HP 419195-002 User Manual

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HP ProLiant DL320 Generation 5 Server Maintenance and Service Guide

Part Number 419195-002 November 2007 (Second Edition)

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© Copyright 2006, 2007 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Intel, Xeon, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

Audience assumptions

This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.

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Customer self repair...................................................................................................................... 5

Parts only warranty service ......................................................................................................................... 5

Illustrated parts catalog ............................................................................................................... 16

Mechanical components........................................................................................................................... 16

System components .................................................................................................................................19

Removal and replacement procedures........................................................................................... 23

Required tools......................................................................................................................................... 23

Safety considerations............................................................................................................................... 23

Preventing electrostatic discharge..............................................................................................................23

Symbols on equipment............................................................................................................................. 23

Rack warnings ........................................................................................................................................ 24

Server warnings and cautions................................................................................................................... 25

Preparation procedures............................................................................................................................ 25

Extend the server from the rack........................................................................................................ 25

Power down the server................................................................................................................... 26

Remove the server from the rack...................................................................................................... 26

Access panel .......................................................................................................................................... 27

Hard drives ............................................................................................................................................ 27

Hard drive blanks.................................................................................................................................... 28

SAS/SATA backplane ............................................................................................................................. 28

Air baffle ............................................................................................................................................... 29

Fan assembly.......................................................................................................................................... 30

BBWC battery holder............................................................................................................................... 31

BBWC battery ........................................................................................................................................ 31

Media cage ........................................................................................................................................... 32

Optical drive .......................................................................................................................................... 33

Diskette drive.......................................................................................................................................... 34

Front video connector ..............................................................................................................................35

Power button/LED board..........................................................................................................................36

Front bezel ............................................................................................................................................. 37

PCI riser board assembly.......................................................................................................................... 39

Expansion boards ................................................................................................................................... 39

Storage controller.................................................................................................................................... 40

PCI Express or PCI-X riser board................................................................................................................ 41

DIMMs................................................................................................................................................... 42

Memory options ............................................................................................................................ 42

DIMM installation guidelines........................................................................................................... 42

Interleaving and non-interleaving memory configuration ..................................................................... 43

Power supply.......................................................................................................................................... 43

Heatsink................................................................................................................................................. 44

Processor ...............................................................................................................................................46

System board ......................................................................................................................................... 50

Battery................................................................................................................................................... 56

Cabling ..................................................................................................................................... 58

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Server cable routing ................................................................................................................................58

Embedded SATA controller cable routing ...................................................................................................58

Optional SAS/SATA controller cable routing ..............................................................................................59

Slot 2........................................................................................................................................... 59

Slot 1........................................................................................................................................... 60

Video connector option cable routing ........................................................................................................ 60

Battery-backed write cache cable routing ................................................................................................... 61

Diagnostic tools.......................................................................................................................... 62

Troubleshooting resources ........................................................................................................................62

HP Insight Diagnostics.............................................................................................................................. 62

HP Insight Diagnostics survey functionality .................................................................................................. 62

Integrated Management Log ..................................................................................................................... 63

Array Diagnostic Utility ............................................................................................................................ 63

HP Systems Insight Manager..................................................................................................................... 63

Component identification............................................................................................................. 64

Front panel components ........................................................................................................................... 64

Front panel LEDs and buttons .................................................................................................................... 65

Rear panel components............................................................................................................................ 66

PCI expansion slot definitions.................................................................................................................... 66

Rear panel LEDs...................................................................................................................................... 67

System board components........................................................................................................................ 68

System maintenance switch............................................................................................................. 68

NMI functionality........................................................................................................................... 69

System board LEDs .................................................................................................................................. 70

System LEDs and internal health LED combinations....................................................................................... 71

Internal USB connector............................................................................................................................. 72

SATA and SAS device numbers................................................................................................................. 72

Fan assembly location.............................................................................................................................. 73

Specifications............................................................................................................................. 74

Environmental specifications ..................................................................................................................... 74

Server specifications................................................................................................................................ 74

Acronyms and abbreviations........................................................................................................ 76

Index......................................................................................................................................... 78

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Customer self repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these

parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for

customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the North American program, refer to the HP website (http://www.hp.com/go/selfrepair

Parts only warranty service

Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, HP will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:

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• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à

HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

• Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont

également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair

Service de garantie "pièces seules"

Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par HP ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida

la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

• Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di

componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

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NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair

Servizio di garanzia per i soli componenti

La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie

den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

• Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center

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anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si

solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos

componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al

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Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair

Servicio de garantía exclusivo de componentes

La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

• Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze

onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

• Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde

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periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.nl/services/servicepartners

Garantieservice "Parts Only"

Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente. Existem duas categorias de peças CSR:

• Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua

essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas

para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

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Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair

Serviço de garantia apenas para peças

A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

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Illustrated parts catalog

Mechanical components

Item Description Spare part number Customer self

repair (on page 5)

1 Access panel 432934-001 Mandatory1 2 Front bezel 432935-001 Mandatory1 3 Hard drive blank 413960-001 Mandatory1

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

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Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti.

Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.

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System components

Item Description Spare part number Customer self repair

(on page 5)

4 Fan assembly 432933-001 Optional2

5 Power supply, 420-W 432932-001 Optional2

6 Power button/LED board 432931-001 Optional2

7 System board 432924-001 Optional2

8 SAS/SATA backplane 432926-001 Optional2

9 Processors — —

System components

Boards

a) 3.2-GHz Intel® Celeron® D 352 processor, 512-KB L2 cache, 533-MHz FSB

b) 1.86-GHz Intel® Xeon™ processor 3040, dual-core, 2-MB cache, 1066-MHz FSB*

c) 2.13-GHz Intel® Xeon™ processor 3050, dual-core, 2-MB cache, 1066-MHz FSB*

d) 2.4-GHz Intel® Xeon™ processor 3060, dualcore, 4-MB cache, 1066-MHz FSB*

e) 2.8-GHz Intel® Pentium® D 820 processor, dual-core, 2 × 1-MB cache, 800-MHz FSB*

418779-001 Optional2

436522-001 Optional2

436523-001 Optional2

432943-001 Optional2

436421-001 Optional2

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Item Description Spare part number Customer self repair

(on page 5)

10 Heatsink 432929-001 Optional2

11 Memory — —

12 PCI riser board assembly with PCIe riser boards

13 PCI-X riser board* 409451-001 Optional2

14 Media cage — —

15 CD-ROM drive* 390629-001 Optional2

16 DVD-ROM drive* 383981-001 Optional2

17 DVD-RW drive* 398663-001 Optional2

18 Diskette drive* 390530-001 Optional2

19 SATA hard drives — —

f) 3.4-GHz Intel® Pentium® 4 651 processor, 2MB cache, 800-MHz FSB*

a) 512-MB, PC2-5300 DDR ECC Unbuffered DIMM

b) 1-GB, PC2-5300 DDR ECC Unbuffered DIMM*

c) 2-GB, PC2-5300 DDR ECC Unbuffered DIMM*

and bracket

Mass storage devices

a) 80-GB 397551-001 Mandatory1

418787-001 Optional2

433555-001 Mandatory1

432930-001 Mandatory1

433935-001 Mandatory1

432936-001 Optional2

20 SAS hard drives* — —

21 Miscellaneous plastics kit* 378632-001 Mandatory1

22 Power cord* 378675-001 Mandatory1

23 Battery, 3-V lithium* 234556-001 Optional2

24 Hard drive cable* 432927-001 Optional2

b) 160-GB* 397552-001 Mandatory1 c) 250-GB* 397553-001 Mandatory1 d) 500-GB* 395501-001 Mandatory1 e) 750-GB* 432401-001 Mandatory1

a) 36-GB 376593-001 Mandatory1 b) 72-GB 376594-001 Mandatory1 c) 146-GB 376595-001 Mandatory1

Miscellaneous

a) Air baffle — — b) PCI card guide* — — c) Bezel screws, T-15* — — d) Serial label pull tab* — —

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Item Description Spare part number Customer self repair

(on page 5)

25 Optical drive cable* 433137-001 Optional2

26 Diskette drive cable* 433138-001 Optional2

27 USB cable* 432938-001 Optional2

28 Cable management arm kit* 360105-001 Mandatory1

29 Rack-mounting hardware kit* 360104-001 Mandatory1 *Not shown

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

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Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

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Removal and replacement procedures

Required tools

You need the following items for some procedures:

• T-10/T-15 Torx screwdriver (included with the server)

• HP Insight Diagnostics software ("HP Insight Diagnostics" on page 62)

Safety considerations

Before performing service procedures, review all the safety information.

Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure.

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This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,

do not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to

cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment,

observe local occupational health and safety requirements and guidelines for manual material handling.

12.27 kg

27.00

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords

to completely disconnect power from the system.

Rack warnings

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:

• The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizing feet are attached to the rack if it is a single-rack installation.

• The racks are coupled together in multiple-rack installations.

• Only one component is extended at a time. A rack may become unstable if more than one

component is extended for any reason.

WARNING: To reduce the risk of personal injury or equipment damage when unloading a

rack:

• At least two people are needed to safely unload the rack from the pallet. An empty 42U

rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and may become unstable when being moved on its casters.

• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always

handle the rack from both sides.

WARNING: To reduce the risk of personal injury or damage to the equipment, adequately

stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended.

WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately

secured at the top and bottom to the building structure.

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Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Do not disable the power cord grounding plug. The grounding plug is an important safety

feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all

times.

• Unplug the power cord from the power supply to disconnect power to the equipment.

• Do not route the power cord where it can be walked on or pinched by items placed against

it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Extend the server from the rack, if applicable ("Extend the server from the rack" on page 25).

If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.racksolutions.com/hp

• Power down the server (on page 26).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Remove the server from the rack (on page 26).

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

Extend the server from the rack

NOTE: If the optional cable management arm option is installed, you can extend the server

without powering down the server or disconnecting peripheral cables and power cords. These steps are only necessary with the standard cable management solution.

1. Power down the server (on page 26).

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2. Disconnect all peripheral cables and power cords from the server rear panel.

3. Loosen the thumbscrews that secure the server faceplate to the front of the rack.

4. Extend the server on the rack rails until the server rail-release latches engage.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack

is adequately stabilized before extending a component from the rack.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-

release latches and sliding the server into the rack. The sliding rails could pinch your fingers.

5. After performing the installation or maintenance procedure:

a. Slide the server fully into the rack. b. Secure the server by tightening the thumbscrews.

6. Connect all peripheral cables and power cords.

Power down the server

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some

1. Back up the server data.

2. Shut down the operating system as directed by the operating system documentation.

3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on

4. Press the Power On/Standby button to place the server in standby mode. When the server activates

5. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button.

6. Disconnect the power cords.

internal circuitry remain active until AC power is removed.

IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.

the front and rear panels of the server.

standby power mode, the system power LED changes to amber.

The system is now without power.

Remove the server from the rack

To remove the server from an HP, Compaq branded, telco, or third-party rack:

1. Power down the server (on page 26).

2. Disconnect all peripheral cables and power cords from the server rear panel.

3. Disconnect the cable management arm, if necessary. For more information, refer to the

documentation that ships with the cable management arm.

4. Loosen the thumbscrews that secure the server faceplate to the front of the rack.

5. Extend the server from the rack (on page 25).

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6. Disengage the server from the rack. For more information, refer to the documentation that ships with

the rack mounting option.

7. Place the server on a sturdy, level surface.

Access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server before

beginning any installation procedure. Improper grounding can cause ESD.

1. Identify the proper server in the server blade enclosure.

2. Back up all server data.

3. Power down the server (on page 26).

4. Remove the server ("Remove the server from the rack" on page 26).

5. Loosen the thumbscrew on the rear of the access panel.

6. Press down on the thumb indentations, slide the access panel toward the rear of the unit about 1.25

cm (0.5 in), and lift to remove the panel.

Hard drives

To remove the component:

1. Back up all data on the hard drive.

2. Power down the server (on page 26).

3. Remove the hard drive.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

all bays are populated with either a component or a blank.

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To replace the component, reverse the removal procedure. When adding hard drives to the server, observe the following general guidelines:

• The system automatically sets all drive numbers.

• If only one hard drive is used, install it in the bay with the lowest drive number.

• Drives must be the same capacity to provide the greatest storage space efficiency when drives are

grouped together into the same drive array.

Optional storage controllers provide support for hot-plug capability and drive LEDs. Controller options are:

• The embedded controller supports non-hot-plug SATA hard drives. Drive LEDs are not supported.

• Optional SATA controllers support hot-plug SATA hard drives and drive LEDs.

• Optional SAS controllers support hot-plug SAS or SATA hard drives and drive LEDs.

NOTE: ACU does not support mixing SAS and SATA drives in the same logical volume.

Hard drive blanks

Remove the component as indicated.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

all bays are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

SAS/SATA backplane

To remove the component:

1. Power down the server (on page 26).

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2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Disconnect all cables connected to the SAS/SATA backplane.

5. Remove all hard drives ("Hard drives" on page 27).

6. Remove all hard drive blanks ("Hard drive blanks" on page 28).

7. Remove the SAS/SATA backplane.

To replace the component, reverse the removal procedure.

Air baffle

To install the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

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3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle.

To replace the component, reverse the removal procedure.

Fan assembly

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Disconnect the fan cables from the system board.

6. Remove the fan assembly.

To replace the component, reverse the removal procedure.

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BBWC battery holder

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Remove the BBWC battery holder.

To replace the component, reverse the removal procedure.

BBWC battery

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Disconnect the BBWC cable ("Battery-backed write cache cable routing" on page 61).

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8. Remove the BBWC holder and battery.

To replace the component, reverse the removal procedure.

Media cage

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Disconnect the power button/LED board cable ("Power button/LED board" on page 36).

8. Remove the BBWC battery holder and optional battery with cable, if installed ("BBWC battery

all bays are populated with either a component or a blank.

holder" on page 31).

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9. Remove the media cage.

To replace the component, reverse the removal procedure.

Optical drive

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Disconnect the power button/LED board cable ("Power button/LED board" on page 36).

8. Remove the BBWC battery holder and optional battery with cable, if installed ("BBWC battery

9. Remove the media cage ("Media cage" on page 32).

all bays are populated with either a component or a blank.

holder" on page 31).

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10. Remove the optical drive.

To replace the component, reverse the removal procedure.

Diskette drive

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Disconnect the power button/LED board cable ("Power button/LED board" on page 36).

8. Remove the BBWC battery holder and optional battery with cable, if installed ("BBWC battery

9. Remove the media cage ("Media cage" on page 32).

all bays are populated with either a component or a blank.

holder" on page 31).

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10. Remove the diskette drive.

To replace the component, reverse the removal procedure.

Front video connector

To remove the component:

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Disconnect the power button/LED board cable ("Power button/LED board" on page 36).

8. Remove the BBWC battery holder and optional battery with cable, if installed ("BBWC battery

9. Remove the media cage ("Media cage" on page 32).

all bays are populated with either a component or a blank.

holder" on page 31).

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10. Remove the front video connector.

To replace the component, reverse the removal procedure.

Power button/LED board

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the fan assembly ("Fan assembly" on page 30).

6. Disconnect cables from any devices installed in the media cage, if necessary.

7. Remove the BBWC battery holder and optional battery with cable, if installed ("BBWC battery

holder" on page 31).

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8. Disconnect the power button/LED board cable.

9. Remove the media cage ("Media cage" on page 32).

10. Remove the power button/LED board.

To replace the component, reverse the removal procedure.

Front bezel

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

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3. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it

from the chassis.

4. Remove the access panel ("Access panel" on page 27).

5. Remove all hard drives ("Hard drives" on page 27).

6. Remove all hard drive blanks ("Hard drive blanks" on page 28).

7. Remove the media cage ("Media cage" on page 32).

8. Use the T-10 Torx screwdriver to loosen the two T-10 screws on each side of the front bezel. The T-

10/T-15 Torx screwdriver is located on the rear of the server.

9. Slide the bezel to the left, release the USB cover by gently lifting the plastic latch, and then detach

the bezel.

To replace the component, reverse the removal procedure.

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PCI riser board assembly

To remove the component:

CAUTION: To prevent damage to the server or expansion boards, power down the server and

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Disconnect any internal or external cables connected to any existing expansion boards.

5. Remove the PCI riser board assembly.

remove all AC power cords before removing or installing the PCI riser board assembly.

To replace the component, reverse the removal procedure.

Expansion boards

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 39).

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5. Remove any installed expansion boards.

To replace the component, reverse the removal procedure.

Storage controller

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Disconnect the storage controller cable.

5. Remove the PCI riser board assembly ("PCI riser board assembly" on page 39).

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6. Remove the storage controller.

To replace the component, reverse the removal procedure.

PCI Express or PCI-X riser board

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 39).

5. Remove the expansion board ("Expansion boards" on page 39).

6. Remove the PCI Express or PCI-X riser board.

To replace the component, reverse the removal procedure.

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DIMMs

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Open the DIMM slot latches.

5. Remove the DIMM.

To replace the component, reverse the removal procedure.

Memory options

The server memory can be expanded by installing PC5300 DDR2 unbuffered SDRAM DIMMs. The server supports up to four ECC DDR2 SDRAM DIMMs.

The server supports standard memory configuration for maximum performance with up to 8 GB of active memory (four 2-GB memory modules).

DIMM installation guidelines

Observe the following guidelines when installing additional memory:

• DIMMs installed in the server must be unbuffered DDR2 SDRAM, 2.5 V, 64 bits wide, and ECC.

• All DIMMs installed must be the same speed (DDR2 PC5300). Do not install DIMMs supporting

different speeds.

• If only a single DIMM is installed, HP recommends installing it in slot 1A.

BIOS detects the DIMM population and sets the system as follows:

• Single-bank mode: DIMMs installed in one bank only.

• Dual-bank interleaved mode: DIMMs installed in both banks with equal bank capacities.

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The following table lists some, but not all, possible configurations. For best performance, HP recommends dual-bank interleaved mode configurations.

Slot 1A Slot 2B Slot 3A Slot 4B Total memory Mode

512 MB — — — 512 MB Single-bank 512 MB — 512 MB — 1 GB Dual-bank interleaved 1 GB — — — 1 GB Single-bank 1 GB — 1 GB — 2 GB Dual-bank interleaved 1 GB 1 GB 1 GB 1 GB 4 GB Dual-bank interleaved

Interleaving and non-interleaving memory configuration

The server supports interleaving and non-interleaving memory configurations. Interleaving memory increases bandwidth by enabling simultaneous access to multiple blocks of data. For example, to overlap read-writes, the server divides the system memory between pairs of DIMMs, and then writes to and reads from each DIMM concurrently. For an interleaving configuration, always install identical DIMMs in pairs. For a non-interleaving configuration, install a single DIMM in slot 1 only.

Power supply

To remove the component:

1. Power down the server (on page 26).

2. Remove the server from the rack (on page 26).

3. Remove the access panel ("Access panel" on page 27).

4. Unfasten the cable clip and lift the cables to access the front screw.

5. Remove the three screws that secure the power supply unit to the chassis.

6. Disconnect the removable media and hard drive power cables.

7. Disconnect the auxiliary power supply cable and the main power supply cable from the system

board by pressing each locking tab on the side of the connector and pulling upwards.

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8. Remove the power supply.

To replace the component, reverse the removal procedure.

Heatsink

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the air baffle ("Air baffle" on page 29).

5. Loosen the four screws securing the heatsink.

a. Loosen each screw three or four turns in the counterclockwise direction. b. Fully loosen the screws to free the heatsink, being careful not to remove the screw assemblies

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent thermal instability and damage to the server, do not separate the

processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.

CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or

cache sizes. Refer to the label on the processor heatsink for a description of the processor.

from the heatsink.

CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite

pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws.

Removal and replacement procedures 44

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6. Remove the heatsink.

To replace the component:

IMPORTANT: When replacing the heatsink, check the label on top to be sure the heatsink is

properly oriented.

1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol

to evaporate before continuing.

CAUTION: After the cover is removed, do not touch the thermal interface media.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

2. Remove the protective cover from the heatsink.

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CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite

pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of

3. Install the heatsink.

overtightening the screws.

4. Install the air baffle.

5. Install the access panel.

Processor

To remove the component:

1. Power down the server (on page 26).

2. Extend the server from the rack (on page 25).

3. Remove the access panel ("Access panel" on page 27).

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent thermal instability and damage to the server, do not separate the

processor from the heatsink. The processor, heatsink, and retaining clip make up a single assembly.

CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or

cache sizes. Refer to the label on the processor heatsink for a description of the processor.

4. Remove the air baffle ("Air baffle" on page 29).

5. Remove the heatsink ("Heatsink" on page 44).

Removal and replacement procedures 46

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6. Open the processor retaining latch and the processor socket retaining bracket.

7. Using your fingers, remove the failed processor.

To replace the component:

IMPORTANT: Be sure the processor remains inside the processor installation tool.

Removal and replacement procedures 47

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1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.

2. Align the processor installation tool with the socket and install the spare processor.

CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides

on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.

Removal and replacement procedures 48

Page 49

3. Press down firmly until the processor installation tool clicks and separates from the processor, and

then remove the processor installation tool.

4. Close the processor retaining latch and the processor socket retaining bracket.

5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to

evaporate before continuing.

Removal and replacement procedures 49

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6. Apply all the grease to the top of the processor in one of the following patterns to ensure even

distribution:

CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite

pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of

7. Install the heatsink.

overtightening the screws.

8. Install the air baffle.

9. Install the access panel.

System board

To remove the component:

1. Power down the server (on page 26).

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2. Remove the server from the rack (on page 26).

3. Remove the access panel ("Access panel" on page 27).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 39).

5. Remove all DIMMs ("DIMMs" on page 42).

6. Remove the air baffle ("Air baffle" on page 29).

7. Remove the fan assembly ("Fan assembly" on page 30).

8. Disconnect the power supply cables from the system board.

9. Disconnect the SATA hard drive cables from the system board ("Cabling" on page 58, "Server cable

routing" on page 58).

10. Disconnect the media cage cables and the power button/LED board cable from the system board.

11. Remove the heatsink ("Heatsink" on page 44).

12. Open the processor retaining latch and the processor socket retaining bracket on the failed system

board.

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13. Using your fingers, remove the processor from the failed system board.

CAUTION: To avoid damage to the system board:

• Do not touch the processor socket contacts.

• Always install the processor socket cover after removing the processor from the socket.

• Do not tilt or slide the processor when lowering the processor into the socket.

CAUTION: To avoid damage to the processor:

• Handle the processor only by the edges.

14. Remove the seven T-15 screws securing the failed system board.

15. Remove the failed system board.

• Do not touch the bottom of the processor, especially the contact area.

To replace the system board:

1. Install the spare system board in the server.

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2. Prepare the processor socket on the spare system board:

a. Open the processor retaining latch and the processor socket retaining bracket.

b. Remove the processor socket protective cover.

3. Install the processor socket cover onto the processor socket of the failed system board.

4. Install the processor on the spare system board.

CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides

on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.

CAUTION: Always install the processor parallel to the system board to avoid damage to the

pins.

Removal and replacement procedures 53

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5. Close the processor retaining latch and the processor socket retaining bracket.

6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.

Allow the alcohol to evaporate before continuing.

Removal and replacement procedures 54

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7. Apply all the grease to the top of the processor in one of the following patterns to ensure even

distribution:

CAUTION: Heatsink retaining screws should be tightened or loosened in diagonally opposite

pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Use the wrench supplied with the system to reduce the possibility of

8. Install the heatsink.

overtightening the screws.

IMPORTANT: To ensure proper cooling, be sure the processor air baffle is installed at all times

(if applicable).

9. Install all components removed from the failed system board.

IMPORTANT: Install all components with the same configuration that was used on the failed

system board.

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10. Install the access panel.

11. Power up the server.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access RBSU.

2. Select the Advanced Options menu.

3. Select Serial Number. The following warning is displayed:

Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.

4. Press the Enter key to clear the warning.

5. Enter the serial number.

6. Select Product ID. The following warning is displayed.

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

7. Enter the product ID and press the Enter key.

8. Press the Esc key to close the menu.

9. Press the Esc key to exit RBSU.

10. Press the F10 key to confirm exiting RBSU. The server will automatically reboot.

Battery

If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

To remove the component:

1. Power down the server (on page 26).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 25).

3. Remove the access panel ("Access panel" on page 27).

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium

pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

• Replace only with the spare designated for this product.

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 39).

CAUTION: To prevent damage to the server or expansion boards, power down the server and

remove all AC power cords before removing or installing the PCI riser cage.

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5. Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default

configuration. After replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an

authorized service provider.

Removal and replacement procedures 57

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Cabling

Server cable routing

CAUTION: When routing cables, always be sure that the cables are not in a position where

they can be pinched or air flow can be blocked.

IMPORTANT: Route the cables without blocking the airflow or other installed components. Use

the cable clips installed in the chassis to manage cable routing.

Embedded SATA controller cable routing

CAUTION: When routing cables, always be sure that the cables are not in a position where

they can be pinched or air flow can be blocked.

Cabling 58

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Optional SAS/SATA controller cable routing

CAUTION: When routing cables, always be sure that the cables are not in a position where

Slot 2

they can be pinched or air flow can be blocked.

Cabling 59

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Slot 1

Video connector option cable routing

Cabling 60

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Battery-backed write cache cable routing

Cabling 61

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Diagnostic tools

Troubleshooting resources

The HP ProLiant Servers Troubleshooting Guide provides simple procedures for resolving common problems as well as a comprehensive course of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance.

To obtain the guide, refer to any of the following sources and then select the HP ProLiant Servers Troubleshooting Guide:

• The server-specific Documentation CD

• The Business Support Center on the HP website (http://www.hp.com/support). Navigate to the

server technical support page. Under self-help resources, select ProLiant Troubleshooting Guide.

• The Technical Documentation website (http://www.docs.hp.com). Select Enterprise Servers,

Workstations and Systems Hardware, and then the appropriate server.

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags

HP Insight Diagnostics survey functionality

HP Insight Diagnostics (on page 62) provides survey functionality that gathers critical hardware and software information on ProLiant servers.

This functionality supports operating systems that may not be supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP.

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NOTE: The current version of SmartStart provides the memory spare part numbers for the

server. To download the latest version, see the HP website (http://www.hp.com/support

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM ("HP Systems Insight Manager" on page 63)

• From within Survey Utility

• From within operating system-specific IML viewers

o For NetWare: IML Viewer o For Windows®: IML Viewer o For Linux: IML Viewer Application

• From within the iLO 2 user interface

• From within HP Insight Diagnostics (on page 62)

For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.

Array Diagnostic Utility

The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage controllers and disk drives. This report provides vital information to assist in identifying faults or conditions that may require attention. ADU can be accessed from the SmartStart CD or downloaded from the HP website (http://www.hp.com

HP Systems Insight Manager

HP SIM is a web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a web browser. HP SIM provides device management capabilities that consolidate and integrate management data from HP and third-party devices.

IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for

For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website (http://www.hp.com/go/hpsim

processors, SAS and SCSI hard drives, and memory modules.

Diagnostic tools 63

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Component identification

Front panel components

Item Description

1 Serial label pull tab 2 Hard drive bay 1 3 Hard drive bay 2 4 Diskette drive/video connector bay 5 Optical drive bay 6 Front USB connector 7 Power On/Standby button and system power LED

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Front panel LEDs and buttons

Item Description Status

1 UID button/LED Blue = Identification is activated.

Flashing blue = System is being remotely managed. Off = Identification is deactivated.

2 Internal health LED Green = System health is normal.

Amber = System is degraded. To identify the component in a degraded state, refer to system board LEDs.

Red = System critical. To identify the component in a critical state, refer to system board LEDs.

Off = System health is normal (when in standby mode).

3 NIC 1 link/activity LED Green = Network link exists.

Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, view the LEDs on the RJ-45 connector for status by

referring to the rear panel LEDs (on page 67).

4 NIC 2 link/activity LED Green = Network link exists.

Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on

the RJ-45 connector for status by referring to the rear panel LEDs (on page 67).

5 Drive activity LED Green = Drive activity is normal.

Amber = Drive failure occurred. Off = No drive activity.

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Item Description Status

6 Power On/Standby button

and system power LED

Green = System is on. Amber = System is shut down, but power is still applied. Off = Power cord is not attached, power supply failure has

occurred, no power supplies are installed, facility power is not available, or the DC-to-DC converter is not installed.

Rear panel components

Item Description

1 PCI Express expansion slot 2, (optional PCI-X, full-length) 2 PCI Express expansion slot 1, low-profile, half-length 3 Power supply 4 UID button/LED 5 10/100/1000 NIC 2 6 10/100/1000 NIC 1 7 iLO 2 management port 8 Serial connector 9 Keyboard connector 10 Mouse connector 11 Video connector 12 USB connectors (2)

PCI expansion slot definitions

Slot Type Length Connector Interconnect

1 PCI Express Half x8 x1

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Slot Type Length Connector Interconnect

2 PCI Express Full x8 x8

Optional PCI-X Full 133 MHz/3.3 V 64 bit

Rear panel LEDs

Item Description Status

1 iLO 2 activity Green = Activity exists.

2 iLO 2 link Green = Link exists.

3 10/100/1000

NIC 1 activity

4 10/100/1000

NIC 1 link

5 10/100/1000

NIC 2 activity

6 10/100/1000

NIC 2 link

Flashing green = Activity exists. Off = No activity exists.

Off = No link exists. Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. Green = Link exists. Off = No link exists. Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. Green = Link exists. Off = No link exists.

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System board components

Item Description Item Description

1 PCI Express x8 connector

or optional PCI-X 133-MHz

connector 2 PCI Express x1 connector 14 Fan 3 and 4 connector 3 Video option connector 15 Fan 5 and 6 connector 4 System maintenance switch 16 Fan 7 and 8 connector 5 NMI switch 17 Main power connector 6 Battery 18 Processor socket 7 Hard drive connector 1 19 Auxiliary power connector 8 Hard drive connector 2 20 DIMM slot 1 (bank A) 9 Front panel LED board

connector 10 Front USB connector 22 DIMM slot 3 (bank A)

11 Fan 1 and 2 connector 23 DIMM slot 4 (bank B) 12 Optical drive connector — —

13 Diskette drive connector

21 DIMM slot 2 (bank B)

System maintenance switch

Position Default Function

S1 Off Off = iLO 2 security is enabled

On = iLO 2 security is disabled

S2 Off Off = Normal operation

On = RBSU will not commit any configuration changes *

S3 Off Reserved

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Position Default Function

S4 Off Off = Normal operation

S5 Off Off = Power-on password enabled

S6 Off Off = Normal operation

S7 Off Reserved

S8 Off Reserved

* "On" activates the function.

NMI functionality

On = Override RBSU setting and enable diskette boot *

On = Power-on password disabled *

On = BIOS will clear CMOS and NVRAM *

An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.

To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do any of the following:

• Short the NMI jumper pins

• Press the NMI switch

• Use the iLO Virtual NMI feature

For additional information, see the whitepaper on the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf

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System board LEDs

Item LED description Status

1 Reserved — 2 Overtemperature Amber = System has reached a cautionary or

critical temperature level. Off = Temperature is OK.

3 Fan 1 and 2 Amber = One or more fans in this module

have failed. Off = All fans in this module are operating

normally.

4 Processor Amber = Processor has failed.

Off = Processor is operating normally.

5 Fan 3 and 4 Amber = One or more fans in this module

have failed. Off = All fans in this module are operating

normally.

6 Fan 5 and 6 Amber = One or more fans in this module

have failed. Off = All fans in this module are operating

normally.

7 Fan 7 and 8 Amber = One or more fans in this module

have failed. Off = All fans in this module are operating

normally.

8 PPM Amber = PPM has failed.

Off = PPM is operating normally.

9 DIMM 4 Amber = DIMM has failed.

Off = DIMM is operating normally.

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Item LED description Status

10 DIMM 3 Amber = DIMM has failed.

Off = DIMM is operating normally.

11 DIMM 2 Amber = DIMM has failed.

Off = DIMM is operating normally.

12 DIMM 1 Amber = DIMM has failed.

Off = DIMM is operating normally.

13 Power on Green = System board power is normal.

Off = System board power has failed.

System LEDs and internal health LED combinations

When the internal health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated system LEDs and the internal health LED indicate system status.

The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may report server status differently than the health LEDs because the software tracks more system attributes.

System LED and Color

Processor failure (amber)

Internal Health

Status

LED Color

Red One or more of the following conditions may exist:

• Processor has failed.

• Processor failed over to the offline spare.

• Processor is not installed in the socket.

• Processor is unsupported.

• ROM detects a failed processor during POST.

Amber Processor is in a pre-failure condition.

PPM failure (amber) Red PPM has failed. DIMM failure, slot X

(amber)

Red

Amber

• DIMM in slot X has failed.

• DIMM in slot X is an unsupported type, and no valid

memory exists in another bank.

• DIMM in slot X has reached single-bit correctable error

threshold.

• DIMM in slot X is in a pre-failure condition.

• DIMM in slot X is an unsupported type, but valid

memory exists in another bank.

DIMM failure, all slots in one bank (amber)

Overtemperature (amber)

Riser interlock (amber) Red The PCI riser board assembly is not seated.

Red No valid or usable memory is installed in the system.

Amber The Health Driver has detected a cautionary temperature

level.

Red The server has detected a hardware critical temperature

level.

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System LED and Color

Fan module (amber) Amber A redundant fan has failed. Fan module (red) Red The minimum fan requirements are not being met in one or

Power supply signal interlock (amber)

Internal Health LED Color

Red The power supply signal cable is not connected to the

Internal USB connector

Status

more of the fan modules. One or more fans have failed or are missing.

system board.

SATA and SAS device numbers

Component identification 72

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Item Description

1 Device 1 2 Device 2

Fan assembly location

Component identification 73

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Specifications

Environmental specifications

Specification Value

Temperature

Operating1 10°C to 35°C (50°F to 90°F) Non-operating 30°C to 60°C (-22°F to 140°F)

Maximum rate of temperature change

Operating Non-operating 20°C/hr (36°F/hr)

Relative humidity (noncondensing)***

Operating 10% to 90% Non-operating 5% to 95%

Maximum wet bulb temperature (non-condensing)

Operating 28°C (82.4°F) Non-operating 38.7°C (101.7°F) Altitude Operating2 3,050 m (10,000 ft) Non-operating 9144 m (30,000 ft)

Maximum rate of altitude change

Operating 457 m/min (1,500 ft/min) Non-operating 457 m/min (1,500 ft/min)

All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048

m (10,000 ft) is applicable. No direct sunlight allowed.

The type and number of options installed can limit the upper limit.

System performance may be reduced if operating with a fan fault above 30ºC (86ºF).

2,3

10°C/hr (18°F/hr)

Server specifications

Specification Value

Dimension

Height 4.32 cm (1.70 in) Depth 60.96 cm (24 in)

Specifications 74

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Specification Value

Width 42.62 cm (16.78 in) Weight (maximum) 12.27 kg (27.0 lb) Weight (no drives installed) 10.91 kg (24.0 lb)

Input requirement

Rated line voltage 90 VAC to 264 VAC Rated input frequency 47 Hz to 63 Hz Rated input current 6.0 A (100 to 120 VAC) to

3.0 A (200 to 240 VAC)

Rated input power 486 W at 115 V (assume 350 W

output) 479 W at 230 V (assume 350 W

output)

BTUs per hour 1710

Power supply output

Rated steady-state power 420 W Acoustic noise* Sound power, L Idle Operating Bystander sound pressure,

pAm

Idle Operating

*The limits apply when operated in an ambient environment temperature of +23°C ± 2° (+73.4°F ± 2°).

WAd

6.22 Bels

6.3 Bels

44.1 dBA

44.9 dBA

Specifications 75

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Acronyms and abbreviations

ACU

Array Configuration Utility

ADU

Array Diagnostics Utility

BBWC

battery-backed write cache

BIOS

Basic Input/Output System

CMOS

complementary metal-oxide semiconductor

CSR

Customer Self Repair

DDR2

double data rate-2

ECC

error checking and correcting

iLO 2

Integrated Lights-Out 2

IML

Integrated Management Log

NIC

network interface controller

NMI

non-maskable interrupt

Acronyms and abbreviations 76

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NVRAM

non-volatile memory

PCI

peripheral component interface

PCI-X

peripheral component interconnect extended

PCIe

peripheral component interconnect express

POST

Power-On Self Test

RBSU

ROM-Based Setup Utility

SAS

serial attached SCSI

SATA

serial ATA

SDRAM

synchronous dynamic RAM

UID

unit identification

USB

universal serial bus

Acronyms and abbreviations 77

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Index

access panel 16 ADU (Array Diagnostic Utility) 63 air baffle 29 Array Diagnostic Utility (ADU) 63

battery 19, 56, 68, 69 battery-backed write cache battery holder 31 battery-backed write cache battery pack 31 bezel, front 16, 37 bezel, server 16, 37 blue screen event 69 buttons 64

cable management arm 19 cables 19, 58, 59 cabling 58, 59, 60, 61 cautions 25 CD-ROM drive 19 component identification 64, 68, 69 components 16, 62, 64 components, mechanical 16 components, system 19 connectors 64 controller 40, 58, 59 crash dump analysis 69 CSR (customer self repair) 5 customer self repair (CSR) 5

device numbers 72 diagnostic tools 62 diagnostics utility 62 DIMM installation guidelines 42 DIMM slot LEDs 70 DIMM slots 68 DIMMs 19, 42, 43 diskette drive 19, 34, 64 diskette drive cable 19, 58

diskette drive connectors 68 drive bays 64 DVD±RW drive 19 DVD-ROM drive 19

electrostatic discharge 23 environmental specifications 74 expansion board 39, 58, 59 expansion slots 66 extending server from rack 25 external health LED 65

fan assembly 19, 30, 73 fan connectors 68 fan LED 70 fans 73 features 64 front bezel 16, 37 front panel components 64 front panel LEDs 65 front panel/LED board connector 68 front video connector 35

hard drive backplane 23, 28 hard drive blanks 28 hard drive cable 19, 58, 59 hard drive connector 68 hard drive, replacing 27 hard drives 27, 64 health LEDs 65, 69 heatsink 19, 44 HP Insight Diagnostics 62 HP ProLiant Essentials Foundation Pack 63 HP Systems Insight Manager, overview 63

illustrated parts catalog 16 IML (Integrated Management Log) 63 Insight Diagnostics 62

Index 78

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Integrated Management Log (IML) 63 interleaving memory configuration 43 internal health LED 65, 71 internal USB connector 72

LED, DIMM slot 70 LED, drive activity 65 LED, fan 70 LED, iLO NIC 67 LED, overtemperature 70 LED, power on 70 LED, PPM 70 LED, processor 70 LED, UID 65 LEDs 64 LEDs, NIC 67

management tools 62 mechanical components 16 media cage 19, 32 memory 19, 42, 43 memory dump 69

NIC LEDs 65, 67 NMI switch 68, 69 non-interleaving memory configuration 43

operating system crash 69 optical drive 33 optical drive cable 19, 58 optical drive connector 68 overtemperature LED 70

part numbers 16 PCI expansion slot definitions 66 PCI Express connector 68 PCI Express riser boards 19, 41 PCI riser board assembly 19, 39 PCI-X riser board 19, 41 plastics kit 19 power button/LED board 19, 36 power connectors, internal 68 power cord 19

power LEDs, system 65 power on LED 70 Power On/Standby button 26, 64, 65 power supplies 19, 43 power supply LEDs 71 powering down 26 PPM failure LEDs 71 PPM LED 70 processor 19, 42, 46 processor failure LEDs 70 processor LED 70 processor socket 68

rack warnings 24 rear panel components 66 rear panel LEDs 67 removal and replacement procedures 23 resetting the system 69

safety considerations 23 safety information 23 SAS backplane 19, 28 SAS hard drive 19 SATA backplane 19, 28 SATA hard drive 19 serial connector 68 serial label pull tab 37, 64 server specifications 74 spare part numbers 16, 19 specifications 74 specifications, environmental 74 specifications, server 74 static electricity 23 storage controller 40, 59 switch, NMI 68, 69 switches 68, 69 symbols on equipment 23 system board 19, 50 system board battery 68 system board LEDs 71 system maintenance switch 68, 69 Systems Insight Manager 63

tools 23, 62

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UID LED 26, 65, 69 USB connectors 64, 68, 72 utilities 62

video connector 35, 64, 68

warnings 25 warranty 5, 16

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