAID DiskSpecifies the devices (disks) that make up an IM array. If RAID Disk
is Yes, the device is part of an IM array; if No, the device is not part
of an IM array. This field is grayed out under the following conditions:
•The device does not meet the minimum requirements for use in
an IM array.
•The device is not large enough to mirror existing data on the
primary drive.
•This disk has been selected as the hot spare for the IM array.
Hot SprSpecifies whether a device is the hot spare for an IM array. If hot
spare is Yes the device is used as a hot spare for the IM array; if No,
the device is not used as a hot spare for the IM array. Only one hot
spare per IM array is permitted. A hot spare is not required in an IM.
You can specify a hot spare at array creation, or any time after
creation, provided the array is made up of five disks or fewer. This
field is grayed out under the following conditions:
•The device does not meet the minimum requirements for use in
•The array already has a hot spare.
•The array is made up of the maximum number of devices (six).
•The device isn't large enough to mirror existing data on the
Drive Statusxxxx
OKDisk is online and fully functional.
MissingDisk is not responding.
FailedDisk has failed.
InitalizingDisk is initializing.
CfgOfflnDisk is offline at host's request.
User FailDisk is marked failed at host's request.
OfflineDisk is offline for some other reason.
InactiveDisk has been set inactive.
Not SyncdData on disk is not synchronized with the rest of
PrimaryDisk is the primary disk for a 2 disk mirror and is
SecondaryDisk is the secondary disk for a 2 disk mirror and
an IM array.
primary. The hot spare drive must be greater than or equal to
the size of any drive in any IM volume.
the array.
OK.
is OK.
Core I/O Card Configuration97
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Wrg TypeDevice is not compatible for use as part of an IM
array.
Too SmallDisk is too small to mirror existing data.
Max DsksMaximum # of disks allowed for this type of Array
reached and/or Maximum # of total IM disks on a
controller reached.
No SMARTDisk doesn't support SMART, cannot be used in
an RAID array.
Wrg IntfcDevice interface (SAS) differs from existing IM
disks.
Pred FailIndicates whether device SMART is predicting device failure (Yes,
No).
Size(MB)Indicates the size of the device in megabytes (megabyte = 1024 x
1024 = 1,048,576). If the device is part of a two-disk array, this field
reflects the size of the array, not the size of the individual disk. If the
device is part of a three or more disk array, this field is the size that
the disk makes up within the array. When creating a striped array,
the usable size of the array is determined by the number of drives
times the size of the smallest drive in the array. In arrays consisting
of different sized drives, excess space on larger drives are unusable.
View Array Screen
The View Array screen enables you to view the current array configuration. To access the View
Array screen, press Enter on the View Existing Array field from the Select New Array Type
screen.
You can perform the following actions on the View Array screen:
•To view the next array, press N.
•To create a new array, press C.
ArrayDisplays the number of this array.
IdentifierDisplays the identifier of this array.
TypeDisplays the RAID type.
Scan OrderDisplays the scan order of the array.
Size (MB)Displays the size of the array.
StatusDisplays the status of the array.
BayDisplays the bay in which devices are located.
Device IdentifierDisplays the device identifier.
RAID DiskSpecifies the devices (disks) that make up an IM array. If RAID Disk
is Yes, the device is part of an IM array, if No, the device is not part
of an IM array. This field is grayed out under the following conditions:
Hot SprSpecifies whether a device is the hot spare for an IM array. If hot
98Installing the System
•The device does not meet the minimum requirements for use in
an IM array.
•The device is not large enough to mirror existing data on the
primary drive.
•This disk has been selected as the hot spare for the IM array.
spare is Yes, the device is used as a hot spare for the IM array, if No,
the device is not used as a hot spare for the IM array. Only one hot
Page 99
spare per IM array is permitted. A hot spare is not required in an IM.
A hot spare can be specified at array creation, or any time after
creation, provided the array is made up of 5 disks or fewer. This field
is grayed out under the following conditions:
•The device does not meet the minimum requirements for use in
•The array already has a hot spare.
•The array is made up of the maximum number of devices (6).
•The device isn't large enough to mirror existing data on the
Drive Statusxxxx
OKDisk is online and fully functional.
MissingDisk is not responding.
FailedDisk has failed.
InitalizingDisk is initializing.
CfgOfflnDisk is offline at host's request.
User FailDisk is marked failed at host's request.
OfflineDisk is offline for some other reason.
InactiveDisk has been set inactive.
Not SyncdData on disk is not synchronized with the rest of
PrimaryDisk is the primary disk for a 2 disk mirror and is
SecondaryDisk is the secondary disk for a 2 disk mirror and
Wrg TypeDevice is not compatible for use as part of an IM
Too SmallDisk is too small to mirror existing data.
Max DsksMaximum # of disks allowed for this type of Array
No SMARTDisk doesn't support SMART, cannot be used in
Wrg IntfcDevice interface (SAS) differs from existing IM
an IM array.
primary. The hot spare drive must be greater than or equal to
the size of any drive in any IM volume.
the array.
OK.
is OK.
array.
reached and/or Maximum # of total IM disks on a
controller reached.
an RAID array.
disks.
Pred FailIndicates whether device SMART is predicting device failure (Yes,
No).
Size(MB)Indicates the size of the device in megabytes (megabyte = 1024 x
1024 = 1,048,576). If the device is part of a two-disk array, this field
reflects the size of the array, not the size of the individual disk. If the
device is part of a three or more disk array, this field is the size that
the disk makes up within the array. When creating a striped array,
the usable size of the array is determined by the number of drives
times the size of the smallest drive in the array. In arrays consisting
of different sized drives, excess space on larger drives are unusable.
Core I/O Card Configuration99
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Manage Array Screen
The Manage Array screen enables you to manage the current array. To access the Manage
Array screen, select the appropriate field and press Enter on the Manage Array field from the
View Array screen.
The Manage Array screen enables you to perform the following actions:
Manage Hot Spare
To display a Hot Spare Management screen that has the same layout as the Create New Array
screen, press Enter on Manage Hot Spare. This field is grayed out under the following conditions:
•The array is inactive.
•The array is at its maximum number of devices.
•Non-IR firmware is used.
•IR is disabled. The array is inactive.
Synchronize Array
To perform a synchronization of the IM array, press Enter on Synchronize Array. The screen
prompts you to ask if you want to perform this action. Press Y for yes or N for no. This field is
grayed out under the following conditions:
•The array is inactive.
•The array does not need to be resynchronized.
•The adapter's MPT firmware does not support the feature
•Non-IR firmware is used.
•IR is disabled. The array is inactive.
Activate Array
To perform an activation of an IM array, press Enter on Activate Array. The screen prompts you
to ask if you want to perform this action. Press Y for yes or N for no.
Delete Array
To perform the deletion of the currently displayed IM array, press Enter on Delete Array. The
screen prompts you to ask if you want to perform this action. Press Y for yes and N for no.
IdentifierDisplays the identifier of this array.
TypeDisplays the RAID type.
Scan OrderDisplays the scan order of the array.
Size (MB)Displays the size of this array.
StatusDisplays the status of this array.
Exit the SAS Configuration Utility Screen
As some changes only take effect when you exit the utility, it is important to always exit the utility
properly. To exit the utility, follow these steps:
1.To return to the Adapter List from Adapter Properties, press ESC.
2.To exit the utility from the Adapter List, press ESC.
NOTE:A similar exit screen is used when exiting most other screens, and can be used to save
settings.
100 Installing the System
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