THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
C
2008/09/152009/12/31
Compal Secret Data
Deciphered Date
D
Title
Size Document NumberRev
Custom
Date:Sheet
Compal Electronics, Inc.
Cover Sheet
LA-4902P
E
of
147Monday, December 14, 2009
0.3
A
Compal Confidential
B
C
Cartier UMA
D
XDP Conn.
Page 4
E
Accelerometer
LIS302DLTR
File Name : LA-4902P
11
22
Express Card 54
EMC2113
DP Panel
VGA
Display Port
PCIE X1 + USB X1
Audio Board
Page 4
Page 20
Page 18
Page 19
WWAN Card
PCIE X1
Thermal Sensor
Fan Control
Page 24
Page 4
USB2.0
eDP
DP-D
FDI
Intel Ibex Peak M
PCI-E BUS
10/100/1000 LAN
Intel Hansville GbE
PHY
Page 21
RJ45 CONN
33
Page 22
WLAN Card
WLAN + PCIE X1
Page 23
1394 port
Rico R5C835
PCI BUS
Controller
Page 27
Page 27Audio Board
Smart Card
SD/MMC Slot
LPC BUS
RTC CKT.
Page 12
Power OK CKT.
44
Power On/Off CKT.
Page 32
Page 25
LED
Audio Board
TPM1.2
SLB9635TT
Page 31page 29
Touch Pad CONN.
SMSC KBC 1098
Page 25
TrackPoint CONN.
DC/DC Interface CKT.
Page 25
Page 33
A
http://laptop-motherboard-schematic.blogspot.com/
SPI ROM
8MB
B
Page 31
Mobile
CPU Dual Core
Socket-rPGA989
37.5mm*37.5mm
Page 4,5,6,7,8
DMI X4
DP-C ; DP-B
USB2.0
Azalia
1071pins
25mm*27mm
Page 12,13,14,15,16,17
ONFI Interface
SATA0
SATA1
Braidwood
Page 24
NAND Flash Card
Page 24
SMSC Super I/O
SMCS47N217N
Int.KBD
Page 25
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
COM1LPT
( Docking )( Docking )
Page 30Page 30
2008/09/152009/12/31
C
Dual Channel
Page 30
Compal Secret Data
Deciphered Date
DP X 2(Docking)
USB x2(Docking)
FingerPrinter VFM451
USBx1
USB conn x 3(For I/O)
BT Conn USB x 1
USB x1(Camara)
MDC V1.5
Audio CKT
IDT 92HD75
SATA ODD Connector
2.5" SATA HDD Connector
D
DDR3-SO-DIMM X 2DDR3 1066/1333MHz 1.5V
BANK 0, 1, 2, 3
Page 26
Page 20
Page 25
Audio Board
Page 12
Page 12
Custom
Date:Sheet
Page 9,10
Clock Generator
ICS9LPRS397
Page 28
Page 28
Page 31
daughter board
RJ11
TPA6047A
AMP & Audio Jack
Page 36
(2) PS/2 Interfaces
(2) USB 2.channels
(2) SATA Channels
(2) Display Port Channels
(1) Seria
(1) Parall
(1) Li
(1) Lin
(1) RJ45 (10/100/1000)
(1)
(1) 2 LAN indicator LED's
(1) Power Button
(1) I2C interface
Title
Size Document NumberRev
Compal Electronics, Inc.
LA-4902P
Docking CONN.
l Port
el Port
ne In
e Out
VGA
Block Diagram
E
CK505
Page 25
Audio Board
of
247Wednesday, December 09, 2009
Page 26
Page 11
0.3
A
Voltage Rails
State
S0
S1
S3
S5 S4/AC
S5 S4/ Battery only
S5 S4/AC & Battery
don't exist
11
( O MEANS ON X MEANS OFF )
+RTCVCC
power
plane
O
O
O
O
O
O
+B
+3VL+0.75V
O
O
O
O
O
X
+5VALW
+3VALW
O
O
O
O
X
XXX
+3VM
+1.05VM
O
O
O
O
X
X
+1.5V
O
XX
X
+5VS
+3VS
+1.5VS
+VCCP
+CPU_CORE
+1.05VS
+1.8VS
OO
OO
X
X
Symbol Note :
: means Digital Ground
: means Analog Ground
@ : means just reserve , no build
CONN@ : means ME part.
Install below 45 level BOM structure for ver. 0.1
45@ : means just put it in the BOM of 45 level.
Install below 43 level BOM structure for ver. 0.1
DEBUG@ : means just build when PCIE port 80 CARD function enable.
N10M@ : Install for N10M Graphic controller
1098@ : Install for 1098 KBC controller
Remove before MP
SMBUS Control Table
SOURCE
SMB_EC_CK1
SMB_EC_DA1
SMBCLK
SMBDATA
SML0CLK
SML0DATA
SML1CLK
SML1DATA
SMSC1098
Calpella
Calpella
Calpella
BATT
V
X
X
X
SODIMM CLK CHIP
XDPG-SENSOR
X
XX
VV
X
X
XX
MINI CARD
X
VV
X
X
XX
DOCK
X
V
X
X
NIC
XX
X
V
X
http://laptop-motherboard-schematic.blogspot.com/
Reserve below BOM structure for ver. 0.1
THERMAL
SENSOR
1091@ : Install for 1091 KBC controller
X
X
X
V
V
X
V
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHO RIZED BY COMPA L ELECTRONIC S, INC. NEITHE R THIS SHEET NO R THE INFORMA TION IT CONT AINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
A
2008/09/152009/12/31
Compal Secret Data
Deciphered Date
Title
Size Document NumberRev
Custom
Date:Sheet
Compal Electronics, Inc.
Notes List
LA-4902P
of
347Wednesday, December 09, 2009
0.3
Layout rule 10mil wi
length < 0.5", spacing 20mil
AA
BB
CC
Κ
H_PECI15
to power; PU to VCCP at power side also
H_PROCHOT#41
H_THERMTRIP#15
H_CPURST#
H_PM_SYNC14
H_CPUPWRGD
H_CPUPWRGD15
PM_DRAM_PWRGD14
from power
VTTPWRGOOD32
BUF_PLT_RST#15
Processor Pullups
H_CATERR#
H_PROCHOT#_D
H_CPURST#_R
DDR3 Compensation Signals
SM_RCOMP0
R52100_0402_1%
SM_RCOMP1
R5324.9_0402_1%
SM_RCOMP2
R54130_0402_1%
Layout Note:Please these
resistors near Processor
1
dth trace
12
12
12
12
TP_SKTOCC#
T1TPC12
H_CATERR#
H_PECI_ISO
R16
12
0_0402_5%
H_PROCHOT#_D
R17
12
0_0402_5%
H_THERMTRIP#_R
R19
12
0_0402_5%
R20
12
0_0402_5%
R21
12
0_0402_5%
SYS_AGENT_PWROK
R22
12
0_0402_5%
VCCPWRGOOD_0
R24
12
0_0402_5%
VDDPWRGOOD_R
R26
12
0_0402_5%
H_PWRGD_XDP_RH_PWRGD_XDP
R30
12
0_0402_5%
PLT_RST#_R
R31
12
1.5K_0402_5%
R3949.9_0402_1%
12
12
R4268_0402_5%
12
R4568_0402_5%@
12
12
12
COMP3
R220_0402_1%
COMP2
R520_0402_1%
COMP1
R749.9_0402_1%
COMP0
R949.9_0402_1%
H_CPURST#_R
H_PM_SYNC_R
12
R33
750_0402_1%
+VCCP
JCPU1B
AT23
COMP3
AT24
COMP2
G16
COMP1
AT26
COMP0
AH24
SKTOCC#
AK14
CATERR#
AT15
PECI
AN26
PROCHOT#
AK15
THERMTRIP#
AP26
RESET_OBS#
AL15
PM_SYNC
AN14
VCCPWRGOOD_1
AN27
VCCPWRGOOD_0
AK13
SM_DRAMPWROK
AM15
VTTPWRGOOD
AM26
TAPPWRGOOD
AL14
RSTIN#
IC,AUB_CFD_rPGA,R1P0
CONN@
JTAG MAPPING
XDP_TRST#
MISCTHERMAL
PWR MANAGEMENT
09/2/5 HP
Close to XDP
12
R5551_0402_5%
REMOTE thermal sensor
DD
REMOTE2+
C4
2200P_0402_50V7K
REMOTE2-
1
2
1
C
Q1
2
B
MMBT3904WH_SOT323-3
E
31
Layout Note:
place near the hottest spot area for
NB & top SODIMM.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
1: Disabled; No Physical Display Port
attached to Embedded Display Port
CFG4
0: Enabled; An external Display Port
device is connected to the Embedded
Display Port
2
-240mV for Pre-ES1
R683.01K_0402_1%
12
Only temporary for early CFD samples (rPGA/BGA)
@
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
05/20
change MLCC part references for
power team request
ΕΕΕΕ
BC994 C988 C92
22U_0805_6.3V6M
C117
1
2
CRACK_BGA 17,29
3 C90
ΕΕΕΕ
C101
ΕΕΕΕ
BC83
C118
1
2
ΕΕΕΕΕΕΕΕ
22U_0805_6.3V6M
C119
1
2
@
10uF: C103 C993
C94 C97 C116 C11
ΕΕΕΕΕΕΕΕΕΕΕΕ
C89 C98 C99 C100
ΕΕΕΕΕΕΕΕΕΕΕΕ
C102 C91 C84 C96
ΕΕΕΕΕΕΕΕΕΕΕΕ
ΕΕΕΕ
C88
C111
22uF: the others
470U_D2_2VM_R4.5M
22U_0805_6.3V6M
C110
1
1
+
@
@
2
2
CRACK_BGA
CRACK_BGA
CRACK_BGA
10U_0805_6.3V6M
C120
BGA Ball Cracking Prevention and Detection
1
2
http://laptop-motherboard-schematic.blogspot.com/
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
3
12
09/4/10 HP
Layout Note:
Place near DIMMA
10U_0603_6.3V6M
1
2
+V_DDR_REF_DIMMA_DQ
SI1: No44
09/4/27 HP
+1.5V
10U_0603_6.3V6M
10U_0603_6.3V6M
C127
C126
1
1
2
2
2008/09/152009/12/31
C128
10U_0603_6.3V6M
C129
1
2
R1100
1K_0402_1%
R1101
1K_0402_1%
10U_0603_6.3V6M
C130
1
2
Compal Secret Data
4
+1.5V
12
+V_DDR_REF_DIMMA_CA
12
10U_0603_6.3V6M
C131
1
1
2
2
Deciphered Date
4
0.1U_0402_16V4Z
C132
@
0.1U_0402_16V4Z
1
2
SI1: No48
C133
1
@
2
0.1U_0402_16V4Z
C134
@
09/4/28 HP
SI2 NO9
0.1U_0402_16V4Z
C135
1
@
2
5
Layout Note:
Shared between the two
SO-DIMMs.
Place two capacitors close
to the VR and one
between the two SODIMMs
Layout Note:
Place near DIMMA
+0.75VS
330U_D2_2VY_R7M
C123
1
+
2
C136
1
2
Title
Size Document NumberRe v
Custom
LA-4902P
Date:Sheet
C138
C137
1U_0402_6.3V6K
C139
1U_0402_6.3V6K
C140
10U_0603_6.3V6M
1U_0402_6.3V6K
1
1
2
2
1U_0402_6.3V6K
1
2
C124
1
1
2
2
Compal Electronics, Inc.
DDRIII-SODIMM SLOT1
5
947Wednesday, December 09, 2009
C125
10U_0603_6.3V6M
10U_0603_6.3V6M
1
2
of
0.3
http://laptop-motherboard-schematic.blogspot.com/
1
2
3
4
5
SI1: No44
+V_DDR_REF_DIMMB_DQ
2.2U_0805_16V4Z
0.1U_0402_16V4Z
1
+3VS
C145
2
DDR_CKE2_DIMMB6
DDR_B_BS26
M_CLK_DDR26
M_CLK_DDR#26
DDR_B_BS06
DDR_B_WE#6
DDR_B_CAS#6
DDR_CS3_DIMMB#6
2.2U_0402_6.3V6M
1
2
1
AA
BB
CC
DD
09/2/16 HP
+VREF_DQ_DIMMB
DDR_B_D0
DDR_B_D1
1
C146
DDR_B_DM0
2
DDR_B_D2
DDR_B_D3
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D10
DDR_B_D11
DDR_B_D16
DDR_B_D17
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D18
DDR_B_D19
DDR_B_D24
DDR_B_D25
DDR_B_DM3
DDR_B_D26
DDR_B_D27
DDR_CKE2_DIMMB
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
M_CLK_DDR2
M_CLK_DDR#2
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#M_ODT2
DDR_B_MA13
DDR_CS3_DIMMB#
DDR_B_D32
DDR_B_D33
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D35
DDR_B_D40
DDR_B_D41
DDR_B_DM5
DDR_B_D42
DDR_B_D43
DDR_B_D48
DDR_B_D49
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D50
DDR_B_D51
DDR_B_D56
DDR_B_D57
DDR_B_DM7
DDR_B_D58
DDR_B_D59
12
10K_0402_5%
0.1U_0402_16V4Z
C165
C166
1
2
+1.5V+1.5V
DDR3 SO-DIMM B
4B
4B A2/6W
A2/6W
4B4B
A2/6WA2/6W
JDIMB1CONN@
VREF_DQ1VSS1
3
VSS2
5
DQ0
7
DQ1
9
VSS4
11
DM0
13
VSS5
15
DQ2
17
DQ3
19
VSS7
21
DQ8
23
DQ9
25
VSS9
27
DQS#1
DQS129RESET#
VSS1131VSS12
33
DQ10
35
DQ11
VSS1337VSS14
39
DQ16
41
DQ17
VSS1543VSS16
45
DQS#2
DQS247VSS17
49
VSS18
51
DQ18
DQ1953VSS19
55
VSS20
57
DQ24
DQ2559VSS21
VSS2261DQS#3
63
DM3
VSS2365VSS24
67
DQ26
69
DQ27
VSS2571VSS26
73
CKE0
75
VDD1
77
NC1
79
BA2
81
VDD3
83
A12/BC#
85
A9
87
VDD5
89
A8
91
A5
93
VDD7
95
A3
97
A1
VDD999VDD10
101
CK0
103
CK0#
105
VDD11
107
A10/AP
109
BA0
111
VDD13
113
WE#
115
CAS#
117
VDD15
119
A13
121
S1#
123
VDD17
125
NCTEST
127
VSS27
129
DQ32
131
DQ33
133
VSS29
135
DQS#4
137
DQS4
139
VSS32
141
DQ34
143
DQ35
145
VSS34
147
DQ40
149
DQ41
151
VSS36
153
DM5
155
VSS37
157
DQ42
159
DQ43
161
VSS39
163
DQ48
165
DQ49
167
VSS41
169
DQS#6
171
DQS6
173
VSS44
175
DQ50
177
DQ51
179
VSS46
181
DQ56
183
DQ57
185
VSS48
187
DM7
189
VSS49
191
DQ58
193
R91
12
R92 10K_0402_5%
DQ59
195
VSS51
197
SA0
199
VDDSPD
201
SA1
203
VTT1
205
G1
+0.75V
BOT
VSS3
DQS#0
DQS0
VSS6
VSS8
DQ12
DQ13
VSS10
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3
DQ30
DQ31
CKE1
VDD2
VDD4
VDD6
VDD8
CK1#
VDD12
RAS#
VDD14
ODT0
VDD16
ODT1
VDD18
VREF_CA
VSS28
DQ36
DQ37
VSS30
VSS31
DQ38
DQ39
VSS33
DQ44
DQ45
VSS35
DQS#5
DQS5
VSS38
DQ46
DQ47
VSS40
DQ52
DQ53
VSS42
VSS43
DQ54
DQ55
VSS45
DQ60
DQ61
VSS47
DQS#7
DQS7
VSS50
DQ62
DQ63
VSS52
EVENT#
VTT2
DDR_B_DQS#[0..7]6
DDR_B_D[0..63]6
2.2U_0805_16V4Z
C160
1
2
DDR_B_DM[0..7]6
DDR_B_DQS[0..7]6
DDR_B_MA[0..15]6
SI1: No44
+V_DDR_REF_DIMMB_CA
3
Layout Note:
Place near DIMMB
10U_0603_6.3V6M
C149
1
2
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
This circuit will add/delete in INTEL ES2 sample to test.
12
R2101M_0402_5%
Y4
12
25MHZ_20P_1BG25000CK1A
18P_0402_50V8J
C222
1
2
18P_0402_50V8J
C1034
1
2
+3VALW
DD
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
1
2
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
U4F
Y3
BMBUSY# / GPIO0
C38
TACH1 / GPIO1
D37
TACH2 / GPIO6
J32
TACH3 / GPIO7
F10
GPIO8
K9
LAN_PHY_PWR_CTRL / GPIO12
T7
GPIO15
AA2
SATA4GP / GPIO16
F38
TACH0 / GPIO17
Y7
SCLOCK / GPIO22
H10
MEM_LED / GPIO24
AB12
GPIO27
V13
GPIO28
M11
STP_PCI# / GPIO34
V6
SATACLKREQ# / GPIO35
AB7
SATA2GP / GPIO36
AB13
SATA3GP / GPIO37
V3
SLOAD / GPIO38
P3
SDATAOUT0 / GPIO39
H3
PCIECLKRQ6# / GPIO45
F1
PCIECLKRQ7# / GPIO46
AB6
SDATAOUT1 / GPIO48
AA4
SATA5GP / GPIO49
F8
GPIO57
A4
VSS_NCTF_1
A49
VSS_NCTF_2
A5
VSS_NCTF_3
A50
VSS_NCTF_4
A52
VSS_NCTF_5
A53
VSS_NCTF_6
B2
VSS_NCTF_7
B4
VSS_NCTF_8
B52
VSS_NCTF_9
B53
VSS_NCTF_10
BE1
VSS_NCTF_11
BE53
VSS_NCTF_12
BF1
VSS_NCTF_13
BF53
VSS_NCTF_14
BH1
VSS_NCTF_15
BH2
VSS_NCTF_16
BH52
VSS_NCTF_17
BH53
VSS_NCTF_18
BJ1
VSS_NCTF_19
BJ2
VSS_NCTF_20
BJ4
VSS_NCTF_21
BJ49
VSS_NCTF_22
BJ5
VSS_NCTF_23
BJ50
VSS_NCTF_24
BJ52
VSS_NCTF_25
BJ53
VSS_NCTF_26
D1
VSS_NCTF_27
D2
VSS_NCTF_28
D53
VSS_NCTF_29
E1
VSS_NCTF_30
E53
VSS_NCTF_31
IBEXPEAK-M_FCBGA1071
R2491K_0402_5%@
R2541K_0402_5%@
Boot BIOS Strap
MODEM_DISABLE# Boot BIOS Location
0
1
0
2008/09/152009/12/31
12
12
LPC*
Reserved(NAND)
PCI
SPI
GPIO
NCTF
RSVD
Compal Secret Data
2
CLKOUT_PCIE6N
CLKOUT_PCIE6P
CLKOUT_PCIE7N
MISC
CLKOUT_BCLK0_N / CLKOUT_PCIE8N
CLKOUT_BCLK0_P / CLKOUT_PCIE8P
CPU
CLKOUT_PCIE7P
PROCPWRGD
THRMTRIP#
INIT3_3V#
Deciphered Date
2
A20GATE
PECI
RCIN#
TP10
TP11
TP12
TP13
TP14
TP15
TP16
TP17
TP18
TP19
NC_1
NC_2
NC_3
NC_4
NC_5
TP24
AH45
AH46
AF48
AF47
U2
AM3
AM1
BG10
T1
BE10
BD10
BA22
TP1
AW22
TP2
BB22
TP3
AY45
TP4
AY46
TP5
AV43
TP6
AV45
TP7
AF13
TP8
M18
TP9
N18
AJ24
AK41
AK42
M32
N32
M30
N30
H12
AA23
AB45
AB38
AB42
AB41
T39
P6
C10
CLK_PCIE_LAN#_R
CLK_PCIE_LAN_R
PCH_PECI_R
KB_RST#
H_THERMTRIP#_L
T29 TPC12
T30 TPC12
T31 TPC12
T32 TPC12
T33 TPC12
T34 TPC12
T35 TPC12
T36 TPC12
T37 TPC12
T38 TPC12
T39 TPC12
T40 TPC12
T41 TPC12
T42 TPC12
T43 TPC12
T44 TPC12
T45 TPC12
T46 TPC12
T47 TPC12
T48 TPC12
T49 TPC12
T50 TPC12
T51 TPC12
T52 TPC12
T53 TPC12
T54 TPC12
1
33_0402_5%
33_0402_5%
12
12
R218
R220
12
12
0_0402_5%
12
56_0402_5%
SI1 NO24
09/4/10 HP
SI1 NO45
09/4/27 HP
SI1 NO59
09/5/4 HP
09/2/5 HP
SI1 NO29
09/4/10 HP
SI1 NO31
Title
Size D ocument NumberRev
Custom
LA-4902P
Date:Sheet
+3VS
R24210K_0402_5%
R24454.9_0402_1%
R245
NPCI_RST#
SATA_CLKREQ#
PCH_XDP_GPIO49
WWAN_D ET#
ALS_EN#
RUNSCI_EC#
R243
12
GATEA20 29
CLK_CPU_BCLK# 4
CLK_CPU_BCLK 4
H_PECI 4
KB_RST# 29
H_CPUPWRGD 4
H_THERMTRIP# 4
+VCCP
delete R268
PCH_XDP_GPIO16
DOCK_ID0
DOCK_ID1
GPIO48
STP_PCI#
WLAN_TRANSMIT_OFF#
WWAN _TRANSMIT_OFF#
GPIO24
GPIO15
ISO_PREP#
CLK_PCIE_LAN_REQ#
USB_OC#0
USB_OC#2
USB_OC#4
EXPRESS_CD#
PCH_XDP_GPIO28
LED_LINK_LAN#_R
LAN_DIS#
GPIO8
Compal Electronics, Inc.
IBEX-M(4/6)-PCI/USB/RSVD
1
CLK_PCIE_LAN# 21
CLK_PCIE_LAN 21
R25010K_0402_5%
12
R25510K_0402_5%
12
R25910K_0402_5%
12
R261100K_0402_5%
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
1547Wednesday, December 09, 2009
of
R26310K_0402_5%
R26610K_0402_5%
R27110K_0402_5%
R27310K_0402_5%
R27510K_0402_5%
R27710K_0402_5%
R96210K_0402_5%
R25210K_0402_5%
R25710K_0402_5%
R26010K_0402_5%
R2621K_0402_5%
R26410K_0402_5%
R26710K_0402_5%
R27010K_0402_5%
R111710K_0402_5%
R95910K_0402_5%
R96010K_0402_5%
R107510K_0402_5%
R108310K_0402_5%
R96110K_0402_5%
R8440_0402_5%@
+3VS
+3VALW
+3VM_LAN
0.3
http://laptop-motherboard-schematic.blogspot.com/
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