HP 86602b schematic

TECHNICAL MANUAL

OPERATOR’S, ORGANIZATIONAL,

DIRECT SUPPORT,AND GENERAL SUPPORT

MAINTENANCE MANUAL

INCLUDING REPAIR PARTS AND

SPECIAL TOOLS LIST

(INCLUDING DEPOT MAINTENANCE REPAIR

PARTS AND SPECIAL TOOLS)

FOR

RF SECTION HP-86602B

(NSN 6625-01-031-8853)

TM 11-6625-2837-14&P-7

HEADQUARTERS, DEPARTMENT OF THE ARMY

OCTOBER 1981

SAFETY

TM 11-6625-2837-14&P-7

WARNING

Although this instrument has been designed in accordance with international safety standards, this manual contains information, cautions, and warnings which must be followed to retain the instrument in safe condition. Be sure to read and follow the safety information in Sections 11, III, V, an VIII.

BEFORE CONNECTING THIS SYSTEM TO LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the m ainfram e manual should be followed.

HIGH VOLTAGE

Adjustments and troubleshooting are often performed with power supplied to the instrument while protective covers are removed. Energy available at many points may constitute a shock hazard

The multi-pin plug connector which provides inter connection from mainframe to RF Section, will be exposed with the RF Section removed from the righthand mainframe cavity. With the Line (Mains Voltage off and power cord disconnected, power supply voltages may still remain and may constitute a shock hazard.

COMPATIBILITY

Damage to the synthesized signal generator system m ay result if an option 002 RF Section is used with unmodified Model 8660A or 8660B main-frames with serial prefixes 1349A and below.

PERFORMANCE TESTING

To avoid the possibility of damage to the instrum ent or test equipment, read completely through each test before starting it. Then make any preliminary control settings necessary before continuing with the procedure.

PLUG-IN REMOVAL

Before removing the RF Section plug-in from the mainframe, remove the line (Mains) voltage by disconnecting the power cable from the power outlet.

SEMI-RIGID COAX

Slight but repeated bending of the semi-rigid coaxial cable will damage them very quickly. Bend the cables as little as possible. If necessary, loosen the assembly to release the cable.

WARNING

Voltages are present in this instrument, when energized, which can cause death on contact.

The multi-pin plug connector which provides interconnection from mainfram e to RF Section, will be exposed with the RF Sect ion removed from the righthand mainfram e cavity. With the line voltage of f and power cord disconnected, power supply voltage may still remain and may constitute a shock hazard.

TM 11-6625-2837-14&P-7

TM 11-6625-2825-14&p-7

TECHNICAL MANUAL ) HEADQUARTERS

) DEPARTMENT OF THE ARMY

No. 11-6625-2825-14&p-7 ) Washington, D.C., 18 October 1981

OPERATOR’S, ORGANIZATIONAL, DIRECT SUPPORT

AND GENERAL SUPPORT MAINTENANCE MANUAL

INCLUDING REPAIR PARTS AND SPECIAL TOOLS LISTS

FOR

RF SECTION PLUG-IN, HEWLETT-PACKARD MODEL 86602B

(NSN 6625-01-031-8853)

CURRENT AS OF 30 JANUARY 1981

REPORTING ERRORS AND RECOMMENDING IMPROVEMENTS

You can help improve this manual. If you find any mistakes or if you know of a way to improve the procedures, please let us know. Mail your letter or DA Form 2028 (R ecommended Changes to Publications and Blank Forms), direc t to: Commander, US Army Communications and Electronics Materiel Readiness Command, ATTN: DRSEL-ME-MQ, Fort Monmouth, New Jersey 07703. In either case, a reply will be furnished direct to you.

This manual is an authentication of the manufacturer’s commercial literature which, through usage, has been found to cover the data required to operate and maintain this equipment. The manual was not prepared in acc or dance with military specifications; therefore, the format has not been st ructured to consider categories of maintenance. Section IX contains improvements made after the printing of the manufacturer’s manual.

CONTENTS

SECTION 0 INTRODUCTION PAGE

0-1. Scope 0-1 0-2. Indexes of Publications 0-1 0-3. Maintenance Forms, Records and Reports 0-1 0-4. Reporting Equipment Improvement Recommendations (EIR) 0-1 0-5. Administrative Storage 0-2 0-6. Destruction of Army Electronics Materiel 0-2

CONTENTS

TM 11-6625-2837-14&P-7

Section Page

I GENERAL INFORMATION......................... 1-1

1-1. Introduction....................................... 1-1

1-7. Specifications .................................. 1-1

1-9. Instruments Covered by Manual....... 1-1

1-12. Manual Change Supplements.......... 1-1

1-15. Description........................................ 1-5

1-20. Options ............................................ 1-5

1-24. Compatibility..................................... 1-5

1-27.Equipment Required but not

Supplied........................................ 1-5

1-28.System Mainframe........................... 1-5

1-31.Frequency Extension Module........... 1-6

1-33.Auxiliary Section............................... 1-6

1-35.Modulation Section Plug-ins............. 1-6

1-37.Equipment Available......................... 1-6

1-40.Safety Considerations...................... 1-6

1-43.Recommended Test Equipment....... 1-6

II INSTALLATION........................................... 2-1

2-1. Introduction....................................... 2-1

2-3. Initial Inspection ............................... 2-1

2-5. Preparation For Use......................... 2-1

2-6. Power Requirements........................ 2-1

2-8. Interconnections............................... 2-1

2-10.Modifications..................................... 2-1

2-13.Operating Environment..................... 2-1

2-15.Installation Instructions..................... 2-1

2-17.Storage and Shipment...................... 2-2

2-18.Environment..................................... 2-2

2-20.Packaging......................................... 2-2

III OPERATION........................................... 3-1

3-1. Introduction ...................................... 3-1

3-3. Panel Features................................. 3-1

3-5. Operator’s Check.............................. 3-1

3-8. Operating Instructions ..................... 3-1

IV PERFORMANCE TESTS ....................... 4-1

4-1. Introduction....................................... 4-1

4-3. Equipment Required......................... 4-1

4-5. Test Record...................................... 4-1

4-7. Performance Tests........................... 4-1

4-9. Frequency Range............................. 4-2

4-10.Frequency Accuracy and Stability.... 4-3

4-11.Frequency Switching Time............... 4-3

4-12.Output Level Switching Time............. 4-5

4-13A. Output Accuracy.......................... 4-7

4-13B. Output Accuracy- Alternate

Procedure...................................... 4-12

4-14.Output Flatness................................ 4-15

4-15.Harmonic Signals............................. 4-16

Section Page

4-16.Pulse Modulation Risetime............... 4-17

4-17.Pulse Modulation On/Off Ratio......... 4-19

4-18.Amplitude Modulation Depth and

3 dB Bandwidth............................. 4-19

4-19.Frequency Modulation Rate and

Deviation....................................... 4-23

4-20.Output Impedance and VSWR......... 4-23

4-21.Signal-to-Phase Noise Ratio............ 4-25

4-22.Signal-to-AM Noise Ratio................. 4-27

4-23.Residual FM..................................... 4-29

4-24.Amplitude Modulation Distortion...... 4-31

4-25.Incidental Phase Modulation ........... 4-33

4-26.Frequency Modulation Distortion...... 4-35

4-27.Incidental AM................................... 4-38

4-28.Spurious Signals, Narrowband......... 4-40

4-29.Spurious Signals, Wideband............ 4-41

4-30.Phase Modulation Peak Deviation... 4-43

4-31A. Phase Modulation Distortion........... 4-43

4-31B. Phase Modulation Distortion -

Alternate Procedure...................... 4-45

V ADJUSTMENTS.......................................... 5-1

5-1. Introduction...................................... 5-1

5-4. Equipment Required........................ 5-1

5-8. Safety Considerations...................... 5-1

5-12.Factory Selected Components......... 5-1

5-14.Related Adjustments........................ 5-1

5-18.Adjustment Locations....................... 5-2

5-20.Adjustments..................................... 5-2

5-22.Post Adjustment Tests .................... 5-2

5-24.RF Output Level Adjustment............ 5-3

5-25.1 dB Step Attenuator Adjustment..... 5-4

5-26.Amplitude Modulation Input Circuit

Adjustment.................................... 5-5

5-27.Phase Modulator Driver Frequency

Response Adjustments................. 5-7

5-28A. Phase Modulation Level and

Distortion Adjustments.................. 5-8

5-28B. Phase Modulation Level and Distortion

Adjustments - Alternate Procedure5-11

VI REPLACEABLE PARTS.......................... 6-1

6-1. Introduction...................................... 6-1

6-3. Exchange Assemblies...................... 6-1

6-5. Abbreviations................................... 6-1

6-7. Replaceable Parts List..................... 6-1

CONTENTS (Cont’d)

TM 11-6625-2837-14&P-7

Section Page

VII MANUAL CHANGES ............................... 7-1

7-1. Introduction ...................................... 7-1

7-3. Manual Changes.............................. 7-1

7-6. Manual Change Instructions............. 7-2

VIII SERVICE................................................... 8-1

8-1. Introduction....................................... 8-1

8-8. Safety Considerations...................... 8-1

8-12.Principles of Operation..................... 8-1

8-16.Troubleshooting................................ 8-1

ILLUSTRATIONS

Figure Page 1-1. HP Model 86602B RF Section (Opt. 002

Shown)

1-2. 40 dB Test Amplifier................................ 1-0

1-3. 15 kHz Low Pass Filter .......................... 1-11

1-4. Low Pass Filters...................................... 1-11

2-1. RF Section Partially Inserted into

Mainframe........................................ 2-2

3-1. Front Panel Controls, Connectors, and

Indicators.......................................... 3-2

3-2. Rear Panel Connectors and Indicators... 3-3

3-3. Operator’s Check.................................... 3-4

4-1. Frequency Range Test Setup................. 4-2

4-2. Frequency Switching Time Test Setup... 4-4 4-3. Output Level Switching Time Test Setup 4-6

4-4A.Output Accuracy Test Setup.................. 4-8

4-4B.Output Accuracy Test Setup (Alternate

Procedure......................................... 4-13

4-5. Pulse Modulation Risetime Test Setup .. 4-18 4-6. Amplitude Modulation, Depth and 3 dB

Bandwidth Test Setup...................... 4-20

4-7. Output Impedance Test Setup................ 4-24

4-8. Signal-to-Phase Noise Ratio Test Setup. 4-26

4-9. Signal-to-AM Noise Ratio Test Setup..... 4-28

4-10.Residual FM Test Setup......................... 4-29

4-11.Amplitude Modulation Distortion Test

Setup................................................ 4-30

4-12.Incidental Phase Modulation Test Setup 4-32 4-13.Frequency Modulation Distortion Test

Setup................................................ 4-35

4-14.Incidental AM Test Setup ....................... 4-38

4-15.Narrowband Spurious Signal Test Setup. 4-39 4-16.Wideband Spurious Signal Test Setup... 4-41

Section Page

8-17.System Troubleshooting.................. 8-2

8-19.RF Section Troubleshooting............. 8-2

8-21.Troubleshooting Aids....................... 8-2

8-28.Recommended Test Equipment...... 8-2

8-30.Repair............................................... 8-2

8-31.General Disassembly Procedures.... 8-2

8-34.Non-Repairable Assemblies............. 8-2

8-36.Module Exchange Program.............. 8-3

8-38.Repair Procedures........................... 8-3

8-42.Post Repair Adjustments................. 8-3

IX ERRATA

Figure Page 4-17A. Phase Modulation Distortion Test Setup 4-44

4-17B.Phase Modulation Distortion Test Setup

(Alternate Procedure)....................... 4-46

5-1. RF Output Level Adjustment Test Setup 5-3 5-2. 1 dB Step Attenuator Adjustment Test

Setup................................................ 5-4

5-3. Amplitude Modulation Input Circuit

Adjustment Test Setup..................... 5-5

5-4. Phase Modulator Driver Frequency

Response Adjustment Test Setup... 5-7 5-5A.Phase Modulation Level and Distortion

Adjustment Test Setup..................... 5-9

5-5B.Phase Modulation Level and Distortion

Adjustment Test Setup (Alternate

Procedure)....................................... 5-12

7-1. Phase Modulator Driver Frequency Response

Adjustment Test Setup (Change B). 7-2 7-2. A16 Phase Modulator Driver Assembly

Component and Test Point Locations

(Change B)....................................... 7-6

7-3. Phase Modulation Section Schematic

Diagram (Option 002) (Change B)... 7-8 7-4. A17 Phase Modulator Assembly

Component Locations (Change C).. 7-9 7-5. P/O Phase Modulation Section Schematic

Diagram (Change C)........................ 7-11

7-6. P/O Attenuator Section Schematic

Diagram (Change D)........................ 7-11

7-7. P/O All Logic Assembly Schematic

Diagram (Change E)........................ 7-12

8-1. LO Signal Circuits Repair....................... 8-4

iii

ILLUSTRATIONS (Cont’d)

TM 11-6625-2837-14&P-7

Figure Page

8-2. Rear Panel Disassembly......................... 8-8

8-3. Schematic Diagram Notes...................... 8-9

8-4. System Test Point Locations.................. 8-17

8-5. Mainframe Interconnect Jack.................. 8-17

8-6. System Troubleshooting Block

Diagram............................................ 8-17

8-7. RF Section Simplified Block Diagram..... 8-19

8-8. Main Troubleshooting Block Diagram .... 8-19

8-9. Logic Troubleshooting Block Diagram ... 8-21 8-10.A7 Mixer Assembly’s Subassembly and

Component Location........................ 8-22

8-11.Mixer Section Schematic Diagram.......... 8-23

8-12.A16 Phase Modulator Driver Assembly

Component and Test Point Locations 8-25 8-13.A17 Phase Modulator Assembly

Component Locations ..................... 8-25

8-14.Phase Modulation Section Schematic

Diagram (Option 002)....................... 8-25

8-15.A4 Detector Amplifier Assembly

Component and Test Point Locations 8-27

Figure Page 8-16..Amplifier/Detector Section

Schematic Diagram.......................... 8-27

8-17.A3 ALC Amplifier Assembly Component

and Test Point Locations.................. 8-28

8-18.A10 Reference Assembly

Component Locations ..................... 8-29

8-19.A2 ALC Mother Board Assembly

Component Locations...................... 8-29

8-20.ALC Section

Schematic Diagram.......................... 8-29

8-21.A9 Attenuator Driver Assembly

Component Locations ..................... 8-31

8-22.Attenuator Section

Schematic Diagram.......................... 8-31

8-23.All Logic Assembly

Component Locations...................... 8-33

8-24.All Logic Assembly

Schematic Diagram.......................... 8-33

8-25.Assemblies, Chassis Parts, and Adjustable

Component Locations ..................... 8-35

TABLES

Table Page

1-1. Models 86602B/11661 Specifications..... 1-2

1-2. Recommended Test Equipment............. 1-7

3-1. Operating Instructions ............................ 3-6

4-1. dB to Power Ratio Conversion................ 4-37

4-2. Narrowband Spurious Signal Checks..... 4-40

4-3. Wideband Spurious Signal Checks........ 4-41

4-4. Performance Test Record ...................... 4-47

5-1. Factory Selected Components................ 5-2

APPENDIX A. References............................................................................................. A-1

APPENDIX B. Maintenance Allocation

Section I. Introduction............................................................................................. B-1

II. Maintenance Allocation.......................................................................... B-5

III. Tool and Test Equipment Requirements............................................ B-6

Users of this manual are advised to consult SECTION IX, ERRATA. SECTION IX contains errors and changes in text and illus trations. The user should correc t the errors and perform the changes indicated, as needed.

Table Page 6-1. Reference Designations & Abbreviations6-3

6-2. Replaceable Parts.................................. 6-5

6-3. Code Lists of Manufacturers................... 6-15

6-4. Parts to NSN Cross Refererence........... 6-16

7-1. Manual Changes by Serial Prefix........... 7-1

7-2. Summary of Changes by Component.... 7-1

7-3. Replaceable Parts (P/O Change B)........ 7-7

8-1. Front Panel Housing Repair................... 8-7

8-2. Adjustable Components Locations.. 8-34

APPENDICES

Page

NOTE

TM 11-6625-2837-14&P-7

SECTION 0

INTRODUCTION

0-1. Scope This manual describes RF Section Hewlett-Packard Model 86602B, hereinafter referred to as the RF Section, and

provides instructions for its operation and maintenance. This manual applies dir ectly to instruments with serial numbers prefixed 1638A. It is also applicable to instruments with

other serial number prefixes for which manual changes are given in SECTION VII. SECTION VI includes Table 6-4, a cross reference between the Hewlett-Packard part numbers and the equivalent NATO/NATIONAL Stock Numbers (NSN). Appendix A provides a reference of pertinent Department of the Army publications. Appendix B contains the Maintenance Allocation Chart (MAC) which defines the levels and scope of maintenance functions for the equipment in the Army system and a list of the tools and test equipment required.

0-2. Indexes of Publications

a. DA Pam 310-4

changes or additional publications pertaining to the equipment.

b. DA Pam 310-7

pertaining to the equipment.

0-3. Maintenance Forms, Records and Reports

a. Reports of Maintenance and Unsatisfac tory Equipment. Departm ent of the Arm y form s and procedures

used for equipment maintenance will be those prescribed by TM 38-750, the Army Maintenance Management System.

b. Report of Item and Packaging Discr epancies. Fill out and forward SF 364 ( Report of Discr epancy (ROD) as

prescribed in AR 735-11-2/DLAR 4140.55/NAVSUPINST 4440.127E/AFR 400.54/MCO 4430.E.

c. Discrepancy in Shipment Report (DISREP) (SF 361). Fill out and forward Disc repancy in Shipment Report

(DISREP) (SF 361) as prescribed in AR 55-38/NAVSUPINST 4610.33B/AFR 75-18/MCO P4610.19C and DLAR 4500.15. 0-4. Reporting Equipment Improvement Recommendations (EIR)

If your HP 86602B RF Section needs improvement, let us know. Send us an EIR. You, the user, are the only one who can tell us what you don’t like about your equipment. Let us know why you don’t like the design. Tell us why a procedure is hard to perform. Put it on an SF 368 (Quality Deficiency Report). Mail it to: Commander, US Army Communications - Electronics Comm and, AT TN : DRSEL-ME-MQ, Fort Monm outh, New Jers ey 07703. W e’ll send you a reply.

. Refer to the latest issue of the DA Pam 310-4 to determine whether there are new editions,

. Refer to DA Pam 310-7 to determine whether there are Modification Work Orders (MWOs)

0-1

0-5. Administrative Storage. Store in accordance with Paragraphs 2-17 through 2-22. 0-6. Destruction of Army Electronics Materiel

Destruction of Army electronics materiel to prevent enemy use shall be in accordance with TM 750-244-2.

TM 11-6625-2837-14&P-7

0-2

Section 1 TM 11-6625-2837-14&P-7

Figure 1-1. HP Model 86602B RF Section (Option 002 Shown)

1-0

Section 1 TM 11-6625-2837-14&P-7

SECTION I

GENERAL INFORMATION

1-1. INTRODUCTION

1-4. Figure 1-1 shows the Option 002 RF Section. 1-2. This manual contains all information required to install, operate, test, adjust and service the HewlettPackard Model 86602B RF Section plug-in, hereinafter referred to as the RF Section. For information concerning related equipment, such as the HewlettPackard Model 8660-series mainframes or the Model 11661 Frequency Extension Module, refer to the appropriate manual or manuals.

1-3. This manual is divided into eight sections which provide information as follows:

a. SECTION I, GENERAL INFORMATION, contains the instrument desc ription and specific ations as well as the accessory and recomm ended test equipment list.

b. SECTION II, INSTALLATION, contains information relative to receiving inspection, preparation for use, mounting, packing, and shipping.

c. SECTION III, OPERATION, contains operating instructions for the instrument.

d. SECTION IV, PERFORMANCE TESTS, contains information required to verify that instrument performance is in accordance with published specifications.

e. SECTION V, ADJUSTMENTS, contains information required to properly adjust and align the instrument after repair.

f. SECTION VI, REPLACEABLE PARTS, contains information required to order all replacement parts and assemblies.

g. SECTION VII, MANUAL CHANGES, provides information to docum ent all serial number prefixes listed on the title page.

h. SECTION VIII, SERVICE, contains descriptions of the circuits, schematic diagrams, parts location diagrams, and troubleshooting pr ocedures to aid the user in maintaining the instrument.

1-5. DELETED

1-6. On the title page of this manual, below the manual

part number, is a “Microf ic he” par t number. This number may be used to order 4 x 6-inch microfilm transparencies of the manual. Each m icrof iche contains up to 60 photoduplicates of the manual pages. The microfiche package also includes the latest Manual Changes supplement as well as all pertinent Service Notes.

1-7. SPECIFICATIONS

1-8. Instrument spec ifications are listed in T able 1-1. These specifications are the per formance standards, or limits against which the instrument may be tested.

1-9. INSTRUMENTS COVERED BY MANUAL 1-10. This instrument has a two-part serial number. The f irst four digits and the letter comprise the serial number prefix. The last f ive digits form the sequential suff ix that is unique to each instrument. The contents of this manual apply directly to instruments having the same serial number prefix(es) as listed under SERIAL NUMBERS on the title page.

1-11. For information concerning a serial num ber prefix not listed on the title page or in the Manual Changes supplement, contact your nearest Hewlett-Packard office.

1-12. MANUAL CHANGE SUPPLEMENTS

1-13. An instrument manufactured after the printing of this manual may have a serial prefix that is not lis ted on the title page. This unlisted serial

1-1

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/11661 Specifications (1 of 3)

SPECIFICATIONS

FREQUENCY CHARACTERISTICS

Spurious Signals (CW, AM, and OM only):

Range: 1.0 to 1299.999999 MHz selectable in 1 Hz

steps. Frequencies from 200 k Hz to 1 MHz may also be selected with some degradation in specifications.

Accuracy and Stability

: CW f requency accuracy and

long term stability are determined by the aging rate of the

80 dB down from carrier at frequencies <700 MHz 80 dB down from carrier within 45 MHz of the carrier at

frequencies >700 MHz

70 dB down from carrier >45 MHz from carrier at

frequencies >700 MHz

50 dB down from carrier on the +10 dBm range.

time base (internal or external) and its sensitivity to changes in temperature and line voltage. Internal

reference oscillator ac curacy = + aging rate ± 3 x 10 /°C + 3 x 10

-10

/1% change in line voltage

-10

All Power Line Related spurious signals are 70 dB down

from carrier.

Switching Time: 6 ms to be within 50 Hz of any new frequency selected; 100 ms to be within 5 Hz of any new frequency delected.

Typical 86602B/11661 Frequency Switching

Characteristics

Harmonic Signals:

All harmonically related signals are at least 30 dB below the desired output signal for output levels <+3 dBm. (25 dB down for output levels above +3 dBm.)

Signal-to-Phase Noise Ratio (CW, AM, and OM only):

Greater than 45 dB in a 30 kHz band centered on the carrier and excluding a 1 Hz band centered on the carrier.

Typical SSB Phase Noise Curve:

Typical 86602B Phase Noise

Signal-to-AM Noise Ratio: Greater than 65 dB down in

a 30 kHz bandwidth centered on the carrier and excluding a 1 Hz band centered on the carrier

Aging rate for the time base of standard mainframes is 3 x

10-8/day: for option 001 mainframes, 3 x 10-9/day.

1-2

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/11661 Specifications (2 of 3)

OUTPUT CHARACTERISTICS

Level: Continuously adjustable from +10 to -146 dBm

(0.7 Vrms to 0.01 /Vrms) into a 50Q resistive

load. Output attenuator calibrated in 10 dB steps

from 1.OV full scale (+10 dBm range) to 0.03

pVrms full scale (-140 dBm range). Vernier

provides continuous adjustment between

attenuator ranges. Output level indicated on

output level meter calibrated in volts and dBm

into 50 ohms. Accuracy: (Local and remote modes)

+ 1.5 dB to -76 dBm; + 2.0 dB to -146 dBm at

meter readings between +3 and -6 dB. Flatness: Output level variation with frequency is less

than ±1.0 dB from 1-1300 MHz at meter

readings between +3 and --6 dB. Level Switching Time: In the remote mode any level

change can be accomplished in les s than 50 ms.

Any change to another level on the same

attenuator range can be accomplished in less

than 5 ms.

Typical AM Distortion (Center Frequency <10 MHz)

Impedance: 50Q. VSWR: <2.0 on +10 and O dBm range; <1.3 on -10 dBm

range and below.

MODULATION CHARACTERISTICS

(With compatible Modulation Sections)

Amplitude Modulation: Depth: 0 - 90% for RF output level meter readings from

+3 to -6 dB and only at +3 dBm and below.

AM 3 db Bandwidth:

Typical AM Distortion (Center Frequency > 10 MHz)

Incidental PM: Less than 0.2 radians peak at 30% AM. Incidental FM: Less than 0.2 times the frequency of

modulation (Hz) at 30% AM.

Applies only at 400 Hz and 1 kHz rates with the RF Section front panel meter indicating from O to +3 dBm. At a meter indication of 6 dB the distortion approximately doubles. The modulating signal distortion must be <0.3% for the system performance to meet these specifications.

1-3

Section 1 TM 11-6625-2837-14&P-7

Table 1-1. Models 86602B/1 1661 Specifications (3 of 3)

FREQUENCY MODULATION

Rate: DC to 200 kHz with the 86632B and 86635A.

20 Hz to 100 kHz with the 86633B.

Maximum Deviation (peak):

200 kHz with the 86632B and 86635A 100 kHz with the 86633B

Incidental AM: AM sidebands are greater than 60 dB

down from the carrier with 75 kHz peak deviation at a 1 kHz rate.

FM Total Harmonic Distortion (at rates up to 20 kHz);

<1% up to 200 kHz deviation. (External modulating signal distortion must be less than

0.3%.)

Residual FM: less than 10 Hz rms average in 300 kHz,

Post-detection bandwidth, FM x 0.1 mode.

ON/OFF Ratio: At least 40 dB. Input Level Required: -10-+ 0.5 Vdc turns RF on.

PHASE MODULATION

(Option 002 Instruments only)

Rate:

with 86635A dc to 1 MHz with 86634A dc to 1 MHz at center frequencies less than 100 MHz dc to 10 MHz at center frequencies greater or equal to 100 MHz.

Maximum Peak Deviation:

0 to 100 degrees peak. May be overdriven to 2 radians

(1150) in the Modulation Section’s external dc mode.

∅M Distortion:

<5% up to 1 MHz rates <7% up to 5 MHz rates <15% up to 10 MHz rates

Typical FM Distortion Curve

PULSE MODULATION

(With the 86631B Auxiliary Section only)

Source: External Rise/Fall Time: 50 ns.

(External modulation signal distortion m ust be less than

0.3% to meet this specification.)

REMOTE PROGRAMMING

(Through the 8660-series mainframes)

Frequency: Programmable in 1 Hz steps. Output Level: Programmable in 1 dB s teps from +10 to

-146 dBm. Modulation: See specifications for modulation section

installed.

GENERAL

Leakage: Meets radiated and conducted limits of MIL-I-

6181D.

Size: Plug-in to fit 8660-series mainframe. Weight: Net 9 lb (3.9 kg).

1-4

Section 1 TM 11-6625-2837-14&P-7

prefix indicates that the instrument is different fr om those documented in this manual. The manual for this instrument is supplied with a yellow Manual Changes

supplement that contains “change information” that documents the differences.

1-14. In addition to change information, the supplem ent may contain information for correcting errors in the manual. To keep this manual as current and accurate as possible, Hewlett-Packard recommends that you periodically request the latest Manual Changes supplement. The supplem ent for this m anual is k eyed to this manual’s print date and part number , both of which appear on the title page. Complimentary copies of the supplement are available from Hewlett-Packard.

1-15. DESCRIPTION

1-16. The HP Model 86602B RF Section is one of several RF Sections available for us e in an 8660-series Synthesized Signal Generator System. This RF Sec tion plug-in is used with an option 100 8660-series mainfram e (Frequenc y Extension Module installed). T he RF Section provides precisely tuned RF output frequencies over the 1 to 1300 MHz range with 1 Hz frequency resolution (8660-series option 004 instr uments have resolutions of 100 Hz.) Frequencies from 200 k Hz to 1 MHz can also be generated with some degradation in the amplitude leveling and other related specifications.

1-17. The output power can be set to any level between +10 and --146 dBm by means of the front panel VERNIER and calibrated OUTPUT RANGE controls. A front panel-mounted meter and the OUTPUT RANGE switch indicate the output power and voltage levels delivered by the RF Section to any external load having a characteristic impedance of 50 ohms. Output power levels are maintained within + 1 dB of selected values through internal leveling of the output signal over the full frequency range of the instrument.

1-18. Amplitude, frequency, phase, or pulse modulation of the RF OUTPUT signal can be accomplished within the RF Section by using the appropriate Auxiliary or Modulation Section plug-in.

1-19. External programm ing perm its rem ote selection of the output signal frequency in 1 Hz steps (100 Hz for option 004 mainframes) and the output power in 1 dB steps over the full operating

range of the instrument. External programming is accomplished via the mainframe computer-compatible interface and digital control unit circuits.

1-20. OPTIONS

1-21. This RF Section has two options available. They affect the instrument’s RF output level, and phase modulation capabilities.

1-22. Option 001. The RF output attenuator is removed. This lim its the RF output level range f rom +10 to -6 dBm.

1-23. Option 002. Circuits are added to provide the phase modulation capability. A compatible modulation section is required.

1-24. COMPATIBILITY

1-25. Except for Option 002 instruments, the Model 86602B is compatible with all 8660-series option 100 mainframes, all AM-FM Modulation Sections and the Auxiliary Section. This RF Section is partially com patible with the FM/OM Modulation Section.

Damage to the signal generator system may result if an option 002 RF Section is used with Model 8660A or 8660B main-frames with serial prefixes 1349A and below.

1-26. Option 002 instruments are compatible with all instruments which are part of the Model 8660-series Synthesized Signal Generator System except early model 8660A and 8660B Mainframes. Refer to the paragraph entitled Modifications in Section II of this manual for further information.

1-27. EQUIPMENT REQUIRED BUT NOT SUPPLIED

1-28. System Mainframe

1-29. The mainframe uses phase-locked loops to accurately generate clock, referenc e, and tuning signals required for operation of the Synthesized Signal Generator System. Front panel-mounted mainframe controls are used to digitally tune two phase-locked loops in the Frequency Extension Module which, in turn, produce two high-frequency output signals that are applied to the RF Section. The RF Section mixes the two signals

1-5

Section 1 TM 11-6625-2837-14&P-7

and presents their frequency difference at the front panel OUTPUT jack. The output frequency is either the value selected by the mainframe front panel controls or external programming.

1-30. The mainframe power supply provides all dc operating voltages required by the RF Section, Frequency Extension Module, and Modulation Section plug-ins. Remote programming of the plug-ins is accomplished via the mainframe interface and digital control unit circuits.

1-31. Frequency Extension Module

1-32. The Frequency Extension Module plug-in extends the output frequency range of the main-frame to meet the input requirements of the RF Section. The Frequency Extension Module plug-in contains two highfrequency phase-locked loops which receive digital tuning signals, variable synthesized signals, and fixed synthesized signals from the mainframe. The phaselocked loops use the main-frame signals, in conjunc tion with the output frequency from a 4.43 GHz oscillator that is common to both loops, to produce two high-frequency output signals that are supplied to the RF Section. O ne output signal is generated by a phase-locked loop using a Voltage Controlled Oscillator (VCO) that is tuneable in 1 Hz steps (100 Hz steps for option 004 mainframe) over the 3.95 to 4.05 GHz range. The other output signal is generated by a phase-locked loop using a Yittrium-IronGarnet (YIG) oscillator that is tunable in 100 MHz steps over the 3.95 to 2.75 GHz range. The two outputs from the Frequency Extension Module plug-in are applied to the RF Section for mixing, amplification of the converted signal, and final output power level control.

1-33. Auxiliary Section

1-34. The Auxiliary Section plug-in provides a means of applying externally generated amplitude or pulse

modulation drive signals to modulate the RF Section’s output carrier.

1-35. Modulation Section Plug-ins

1-36. The Model 86630-series Modulation Section plugins can accept external modulation drive signals or generate internal drive signals to amplitude, frequency, phase or pulse modulate the RF Sections output signal.

1-37. EQUIPMENT AVAILABLE

1-38. Extender cables, coaxial adapters, and an adjustment tool are available for use in performance testing, adjusting, and maintaining the RF Section. Each piece may be ordered separately or as part of the 11672A Service Kit.

1-39. Extender cards for use in ser vicing the RF Section and a type N to BNC adapter for use on the front panel RF OUTPUT connector are contained in the HP Rack Mount Kit, Part Number 08660-60070, that is supplied with the mainframe.

1-40. SAFETY CONSIDERATIONS

1-41. This instrument has been designed in accord-ance with international safety standards and has been supplied in safe condition.

1-42. Although this instrument has been designed in accordance with international safety standards, this manual contains information, cautions, and warnings which must be followed to retain the instrument in sa fe condition. Be sure to read and follow the safety information in Sections II, III, V, and VIII.

1-43. RECOMMENDED TEST EQUIPMENT 1-44.

Table 1-2 lists the test equipment and accessories recommended for use in testing, adjusting, and s ervicing the RF Section. If any of the recommended test equipment is unavailable, instruments with equivalent specifications may be used. See Appendix B, Section III.

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Section 1 TM 11-6625-2837-14&P-7

See Appendix B, Section III

Table 1-2. Recommended Test Equipment (1 of 4)

Item Critical Specifications Suggested Model Use*

Adapter (Male Type N Frequency range 100 MHz to 1.3 GHz HP 1250-0847 P to GR874 )

Adapter, SMA-to-BNC 2 required OSM 21190 P Adapter, SMA-to-OSM OSM 219 P

Right Angle Adapter, Type N-to- OSM 21040 P

SMA Amplifier, 20 dB -20 dB gain at 30 MHz HP 8447A P

Input SWR <1.7 Amplifier, 40 dB Special (see Figure 1-2) P Analyzer, Distortion 20 Hz to 20 kHz; must measure <0.1% distortion HP 333A P Analyzer, Spectrum Measurement Accuracy +2.0 dB from 1 kHz HP 8553B with HP 8552B P.,A

to 110 MHz and HP 1-10T Analyzer, Spectrum Measurement Accuracy +2.0 dB from 10 MHz HP 8555A with HP 8552B P. A, T

to 8 GHz and HP 140T Analyzer, Wave Center frequencies 20 to 40 kHz HP 3581A P

Resolution bandwidth <3 Hz

Bandpass shape factor 10:1

Analog output 0 to 5V

Noise level (at 11 kHz center frequency with a

3 Hz bandwidth) <-150 dBV Attenuator, 3 dB 3 dB HP 8491A Option 003 P

Fixed Attenuator, 10 dB Step Calibrated at 30 MHz; refer to calibration curve HP 355D-H38 (only) P, A Attenuator, 40 dB 40 dB HP 8491A Option 040 P

Fixed Cables, Double Minimum input <300 mVrms (5 required) HP 08708-6033 P

Shielded Capacitor, 1500 pF HP 0160-2222 P Capacitor, 100 pF HP 0180-2207 P Connector, BNC HP 1250-0118 T

Panel Mount

*Use: P = Performance Tests, A = Adjustments, T = Troubleshooting

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Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (2 of 4)

Item Critical Specifications Suggested Model Use*

Counter, Computing 50 kHz to 50 MHz with a 1 ms gate time and HP 5360A with HP 5365A P

external trigger; 1 Hz resolution plug-in Counter, Frequency Range: 0.2-1300 MHz HP 5340A P

Resolution: 1 Hz

10 MHz external reference output

7.2 Vrms output into 170 ohms Coupler, Directional Frequency range 100 MHz to 1.3 GHz HP 778D Option 12 P Detector, Crystal 1 to 1200 MHz HP 8471A P Detector, Crystal 10 MHz to 1.3 GHz HP 423A P, A FM Discriminator Input frequency 100 kHz to 10 MHz HP 5210A P, A

Linear Analog Output 1V full scale Filter Kit Accessory for HP 5210A HP 10513A P, A Filter, Low Pass, Special (see Figure 1-3) P

15 kHz Filter, Low Pass, Cutoff frequency: 4 MHz CIR-Q-TEL P 4 MHz FLT/21B-4-3/50-3A/3B

Filter, Low Pass, Cutoff frequency: 2200 MHz HP 360C P 2200 MHz

Filters, Low Pass, 100 kHz at 50 and 600 ohms Specials (See Figure 1-4) A 100 kHz

Filters, Low Pass, 1 MHz - 50 and 600 ohms Specials (See Figure 1-4) P, A 1 MHz

Filters, Low Pass, 5 and 10 MHz - 50 ohms Specials (See Figure 1-4) P 5 and 10 MHz

Filter, Band Pass Pass band 1-2 GHz HP 8430A P Generator, Distortion less than 0.3% HP 203A P

Function Range: 0.5 Hz to 20 kHz

Output level: 0.1 to 2.0 Vrms into 600 ohms Generator, Pulse Output -10 Vpk with <10 ns risetime in 600 HP 8013B P

ohms Generator, Sweep Sweep Width 0.1 to 100 MHz HP 8601A A

Output Level +20 to -80 dBm

Flatness +0.25 dB Generator, Synthe- +1 Hz from 1 MHz to 1300 MHz, +7 dBm output HP 8660 with HP 86631B P, A sized Signal 10 MHz Reference output

>0.5V into 170 ohms

*Use: P = Performance Tests, A = Adjustments, T = Troubleshooting

1-8

Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (3 of 4)

Item Critical Specifications Suggested Model Use*

Mixer, Double 1 MHz to 110 MHz HP 10514A A Balanced

Mixer, Double 300 to 1300 MHz Watkins-Johnson M1J P Balanced

Oscillator, Test 1 kHz to 10 MHz HP 651B P, A

1.0 to 2.0 Vrms into 600 or 50 ohms Oscilloscope Vertical: HP 180C with HP 1801A P, A, T

Bandwidth 50 MHz with sensitivity of and HP 1821A plug-ins

5mV/ division minimum

Horizontal:

Sweep time 10 ns to 1 s

Delayed sweep

External triggering to 100 MHz Oscilloscope, Input impedance HP 10004 P, A, T 10:1 divider probes 10 megohm shunted by 10 pF

Power MeterISensor Range: -10 to +10 dBm from 10 MHz to 1.3 HP 435A/8481A P, A, T GHz Power Supply, DC 0-10 volts HP 721A P

Programmer, Marked Capable of programming BCD or HP-IB data HP 3260A Option 001 P, A Card Probe, Logic TTL Compatible HP 10525T T

Resistor, 1000 ohm +2% HP 0757-0280 P, A Resistor, 10K ohm +2% HP 0757-0442 P

Resistor, 100K ohm f2% HP 0698-7284 P Service Kit Interconnect cables, adaptors, and coaxial HP 11672A (See A, T

cables compatible to 8660-series plus and Operating Note or

jacks mainframe manual for

parts list) Stub, Adjustable Frequency range 100 MHz to 1.3 GHz General Radio 874-D50L P Tee, Coaxial 2 required HP 1250-0781 (BNC) P, A Termination, 50 50 ohm HP 11048C P

ohm Feed Thru

*Use: P = Performance, A = Adjustments, T = Troubleshooting

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Section 1 TM 11-6625-2837-14&P-7

Table 1-2. Recommended Test Equipment (4 of 4)

Item Critical Specifications Suggested Model Use*

Termination, 50 ohm 50 ohm, (2 required) HP 11593A P Test Set, Phase Input Frequency Range 250 to 950 MHz HP 8660C-K10 (only) P, A

Modulation Distortion

<2% up to 2 MHz rates <3.5% up to 5 MHz <5.0% up to 10 MHz

Voltmeter, AC Accuracy +2% of full scale from HP 403B P, A, T

1 Hz to 1 MHz

1 mVrms to 10 Vrms full scale Voltmeter, Digital Range 0.00 to 60.00 volts HP 34740A/34702A P, A, T

DC Accuracy +(0.3%, of reading +0.01% of

range)

AC Accuracy +(0.25% of reading +0.05% of

range)

45 Hz to 20 kHz Voltmeter, Vector Frequency range 5 to 15 MHz HP 8405A P

Input level 100 mVrms to 1 Vrms

Analog output: +0.5 Vdc for +180°

*Use: P = Performance Tests. A = Adjustments, T = Troubleshooting

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Section 1 TM 11-6625-2837-14&P-7

40 dB TEST AMPLIFIER

Amplifier Specifications

Gain 44 dB at 25°C

Bandwidth 100 kHz (3 dB down) Noise Bandwidth 157 kHz Input Impedance 75K Ohms Output Impedance 12K Ohms Current Drain 260 Microamperes Output (Maximum) 1 Volt Dynamic Range 66 dB

Figure 1-2. 40 dB Test Amlifier

Figure 1-3. 15 kHz Low Pass Filter

1-11

Section 1 TM 11-6625-2837-14&P-7

100 kHz - 50 ohms 100 kHz - 600 ohms

C1, C4 0.015 µF Mylar 0160-0194 C1, C4 1300 pF 0160-2221 C2 0.027 µF Mylar 0170-0066 C2 3000 pF 0160-2229 C3 0.022 µF Mylar 0160-0162 C3 1100 pF 0160-2219 L1, L2 100 µH 9140-0210 L1, L2 1200 µH 9100-1655

1 MHz -50 ohms 1 MHz - 600 ohms

C1, C4 1500 pF 0160-2222 C1, C4 130 pF 0140-0195 C2 3300 pF 0160-2230 C2 300 pF 0160-2207 C3 1600 pF 0160-2223 C3 120, µH 0140-0194

L1, L2 10H ±10% 9140-0114 L1, L2 120

5 MHz - 50 ohms 10 MHz - 50 ohms

C1, C2, C4 300 pF 0160-2207 C1, C4 150 pF 0140-0196 C3 680 pF 0160-3537 C2 330 pF 0160-2208 L1, L2 2 µH 9100-3345 C3 160 pH 0160-2206

L1, L2 1 µH±10% 9140-0096

NOTE

9100-1637

Unless otherwise noted, tolerance of components is + 5%

and capacitors are mica. Part numbers are Hewlett-Packard

Figure 1-4. Low Pass Filters

1-12

Section 2 TM 11-6625-2837-14&P-7

SECTION II

INSTALLATION

2-1. INTRODUCTION

2-2. This section provides information relative to initial inspection, preparation for use, and storage and shipment of the Model 86602B RF Section plug-in. Initial Inspection provides instructions to be followed when an instrument is received in a damaged condition. Preparation For Use gives all necessary interconnection and installation instructions. Storage and Shipment provides instructions and environmental limitations pertaining to instrument storage. Also provided are packing and packaging instructions which should be followed in preparing the instrument for shipment.

2-3. INITIAL INSPECTION

2-4. Inspect the shipping container for dam age. If the shipping container or cushioning material is dam aged, it should be kept until the contents of the shipment have been checked for com pleteness and the instrument has been checked mechanically and electrically. The contents of the shipment s hould be as shown in Figure 1-1, and procedures for chec king electrical perform ance are given in Section IV. If the contents are inc om plete, if there is mechanical damage or defect, or if the instrument does not pass the electrical performance test, notify the nearest Hewlett-Packard office. If the s hipping container is damaged, or the c ushioning material shows signs of stress, notify the carrier as well as the Hewlett-

Packard office. Keep the shipping m aterials for car rier’s inspection. The HP office will arrange for repair or replacement without waiting for claim settlement.

2-10. Modifications

2-11. A power supply modification to older versions of Model 8660A and 8660B mainfram es are requir ed if they are to be used with the option 002 RF Section.

Damage to the synthesized signal generator system may result if an option 002 RF Section is used with an older 8660A or 8660B mainframe.

2-12. Due to the increased power consumption of the option 002 instrument, mainframes with serial prefixes 1349A and below must be modif ied by installing a Field Update Kit. For mainframe configurations other than option 003 (60 Hz line operation), order kit number 08660-60273. For option 003 mainframes ( 50 - 400 Hz line operation) order kit number 08660-60274.

NOTE

Verify that a new higher current fuse, HP Part Number 2110-0365, 4A Slow Blow, is used in mainframes with the power supply modification.

2-13. Operating Environment

2-14. The RF Section is designed to operate within the following environmental conditions:

2-5. PREPARATION FOR USE 2-6. Power Requirements

2-7. All power required for operation of the RF Section is furnished by the mainfram e. T his RF Section requir es approximately 40 volt-amperes.

2-8. Interconnections

2-9. Prior to installing the RF Section plug-in into the mainfram e, verify that the Frequency Extension Module plug-in and interconnecting cable assem blies have been installed in accordance with the instru ctions contained in the Frequency Extension Module manual.

Temperature ........................................ 0° to +55°C

Humidity..................................... less than 95% relative

Altitude....................................... less than 15,000 feet

2-15. Installation Instructions

WARNING

The multi-pin plug connector which provides interconnection from mainframe to RF Section, will be exposed with the RF Section removed from the right-hand mainframe cavity. With the Line (Mains) Volt age off and power cord disconnected, power supply voltages may still remain which, if contacted, may constitute a shock hazard.

2-1

Section 1 TM 11-6625-2837-14&P-7

2-16. Insert the plug-in approximately half-way into the right cavity of the mainframe. Rotate the latch (lower right corner) to the left until it protrudes perpendicular to the front panel. Refer to Figure 2-1, which shows the plug-in partially inserted into the mainfram e and the latc h rotated to a position that is perpendicular to the plug-in front panel. Push the plug-in all the way into the mainframe cavity and then rotate the latch to the right until it snaps into position.

2-17. STORAGE AND SHIPMENT

2-18. Environment

2-19. The storage and shipping environm ent of the RF Section should not exceed the following limits:

Temperature................................ 40° to +75°C

Humidity....................................... less than 95% relative

Altitude......................................... less than 25,000 feet

2-20. Packaging 2-21. Original Type Packaging. Containers and

materials identical to those used in f ac tor y pack aging are available through Hewlett-Packard offices. If the instrument is being returned to Hewlett-Packard for servicing, attach a tag indicating the type of service required, return address, model number, and full serial Figure 2-1. RF Section Partially Inserted into Mainframe

number. Also mark the container FRAGILE to assure careful handling. In any correspondence, refer to the instrument by model number and full serial number.

2-22. Other Packaging. The following general instructions should be used for re-packaging with commercially available materials:

a. Wrap the instrument in heavy paper or plastic. (If shipping to a Hewlett-Packard office or service center, attach a tag indicating the type of ser vice required, return address, model number, and full serial number.)

b. Use a strong shipping container. A doublewall carton made of 350-pound test material is adequate.

c. Use enough shock-absorbing material (3 to 4inch layer) around all the sides of the instrument to provide firm cushion and prevent movement inside the container. Protect the control panel with cardboard.

d. Seal the shipping container securely.

e. Mark the shipping container FRAGILE to assure careful handling.

Figure 2-1. RF Section Partially Inserted into Mainframe

2-2

Section 3 TM 11-6625-2837-14&P-7

SECTION III

OPERATION

3-1. INTRODUCTION

3-2. This section contains information which will enable the operator to learn to operate and quickly check for proper operation of the RF Section plug-in as part of the Synthesized Signal Generator System.

3-3. PANEL FEATURES

3-4. The front and rear panel controls, connectors , and indicators of the RF Section and its options are described by Figure 3-1 and 3-2.

3-5. OPERATOR’S CHECKS

3-6. The RF Section, as part of the Synthesized Signal Generator System, accepts inputs from the rest of the system but controls only the RF output level. Even though the controlled circuits for most other functions are within the RF Section, the actual checks are f ound in the manual of the instrument which controls that function.

3-7. The Operator’s Check s in this m anual are intended to verify proper operation of the circuits which control and are controlled by the RF output level controls. This includes the meter, the VERNIER control, the OUT PUT RANGE switch, and the Output Range Attenuator when operating in the local mode. W hen the system is being remotely controlled, the 1 dB and 10 dB remote step attentator switches are checked in place of the VERNIER control and OUTPUT RANGE switch. Refer to Figure 3-

3-8. OPERATING INSTRUCTIONS

3-9. In this system, the mainframe and plug-ins contain the controls for frequency, modulation, and RF level selection. The mainframe controls frequency, the Modulation Section plug-in controls m odulation type and level, and the RF Section plug-in controls RF output level. The Operating Instructions for the RF Section plug-in are included in Table 3-1.

3-1

Section 3 TM 11-6625-2837-14&P-7

The front panel of the option 002 instrument is shown. The standard instrument does not have the term PHASE MODULATION after 1-1300 MHz. The option 001 instrument has an OUTPUT RANGE switc h whic h s hows only the +10 and 0 dBm ranges.

1 Meter. Indicates the RF Output level in Vrms and dBm (50w) with the scale reference indicated by the OUTPUT RANGE switch.

2 Mechanical Meter Zero Control. Sets the Panel Meter indicator to zero when the mainfram e LINE Switch is set to STBY.

3 OUTPUT RANGE Switch. Sets the output level range of all except option 001 instruments from

Figure 3-1. Front Panel Controls, Connectors, and Indicators

NOTE

+10 to -140 dBm (502) in 10 dB steps. For option 001 instruments, +10 and 0 dBm ranges only.

4 OUTPUT Jack. Type-N female coaxial connector. RF Output level +10 to -146 dBm (0.7 Vrms to 0.01 /IVrms) into a 50Q load. Frequency range is 1 to

1299.999 999 MHz in 1 Hz steps. 5 VERNIER Control. RF Output continuously var-iable

within the useable range (+3 to --6 dB) as indicated by the meter.

3-2

Section 3 TM 11-6625-2837-14&P-7

1 Coaxial Plug. Connects the 3.95 to 2.75 GHz RF

Input signal to the RF Section from the Frequency Extension Module.

2 Interconnect Plug. Provides interconnection of power supply voltages; RF and control signals between the RF Section plug-in and the Main-frame, Frequency Extension Module, and Modulation Section plug-in.

Figure 3-2. Rear Panel Connectors and Indicators

3 Coaxial Plug. Connects the 3.95 to 4.05 GHz LO Input signal to the RF Section plug-in from the Frequency Extension Module.

4 Serial Number Plate. Metal plate with stamped serial number. Four-digit and letter f or prefix. Suffix is unique to an instrument.

3-3

Section 3 TM 11-6625-2837-14&P-7

WARNING

BEFORE CONNECTING TH IS SYSTEM TO LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the mainframe manual should be followed.

Damage to the signal generator system may occur if option 002 RF Sections are used with unmodified 8660A and 8660B main f rames with serial prefixes 1349A and below. See the paragraph entitled Modifications in Section II.

Refer to Section HI for RF Section Installation instructions.

1. Set the System controls as follows: Mainframe

LINE Switch.................................................................................... ON

REFERENCESELECTOR.............................................................. EXT

CENTER FREQUENCY................................................................. 500 MHz

Modulation Section plug-in

MODE Switch................................................................................. OFF

RF Section plug-in

OUTPUT RANGE Switch ............................................................... 0 dBm

VERNIER Control........................................................................... +3 dB meter reading

NOTE

Figure 3-3. Operator’s Checks (1 of 2)

3-4

Section 3 TM 11-6625-2837-14&P-7

OPERATOR’S CHECKS

2. Connect the RF Section OUTPUT to the power sensor input. Ver if y that the amplitude of the 500 MHz s ignal

is approximately +3 dBm.

3. Set the OUTPUT RANGE Switch to +10 dBm and adjust the VERNIER control for a -3 dB meter reading.

Verify that the output level is approximately +7 dBm.

4. Connect the RF Section OUTPUT to the frequenc y counter input through the 3 dB attenuator. Verify that the

signal is accurate within +1 Hz.

5. To check the remote control capabilities of the RF Section, connect a control unit to the m ainfram e. Repeat

steps 1 through 4 while the system is remotely programmed fr om an external source. Application Note 164-1 "Programming the 8660A/B Synthesized Signal Generator" provides the inform ation needed for r emote BCD operation of this system. Application Note 164-2 "Calculator Control of the 8660A/B/C Synthesized Signal Generator" provides the inform ation needed for calculator control of the s ystem us ing the HP- IB ( option 005). Section III of the mainframe manual contains the same information in abridged form.

Figure 3-3. Operator’s Checks (2 of 2)

3-5

Section 3 TM 11-6625-2837-14&P-7

Table 3-1. Operating Instructions (1 of 2)

OPERATING INSTRUCTIONS

TURN ON

BEFORE CONNECTING THIS SYSTEM TO THE LINE (MAINS) VOLTAGE, the safety and installation instructions found in Sections II and III of the mainframe manual should be followed.

Damage to the signal generator system may occur if option 002 RF Sections are used with unmodified 8660A and 8660B main- frames with serial prefixes 1349A and below. See the paragraph entitled Modifications in Section II.

NOTE

Refer to Section II for RF Section Installation Instructions.

1. Set the mainf ram e’s LINE Switch to ON and the rear panel REFERENCE SELECTOR Switch to INT . Wait for the mainframe "oven" indication to go out.

FREQUENCY SELECTION

2. Refer to Section III of the mainframe operating and service manual for information on system frequency selection.

RF OUTPUT LEVEL

3. dBm . Set the OUTPUT RANG E switch to within +3 and --6 dB of the desired output level. Adjust the VERNIER control for a meter r eading which when added to the O UT PUT RANGE switch indication equals the desired output level.

4. VOLTS. To set the RF output level in rms volts, the OUTPUT RANGE switch selec ted the f ull s c ale meter reading and the VERNIER control is adjusted for the cor rect voltage reading on the meter. The voltage level f or meter scale 1.0 should not be set below 0.32 of full scale. T he voltage level should not be set below 1 when using the meter scale of 3.

NOTE

In order to achieve the output level accuracy specified, the level selected must be S<+10 dBm and the RF Section front panel meter reading must be as stated above.

5. Connect the RF Output to the Devic e Under Test. The front panel m eter r eading of RF Output level will be c or rec t only if the input impedance of the Device Under Test is 50w2.

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