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TECHNICAL MANUAL

OPERATOR’S, ORGANIZATIONAL,

DIRECT SUPPORT,AND GENERAL SUPPORT

MAINTENANCE MANUAL

INCLUDING REPAIR PARTS AND

SPECIAL TOOLS LIST

(INCLUDING DEPOT MAINTENANCE REPAIR

PARTS AND SPECIAL TOOLS)

FOR

RF SECTION HP-86602B

(NSN 6625-01-031-8853)

TM 11-6625-2837-14&P-7

HEADQUARTERS, DEPARTMENT OF THE ARMY

OCTOBER 1981

SAFETY

TM 11-6625-2837-14&P-7

WARNING

Although this instrument has been designed in accordance with international safety standards, this manual contains information, cautions, and warnings which must be followed to retain the instrument in safe condition. Be sure to read and follow the safety information in Sections 11, III, V, an VIII.

BEFORE CONNECTING THIS SYSTEM TO LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the m ainfram e manual should be followed.

HIGH VOLTAGE

Adjustments and troubleshooting are often performed with power supplied to the instrument while protective covers are removed. Energy available at many points may constitute a shock hazard

The multi-pin plug connector which provides inter connection from mainframe to RF Section, will be exposed with the RF Section removed from the righthand mainframe cavity. With the Line (Mains Voltage off and power cord disconnected, power supply voltages may still remain and may constitute a shock hazard.

COMPATIBILITY

Damage to the synthesized signal generator system m ay result if an option 002 RF Section is used with unmodified Model 8660A or 8660B main-frames with serial prefixes 1349A and below.

PERFORMANCE TESTING

To avoid the possibility of damage to the instrum ent or test equipment, read completely through each test before starting it. Then make any preliminary control settings necessary before continuing with the procedure.

PLUG-IN REMOVAL

Before removing the RF Section plug-in from the mainframe, remove the line (Mains) voltage by disconnecting the power cable from the power outlet.

SEMI-RIGID COAX

Slight but repeated bending of the semi-rigid coaxial cable will damage them very quickly. Bend the cables as little as possible. If necessary, loosen the assembly to release the cable.

WARNING

Voltages are present in this instrument, when energized, which can cause death on contact.

The multi-pin plug connector which provides interconnection from mainfram e to RF Section, will be exposed with the RF Sect ion removed from the righthand mainfram e cavity. With the line voltage of f and power cord disconnected, power supply voltage may still remain and may constitute a shock hazard.

TM 11-6625-2837-14&P-7

TM 11-6625-2825-14&p-7

TECHNICAL MANUAL ) HEADQUARTERS

) DEPARTMENT OF THE ARMY

No. 11-6625-2825-14&p-7 ) Washington, D.C., 18 October 1981

OPERATOR’S, ORGANIZATIONAL, DIRECT SUPPORT

AND GENERAL SUPPORT MAINTENANCE MANUAL

INCLUDING REPAIR PARTS AND SPECIAL TOOLS LISTS

FOR

RF SECTION PLUG-IN, HEWLETT-PACKARD MODEL 86602B

(NSN 6625-01-031-8853)

CURRENT AS OF 30 JANUARY 1981

REPORTING ERRORS AND RECOMMENDING IMPROVEMENTS

You can help improve this manual. If you find any mistakes or if you know of a way to improve the procedures, please let us know. Mail your letter or DA Form 2028 (R ecommended Changes to Publications and Blank Forms), direc t to: Commander, US Army Communications and Electronics Materiel Readiness Command, ATTN: DRSEL-ME-MQ, Fort Monmouth, New Jersey 07703. In either case, a reply will be furnished direct to you.

This manual is an authentication of the manufacturer’s commercial literature which, through usage, has been found to cover the data required to operate and maintain this equipment. The manual was not prepared in acc or dance with military specifications; therefore, the format has not been st ructured to consider categories of maintenance. Section IX contains improvements made after the printing of the manufacturer’s manual.

CONTENTS

SECTION 0 INTRODUCTION PAGE

0-1. Scope 0-1 0-2. Indexes of Publications 0-1 0-3. Maintenance Forms, Records and Reports 0-1 0-4. Reporting Equipment Improvement Recommendations (EIR) 0-1 0-5. Administrative Storage 0-2 0-6. Destruction of Army Electronics Materiel 0-2

CONTENTS

TM 11-6625-2837-14&P-7

Section Page

I GENERAL INFORMATION......................... 1-1

1-1. Introduction....................................... 1-1

1-7. Specifications .................................. 1-1

1-9. Instruments Covered by Manual....... 1-1

1-12. Manual Change Supplements.......... 1-1

1-15. Description........................................ 1-5

1-20. Options ............................................ 1-5

1-24. Compatibility..................................... 1-5

1-27.Equipment Required but not

Supplied........................................ 1-5

1-28.System Mainframe........................... 1-5

1-31.Frequency Extension Module........... 1-6

1-33.Auxiliary Section............................... 1-6

1-35.Modulation Section Plug-ins............. 1-6

1-37.Equipment Available......................... 1-6

1-40.Safety Considerations...................... 1-6

1-43.Recommended Test Equipment....... 1-6

II INSTALLATION........................................... 2-1

2-1. Introduction....................................... 2-1

2-3. Initial Inspection ............................... 2-1

2-5. Preparation For Use......................... 2-1

2-6. Power Requirements........................ 2-1

2-8. Interconnections............................... 2-1

2-10.Modifications..................................... 2-1

2-13.Operating Environment..................... 2-1

2-15.Installation Instructions..................... 2-1

2-17.Storage and Shipment...................... 2-2

2-18.Environment..................................... 2-2

2-20.Packaging......................................... 2-2

III OPERATION........................................... 3-1

3-1. Introduction ...................................... 3-1

3-3. Panel Features................................. 3-1

3-5. Operator’s Check.............................. 3-1

3-8. Operating Instructions ..................... 3-1

IV PERFORMANCE TESTS ....................... 4-1

4-1. Introduction....................................... 4-1

4-3. Equipment Required......................... 4-1

4-5. Test Record...................................... 4-1

4-7. Performance Tests........................... 4-1

4-9. Frequency Range............................. 4-2

4-10.Frequency Accuracy and Stability.... 4-3

4-11.Frequency Switching Time............... 4-3

4-12.Output Level Switching Time............. 4-5

4-13A. Output Accuracy.......................... 4-7

4-13B. Output Accuracy- Alternate

Procedure...................................... 4-12

4-14.Output Flatness................................ 4-15

4-15.Harmonic Signals............................. 4-16

Section Page

4-16.Pulse Modulation Risetime............... 4-17

4-17.Pulse Modulation On/Off Ratio......... 4-19

4-18.Amplitude Modulation Depth and

3 dB Bandwidth............................. 4-19

4-19.Frequency Modulation Rate and

Deviation....................................... 4-23

4-20.Output Impedance and VSWR......... 4-23

4-21.Signal-to-Phase Noise Ratio............ 4-25

4-22.Signal-to-AM Noise Ratio................. 4-27

4-23.Residual FM..................................... 4-29

4-24.Amplitude Modulation Distortion...... 4-31

4-25.Incidental Phase Modulation ........... 4-33

4-26.Frequency Modulation Distortion...... 4-35

4-27.Incidental AM................................... 4-38

4-28.Spurious Signals, Narrowband......... 4-40

4-29.Spurious Signals, Wideband............ 4-41

4-30.Phase Modulation Peak Deviation... 4-43

4-31A. Phase Modulation Distortion........... 4-43

4-31B. Phase Modulation Distortion -

Alternate Procedure...................... 4-45

V ADJUSTMENTS.......................................... 5-1

5-1. Introduction...................................... 5-1

5-4. Equipment Required........................ 5-1

5-8. Safety Considerations...................... 5-1

5-12.Factory Selected Components......... 5-1

5-14.Related Adjustments........................ 5-1

5-18.Adjustment Locations....................... 5-2

5-20.Adjustments..................................... 5-2

5-22.Post Adjustment Tests .................... 5-2

5-24.RF Output Level Adjustment............ 5-3

5-25.1 dB Step Attenuator Adjustment..... 5-4

5-26.Amplitude Modulation Input Circuit

Adjustment.................................... 5-5

5-27.Phase Modulator Driver Frequency

Response Adjustments................. 5-7

5-28A. Phase Modulation Level and

Distortion Adjustments.................. 5-8

5-28B. Phase Modulation Level and Distortion

Adjustments - Alternate Procedure5-11

VI REPLACEABLE PARTS.......................... 6-1

6-1. Introduction...................................... 6-1

6-3. Exchange Assemblies...................... 6-1

6-5. Abbreviations................................... 6-1

6-7. Replaceable Parts List..................... 6-1

CONTENTS (Cont’d)

TM 11-6625-2837-14&P-7

Section Page

VII MANUAL CHANGES ............................... 7-1

7-1. Introduction ...................................... 7-1

7-3. Manual Changes.............................. 7-1

7-6. Manual Change Instructions............. 7-2

VIII SERVICE................................................... 8-1

8-1. Introduction....................................... 8-1

8-8. Safety Considerations...................... 8-1

8-12.Principles of Operation..................... 8-1

8-16.Troubleshooting................................ 8-1

ILLUSTRATIONS

Figure Page 1-1. HP Model 86602B RF Section (Opt. 002

Shown)

1-2. 40 dB Test Amplifier................................ 1-0

1-3. 15 kHz Low Pass Filter .......................... 1-11

1-4. Low Pass Filters...................................... 1-11

2-1. RF Section Partially Inserted into

Mainframe........................................ 2-2

3-1. Front Panel Controls, Connectors, and

Indicators.......................................... 3-2

3-2. Rear Panel Connectors and Indicators... 3-3

3-3. Operator’s Check.................................... 3-4

4-1. Frequency Range Test Setup................. 4-2

4-2. Frequency Switching Time Test Setup... 4-4 4-3. Output Level Switching Time Test Setup 4-6

4-4A.Output Accuracy Test Setup.................. 4-8

4-4B.Output Accuracy Test Setup (Alternate

Procedure......................................... 4-13

4-5. Pulse Modulation Risetime Test Setup .. 4-18 4-6. Amplitude Modulation, Depth and 3 dB

Bandwidth Test Setup...................... 4-20

4-7. Output Impedance Test Setup................ 4-24

4-8. Signal-to-Phase Noise Ratio Test Setup. 4-26

4-9. Signal-to-AM Noise Ratio Test Setup..... 4-28

4-10.Residual FM Test Setup......................... 4-29

4-11.Amplitude Modulation Distortion Test

Setup................................................ 4-30

4-12.Incidental Phase Modulation Test Setup 4-32 4-13.Frequency Modulation Distortion Test

Setup................................................ 4-35

4-14.Incidental AM Test Setup ....................... 4-38

4-15.Narrowband Spurious Signal Test Setup. 4-39 4-16.Wideband Spurious Signal Test Setup... 4-41

Section Page

8-17.System Troubleshooting.................. 8-2

8-19.RF Section Troubleshooting............. 8-2

8-21.Troubleshooting Aids....................... 8-2

8-28.Recommended Test Equipment...... 8-2

8-30.Repair............................................... 8-2

8-31.General Disassembly Procedures.... 8-2

8-34.Non-Repairable Assemblies............. 8-2

8-36.Module Exchange Program.............. 8-3

8-38.Repair Procedures........................... 8-3

8-42.Post Repair Adjustments................. 8-3

IX ERRATA

Figure Page 4-17A. Phase Modulation Distortion Test Setup 4-44

4-17B.Phase Modulation Distortion Test Setup

(Alternate Procedure)....................... 4-46

5-1. RF Output Level Adjustment Test Setup 5-3 5-2. 1 dB Step Attenuator Adjustment Test

Setup................................................ 5-4

5-3. Amplitude Modulation Input Circuit

Adjustment Test Setup..................... 5-5

5-4. Phase Modulator Driver Frequency

Response Adjustment Test Setup... 5-7 5-5A.Phase Modulation Level and Distortion

Adjustment Test Setup..................... 5-9

5-5B.Phase Modulation Level and Distortion

Adjustment Test Setup (Alternate

Procedure)....................................... 5-12

7-1. Phase Modulator Driver Frequency Response

Adjustment Test Setup (Change B). 7-2 7-2. A16 Phase Modulator Driver Assembly

Component and Test Point Locations

(Change B)....................................... 7-6

7-3. Phase Modulation Section Schematic

Diagram (Option 002) (Change B)... 7-8 7-4. A17 Phase Modulator Assembly

Component Locations (Change C).. 7-9 7-5. P/O Phase Modulation Section Schematic

Diagram (Change C)........................ 7-11

7-6. P/O Attenuator Section Schematic

Diagram (Change D)........................ 7-11

7-7. P/O All Logic Assembly Schematic

Diagram (Change E)........................ 7-12

8-1. LO Signal Circuits Repair....................... 8-4

iii

ILLUSTRATIONS (Cont’d)

TM 11-6625-2837-14&P-7

Figure Page

8-2. Rear Panel Disassembly......................... 8-8

8-3. Schematic Diagram Notes...................... 8-9

8-4. System Test Point Locations.................. 8-17

8-5. Mainframe Interconnect Jack.................. 8-17

8-6. System Troubleshooting Block

Diagram............................................ 8-17

8-7. RF Section Simplified Block Diagram..... 8-19

8-8. Main Troubleshooting Block Diagram .... 8-19

8-9. Logic Troubleshooting Block Diagram ... 8-21 8-10.A7 Mixer Assembly’s Subassembly and

Component Location........................ 8-22

8-11.Mixer Section Schematic Diagram.......... 8-23

8-12.A16 Phase Modulator Driver Assembly

Component and Test Point Locations 8-25 8-13.A17 Phase Modulator Assembly

Component Locations ..................... 8-25

8-14.Phase Modulation Section Schematic

Diagram (Option 002)....................... 8-25

8-15.A4 Detector Amplifier Assembly

Component and Test Point Locations 8-27

Figure Page 8-16..Amplifier/Detector Section

Schematic Diagram.......................... 8-27

8-17.A3 ALC Amplifier Assembly Component

and Test Point Locations.................. 8-28

8-18.A10 Reference Assembly

Component Locations ..................... 8-29

8-19.A2 ALC Mother Board Assembly

Component Locations...................... 8-29

8-20.ALC Section

Schematic Diagram.......................... 8-29

8-21.A9 Attenuator Driver Assembly

Component Locations ..................... 8-31

8-22.Attenuator Section

Schematic Diagram.......................... 8-31

8-23.All Logic Assembly

Component Locations...................... 8-33

8-24.All Logic Assembly

Schematic Diagram.......................... 8-33

8-25.Assemblies, Chassis Parts, and Adjustable

Component Locations ..................... 8-35

TABLES

Table Page

1-1. Models 86602B/11661 Specifications..... 1-2

1-2. Recommended Test Equipment............. 1-7

3-1. Operating Instructions ............................ 3-6

4-1. dB to Power Ratio Conversion................ 4-37

4-2. Narrowband Spurious Signal Checks..... 4-40

4-3. Wideband Spurious Signal Checks........ 4-41

4-4. Performance Test Record ...................... 4-47

5-1. Factory Selected Components................ 5-2

APPENDIX A. References............................................................................................. A-1

APPENDIX B. Maintenance Allocation

Section I. Introduction............................................................................................. B-1

II. Maintenance Allocation.......................................................................... B-5

III. Tool and Test Equipment Requirements............................................ B-6

Users of this manual are advised to consult SECTION IX, ERRATA. SECTION IX contains errors and changes in text and illus trations. The user should correc t the errors and perform the changes indicated, as needed.

Table Page 6-1. Reference Designations & Abbreviations6-3

6-2. Replaceable Parts.................................. 6-5

6-3. Code Lists of Manufacturers................... 6-15

6-4. Parts to NSN Cross Refererence........... 6-16

7-1. Manual Changes by Serial Prefix........... 7-1

7-2. Summary of Changes by Component.... 7-1

7-3. Replaceable Parts (P/O Change B)........ 7-7

8-1. Front Panel Housing Repair................... 8-7

8-2. Adjustable Components Locations.. 8-34

APPENDICES

Page

NOTE

TM 11-6625-2837-14&P-7

SECTION 0

INTRODUCTION

0-1. Scope This manual describes RF Section Hewlett-Packard Model 86602B, hereinafter referred to as the RF Section, and

provides instructions for its operation and maintenance. This manual applies dir ectly to instruments with serial numbers prefixed 1638A. It is also applicable to instruments with

other serial number prefixes for which manual changes are given in SECTION VII. SECTION VI includes Table 6-4, a cross reference between the Hewlett-Packard part numbers and the equivalent NATO/NATIONAL Stock Numbers (NSN). Appendix A provides a reference of pertinent Department of the Army publications. Appendix B contains the Maintenance Allocation Chart (MAC) which defines the levels and scope of maintenance functions for the equipment in the Army system and a list of the tools and test equipment required.

0-2. Indexes of Publications

a. DA Pam 310-4

changes or additional publications pertaining to the equipment.

b. DA Pam 310-7

pertaining to the equipment.

0-3. Maintenance Forms, Records and Reports

a. Reports of Maintenance and Unsatisfac tory Equipment. Departm ent of the Arm y form s and procedures

used for equipment maintenance will be those prescribed by TM 38-750, the Army Maintenance Management System.

b. Report of Item and Packaging Discr epancies. Fill out and forward SF 364 ( Report of Discr epancy (ROD) as

prescribed in AR 735-11-2/DLAR 4140.55/NAVSUPINST 4440.127E/AFR 400.54/MCO 4430.E.

c. Discrepancy in Shipment Report (DISREP) (SF 361). Fill out and forward Disc repancy in Shipment Report

(DISREP) (SF 361) as prescribed in AR 55-38/NAVSUPINST 4610.33B/AFR 75-18/MCO P4610.19C and DLAR 4500.15. 0-4. Reporting Equipment Improvement Recommendations (EIR)

If your HP 86602B RF Section needs improvement, let us know. Send us an EIR. You, the user, are the only one who can tell us what you don’t like about your equipment. Let us know why you don’t like the design. Tell us why a procedure is hard to perform. Put it on an SF 368 (Quality Deficiency Report). Mail it to: Commander, US Army Communications - Electronics Comm and, AT TN : DRSEL-ME-MQ, Fort Monm outh, New Jers ey 07703. W e’ll send you a reply.

. Refer to the latest issue of the DA Pam 310-4 to determine whether there are new editions,

. Refer to DA Pam 310-7 to determine whether there are Modification Work Orders (MWOs)

0-1

0-5. Administrative Storage. Store in accordance with Paragraphs 2-17 through 2-22. 0-6. Destruction of Army Electronics Materiel

Destruction of Army electronics materiel to prevent enemy use shall be in accordance with TM 750-244-2.

TM 11-6625-2837-14&P-7

0-2

Section 1 TM 11-6625-2837-14&P-7

Figure 1-1. HP Model 86602B RF Section (Option 002 Shown)

1-0

Section 1 TM 11-6625-2837-14&P-7

SECTION I

GENERAL INFORMATION

1-1. INTRODUCTION

1-4. Figure 1-1 shows the Option 002 RF Section. 1-2. This manual contains all information required to install, operate, test, adjust and service the HewlettPackard Model 86602B RF Section plug-in, hereinafter referred to as the RF Section. For information concerning related equipment, such as the HewlettPackard Model 8660-series mainframes or the Model 11661 Frequency Extension Module, refer to the appropriate manual or manuals.

1-3. This manual is divided into eight sections which provide information as follows:

a. SECTION I, GENERAL INFORMATION, contains the instrument desc ription and specific ations as well as the accessory and recomm ended test equipment list.

b. SECTION II, INSTALLATION, contains information relative to receiving inspection, preparation for use, mounting, packing, and shipping.

c. SECTION III, OPERATION, contains operating instructions for the instrument.

d. SECTION IV, PERFORMANCE TESTS, contains information required to verify that instrument performance is in accordance with published specifications.

e. SECTION V, ADJUSTMENTS, contains information required to properly adjust and align the instrument after repair.

f. SECTION VI, REPLACEABLE PARTS, contains information required to order all replacement parts and assemblies.

g. SECTION VII, MANUAL CHANGES, provides information to docum ent all serial number prefixes listed on the title page.

h. SECTION VIII, SERVICE, contains descriptions of the circuits, schematic diagrams, parts location diagrams, and troubleshooting pr ocedures to aid the user in maintaining the instrument.

1-5. DELETED

1-6. On the title page of this manual, below the manual

part number, is a “Microf ic he” par t number. This number may be used to order 4 x 6-inch microfilm transparencies of the manual. Each m icrof iche contains up to 60 photoduplicates of the manual pages. The microfiche package also includes the latest Manual Changes supplement as well as all pertinent Service Notes.

1-7. SPECIFICATIONS

1-8. Instrument spec ifications are listed in T able 1-1. These specifications are the per formance standards, or limits against which the instrument may be tested.

1-9. INSTRUMENTS COVERED BY MANUAL 1-10. This instrument has a two-part serial number. The f irst four digits and the letter comprise the serial number prefix. The last f ive digits form the sequential suff ix that is unique to each instrument. The contents of this manual apply directly to instruments having the same serial number prefix(es) as listed under SERIAL NUMBERS on the title page.

1-11. For information concerning a serial num ber prefix not listed on the title page or in the Manual Changes supplement, contact your nearest Hewlett-Packard office.

1-12. MANUAL CHANGE SUPPLEMENTS

1-13. An instrument manufactured after the printing of this manual may have a serial prefix that is not lis ted on the title page. This unlisted serial

1-1

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/11661 Specifications (1 of 3)

SPECIFICATIONS

FREQUENCY CHARACTERISTICS

Spurious Signals (CW, AM, and OM only):

Range: 1.0 to 1299.999999 MHz selectable in 1 Hz

steps. Frequencies from 200 k Hz to 1 MHz may also be selected with some degradation in specifications.

Accuracy and Stability

: CW f requency accuracy and

long term stability are determined by the aging rate of the

80 dB down from carrier at frequencies <700 MHz 80 dB down from carrier within 45 MHz of the carrier at

frequencies >700 MHz

70 dB down from carrier >45 MHz from carrier at

frequencies >700 MHz

50 dB down from carrier on the +10 dBm range.

time base (internal or external) and its sensitivity to changes in temperature and line voltage. Internal

reference oscillator ac curacy = + aging rate ± 3 x 10 /°C + 3 x 10

-10

/1% change in line voltage

-10

All Power Line Related spurious signals are 70 dB down

from carrier.

Switching Time: 6 ms to be within 50 Hz of any new frequency selected; 100 ms to be within 5 Hz of any new frequency delected.

Typical 86602B/11661 Frequency Switching

Characteristics

Harmonic Signals:

All harmonically related signals are at least 30 dB below the desired output signal for output levels <+3 dBm. (25 dB down for output levels above +3 dBm.)

Signal-to-Phase Noise Ratio (CW, AM, and OM only):

Greater than 45 dB in a 30 kHz band centered on the carrier and excluding a 1 Hz band centered on the carrier.

Typical SSB Phase Noise Curve:

Typical 86602B Phase Noise

Signal-to-AM Noise Ratio: Greater than 65 dB down in

a 30 kHz bandwidth centered on the carrier and excluding a 1 Hz band centered on the carrier

Aging rate for the time base of standard mainframes is 3 x

10-8/day: for option 001 mainframes, 3 x 10-9/day.

1-2

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/11661 Specifications (2 of 3)

OUTPUT CHARACTERISTICS

Level: Continuously adjustable from +10 to -146 dBm

(0.7 Vrms to 0.01 /Vrms) into a 50Q resistive

load. Output attenuator calibrated in 10 dB steps

from 1.OV full scale (+10 dBm range) to 0.03

pVrms full scale (-140 dBm range). Vernier

provides continuous adjustment between

attenuator ranges. Output level indicated on

output level meter calibrated in volts and dBm

into 50 ohms. Accuracy: (Local and remote modes)

+ 1.5 dB to -76 dBm; + 2.0 dB to -146 dBm at

meter readings between +3 and -6 dB. Flatness: Output level variation with frequency is less

than ±1.0 dB from 1-1300 MHz at meter

readings between +3 and --6 dB. Level Switching Time: In the remote mode any level

change can be accomplished in les s than 50 ms.

Any change to another level on the same

attenuator range can be accomplished in less

than 5 ms.

Typical AM Distortion (Center Frequency <10 MHz)

Impedance: 50Q. VSWR: <2.0 on +10 and O dBm range; <1.3 on -10 dBm

range and below.

MODULATION CHARACTERISTICS

(With compatible Modulation Sections)

Amplitude Modulation: Depth: 0 - 90% for RF output level meter readings from

+3 to -6 dB and only at +3 dBm and below.

AM 3 db Bandwidth:

Typical AM Distortion (Center Frequency > 10 MHz)

Incidental PM: Less than 0.2 radians peak at 30% AM. Incidental FM: Less than 0.2 times the frequency of

modulation (Hz) at 30% AM.

Applies only at 400 Hz and 1 kHz rates with the RF Section front panel meter indicating from O to +3 dBm. At a meter indication of 6 dB the distortion approximately doubles. The modulating signal distortion must be <0.3% for the system performance to meet these specifications.

1-3

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/1 1661 Specifications (3 of 3)

FREQUENCY MODULATION

Rate: DC to 200 kHz with the 86632B and 86635A.

20 Hz to 100 kHz with the 86633B.

Maximum Deviation (peak):

200 kHz with the 86632B and 86635A 100 kHz with the 86633B

Incidental AM: AM sidebands are greater than 60 dB

down from the carrier with 75 kHz peak deviation at a 1 kHz rate.

FM Total Harmonic Distortion (at rates up to 20 kHz);

<1% up to 200 kHz deviation. (External modulating signal distortion must be less than

0.3%.)

Residual FM: less than 10 Hz rms average in 300 kHz,

Post-detection bandwidth, FM x 0.1 mode.

ON/OFF Ratio: At least 40 dB. Input Level Required: -10-+ 0.5 Vdc turns RF on.

PHASE MODULATION

(Option 002 Instruments only)

Rate:

with 86635A dc to 1 MHz with 86634A dc to 1 MHz at center frequencies less than 100 MHz dc to 10 MHz at center frequencies greater or equal to 100 MHz.

Maximum Peak Deviation:

0 to 100 degrees peak. May be overdriven to 2 radians

(1150) in the Modulation Section’s external dc mode.

∅M Distortion:

<5% up to 1 MHz rates <7% up to 5 MHz rates <15% up to 10 MHz rates

Typical FM Distortion Curve

PULSE MODULATION

(With the 86631B Auxiliary Section only)

Source: External Rise/Fall Time: 50 ns.

(External modulation signal distortion m ust be less than

0.3% to meet this specification.)

REMOTE PROGRAMMING

(Through the 8660-series mainframes)

Frequency: Programmable in 1 Hz steps. Output Level: Programmable in 1 dB s teps from +10 to

-146 dBm. Modulation: See specifications for modulation section

installed.

GENERAL

Leakage: Meets radiated and conducted limits of MIL-I-

6181D.

Size: Plug-in to fit 8660-series mainframe. Weight: Net 9 lb (3.9 kg).

1-4

Section 1 TM 11-6625-2837-14&P-7

prefix indicates that the instrument is different fr om those documented in this manual. The manual for this instrument is supplied with a yellow Manual Changes

supplement that contains “change information” that documents the differences.

1-14. In addition to change information, the supplem ent may contain information for correcting errors in the manual. To keep this manual as current and accurate as possible, Hewlett-Packard recommends that you periodically request the latest Manual Changes supplement. The supplem ent for this m anual is k eyed to this manual’s print date and part number , both of which appear on the title page. Complimentary copies of the supplement are available from Hewlett-Packard.

1-15. DESCRIPTION

1-16. The HP Model 86602B RF Section is one of several RF Sections available for us e in an 8660-series Synthesized Signal Generator System. This RF Sec tion plug-in is used with an option 100 8660-series mainfram e (Frequenc y Extension Module installed). T he RF Section provides precisely tuned RF output frequencies over the 1 to 1300 MHz range with 1 Hz frequency resolution (8660-series option 004 instr uments have resolutions of 100 Hz.) Frequencies from 200 k Hz to 1 MHz can also be generated with some degradation in the amplitude leveling and other related specifications.

1-17. The output power can be set to any level between +10 and --146 dBm by means of the front panel VERNIER and calibrated OUTPUT RANGE controls. A front panel-mounted meter and the OUTPUT RANGE switch indicate the output power and voltage levels delivered by the RF Section to any external load having a characteristic impedance of 50 ohms. Output power levels are maintained within + 1 dB of selected values through internal leveling of the output signal over the full frequency range of the instrument.

1-18. Amplitude, frequency, phase, or pulse modulation of the RF OUTPUT signal can be accomplished within the RF Section by using the appropriate Auxiliary or Modulation Section plug-in.

1-19. External programm ing perm its rem ote selection of the output signal frequency in 1 Hz steps (100 Hz for option 004 mainframes) and the output power in 1 dB steps over the full operating

range of the instrument. External programming is accomplished via the mainframe computer-compatible interface and digital control unit circuits.

1-20. OPTIONS

1-21. This RF Section has two options available. They affect the instrument’s RF output level, and phase modulation capabilities.

1-22. Option 001. The RF output attenuator is removed. This lim its the RF output level range f rom +10 to -6 dBm.

1-23. Option 002. Circuits are added to provide the phase modulation capability. A compatible modulation section is required.

1-24. COMPATIBILITY

1-25. Except for Option 002 instruments, the Model 86602B is compatible with all 8660-series option 100 mainframes, all AM-FM Modulation Sections and the Auxiliary Section. This RF Section is partially com patible with the FM/OM Modulation Section.

Damage to the signal generator system may result if an option 002 RF Section is used with Model 8660A or 8660B main-frames with serial prefixes 1349A and below.

1-26. Option 002 instruments are compatible with all instruments which are part of the Model 8660-series Synthesized Signal Generator System except early model 8660A and 8660B Mainframes. Refer to the paragraph entitled Modifications in Section II of this manual for further information.

1-27. EQUIPMENT REQUIRED BUT NOT SUPPLIED

1-28. System Mainframe

1-29. The mainframe uses phase-locked loops to accurately generate clock, referenc e, and tuning signals required for operation of the Synthesized Signal Generator System. Front panel-mounted mainframe controls are used to digitally tune two phase-locked loops in the Frequency Extension Module which, in turn, produce two high-frequency output signals that are applied to the RF Section. The RF Section mixes the two signals

1-5

Section 1 TM 11-6625-2837-14&P-7

and presents their frequency difference at the front panel OUTPUT jack. The output frequency is either the value selected by the mainframe front panel controls or external programming.

1-30. The mainframe power supply provides all dc operating voltages required by the RF Section, Frequency Extension Module, and Modulation Section plug-ins. Remote programming of the plug-ins is accomplished via the mainframe interface and digital control unit circuits.

1-31. Frequency Extension Module

1-32. The Frequency Extension Module plug-in extends the output frequency range of the main-frame to meet the input requirements of the RF Section. The Frequency Extension Module plug-in contains two highfrequency phase-locked loops which receive digital tuning signals, variable synthesized signals, and fixed synthesized signals from the mainframe. The phaselocked loops use the main-frame signals, in conjunc tion with the output frequency from a 4.43 GHz oscillator that is common to both loops, to produce two high-frequency output signals that are supplied to the RF Section. O ne output signal is generated by a phase-locked loop using a Voltage Controlled Oscillator (VCO) that is tuneable in 1 Hz steps (100 Hz steps for option 004 mainframe) over the 3.95 to 4.05 GHz range. The other output signal is generated by a phase-locked loop using a Yittrium-IronGarnet (YIG) oscillator that is tunable in 100 MHz steps over the 3.95 to 2.75 GHz range. The two outputs from the Frequency Extension Module plug-in are applied to the RF Section for mixing, amplification of the converted signal, and final output power level control.

1-33. Auxiliary Section

1-34. The Auxiliary Section plug-in provides a means of applying externally generated amplitude or pulse

modulation drive signals to modulate the RF Section’s output carrier.

1-35. Modulation Section Plug-ins

1-36. The Model 86630-series Modulation Section plugins can accept external modulation drive signals or generate internal drive signals to amplitude, frequency, phase or pulse modulate the RF Sections output signal.

1-37. EQUIPMENT AVAILABLE

1-38. Extender cables, coaxial adapters, and an adjustment tool are available for use in performance testing, adjusting, and maintaining the RF Section. Each piece may be ordered separately or as part of the 11672A Service Kit.

1-39. Extender cards for use in ser vicing the RF Section and a type N to BNC adapter for use on the front panel RF OUTPUT connector are contained in the HP Rack Mount Kit, Part Number 08660-60070, that is supplied with the mainframe.

1-40. SAFETY CONSIDERATIONS

1-41. This instrument has been designed in accord-ance with international safety standards and has been supplied in safe condition.

1-42. Although this instrument has been designed in accordance with international safety standards, this manual contains information, cautions, and warnings which must be followed to retain the instrument in sa fe condition. Be sure to read and follow the safety information in Sections II, III, V, and VIII.

1-43. RECOMMENDED TEST EQUIPMENT 1-44.

Table 1-2 lists the test equipment and accessories recommended for use in testing, adjusting, and s ervicing the RF Section. If any of the recommended test equipment is unavailable, instruments with equivalent specifications may be used. See Appendix B, Section III.

1-6

Section 1 TM 11-6625-2837-14&P-7

See Appendix B, Section III

Table 1-2. Recommended Test Equipment (1 of 4)

Item Critical Specifications Suggested Model Use*

Adapter (Male Type N Frequency range 100 MHz to 1.3 GHz HP 1250-0847 P to GR874 )

Adapter, SMA-to-BNC 2 required OSM 21190 P Adapter, SMA-to-OSM OSM 219 P

Right Angle Adapter, Type N-to- OSM 21040 P

SMA Amplifier, 20 dB -20 dB gain at 30 MHz HP 8447A P

Input SWR <1.7 Amplifier, 40 dB Special (see Figure 1-2) P Analyzer, Distortion 20 Hz to 20 kHz; must measure <0.1% distortion HP 333A P Analyzer, Spectrum Measurement Accuracy +2.0 dB from 1 kHz HP 8553B with HP 8552B P.,A

to 110 MHz and HP 1-10T Analyzer, Spectrum Measurement Accuracy +2.0 dB from 10 MHz HP 8555A with HP 8552B P. A, T

to 8 GHz and HP 140T Analyzer, Wave Center frequencies 20 to 40 kHz HP 3581A P

Resolution bandwidth <3 Hz

Bandpass shape factor 10:1

Analog output 0 to 5V

Noise level (at 11 kHz center frequency with a

3 Hz bandwidth) <-150 dBV Attenuator, 3 dB 3 dB HP 8491A Option 003 P

Fixed Attenuator, 10 dB Step Calibrated at 30 MHz; refer to calibration curve HP 355D-H38 (only) P, A Attenuator, 40 dB 40 dB HP 8491A Option 040 P

Fixed Cables, Double Minimum input <300 mVrms (5 required) HP 08708-6033 P

Shielded Capacitor, 1500 pF HP 0160-2222 P Capacitor, 100 pF HP 0180-2207 P Connector, BNC HP 1250-0118 T

Panel Mount

*Use: P = Performance Tests, A = Adjustments, T = Troubleshooting

1-7

Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (2 of 4)

Item Critical Specifications Suggested Model Use*

Counter, Computing 50 kHz to 50 MHz with a 1 ms gate time and HP 5360A with HP 5365A P

external trigger; 1 Hz resolution plug-in Counter, Frequency Range: 0.2-1300 MHz HP 5340A P

Resolution: 1 Hz

10 MHz external reference output

7.2 Vrms output into 170 ohms Coupler, Directional Frequency range 100 MHz to 1.3 GHz HP 778D Option 12 P Detector, Crystal 1 to 1200 MHz HP 8471A P Detector, Crystal 10 MHz to 1.3 GHz HP 423A P, A FM Discriminator Input frequency 100 kHz to 10 MHz HP 5210A P, A

Linear Analog Output 1V full scale Filter Kit Accessory for HP 5210A HP 10513A P, A Filter, Low Pass, Special (see Figure 1-3) P

15 kHz Filter, Low Pass, Cutoff frequency: 4 MHz CIR-Q-TEL P 4 MHz FLT/21B-4-3/50-3A/3B

Filter, Low Pass, Cutoff frequency: 2200 MHz HP 360C P 2200 MHz

Filters, Low Pass, 100 kHz at 50 and 600 ohms Specials (See Figure 1-4) A 100 kHz

Filters, Low Pass, 1 MHz - 50 and 600 ohms Specials (See Figure 1-4) P, A 1 MHz

Filters, Low Pass, 5 and 10 MHz - 50 ohms Specials (See Figure 1-4) P 5 and 10 MHz

Filter, Band Pass Pass band 1-2 GHz HP 8430A P Generator, Distortion less than 0.3% HP 203A P

Function Range: 0.5 Hz to 20 kHz

Output level: 0.1 to 2.0 Vrms into 600 ohms Generator, Pulse Output -10 Vpk with <10 ns risetime in 600 HP 8013B P

ohms Generator, Sweep Sweep Width 0.1 to 100 MHz HP 8601A A

Output Level +20 to -80 dBm

Flatness +0.25 dB Generator, Synthe- +1 Hz from 1 MHz to 1300 MHz, +7 dBm output HP 8660 with HP 86631B P, A sized Signal 10 MHz Reference output

>0.5V into 170 ohms

*Use: P = Performance Tests, A = Adjustments, T = Troubleshooting

1-8

Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (3 of 4)

Item Critical Specifications Suggested Model Use*

Mixer, Double 1 MHz to 110 MHz HP 10514A A Balanced

Mixer, Double 300 to 1300 MHz Watkins-Johnson M1J P Balanced

Oscillator, Test 1 kHz to 10 MHz HP 651B P, A

1.0 to 2.0 Vrms into 600 or 50 ohms Oscilloscope Vertical: HP 180C with HP 1801A P, A, T

Bandwidth 50 MHz with sensitivity of and HP 1821A plug-ins

5mV/ division minimum

Horizontal:

Sweep time 10 ns to 1 s

Delayed sweep

External triggering to 100 MHz Oscilloscope, Input impedance HP 10004 P, A, T 10:1 divider probes 10 megohm shunted by 10 pF

Power MeterISensor Range: -10 to +10 dBm from 10 MHz to 1.3 HP 435A/8481A P, A, T GHz Power Supply, DC 0-10 volts HP 721A P

Programmer, Marked Capable of programming BCD or HP-IB data HP 3260A Option 001 P, A Card Probe, Logic TTL Compatible HP 10525T T

Resistor, 1000 ohm +2% HP 0757-0280 P, A Resistor, 10K ohm +2% HP 0757-0442 P

Resistor, 100K ohm f2% HP 0698-7284 P Service Kit Interconnect cables, adaptors, and coaxial HP 11672A (See A, T

cables compatible to 8660-series plus and Operating Note or

jacks mainframe manual for

parts list) Stub, Adjustable Frequency range 100 MHz to 1.3 GHz General Radio 874-D50L P Tee, Coaxial 2 required HP 1250-0781 (BNC) P, A Termination, 50 50 ohm HP 11048C P

ohm Feed Thru

*Use: P = Performance, A = Adjustments, T = Troubleshooting

1-9

Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (4 of 4)

Item Critical Specifications Suggested Model Use*

Termination, 50 ohm 50 ohm, (2 required) HP 11593A P Test Set, Phase Input Frequency Range 250 to 950 MHz HP 8660C-K10 (only) P, A

Modulation Distortion

<2% up to 2 MHz rates <3.5% up to 5 MHz <5.0% up to 10 MHz

Voltmeter, AC Accuracy +2% of full scale from HP 403B P, A, T

1 Hz to 1 MHz

1 mVrms to 10 Vrms full scale Voltmeter, Digital Range 0.00 to 60.00 volts HP 34740A/34702A P, A, T

DC Accuracy +(0.3%, of reading +0.01% of

range)

AC Accuracy +(0.25% of reading +0.05% of

range)

45 Hz to 20 kHz Voltmeter, Vector Frequency range 5 to 15 MHz HP 8405A P

Input level 100 mVrms to 1 Vrms

Analog output: +0.5 Vdc for +180°

*Use: P = Performance Tests. A = Adjustments, T = Troubleshooting

1-10

Section 1 TM 11-6625-2837-14&P-7

40 dB TEST AMPLIFIER

Amplifier Specifications

Gain 44 dB at 25°C

Bandwidth 100 kHz (3 dB down) Noise Bandwidth 157 kHz Input Impedance 75K Ohms Output Impedance 12K Ohms Current Drain 260 Microamperes Output (Maximum) 1 Volt Dynamic Range 66 dB

Figure 1-2. 40 dB Test Amlifier

Figure 1-3. 15 kHz Low Pass Filter

1-11

Section 1 TM 11-6625-2837-14&P-7

100 kHz - 50 ohms 100 kHz - 600 ohms

C1, C4 0.015 µF Mylar 0160-0194 C1, C4 1300 pF 0160-2221 C2 0.027 µF Mylar 0170-0066 C2 3000 pF 0160-2229 C3 0.022 µF Mylar 0160-0162 C3 1100 pF 0160-2219 L1, L2 100 µH 9140-0210 L1, L2 1200 µH 9100-1655

1 MHz -50 ohms 1 MHz - 600 ohms

C1, C4 1500 pF 0160-2222 C1, C4 130 pF 0140-0195 C2 3300 pF 0160-2230 C2 300 pF 0160-2207 C3 1600 pF 0160-2223 C3 120, µH 0140-0194

L1, L2 10H ±10% 9140-0114 L1, L2 120

5 MHz - 50 ohms 10 MHz - 50 ohms

C1, C2, C4 300 pF 0160-2207 C1, C4 150 pF 0140-0196 C3 680 pF 0160-3537 C2 330 pF 0160-2208 L1, L2 2 µH 9100-3345 C3 160 pH 0160-2206

L1, L2 1 µH±10% 9140-0096

NOTE

9100-1637

Unless otherwise noted, tolerance of components is + 5%

and capacitors are mica. Part numbers are Hewlett-Packard

Figure 1-4. Low Pass Filters

1-12

Section 2 TM 11-6625-2837-14&P-7

SECTION II

INSTALLATION

2-1. INTRODUCTION

2-2. This section provides information relative to initial inspection, preparation for use, and storage and shipment of the Model 86602B RF Section plug-in. Initial Inspection provides instructions to be followed when an instrument is received in a damaged condition. Preparation For Use gives all necessary interconnection and installation instructions. Storage and Shipment provides instructions and environmental limitations pertaining to instrument storage. Also provided are packing and packaging instructions which should be followed in preparing the instrument for shipment.

2-3. INITIAL INSPECTION

2-4. Inspect the shipping container for dam age. If the shipping container or cushioning material is dam aged, it should be kept until the contents of the shipment have been checked for com pleteness and the instrument has been checked mechanically and electrically. The contents of the shipment s hould be as shown in Figure 1-1, and procedures for chec king electrical perform ance are given in Section IV. If the contents are inc om plete, if there is mechanical damage or defect, or if the instrument does not pass the electrical performance test, notify the nearest Hewlett-Packard office. If the s hipping container is damaged, or the c ushioning material shows signs of stress, notify the carrier as well as the Hewlett-

Packard office. Keep the shipping m aterials for car rier’s inspection. The HP office will arrange for repair or replacement without waiting for claim settlement.

2-10. Modifications

2-11. A power supply modification to older versions of Model 8660A and 8660B mainfram es are requir ed if they are to be used with the option 002 RF Section.

Damage to the synthesized signal generator system may result if an option 002 RF Section is used with an older 8660A or 8660B mainframe.

2-12. Due to the increased power consumption of the option 002 instrument, mainframes with serial prefixes 1349A and below must be modif ied by installing a Field Update Kit. For mainframe configurations other than option 003 (60 Hz line operation), order kit number 08660-60273. For option 003 mainframes ( 50 - 400 Hz line operation) order kit number 08660-60274.

NOTE

Verify that a new higher current fuse, HP Part Number 2110-0365, 4A Slow Blow, is used in mainframes with the power supply modification.

2-13. Operating Environment

2-14. The RF Section is designed to operate within the following environmental conditions:

2-5. PREPARATION FOR USE 2-6. Power Requirements

2-7. All power required for operation of the RF Section is furnished by the mainfram e. T his RF Section requir es approximately 40 volt-amperes.

2-8. Interconnections

2-9. Prior to installing the RF Section plug-in into the mainfram e, verify that the Frequency Extension Module plug-in and interconnecting cable assem blies have been installed in accordance with the instru ctions contained in the Frequency Extension Module manual.

Temperature ........................................ 0° to +55°C

Humidity..................................... less than 95% relative

Altitude....................................... less than 15,000 feet

2-15. Installation Instructions

WARNING

The multi-pin plug connector which provides interconnection from mainframe to RF Section, will be exposed with the RF Section removed from the right-hand mainframe cavity. With the Line (Mains) Volt age off and power cord disconnected, power supply voltages may still remain which, if contacted, may constitute a shock hazard.

2-1

Section 1 TM 11-6625-2837-14&P-7

2-16. Insert the plug-in approximately half-way into the right cavity of the mainframe. Rotate the latch (lower right corner) to the left until it protrudes perpendicular to the front panel. Refer to Figure 2-1, which shows the plug-in partially inserted into the mainfram e and the latc h rotated to a position that is perpendicular to the plug-in front panel. Push the plug-in all the way into the mainframe cavity and then rotate the latch to the right until it snaps into position.

2-17. STORAGE AND SHIPMENT

2-18. Environment

2-19. The storage and shipping environm ent of the RF Section should not exceed the following limits:

Temperature................................ 40° to +75°C

Humidity....................................... less than 95% relative

Altitude......................................... less than 25,000 feet

2-20. Packaging 2-21. Original Type Packaging. Containers and

materials identical to those used in f ac tor y pack aging are available through Hewlett-Packard offices. If the instrument is being returned to Hewlett-Packard for servicing, attach a tag indicating the type of service required, return address, model number, and full serial Figure 2-1. RF Section Partially Inserted into Mainframe

number. Also mark the container FRAGILE to assure careful handling. In any correspondence, refer to the instrument by model number and full serial number.

2-22. Other Packaging. The following general instructions should be used for re-packaging with commercially available materials:

a. Wrap the instrument in heavy paper or plastic. (If shipping to a Hewlett-Packard office or service center, attach a tag indicating the type of ser vice required, return address, model number, and full serial number.)

b. Use a strong shipping container. A doublewall carton made of 350-pound test material is adequate.

c. Use enough shock-absorbing material (3 to 4inch layer) around all the sides of the instrument to provide firm cushion and prevent movement inside the container. Protect the control panel with cardboard.

d. Seal the shipping container securely.

e. Mark the shipping container FRAGILE to assure careful handling.

Figure 2-1. RF Section Partially Inserted into Mainframe

2-2

Section 3 TM 11-6625-2837-14&P-7

SECTION III

OPERATION

3-1. INTRODUCTION

3-2. This section contains information which will enable the operator to learn to operate and quickly check for proper operation of the RF Section plug-in as part of the Synthesized Signal Generator System.

3-3. PANEL FEATURES

3-4. The front and rear panel controls, connectors , and indicators of the RF Section and its options are described by Figure 3-1 and 3-2.

3-5. OPERATOR’S CHECKS

3-6. The RF Section, as part of the Synthesized Signal Generator System, accepts inputs from the rest of the system but controls only the RF output level. Even though the controlled circuits for most other functions are within the RF Section, the actual checks are f ound in the manual of the instrument which controls that function.

3-7. The Operator’s Check s in this m anual are intended to verify proper operation of the circuits which control and are controlled by the RF output level controls. This includes the meter, the VERNIER control, the OUT PUT RANGE switch, and the Output Range Attenuator when operating in the local mode. W hen the system is being remotely controlled, the 1 dB and 10 dB remote step attentator switches are checked in place of the VERNIER control and OUTPUT RANGE switch. Refer to Figure 3-

3-8. OPERATING INSTRUCTIONS

3-9. In this system, the mainframe and plug-ins contain the controls for frequency, modulation, and RF level selection. The mainframe controls frequency, the Modulation Section plug-in controls m odulation type and level, and the RF Section plug-in controls RF output level. The Operating Instructions for the RF Section plug-in are included in Table 3-1.

3-1

Section 3 TM 11-6625-2837-14&P-7

The front panel of the option 002 instrument is shown. The standard instrument does not have the term PHASE MODULATION after 1-1300 MHz. The option 001 instrument has an OUTPUT RANGE switc h whic h s hows only the +10 and 0 dBm ranges.

1 Meter. Indicates the RF Output level in Vrms and dBm (50w) with the scale reference indicated by the OUTPUT RANGE switch.

2 Mechanical Meter Zero Control. Sets the Panel Meter indicator to zero when the mainfram e LINE Switch is set to STBY.

3 OUTPUT RANGE Switch. Sets the output level range of all except option 001 instruments from

Figure 3-1. Front Panel Controls, Connectors, and Indicators

NOTE

+10 to -140 dBm (502) in 10 dB steps. For option 001 instruments, +10 and 0 dBm ranges only.

4 OUTPUT Jack. Type-N female coaxial connector. RF Output level +10 to -146 dBm (0.7 Vrms to 0.01 /IVrms) into a 50Q load. Frequency range is 1 to

1299.999 999 MHz in 1 Hz steps. 5 VERNIER Control. RF Output continuously var-iable

within the useable range (+3 to --6 dB) as indicated by the meter.

3-2

Section 3 TM 11-6625-2837-14&P-7

1 Coaxial Plug. Connects the 3.95 to 2.75 GHz RF

Input signal to the RF Section from the Frequency Extension Module.

2 Interconnect Plug. Provides interconnection of power supply voltages; RF and control signals between the RF Section plug-in and the Main-frame, Frequency Extension Module, and Modulation Section plug-in.

Figure 3-2. Rear Panel Connectors and Indicators

3 Coaxial Plug. Connects the 3.95 to 4.05 GHz LO Input signal to the RF Section plug-in from the Frequency Extension Module.

4 Serial Number Plate. Metal plate with stamped serial number. Four-digit and letter f or prefix. Suffix is unique to an instrument.

3-3

Section 3 TM 11-6625-2837-14&P-7

WARNING

BEFORE CONNECTING TH IS SYSTEM TO LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the mainframe manual should be followed.

Damage to the signal generator system may occur if option 002 RF Sections are used with unmodified 8660A and 8660B main f rames with serial prefixes 1349A and below. See the paragraph entitled Modifications in Section II.

Refer to Section HI for RF Section Installation instructions.

1. Set the System controls as follows: Mainframe

LINE Switch.................................................................................... ON

REFERENCESELECTOR.............................................................. EXT

CENTER FREQUENCY................................................................. 500 MHz

Modulation Section plug-in

MODE Switch................................................................................. OFF

RF Section plug-in

OUTPUT RANGE Switch ............................................................... 0 dBm

VERNIER Control........................................................................... +3 dB meter reading

NOTE

Figure 3-3. Operator’s Checks (1 of 2)

3-4

Section 3 TM 11-6625-2837-14&P-7

OPERATOR’S CHECKS

2. Connect the RF Section OUTPUT to the power sensor input. Ver if y that the amplitude of the 500 MHz s ignal

is approximately +3 dBm.

3. Set the OUTPUT RANGE Switch to +10 dBm and adjust the VERNIER control for a -3 dB meter reading.

Verify that the output level is approximately +7 dBm.

4. Connect the RF Section OUTPUT to the frequenc y counter input through the 3 dB attenuator. Verify that the

signal is accurate within +1 Hz.

5. To check the remote control capabilities of the RF Section, connect a control unit to the m ainfram e. Repeat

steps 1 through 4 while the system is remotely programmed fr om an external source. Application Note 164-1 "Programming the 8660A/B Synthesized Signal Generator" provides the inform ation needed for r emote BCD operation of this system. Application Note 164-2 "Calculator Control of the 8660A/B/C Synthesized Signal Generator" provides the inform ation needed for calculator control of the s ystem us ing the HP- IB ( option 005). Section III of the mainframe manual contains the same information in abridged form.

Figure 3-3. Operator’s Checks (2 of 2)

3-5

Section 3 TM 11-6625-2837-14&P-7

Table 3-1. Operating Instructions (1 of 2)

OPERATING INSTRUCTIONS

TURN ON

BEFORE CONNECTING THIS SYSTEM TO THE LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the mainframe manual should be followed.

Damage to the signal generator system may occur if option 002 RF Sections are used with unmodified 8660A and 8660B main- frames with serial prefixes 1349A and below. See the paragraph entitled Modifications in Section II.

NOTE

Refer to Section II for RF Section Installation Instructions.

1. Set the mainf ram e’s LINE Switch to ON and the rear panel REFERENCE SELECTOR Switch to INT . Wait for the mainframe "oven" indication to go out.

FREQUENCY SELECTION

2. Refer to Section III of the mainframe operating and service manual for information on system frequency selection.

RF OUTPUT LEVEL

3. dBm . Set the OUTPUT RANG E switch to within +3 and --6 dB of the desired output level. Adjust the VERNIER control for a meter r eading which when added to the O UT PUT RANGE switch indication equals the desired output level.

4. VOLTS. To set the RF output level in rms volts, the OUTPUT RANGE switch selec ted the f ull s c ale meter reading and the VERNIER control is adjusted for the cor rect voltage reading on the meter. The voltage level f or meter scale 1.0 should not be set below 0.32 of full scale. T he voltage level should not be set below 1 when using the meter scale of 3.

NOTE

In order to achieve the output level accuracy specified, the level selected must be S<+10 dBm and the RF Section front panel meter reading must be as stated above.

5. Connect the RF Output to the Devic e Under Test. The front panel m eter r eading of RF Output level will be c or rec t only if the input impedance of the Device Under Test is 50w2.

3-6

Section 3 TM 11-6625-2837-14&P-7

Table 3-1. Operating Instructions (2 of 2)

MODULATION SELECTION

6. Refer to Section III of the Modulation Section plug-in operating and service manual for information relating to selection of modulation type and level.

REMOTE OPERATION

7. Application Note 164-1 "Programming the 8660A/B Synthesized Signal Generator" provides most of the information needed for remote BCD operation of this system. AN 164-2 "Calculator Control of the 8660A/B/C Synthesized Signal Generator" provides information for r emote HP-IB operation of this system. In abridged f orm, Section III of the mainframe manuals contain the same information.

3-7

Section 4 TM 11-6625-2837-14&P-7

SECTION IV

PERFORMANCE TESTS

4-1. INTRODUCTION

4-2. The procedures in this section test the

instrument’s electrical performance using the specifications of Table 1-1 as the per formance standard All tests can be perform ed without access to l interior of the instrument. A simpler operation test is included in Section III under Operator’s Checks.

4-3. EQUIPMENT REQUIRED

4-4. Equipment required for the per formance tests is listed in the Recommended Test Equipment table in Section I. Any equipment that satisfies critical specifications given in the table m ay substituted for the recommended model(s).

4-5. TEST RECORD

4-6. Results of the perform ance tests may tabulated on the Test Record at the end of the procedures. T he Test Record lists all of the test specifications and their acceptable limits. Test results recorded at incoming

inspection can be used for comparison in periodic maintenance and trouble-shooting, and after repairs or adjustments.

4-7. PERFORMANCE TESTS

4-8. For each test, the specifications are written exactly as they appear in the specification table in Section I. Next, a description of the test and any special instructions or problem areas are included. Most tests that require test equipment have a setup drawing; each has a list of required equipment. The initial steps of each procedure give control settings required for that particular list.

To avoid the possibility of damage to the instrument or test equipment, read completely through each test before starting it. Then make any preliminary control settings before continuing with the procedure.

4-1

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-9. FREQUENCY RANGE

SPECIFICATION: 1 to 1299.999999 MHz selectable in 1 Hz steps. Frequencies from 200 to kH z to 1 MHz m ay also be selec ted with som e degradation in specifications.

DESCRIPTION: The Synthesized Signal Generator System RF OUTPUT is monitored by a frequency counter which supplies a common time base reference signal. The frequencies are checked at the extremes. Any specified frequency may be checked.

Figure 4-1. Frequency Range Test Setup

EQUIPMENT:

Frequency Counter....................................HP 5340A

10 dB Fixed Attenuator..............................HP 8491A Opt 003

NOTE

In the following procedure, allow for accuracy of counter used. -Model recommended is specified at +1 count.

1. Connect frequency counter 10 MHz output reference signal to mainframe EXT REF input as shown in Figure 4-1 and set mainframe rear panel REF switch to EXT.

2. Set the RF Section OUTPUT RANGE switch to 0 dBm; set the VERNIER control full CW.

3. Set mainframe center frequency to 1.000 000 MHz and check RF section output frequency with counter. Record the frequency.

0.999999_______________________1.000001 MHz

4. Set m ainf ram e center f requenc y to 1299.999 999 MHz (Option 004 mainf ram e set to 1299.,s pace 9999 MHz) and check RF Section output frequency with counter. Record the frequency.

1299.999 998________________1300.000 000 MHz

4-2

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-10. FREQUENCY ACCURACY AND STABILITY

SPECIFICATION: CW f requenc y accuracy and long term stability are determ ined by the aging rate of the time base (internal or external) and

its sensitivity to changes in temperature and line voltage. Internal ref er enc e osc illator acc ur ac y = + aging rate +3 x 10-10/° C + 3 x 10-10/1% change in line voltage. (Aging rate for the tim e base in the standard mainfram e is 3 x 10- 8/day; for option 001 mainframes, 3 x 10-9/day.)

NOTE

If there is any reason to doubt the mainframe crystal oscillator accuracy or stability, r efer to the per formanc e tes t in Sec tion IV of the mainframe manual.

_______________________________________

4-11. FREQUENCY SWITCHING TIME

SPECIFICATION: 6 ms to be within 50 Hz of any new frequency selected; 100 ms to be within 0.5 Hz of any new frequency selected.

DESCRIPTION: A change in the Synthesized Signal Generator System's frequency is remotely programmed; af ter a preset time interval the frequency is measured. A trigger pulse from the program m ing device is f irst c oupled to the oscillos cope. T he pulse is delayed a preset interval by the oscilloscope and then coupled to the computing counter at which tim e the frequency is measured.

NOTE

The frequencies in this test were selected for worst-case conditions (longest switching time).

4-3

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-11. FREQUENCY SWITCHING TIME (Cont’d)

Figure 4-2. Frequency Switching Time Test Setup

EQUIPMENT:

DC Power Supply.......................................HP 721A

Computing Counter....................................HP 5360A/5365A

Marked Card Programmer.........................HP 3260A Opt 001

Oscilloscope...............................................HP 180C/1801A/1821A

Coaxial Tee................................................HP 1250-0781

PROCEDURE:

1. Connect the dc power supply +5 volt output through a 1000 ohm resistor to pin 17 of the m ating connector f or J3. Pin 17 (flag) of the Marked Card Programmer output connector is also connected to the oscilloscope ext trigger input.

2. Connect the marked card programmer to mainframe rear panel connector J3.

3. Connect oscillos cope delayed sweep output through a BNC TEE to oscilloscope channel A vertical input and to computing counter rear panel external time measurement input.

4. Set counter controls as f ollows: rear panel switch to trigger ; "B" channel to X1 sensitivity; m odule switch pres sed; digits displayed for necessary resolution; measurement time to 1; counter gate time to 1 ms.

5 Program the System for 29.999 999 MHz. Set the mainframe rear panel reference switch to external.

6. Set oscilloscope controls as follows: trigger to ac slow; ext, negative slope, trigger level at about 9:00 o’clock; sweep mode auto; delay trigger auto; main sweep 1 ms; delay sweep 0.1 ps; main sweep mode.

7. Set oscilloscope trace to start at left vertical graticule line. Use oscilloscope delay control to delay spike 5.5 divisions from CRT left graticule line.

8. Switch oscilloscope sweep mode from auto to normal.

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Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-11. FREQUENCY SWITCHING TIME (Cont’d)

9 Program the system for 30.000 000 MHz. Frequency displayed on computing counter should be 30 MHz + 50 Hz.

Record the frequency.

29.999950__________________30.000050 MHz

10. Program the system for 29.999 999 MHz. Frequency displayed on counter should be within + 50 Hz of 29.999 999

MHz.

29.999949__________________30.000049 MHz

11. Set Oscilloscope normal sweep for 10 ms and delay sweep to 1 us.

12. Set Oscilloscope sweep mode to auto and delay control for delay spike 9.5 divisions from the CRT left graticule line.

13. Set Oscilloscope main trigger to normal and computing counter gate time to 10 ms.

14. Program the System for 30.000 000 MHz. Frequency displayed on computing counter should be within + 5 Hz or programmed frequency.

29.999995__________________30.000005 MHz

15. Program the System for 29.999 999 MHz. Frequency Displayed on computing counter should be within + 5 Hz of programmed frequency.

29.999994___________________30.000004 MHz

NOTE

To reduce the effect of random errors, steps 5 thr ough 10 and 13 through 15 may be repeated several times (5 minimum). Record the average frequency.

______________________________________________

4-12. OUTPUT LEVEL SWITCHING TIME

SPECIFICATION: In remote mode, any level change can be accom plished in less than 50 ms. Any change to another level on the same attenuator range can be accomplished in 5 ms.

DESCRIPTION: The Synthesized Signal Generator System RF OUTPUT level (attenuation) is remotely programmed while the RF OUTPUT is detected and monitored by an oscilloscope. Because the oscilloscope is triggered by the programming device, the time needed to effect the level change may be measured directly on the oscilloscope CRT.

4-5

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-12 OUTPUT LEVEL SWITCHING TIME (Cont’d)

Figure 4-3. Output Level Switching Time Test Setup

EQUIPMENT:

Marked Card Programmer...................................... HP 3260A Opt 001

Oscilloscope............................................................ HP 180C/1801A/1821A

Crystal Detector ..................................................... HP 8471A

Power Supply.......................................................... HP 721A

PROCEDURE:

1. Connect equipm ent as illustrated in Figure 4-3. Note that + 5 volt output from DC Power Supply is connected through a 1000 ohm resistor to pin 17 of mating connector to J3 and to Oscilloscope external trigger input.

2. Connect RF Section OUTPUT through crystal detector to oscilloscope Channel A input.

3. Set Oscillos cope controls as follows: Main Tim e/Div, 5 ms; Vertical input, dc coupled, 0.2 V/Div; Norm al Sweep;

Ext Trigger, negative slope, AC slow Trigger level about 9:00 o’clock.

4. Program the System’s center f requency for 500 MHz and 10 dB attenuation of the RF output signal. Reprogram for 19 dB attenuation. Switching time should be less than 5 ms. Record switching time.

10 to 19 dB_______________________5 ms

5. Program RF Section attenuation for 10 dB, then for 30 dB. Switching time should be less than 50 ms.

10 to 30 dB_______________________50 ms

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PERFORMANCE TESTS

4-12. OUTPUT LEVEL SWITCHING TIME (Cont’d)

6. Repeat steps 4 and 5 with center frequency set to 1 MHz.

10 to 19 dB__________________________5 ms

_______________________________________________

4-13A. OUTPUT ACCURACY

SPECIFICATION: (for local and remote modes) +1.5 dB to -76 dBm; +

DESCRIPTION: The RF level accuracy for the +10 and 0 dBm ranges is measured with a power meter. For the lower ranges, an IF substitution measurement technique is used.

2.0 dB to -146 dBm at meter readings between +3 and -6 dB.

RF level (attenuation) measurements using IF substitution is accomplished by 1) converting the RF output to a low frequency IF signal, 2) offsetting the decrease in RF level ( increas e in attenuation) by an equal decrease in IF attenuation. This maintains a fairly constant output level at the IF load. The intermediate frequency is selected on the basis of availability of a precision attenuator. Therefore, any variation in output level from an established r eferenc e is pr im arily due to the RF attenuator.

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Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13A. OUTPUT ACCURACY (Cont’d)

EQUIPMENT:

Figure 4-4A. Output Accuracy Test Setup

Power Meter/Sensor............................................... HP 435A/8481A

Synthesized Signal Generator ............................... HP 8660C/86602B/86631B

40 dB Attenuator..................................................... HP 8491A Option 040

Mixer....................................................................... Watkins-Johnson M1J

4 MHz Low Pass Filter............................................ CIRC-Q-TEL FLT/21B-

4-3/50-3A/3B

Coaxial Tee............................................................. 1250-0781 (BNC)

50 Ohm Termination............................................... HP 11593A

40 dB Amplifier........................................................ (See Figure 1-2)

Double Shielded Cables (5 required)...................... HP 08708-6033

Capacitor, 100 #F ................................................... .HP 0180-2207

Resistor, 100 k........................................................ HP 0698-7284

Type N-to SMA Adaptor.......................................... OSM 21040

SMA-to-OSM Right Angle Adapter ......................... OSM 219

SMA-to-BNC Adapter (2)........................................ OSM 21190

10 dB Step Attenuator............................................. HP 355D Option H38

Wave Analyzer........................................................ HP 3581A

4-8

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13A. OUTPUT ACCURACY (Cont’d)

PROCEDURE:

1. Set the System Under Test Controls for a center frequency of 1000.000000 MHz and an output level of +10 dBm.

2. Set the power meter controls for the +15 dBm range.

3. Connect the power sensor to the RF Section OUTPUT jack of the System Under Test.

4. Set the RF Section c ontrols as shown in the table below and verify that the RF output level is within the specif ied tolerance.

Synthesized Signal Generator System

OUTPUT RANGE

Switch

(dBm)

+10 0 +8.5________+11.5 +10 -3 +5.5________+ 8.5 +10 -6 +2.5________+ 5.5

0 -6 -7.5_________- 4.5 0 -3 -4.5_________- 1.5 0 0 -1.5_________+ 1.5 0 +3 +1.5_________+ 4.5

Panel Meter

Reading

(dB)

Power Reading

Reading

(dBm)

NOTE

Be careful not to vary the RF Section ‘s VERNIER control setting throughout the rest of this procedure.

5. Connect the 40 dB attenuator directly to the OUTPUT jack of the RF Section in place of the power sensor.

6. Connect the “R” port of the mixer directly to the 40 dB attenuator using the Type N-to SMA adapter and the SMA-

to-OSM right angle adapter.

7. Connect the 4 MHz Low Pass Filter to the “I” port of the mixer with a SMA-to-BNC adapter.

8. Connect the cable from the Reference System output to the “L” port of the mixer with a SMA-to-BNC adapter.

NOTE

Be sure all connections are tight to prevent RF leakage.

9. Set the reference system c ontrols for a center frequency of 1000.011000 and an output level of +7 dBm . Set the rear panel reference selector to external.

10. Set the 10 dB Step Attenuator to 50 dB.

4-9

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13A. OUTPUT ACCURACY (Cont’d)

11. Set the wave analyzer controls as follows: frequency 11 kHz, resolution bandwidth 3 Hz, sweep mode of f, dBv/LIN

- dBm 600:1 switch to dBv/LIN, amplitude reference level -40 dB, AFC switch unlock and scale 10 dB.

12. Connect the other equipment which follows the 4 MHz Low Pass Filter as shown in Figure 4-4A.

13. Tune the wave analyzer frequency control for the maxim um m eter reading. Adj ust the input s ensitivity and vernier controls for a midscale meter reading. Press the AFC control for frequency lock.

14. Wait 30 seconds for the DVM reading to stabilize. Record the DVM reading. This is the reference level equivalent to the last power meter reading ( +3 dBm).

15. Use the following formula to calculate the obsolute RF output level from the System Under Test:

dBm = dBm1 -A dB +2(V-Vre

dBm is the RF output level dBm1 is the actual RF level measured at the +3 dBm (O dBm OUTPUT RANGE setting) in Step 4. A dB is the difference in 10 dB step attenuator setting. V is the DVM reading for each individual OUTPUT RANGE. Vref is the reference DVM reading.

NOTE

The wave analyzer recorder output sensitivity is 2dB/volt.

16. Set the RF Section OUTPUT RANGE switch to -10 dBm; set the 10 dB step attenuator to the 40 dB. Wait 30 seconds for the reading to stabilize. Record the DVM reading in the table following step 17. Calc ulate and record the RF level in the table.

EXAMPLE:

dBm = dBm1 --(∆dB) +2 (V1 -Vref)

dBm1 = 2.8 dBm

∆

dB = 10 dB V1= 2.388 Vdc Vref = 2.433 Vdc (from step 14)

dBm = 2.8 - (10) +2(2.388-2.433)

= 2.8 -10 +2(-0.045) = -7.29 dBm

4-10

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13A. OUTPUT ACCURACY (Cont’d)

17. Continue as in step 16,space to measure, record and calculate the DVM reading and RF level for each OUTPUT RANGE setting as shown in the following table.

Absolute RF Output

Output Range 10dB Step DVM Level (dBm)

Switch Attenuator Reading

(dB) (Vdc) Min. Actual Max.

0 50 _________ + 1.5 __________ + 4.5

- 10 40 _________ - 8.5 __________ - 5.5

-20 30 _________ -18.5 __________ -15.5

-40 10 _________ -38.5 __________ -35.5

-50 0 _________ -48.5 __________ -45.5

18. Set the 10 dB step attenuator to 50 dB.

19. Remove the 40 dB attenuator and connect the mixer directly to the OUTPUT jack of the system under test.

20. Increase the wave analyzer’s input sensitivity by 10 dB. If necessary,space adjust the input sensitivity vernier for a midscale meter reading.

21. Transfer the last calculated RF output level on the preceding table to the first line on the following table. Wait 30

seconds and record the new DVM reading (Vref).

22. Use the formula and the new Vref level to calculate the RF level for each range shown in the following table.

Absolute RF Output

Output Range 10 dB Step DVM Level (dBm)

Switch (dBm) Attenuator Reading

(dB) (Vdc) Min. Actual Max.

-50 50 ________ -48.5 ________ -45.5

-60 40 ________ -58.5 ________ -55.5

-70 30 ________ -68.5 ________ -65.5

-80 20 ________ -79.0 ________ -75.0

-90 10 ________ -89.0 ________ -85.0

-100 0 ________ -99.0 ________ -95.0

23. Set the wave analyzer’s AFC switch to unlock (OFF). Adjust the frequency control for the peak reading equal to

the last recorded DVM reading on the previous table.

24 Set the 10 dB step attenuator to 30 dB.

4-11

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13A. OUTPUT ACCURACY (Cont’d)

25. Set the wave analyzer amplitude reference level to -60 dB. Increase the input sensitivity 10 dB.

26 Transf er the last RF output level reading on the preceding table to the first line of the following table. After 30

seconds record the new DVM reference on the first line of the following table.

27. Measure, calculate,space and r ecor d the DVM reading and RF level for each OUTPUT RANGE Setting as shown

in the following table. Due to the high noise levels evident on this test, ther e is apprec iable deviation in the wave analyzer and DVM readings. Record the average reading.

Absolute RF Output

Output Range 10dB Step DVM Level (dBm)

Switch (dBm) Attenuator Reading

(dB) (Vdc) Min. Actual Max.

-100 30 _______ -99.0 _________ -95.0

-110 20 _______ -109.0 _________ -105.0

-120 10 _______ -119.0 _________ -115.0

-130 0 _______ -129.0 _________ 125.0

NOTE

Output level accuracy may be checked at any frequency between 300 and 2000 MHz using this procedure. This procedure may also be used at the frequency extremes if a well shielded mixer specified for the desir ed frequency range is used in place of the Watkins Johnson M1J.

4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE

SPECIFICATION: +1.5 dB to -76 dBm; +2.0 dB to -146 dBm at meter readings between +3 and -6 dB.

DESCRIPTION: The RF Level Accuracy for the +10 and 0 dBm ranges is m easured with a power m eter. A reference level is es tablished and accuracy is checked from 0 dBm to -80 dBm by compar ing the RF Sec tion attenuation agains t a calibr ated 10 dB s tep attenuator.

NOTE

This procedure checks all sections of the RF Section Attenuator separately. Also, the 10 dB, 20 dB, and 40 dB sections are checked in all possible combinations. The sum of the -70 dBm inaccuracy at -80 dBm shall not exceed +1.0 dB.

4-12

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE (Cont’d)

Figure 4-4B. Output Accuracy Test Setup (Alternate Procedure)

EQUIPMENT:

Spectrum Analyzer.................................................. HP 8555A/8552B/140T

Power Meter/Sensor............................................... HP 435A/8481A

10 dB Step Attenuator............................................. HP 355D Option H38

20 dB Amplifier........................................................ HP 8447A

PROCEDURE:

1. Set the system controls for a frequency of 30 MHz and an output level of +10 dBm.

2. Connect the power sensor to the RF Section’s OUTPUT jack.

3. Set the RF Output Level as shown in the table below and verify that the level is within the specified tolerance.

Synthesized Signal Generator System

Output Range

Switch

(dBm)

+10 0 +8.5_______+11.5 +10 -3 +5.5_______+ 8.5 +10 -6 +2.5_______+ 5.5

0 -6 -7.5________-4.5 0 -3 -4.5________-1.5 0 0 -1.5________+1.5 0 +3 +1.5________+4.5

Panel Meter

Reading

(dB)

Power Meter

Reading

(dBm)

4-13

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE (Cont’d)

NOTE

Do not change the RF Section VERNIER Control Setting until this procedure is completed.

4. Set the spectrum analyzer controls as follows: center frequency 30 MHz, frequency span per division 5 kHz,

resolution bandwidth 3 kHz, input attenutation 10 dB, vertical sensitivity per division 2 dB and sweep time per division 5 ms.

5. Set the 10 dB Step attenuator switch to the 80 dB range.

6. Connect the equipment as shown in Figure 4-4B.

7. Adjust the reference level range and vernier to extablish a reference level on the analyzer display.

8. On the first line of the following table, record the power meter reading shown on the preceding table for the

OUTPUT RANGE Setting of 0 dBm and the panel meter reading of +3 dB. T his is the absolute RF level which corresponds to the display reference.

9. Set the OUTPUT RANGE switch and the 10 dB step attenuator range s witch s ettings as s hown on each line of the

following table. Record the display variation from the established reference.

10. Calculate the RF level using the following formula:

dBm = dBm1 - ∆AdB10 + ∆dB dBm is the RF output level dBm1 is the RF level measured at +3 dBm (0 dBm OUTPUT RANGE setting) in step 3.

∆ ∆

is the change in 10 dB Step Attenuator level

dB is the variation from the established display reference for each OUTPUT RANGE setting.

For example, results of the first step are:

dBm1 =+2.8

= 10

∆

A dB

∆

A dB= -0.2 dBm = +2.8 dBm -10 dB +(-0.2) dB = -7.4 dBm

4-14

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-13B. OUTPUT ACCURACY - ALTERNATE PROCEDURE (Cont’d)

10 dB Step RF Output Level

Output Range Attenuator (dBm)

Switch (dBm) (dB) Min. Measured Max.

0 80 + 1.5 ________ + 4.5

-10 70 -8.5 ________ - 5.5

-20 60 -18.5 ________ -15.5

-30 50 -28.5 ________ -25.5

-40 40 -38.5 ________ -35.5

-50 30 -48.5 ________ -45.5

-60 20 -58.5 ________ -55.5

-70 10 -68.5 ________ -65.5

-80 0 -79.0 ________ -75.0

11. Subtract the two levels obtained for OUTPUT RANGES of -70 and -80 dBm. The level change should be 10 + 1 dB.

9 dB_________________________________11 dB

4-14. OUTPUT FLATNESS

SPECIFICATION: Output level variation with frequency is less than +1.0 dB from 1-1300 MHz at front panel meter readings between +3 and 6 dB.

DESCRIPTION: After an output level reference is established, power level measurements are made at various frequencies across the range of the Synthesized Signal Generator System. The Output levels must fall within the limits specified.

EQUIPMENT:

Power Meter/Sensor............................................... HP 435A/8481A

PROCEDURE:

1. Zero the Power Meter.

2. Set the system center frequency to 1000 MHz.

3. Set the Power Meter range switch to 0 dBm; set the RF Section OUTPUT RANGE Switch and VERNIER Control for an output level of -1.0 dBm as read on the power meter.

4-15

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-14. OUTPUT FLATNESS (Cont’d)

4. Measure and record the power level indicated by the Power Meter at the following center frequencies: 1 MHz, 10 MHz, 100 MHz, 200,space 400,space 600,space 800,space and 1299 MHz.

1 MHz -2.0_______________0.0 dBm 10 MHz -2.0_______________0.0 dBm 100 MHz -2.0_______________0.0 dBm 200 MHz -2.0_______________0.0 dBm 400 MHz -2.0_______________0.0 dBm 600 MHz -2.0_______________0.0 dBm 800 MHz -2.0_______________0.0 dBm 1299 MHz -2.0_______________0.0 dBm

4-15. HARMONIC SIGNALS

SPECIFICATION: All harmonically related signals are at least 30 dB below the desired output signal for output levels < +3 dBm. (25 dB down for output levels above +3 dBm.)

DESCRIPTION: A spectrum analyzer is used to measure the r elative levels of the second and third carrier har monics with respec t to the carrier fundamental at various center frequencies.

EQUIPMENT:

Spectrum Analyzer.................................................. HP 8555A/8552B/140T

PROCEDURE:

1. Set the system center frequency to 1299 MHz; set the RF Section OUTPUT RANGE switch and VERNIER control for an output level of +10 dBm.

2. Connect the power meter/sensor to the system RF OUTPUT jack.

3. Readjust the VERNIER control for a power meter reading of +10 dBm.

4. Set the spectrum analyzer input attenuation to 30 dB. Connect the RF Section OUTPUT jack to the spectrum analyzer RF input.

5. Set the other spectrum analyzer controls for convenient viewing of the carrier. Adjust the controls as necessary to view the second and third harmonics. Record the harmonic levels relative to the fundamental signal.

Second Third

1299 MHz >,space 25 dB down ______ ______

4-16

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-15. HARMONIC SIGNALS (Cont’d)

6. Repeat steps 1 through 5 at the other frequencies listed. Record the levels.

Second Third 1000 MHz>-25 dB down ______ ______ 500 MHz>25 dB down ______ ______ 100 MHz>25 dB down ______ ______ 10 MHz >25 dB down ______ ______

7. Set the system center frequency to 100 MHz; set the RF Section OUTPUT RANGE switch to 0 dBm and the VERNIER control for a front panel meter reading of +3 dB. Record the harmonic levels.

Second Third

100 MHz >-30 dB down ______ ______

4-16 PULSE MODULATION RISETIME

SPECIFICATION: 50 nanoseconds.

DESCRIPTION: The external pulse generator output is coupled to the RF Section plug-in through the Model 86631B Auxiliary Section. The pulse modulated signal is detected and the rise time measured with an oscilloscope.

4-17

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-16. PULSE MODULATION RISETIME (Cont’d)

Figure 4-5. Pulse Modulation Risetime Test Setup

EQUIPMENT:

Pulse Generator...................................................... HP 8013A

Oscilloscope............................................................ HP 180C/1801A/1821A

Crystal Detector...................................................... HP 423A

Termination, 50Ω Feedthru..................................... HP 11048C

Band Pass Filter...................................................... HP 8430A PROCEDURE:

1. Set System center frequency to 1200 MHz.

2. Set the RF Section OUTPUT RANGE switch and VERNIER control for an output of +10 dBm.

3. Set the Auxiliary Section external modulation switch to pulse; set pulse level control full cw.

4. Adjust pulse generator output for -10 Vpk (into 50Q) with risetime <10 ns; set pulse repetition rate and width to convenient values.

5. Connect equipment as illustrated in Figure 4-5.

6. Adjust oscilloscope to display leading edge of detected pulse modulated RF signal. Risetime, as measured between the 10% and 90% amplitude points on leading edge should be 50 nanoseconds or less.

__________________50 ns

4-18

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-17. PULSE MODULATION ON/OFF RATIO

SPECIFICATION: At least 40 dB

DESCRIPTION: An HP Model 86631B Auxiliary Section is inserted in the left cavity of the ma inframe. Inputs of -9.5Vdc (pulse-on) and 0 Vdc (pulse-off) are input to the Aux iliary Section while the RF output of the system is monitored by a s pectrum analyzer. The ratio of the pulse-off and pulse-on RF levels is the on/off ratio.

EQUIPMENT:

Spectrum Analyzer.................................................. HP 8555A/8552B/140T

Power Supply.......................................................... HP 6215A

PROCEDURE:

1. Set System center frequency to 500 MHz, RF Section OUTPUT RANGE Switch and VERNIER control for an output level of +10 dBm, and Auxiliary Section external modulation switch to pulse.

2. Set spectrum analyzer input attenuation to 30 dB; connect the RF Section OUTPUT to the analyzer RF input.

3. Connect -9.5 Vdc from the power supply to the Auxiliary Section input.

4. Adjust the analyzer controls for a CRT display of the carrier. Establish the reference by positioning the carrier peak on the top horizontal graticule line.

5. Set the power supply output to 0.0 Vdc. Set the Pulse Level control fully clockwise. The signal displayed on Spectrum Analyzer should be >40 dB down with respect to the reference. Record the displayed level.

40 dB down__________

4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH

SPECIFICATION: Depth: 0-90% for RF output level meter readings from +3 to -6 dB and only at +3 dBm and below. 3 dB Bandwidth: At center frequencies <10 MHz

10 kHz from 0 - 30% AM

6 kHz from 0 - 70% AM 5 kHz from 0 - 90% AM

At center frequencies >10 MHz

100 kHz from 0 - 30% AM

60 kHz from 0 - 70% AM 50 kHz from 0 --90% AM

NOTE

To check AM accuracy, refer to section IV of the appropriate modulation section Operating and Service manual.

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Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH (Cont’d)

DESCRIPTION: The system Rf output is am plitude modulated. T he signal is demodulated by a peak detector in a spectr um analyzer (the frequency span width is set to zero). The ac and dc com ponents are m easured with a voltmeter at the detector ( vertical) output. First, the dc component is set to -283 mVdc plus a detector offset correction. Then, the ac component is

measured. The AM level (%) is ½ (one half) the rms output. Because of the required measurement accuracy, the accuracy of the spectrum analyzer’s detector offset must be known to

+2 mVdc. The off set voltage is calculated by measuring the change in the detector output f or a change in the RF input and assuming a linear detector over the range of the levels used.

EQUIPMENT:

Figure 4-6. Amplitude Modulation Depth and 3 dB Bandwidth Test Setup

Test Oscillator......................................................... HP 651B

AC Voltmeter........................................................... HP 403B

10 dB Step Attenuator............................................. HP 3550 Option H38

Spectrum Analyzer.................................................. HP 8555A/8552B/140T

Digital Voltmeter ..................................................... HP 34740A/34702A

Coaxial Tee (2 required)......................................... HP 1250-0781

Crystal Detector...................................................... HP 423A

Oscilloscope............................................................ HP 180C/1801A/1821A

Resistor 1K ............................................................ HP 0757-0280

4-20

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH (Cont’d)

PROCEDURE:

1. Connect the equipment as shown in Figure 4-6 (step 1).

2. Set the synthesized signal generator controls as follows: center frequency 30 MHz, OUTPUT RANGE 10 dBm, VERNIER control for a panel meter reading of 0 dB, and AM off.

3. Let the spectrum analyzer warm up for 1 hour to minimize drift of the spectrum analyzer detector output. Set 10 dB step attenuator to 10 dB attenuation.

4. Set the spec trum analyzer center frequency to 30 MHz, frequency span per division 5 MHz, resolution bandwidth 300 kHz; input attenuation to 20 dB, and vertical sensitivity per division 10 dB. Adjust the center frequency control to center the display. Set the frequency span to zero and tune to peak the trace.

NOTE

Throughout this test, continually check that the signal is peaked for maximum deflection. Tune the center frequency control for maximum signal deflection.

5. Set the vertical scale to linear and adjust the reference level vernier for a digital voltmeter reading of 200 mVdc.

6. Set the 10 dB step attenuator to 0 dB and record the digital voltmeter reading.

_______________mVdc

7. Set the 10 dB Step Attenuator to 20 dB and record the digital voltmeter reading.

_______________mVdc

8. Calculate the offset voltage using the following formula:

mVdc + 200a

off

1-a

Where Voff is the offset voltage in millivolts mVdc is the DVM reading in m illivolts a is 3.16 (step 5) or 0.316 (step 6).

For example:

mVdc = -687 in step 5

-687 + 200 (3.16

therefore V

= = +25.5 mVdc

off

)

1 -(3.16)

9. Find the value of V

off

for step 6. The difference between the two should be < 4 m Vdc. Use the average value of

off

10. Set the 10 dB step Attenuator to 10 dB.

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4-18. AMPLITUDE MODULATION DEPTH AND 3 dB BANDWIDTH (Cont’d)

11. Set the system center frequency to 500 MHz, the modulation mode to AM, the modulation source to ex ternal, and a modulation level of 30% (0.3 Vrm s input to an Auxiliary Section; 1.5 Vrms to a Modulation Section) at a 1 kHz rate.

12. Set the spectrum analyzer center frequency control to 500 MHz, frequency span to zero, and peak the trace. Set the reference level vernier for a digital voltmeter reading of -283 mVdc + Vof

See Steps 8 and 9.

13. Set the DVM controls to measure the peak detector’s ac component. The modulation level (%) is 1/2 (one-half) the DVM reading (Vrms). Record the reading for 30% AM.

50 mVrms_______________________70 mVrms

14. Set the modulation section (test oscillator) controls for 70% AM. Record the DVM reading.

130 mVrms_____________________150 mVrms

15. Set the modulation section (test oscillator) controls for 90% AM. Record the DVM reading

170 mVrms_____________________190 mVrms

16. Connect the crystal detector to the RF Section OUTPUT jack.

17. Set the modulation section and test oscillator controls for an AM level of 30% (0.3 Vrms input to an auxiliary section; 1.5 Vrms to a modulation section) at a 5 kHz rate.

18. Set the oscilloscope controls for a 5 division peak-to-peak display of the demodulated signal.

19. Increase the test oscillator frequency to 100 kHz. The signal amplitude should be >3.5 divisions peak-to-peak.

3.5 div. p-p_________________

20. Install the 1500 Pf capacitor as shown in Figure 4-6.

21. Repeat steps 17 through 19 with center frequenc y set to 9 MHz. Increase the test os cillator frequenc y from 5 to 10 kHz. Record the signal amplitude.

3.5 div. p-p_________________

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PERFORMANCE TESTS

4-19. FREQUENCY MODULATION RATE AND DEVIATION

SPECIFICATION: Rate: DC to 200 kHz with the 86632B or 86635A.

20 Hz to 100 kHz with the 86633B.

Maximum Deviation (Peak):

200 kHz with the 86632B and 86635A. 100 kHz with the 86633B.

NOTE

To check the frequency modulation rate and deviation, refer to the performance test in Section IV of the applicable modulation section manual.

4-20. OUTPUT IMPEDANCE AND VSWR

SPECIFICATION: Impedance: 50

VSWR: <2.0 on +10 and 0 dBm ranges; <1.3 on -10 dBm range and below. DESCRIPTION:

The Synthesized Signal Generator System’s output signal is reflected back into the RF OUT PUT j ack by a coaxial short at the end of an adjustable stub (a variable length of air -line). This reflected s ignal is re-reflected by any mism atch at the jack. The re-ref lected signal combines with the output signal according to the relative phase and m agnitude of the two signals. The combined signal is monitored by a directional coupler and then measured by a voltmeter or spectrum analyzer. Maximum and minimum power levels are noted as the electrical length of the stub is var ied (i.e. the electrical distance from the RF OUT PUT jack to the coaxial short is varied). The maximum allowable change in voltage or dB is calculated from the following formulas.

Ω

VSWR =Vmax

Vmin Vmax = (VSWR) (Vmin) dB = 20 log (Vmax)

(Vmin)

dB = 20 log (VSWR)

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PERFORMANCE TESTS

4-20. OUTPUT IMPEDANCE AND VSWR (Cont’d)

Figure 4-7. Output Impedance Test Setup

EQUIPMENT:

Directional Coupler ................................................. HP 778D Opt 12

Adapter (Male Type N to GR 874).......................... HP 1250-0847

Adjustable Stub....................................................... General Radio 874-D50L

Spectrum Analyzer ................................................. HP 8555/8552B/140T

5052 Termination.................................................... HP 11593A

PROCEDURE:

1. Set the Synthesized Signal Generator system center frequency to 500 MHz, the OUTPUT RANGE switch to +10 dBm, and the VERNIER control for a panel meter reading of 0 dB.

2. Set up the equipment as shown in Figure 4-7.

3. Set the spectrum analyzer controls for a convenient display of the signal. Set the vertical sensitivity to 2 dB per division.

4. Adjust the stub for a minimum indication on the spectrum analyzer display. Adjust the reference level range and vernier controls for a convenient reference level.

5. Adjust the stub for a maximum indication on the display. The signal level increase should be <6 dB (VSWR <2.0).

____________________6dB

6 Set the system’s OUTPUT RANGE switch to 0 dBm. Adjust the VERNIER control for a panel meter reading of +3

dB.

7 Repeat steps 3 and 4. The signal level increase should be <6 dB (VSWR <2.0).

____________________6dB

8. Set the system’s OUTPUT RANGE switch to -10 dBm.

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PERFORMANCE TESTS

4-20. OUTPUT IMPEDANCE AND VSWR (Cont’d)

9. Repeat steps 3 and 4. The signal level increase should be <2.3 dB (VSWR <1.3).

10. If desired, repeat at other frequencies between 100 MHz and 1 GHz.

___________________2.3 dB

NOTE

The steps given above effectively check VSWR at all settings of the output attenuator.

4-21. SIGNAL-TO-PHASE NOISE RATIO

SPECIFICATION: (For AM,s CW, and OM modes only) Greater than 45 dB in a 30 kHz band centered on the carrier and excluding a 1 Hz band centered on the carrier. DESCRIPTION:

AC voltage measurements proportional to carrier amplitude and residual carrier phase deviation are compared for the signal-to-phase noise ratio. The Synthesized Signal Generator System’s reference and RF output (carrier) signals are mixed and the difference frequency is monitored by an oscilloscope and ac voltmeter. T he mixer output (proportional to

the carrier amplitude) is noted. The two signals are then fr equency synchronized with phase difference of 180°. (This phase difference provides m ax imum resolution for voltage measurements at the mix er output which ar e propor tional to the change of phase of the RF output signal.) T his ac voltage is proportional to the phase noise and when compar ed to the carrier voltage yields the signal-to-phase noise ratio.

NOTE

A 3 dB correction factor takes into account the non-correlated noise c ontribution of the reference system. The noise levels of the reference system and the system under test are assumed to be equal.

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PERFORMANCE TESTS

4-21 SIGNAL-TO-PHASE NOISE RATIO (Cont’d)

Figure 4-8. Signal-to-Phase Nose Ratio Test Setup

EQUIPMENT:

Synthesized Signal Generator System................... HP 8660C/86602B/86631B

Oscilloscope............................................................ HP 180C/1801A/1821A

Coaxial Tee............................................................. HP 1250-0781 (BNC)

Double Balanced Mixer........................................... Watkins-Johnson M1J

AC Voltmeter........................................................... HP 403B

40 dB Amplifier........................................................ (See Figure 1-2)

15 kHz Low Pass Filter........................................... (See Figure 1-3)

502 Termination...................................................... HP 11593A

PROCEDURE:

1. Set the controls of the system under tes t as f ollows: center f requency 500.001000 MHz and the output level to -47 dBm (OUTPUT RANGE switch set to -50 dBm).

2. Set the contr ols of the refer ence system as follows: c enter frequency 500.000000 MHz and the output level to +7 dBm.

3. Connect the equipment as shown in Figure 4-8.

4. Record the relative ac voltmeter reading.

_______________dB

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PERFORMANCE TESTS

4-21. SIGNAL-TO-PHASE NOISE RATIO (Cont’d)

5. Set the system under test OUTPUT RANGE switch to -10 dBm (-7 dBm output level).

6. Adjus t the os c illos c ope dis play of the 1 kH z signal for an amplitude of eight divisions . Set the os c illos cope vertical input to ground and adjust the vertical position control so the trace lies over the center horizontal line of the graticule. Set the vertical input to dc coupled.

7. Set the system under test center frequency to 500.000001 MHz and note that oscilloscope baseline trace alternately rises and falls over eight-division display. (510.0001 MHz; Option 004).

8. Reset the center frequenc y to 500.000000 MHz at a time that causes the oscillos c ope baseline tr ac e to st op within + 1/10 division of the center horizontal line of the graticule.

9. Read the noise level on the ac voltmeter. Signal- to-phase noise ratio equals the sum of the attenuator change and the reference system noise contr ibution minus the change in voltmeter r eading (in dB) . Signal- to-phas e nois e ratio = 40 dB +3 dB - (+A dB). For example, the voltmeter reading is 8 dB below the ref erenc e ( -8 dB) . T her ef or e, the signal-to-phase noise ratio = 40 + 3 - (-8) = 51 dB down.

10. Record the ratio.

45 dB down__________

4-22. SIGNAL-TO-AM NOISE RATIO

SPECIFICATION: Greater than 65 dB in a 30 kHz bandwidth centered on the carrier excluding a 1 Hz band centered on the carrier.

DESCRIPTION: A comparison of ac voltage measurements proportional to c arrier amplitude and AM noise yields the signal-to-AM noise ratio. First, a carrier refer ence level is determ ined by measuring the detected ac voltage for 30% AM ( the detected signal is 10.5 dB below the carrier level). Then the AM noise level is measured and the signal-to-AM noise ratio is determined.

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PERFORMANCE TESTS

4-22. SIGNAL-TO-AM NOISE RATIO (Cont’d)

Figure 4-9. Signal-to-AM Noise Test Setup

EQUIPMENT:

10 dB Step Attenuator............................................. HP 355D Option H38

40 dB Amplifier........................................................ Special (See figure 1-2)

Crystal Detector...................................................... HP 423A

15 kHz Low Pass Filter........................................... Special (See figure 1-3)

Test Oscillator......................................................... HP 651B

502 Termination ..................................................... HP 11593A

Coaxial Tee............................................................. HP 1250-0781

AC Voltmeter........................................................... HP 403B

PROCEDURE:

1. Set the 10 dB step attenuator to 50 dB.

2. Set the system center frequency to 500 MHz and the RF output level to +3 dBm (O dBm OUTPUT RANGE).

3. Connect the equipment as shown in Figure 4-9.

4. Set the system’s modulation section controls for the AM mode and an external modulation source. The modulation level control and/or the test oscillator controls are set for a m odulation level of 30% (0.3 Vrms to an auxiliary section; 1.5 Vrms to a modulation section) at a 1 kHz rate.

NOTE

The ac voltmeter can be used to monitor the modulation or auxiliary section input voltage while it is being set.

5. Record the ac voltmeter reading of the 40 dB amplifier output in dB.

4-28

______________dB

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-22. SIGNAL-TO-AM NOISE RATIO (Cont’d)

6. Set the system’s modulation mode to off.

7. Set the 10 dB step attenuator to 0 dB.

8. Record the ac voltmeter reading.dB

9. T he signal-to-AM noise ratio is equal to the sum of the change in attenuation level and the level of the 30% AM level relative to the carrier minus the change in ac voltmeter reading in dB. Therefore, signal-to-AM nois e ratio = 50 dB + 10.5 dB - (+A dB). For example,spac e the ac voltmeter reading is 12 dB down (below) the ref erence level and the signal-to-AM noise ratio = 50 + 10.5 - (-12) or 72.5 dB down.

10. Record the ratio.

65 dB down__________

4-23. RESIDUAL FM

SPECIFICATION: In the FM XO.1 MODE, <10 Hz-rms average in a 300 Hz to 3 kHz post-detection band.

DESCRIPTION: An FM discriminator is used to m easure the residual FM of the signal generator system in the FM mode. A referenc e generator and mixer are used to down-convert the RF output to the frequency range of the discriminator. The discriminator output is amplif ied, filtered and m easured with a voltmeter. T he rms voltmeter reading is proportional to the rms residual FM deviation.

NOTE

Below 300 Hz, the 5 MF capacitor rolls off the 3 kHz low pass filter output.

Figure 4-10. Residual FM Test Setup

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PERFORMANCE TESTS

4-23. RESIDUAL FM (Cont’d)

EQUIPMENT:

Synthesized Signal Generator System................... HP 8660C/86602B/86631B

Coaxial Tee............................................................. HP 1250-0781 (BNC)

FM Discriminator..................................................... HP 5210A

50 Ohm Termination............................................... HP 11593A

40 dB Amplifier (34 dB into 502 )............................ HP 465A

AC Voltmeter........................................................... HP 403B

Capacitor, 5 µF ....................................................... HP 0180-2211

Mixer ...................................................................... Watkins-Johnson M1J

3 kHz Low Pass Filter............................................. CIR-Q-TEL FLT/21B-3K-5/50-3A/3B

Spectrum Analyzer.................................................. HP 8555A/8552B/140T

PROCEDURE:

1. Set the system under test center frequency to 1200.0 MHz, the output level to +10 dBm, the m odulation mode to FM XO.1 modulation source to inter nal 1 kH z, and set the modulation level c ontrol f or a m eter reading of 2.4 k Hzpeak.

2. Set the spectrum analyzer controls for a center frequency of 1200 MHz, frequency span per division 2 kHz, resolution bandwidth 0.3 kHz, input attenuation 40 dB, vertical sensitivity per division 10 dB, and sweep time per division to 50 ms. Adjust the controls as necessary for a convenient display of the FM signal.

3. Connect the System Under Test OUTPUT jack to the spectrum analyzer’s RF input jack as shown in Figure 4-10.

4. Adjust the signal generator’s modulation level control to null the carrier (2.4048 kHz-pk).

5. Set the Reference System center frequency to 1200.1 MHz, the RF output level to +10 dBm, and modulation off.

6. Disconnect the spectrum analyzer from the System Under Test and connect the other equipment as shown in Figure 4-10.

7. Set the FM disc riminator controls to the 100 kH z range and the sensitivity to 0.01 Vrms (full scale). Install a 10 kHz Butterworth Low Pass Filter in the discriminator output. (Refer to the FM discriminator’s operating and service manual).

8. Adjust the FM discriminator’s sensitivity control for an ac voltmeter reading of 0.850 Vrms. (This ensures the sensitivity of the measurem ent is 2.00/vO/Hz-rms per millivolt-rm s. The V2 factor accounts f or the residual FM contributed by the reference system.)

9. Set the System Under T es t m odulation sourc e switch for external ac (leveled); set the m odulation level contr ol f ull clockwise.

10. Press the CF CAL switch (Models 86632A and 86635A only) several times.

11. Verify and record that the residual FM is less than 10 Hz-rms (less than 7.10 mVrms).

__________< 7.10 mVrms

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PERFORMANCE TESTS

4-24. AMPLITUDE MODULATION DISTORTION

SPECIFICATION: AM distortion at 30% AM is < 1%, at 70% AM is < 3%, and at 90% AM is < 5%.

NOTES

The AM distortion specification applies only at 400 and 1000 Hz rates, with

a front panel meter indication of 0 to +3 dB, and at OUTPUT RANGE switch settings of < 0 dBm. At a meter indication of -6 dB, the distortion approximately doubles. The modulating signal distortion must be < 0.3% for the system performance to meet the specifications

If the signal generator system does not meet the AM distortion

specification, refer to the Systems Troubleshooting information in Section VIII (Service Sheet 1) in this manual.

DESCRIPTION: To measure AM distortion, a distortion analyzer is connected to the video output of a spectrum analyzer. In the zero frequency-span mode, the video output of the spectrum analyzer is the detected RF signal. The signal generator system controls are set for a specific AM level and the distortion level is measured.

EQUIPMENT:

Figure 4-11. Amplitude Modulation Distortion Test Setup.

Distortion Analyzer.................................... .HP 333A

Spectrum Analyzer.................................... HP 8555A/8552B/140T

Function Generator................................... HP 203A

AC Voltmeter............................................. HP 403B

4-31

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PERFORMANCE TESTS

4-24. AMPLITUDE MODULATION DISTORTION (Cont’d)

PROCEDURE:

1. Set the signal generator system controls for a center frequency of 1000 MHz, the output level to -20 dBm (OUTPUT RANGE -20 dBm), and the modulation mode to off.

2. Set the spectrum analyzer center frequency to 1000 MHz, frequency span per division 1 MHz, resolution bandwidth 300 kHz, input attenuation 20 dB, vertical sensitivity per division 10 dB and video filter to 10 kHz.

3. Connect the equipment as shown in Figure 4-11.

4. Set the spec trum analyzer’s tuning stabilizer to on. Adjust the center frequency fine tune to c enter the signal on the display. Set the reference switch and vernier to center the trace vertically.

5. Set the f requency span per division to zero, and the vertical scale to linear. Peak the trace by adjusting the fine tune center frequency control. Center the trace vertically with the vertical sensitivity and vernier controls.

6. Set the signal generator system’s modulation mode to AM, the source to external, and set the m odulation level to 30%. If a modulation section plug- in is ins talled in the Signal Gener ator m ainframe, set the test osc illator c ontrols to 1.5 Vrms at 1000 Hz. If an auxiliary section plug-in is installed, set the test osc illator controls to 0.3 Vrms at 1000 Hz.

7. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 1%.

8. Set the System modulation level to 70% AM. If the Auxiliary Section plug-in is being us ed, s et the tes t oscillator to an output of 0.7 Vrms.

9. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 3%.

10. Set the system modulation level to 90% AM.3%

10. Set the system modulation level to 90% AM. If the Aux iliary Section plug-in is being used, set the tes t oscillator to an output of 0.9 Vrms.

11. Measure the total harmonic distortion. With the trace peaked on the display, the distortion should be less than 5%.

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PERFORMANCE TESTS

4-25. INCIDENTAL PHASE MODULATION

SPECIFICATION: At 30% AM < 0.2 radians

DESCRIPTION: The phase difference between the signal gener ators is monitored with a vector voltmeter. Amplitude modulation is applied to the system under test. The peak- to-peak phase variation incidental to the am plitude modulation is r ead on the vector voltmeter.

EQUIPMENT:

Figure 4-12. Incidental Phase Modulation Test Setup

Synthesized Signal Generator ................. HP 8660C/86602B/86631B

Function Generator .................................. HP 203A

Vector Voltmeter (with 10:1 voltage

divider probe)....................................... HP 8405A

AC Voltmeter............................................. HP 403B

Mixer......................................................... Watkins-Johnson M1J

4-33

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PERFORMANCE TESTS

4-25. INCIDENTAL PHASE MODULATION (Cont’d)

PROCEDURE:

1. Set the system under test rear panel reference selector to exter nal, center frequency 500 MHz, output level -10 dBm (OUTPUT RANGE -10 dBm) and AM mode to off.

2. Set the ref erence system center frequency to 510 MHz and the output level to +7 dBm ( OUTPUT RANGE +10 dBm).

3. Connect the equipment as shown in Figure 4-12.

4. Adjust the vector voltmeter’s frequency range control to 10 MHz, phase range switch to +180, and the phase meter offset switch for a near or on scale phase reading (Phase reading will drif t somewhat due to phase drift in the synthesized signal generator outputs).

5. Set the system under tes t modulation mode to AM, the s ource to external, and the modulation level to 30%. Set the input level to 0.3 Vrms at 1 kHz if an auxiliary section is inserted into the mainfram e of the system under tes t. If a modulation section is used, the input level should be 1.5 Vrms at 1 k Hz. Use the external dc source if an 86632B or 86633B Modulation Section is used.

6. Set the function generator controls for a modulation rate of 0.5 Hz. (The low rate is necessary for the vector voltmeter’s metering circuitry. The modulation level is still 30%.)

7. The phase reading will vary at a 0.5 Hz rate. If necessary, readjust the vector voltmeter’s phase meter offset switch for an on scale reading.

8. Note the peak -to-peak phase variation caused by the 0.5 Hz AM. Visually disregard the random phase variations caused by phase drift in the synthesized signal generator outputs. Divide the reading by 2 to obtain the peak phase deviation. The phase deviation should be less than 11.50 - peak (0.2 radians-peak)

11.5°-pk

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PERFORMANCE TESTS

4-26. FREQUENCY MODULATION DISTORTION

SPECIFICATION: Total harmonic distortion for modulation rates up to 20 kHz, < 1% up to 200 kHz peak deviation. Distortion from an external source must be < 0.3% to meet these specifications.

NOTES

In the FM mode, typical Residual FM in a 0.3 to 3 kHz audio bandwidth is

<15 Hz and may limit minimum Noise and Distortion measurements at deviations <2 kHz peak.

If the signal generator system does not meet the FM distortion

specification, refer to the System’s Troubleshooting information in Section VIII (Service Sheet 1) in this manual.

DESCRIPTION: A test oscillator input is used to frequency modulate the RF OUTPUT of the Synthesized Signal Generator System. The

output is connected to a FM discrim inator. To elim inate the carrier, the dem odulated signal is pas sed through a 100 kHz lowpass filter at the discriminator output. T he amplitude of the firs t harmonic is es tablished as the reference level on the wave analyzer. The levels of the second and third harmonics are m easured, added, and the total is compared to the reference level to indicate the level of FM distortion.

NOTE

This procedure is valid only if the HP 86635A is used.

4-35

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-26. FREQUENCY MODULATION DISTORTION (Cont’d)

Figure 4-13. Frequency Modulation Distortion Test Setup

EQUIPMENT:

FM Discriminator....................................... HP 5210A

Wave Analyzer.......................................... HP 3581A

Function Generator................................... HP 203A

NOTE

This performance test is normally performed with either an HP model 86632B or 86635A Modulation Section inserted into the signal generator mainframe. Control settings in parenthesis apply only to the Model 86633B.

1. Set the signal generator system center frequency to 8.5 MHz and set the OUTPUT RANGE switch to +10 dBm. Adjust the VERNIER control for a -3 dB meter reading.

2. Connect equipment as illustrated in Figure 4-13.

3. Set Modulation Section MODE to FM X10 (FM X1) and source switch to EXTERNAL AC. Adjust Modulation Section modulation level control for 200 kHz (100 kHz) peak deviation and press FM CF CAL switch.

NOTE

The 86633B does not have an FM CF CAL switch.

4. Set the function generator output for 10 kHz at 1.5 Vrms.

5. Install a 100 kHz low pass filter in the FM Discriminator. (Refer to the FM Discriminator Operating and Service Manual for details ).

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PERFORMANCE TESTS

4-26. FREQUENCY MODULATION DISTORTION (Cont’d)

6. Adjust the FM Discriminator for 1 volt rms input sensitivity. Set the controls for the 10 MHz range.

7. Set the wave analyzer scale switch to 90 dB, reference level to norm al, resolution bandwidth 30 Hz, sweep mode off, and AFC on.

8. Peak the meter reading near 10 kHz with the frequency control. Verify that the AFC locks and the amplitude is ~37 dBV (14.4 mVrms). Use the input sensitivity switch and vernier control and the amplitude reference level control to establish a reference level at 0 dB.

9. Set the frequency to ~ 20 kHz (second harmonic) and peak the meter reading. Record the meter reading.

10. Set the frequency to ~ 30 kHz (third harmonic) and peak the meter reading. Record the meter reading.

11. Use Table 4-1 to obtain power ratios for the levels recorded in steps 8 and 9. Then use Table 4-1 to f ind the dB level corresponding to the sum of the ratios. The res ultant level should be -> 40 dB down from the fundam ental frequency level. Record the level.

4-37

40 dB down

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-26. FREQUENCY MODULATION DISTORTION (Cont’d)

Table 4-1. dB To Power Ratio Conversion

4-27. INCIDENTAL AM

SPECIFICATION: AM sidebands > 60 dB down from carrier with FM peak deviation of 75 kHz at a 1 kHz rate. DESCRIPTION: A reference is established on the wave analyzer by detecting an AM signal of known modulation level and rate from the

Synthesized Signal Generator System. The output is frequency modulated at a specified rate and level. T he incidental AM level is detected during frequency modulation and compared to the carrier amplitude.

4-38

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-27. INCIDENTAL AM (Cont’d)

Figure 4-14. Incidental AM Test Setup

EQUIPMENT:

Wave Analyzer ......................................... HP 3581A

Crystal Detector........................................ HP 8471A

15 kHz Low Pass Filter............................. (See Figure 1-3)

Resistor 10K .............................................. HP 0757-0442

Capacitor 1500 p....................................... HP 0160-2222

PROCEDURE:

1. Set the signal generator system controls for a c enter frequenc y of 100 MHz, a +3 dBm output level, the amplitude modulation mode, an internal source at 1 kHz rate, and a modulation level of 50%.

2. Connect the equipment together as shown in Figure 4-14.

3. Set the wave analyzer controls for the 90 dB scale, AFC on, and r esolution bandwidth 30 Hz. Tune the wave analyzer for a peak meter indication near 1 k Hz. Set a reference level of 0 dB using the input s ensitivity switch and the amplitude reference switch. This reference level (AM sidebands ) is 12 dB down from carrier signal (50% AM).

4. Set the system modulation section controls for FM mode, and a modulation level of 75 kHz peak deviation.

5. The meter reading should be > 48 dB down (> 60 dB down from carrier).

60 dB down

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PERFORMANCE TESTS

4-28. SPURIOUS SIGNALS, NARROWBAND

SPECIFICATION: All narrowband spurious signals in the CW, AM, and OM modes are:

80 dB down from carrier at frequencies < 700 MHz 80 dB down from carrier within 45 MHz of the carrier at frequencies >- 700 MHz 50 dB down from carrier on the +10 dBm range.

ALL power line related spurious signals are 70 dB down from the carrier.

DESCRIPTION: The outputs of two Synthesized Signal Generator Systems which use the s ame time base reference are mixed and the difference frequency is amplified and coupled to the wave analyzer. A reference level is established, various selected frequencies are then set on the two generator systems, and the spurious signal levels are measured.

Figure 4-15. Narrowband Spurious Signal Test Setup.

EQUIPMENT:

Synthesized Signal Generator ................. HP 8660C/86602B/86631B

Double Balanced Mixer............................. Watkins Johnson M1J

Wave Analyzer ......................................... HP 3581A

40 dB Amplifier.......................................... See Figure 1-2

PROCEDURE:

1. Connect the equipment as illustrated in Figure 4-15.

2. Connect rear panel REFERENCE OUTPUT from reference system to rear panel REFERENCE INPUT of system under test. Set REFERENCE SELECTOR of system under test to EXT.

3. On reference system. set the mainframe center frequency to 500.001 MHz, the OUTPUT RANGE switch to +10 dBm, and adjust VERNIER control to a -3 dB meter reading.

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Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-28. SPURIOUS SIGNALS, NARROWBAND (Cont’d)

4. On s ystem under test, set m ainfram e center frequency to 500 MHz, the RF Section OUTPUT RANGE switch to 80 dBm, and adjust VERNIER control to 0 dB indication on meter scale.

5. Set the wave analyzer scale switch to 90 dB, amplitude reference to -60, dBV mode, resolution band-width 3 Hz, display smoothing to max, and AFC on.

6. Set wave analyzer frequency control to 1 kHz and adjust the input sensitivity for a 0 dB indication on meter scale.

7. On s ystem under test, set the O UTPUT RANGE switch to -10 dBm and adj ust VERNIER to 0 dB indication on meter scale.

8. On ref erence system and system under test, set mainfram e center frequency values to those listed in Table 4- 2 and verify that levels of corresponding spurious signals are in accordance with specification. The corrected reading of spurious level relative to car rier is 70 dB - (+ dif ference level) , therefore a reading of -13 dB relative to the reference level (step 6) gives the spurious signal level. 70 dB -(-13 dB) = 83 dB down.

NOTE

It may be necessary to slightly readjust the Wave Analyzer Frequency control to locate the spurious signal.

Table 4-2. Narrowband Spurious Signals Checks

System Under Test Reference System Level Measured

100.280000 MHz 100.561000 MHz 80 dB

200.280000 MHz 200.561000 MHz 80 dB

409.720000 MHz 409.441000 MHz 80 dB

509.720000 MHz 509.441000 MHz 80 dB

1109.720000 MHz 1109.441000 MHz 80 dB

1209.720000 MHz 1209.441000 MHz 80 dB

4-29. SPURIOUS SIGNALS, WIDEBAND

SPECIFICATION: All wideband non-harmonically related spurious signals in the CW, AM, and OM modes are:

80 dB down from carrier at frequencies < 700 MHz 80 dB down from carrier > 45 MHz from carrier at frequencies > 700 MHz 50 dB down from carrier on the +10 dBm range.

4-41

(dBdown)

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-29. SPURIOUS SIGNALS, WIDEBAND (Cont’d)

DESCRIPTION: The RF OUTPUT of the Synthesized Signal Generator System is monitored by a spectrum analyzer after being passed

through a 2200 MHz low pass filter. Selected signals which fall within the specified range are measured.

Figure 4-16. Wideband Spurious Signal Test Setup

EQUIPMENT:

Spectrum Analyzer ................................... HP 8555A/8552B/140T

Low Pass Filter (2200 MHz)...................... HP 360C

PROCEDURE:

1. Connect equipment as illustrated in Figure 4-16.

2. W ith the RF Section OUTPUT RANGE switch set to +10 dBm and VERNIER control adjusted for 0 dB m eter indication, set mainframe center frequency to those values listed in Table 4-3 and adj us t the Spectr um Analyzer to measure corresponding spurious signal level relative to the carrier.

Table 4-3. Wideband Spurious Signals Checks

Mainframe Frequency Spurious Frequency Level Measured

1299.9 MHz 150 MHz 50 dB down 1150 MHz 50 dB down 1450 MHz 50 dB down

1000 MHz 950 MHz 50 dB down

1050 MHz 50 dB down

999.9 MHz 950 MHz 50 dB down 1050 MHz 50 dB down

800.0 MHz 750 MHz 50 dB down

799.9 MHz 850 MHz 50 dB down

4-42

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-30. PHASE MODULATION PEAK DEVIATION

SPECIFICATION: 0 to 100 degrees peak. May be overdriven to 2 radians (1150) in Modulation Section external dc mode.

NOTE

To check Phase Modulation peak deviation, refer to Section IV of the appropriate Modulation Section Operating and Service Manual.

4-31A. PHASE MODULATION DISTORTION

SPECIFICATION: <5% up to 1 MHz rates, <7% up to 5 MHz rates, and <15% up to 10 MHz rates External modulation signal distortion must be <0.3% to meet this specification.

NOTES

1. Using this procedure, the proof of performance for phase modulation distortion is valid only when the HP 86635A Modulation Section is being used in the signal generator system. The change in distortion level from the 20 Hz rate as used in this procedure to the maximum I MHz rate is minimal. This procedure is, however, not a complete check for the Model 86634A which can use modulation rates up to 10 MHz.

If the signal generator system does not meet the OM distortion specification, refer to the System’s Trouble-shooting information in Section VIII (Service Sheet 1) in this manual.

DESCRIPTION: The phase modulated output of the System Under T est is demodulated using a vector voltmeter. T he vector voltmeter

output is set to a linear portion of its operating range and the total harmonic distortion of the demodulated signal is measured.

4-43

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-31A. PHASE MODULATION DISTORTION (Cont’d)

Figure 4-17A. Phase Modulation Distortion Test Setup

EQUIPMENT:

Vector Voltmeter..................................................... HP 8405A

Test Oscillator ......................................................... HP 651B

Distortion Analyzer ................................................. HP 333A

50Ω Termination .................................................... HP 11593A

Coaxial Tee............................................................. HP 1250-0781

PROCEDURE:

1. Set the Synthesized Signal Generator System controls for a center frequency of 10.000 000 MHz and an output level of +3 dBm (O dBm range).

2. Set the test oscillator output to 1.5 Vrms at 20 Hz. Set the signal generator system’s modulation mode to off.

3. Connect the instruments as shown in Figure 4-17A.

°.

4. Set the vector voltmeter’s phase range switch to +180

Set the meter offset switch for a phase meter reading

of 0 +100.

5. Set the modulation section controls for the OM mode and a modulation level of 1000 as indicated by the front panel meter.

*In Figure 4-16A, the test oscillator output is 50 ohms when the modulation section is a Model 86634A and 600 ohms when used with a Model 86635A.

4-44

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-31A. PHASE MODULATION DISTORTION (Cont’d)

6. Measure the total harmonic distortion of the 20 Hz demodulated signal using the distortion analyzer. Distortion should be <5%.

4-31B. PHASE MODULATION DISTORTION -ALTERNATE PROCEDURE

SPECIFICATION:

< 5% up to 1 MHz rates < 7% up to 5 MHz rates < 15% up to 10 MHz rates

NOTES

1. The HP Model 86635A Modulation Section has a maximum specified phase modulation rate of 1 MHz. Therefore, only the < 5% distortion specification is applicable. Because the maximum modulation rate of the Model 86634A is 10 MHz, all the specified distortion levels apply.

2. If the signal generator system does not meet the OM distortion specification,

refer to the System’s Troubleshooting information in Section

VIII (Service’

Sheet 1) in this manual.

DESCRIPTION: The phase modulated output of the System Under Test is demodulated us ing a phase m odulation test set. T he harmonic

levels are measured with a spectrum analyzer and the total harmonic distortion is c alculated. A low pass filter is used between test oscillator and modulation section to insure that the modulation drive signal has less than 0.3% distortion.

4-45

Section 4 TM 11-6625-2837-14&P-6

PERFORMANCE TESTS

Figure 4-17B. Phase Modulation Distortion Test Setup (Alternate Procedure)

EQUIPMENT:

Synthesized Signal Generator ................. HP 8660C/86602B/86631B

Test Oscillator........................................... HP 651B

Mixer......................................................... Watkins Johnson M1J

Phase Modulation Test Set....................... HP 8660C-K10

Spectrum Analyzer.................................... HP 8553B/8552B/140T

Low Pass Filters (1 MHz 600Ω; 1, 5, and

10 MHz

PROCEDURE:

1. Set the T est Oscillator to 1 MHz, connect a 1 MHz low pass filter (50 ohm for 86634A, 600 ohm for 86635A) to appropriate test oscillator output and adjust f or 1.7 Vrms output. Connect the rest of the equipm ent as shown in Figure 4-17B.

2. Set the system under test for 300 MHz center fr equency and +3 dBm output (O dBm r ange). Connect the RF

output jack directly to the RF input of the phase modulation test set.

3. Set the system under test controls for OM with a modulation level of 1000 peak deviation.

*In Figure 4-16B. the test oscillator output impedance and Low Pass Filter impedance is 50 ohms when the modulation section is a Model 86634A and 600 ohms with a Model 86635A.

50Ω).......................................... Specials (See Figure 1-4)

4-46

Section 4 TM 11-6625-2837-14&P-7

PERFORMANCE TESTS

4-31B. PHASE MODULATION DISTORTION - ALTERNATE PROCEDURE (Cont’d)

4. View the signal generator output on the spectrum analyzer display. Record the level of the second and third harmonics of the demodulated output signal with respect to the fundamental.

5. Use T able 4-1 to obtain power ratios of the har monics. T hen use Table 4-1 to find the dB level cor responding to sum of the two ratios. The resultant level should be < 5% or >- 26 dB down.

86634A 26 dB down 86635A 26 dB down

6. Set the center frequency of the system under test to 299.9 MHz.

7. Set the test os cillator to 1 MHz (10 MHz), connect the 1 MHz (10 MHz) low pass f ilter to the appropriate os cillator output (50 or 600Ω) and adjust for an output of 1.7 Vrms.

8. Repeat steps 3-5. Total harmonic distortion should be < 5% or > 26 dB down (< 15% or >- 16.5 dB down).

86634A 16.5 dB down

86635A 26 dB down

9. Set the center frequency of the system under test to 1200 MHz. Connect the m ixer and the ref erence system as shown in Figure 4-17B.

10. Set the reference system center frequency to 900 MHz with an RF output level of +7 dBm.

11. Increase the RF output level of the system under test (if necessary) until the Phase Modulation Test Set phase locks.

12. Set the test oscillator frequenc y to 1 MHz (5 MHz). Connect the 1 MHz (5 MHz) low pass f ilter (50 or 600Ω) to the oscillator output. Adjust the test oscillator output level to 1.7 Vrm s. Set the s ystem under test m odulation level to 1000 peak deviation.

13. Repeat steps 3-5. Total harmonic distortion should be < 5% or > 26 dB down (< 7% or >- 23.1 dB down).

86634A 23.1 dB down

86635A 26 dB down

4-47

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (1 of 6)

4-9.

4-11.

4-12.

4-48

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (2 of 6)

4-13A.

4-13B.

4-49

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (3 of 6)

4-14.

4-15.

4-16.

4-17.

4-50

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (4 of 6)

4-18.

4-20.

4-21.

4-22.

4-23.

4-51

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (5 of 6)

4-24.

4-25.

4-26.

4-27.

4-28.

4-29.

4-52

Section 4 TM 11-6625-2837-14&P-7

Table 4-4. Performance Test Record (6 of 6)

4-31A.

4-31B.

4-53

Section 5 TM 11-6625-2837-14&P-7

SECTION V

ADJUSTMENTS

5-1. INTRODUCTION

5-2. This section contains adjustment procedure: required to assure peak performance of the Mode 86602B RF Section. The RF Section should be adjusted after any repair or if the unit, in conjunction with the Frequency Extension Module, fails to meet the specifications listed in Section IV of this manual. Prior to making any adjustments, allow the RF Section warmup for 30minutes.

5-3. The order in which some adjustments are made to the RF Section is critical. Perform the adjustments under the conditions presented in this section. Do not attempt to make adjustment randomly to the instrument. Prior to making any adjustments to the RF Section, refer to the paragraph entitled Related Adjustments.

5-4. EQUIPMENT REQUIRED

5-5. Each adjustment procedure in this section contains a list of test equipment and accessories: required to perform the adjustment. The test equipment is also identified by callouts in the test setup diagrams included with each procedure.

5-6. If substitutions must be made for the specified test equipment, refer to Table 1-2 for the minimum specifications of the test equipment to be used in the adjustment procedures. Since the Synthesized Signal Generator System is ex tremely accurate, it is particularly important that the test equipment used in the adjustment procedure meets the critical specifications listed in the table

5-7. The HP 11672A Service Kit is an accessories item available from Hewlett-Packard for use it maintaining the RF Section. A detailed listing of the items contained in the service kit is provided in the 11672A Operating Note and in Section I of the mainframe manuals. Any item in the kit may be ordered separately.

5-8. SAFETY CONSIDERATIONS

5-9. Although this instrument has been designed in accordance with international safety standards, this manual and the system mainframe manual contain

information, cautions, and warnings which must be followed to ensure safe operation and to retain the complete system in safe condition. Ser vice adjustments should be performed only by qualified service personnel.

NOTE

Refer to the mainframe manual for safety information relating to ac line (Mains) voltage, fuses, protective earth grounding, etc.

5-10. Any adjustment, maintenance, and repair of the opened instrument under voltage should be avoided as much as possible and, when inevitable, should be carried out only by a skilled person who is aware of the hazard involved.

5-11. Capacitors inside the instrument may still be charged even if the instrument has been disconnected from its source of supply.

WARNING

Adjustments described herein are performed with power supplied to the instrument while protective covers are removed. Energy available at many points may constitute a shock hazard.

5-12. FACTORY SELECTED COMPONENTS

5-13. Factory selected components are identified on the schematics and parts list by an asteris k which follows the reference designator. The normal value of the components are shown. The manual change sheets will provide updated information pertaining to the selected components. Table 5-1 lists the reference designator, the criterion used for selecting a particular value, the normal value range, and the service sheet where the component part is shown.

5-14. RELATED ADJUSTMENTS

5-15. The RF Output Level and 1 dB Step Attenuator Adjustments interact. The Amplitude Modulation Input Circuit Adjustment is dependent on

5-1

Section 5 TM 11-6625-2837-14&P-7

and should be performed after the previous mentioned adjustments. The Phase Modulation Level and Distortion Adjustment is affected by and should he performed after the Phase Modulator Driver Frequency Response Adjustment. All other adjustments are independent.

5-16. If the RF Output Level Adjustment is perform ed, the 1 dB Step Attenuator Adjustment should follow immediately. Repeat these procedures until the RF levels are within the stated limits without further adjustment. Then perform the Amplitude Modulation Input Circuit Adjustment If the Phase Modulator Driver Frequency Response Adjustment is performed, the Phase Modulator Level and Distortion Adjustm ent s hould be performed.

5-17. If the RF Output Level and 1 dB Steel Attenuator Adjustments are not performed, the Amplitude Modulation Input Circuit Adjustment m ay be considered independent. If the Phase Modulator Driver Frequency Response Adjustment is not performed, the Phase Modulation Level and Distortion Adjustment may be considered independent.

5-18. ADJUSTMENT LOCATIONS

5-19. The last foldout in this manual contains table which cross-refer ences pictorial and sc hematic locations of the adjustable controls. The figure ac companying the table shows the locations of adjustable controls, assemblies, and chassis-mounted parts.

5-20. ADJUSTMENTS

5-21. Before performing the adjustment procedures (1) disconnect the mainframe (Mains) Power

Cable, (2) remove the RF Section fr om the main-fram e, and (3) remove the RF Section covers . At this point, the RF Section is either reinserted into the mainframe or connected to the mainfram e with interconnection cables supplied in the Service Kit. If the RF Section is reinserted into the mainframe for adjustments, the mainframe top and/or right side covers must be removed. Refer to the left-hand foldout page immediately preceding the last foldout in this manual f or procedures explaining how to remove the RF Section from the main-f ram e, the RF Section cover rem oval, and how to interconnect the RF Section and mainframe for adjustments.

NOTE

It may be necessary to remove the upper guide rail to gain access to some of the adjustable components.

5-22. POST ADJUSTMENT TESTS

5-23. After adjustments are performed verify that the system performance is within the parameters specified for the RF Section and Frequency Extension Module. Perform the applicable performance test(s) found in Section IV.

WARNING

The multi-pin plug connector (on mainframe), which provides interconnection to the RF Section, will expose power supply voltages which may remain on the pins after the RF Section is removed and after the (Mains) power cable is disconnected from the mainframe. Be careful to avoid contact with the pins during interconnection with RF Section.

Table 5-1. Factory Selected components

Reference Selected For Normal Value Service

Designator Range Sheet

A4R17 Accurately sets the 10 dB difference in

the power output between OUTPUT RANGE switch settings of +10 and 0 dBm (the VERNIER control is not moved).

A16R5 Sets the adjustment range of the Gain

Tracking Control A16R4. Refer to the Phase Modulator Driver Adjustments procedure.

5-2

Ω

237

10 to 316Ω

Section 5 TM 11-6625-2837-14&P-7

ADJUSTMENTS

5-24. RF OUTPUT LEVEL ADJUSTMENT

REFERENCE: Service Sheet 6. DESCRIPTION: The Meter and Detector Bias controls are adj usted alternately at specific RF Output levels until the VERNIER’S control of

the RF Output is linear across the control range.

Figure 5-1. RF Output Level Adjustment Test Setup

EQUIPMENT:

Power Meter/Sensor............................................... .HP 435A/8481A

PROCEDURE:

NOTE

Prior to performing the procedure, clean the meter face with antistatic glass cleaner

1. Extract the RF Section from the mainframe. Remove the mainframe top cover and the RF Section covers. Insert the RF Section into the mainframe.

2. Zero the external Power Meter.

3. Interconnect the equipment as illustrated in Figure 5-1.

4. Set the system’s center frequency to 1000 MHz and the RF Section’s OUTPUT RANGE switch to the 0 dBm position.

5. Adjust the VERNIER control for a +3.0 dBm indication on the external Power Meter.

6. Adjust MTR potentiometer A4R26 for a +3.0 dB indication on the front panel meter.

7. Adjust the VERNIER control for a front panel meter indication of --6.0 dB.

8. Adjust the BIAS potentiometer A4R13 for a -6.0 dBm indication on external Power Meter.

9. Repeat steps 5 through 8 until the RF Section's front panel meter indicates power levels that are with-in ±0.3 dB of

the external Power Meter indications with no further adjustment.

*STATNUL by Weston Instrument Inc., Newark, New Jersey

5-3

Section 5 TM 11-6625-2837-14&P-7

ADJUSTMENTS

5-25. 1 dB STEP ATTENUATOR ADJUSTMENT

REFERENCE: Service Sheet 7. DESCRIPTION: RF Level and RF Linearity controls are adjusted alternately at specific RF Output levels until the programm ed 1 dB step

control of RF Output is linear across the range (10 dB).

Figure 5-2. 1 dB Step Attenuator Adjustment Test Setup

EQUIPMENT:

Marked Card Programmer ..................................... HP 3260A Opt 001

Power Meter/Sensor .............................................. HP 435A/8481A

PROCEDURE:

1. Connect the equipment as illustrated in Figure 5-2.

2. Zero the external Power Meter.

3. Use a Marked Card Programmer to program the mainframe for a center frequency of 1000 MHz and the RF Section for an output power level of +3 dBm.

4. Adjust the RF Section’s RF Level Control A10OR7 for a +3.0 dBm indication on the power meter.

5. Use the Marked Card Programmer to program the RF Section for an output power level of -6 dBm.

6. Adjust the Linearity control A3R4 for a -6.0 dBm indication on the power meter.

7. Repeat steps 3 through 6 until the programmed output power levels are within ± 0.3 dB of the required power

meter indication.

8. Rechec k the power meter readings for the RF Output Level Adjustm ents. If necess ary, perform the adj ustments again. Then check the power meter readings f or this procedure. Alternately perform one procedure and chec k the power meter readings on the other until the RF levels are within tolerance without further adjustment.

5-4

Section 5 TM 31-6625-2837-14&P-7

ADJUSTMENTS

5-25. 1 dB STEP ATTENUATOR ADJUSTMENT (Cont’d)

9. Perform the Amplitude Modulation Input Circuit Adjustments.

5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT

REFERENCE: Service Sheet 7. DESCRIPTION: A specific modulation drive level is coupled to the RF Section. The RF output signal is demodulated by a peak detector in

a spectrum analyzer (when the frequency-span width is set to zero). The ac and dc components are measured with a voltmeter at the detector (vertical) output. First, the dc component is set to 283 mVdc plus the detector offset correction. Then, the ac component is measured. The AM level (%) is 1/2 (one half) the rms output.

Because of the required measurement accuracy, the accuracy of the spectrum analyzer’s detector offset must be known to

2m Vdc. The offset voltage is calculated by measuring the change in the detector output for a change in the RF input and

assuming a linear detector over the range of the levels used.

EQUIPMENT:

Figure 5-3. Amplitude Modulation Input Circuit Adjustment Test Setup

Test Oscillator ........................................................ HP 651B

AC Voltmeter........................................................... HP 403B

10 dB Step Attenuator ............................................ HP H38-355D

Spectrum Analyzer ................................................. HP 8555A/8552B/140T

Digital Voltmeter...................................................... HP 34740A/34702A

Coaxial Tee (2 required)......................................... HP 1250-0781

Crystal Detector...................................................... HP 423A

Oscilloscope ........................................................... HP 180C/1801A/1821A

Resistor, 1K . .......................................................... HP 0757-0280

5-5

Section 5 TM 11-6625-2837-14&P-7

ADJUSTMENTS

5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT (Cont’d)

PROCEDURE:

1. Remove the RF Section from the mainframe. Remove the mainframe top cover and the RF Section covers. Insert the RF Section into the mainframe.

2. Connect the equipment as shown in Figure 5-3.

3. Set the synthesized signal generator controls as follows: center frequency 30 MHz, OUTPUT RANGE 0 dBm. VERNIER control for a panel meter reading of +3 dB, and AM off.

4. Let the spec trum analyzer warm up for 1 hour to m inimize drift of the spectrum analyzer detector output. Set the 10 dB step attenuator to 10 dB attenuation.

5. Set the spec trum analyzer center frequency to 30 MHz, frequency span per division 5 MHz, resolution bandwidth

300 kHz; input attenuation to 20 dB, and vertical sensitivity per division 10 dB. Adjust the center frequency control to center the display. Set the frequency span to zero and tune to peak the trace.

NOTE

Throughout this test, continually check that the signal is peaked for maxim um deflection. Tune the center frequency control for maximum signal deflection.

6. Set the vertical scale to linear and adjust the reference level vernier for a digital voltmeter reading of -200 mVdc.

7. Set the 10 dB step attenuator to 0 dB and record the digital voltmeter reading.

mVdc

8. Set the 10 dB Step Attenuator to 20 dB and record the digital voltmeter reading.

mVdc

9.Calculate the offset voltage using the following formula:

V off = mVdc + 200a

Where Voff is the offset voltage in millivolts mVdc is

the DVM reading in millivolts. α is 3.16 (step

7) and 0.316 (step 8).

For example:

mVdc = -687 in step 7

Therefore Voff = 687+200(3.16) =+25.5 mVdc

1 - (3.16)-+5 m

10. Find the value of Voff for step 8. The difference between the two should be <4 mVdc. Use the average value of

Vof

Voff= mVdc

5-6

Section 5 TM 11-6625-2837-14&P-7

ADJUSTMENTS

5-26. AMPLITUDE MODULATION INPUT CIRCUIT ADJUSTMENT (Cont’d)

11. Set the 10 dB step attenuator to 10 dB.

12. Set the system center frequency to 1000 MHz, the modulation mode to AM, the modulation source to external, and a modulation level of 50% (0.5 Vrms input to an Auxiliary Section) at a 1 kHz rate.

13. Set the spectrum analyzer center frequency control to 1000 MHz, and s et the reference level vernier for digital voltmeter reading of  283 mVdc + Vof

See Step 10.

14. Set the DVM controls to measure the peak detector’s ac com ponent. The modulation level (%) is 1/2 (one- half) the DVM reading (Vrms). Adjust the AM CAL Control A10R5 for a reading of 100 mVrms.

15. Set the RF Section’s VERNIER control for a front panel meter reading of  -6 dB.

16. Set the DVM to monitor the dc vertical output. Reset the DVM reading of 283 mVdc + Voff.

17. Set the DVM to monitor the ac vertic al output. Adjust the AM Linearity control A10OR2 for a DVM reading of 100 mVrms.

18. Repeat steps 13 through 17 until the DVM reading is 100 ±2 mVrms at RF Sec tion meter readings of +3 and -6 dB without further adjustment.

5-27. PHASE MODULATOR DRIVER FREQUENCY RESPONSE ADJUSTMENTS

REFERENCE: Service Sheet 5. DESCRIPTION: The output of a sweep generator is connected to the A16 Phase Modulator Driver Assembly input while a spectrum

analyzer monitors the system’s phase modulated RF output. The frequency response control is adjusted for maximum flatness to ±40 MHz and for minimum peaking at 80 MHz.

Figure 5-4. Phase Modulator Driver Frequency Response Adjustment Test Setup

5-7

Section 5 TM 11-6625-2837-14&P-7

ADJUSTMENTS

5-27. PHASE MODULATOR DRIVER FREQUENCY RESPONSE ADJUSTMENTS (Cont’d)

EQUIPMENT:

Sweep Generator............................................................ HP 8601A

Spectrum Analyzer.......................................................... HP 8555A/8552B/140T

Digital Voltmeter ............................................................. HP 34740A/34702A

PROCEDURE:

1. Rem ove the RF Section from the m ainframe. Rem ove the mainfram e top cover and the RF Section covers and top guide rail.

2. Remove cable W12 fr om the OM Input A16J1 and wrap the connector with insulating tape. Connect 11672-60005 (from the Service Kit) to A16J1. Route the BNC end of cable into the cavity and out through the top of the mainframe. Carefully reinstall the RF Section so as not to damage the cables.

3. Set the sweep generator controls as f ollows: sweep range 110 MHz, frequency 100 MHz, output level -10 dBm, sweep video, sweep mode free-slow, and sweep vernier full clockwise.

4. Connect the equipment as shown in Figure 5-4.

5. Set the synthesized signal generator controls for a center frequency of 1.05 GHz and an output level of 0 dBm.

6. Set the spectrum analyzer controls for center frequency of 1.05 GHz, frequency span per division 20 MHz, resolution bandwidth 300 kHz, input attenuation 30 dB, vertical sensitivity per division linear, and sweep tim e per division 2 ms.

7. Center the RF Section’s Gain Tracking Adj control, A16R27.

8. Set the Second Harmonic Adj control for +7.0 Vdc on A16TP2.

9. Remove the DVM connection to A16TP2 before continuing.

10. Set the Third Harmonic and Gain Adj controls (A16R1 and A16R2) to their full counter clockwise position.

11. Adjust the sweep generator output level so the sidebands are approximately 34 dB below carrier level.

12. Adjust the Frequency Response Control A16C7 for m aximum flatness within 40 MHz of the carrier and for the minimum peaking at frequencies from 60 to 80 MHz.

13. Disconnect sweep generator from the A16 Assembly and set signal generator LINE switch to STBY.

14. Carefully remove the RF Section. Be careful not to damage the cables. Reconnect W12 to A16J1.

5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS

REFERENCE: Service Sheet 5. DESCRIPTION:

The phase modulated signal from the synthesized signal generator is monitored by a spectrum analyzer and is adjusted to the modulation level indicated by the modulation level meter. The phase modulated signal is then mixed down, the difference frequenc y is connected to an FM discrim inator, and the detected output is connected to the spectrum analyzer. The adjustments are set to minimize harmonic dis tortion. The modulation level and distortion adjustments are repeated until both are within the required accuracy.

5-8

Section 5 TM 11-6625-2837-14 & P-7

ADJUSTMENTS

5-28 A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d)

Figure 5-5A. Phase Modulation Level and Distortion Adjustment Test Setup

EQUIPMENT:

Spectrum Analyzer...............................HP 8553B/8552B/140T

Synthesized Signal Generator System ............HP 8660C/86603A/86631B

Test Oscillator .....................................HP 651B

FM Discriminator..................................HP 5210A

Mixer, Doubler Balanced......................HP 10514A

Low Pass Filters (100 kHz at 5012 or 6001 )....Special (See Figure 1-4)

PROCEDURE:

1. Extract the RF Section from mainframe. Remove the mainframe top cover, the RF Section covers, and the top guide rail. Insert the RF Section back into the mainframe.

2. Connect the equipment as shown in Figure 5-5A. Connect the output of the System Under Test directly to the spectrum analyzer RF input. Be sure to use the correct impedance test oscillator output and the correc t low pass filter.

3. Set the test oscillator output to 100 kHz at 1.5 Vrms.

4. Set the System Under Test center frequency to 100 MHz with a 0 dBm OUTPUT level.

*In Figure 5-5A. the test oscillator output and low pass filter impedances are 50s when the modulation section being used is a Model 86634A and 60012 when used with an 86635A.

5-9

TM 11-6625-2837-14 & P-7

Section 5

ADJUSTMENTS

5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d)

5. Set the spectrum analyzer controls for a center frequency of 100 MHz, resolution bandwidth of 10 kHz, frequency span per division of 0.5 MHz, sweep time per division of 10 m s, input attenuation of 30 dB, vertical scale per division to 2 dB and adjust the reference level to a readable level.

6. Set the Modulation Section c ontrols for OM mode, external AC s ource, and a modulation level of exactly 82° as

read on the front panel meter.

7. Adjust A16R2 so the carrier and first sidebands are of equal amplitude.

8. Step the System Under T est center frequency down 1 Hz to 99.999999 MHz. Adjust A16R27 so the carrier and first sidebands are equal.

9. Set the FM discriminator controls for the 10 MHz range and 0.1V sensitivity, and insert an internal 1 MHz lowpass filter.

10. Set the spectrum analyzer controls for a center frequency of 100 kHz, resolution bandwidth to 3 kHz, frequency span per division to 100 kHz, input attenuation to 0 dB, log reference level to a convenient level, vertical sensitivity per division to 10 dB, and scan time per division to 20 ms.

11. Set the Reference System controls for a center frequency of 109 MHz and an output level of +7 dBm.

12. Set the System Under Test center frequency to 100 MHz; set the modulation level to 100° as read on the front panel meter.

13. Refer to Figure 5-5 and connect the System Under T est OUT PUT to the "RF" input of the m ixer . Connect the FM Discriminator output to the spectrum analyzer RF input.

14. Adjust the spectrum analyzer's reference level control so the peak of the f undamental 100 kHz signal is viewed on the CRT display at the log reference graticule line.

15. Adjust A16R36 to null the second harmonic level; adjust A16R1 to null the third harmonic level.

NOTE

Observing harmonic distor tion of a O M signal af ter pas sing it thr ough an FM dis c riminator results in an increase in level of 6 dB per octave. There- fore, the measured second harmonic level will be 6 dB higher and the third harm onic level 9.5 dB higher than with a phase demodulator.

16. Step the System Under Test center frequency down 1 Hz. Note the direction and amount of readjustment of A16R36 and R1 necessary to null the second and third harmonics.

17. Set A16R36 and R1 for the best compromise (minimum second and third harmonic levels) at both center frequency settings of 99.999999 and 100.000000 MHz.

18. Set the System Under Test center frequency to 100 MHz; set the modulation level to 82 degrees as indicated on the Modulation Section meter.

19. Reconnect the RF Section output directly to the spectrum analyzer input.

5-10

TM 11-6625-2837-14 & P-7

Section 5

ADJUSTMENTS

5-28A. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS (Cont’d)

20. Adjust A16R2 for equal carrier and first sideband levels.

21. Step center frequency down 1 Hz to 99.999999 MHz and adjust A16R27 for equal amplitude carrier and first sidebands.

22. Repeat steps 4 through 22 until all the conditions below are met without further adjustment. a. Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System Under Test

between 100 and 99.999999 MHz (Steps 7-8).

b. Second harmonic levels are equal within 4 dB or >40 dB down from the fundamental as indicated by the

spectrum analyzer at center frequencies of 100 an,, 99.999999 MHz (Step 17).

c. Third harmonic levels are equal within 4 dB or >35 dB down from the fundamental as indicated by spectrum

analyzer at center frequencies of 300 and 299.999999 MHz (Step 17).

23. Replace the RF Section top guide rail and covers, and the mainframe cover.

5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE PROCEDURE REFERENCE:

Service Sheet 5. DESCRIPTION:

The phase modulated signal from the synthesized signal generator is monitored by a spectrum analyzer and is adjusted to the modulation level indicated by the modulation level meter. The phase modulated signal is then mixed down, the difference frequency is connected to a phase demodulator, and the detected output is connected to the spectrum analyzer. The adjustments are set to minimize harmonic dis tortion. The modulation level and distortion adjustments are repeated until both are within the required accuracy.

5-11

ADJUSTMENTS

5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE

PROCEDURE (Cont’d)

Figure 5-5B. Phase Modulation Level and Distortion Adjustment Test Setup (Alternate Procedure)

EQUIPMENT:

Spectrum Analyzer ...........................HP 8553B/8552B/140T

Test Oscillator...................................HP 651B

Low Pass Filters (1 MHz at 500 or 6002) .....Special (See Figure 1-4)

Phase Modulation Test Set...............HP 8660C-K10

TM 11-6625-2837-14 & P-7

PROCEDURE:

1. Extract the RF Section from mainf ram e. Remove the m ainfr ame top cover , the RF Sec tion covers , and the top guide

rail. Insert the RF Section back into the mainframe.

2. Connect the equipment as shown in Figure 5-5A. Connect the output of the System Under Test directly to the

spectrum analyzer RF input. Be sure to use the correct impedance test os cillator output and the correct low pass filter.

3. Set the test oscillator output to 100 kHz at 1.5 Vrms.

4. Set the System Under Test center frequency to 100 MHz with a 0 dBm OUTPUT level.

5. Set the spectrum analzer controls for a center f requency of 100 MHz, resolution bandwidth of 10 kHz, frequenc y span

per division of 0.5 MHz, sweep time per division of 10 ms, input attenuation of 30 dB, vertical scale per division of 2 dB, and adjust the reference level to a readable level.

6. Set the Modulation Section controls for OM mode, external AC source, and a m odulation level of exactly 82° as read on the front panel meter.

*In Figure 5-5B, the test oscillator output and low pass filter impedances are 50 ohms when the modulation section being used is a Model 86634A and 600 ohm when used with an 86635A.

5-12

TM 11-6625-2837-14 & P-7

Section 5

ADJUSTMENTS

5-28B. PHASE MODULATION LEVEL AND DISTORTION ADJUSTMENTS - ALTERNATE PROCEDURE (Cont’d)

7. Adjust A16R2 so the carrier and first sidebands are of equal amplitude.

8. Step the System Under Test center fr equency down 1 Hz to 99.999999 MHz. Adjust A16R27 so the carrier and first sidebands are equal.

9. Set the spectrum analyzer controls for a center f requency of 2 MHz, resolution bandwidth to 30 kHz, frequency s pan

per division to 0.5 MHz, input attenuation to 30 dB, log reference level to a c onvenient level, vertical sensitivity per division to 10 dB, and scan time per division to 10 ms.

10. Set the System Under Test center fr equency to 300 MHz with a modulation level of 100° as read on the front panel

meter.

11. Connect the phase modulation test set between the signal generator output and the spectrum analyzer input as

shown in Figure 5-5B.

12. Adjust the spectrum analyzer's reference level so the peak of the fundam ental 1 MHz signal is viewed on the CRT

display at the log reference graticule line.

13. Adjust A16R36 to null the second harmonic level; adjust A16R1 to null the third harmonic level.

14. Step the System Under Test center fr equenc y down 1 Hz. Note the direction and am ount of readj us tment of A16R36

and R1 necessary to null the second and third harmonics.

15. Set A16R36 and R1 for the best comprom ise (m inimum second and third harm onic levels) at both c enter fr equency

settings of 299.999999 and 300 MHz*

16. Set the System Under Test center frequency to 100 MHz; set the modulation level to 82° as indicated on the

Modulation Section meter.

17. Reconnect the RF Section output directly to the spectrum analyzer input.

18. Adjust A16R2 for equal carrier and first sideband levels.

19. Step the center frequency down 1 Hz to 99.999999 MHz and adjust A16R27 for equal amplitude carrier and first

sidebands.

20. Repeat steps 4 through 20 until all the conditions below are met without further adjustment.

a. Carrier and first sidebands are equal within 0.5 dB when changing Center Frequency of System under

Test between 100 and 99.999999 MHz (Steps 7-8).

b. Second harmonic levels are equal within 4 dB or > 46 down from the fundamental. at center

frequencies of 300 and 299.999999 MHz (Step 15).

c. Third harmonic levels are equal within 4 dB or >46 dB down from the fundamental at center frequencies

of 300 and 299.999999 MHz (Step 15).

21. Replace the RF Section top guide rail and covers, and the mainframe cover.

5-13

Section 6

TM 11-6625-2837-14 & P-7

SECTION VI

REPLACEABLE PARTS

6-1. INTRODUCTION

6-2. This section c ontains inf orm ation for order ing par ts. Table 6-1 lists abbreviations used in the par list and throughout the manual. Table 6-2 lists a replaceable parts in reference designation order Table 6-3 contains the names and addresses that correspond with the manufacturers’ code numbers

6-3. EXCHANGE ASSEMBLIES

6-4. The A13 Attenuator Assembly may be re placed on an exchange basis, thus affording a con siderable cost saving. Exchange, factory-repaired and tested assemblies are available only on a trade basis; therefore, the defective assemblies must be returned for credit. For this reason, assemblies required for spare parts stock must be ordered by the new assembly part number. The A13 assembly exchange part number is 86601-60109.

6-5. ABBREVIATIONS

6-6. Table 6-1 lists abbreviations used in the part list, schematics and throughout the m anual. I some cases , two forms of the abbreviation ar e used one all in capital letters, and one partial or n capitals. This occurs because the abbreviations i the parts list are always all capitals. However, in the schematics and other parts of the manual other abbreviation forms are used with both lower case and upper case letters.

b. The total quantity (Qty) used in the instrument. c. The description of the part. d. A typical manufacturer of the part in a five-digit

code.

e The manufacturer’s number for the part.

The total quantity for each part is given only at the fir st appearance of the part number in the list.

6-7. REPLACEABLE PARTS LIST

6-8. Table 6-2 is the list of replaceable parts and in organized as follows:

a. Electrical assemblies and their components in

alpha-numerical order by reference designation.

b. Chassis-mounted parts in alpha-numerical order

by reference designation.

c. Miscellaneous parts.

The information given for each part consists of the following:

a. The Hewlett-Packard part number.

(Next printed page is 6-3)

6-1

Section 6

TM 11-6625-2837-14 & P-7

Table 6-1. Reference Designations and Abbreviations (1 of 2)

6-3

Section 6

TM 11-6625-2837-14&P-7

Table 6-1. Reference Designations and Abbreviations (1 of 2)

6-4

HP 86602b schematic

Specifications and Main Features

Frequently Asked Questions

User Manual

WARNING