The information contained herein is subject to change without notice. The only warranties for HP products
and services are set forth in the express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for
technical or editorial errors or omissions contained herein.
Printed in U.S.A.
Intel, Pentium, Intel Inside, Itanium, and the Intel Inside logo are trademarks or registered trademarks of
Intel Corporation or its subsidiaries in the United States and other countries.
Linux is a U.S. registered trademark of Linus Torvalds.
This document provides information and instructions on how to service and troubleshoot the HP 9000 rp3410
and rp3440 servers.
The document printing date and part number indicate the document’s current edition. The printing date
changes when a new edition is printed. Minor changes may be made at reprint without changing the printing
date. The document part number changes when extensive changes are made.
Document updates may be issued between editions to correct errors or document product changes. To ensure
you receive the updated or new editions, subscribe to the appropriate product support service. See your HP
sales representative for details.
The latest version of this document can be found on the web at:
http://www.docs.hp.com.
Intended Audience
This document is intended to provide technical product and support information for authorized service
providers, system administrators, and HP support personnel.
This document is not a tutorial.
New and Changed Information in This Edition
This following changes are included in this edition:
•The User Service Guide includes the contents of the Maintenance Guide and the Operations Guide.
•Server specification and installation information has been included.
•Physical and environmental specifications table was added.
Publishing History
Table 1 lists the publishing history details for this document.
Table 1Publishing History Details
Document
Manufacturing
Part Number
A7137-96008-ed5HP-UX 11i v1
A7137-96008HP-UX 11i v1
A7137-96002
A7137-96003
Operating Systems
Supported
HP-UX 11i v2
HP-UX 11i v3
HP-UX 11i v2
HP-UX 11i v3
HP-UX 11i v1HP 9000 rp3410 and rp3440April 2005
Supported Product VersionsPublication Date
HP 9000 rp3410 and rp3440September 2008
HP 9000 rp3410 and rp3440April 2007
N/AHP-UX 11i v1HP 9000 rp3410 and rp3440July 2003
15
Document Organization
This guide is divided into the following chapters:
Chapter 1 Overview: Provides views and descriptions of the server.
Chapter 2 System Specifications: Server details such as system configuration, physical
specifications, and requirements.
Chapter 3 Installing the System: Unpacking, installation, and preparation for booting the operating
system.
Chapter 4 Booting and Shutting Down the Operating System: Provides procedures to boot and
shut down the operating system.
Chapter 5 Troubleshooting: Provides diagnostics and basic troubleshooting methodology.
Chapter 6 Removing and Replacing Components: Provides instructions and procedures on how to
remove and replace server components.
Appendix A Replacement Parts: Provides a list of available customer self-repair parts.
Appendix B Utilities: Provides information on the utilities on the server such as Boot Console Handler
(BCH) and the Integrity iLO MP.
Appendix C Physical and Environmental Specifications: Provides temperature and airflow
information for minimum, typical, and maximum configurations for the server. Also lists the
server and rack weights and dimensions.
Typographic Conventions
This document uses the following conventions.
WARNINGA warning lists requirements that you must meet to avoid personal injury.
CAUTIONA caution provides information required to avoid losing data or avoid losing system
functionality.
IMPORTANT Important messages provide essential information to explain a concept or to complete a task.
NOTEA note highlights useful information such as restrictions, recommendations, or important
details about HP product features.
TIPTips provide you with helpful hints for completing a task. A tip is not used to give essential
information, but can be used, for example, to provide an alternate method for completing the
task that precedes it.
Book TitleThe title of a book. On the web and on the Instant Information CD, it can be a hot link to the
KeyCap The name of a keyboard key or graphical interface item (such as buttons, tabs, and menu
16
book itself.
items). Return and Enter both refer to the same key.
EmphasisText that is emphasized.
Bold Text that is strongly emphasized.
Bold The defined use of an important word or phrase.
ComputerOut Text displayed by the computer.
UserInput Commands and other text that you type.
Command A command name or qualified command phrase.
Option An available option.
Screen Output Example of computer screen output.
[] The contents are optional in formats and command descriptions. If the contents are a list
{} The contents are required in formats and command descriptions. If the contents are a list
... The preceding element can be repeated an arbitrary number of times.
| Separates items in a list of choices.
separated by |, you must select one of the items.
separated by |, you must select one of the items.
HP-UX Release Name and Release Identifier
Each HP-UX 11i release has an associated release name and release identifier. The uname (1) command with
the -r option returns the release identifier.
Table 2 shows the releases available for HP-UX 11i.
HP Books are available worldwide through bookstores, online booksellers, and office and computer stores.
HP Encourages Your Comments
HP encourages your comments concerning this document. We are truly committed to providing
documentation that meets your needs.
Send comments to:
netinfo_feedback@cup.hp.com
Include title, manufacturing part number, and any comments, errors found, or suggestions for improvement
you have concerning this document. Also, please include what we did right so we can incorporate it into other
documents.
18
1Overview
The HP 9000 rp3410 server is a 1P/1C, 1P/2C, rack- or pedestal-mount server. Similarly, the HP 9000 rp3440
server is a 1P/1C, 1P/2C, 2P/2C, or 2P/4C rack- or pedestal-mount server. Both of these servers are based on
the PA-RISC processor family architecture.
The server accommodates up to 12 DIMMs and internal peripherals including disks and DVD. Its
high-availability features include hot-swappable power supplies and hot-pluggable disk drives.
The supported operating system is HP-UX 11i v1 (and newer HP-UX versions that support PA-RISC
systems).
This chapter addresses the following topics:
•“HP 9000 rp3410 and rp3440 Server Views” on page 20
•“Detailed Server Description” on page 22
•“Controls, Ports, and LEDs” on page 35
•“Powering the Server On and Off” on page 44
Chapter 1
19
Overview
HP 9000 rp3410 and rp3440 Server Views
HP 9000 rp3410 and rp3440 Server Views
Figure 1-2, Figure 1-2, Figure 1-3, and Figure 1-4 show the front, rear, and pedestal views of the HP 9000
rp3410 and rp3440 servers.
Figure 1-1HP 9000 rp3410 and rp3440 Servers - Front View
Figure 1-2HP 9000 rp3410 and rp3440 Servers - Front View with Bezel Removed
20
Chapter 1
HP 9000 rp3410 and rp3440 Server Views
Figure 1-3HP 9000 rp3410 and rp3440 Servers - Rear View
Figure 1-4HP 9000 rp3410 and rp3440 Servers - Pedestal Mount
Overview
Chapter 1
21
Overview
Detailed Server Description
Detailed Server Description
This section provides information on the features that comprise the HP 9000 rp3410 and rp3440 servers.
Processor
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•800 MHz/1.5 GB cache (HP 9000 rp3410 and rp3440 servers).
•1 GHz/1.5 GB cache (HP 9000 rp3440 server only).
•Both processors are available with 32 MB or 64 MB L2 cache.
•HP 9000 rp3410 servers can be 1P/1C and 1P/2C.
•HP 9000 rp3440 servers can be 1P/1C and 1P/2C, and 2P/2C.
Memory
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•12 memory DIMM slots.
•Minimum memory size is as follows:
— 512 MB (2 x 256 MB DIMMs in a HP 9000 rp3410, model A7136A server).
— 1 GB (4 x 256 MB DIMMs in a HP9000 rp3410 model A7136B server, or in a HP 9000 rp3440 server).
•Maximum memory size is as follows:
— 6 GB (HP 9000 rp3410 server), 24 GB (HP 9000 rp3440 server with 2 GB DIMMs installed in all 12
slots). or
— 32 GB (HP 9000 rp3440 server with 4 GB DIMMs installed in the first eight slots)
•For the HP 9000 rp3410 server, DIMMs are as follows:
— 256 MB, 512 MB, and 1 GB
— standard 184 pins 2.5V
— DDR266, CL2, registered, ECC
•For the HP 9000 rp3440 server, DIMMs are as follows:
— 256 MB, 512 MB, and 1 GB, 2 GB, 4 GB
— standard 184 pins 2.5V
— DDR266, CL2, registered, ECC
•Only one supported configuration for 4 GB DIMMs; 2 quads (8 DIMMs); and no other DIMMs can be
installed.
•DIMMs loaded by quads enable interleaved mode and chip spare.
•Memory is loaded across both memory busses (two DIMMs on each bus) to ensure maximum bandwidth
and performance.
•133 MHz memory bus frequency, 266 MTransfers/s data, 8.5 GB/s peak data bandwidth.
22
Chapter 1
Overview
Detailed Server Description
•Total memory bandwidth is 8.5 GB/s, split across two 4.25 GB/s memory buses.
•Open page memory latency is 80 nanoseconds.
PCI Riser
Two (HP 9000 rp3410 server) or four (HP 9000 rp3440 server) independent PCI-X 133 MHz 64-bit 3.3V 15W
slots. No 5V card and hot-pluggable support.
Internal Core I/O
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•Dual-channel SCSI U160 interface, two internal 68-pin connectors, one 68-pin external connector.
•SCSI backplane configured either as two channels with 2+1 drives. A SAF-TE accessory (currently not
available) is required to configure the SCSI backplane as one channel with three drives.
•Three internal SCSI drive connectors are of the 80-pin type and provide drive electrical hot-pluggable
capability.
•SCSI backplane is designed to support a SCSI management piggy board accessory that provides a SCSI
management SAF-TE chip and shunts the backplane's channels A and B to provide three disks on
channel A and leave only the external connector on channel B.
•One internal IDE connector for a slim-line optical device (CD and DVD).
•No floppy connector.
External Core I/O
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•One SCSI U160 68-pin connector.
•One 10/100/1000Base-T Ethernet LAN connectors for copper cable.
•Four USB 2.0 ports.
•Three DB-9 ports (console, UPS, and modem) through a 3-connector M cable.
Power Supply Unit
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•650W output power.
•The power supply is split in a front end block (the actual power supply case) that converts the line voltage
into a high dc voltage and back end voltage regulation modules (on the motherboard) that step down the
front end dc voltage to the required voltages.
•Redundant and hot-pluggable power supplies (front end block only).
System Board Manageability
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•Baseboard Management Controller (BMC).
•Temperature monitoring and fans regulation by BMC.
Chapter 1
23
Overview
Detailed Server Description
•BMC manageability console shared with system console/general purpose serial port.
•IPMI protocol for communication between BMC/system/iLO MP.
•Hardware diagnostics by BMC displayed on the front status panel.
•Locator front/rear LEDs.
•Field replacement units monitoring by BMC.
Enhanced Server Manageability Using the Integrity iLO MP
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•LAN telnet console.
•Web GUI.
•Serial port for local console.
•Serial port for modem console.
•Duplication of console screen content across all consoles.
Hard Disk Drives
Three half-height hard disk drives (1-inch height).
Internal RAID
The following is supported on the HP 9000 rp3410 and rp3440 servers:
•The A9890A and A9891A RAID cards are supported to provide RAID for the embedded drives.
•The A9827A cabling kit is required for internal RAID. See the HP 9000 rp3410 and HP 9000 rp3440 Upgrade Guide for complete RAID installation instructions.
Firmware
Firmware consists of many individually linked binary images that are bound together by a single framework
at run time. Internally, the firmware employs a software database called a device tree to represent the
structure of the hardware platform and to provide a means of associating software elements with hardware
functionality.
The firmware incorporates the Boot Console Handler (BCH) which provides an interface between the
operating system and the platform firmware.
The firmware supports the HP-UX 11i version 1 (and higher HP-UX versions that support PA-RISC systems)
operating system through the HP 9000 processor family standards and extensions, and has no operating
system-specific functionality included. The operating system is presented with the same interface to system
firmware, and all features are available to the operating system.
Event IDs for Errors and Events
The server firmware generates event IDs similar to chassis codes for errors, events, and forward progress to
the Integrity Integrated Light-Out Management Processor (iLO MP) through common shared memory. The
integrity iLO MP interprets and stores event IDs. Reviewing these events helps you diagnose and
troubleshoot problems with the server.
24
Chapter 1
Detailed Server Description
Dimensions and Values
Table 1-1 lists the dimensions and their values of the HP 9000 rp3410 and rp3440 servers.
Table 1-1Server Dimensions and Values
DimensionValues
Overview
Rack dimensions (depth x width x height)
Pedestal dimensions (depth x width x height)
Rack weight
Pedestal weight
Pedestal footprint
Rack units2U
26.8 in (67.9 cm) max. x 19.0 in (48.3 cm) x 3.4 in (8.6 cm)
26.6 in (67.5 cm) x 11.6 in (29.5 cm) x 19.5 in (49.4 cm)
Minimum: 38.6 lbs (17.5 kg)
Maximum: 49.0 lbs (22.2 kg)
Minimum: 49.4 lbs (22.4 kg)
Maximum: 56.3 lbs (25.5 kg)
2
0.2 m
(2.1 sq. ft.)
System Board
This section provides a block diagram of the system board and descriptions of key components (integrated
circuits) on the board.
Chapter 1
25
Overview
Detailed Server Description
Figure 1-5 shows the system block diagram.
Figure 1-5System Block Diagram
ASIC
Bus
Interface
ASIC
Bus
Interface
ASIC
Bus
Interface
ASIC
Bus
Interface
PA-RISC
Processor
PA-RISC
Processor
Interface
ASIC
Bus
ASIC
Bus
Interface
ASIC
Bus
Interface
ASIC
Bus
Interface
ASIC
Bus
Interface
*
*
*Factory use only
System Board Components
The following describes the main components of the system board:
•Dual PA-RISC processors:
— One or two processors enabled in HP 9000 rp3410 server
— One, two, or four processors enabled in HP 9000 rp3440 server
•ZX1 I/O and memory controller
•ZX1 PCI bus controller
•Processor dependent hardware controller
•Field processor gate array controller
•BMC
•SCSI controller
26
Chapter 1
Overview
Detailed Server Description
•IDE controller
•USB controller
•10/100/1000 LAN
PA RISC Processor
The system board consists of two Zero Insertion Force (ZIF) processor sockets, the Core Electronic Complex
(CEC), and circuits for clock and power generation and distribution, boundary Scan, In-target Probe (ITP),
and debug.
The Front Side Bus (FSB) is the IA64 processor bus based on bus protocol from Intel. This enables processor
customer self-repair (CSR) parts to be dropped in, provided that electrical and mechanical compatibility and
support circuitry exist. A processor CSR consists of a dual processor module with heatsink assembly.
One end of the FSB is terminated with an I/O ASIC. The other end of the bus is terminated with a CSR. An
additional CSR can be loaded in the middle. For the system to function properly, the processor farthest away
from the I/O ASIC must be loaded at all times to electrically terminate the FSB.
Each processor module plugs directly into and is powered by its own 12V to 1.2V power-pod. Other power for
the system board comes from multiple on-board dc/dc converters. Each processor module is attached to the
board through a ZIF socket and the entire CSR secured down by a heatsink bolster plate.
Processor Bus
The processor bus (Front Side Bus [FSB]) in this product runs at 200 MHz. Data on the FSB are transferred
at a double data rate, which enables a peak FSB bandwidth of 6.4 Gb/sec.
ZX1 I/O and Memory Controller
HP 9000 rp3410 and rp3440 servers support the following features of the ZX1 I/O and memory controller
chip:
•3.3 GB/s peak IO bandwidth.
•Provides eight communication paths.
•Peak memory bandwidth of 8.5 GBs.
•Two memory cells, 144 data bits each.
Memory
The memory subsystem provides two memory cells, each of which is 144 data bits wide. Each cell has six
DIMM slots, which means a total of 12 DIMM slots are available. The memory bus clock speed is 133 MHz,
and the data transfer rate is 266Mtransfers/second as data is clocked on both edges of the clock. The peak
data bandwidth for this memory subsystem design is 8.5 GB/s. DIMMs must be loaded in quads with
qualified modules, with the exception of 256 MB DIMMs which is loaded in pairs. Memory is protected by
data error correction code (ECC), and the hardware implementation supports the chip-spare feature.
The minimum amount of memory that you can install is 512 MB (2x256 MB modules in a HP 9000 rp3410
model A7136A server), and 1 GB (4x256 MB modules in other HP 9000 rp34x0 servers). The maximum
amount of memory that you can install is limited to 24 GB (12 x 2 GB modules) or 32 GB (8 x 4 GB modules)
in a HP 9000 rp3440 server.
This design does not support any non industry-standard DDR DIMMs. Only qualified DIMMs are supported.
Chapter 1
27
Overview
Detailed Server Description
Figure 1-6 shows the memory block diagram.
Figure 1-6Memory Block Diagram
Memory
Controller
Memory Architecture
The I/O ASIC memory interface supports two DDR cells, each of which is 144 data bits wide. The memory
subsystem physical design uses a comb-filter termination scheme for both the data and address/control buses.
This part of the topology is similar to other DDR designs in the computer industry. Clocks are distributed
directly from the I/O ASIC; each clock pair drives two DIMMs.
Memory data is protected by ECC. Eight ECC bits per DIMM protect 64 bits of data. The use of ECC enables
correction of single-bit errors, and detection of multi-bit errors. Only DIMMs with ECC are qualified or
supported.
DIMMs
The memory subsystem only supports DDR SDRAM (Double Data Rate Synchronous Dynamic Random
Access Memory) technology utilizing industry-standard PC-1600 type DDR SDRAM DIMMs, 1.2" tall. This is
currently being used by high-volume products. The DIMMs use a 184-pin JEDEC standard connector.
DIMMs are loaded in groups of four, known as a rank or quad (except for 256 MB DIMMs, which is loaded in
pairs). All four DIMMs in a rank or quad must be the same size. The following information summarizes the
memory solutions.
28
Chapter 1
Overview
Detailed Server Description
Memory Array Capacities
Table 1-2 lists the memory array capacities for the server.
Table 1-2Memory Array Capacities
Minimum and
Maximum
Memory Size
0.5 GB / 3 GB256 MB DIMM18 x 32 MB x 4 DDR SDRAMs (128 MB)
2 GB / 6 GB512 MB DIMM36 x 32 MB x 4 DDR SDRAMs (128 MB)
4 GB / 12 GB1024 MB DIMM36 x 64 MB x 4 DDR SDRAMs (256 MB)
8 GB / 24 GB 2048 MB DIMM36 x 128 MB x 4 DDR SDRAMs (512 MB)
16 GB / 32 GB4096 MB DIMM36 x 256 MB x 4 DDR SDRAMs (1024 MB)
Chip Spare Functionality
Chip spare enables an entire DDR SDRAM chip on a DIMM to be bypassed in the event that a multi-bit error
is detected on the DDR SDRAM. In order to use the chip spare functionality on the server, only DIMMs built
with ×4 DDR SDRAM parts are used, and these DIMMs must be loaded in quads.
Single DIMM SizeDDR SDRAM Count, Type and Technology
The memory subsystem design supports the I/O ASIC chip’s spare functionality. Chip spare enables an entire
SDRAM chip on a DIMM to be bypassed/replaced in the event that a multi-bit error is detected on that
SDRAM. In order to use the chip spare functionality, only DIMMs built with x4 SDRAM parts are used, and
these DIMMs must be loaded in quads (2 DIMMs per memory cell, loaded in the same location in each
memory cell). Each DIMM within a quad must be identical to all the other DIMMs in the quad.
Using the DIMM loading order figure from above, chip spare is achieved if four identical DIMMs are loaded in
the slots labeled “1st” and “2nd.” If more DIMMs are added, they must be loaded in quads in order to
maintain the chip spare functionality. If more DIMMs are added to the example case, four identical DIMMs
(identical to each other, but can be different from the original quad that was loaded) must be loaded in the
slots labeled “3rd” and “4th.”
Maximum memory capability of the HP 9000 rp3440 server is 24 GB or 32 GB. If 4 GB DIMMs are used,
install eight DIMMs in the first eight slots. The remaining slots (9-12) must remain empty when 4 GB
DIMMs are used.
Serial Presence Detect
Each DIMM contains an I
2
C EEPROM whose content describes the module’s characteristics: speed,
technology, revision, vendor, etc. This feature is called serial presence detect (SPD). Firmware typically uses
this information to detect unmatched pairs of DIMMs, and configure certain memory subsystem parameters.
The SPD information for DIMMs loaded in the system are also accessible to the BMC through the I
2
C bus.
I/O Bus Interface
The I/O bus interface has these features:
•Provides industry standard PCI 33 MHz and 66 MHz, PCI-X 66 MHz to 133 MHz, 32 or 64 data bit
support.
•Uses 3.3V PCI only, and it does not support 5V PCI.
•Optimizes for DMA performance.
Chapter 1
29
Overview
Detailed Server Description
•Supports 3.3V or universal-keyed PCI cards. 5V-keyed PCI cards are not supported.
Processor Dependent Hardware (PDH) Controller
The Processor Dependent Hardware (PDH) controller provides the following features.
•16-bit PDH bus with reserved address space for the following:
—Flash memory
— Nonvolatile memory
— Scratch RAM
— Real time clock
— UARTs
— External registers
— Firmware read/writable registers
— Two general purpose 32-bit registers
— Semaphore registers
— Monarch selection registers
— Test and reset register
•Reset and INIT generation
Field Programmable Gate Array
The Field Programmable Gate array (FPGA) provides ACPI and LPC support for the PDH bus and provides
these features:
•ACPI 2.0 interface.
•LPC bus interface to support BMC.
•Decoding logic for PDH devices.
BMC
The BMC supports the industry-standard Intelligent Platform Management Interface (IPMI) specification.
This specification describes the management features that have been built into the system board. These
features include: diagnostics (both local and remote), console support, configuration management, hardware
management and troubleshooting.
The BMC provides the following:
•Compliance with IPMI 1.0.
•Tachometer inputs for fan speed monitoring.
•Pulse width modulator outputs for fan speed control.
•Push-button inputs for front panel buttons and switches.
•One serial port, multiplexed with the system console port.
•Remote access and intelligent chassis management bus (ICMB) support.
•Three I
2
C master/slave ports (one of the ports is used for intelligent platform management bus (IPMB).
30
Chapter 1
Overview
Detailed Server Description
•Low Pin Count (LPC) bus provides access to three Keyboard Controller Style (KCS) and one-Block
Transfer (BT) interface.
•32-bit ARM7 RISC processor.
•160-pin Low Profile Flat Pack (LQFP) package.
•Firmware is provided for the following interfaces:
—IPMI
—IPMB
SCSI Controller
The SCSI controller is a LSI Logic 53C1030 chip. This chip is fully compliant with the SCSI Peripheral
Interface-4 Specification (SPI-4). It has two independent SCSI channels supporting devices at speeds up to
320 MB/sec each. The 53C1030 adheres to the PCI-X addendum, to the PCI Local Specification, and is
hard-wired to PCI ID 1 which corresponds to bit 17 of the PCI AD bus.
IDE Interface
The IDE controller (PCI649) supports the ATAPI zero (0) to five (5) modes (from 16 to 100 MB/s). The usable
speed on this system is limited to 16 MHz (ATA-33 mode, 33 MB/s) because the slimline CD/DVD devices do
not support the ATA-66 and 100 modes.
The primary IDE channel is the only channel that is implemented. The IDE cable provides only one drive
connector, of the master type, for the optical storage peripheral.
1 GB System LAN
The 1 GB System LAN port provides:
•Main system LAN.
•10/100/1000 MB capable.
USB Connectors
The USB connectors provide:
•High speed 480 MB/sec. capable.
•Full speed 12 MB/sec. and low speed 1.5 MB/sec.
•Support for USB keyboard and mouse.
•HP-UX supports HP USB keyboard and mouse.
Chapter 1
31
Overview
Detailed Server Description
Disk and I/O Path Logging
Some failures result in I/O path logging. These paths help to indicate the source of the error and can be
included in the error message or logged into console or event logs.
Table 1-3 describes the disk drive and DVD paths for the server.
Table 1-3Internal Disk and DVD Paths
Function
Slot
Disk slot 0Ultra 3 SCSI I/O for bottom removable diskBottom disk slot0/1/1/0.0.0
Disk slot 1Ultra 3 SCSI I/O for middle removable diskMiddle disk slot0/1/1/0.1.0
Disk slot 2Ultra 3 SCSI I/O for top removable diskTop disk slot0/1/1/1.2.0
DVD slotIDE I/O for DVDDVD slot0/0/2/0.0.0
Table 1-4 describes the extended core I/O paths for the server.
This section describes the controls, ports, and indicators found on the front and rear panel locations of the HP
9000 rp3410 or rp3440 server. The servers are designed to be rack- or pedestal-mounted.
Control Panel
The control panel of the HP 9000 rp3410 and rp3440 servers provide the controls and indicators commonly
used for operation.
Figure 1-7 shows the front panel details.
Figure 1-7Front View
Control PanelDVD Drive
Drive 3
Drive 2
Drive 1
System Product
Label (Pulls-Out)
Figure 1-8 shows the control panel LEDs and buttons.
Figure 1-8Control Panel LEDs and Buttons
Locator Button and LED
Diagnostics LEDs
(Disabled)
LAN
LED
1234LAN System
System
LED
Power Button
Power On/Off LED
Chapter 1
35
Overview
Controls, Ports, and LEDs
Table 1-7 provides control panel and LED information.
Table 1-7Control Panel LEDs and Switches
NameFunction
Power on/off
LED
Power ButtonControls the power supply (turns system power on or off) if power is available to the
The green on/off LED is illuminated when the power is on.
power supply. (Controls both power supplies if two are installed).
If power is off but power is available to the power supplies, pressing the power button
does the following:
•Momentarily (less than one second) turns on the power supplies and applies power to
server circuits.
•More than two or three seconds, then released, has no effect.
If power is on and the system is at initial system loader, pressing the power button:
•Momentarily (less than one second) has no effect.
•More than one second, but less than five seconds—do not use. This initiates e-buzzer
functions that are not supported in the server.
•More than five seconds then released causes an immediate hard power off.
If power is on and the system is at BCH, pressing the power button does the following:
•Momentarily (less than one second) causes a immediate and hard power down.
•More than one second, but less than five seconds—do not use. This initiates e-buzzer
functions that are not supported in the server.
•More than five seconds then released causes an immediate hard power off.
If power is on but the OS has been shut down, pressing the power button:
•Momentarily (less than one second) has no effect.
•More than one second, but less than five seconds—do not use. This initiates e-buzzer
functions that are not supported in the servers.
•More than five seconds then released causes an immediate hard power off.
If the OS is running, pressing the power button does the following:
•Momentarily (less than one second) has no effect.
•More than one second, but less than five seconds—do not use. This initiates e-buzzer
functions that are not supported in the servers.
•More than five seconds then released causes an immediate hard power off.
System LEDThe System LED provides information about the system status. When operation is
normal, the LED is green. When there is a system warning, the LED is flashing yellow.
When there is a system fault, the LED is flashing red.
LAN LEDThe LAN LED provides status information about the LAN interface. When the LAN LED
is flashing, there is activity on the LAN.
36
Chapter 1
Table 1-7Control Panel LEDs and Switches (Continued)
NameFunction
Overview
Controls, Ports, and LEDs
Locator button
and LED
The locator button and LED are used to help locate this server within a rack of servers.
When the button is engaged, the blue LED illuminates and an additional blue LED on
the rear panel of the server illuminates. You can remotely activate this function.
Additional Controls and Indicators
HP 9000 rp3410 and rp3440 servers can have up to three low-voltage differential (LVD), 3.5-inch form factor
hot-pluggable disk drives installed. These disk drives have LEDs that provide status and activity
information.
Hot-Pluggable Disk Drive Indicators
The disk drives have two LEDs per drive, as follows:
•Status LED: Not used on the HP 9000 rp3410 or rp3440 server.
•Activity LED: Flashing green and indicates disk drive activity. This LED is directly controlled by the disk
drive and turns on when a drive is accessed.
Figure 1-9 shows the hot-pluggable disk drive LED indicators.
Figure 1-9Hot-Pluggable Disk Drive LED Indicators
Status LED
(Not Used)
Activity LED
Table 1-8 lists the hot-pluggable disk drive LED definitions.
Table 1-8Hot-Pluggable Disk Drive LED Definitions
LEDStateDescription
Status LEDNoneNot used.
Activity LEDFlashing greenReading and scanning hard drive
Optional Removable Media Drive
HP 9000 rp3410 and rp3440 servers are delivered without a removable media drive. You can add either a
DVD or CD-RW/DVD drive. Each of these optional devices has one activity LED.
Chapter 1
37
Overview
Controls, Ports, and LEDs
Figure 1-10 shows the DVD drive details.
Figure 1-10DVD Drive
DVD
Activity LED
Table 1-9 lists the DVD drive LED definitions.
Eject Button
Emergency Eject
Table 1-9DVD Drive LED Definitions
LEDStateDescription
Activity LEDFlashing greenDrive is active
Rear Panel
The rear panel of the HP 9000 rp3410 and rp3440 servers includes communication ports, I/O ports, ac power
connector, and the locator LED/button. Additional LEDs located on the rear panel of the HP 9000 rp3410 and
rp3440 servers signal the operational status of:
•10/100/1000 Base-T Ethernet LAN
•iLO MP card LAN
Figure 1-11 shows the rear panel ports and LEDs.
Figure 1-11Rear View
VGA Port-disabled
ac Power Receptacle
LVD/SE SCSI
10/100 iLO MP
10/100/1000 LAN
38
DO NOT USE
LAN
System Lock
Console/Remote/UPS
USB Ports
TOC Button
Locator Button and LED
Console/Serial Port A (Factory Use Only)
PCI Slot 1
PCI Slot 2
PCI Slot 3
(rp3440
Only)
Serial Port B
(Factory Use Only)
PCI Slot 4
(rp3440
Only)
Chapter 1
Table 1-10 lists the rear-panel connectors and switches.
Table 1-10Rear Panel Connectors and Switches
Overview
Controls, Ports, and LEDs
Connector or
Switch
ac powerPrimary power connection for the server.
LVD/SE SCSI68-pin, low-voltage differential, single-ended U160 SCSI. This connector provides
external SCSI connection on SCSI Channel B.
(1 GB) 10/100/1000
LAN
Serial A (console)
and Serial B
USBFour universal serial bus (USB 2.0) connectors.
TOCTransfer of control button. Halts all system processing and I/O activity and
Locator button and
LED
Video (not used)15-pin female video connector. DISABLED—DO NOT USE. To enable video
10/100/1000 base-T Ethernet LAN connector.
9-pin male serial connectors—factory use only.
restarts system.
The locator button and LED are used to help locate a server within a rack of
servers. When the button is engaged, the blue LED illuminates and an additional
blue LED on the front panel of the server illuminates. You can remotely activate
this function.
capability you must obtain the supported A6150 video PCI card. See enclosed
ReadMe, A6150-90001.
Function
Console/remote/UPS25-pin female serial data bus connector for the iLO MP card.
10/100 iLO MP LAN10 Mb/100 Mb LAN connector for the iLO MP.
10/100/1000 Base-T Ethernet LAN Connector
Figure 1-12 shows the rear panel 10/100/1000 base-T Ethernet LAN connector and the status and activity
LEDs.
Figure 1-1210/100/1000 Base-T Ethernet LAN Connector LEDs
1 2 3 4 5 6 7 8
1000BT
100BT
10BT
Activity
Chapter 1
39
Overview
Controls, Ports, and LEDs
Table 1-11 lists the 10/100/1000 base-T Ethernet LAN connector LED descriptions.
Table 1-1110/100/1000 Base-T Ethernet LAN Connector LEDs
LEDDescription
1000BTBlinking green—the 1000 MHz with Ethernet protocol and twisted-pair wiring is
enabled, off—no link.
100BTBlinking green—the 100 MHz with Ethernet protocol and twisted-pair wiring is
enabled, off—no link.
10BTBlinking green—the 10 MHz with Ethernet protocol and twisted-pair wiring is
enabled, off—no link.
ActivityBlinking green—LAN activity.
Table 1-12 lists the 10/100/1000 base-T Ethernet LAN connector pinouts.
Table 1-1210/100/1000 Base-T Ethernet LAN Connector Pinouts
Pin NumberSignal Description
1TXP
2TXN
3RXP
4Not used
5Not used
6RXN
7Not used
8Not used
USB Ports
Figure 1-13 shows the dual USB port connector.
Figure 1-13Dual USB Port Connector
1 2
34
40
1 2
34
Chapter 1
Figure 1-14 shows the single USB port.
Figure 1-14Single USB Port
Table 1-13 lists the USB pinouts.
Table 1 -13U S B Pin o uts
Pin NumberSignal Description
1+5 VDC
1 2
Overview
Controls, Ports, and LEDs
34
2MR
3PR
4Ground
SCSI Port, Ultra 3, 68-Pin
A single, Ultra 3, 68 pin SCSI connector is located at the rear panel of the server. The external connector
supports SCSI channel “B.”
The iLO MP card LAN uses an RJ-45 type connector. This connector has four LEDs that signal status and
activity.
Figure 1-16 shows the iLO MP card LAN LEDs.
Figure 1-16iLO MP Card LAN LEDs
Self-test
10BT
100BT
Standby
Power
Table 1-15 lists the iLO MP card LAN LEDs.
Table 1-15iLO MP Card LAN LEDs
LEDColorDescription
Self-testYellowiLO MP is running self-test or error is detected
10BTGreen10BT link established, blinking green
10BT link activity, off
no link
100BTGreen100BT link established, blinking green
100BT link activity, off
no link
Standby powerGreenStandby power on, off
standby power off
Chapter 1
43
Overview
Powering the Server On and Off
Table 1-16 lists the iLO MP card LAN connector pinouts.
Table 1-16iLO MP Card LAN Connector Pinouts
Pin NumberSignal Description
1TXP
2TXN
3RXP
4Not used
5Not used
6RXN
7Not used
8Not used
Powering the Server On and Off
This section provides information on how to power off and power on the server.
Power States
The server has three power states:
•Standby power
•Full power
•Off
Plug the power cord into the appropriate receptacle on the rear of the server to achieve the standby power
state; the front panel power button is not turned on. Full power occurs when the power cord is plugged into
the appropriate receptacle, and either the power is activated through the iLO MP PC command, or the power
button is activated. In the off state, the power cords are not plugged in.
Table 1-17 lists the server power states.
Table 1-17Power States
Power Activated through the
iLO MP PC Command; or
Front Panel Power Button
Activated?
Standby dc
Voltage
Applied?
dc Voltage
Applied?
Power States
Power Cable
Plugged Into
Receptacle?
Standby powerYesNoYesNo
Full powerYesYesYesYes
OffNoNoNoNo
44
Chapter 1
Overview
Powering the Server On and Off
NOTEIf the power restore feature is set to Always On through the iLO MP PR command, the server
automatically powers on to the full power state.
Powering On the Server
Power on the server to full power using the following methods if the server is in the standby power state:
•iLO MP PC command
•Power button
Powering On the Server Using the iLO MP
NOTEIf the power restore feature is set to Always On through the iLO MP PR command, the server
automatically powers on to the full power state.
To power on the server using the iLO MP, follow these steps:
Step 1. Plug all power cables into the receptacles on the rear panel of the server.
Step 2. Initiate a console session, and access the
Step 3. Enter CM to enable command mode.
Step 4. Enter PC to use the remote power control command.
Step 5. Enter ON to power on the server, and enter YES when prompted to confirm the action.
Step 6. Start the operating system.
Powering On the Server Manually
NOTEIf the power restore feature is set to Always On through the iLO MP PR command, the server
automatically powers on to the full power state.
To manually power on the server, follow these steps:
Step 1. Plug all power cables into the receptacles on the rear panel of the server.
Step 2. Press the power button to start the server.
Step 3. Start the operating system.
MP Main Menu.
Powering Off the Server
Power off the server using the following methods if the server is in the standby or full power state:
•iLO MP PC command
•Power button
Powering Off the Server Using the iLO MP
To power off the server using the iLO MP, follow these steps:
Chapter 1
45
Overview
Powering the Server On and Off
Step 1. Gracefully shut down the operating system.
Step 2. Initiate a console session, and access the
MP Main Menu.
Step 3. Enter CM to enable command mode.
Step 4. Enter PC to use the remote power control command.
Step 5. Enter OFF to power off the server, and enter YES when prompted to confirm the action.
IMPORTANT The main dc voltage is now removed from the system; however, ac voltage for
standby power is still present in the server.
Step 6. Unplug all power cables from the receptacles on the rear panel of the server.
Powering Off the Server Manually
To manually power off the server, follow these steps:
Step 1. Gracefully shut down the operating system.
Step 2. Press the power button to power off the server.
IMPORTANT The main dc voltage is now removed from the system; however, ac voltage for
standby power is still present in the server.
Step 3. Unplug all power cables from the receptacles on the rear panel of the server.
46
Chapter 1
2System Specifications
This chapter provides information on the basic system configuration, physical specifications, and
requirements for the HP 9000 rp3410 or rp3440 server.
This chapter addresses the following topics:
•“System Configuration” on page 47
•“Dimensions and Values” on page 48
•“Grounding” on page 49
•“Electrical Specifications” on page 49
•“Environmental Specifications” on page 51
•“Physical and Environmental Specifications” on page 54
System Configuration
Table 2-1 lists the minimum and maximum configuration options for the HP 9000 rp3410 and rp3440 servers.
Table 2-1Minimum and Maximum System Configurations
Componentrp3410rp3440
MicroprocessorsOne dual processor module with one or
two PA RISC processors enabled. Each
processor is 800 MHz/1.5 MB cache
with 32 MB or 64 MB L2 cache.
MemorySupports up to 12 double data rate
(DDR) registered ECC memory, in
PC2100 DIMMs. Maximum memory
capacity is 6 GB. Supported DDR
DIMM sizes: 256 MB, 512 MB, and 1
GB.
HDDsThree 36 GB, 15K RPM Ultra320 SCSI
hot-plug disks or
Three 73 GB, 15K RPM Ultra320 SCSI
hot-plug disks or
Three 146 GB, 10K RPM Ultra320
SCSI hot-plug disks.
One or two dual processor modules each
containing two PA RISC processors.
Each processor is 800 MHz/1.5 MB cache
or 1 GHz/1.5 MB with 32 MB or 64 MB
L2 cache.
Supports up to 12 double data rate
(DDR) registered ECC Memory, in
PC2100 DIMMs. Maximum memory
capacity is 32 GB if 4 GB DIMMs are
used. Supported DDR DIMM sizes:
256 MB, 512 MB, 1 GB, 2 GB, and 4 GB.
Three 36 GB, 15K RPM Ultra320 SCSI
hot-plug disks or
Three 73 GB, 15K RPM Ultra320 SCSI
hot-plug disks or
Three 146 GB, 10K RPM Ultra320 SCSI
hot-plug disks.
SCSIIntegrated Ultra-3 SCSI dual-channel
controller; 80 MB/s transfer rate with
one internal 68-pin connector and one
external 68-pin connector.
LANPCI GB, fast Ethernet controller.PCI GB, fast Ethernet controller.
Chapter 2
Integrated Ultra-3 SCSI dual-channel
controller; 80 MB/s transfer rate with
one internal 68-pin connector and one
external 68-pin connector.
47
System Specifications
Dimensions and Values
Table 2-1Minimum and Maximum System Configurations (Continued)
Componentrp3410rp3440
PCI slotsTwo 64-bit PCI-X slots, 133 MHz, 3.3V
slots.
Core I/OOne serial port, four USB 2.0 ports,
integrated RJ-45 LAN on iLO MP card.
DVDNone.IDE interface; 48x speed.
External storageOptional.Optional.
Power supplyOne 650W power supply. You can
install a second power supply to provide
redundant (N+1) capability.
Four 64-bit PCI-X slots, 133 MHz, 3.3V
slots.
One serial port, four USB 2.0 ports,
integrated RJ-45 LAN on iLO MP card.
One 650W power supply. You can install
a second power supply to provide
redundant (N+1) capability.
Dimensions and Values
Table 2-2 lists dimensions and their values of the HP 9000 rp3410 and rp3440 servers.
Table 2-2Server Dimensions and Values
DimensionValues
Rack dimensions (depth x width x height)
26.8 in (67.9 cm) max. x 19.0 in (48.3 cm) x3.4 in (8.6 cm)
Pedestal dimensions (depth x width x height)
Rack weight
Pedestal weight
Pedestal footprint
Rack units2U
26.6 in (67.5 cm) x 11.6 in (29.5 cm) x 19.5 in (49.4 cm)
Minimum: 38.6 lbs (17.5 kg)
Maximum: 49.0 lbs 22.2 kg
Minimum: 49.4 lbs 22.4 kg
Maximum: 56.3 lbs 25.5 kg
0.2 m
2
(2.1 sq. ft.)
48
Chapter 2
System Specifications
Grounding
Grounding
The site building shall provide a safety ground or protective earth for each ac service entrance to all cabinets.
Install a PE (protective earthing) conductor that is identical in size, insulation material, and thickness to the
branch-circuit supply conductors. The PE conductor must be green with yellow stripes. The earthing
conductor is to be connected from the unit to the building installation earth or, if supplied by a separately
derived system, at the supply transformer or motor-generator set grounding point.
Electrical Specifications
This section provides electrical specifications for the server.
AC Power Cords
Table 2-3 lists the power cables available for use with the HP 9000 rp3410 and rp3440 servers.
Table 2-3Power Cords
Part NumberDescriptionCountry
8120-5341Power Cord C15/S Africa 2.5m black CA ASSY 917South Africa
8120-1351Power Cord C13/BS-1363 2.3m black CA ASSY 900United Kingdom
Hong Kong
Singapore
8120-1369Power Cord C13/AS-3112 2.0m gray CA ASSY 901Australia
8120-1689Power Cord C13/CEE 7 2.0m black CA ASSY 902Europe
8120-2104Power Cord C13/SEV 12 2.0m black CA ASSY 906Switzerland
8120-8390Power Cord C15/CEI 23-16 2.5m black CA ASSY 920Argentina
8120-8389Power Cord C15/CEI 23-16 2.5m black CA ASSY 921Chile
8120-8376Power Cord C13/GB-1002 2.236m gray CA ASSY 922China
8121-0668Power Cord OPT-927 3-COND 2.3-M-LG FLNT 927South America
8120-6514C13/C14 Jumper cordAll
Chapter 2
49
System Specifications
Electrical Specifications
Circuit Breaker
The marked electrical for the server is 7.2 amps. The recommended circuit breaker size is 12 amps per line
cord (2 maximum) for North America. For countries outside North America, consult the local electrical
authority that has jurisdiction for the recommended circuit breaker size.
System Power Specifications
Available power (output) is the maximum dc power that the power supply can supply to the system.
Maximum input power is what the power supply requires from the ac line to deliver the maximum dc output
(given worst case efficiency and max loading).
Maximum input current is the worst case or highest current given the lowest input voltage and the maximum
input power.
Table 2-4 lists the system power specifications.
Table 2-4System Power Specifications
ParameterTotal Rating
Input voltage100 – 240 VACOffOff
Input current (max)7.2A at 115 VAC or
3.6A at 220 VAC
Input frequency50 to 60 HzOffOff
Measured input power560WOffOff
Available power (output)650WOff85W total for PCI sockets
Maximum current at +12V49A0.5AOff
Maximum current at –12V0.35AOff0.1A
Maximum current at +3.3V34AOff4.6A
Maximum current at +5V18A31A3A
Maximum current at +3.3V
standby
If an overload triggers the power supply overload protection, the system is immediately powered off. To reset
the power supply unit, follow these steps:
3.5AOffOff
Peak
(15 sec)
OffOff
Max. per PCI-X Sockets
64-bit, 133 MHz
1. Disconnect the power cord.
2. Determine what caused the overload by contacting a HP support representative.
3. Reconnect the power cord, then reboot the system.
If an overload occurs twice, there is an undetected short circuit somewhere.
When you use the front panel’s power button to power off the server, power consumption falls below the low
power consumption, but doesn’t reach zero. To reach zero power consumption in “off” mode, either unplug the
server or use a power block with a switch.
50
Chapter 2
System Specifications
Environmental Specifications
Power and Cooling
Typical power consumption for a server is 600W/2050 Btu/h. The power consumptions listed in Table 2-5 are
valid for a standard configuration as shipped (one 1 GHz processor, 6 GB of memory, 650W power supply,
three hard disk drives, one graphics card, one LVD SCSI card).
All information in this section is based on primary power consumptions.
Table 2-5 lists additional component power consumption information.
Table 2-5Additional Component Power Consumption
Additional ComponentPower Consumption
Processor130W443.6 Btu/h
SCSI hard disk drive (with I/O access)23W78.4 Btu/h
SCSI hard disk drive (idle)16W54.5 Btu/h
PCI card10W to 25W34.12 Btu/h to 85.30 Btu/h
Environmental Specifications
This section provides the temperature and humidity requirements, noise emission, and air flow specifications
for the server.
Operating temperature and humidity ranges might vary depending on the installed mass storage devices.
High humidity levels can cause improper disk operation. Low humidity levels can aggravate static electricity
problems and cause excessive wear of the disk surface.
Table 2-6 lists the environmental specifications for a system processing unit with a hard disk drive.
Table 2-6Environmental Specifications
ParameterValue
Operating temperature+5°C to +35°C (+40°F to +95°F)
Storage temperature–40°C to +70°C (–40°F to +158°F)
Over-temperature shutdown+40°C (+104°F)
Operating humidity15% to 80% relative (noncondensing)
Storage humidity8% to 85% relative (noncondensing)
Acoustic noise emission (ISO 7779)
Pedestal system
Sound power level
a
Typical configuration (disk idle)
Maximum configuration (disk idle)
Chapter 2
b
c
LwA = 5.1 BA
LwA = 5.4 BA
51
System Specifications
Environmental Specifications
Table 2-6Environmental Specifications (Continued)
ParameterValue
Maximum configuration (disk active)
Rack system
Typical configuration (disk idle)
Maximum configuration (disk idle)
Maximum configuration (disk active)
Operating altitude3048m (10,000 ft.) max
Storage altitude4600m (15,000 ft.) max
a. Typical configuration at room temperature (25°C).
b. One processor enabled, one or two SCSI hard disk drives and less than 8 GB of memory.
c. Two dual processors, one or two SCSI hard disk drives and less than 8 GB of memory.
c
b
c
c
LwA = 6.2 BA
LwA = 6.4 BA
LwA = 6.4 BA
LwA = 7.2 BA
Operating Environment
The system is designed to run continuously and meet reliability goals in an ambient temperature of 5°C to
35°C (+40°F to +95°F) at sea level. The maximum allowable temperature is de-rated 1°C per 1,000 feet of
elevation above 5,000 feet above sea level up to 30°C at 10,000 feet. For optimum reliability and performance,
the recommended operating range is 20°C to 25°C and 40% – 55% relative humidity.
Ambient intake air temperature is often different from ambient room temperature; you should measure the
operating temperature and humidity directly in front of the cabinet cooling air intakes rather than just
checking ambient room conditions.
Environmental Temperature Sensor
The server includes internal sensors that monitor input air temperature and server operating temperatures.
The ambient air temperature is measured using a sensor placed on the system I/O board. Data from the
sensor is used to control the fan speed and to initiate system overtemperature shutdown.
Nonoperating Environment
The system is designed to withstand ambient temperatures between –40°C to 70°C under nonoperating
conditions.
Cooling
This section provides information on the cooling systems in the server.
CPU and Memory Cooling
The server incorporates front to back airflow across the processor and memory extender boards and through
the HDD backplane. Two 127 mm dual fan assemblies, mounted vertically in the center of the chassis, pull air
through the processor and memory section and push air through the PCI section.
52
Chapter 2
System Specifications
Environmental Specifications
Each processor and memory dedicated dual fan assembly is controlled by smart fan control circuits embedded
in the system I/O board. The smart fan control circuit receives fan control input from the system fan
controller in the I/O board, and returns fan status information to the system fan controller. The smart fan
circuit controls the power and the pulse-width-modulated control signal to the fan and monitors the speed
indicator back from each of the fans. The fan status LED is driven by the smart fan circuit. The fan status
LED is located on the diagnostic board inside the system.
Bulk Power Supply Cooling
Cooling for the bulk power supplies is provided by one 120 mm dual fan assembly and one externally mounted
60 mm power supply fan. Air is pushed into both power supply bays by the 120 mm fan assembly and
exhausted out the rear by the 60 mm fan (one per power supply).
Air flows out of the rear of the chassis with minimal leakage into the cell airflow plenum.
NOTEA power supply filler is required in the unused power supply slot to maintain proper airflow
throughout the system.
PCI and Mass Storage Section Cooling
Two dual fan assemblies located at the center of the chassis provide airflow for all the PCI slots. Airflow is
over the processor and memory extender boards and into the PCI section. The fans are controlled by the
system temperature and run at the speed necessary to maintain proper internal temperature throughout the
chassis.
The air is pulled through openings in the front cover and the mass storage devices and pushed through the
PCI card cage.
Perforation is provided between and above the PCI card cage to enable proper exhaust ventilation to maintain
the required temperature rating of the PCI cards.
CAUTIONFor maximum cooling effects, ensure that the chassis ventilation holes are not blocked or
covered after installation.
Acoustic Noise Specification
The acoustic noise specification for the HP 9000 rp3410 or rp3440 servers is as follows:
•53 db LpA (sound pressure level at bystander position in a dedicated computer room environment
temperature of <25°C)
Chapter 2
53
System Specifications
Physical and Environmental Specifications
Physical and Environmental Specifications
Table 2-7 provides temperature and airflow information for minimum, typical, and maximum configurations
for the HP 9000 rp3410 and rp3440 servers. It also lists the server and rack weights and dimensions.
Table 2-7Physical and Environmental Specifications
Condition
Typical
Heat
Release
100-250
VAC
Airflow, Nominal
Airflow, at
Maximum
Ambient
degrees C
Wei ght
a
Server
Alone
Rack
Pede-
stal
Overall Server
(W x D x H)
Rack
Pede-
stal
Min.
Config.
Max.
Config.
Typical
Config.
ASHRAE
Class 1
341 Watts
536 Watts
426 Watts
57.8
CFM
98.3
3
m
/hr
Airflow cooling scheme (front to
rear)
68.2
CFM
115.94
m3/hr
Min./
Config.
Max.
Config.
38.6 lbs
(17.5 kg)
One dual-core CPU, one power supply, 2 GB
DIMM, zero DVD, three HDDs.
Two dual-core CPUs, one power supply, 32 GB
DIMM, one DVD, three HDDs, one graphics card,
one SCSI card.
Typical
Config.
One dual-core CPU, one power supply, 6 GB
DIMM, one DVD, three HDDs, one graphics card,
one SCSI card.
a. Derate maximum dry bulb temperature 1 degree per 300 meters above 900 meters.
49.0 lbs
(22.2 kg)
56.3 lbs
(25.5 kg)
W: 19.0 in
(48.3 cm)
D: 26.8 in
(67.9 cm)
H: 3.4 in
(8.6 cm)
W: 11.6 in
(29.5 cm)
D: 26.6 in
(67.5 cm)
H: 19.5 in
(49.4 cm)
54
Chapter 2
3Installing the System
This chapter provides information on how to install the system.
This chapter addresses the following topics:
•“Introduction” on page 55
•“Unpacking and Inspecting the Server” on page 61
•“Installing Additional Components” on page 63
•“Installing the Server Into a Rack, Non-HP Rack, or Pedestal” on page 104
•“Connecting the Cables” on page 105
•“Console Setup” on page 107
•“Accessing the Host Console” on page 116
•“Powering the Server ON and OFF” on page 119
•“Booting the Operating System” on page 121
•“Troubleshooting” on page 124
Introduction
The HP 9000 rp3410 server is a 1P/1C, 1P/2C, rack- or pedestal-mount server. Similarly, the HP 9000 rp3440
server is a 1P/1C, 1P/2C, 2P/2C or 2P/4C rack- or pedestal-mount server. Both of these servers are based on
the PA-RISC processor family architecture. The server accommodates up to 12 DIMMs and internal
peripherals including disks and DVD. Its high availability features include hot-swappable power supplies and
hot-pluggable disk drives. The supported operating system is HP-UX 11i v1 (and newer HP-UX versions that
support PA-RISC systems).
Chapter 3
55
Installing the System
Introduction
Server Views
Figure 3-1, Figure 3-2, Figure 3-3, and Figure 3-4 show the front, rear, and pedestal-mount views of the HP
9000 rp3410 and rp3440 servers.
Figure 3-1HP 9000 rp3410/rp3440 Server (Front View)
Figure 3-2HP 9000 rp3410/rp3440 Server (Front View with Bezel Removed)
Figure 3-3HP 9000 rp3410/rp3440 Server (Rear View)
56
Chapter 3
Figure 3-4HP 9000 rp3410/rp3440 Server (Pedestal Mount)
Installing the System
Introduction
Chapter 3
57
Installing the System
Introduction
Detailed Server Description
The following sections list the main subsystems within the HP 9000 rp3410 and rp3440 servers.
Fea t ures
Table 3-1 lists the features of the HP 9000 rp3410 and rp3440 servers.
Table 3-1HP 9000 rp3410 and rp3440 Server Features
HP-UX 11i v1, HP-UX 11i v2, and HP-UX
11i v3 (choice of Enterprise,
Mission-Critical, Technical Computing,
and Foundation operating environments)
Chapter 3
Installing the System
Introduction
Firmware
Firmware consists of many individually linked binary images that are bound together by a single framework
at run time. Internally, the firmware employs a software database called a device tree to represent the
structure of the hardware platform and to provide a means of associating software elements with hardware
functionality.
The firmware incorporates Boot Console Handler (BCH) which provides an interface between the operating
system and the platform firmware.
The firmware supports the HP-UX 11i version 1 (and higher HP-UX versions that support PA-RISC systems)
operating system through the HP 9000 processor family standards and extensions, and has no operating
system-specific functionality included. The operating system is presented with the same interface to system
firmware, and all features are available to the operating system.
Event IDs for Errors and Events
The server firmware generates event IDs similar to chassis codes for errors, events, and forward progress to
the Integrity Integrated Light-Out Management Processor (iLO MP) through common shared memory. The
Integrity iLO MP interprets and stores event IDs. Reviewing these events helps you diagnose and
troubleshoot problems with the server.
Dimensions and Values
Table 3-2 lists the dimensions and their values of the HP 9000 rp3410 and rp3440 servers.
Table 3-2Server Dimensions and Values
DimensionsValues
Rack dimensions (depth x width x height)
Pedestal dimensions (depth x width x height)
Rack weight
Pedestal weight
Pedestal footprint2.1 sq ft (0.2 m2)
Rack units2U
26.8 in (67.9 cm) max x 19.0 in (48.3 cm) x 3.4 in (8.6 cm)
26.6 in (67.5 cm) x 11.6 in (29.5 cm) x 19.5 in (49.4 cm)
Minimum: 38.6 lbs (17.5 kg)
Maximum: 49.0 lbs (22.2 kg)
Minimum: 49.4 lbs (22.4 kg)
Maximum: 56.3 lbs (25.5 kg)
Safety Information
Use care to prevent injury and equipment damage when performing removal and replacement procedures.
Voltages might be present within the server. Many assemblies are sensitive to damage by electrostatic
discharge.
Follow the safety conventions listed below to ensure safe handling of components, to prevent injury, and to
prevent damage to the server:
•When removing or installing any server component, follow the instructions provided in this guide.
•If installing a hot-swappable or hot-pluggable component when power is applied (fans are running),
reinstall the server cover immediately to prevent overheating.
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•If installing a hot-pluggable component, complete the required software intervention before removing the
component.
•If installing an assembly that is neither hot-swappable, nor hot-pluggable, disconnect the power cable
from the external server power receptacle.
WARNINGEnsure that the server is powered off and all power sources are disconnected from
the server before removing or installing server hardware unless you are removing or
installing a hot-swappable or hot-pluggable component.
Voltages are present at various locations within the server whenever a dc power
source is connected. This voltage is present even when the main power switch is
turned off.
Failure to observe this warning can result in personal injury or damage to
equipment.
•Do not wear loose clothing that can snag or catch on the server or on other items.
•Do not wear clothing subject to static charge build up, such as wool or synthetic materials.
•If installing an internal assembly, wear an antistatic wrist strap and use a grounding mat, such as those
included in the Electrically Conductive Field Service Grounding Kit (HP 9300-1609).
•Handle accessory boards and components by the edges only. Do not touch any metal-edge connectors or
any electrical components on accessory boards.
Installation Sequence and Checklist
Follow the steps in Table 3-3 sequentially to ensure successful installation of the server.
Table 3-3Installation Sequence Checklist
StepDescriptionCompleted
1Unpack and inspect the server shipping container; inventory the contents using
the packing slip.
2Install additional components shipped with the server.
3Install the server into a rack- or pedestal-mount.
4Connect cables to the server.
4aConnect dc input power cable.
4bConnect LAN core I/O cable.
5Set up the console.
6Power on the server.
7Access the console.
8Boot the operating system.
9Verify the server configuration.
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Unpacking and Inspecting the Server
Unpacking and Inspecting the Server
This section describes procedures you perform before installation. Ensure that you have adequately prepared
your environment for the new server, received the components that you ordered, and verified that the server
and its containers are in good condition after shipment.
Verifying Site Preparation
Verifying site preparation is an essential factor of a successful server installation and includes the following
tasks.
Step 1. Gather LAN information and determine the two separate IP addresses for the iLO MP LAN and
the system LAN.
Step 2. Establish a method to connect to the server console.
Step 3. Verify electrical requirements and ensure that grounding specifications and power requirements
have been met.
Step 4. Validate server physical space requirements.
Step 5. Confirm environmental requirements.
Inspecting the Shipping Containers for Damage
HP shipping containers protect their contents under normal shipping conditions. After the equipment arrives,
carefully inspect each carton for signs of shipping damage. Shipping damage constitutes moderate to severe
damage, such as punctures in the corrugated carton, crushed boxes, or large dents. Normal wear or slight
damage to the carton is not considered shipping damage. If you find shipping damage to the carton, contact
your HP customer service representative immediately.
Unpacking the Server
To unpack a non-racked server, follow these steps.
NOTEHP recommends the use of a lifter, such as a RonI Company model 17000 SP 400 lifting device,
when moving a non-racked server.
Step 1. Use the instructions printed on the outside top flap of the carton; remove the banding and the outer
carton from the server pallet.
Step 2. Remove all inner accessory cartons and the top foam cushions, leaving only the server.
IMPORTANT Inspect each carton for shipping damage as you unpack the server.
Checking the Inventory
The sales order packing slip lists all of the equipment shipped from HP. Use this packing slip to verify that all
of the equipment has arrived.
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NOTETo identify each item by part number, see the sales order packing slip.
Returning Damaged Equipment
If the equipment is damaged, contact your HP customer service representative immediately. The service
representative initiates appropriate action through the transport carrier or the factory and assists you in
returning the equipment.
Unloading the Server with a Lifter
WARNINGUse caution when using a lifter. Because of the weight of the server, you must center
the server on the lifter forks before lifting it off the pallet to avoid injury.
To unload the server from the pallet using a lifter, follow these steps:
Step 1. Unpack the server.
Step 2. Unroll the bottom corrugated tray corresponding to the side on which the lifter will be placed, and
slide the server as close to that edge of the pallet as possible.
Step 3. Break off any foam packaging which could prevent the lifter from being fully inserted under the
server. Do not remove the foam packaging from the corners of the server. This foam is required to
elevate the server and enable the forks of the lifter to be placed under the server.
Step 4. Insert the lifter forks under the server.
Step 5. Carefully roll the lifters forward until it is fully against the side of the server.
Step 6. Slowly raise the server off the pallet until it clears the pallet cushions.
Step 7. Carefully roll the lifter and server away from the pallet. Do not raise the server any higher than
necessary when moving it over to the rack.
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Installing Additional Components
This section describes how to install server components that are not installed before delivery.
Removing and Replacing Server Covers and Bezels
To upgrade, remove, or replace most server components, you must first remove the covers from the server
chassis. This section explains how to remove and replace the covers for both rack and pedestal-mounted
configurations.
WARNINGDo not remove the server cover without first turning the server off and unplugging
the power cord from the outlet or power protection device unless you are only
replacing a hot-swappable fan. Always replace the cover before turning the server
on.
Rack-Mounted Server
To access the internal components on a rack-mounted server, pull the server out onto the rail guides and
remove the top cover.
Accessing a Rack-Mounted Server
HP 9000 rp3410 and rp3440 servers are designed to be rack mounted. The following procedure explains how
to gain access to a server that is mounted in an approved rack. For slide installation instructions, see the
Installation Guide, Mid-Weight Slide Kit (HP part number 5065-7291). This document can be accessed on the
Web at: http://www.hp.com/racksolutions.
WARNINGEnsure that all anti-tip features (front and rear anti-tip feet installed; adequate
ballast properly placed; and so on) are employed before extending the server.
Extend the Server from the Rack
NOTEEnsure that there is enough area (approximately 1.5 meters {4.5 ft.}) to fully extend the server
out the front to work on it.
To extend the server from the rack, follow these steps:
NOTEIf you are replacing a hot-swappable item, you can leave the server on and external cables
(including the power cord) connected.
Step 1. Power off the server and disconnect the power and external cables from the back of the server.
Step 2. Release the rack latches by rotating them outward.
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Figure 3-5 Release the Rack Latches
Step 3. Slide the server out of the rack until the guide-rail release clips are visible.
Insert the Server into the Rack
To insert the server into the rack, follow these steps:
Step 1. Press the rail clips on either side of the server inward and push the server into the rack until it
stops.
Step 2. Verify that the rack latches are closed.
Removing and Replacing the Top Cover on a Rack-Mounted Server
Removal of this cover is necessary when installing or removing many components.
Removing the Top Cover on a Rack-Mounted Server
NOTEIf you are replacing a hot-swappable item, you can leave the server on and external cables
(including the power cord) connected.
Step 1. Power off the server and disconnect the power and external cables from the back of the server.
Step 2. Ensure the top cover lock keyswitch is in the unlocked position. Rotate the blue release lever
toward the back of the server and slide the cover toward the back of the server.
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Figure 3-6 Removing and Replacing the Top Cover on a Rack-Mounted Server
Step 3. Lift the cover off the server chassis.
Installing the System
Installing Additional Components
Replacing the Top Cover on a Rack-Mounted Server
CAUTIONSecure any wires or cables in the server so they will not get cut or interfere with the
replacement of the cover.
Step 1. Align the front edge of the cover with the alignment mark on the optical drive bay.
Figure 3-7 Aligning the Top Cover
To replace cover,
align front edge here
then slide forward
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Step 2. Grasp the blue release lever and slide the cover toward the front of the server until the lever snaps
into place.
Figure 3-8 Closing the Top Cover
Step 3. Slide the server into the rack enclosure and reconnect the power and external cables.
Removing and Replacing the Front Bezel on a Rack-Mounted Server
You must remove the front bezel from the chassis to gain access to the power supplies and optical drive.
Removing the Front Bezel on a Rack-Mounted Server
Step 1. Press in on the retaining clips located on the right-side of the front panel.
Figure 3-9 Front Bezel Retaining Clip
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Step 2. Rotate the front panel outward and lift it off the server chassis.
Replacing the Front Bezel on a Rack-Mounted Server
Step 1. Insert the bezel latches into the matching slots on the server chassis.
Step 2. Close the bezel and push toward the front of the server until it locks into place.
Figure 3-10 Replacing the Front Bezel
Installing the System
Accessing a Pedestal-Mounted Server
NOTEIf you are replacing a hot-swappable item, you can leave the server on and external cables
(including the power cord) connected.
Removing the Side Cover on a Pedestal-Mounted Server
Step 1. Power off the server and disconnect the power and external cables.
Step 2. Remove the side cover.
a. Grasp both indentations at the top of the side panel and pull outward.
b. Lift the side cover off of the server chassis.
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Figure 3-11 Removing the Side Cover on a Pedestal-Mounted Server
Removing the Top Cover on Pedestal-Mounted Server
To remove the top cover, follow these steps:
Step 1. Turn the top cover lock keyswitch to the unlocked position.
Step 2. Rotate the blue release handle to release the latch.
Step 3. Slide the cover toward the back of the chassis and lift the cover off.
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Figure 3-12 Removing the Top Cover on a Pedestal-Mounted Server
Step 4. Remove the top cover.
Installing the System
Installing Additional Components
CAUTIONThe server depends on the access panels being closed for proper cooling of internal
components. Operating the server with the cover removed can cause the server to
quickly overheat.
Replacing the Top Cover on a Pedestal-Mounted Server
CAUTIONSecure any wires or cables in the server so they do not get cut or interfere with the replacement
of the cover.
To replace the top cover, follow these steps:
Step 1. Align the front edge of the top cover with the alignment mark on the optical drive bay.
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Figure 3-13 Top Cover Alignment Mark
To replace cover,
align front edge here
then slide forward
Step 2. Place the top cover on the chassis and slide it toward the front of the server until the blue release
lever snaps in place.
Figure 3-14 Replacing the Top Cover on a Pedestal-Mounted Server
Replacing the Side Cover on a Pedestal-Mounted Server
To replace the side cover, follow these steps:
Step 1. Align the cover’s mounting holes with the matching tabs on the server chassis.
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Figure 3-15 Replacing the Side Cover on a Pedestal-Mounted Server
Installing the System
Step 2. Close the cover until it snaps onto the server chassis.
Removing and Replacing Front Bezel on a Pedestal-Mounted Server
You must remove the front bezel from the chassis to gain access to the power supplies and optical drive.
Removing the Front Bezel on a Pedestal-Mounted Server
To remove the front bezel parts, follow these steps:
Step 1. Use the indentation at the top edge of the bezel to pull the bezel away from the chassis and to a 45
degree angle.
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Figure 3-16Removing the Front Bezel on a Pedestal-Mounted Server
Step 2. Lift the bezel off the mounting tabs and away from the chassis.
Replacing the Front Bezel on a Pedestal-Mounted Server
To replace the front bezel parts, follow these steps:
Step 1. Position the bezel at an approximate 45 degree angle and align the retaining slots at the bottom
with the retaining tabs on the chassis. Press the bezel against the chassis to engage the tabs.
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Figure 3-17Aligning the Pedestal Front Bezel
Installing the System
Installing Additional Components
Step 2. Rotate the bezel against the chassis so that it snaps into place.
Installing Internal Hard Disk Drives
This section provides information about installing additional internal hard disk drives.
CAUTIONA hot-pluggable device can require interaction with the operating server before the device can
be safely installed into the server. Verify that the operating system supports installing disk
drives while the operating system is running. If the operating system does not support this
feature, shut down the operating system before attempting this procedure. Failure to observe
this caution will result in system failure.
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Figure 3-18Front View of the HP 9000 rp3410/rp3440 Server
Control PanelDVD Drive
LVD H D D 3
LVD HDD 2
LVD HDD 1
Two additional hard disk drives can be added to the server in slots 2 and 3. Always use low profile disk drives
(1 inch height) in HP 9000 rp3410 and rp3440 servers.
To install a hard disk drive, follow these steps:
Step 1. If you will be locking the hard drive in place, you must remove the cover to access the hard drive
lock. Proceed as follows:
a. If rack-mounted, slide the server out from the rack until it stops. (See “Extend the Server from
the Rack” on page 63.)
b. Remove the cover and bezel. (See “Removing and Replacing Server Covers and Bezels” on
page 63.)
Step 2. Remove the slot filler that is installed in the slot where the additional drive is to be installed.
System Product
Label (pull-out)
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Figure 3-19 Filler Removal from Slot 1
Installing the System
Installing Additional Components
Step 3. Slide the hard disk drive into the slot until it is seated.
Figure 3-20 Disk Drive Installation in Slot 3
Step 4. Close the drive ejector handle by pushing it down until it clicks.
Step 5. If desired, lock the hard drive in place.
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a. Press the hard drive locking lever down into the locked position.
b. Replace the cover and bezel. (See “Removing and Replacing Server Covers and Bezels” on
page 63.)
Figure 3-21 Hard Drive Lock
Step 6. Verify the drive installation by using the system utilities.
•Use the iLO MP commands to verify operation.
•Use the BCH commands to verify operation.
•Use diagnostics provided by the offline diagnostic environment to exercise the module added.
Step 7. If rack-mounted, slide the server back into the rack until it stops.
Step 8. Check the installation of the hard disk drive by powering on the server and checking the virtual
front panel and System Event Log (SEL) for correct status for the hard disk drive.
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Installing a DVD Drive
Install a DVD drive behind the front bezel.
WARNINGEnsure that the server is powered off and all power sources have been disconnected
from the server before removing or replacing a removable media drive.
Voltages are present at various locations within the server whenever an ac power
source is connected. This voltage is present even when the main power switch is in
the off position.
Failure to observe this warning can result in personal injury or damage to
equipment.
CAUTIONObserve all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions can result in damage to the server. Failure to properly complete the steps in
this procedure will result in erratic server behavior or system failure. For assistance with this
procedure contact your local HP Authorized Service Provider.
Figure 3-22DVD Drive Installation
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Installing the DVD Drive
To install a DVD drive, follow these steps:
Step 1. Power off the server and disconnect power and external cables.
Step 2. Remove the front bezel and cover. (See “Removing and Replacing Server Covers and Bezels” on
page 63.)
Step 3. If a removable media drive has not previously been installed in the server, the drive slot will be
covered with a DVD drive filler. Remove the DVD drive filler.
Step 4. Slide the drive into the drive bay until it stops sliding and the retaining clips on both sides of the
drive snap into place (Figure 3-22).
Step 5. Connect the IDE cable on the back of the drive (Figure 3-22).
Step 6. Replace the cover and bezel. (See “Removing and Replacing Server Covers and Bezels” on page 63.)
Step 7. Reconnect the power and external cables and turn on the server.
Step 8. Verify the drive operation by using the system utilities.
•Use the iLO MP commands to verify operation.
•Use the BCH commands to verify operation.
•Use diagnostics provided by the offline diagnostic environment to exercise the newly installed
module.
Removing and Replacing Airflow Guides
You must remove airflow guides before installing processors or memory. The server has the following airflow
guides:
•The processor airflow guide ensures that the proper volume of air for cooling the dual processor module
power pods, processor modules, and voltage regulator modules flows over these components. You must
remove the processor airflow guide before removing or installing a dual processor module.
•The memory airflow guide ensures that the proper volume of air flows over the memory DIMMs to cool
them. You must remove the memory airflow guide to access memory DIMMs and sockets.
NOTEAir flows through the server from front to back.
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Figure 3-23Airflow Guides Locations
Installing the System
Installing Additional Components
Memory Airflow Guide
Removing and Replacing the Memory Airflow Guide
Removing the Memory Airflow Guide
Step 1. Power off the server and disconnect power and external cables.
Processor Airflow Guide
Front Portion of Processor
Airflow Guide
Step 2. Remove the server chassis cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted
Server” on page 64.)
Step 3. Grasp the memory airflow guide and lift it out of the server.
Figure 3-24 Removing the Memory Airflow Guide
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Replacing the Memory Airflow Guide
Step 1. Align the guides on both sides of the airflow guide with the slots on the chassis.
Step 2. Insert the memory airflow guide in the slots.
Step 3. Replace the cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server” on
page 64.)
Removing and Replacing the Processor Airflow Guide
Removing the Processor Airflow Guide
Step 1. Power off the server, disconnect power and external cables.
Step 2. Remove the server cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server”
on page 64.)
Step 3. Remove the IDE cable and power module cables from the processor airflow guide cable clips.
Step 4. Remove the main portion of the airflow guide:
a. Hold the guide using the opening on top of the guide.
b. At the same time, grasp the back end of the processor airflow guide and lift the guide out of the
server.
Figure 3-25 Removing the Processor Airflow Guide
Step 5. Grasp system fan 1A and lift it from its socket.
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Figure 3-26 Removing Fans 1A and 1B
Installing the System
Installing Additional Components
Fan 1A
Fan 1B
Step 6. Grasp system fan 1B and lift it from its socket (Figure 3-26).
Step 7. Remove the memory airflow guide. “Removing the Memory Airflow Guide” on page 79
Step 8. Rotate the clip clockwise to release the latch.
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Figure 3-27 Open the Release Clip
Step 9. Disconnect the power cable connected to the guide from the system board by squeezing the clips.
Step 10. Lift the front portion of the processor airflow guide out of the server.
Figure 3-28 Remove the Front Portion of the Processor Airflow Guide
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Replacing the Processor Airflow Guide
Step 1. Replace the front portion of the airflow guide:
a. Align the release latch of the front half of the airflow guide over the release latch post and snap
it in place.
b. Connect the power connector on the front portion of the guide to the connector on the system
board.
Step 2. Insert system fans 1A and 1B into their mounting positions.
Step 3. Route the processor turbo fan power cables through the processor heatsink posts so that the cables
will not be pinched between the heatsink posts and the processor airflow guide (Figure 3-29).
CAUTIONTurbo fan power cables can be damaged if pinched between the heatsink posts and
the processor airflow guide. Ensure that the cables are below the top surface of the
heatsink posts before installing the processor airflow guide.
Figure 3-29 Routing the Turbofan Power Cables through Heatsink Posts
Step 4. Replace the main portion of the airflow guide:
a. Hold the opening on top of the processor airflow guide.
b. At the same time, grasp the back end of the airflow guide and insert the airflow guide into the
server.
c. Connect the power module cable.
d. Place the power and IDE cables in the cable clips.
e. Insert the two airflow guide retaining tabs into the two slots on the front half of the airflow
guide.
f. Replace the memory airflow guide. “Replacing the Memory Airflow Guide” on page 80
Step 5. Replace the server cover.
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Installing Additional System Memory
The server has 12 memory sockets for installing DDR SDRAM memory modules. System memory DIMMs are
located on the system board.
WARNINGEnsure that the server is powered off and all power sources have been disconnected
from the server before removing or replacing system memory.
Voltages are present at various locations within the server whenever an ac power
source is connected. This voltage is present even when the main power switch is in
the off position.
Failure to observe this warning can result in personal injury or damage to
equipment.
CAUTIONObserve all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions can result in damage to the server.
Supported DIMM Sizes
Supported DIMM sizes are as follows:
•256 MB
•512 MB
•1 GB
•2 GB)
•4 GB (HP 9000 rp3440 only). If 4 GB DIMMs are used, only one configuration (8 X 4 GB in the first eight
sockets) is supported.
Dissimilar DIMM sizes can be used across the entire system board (except when 4 GB DIMMs are used) but
both DIMMs in a pair (first group of four, connectors 0A and 0B of HP 9000 rp3410) and all four DIMMs of
any quad must be identical.
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Figure 3-30DIMM Slot Identification
Rear
Pair 6 (5A&5B)
Pair 4 (3A&3B)
Pair 2 (1A&1B)
Cell 1
Installing the System
Installing Additional Components
Cell 0
Pair 1 (0A&0B)
Pair 3 (2A &
Pair 5
Installing System Memory
1B
0B
5B
4B
1A
3B
2B
3A
5A
0
2A
4A
Quad 1 = Pair 1 & Pair 2
Quad 2 = Pair 3 & Pair 4
Quad 3 = Pair 5 & Pair 6
Front
When adding DIMMs, you must use a minimum of four like-sized DIMMs in the next available quad. If you
are installing DIMMs of different sizes, you must install the largest DIMMs (most memory) in the first quad.
DIMMs in the second quad can be equal to or smaller than (less memory) the DIMMs in the first quad. If you
install DIMMs in the third quad, they must be equal to or smaller than the DIMMs in the second quad.
rp3410 Memory Configuration T
The HP 9000 rp3410 server supports DDR SDRAM DIMMs with ECC and chip spare protection. This server
has 12 DIMM slots and supports a maximum of six GB of total system memory. Memory usage in the server
varies with the model designation.
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In the original server (model A7136A), memory can be installed as one or two pairs in the first quad (group of
four). This allows memory configurations of two, four, eight, or twelve DIMMs. In the current server (model
A7136B), memory must be installed as quads (groups of four). This allows memory configurations of four,
eight, or twelve DIMMs. Thus, the HP 9000 rp3410 server must include a minimum of 512 MB (model
A7136A) or 1 GB (model A7136B) and can include up to six GB of memory in combinations of 256 MB, 512
MB, and 1 GB DIMMs. Different size DIMMs can be installed in the server, but all four DIMMs in a quad
must be identical.
Memory Loading Rules and Performance Guidelines
•DIMMs must be installed in server load sequence (the first DIMM must be in the first slot, the second
DIMM must be in the second slot, and so on).
•A minimum of 512 MB (2 x 256 MB DIMMs in a model A7136A server) or 1 GB (4 x 256 MB DIMMs in a
model A7136B server) of memory must be installed in a HP 9000 rp3410 server.
•Maximum memory is 6 GB.
•A minimum of two DIMMs (one pair) is required in the model A7136A server.
•A minimum of four DIMMs (one quad) is required in the model A7136B server.
•All DIMMs within a quad must be identical.
•Memory can be ordered in amounts of 1 GB (4 x 256 MB), 2 GB (4 x 512 MB), 4 GB (4 x 1 GB), 8 GB (4 x 2
GB), and 16 GB (4 x 4 GB).
•Memory is loaded across both memory busses (two DIMMs on each bus) to ensure maximum bandwidth
and performance.
•Total memory bandwidth is 8.5 GB/s, split across two 4.25 GB/s memory buses.
•Open page memory latency is 80 nanoseconds.
rp3440 Memory Configuration
The HP 9000 rp3440 supports DDR SDRAM DIMMs with ECC and chip spare protection. This server has 12
DIMM slots, but maximum system memory is 32 GB due to cooling limitations. Memory must be installed as
quads (groups of four). This allows memory configurations of four, eight, or twelve DIMMs. Thus, the HP 9000
rp3440 server must include a minimum of 1 GB and can include up to 24 GB of memory in combinations of
256 MB, 512 MB, 1 GB, and 2 GB DIMMs, or 32 GB of memory consisting of eight 4 GB DIMMs. Different size
DIMMs can be installed in the server (except when 4 GB DIMMs are used), but all four DIMMs in a quad
must be identical.
Memory Loading Rules and Performance Guidelines
•Minimum memory is 1 GB (4 x 256 MB).
•Maximum memory is 32 GB (8 x 4 GB installed in the first eight slots—the remaining slots must remain
empty if 4 GB DIMMs are installed).
•Memory DIMMs must be installed in groups of four (quads).
•All DIMMs within a quad must be identical.
•Memory must be loaded in the specific order outlined on the system board.
•Memory can be ordered in amounts of 512 MB (2 x 256 MB), 1 GB (4 x 256 MB), 2 GB (4 x 512 MB), 4 GB
(4 x 1 GB), 8 GB (4 x 2 GB), and 16 GB (4 x 4 GB).
•Each quad of memory is loaded across both memory buses (two DIMMs on each bus) to ensure maximum
bandwidth and performance.
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•Total memory bandwidth is 8.5 GB/s, split across two 4.25 GB/s memory buses.
•Open page memory latency is 80 nanoseconds.
The memory subsystem supports chip-spare functionality. Chip spare enables an entire SDRAM chip on a
DIMM to be bypassed (logically replaced) in the event that a multi-bit error is detected on that SDRAM.
In order to use the chip spare functionality, only DIMMs built with x4 SDRAM parts can be used, and these
DIMMs must be loaded in quads (two DIMMs per memory cell, loaded in the same location in each memory
cell).
System Firmware Requirements
If you are using 4 GB DIMMs in a HP 9000 rp3440 server, system firmware must be greater than revision
44.24. Use the BCH FV command, or the iLO MP SR command to display the system firmware revision status.
If necessary, use the iLO MP SR command to upgrade system firmware. (Detailed instructions are downloaded
with the upgrade.)
Installation Procedure
To install DIMMs, follow these steps:
Step 1. Power off the server and disconnect all power and external cables.
Step 2. Remove the server cover. (See “Removing and Replacing Server Covers and Bezels” on page 63.)
Step 3. Remove the memory airflow guide. (See “Removing the Memory Airflow Guide” on page 79.)
CAUTIONTo ensure that memory modules are not damaged during removal or installation,
power off the server and unplug the power cord from the ac power outlet. Wait until
the LED on the back of the power supply turns off before removing or installing
memory.
Step 4. Locate the slot into which the DIMM will be installed. Holding the memory module by its left and
right edges, insert the module into the socket (Figure 3-31.)
NOTEThe memory modules are keyed and can only be inserted in one direction. When the
module is correctly seated, the retainer clips will return to their fully upright
position. Snap the clips firmly into place to ensure that the DIMMs are seated
properly.
Step 5. Evenly push down firmly on each end of the DIMM until it seats in the socket. Ensure the
extraction levers are in the closed position.
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Figure 3-31 Inserting DIMM into Connector
Step 6. Replace the memory airflow guide. (See “Replacing the Memory Airflow Guide” on page 80.)
Step 7. Replace the server cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server”
on page 64.)
Step 8. Reconnect all power and external cables and turn on the server.
Step 9. Verify the memory installation by using the system utilities.
•Use the iLO MP commands to verify operation.
•Use the BCH commands to verify operation.
•Use diagnostics provided by the offline diagnostic environment (ODE) to exercise the memory
added.
Removing and Replacing the PCI Card Cage
Accessory cards are installed in a removable PCI card cage. This section explains how to remove and replace
the PCI card cage. Removal is required to install accessory cards.
Removing the PCI Card Cage
To remove the PCI card cage from the server, follow these steps:
Step 1. Remove the cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server” on
page 64.)
Step 2. Disconnect the cables from the PCI cards.
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Step 3. Lift up on the PCI card cage release lever and the back edge of the PCI card cage and lift the PCI
card cage out of the server.
Figure 3-32 Removing the PCI Card Cage
Step 4. Grasp the PCI card cage cover and slide it away from the bulkhead end of the cage, then lift the
cover off.
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Figure 3-33 Removing the PCI Card Cage Cover
Step 5. Unscrew the bulkhead screw that holds the accessory card holder (if installed) in place.
Step 6. The PCI slots are now accessible for installation of additional cards.
Replacing the PCI Card Cage
To replace the PCI card cage, follow these steps:
Step 1. Hold the PCI card cage cover in mounting position and slide it toward the bulkhead end of the cage.
Step 2. Hold the PCI card cage above the chassis mounting position, such that the bulkhead end of the cage
is toward the rear of the server. (Figure 3-32.)
Step 3. Hold the PCI card cage release lever in the raised position and lower the card cage into the server
chassis.
Step 4. Press the PCI card cage release lever into the lowered position to lock the card cage into the server
chassis.
Installing PCI Cards
The server can contain up to 4 PCI cards. PCI cards are located in the PCI card cage. The HP 9000 rp3410
server provides two 64-bit, 133 MHz PCI-X card sockets as slots 1 and 2. The HP 9000 rp3440 server provides
four 64-bit, 133 MHz PCI-X card sockets as slots 1 through 4.
HP 9000 rp3410 and rp3440 servers have the following accessory card sockets:
•Four 64-bit, 133 MHz PCI-X card sockets.
WARNINGEnsure that the server is powered off and all power sources have been disconnected
from the server before removing or replacing a PCI card.
Voltages are present at various locations within the server whenever an ac power
source is connected. This voltage is present even when the main power switch is in
the off position.
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Failure to observe this warning can result in personal injury or damage to
equipment.
CAUTIONObserve all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions can result in damage to the server.
Carefully read the following information concerning PCI slot configuration. Inserting a PCI card into a slot
that is not configured to accept it can cause operation failure or the PCI card to operate at less than optimum
speed. PCI slots are numbered 1 (top of card cage) through 4 (bottom of card cage). See the labels on the rear
panel of the chassis for correct PCI slot number identification.
Installing a PCI Card
Step 1. Remove the cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server” on
page 64.)
Step 2. Remove the PCI cage. (See “Removing the PCI Card Cage” on page 88.)
Step 3. Grasp the edges of the PCI card to be installed and evenly press the card into the PCI backplane
connector.
Figure 3-34 Installing a PCI Card
Step 4. Connect any internal cables that are required by the PCI card.
Step 5. Install the accessory card holder and secure in place by tightening the associated bulkhead screws.
Step 6. Reinstall the PCI cage. (See “Replacing the PCI Card Cage” on page 90.)
Step 7. Replace the cover. (See “Removing and Replacing the Top Cover on a Rack-Mounted Server” on
page 64.)
Step 8. Verify the PCI card installation by using the system utilities.
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•Use the iLO MP commands to verify operation.
•Use the BCH commands to verify operation.
•Use diagnostics provided by the offline diagnostic environment to exercise the card added.
Installing an Additional Power Supply
The supported configuration of the HP 9000 rp3410 and rp3440 servers requires a minimum of one power
supply to be installed. A second, optional hot-swappable power supply, can be installed to provide redundant
(N+1) capability.
The power supplies in the server are hot-swappable; that is, if one power supply stops working or exhibits
voltage problems, the remaining supply can support the server until the failed unit is replaced. A power
supply can be removed and replaced without turning off the server on servers with two power supplies.
CAUTIONBefore removing a power supply, make sure the second power supply functions properly. The
two green LEDs inside the supply must both be lit on the second supply before the failed power
supply can be safely removed.
To replace the power supply, follow these steps:
Step 1. Remove the front bezel from the server (See “Removing and Replacing Front Bezel on a
Pedestal-Mounted Server” on page 71.)
Step 2. Remove the power supply filler panel.
Figure 3-35 Removing the Power Supply Filler Panel
Power Supply 1
Step 3. Open the power supply release lever and slide the power supply into place.
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Figure 3-36 Replacing the Power Supply
Installing the System
Installing Additional Components
Power Supply
Power Supply 1
Step 4. Push in on the power supply release lever to lock the retaining clip in place.
Step 5. Replace the front bezel. (See “Removing and Replacing Front Bezel on a Pedestal-Mounted Server”
on page 71.)
Step 6. Verify that both power supply LEDs are lit.
Step 7. Use the iLO MP PS command to verify power supply operation.
Installing an Additional Processor Module
This section provides information about installing dual processor modules. The modules are located on the
system board which is accessible by removing the server cover.
The HP 9000 rp3410 server supports one processor socket. This socket will accept one dual processor module
which contains two 800 MHz CPUs. The HP 9000 rp3410 server 1P/1C configuration includes two CPUs in a
single module, but only one CPU is enabled. (The second CPU can be enabled as part of a server upgrade.)
The HP 9000 rp3440 server supports two processor sockets. Each socket will accept one dual processor
module which contains either two 800 MHz CPUs or two 1 GHz CPUs.
WARNINGEnsure that the server is powered off and all power sources have been disconnected
from the server before removing or replacing a dual processor module.
Voltages are present at various locations within the server whenever an ac power
source is connected. This voltage is present even when the main power switch is in
the off position.
Failure to observe this warning can result in personal injury or damage to
equipment.
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CAUTIONFailure to properly complete the steps in this procedure will result in erratic server behavior or
system failure. For assistance with this procedure contact your local HP Authorized Service
Provider.
Observe all ESD safety precautions before attempting this procedure. Failure to follow ESD
safety precautions can result in damage to the server.
NOTEProcessor tool kit (HP part number 5069-5441) is required for installation of a processor
module.
Processor modules are located on the system board. The system board can support either one or two dual
processor modules. The CPU0 socket is located at the right of the system board and the CPU1 socket is
located at the left of the system board next to the bridge assembly. In a 1P/1C, 1P/2C server, the single dual
processor module must be installed in the CPU0 socket.
Install a second dual processor module as follows:
Step 1. Power off the server and disconnect all power and external cables.
Step 2. Remove the cover. (See “Removing and Replacing Server Covers and Bezels” on page 63.)
Step 3. Remove the memory airflow guide. (See “Replacing the Memory Airflow Guide” on page 80.)
Step 4. Remove the processor airflow guide. (See “Removing the Processor Airflow Guide” on page 80.)
Step 5. Unlock the dual processor module locking mechanism using the CPU install tool (2.5 mm driver or
Allen Wrench). Insert the tool into the hole that runs down through the edge of the heatsink and
rotate the special processor tool 180 degrees counterclockwise. Verify that the dual processor
module socket locking mechanism is rotated into the unlocked position.
Figure 3-37 Unlocking the Dual Processor Module Locking Mechanism
CPU Install Tool
(2.5 mm Driver or
Allen Wrench)
Step 6. Remove any protective packaging from the processor module.
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NOTEProtective covers can be installed to protect connector pins. These covers can be
saved for future use.
Step 7. Use the four locator posts on the heatsink and the turbo fan power cable to properly align the fan
and dual processor module on the system board. The four locator posts will fit in locator holes on
the system board processor module mount. The turbo fan power cable must be positioned so that it
is located on the side of the heatsink that faces the front of the server.
Figure 3-38 Aligning the Processor Module
Step 8. Use the special CPU install tool (2.5 mm driver or Allen Wrench) to lock the dual processor module
in place on the system board. To do this, insert the CPU install tool into the hole that runs down the
side of the heatsink and rotate it clockwise 180 degrees.
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Figure 3-39 Locking the Dual Processor Module in Place
CPU Install Tool
(2.5 mm Driver or Allen
Wrench)
Step 9. Slide the sequencing retainer plate toward the front of the server.
Figure 3-40 Slide the Sequencing Retainer Plate
Step 10. Screw in the four heatsink captive screws in a criss-cross torquing pattern by alternately
tightening the screws so as not to completely tighten one screw before the others.
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Figure 3-41 Secure the Captive Screws
CPU Install Tool
Installing the System
Installing Additional Components
Step 11. Locate the two power pod module shims on the system board. (On servers delivered with only one
dual processor module installed, the power module shims are held in place by screws with plastic
spacers over the threads.) Remove the holding screws and discard the plastic spacers. Retain the
screws for use when installing the power module.
Figure 3-42 Power Module Shims
Screws
Spacers
Shims
Step 12. Slide the power pod module on the system board’s metal mounting bracket so that the power pod
module connector connects with its connector on the processor module.
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Figure 3-43 Aligning the Processor Module Power Pod
Step 13. Align the two mounting screw holes on the power pod module with the screw holes in the shims on
the system board’s metal mounting bracket. Screw in the power pod module mounting screws. (Use
the screws removed in step 11.)
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Figure 3-44 Installing the Processor Module Power Pod Mounting Screws
Step 14. Connect the power pod cable to the power connector on the system board.
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Figure 3-45 Connecting the Power Pod Cable
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