SERVICE MANUAL
HP 1650B/1651B
Logic Analyzer
SERIAL NUMBERS
This manual applies directly to instruments
For additional information about serial numbers see
INSTRUMENTS COVERED BY THIS MANUAL
ã
COPYRIGHT HEWLETT-PACKARD COMPANY/COLORADO DIVISION 1989
1900 GARDEN OF THE GODS ROAD, COLORADO SPRINGS, COLORADO U.S.A.
prefixed with serial number:
2924A
in Section 1.
ALL RIGHTS RESERVED
Manual Part No. 01650-90915
Microfiche Part No. 01650-90815
Printed in U.S.A. August 1989
Herstellerbescheinigung
Hiermit wird bescheinigt, dab das Gerät/System in Ü bereinstimmung mit den
Bestimmungen von Postverfügung 1046/84 funkentstört ist.
Der Deutschen Bundespost wurde das Inverkehrbringen dieses Gerätes/Systems
angezeigt und die Berechtigung zur Überprüfung der Serie auf Einhaltung der
Bestimmungen eingeräumt.
b
Zusatzinformation für Me
b
Werden Me
b
aufbauten verwendet, so ist vom Betreiber sicherzustellen, dab die
Me
Funkentstörbestimmungen unter Betriebsbedingungen an seiner
Grundstücksgrenze eingehalten werden.
- und Testgeräte mit ungeschirmten Kabeln und/oder in offenen
- und Testgeräte
Manufacturer’s declaration
This is to certify that this product meets the radio frequency interference
requirements of directive 1046/84. The G erman Bundespost has been notified that
this equipment was put into circulation and was granted the right to check the
product type for compliance with these requirements.
Additional Information for Test and Measurement Equipment
Note: If test and measurement equipment is operated with unshielded cables
and/or used for measurements on open set-ups, the user must insure that under
these operating conditions, the radio frequency interference limits are met at the
border of his premises.
ii
CERTIFICATION
Hewlett-Packard Company certifies that this product met its published specifications at the time of shipment from the factory. Hewlett-Packard further certifies that its calibration measurements are traceable to
the United States National Institute of Standards and Technology, to the extent allowed by the Institute’s
calibration facility, and to the calibration facilities of other International Standards Organization members.
WARRANTY
This Hewlett-Packard product is warranted against defects in material and workmanship for a period of
one year from date of shipment. During the warranty period, Hewlett-Packard Company will, at its option,
either repair or replace products which prove to be defective.
For warranty service or repair, this product must be returned to a service facility designated by HP. Buyer
shall prepay shipping charges to HP and HP shall pay shipping charges to return the product to Buyer.
However, Buyer shall pay all shipping charges, duties, and taxes for products returned to HP from another
country.
HP warrants that its software and firmware designated by HP for use with an instrument will execute its
programming instructions when properly installed on that instrument. HP does not warrant that the
operation of the instrument or software, or firmware will be uninterrupted or error free.
LIMITATION OF WARRANTY
The foregoing warranty shall not apply to defects resulting from improper or inadequate maintenance by
Buyer, buyer-supplied software or interfacing, unauthorized modification or misuse, operation outside the
environmental specifications for the product, or improper site preparation or maintenance.
NO OTHER WARRANTY IS EXPRESSED OR IMPLIED. HP SPECIFICALLY DISCLAIMS THE IMPLIED
WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
EXCLUSIVE REMEDIES
THE REMEDIES PROVIDED HEREIN ARE BUYER’S SOLE AND EXCLUSIVE REMEDIES. HP SHALL NOT
BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES,
WHETHER BASED ON CONTRACT, TORT, OR ANY OTHER LEGAL THEORY.
ASSISTANCE
Product maintenance agreements and other customer assistance agreements are available for
Hewlett-Packard products.
For any assistance, contact your nearest Hewlett-Packard Sales and Service Office. Addresses are
provided at the back of this manual.
CWA789
iii
Safety Considerations
General
Operation
General
Warnings and
Cautions
This is a Safety Class I instrument (provided with terminal for protective earthing). BEFO RE
APPLYING POWER verify that the power transformer primary is matched to the available line
voltage, the correct fuse is installed, and Safety Precautions are taken (see the following warnings).
In addition, note the instrument’s external markings which are described under "Safety Symbols."
·
BEFORE SWITCH ING ON T HE INSTRUMENT, the protective earth terminal of the
instrument must be connected to the protective conductor of the (mains) powercord. The mains
plug shall only be inserted in a socket outlet provided with a protective earth contact. The
protective action must not be negated by the use of an extension cord (power cable) without a
protective conductor (grounding). Grounding one conductor of a two-conductor outlet is not
sufficient protection.
·
Servicing instructions are for use by service-trained personnel. To avoid dangerous electric shock,
do not perform any servicing unless qualified to do so.
·
If this instrument is to be energized via an auto-transformer (for voltage reduction) make sure
the common terminal is connected to the earth terminal of the power source.
·
Any interruption of the protective (grounding) conductor (inside or outside the instrument) or
disconnecting the protective earth terminal will cause a potential shock hazard that could result in
personal injur y.
·
Whenever it is likely that the protection has been impaired, the instrument must be made
inoperative and be secured against any unintended operation.
·
Only fuses with the required rated current, voltage, and specified type (normal blow, time delay,
etc.) should be used. Do not use repaired fuses or short circuited fuseholders. To do so could
cause a shock or fire hazard.
·
Do not operate the instrument in the presence of flammable gasses or fumes. Operation of any
electrical instrument in such an environment constitutes a definite safety hazard.
·
Do not install substitute parts or perform any unauthorized modification to the instrument.
·
Adjustments described in the manual are performed with power supplied to the instrument while
protective covers are removed. Energy available at many points may, if contacted, result in
personal injur y.
·
Any adjustment, maintenance, and repair of the opened instrument under voltage should be
avoided as much as possible, and when inevitable, should be carried out only by a skilled person
who is aware of the hazard involved.
·
Capacitors inside the instrument may still be charged even if the instrument has been
disconnected from its source of supply.
Warning
iv
Caution
Safety Symbols
Instruction manual symbol. The product will be marked with this symbol when it is necessary for the
user to refer to the instruction manual in order to protect against damage to the product.
Indicates Hazardous Voltages
Earth terminal (sometimes used in manual to indicate circuit common connected to grounded chassis).
The WARNING sign denotes a hazard. It calls attention to a procedure, practice, or the like, which, if
not correctly performed or adhered to, could result in personal injury. D o not proceed beyond a
WARNING sign until the indicated conditions are fully understood and met.
The CAUTION sign denotes a hazard. It calls attention to an operating procedure, practice, or the
like, which, if not correctly performed or adhered to, could result in damage to or destruction of part
or all of the product. Do not proceed beyond a CAUTION sign until the indicated conditions are fully
understood or met.
Printing History
New editions are complete revisions of the manual. Update packages, which are
issued between editions, contain additional and replacement pages to be merged
into the manual by the customer. The dates on the title page change only when a
new edition is published.
A software and/or firmware code may be printed before the date; this indicates the
version level of the software and/or firmware of this product at the time of the
manual or update was issued. Many product updates and fixes do not require
manual changes and, conversely, manual corrections may be done without
accompanying product changes. Therefore, do not expect a one to one
correspondence between product updates and manual updates.
Edition 1 August 1989 01650-90915
v
List of Effective Pages
The List of Effective Pages gives the date of the current edition and of any pages
changed in updates to that edition. Within the manual, any page changed since the
last edition is indicated by printing the date the changes were made on the bottom
of the page. If an update is incorporated when a new edition of the manual is
printed, the change dates are removed from the bottom of the pages and the new
edition date is listed in Printing History and on the title page.
Pages Effective Date
all . . . . . . . . . . . . . . . . . August 1989
vi
Contents
Section 1: General Information
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Instruments Covered by this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Safety Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Accessories Supplied . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Accessories Available . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Logic Analyzer Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Probes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
State Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Timing Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Probes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Measurement Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
State Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Timing Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Measurement and Display Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Operating Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Recommended Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Section 2: Installation
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Safety Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Initial Inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Line Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Power Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Operating Disk Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Applying Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
HP-IB Interfacing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
HP-IB Address Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
RS-232-C Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
RS-232-C Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Storage and Shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Tagging for Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Original Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Other Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Cleaning Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
HP 1650B/1651B Contents - 1
Service Manual
Section 3: Performance Tests
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Recommended Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Test Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Power-up Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Selectable Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Performance Test Interval. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Clock, Qualifier, and Data Inputs Test 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Clock, Qualifier, and Data Inputs Test 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Clock, Qualifier, and D ata Inputs Test 3 (HP 1650B Only) . . . . . . . . . . . . . . . . . 3-13
Clock, Qualifier, and Data Inputs Test 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Clock, Qualifier, and Data Inputs Test 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Clock, Qualifier, and Data Inputs Test 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Glitch Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
Threshold Accuracy Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28
Section 4: Adjustments
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Calibration Interval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Safety Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Recommended Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Instrument Warmup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Power Supply Assembly Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
CRT Monitor Assembly Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Intensity, Sub-bright, and Contrast Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Focus Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Horizontal Phase, Vertical Linearity, and Height Adjustments . . . . . . . . . . . . 4-6
System Board Assembly Threshold Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
EXAMPLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
Section 5: Replaceable Parts
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Replaceable Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Exchange Assemblies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Direct Mail Order System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Contents - 2 HP 1650B/1651B
Service Manual
Section 6: Service
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Data Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Arming Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
CRT Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Disk Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Keypad and Knob Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
RS-232-C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
Trouble Isolation Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Power Supply Voltages Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
CRT Monitor Signals Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Keyboard Signals Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Assembly Removal and Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Removal and Replacement of System Assembly Board . . . . . . . . . . . . . . . . . . 6-17
Removal and Replacement of CRT Monitor Assembly. . . . . . . . . . . . . . . . . . 6-19
Removal and Replacement of Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Removal and Replacement of Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Removal and Replacement of Keyboard Assembly. . . . . . . . . . . . . . . . . . . . . 6-21
Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
Data Acquisition Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
RS-232-C Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
BNC Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
Keyboard Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
RAM Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
ROM Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Disk Drive Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Cycle Through Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Auxiliary Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
HP 1650B/1651B Contents - 3
Service Manual
Contents
Section 1 General Information
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Instruments Covered by this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Safety Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Accessories Supplied . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Accessories Available . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Logic Analyzer Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Probes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
State Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Timing Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Probes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Measurement Configurations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
State Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Timing Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Measurement and Display Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Operating Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
Recommended Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
General Information
Introduction This service manual explains how to test, adjust, and service the HP 1650B and
HP 1651B Logic Analyzers. This manual is divided into six sections:
·
General Information
·
Installation
·
Performance Tests
·
Adjustments
·
Replaceable Parts
·
Ser vice
This section of the manual includes a description of the HP 1650B/51B Logic
Analyzers, specifications, options, available accessories, and recommended test
equipment.
Listed on the title page of this manual is a microfiche part number. This number
can be used to order 4 X 6 inch microfilm transparencies of the manual. E ach
microfiche contains up to 96 photo-duplicates of the manual pages. The
microfiche package also includes the latest manual changes supplement and
pertinent service notes.
1
Instruments
Covered by this
Manual
The instrument serial number is on the rear panel. Hewlett-Packard uses a two
part serial number consisting of a four-digit prefix and a five-digit suffix separated
by a letter (0000A00000). The prefix is the same for all identical instruments and
changes only when a modification is made that affects parts compatibility. The
suffix is assigned and is different for each instrument. This manual applies directly
to instruments with the serial prefix shown on the title page.
An instrument manufactured after the printing of this manual may have a serial
number prefix that is not listed on the title page. This unlisted serial prefix
indicates the instrument is different from those described in this manual. The
manual for this newer instrument is accompanied by a manual changes
supplement. This supplement contains "change information" that explains how to
adapt the manual to the newer instrument.
In addition to change information, the supplement may contain information for
correcting errors in the manual. To keep this manual as current and accurate as
possible, Hewlett-Packard recommends that you periodically request the latest
manual change supplement. The supplement for this manual is identified with the
manual print date and part number, both of which appear on the manual title page.
Complimentary copies of the supplement are available from Hewlett-Packard.
HP 1650B/1651B General Information
Service Manual 1-1
Safety
Considerations
This product is a Safety Class 1 instrument (provided with a protective earth
terminal). Review the instrument and manual for safety markings and instructions
before operating. Specific warnings, cautions, and instructions are placed
wherever applicable throughout the manual. These precautions must be observed
during all phases of operation, service, and repair of the instrument. Failure to
comply with these precautions or with specific warnings elsewhere in this manual
violates safety standards of design, manufacture, and intended use of this
instrument.
Hewlett-Packard assumes no liability if the customer fails to comply with these
safety requirements.
Product
Description
The H P 1650B is an 80-channel STATE /TIMING (35 MH z/100 MH z) logic
analyzer, selectable in 16-channel groupings. The HP 1651B is a 32-channel
STATE/TIMING (25 MHz/100 MHz) analyzer, also selectable in 16-channel
groupings. The user interface for both models consists of a panel keyboard with an
RPG knob and a 9-inch, white-phosphor, high-resolution CRT for information
display. A 3.5-inch Sony disk drive, for setup storage and information retrieval, is
integral to the analyzers. An RS-232-C port, HP-IB port, and external arming
trigger are available on the rear panel. The RS-232-C and H P-IB ports are used
for printer hardcopy or for logic analyzer control via a controller. Either port can
be used for hardcopy or control.
The following items are other main features of the logic analyzers.
·
Simultaneous state/state, or simultaneous state/timing analysis.
·
Time interval; number of states; pattern search; minimum, maximum, and
average time interval statistics.
·
Transitional timing to store data only when there is a transition.
·
Clock qualifiers, storage qualification, time and number of state tagging, and
prestore.
·
Small lightweight, passive probing.
General Information HP 1650B/1651B
1-2 Service Manual
Accessories
Supplied
The following accessories are supplied with the H P 1650B/51B Logic Analyzer.
·
Woven probe cable (HP part number 01650-61607) with 40-pin connector on
each side, 17 signal lines, 17 return lines, 2 power lines, and 2 power ground
lines. Each power line supplies + 5 volts for preprocessor power. Each
cable supplies 600 milliamperes with a maximum power available from the
HP 1650B/51B of 2 amperes. Five probe cables are supplied with the
HP 1650B and two are supplied with the HP 1651B.
·
Pr obe Tip Assemblies (HP part number 01650-61608) that provide 16 data
channels, 1 clock channel, and 1 ground lead per pod assembly. The probe
input specifications are listed in table 1-1. Five Probe Tip Assemblies are
supplied with the HP 1650B and two are supplied with the HP 1651B.
·
Grabbers for the probe tip assemblies are supplied in packages of 20 (HP
part number 5959-0288). 100 grabbers (5 packages) are supplied with the
HP 1650B and 40 grabber s (2 packages) are suppied with the H P 1651B.
·
Two operating system disks.
·
One 2.3 meter (7.5 feet) power cord. See section 2 for available power cords.
·
One operating and reference manual set.
·
One service manual.
Accessories
Available
·
One RS-232-C Loopback Connector.
The following accessories are available for the HP 1650B/51B Logic Analyzer.
·
Termination Adap ter - HP Part Number 01650-63201.
·
Soft Carrying Case - H P Part Number 1540-1066.
·
HP 1008A /006 Testmobile.
·
HP 92192A 3.5-inch Microfloppy Disks (box of ten)
·
Rackmount Kit - HP Part Number 5061-6175.
·
HP M odel 10269C Probe interface to connect the logic analyzer directly to
microprocessor preprocessors.
·
Preprocessors for specific microprocessors and bus systems (for more
information contact your Hewlett-Packard Sales and Service Office).
HP 1650B/1651B General Information
Service Manual 1-3
Logic Analyzer
Specifications
Probes Minimum Swing: 600 mV peak-to-peak.
The following specifications are the performance standards or limits against which
the H P 1650B/51B Logic Analyzer is tested.
Threshold Accuracy:
Voltage Range Accuracy
-2.0V to + 2.0V
-9.9V to -2.1V
+ 2.1V to + 9.9V
±
150 mV
±
300 mV
±
300 mV
State Mode Clock Repetition Rate: Single phase is 35 MH z maximum. With time or state
counting, minimum time between states is 60 ns (16.67 MHz). Both mixed and
demultiplexed clocking use master-slave clock timing; master clock must follow
³
³
50 ns.
10 ns.
slave clock by at least 10 ns and precede the next slave clock by
Clock Pulse Width:
Setup Time: Data must be present prior to clock transition,
Hold Time: Data must be present after rising clock transition; 0 ns.
Data must be present after falling clock transition, 0 ns (HP 1651B); data must be
present after falling L clock transition, 0 ns (HP 1650B); data must be present after
falling J, K, M, and N clock transition, 1 ns (HP 1650B).
³
10 ns at threshold.
Timing Mode Minimum Detectable Glitch: 5 ns wide at the threshold.
General Information HP 1650B/1651B
1-4 Service Manual
Operating
Characteristics
The following operating characteristics are are typical operating characteristics for
the H P 1650B/51B Logic Analyzer.
Probes Input RC: 100 K
Measurement
Configurations
W ±
2% shunted by approximately 8 pF at the probe tip.
TTL Threshold Preset: + 1.6 volts.
ECL Threshold Preset: -1.3 volts.
Threshold Range: -9.9 to + 9.9 volts in 0.1V increments.
Threshold Setting: Threshold levels may be defined for pods 1 and 2 individually
(H P 1651B). Threshold levels may be defined for pods 1, 2, and 3 on an individual
basis and one threshold may be defined for pods 4 and 5 (HP 1650B).
Minimum Input Overdrive: 250 mV or 30% of the input amplitude, whichever is
greater.
Maximum Voltage:
Maximum Power Available Through Cables: (600 mA) 2/3 amp @ 5V per cable; 2
amp @ 5V per HP 1650B/51B.
Analyzer Configurations:
±
40 volts peak.
Analyzer 1 Analyzer 2
Timing Off
Off Timing
State Off
Off State
Timing State
State Timing
State State
Off Off
Channel Assignment: Each group of 16 channels (a pod) can be assigned to
Analyzer 1, Analyzer 2, or remain unassigned. The HP 1650B contains 5 pods; the
HP 1651B contains 2 pods.
HP 1650B/1651B General Information
Service Manual 1-5
State Analysis MEMORY
Data Acquisition: 1024 samples/channel.
Trace Specification
Clocks: Five clocks (HP 1650B) or two clocks (H P 1651B) are available and can
be used by either one or two state analyzers at any time. Clock edges can be ORed
together and operate in single phase, two phase demultiplexing, or two phase
mixed mode. Clock edge is selectable as positive, negative, or both edges for each
clock.
Clock Qualifier: The high or low level of four ORed clocks (H P 1650B) or one
clock (HP1651B) can be ANDed with the clock specification. Setup time: 20 ns;
hold time: 5 ns.
Pattern Recognizers: Each recognizer is the AND combination of bit (0, 1, or X)
patterns in each label. Eight pattern recognizers are available when one state
analyzer is on. Four are available to each analyzer when two state analyzers are on.
Range Recognizers: R ecognizes data which is numerically between or on two
specified patterns (ANDed combination of 0s and/or 1s). One range term is
available and is assigned to the first state analyzer turned on. The maximum size is
32 bits and on a maximum of 2 pods.
Qualifier: A user-specified term that can be anystate, nostate, a single pattern
recognizer, range recognizer, or logical combination of pattern and range
recognizers.
Sequence Levels: There are eight levels available to determine the sequence of
events required for trigger. The trigger term can occur anywhere in the first seven
sequence levels.
Branching: Each sequence level has a branching qualifier. When satisfied, the
analyzer will restart the sequence or branch to another sequence level.
Occurrence Counter: Seq uence qualifier may be specified to occur up to 65535
times before advancing to the next level.
Storage Qualification: Each sequence level has a storage qualifier that specifies
the states that are to be stored.
Enable/Disable: Defines a window of post-trigger storage. States stored in this
window can be qualified.
Prestore: Stores two qualified states that precede states that are stored.
General Information HP 1650B/1651B
1-6 Service Manual
Tagging
State Tagging: Counts the number of qualified states between each stored state.
Measurement can be shown relative to the previous state or relative to trigger.
Maximum count is 4.4 X (10 to the 12th power).
Time Tagging: Measures the time between stored states, relative to either the
previous state or the trigger. Maximum time between states is 48 hours.
With tagging on, the acquisition memory is halved; minimum time between states is
60 ns.
Symbols
Pattern Symbols: User can define a mnemonic for the specific bit pattern of a
label. When data display is SYMBOL, mnemonic is displayed where the bit
pattern occurs. Bit pattern can include 0s, 1s, and don’t cares.
Range Symbols: User can define a mnemonic covering a range of values. Bit
pattern for lower and upper limits must be defined as a pattern of 0s and 1s. When
data display is SYMBOL, values within the specified range are displayed as
mnemonic + offset from base of range.
Number of Pattern and Range Symbols: 200 total used for both analyzers.
Symbols can be down-loaded over RS-232-C or HP-IB.
Timing Analysis Transitional Timing Mode
Sample is stored in acquisition memory only when the data changes. A time tag
stored with each sample allows reconstruction of waveform display. Time covered
by a full memory acquisition varies with the number of pattern changes in the data.
Sample Period: 10 ns.
Maximum Time Covered By Data: 5000 seconds.
Minimum Time Covered by Data: 10.24 us.
Glitch Capture Mode
Data sample and glitch information stored every sample period.
Sample Period: 20 ns to 50 ms in a 1-2-5 sequence dependent on sec/div and delay
settings.
Memory Depth: 512 samples/channel.
Time Covered by Data: Sample period X 512.
Waveform Display
Sec/div: 10 ns to 100 s; 0.01% resolution.
Delay: -2500 s to 2500 s; presence of data dependent on the number of transitions
in data between trigger and trigger plus delay (transitional timing).
Accumulate: Waveform display is not erased between successive acquisitions.
HP 1650B/1651B General Information
Service Manual 1-7
Overlay Mode: Multiple channels can be displayed on one waveform display line.
Primary use is to view summary of bus activity.
Maximum Number Of Displayed Waveforms: 24
Time Interval Accuracy
Channel to Channel Skew: 4 ns typical.
Measurement and
Display Functions
Time Interval Accuracy:
of time interval reading).
Trigger Specification
Asynchronous Pattern: Trigger on an asynchronous pattern less than or greater
than specified duration. Pattern is the logical AND of specified low, high, or don’t
care for each assigned channel. If pattern is valid but duration is invalid, there is a
20 ns reset time before looking for patterns again.
Greater Than Duration: Minimum duration is 30 ns to 10 ms with 10 ns or 0.01%
resolution, whichever is greater. Accuracy is + 0 ns to -20 ns. Trigger occurs at
pattern + duration.
Les s Than Duration: Maximum duration is 40 ns to 10 ms with 10 ns or 0.01%
resolution, whichever is greater. Pattern must be valid for at least 20 ns. Accuracy
is + 20 ns to -0 ns. Trigger occurs at the end of the pattern.
Glitch/Edge Triggering: Trigger on glitch or edge following valid duration of
asynchronous pattern while the pattern is still present. E dge can be specified as
rising, falling or either. Less than duration forces glitch and edge triggering off.
Autoscale (Timing Analyzer Only)
±
(sample period + channel-to-channel skew + 0.01%
Autoscale searches for and displays channels with activity on the pods assigned to
the timing analyzer.
Acquisition Specifications
Arm ing: Each analyzer can be armed by the run key, the other analyzer, or the
external trigger on rear panel.
Trace Mode: Single mode acquires data once per trace specification; repetitive
mode repeats single mode acquisitions until stop is pressed or until time interval
between two specified patterns is less than or greater than a specified value, or
within or not within a specified range. There is only one trace mode when two
analyzers are on.
Labels
Channels may be grouped together and given a six character name. Up to 20 labels
in each analyzer may be assigned with up to 32 channels per label. Primary use is
for naming groups of channels such as address, data, and control busses.
General Information HP 1650B/1651B
1-8 Service Manual
Indicators
Activity Indicators: Provided in the Configuration, State Format, and Timing
Format menus for identifying high, low, or changing states on the inputs.
Markers: Two markers (X and 0) are shown as dashed lines on the display.
Trigger: D isplayed as a vertical dashed line in the timing waveform display and as
line 0 in the state listing display.
Marker Functions
Time Interval: The X and 0 markers measure the time interval between one point
on a timing waveform and trigger, two points on the same timing waveform, two
points on different waveforms, or two states (time tagging on).
Delta States ( State Analyzer Only): The X and 0 markers measure the number of
tagged states between one state and trigger, or between two states.
Patterns: The X and 0 markers can be used to locate the nth occurrence of a
specified pattern before or after trigger, or after the beginning of data. The 0
marker can also find the nth occurrence of a pattern before or after the X marker.
Statistics: X to 0 marker statistics are calculated for repetitive acquisitions.
Patterns must be specified for both markers and statistics are kept only when both
patterns can be found in an acquisition. Statistics are minimum X to 0 time,
maximum X to 0 time, average X to 0 time, and ratio of valid runs to total runs.
General
Characteristics
Run/Stop Functions
Run: Starts acquisition of data in specified trace mode.
Stop: In single trace mode or the first run of a repetitive acquisition, STOP halts
acquisition and displays the current acquisition data. For subsequent runs in
repetitive mode, STOP halts acquisition of data and does not change current
display.
Data Display/Entry
Display Modes: State listing; timing waveforms; interleaved, time-correlated
listing of two state analyzers (time tagging on); time-correlated state listing and
timing waveform display (state listing in upper half, timing waveform in lower half,
and time tagging on).
Timing Waveform: Pattern readout of timing waveforms at X or 0 marker.
Bases: Binary, Octal, Decimal, Hexadecimal, ASCII (display only), and
User-defined symbols.
The following general characteristics for the HP 1650B/51B are the environmental
operating conditions, shipping weights, and instrument dimensions.
Operating
Environment
HP 1650B/1651B General Information
Service Manual 1-9
Temperature: Instruments, 0° to 55° C (+ 32° to 131°F); probes and cables, 0° to
°
C (+ 32° to 149°F). Recommended temperature range for disk media, 10° to
65
°
C (+ 50° to 149°F).
50
Humidity: Instruments up to 95% relative humidity at + 40°C; (104°F).
Recommended humidity range for disk media, 8% to 80% relative humidity at
°
C (+ 104°F).
+40
Altitude: To 4600 m (15,000 ft).
Vibr atio n:
Operating: Random vibration 5-500 Hz, 10 minutes per axis, &2.41 g (rms).
Non-operating: Random vibration 5-500 Hz, 10 minutes per axis, & 2.41 g (rms);
and swept sine resonant search, 5-500 Hz, 0.75 g (0-peak), 5 minute resonant dwell
@ 4 resonances per axis.
Weig ht : 10.0 kg (22 lbs) net; 18.2 kg (40 lbs) shipping.
Power: 115V/230V, 48-66 Hz, 200 W maximum.
Dimensions: See outline drawing below.
Recommended
Test Equipment
General Information HP 1650B/1651B
1-10 Service Manual
Table 1-1 lists the test equipment required to test performance, make adjustments,
and troubleshoot the HP 1650B/51B Logic Analyzers. The table includes the
critical specifications of the test equipment and lists each procedure in which the
equipment is required. Other equipment may be substituted if it meets or exceeds
the critical specifications listed in the table.
Table 1-1. Recommended Test Equipment
Equipment Required Critical Specifications Recommended Model
Oscilloscope dual channel HP 54502A P,T
dc to 300 MHz
Pulse 5 ns pulse width H P 8161A/020 P
Generator 20 ns period
1.3 ns risetime
double pulse
100 kHz Repetition R ate
Overshoot: 5% of Amp.
Power + or - 10.2 V output HP 6216B P
Supply current: 0 - 0.4 amperes
Adapter BNC(f)-to-Dual Banana HP Part Number P
1251-2277
DMM 5.5 digit resolution HP 3478A A
Resistor 2 ohms, 25 watts HP Part Number T
0811-1390
BNC Cable (2) 50 ohms with UG-88C/U BNC (m) HP 10503A P
connectors
Use *
BNC Adapter (2) BNC tee (m) (f) (f) HP Part Number P
1250-0781
BNC Feedthrough 50 ohm BNC HP 10100C P
* P = Performance Tests, A = Adjustments, T = Troubleshooting
HP 1650B/1651B General Information
Service Manual 1-11
Section 2 Installation
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Safety Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Initial Inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Line Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Power Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Operating Disk Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Applying Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
HP-IB Interfacing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
HP-IB Address Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
RS-232-C Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
RS-232-C Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Storage and Shipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Tagging for Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
Original Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Other Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Cleaning Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
Installation
Introduction This section of the manual contains information and instructions necessary for
setting up the H P 1650B/51B Logic Analyzer. This includes inspection
procedures, power requirements, hardware connections and configurations, and
packaging information.
2
Safety
Considerations
Initial
Inspection
Power
Requirements
Caution BEFORE CONNECTING POWER TO THIS INSTRUMENT, be sure the Line
The safety symbols used with Hewlett-Packard instruments are illustrated in the
front of this manual. WARNING and CAUTION symbols and instructions should
be reviewed before operating the instrument. These warnings and cautions must
be followed for your own protection and to avoid damaging the instrument.
Inspect the shipping container for damage. If the shipping container or cushioning
material is damaged, keep it until the contents of the shipment have been checked
for completeness and the instrument has been checked mechanically and
electrically. The contents of the shipment are listed under "Accessories Supplied"
in Section 1. If the contents are incomplete, if there is mechanical damage or
defect, or if the instrument does not operate properly, notify the nearest
Hewlett-Packard office. If the shipping container is damaged, or the cushioning
materials show signs of stress, notify the carrier as well as the Hewlett-Packard
office. Keep the shipping materials for the carrier’s inspection. The
Hewlett-Packard office will arrange for repair or replacement at HP option
without waiting for claim settlement.
The HP 1650B/51B Logic Analyzer requires a power source of either 115 Vac or
230 Vac, -22% to + 10%; single phase, 48 to 66 Hz, 200 Watts maximum power.
Voltage Select switch on the rear panel of the instrument is set properly and the
correct fuse is installed.
HP 1650B/1651B Installation
Service Manual 2-1
Line Voltage
Selection
When shipped from the factory, the line voltage selector is set and an appropriate
fuse is installed for operating the instrument in the country of destination.
To operate the instrument from a power source other than the one set at the
factory:
1. Turn the rear power switch to the OFF position and remove the power cord
from the instrument.
2. Remove the fuse module by carefully prying it at the top center of the
module until you can grasp it and pull it out by hand as shown below.
Figure 2-1. Fuse Module Removal
Installation HP 1650B/1651B
2-2 Service Manual
3. Reinsert the fuse module with the arrows aligned for your application. See
fuse module below.
Figure 2-2. Fuse Module
4. Reconnect the power cord, turn the rear power switch to the ON position,
and continue normal operation.
Power Cable This instrument is equipped with a three-wire power cable. When connected to an
appropriate AC power outlet, this cable grounds the instrument cabinet. The type
of power cable plug shipped with the instrument depends on the country of
destination. See Table 2-1 for the option numbers of available power cables and
plug configurations.
Operating Disk
Installation
This instrument is shipped with a yellow protective disk in the disk drive. Before
applying power to the instrument, remove the protective disk from the disk drive
and install the operating disk. Reinstall the protective disk whenever the
instrument is to transported.
Applying Power When power is applied to the HP 1650B/51B, a power-up self test is automatically
performed. For information on the power-up self test, refer to section 3.
HP 1650B/1651B Installation
Service Manual 2-3
Table 2-1. Power Plug Configurations
Installation HP 1650B/1651B
2-4 Service Manual
User Interface The front-panel user interface of the HP 1650B/51B consists of fr ont-panel keys,
the KNO B, and display. The interface allows configuration of each analyzer
(machine) within the logic analyzer. It also displays acquired data and
measurement results.
Use the front-panel interface with the following process:
·
select the desired menu with menu keys
·
place the cursor on the desired field within the menu by rotating the KNOB
·
display the field options or current data by pressing the SELECT key
·
select the desired option by rotating the KNOB or entering new data by using
the KNOB or the keypad
·
Start and stop data acquisition by using the RUN and STOP keys
HP-IB
Interfacing
The Hewlett-Packard Interface Bus (HP-IB) is Hewlett-Packard’s implementation
of IEEE Standard 488-1978, "Standard Digital Interface for Programming
Instrumentation." HP-IB is a carefully defined interface that simplifies the
integration of various instruments and computers into systems. The interface
makes it possible to transfer messages between two or more HP-IB compatible
devices. HP-IB is a parallel bus of 16 active signal lines divided into three
functional groups according to function.
Eight signal lines, called data lines, are in the first functional group. The data lines
are used to transmit data in coded messages. These messages are used to program
the instrument function, transfer measurement data, and coordinate instrument
operation. Input and output of all messages, in bit parallel-byte serial form, are
also transferred on the data lines. A 7-bit ASCII code normally represents each
piece of data.
Data is transferred by means of an interlocking "Handshake" technique which
permits data transfer (asynchronously) at the rate of the slowest active device used
in that transfer. The data byte control lines coordinate the handshaking and form
the second functional group.
The remaining five general interface management lines (third functional group)
are used to manage the devices connected to the HP-IB. This includes activating
all connected devices at once, clearing the interface, and other operations.
The HP-IB connector and on the rear panel are shown in figure 2-3.
HP 1650B/1651B Installation
Service Manual 2-5
Figure 2-3. HP 1650B Rear Panel
HP-IB Address
Selection
Each instrument connected to the HP-IB interface bus requires a unique address.
The address provides a method for the system computer to select individual
instruments on the bus. The address of the H P 1650B/51B defaults at power up to
decimal "07". The corresponding ASCII code is a listen of "’" and a talk address of
"G ." To change the address of the HP 1650B/51B proceed as follows:
1. Press the I/O key on the front-panel keypad and the I/O menu will appear on
screen.
2. Rotate the KNOB until "I/O Port Configuration" is highlighted.
3. Press the SELE CT key and the External I/O Port Configuration menu will
appear on screen.
Installation HP 1650B/1651B
2-6 Service Manual
Figure 2-4. External I/O Port Configuration Menu
4. Select the HP-IB Address field with the KNOB and press the SELECT key.
5. When the pop-up field appears on screen, rotate the KNOB to select the
desired HP-IB address.
6. Press the SELE CT key to enter the new address.
7. Select the DONE field in the upper-right corner with the KNOB to exit the
External I/O Port Configuration menu.
RS-232-C
Interface
The HP 1650B/51B interfaces with RS-232-C communication lines through a
standard 25 pin D connector. The H P 1650B/51B is compatible with RS-232-C
protocol. When a hardwire handshake method is used, the Data Terminal Ready
(DTR) line (pin 20 on the Computer/Modem connector) is used to signal whether
space is available in the logical I/O buffer for more data. Pin outs of the RS-232-C
connectors are listed in table 2-4.
HP 1650B/1651B Installation
Service Manual 2-7
Table 2-1. RS-232-C Signal Definitions
RS-232-C
Pin No. Function Standard Signal Direction and Level
1 Protective Ground AA Not applicable
2 Transmitted Data (TD) BA Data from Logic Analyzer
High = Space = "0" = +12 V
Low = Mark = "1" = -12 V
3 Received Data (RD) BB Data to Logic Analyzer
High = Space = "0" = +3 V to +25 V
Low = Mark = "1" = -3 V to -25 V
4 Request to Send (R TS) CA Signal from Logic Analyzer
High = ON = + 12 V
Low = OFF = -12 V
5 Clear to Send (CTS) CB Signal to Logic Analyzer
High = ON = + 3 V to + 12 V
Low = OFF = -3 V to -25 V
6 Data Set Ready (DSR) CC Signal to Logic Analyzer
High = ON = + 3 V to + 25 V
Low = OFF = -3 V to -25 V
7 Signal Ground AB Not applicable
8 Data Carrier Detect (DCD) CF Signal to Logic Analyzer
20 Data Terminal Ready (DTR) CD Signal from Logic Analyzer
23 Data Signal Rate Selector CH/CI Signal from Logic Analyer
RS-232-C
Configuration
High = ON = + 3 V to + 25 V
Low = OFF = -3 V to -25 V
High = ON = + 12 V
Low = OFF = -12 V
Always H igh = ON = + 12 V
At power up, the RS-232-C interface is configured as shown in previous figure. To
change the RS-232-C configuration:
1. Press the I/O key on the front-panel keypad and the I/O menu will appear on
screen.
2. Rotate the KNOB until "I/O Port Configuration" is highlighted.
3. Touch the SE LE CT key and the External I/O Port Configuration menu will
appear on screen.
Installation HP 1650B/1651B
2-8 Service Manual
4. Using the KNO B and SE LE CT key, configure the RS-232-C interface as
desired.
5. Select the DONE field in the upper-right corner with the KNOB to exit the
External I/O Port Configuration menu.
Operating
Environment
Storage and
Shipment
Tagging for
Service
The operating environment for the HP 1650B/51B is described in table 1-2. Note
the non-condensing humidity limitation. Condensation within the instrument
cabinet can cause poor operation or malfunction. Protection should be provided
against temperature extremes which cause condensation within the instrument.
The HP 1650B/51B operates at all specifications within the temperature and
humidity range given in table 1-2.
The instrument may be stored or shipped in environments within the following
limits:
Temperature:-40 degrees C to + 75 degrees C.
Humidity:Up to 90% at 65 degrees C.
Altitude:Up to 15,300 metres (50,000 feet).
If the instrument is to be shipped to a Hewlett-Packard office for service or repair,
attach a tag to the instrument identifying the owner, address of the owner,
complete instrument model and serial numbers, and a description of the service
required.
HP 1650B/1651B Installation
Service Manual 2-9
Original
Packaging
If the original packaging material is unavailable or unserviceable, materials
identical to those used in factory packaging are available through Hewlett-Packard
offices. If the instrument is to be shipped to a Hewlett-packard office for service,
attach a tag identifying the owner, address of the owner, complete instrument
model and serial numbers, and a description of the service required. Mark the
container FRAG ILE to ensure careful handling. In any correspondence, refer to
the instrument by model number and full serial number.
Other
Packaging
Cleaning
Requirements
The following general instructions should be followed for repacking the instrument
with commercially available materials.
·
Remove discs from disk drives and install yellow shipping discs.
·
Wrap the instrument in heavy paper or plastic.
·
Use a strong shipping container. A double-wall carton made of 350 lb. test
material is adequate.
·
Use a layer of shock-absorbing material 70 to 100 mm (3 to 4 inches) thick
around all sides of the instrument to provide firm cushioning and prevent
movement inside the container. Protect the control panel with cardboard.
·
Seal the shipping container securely.
·
Mark the shipping container FRAGILE to ensure careful handling.
·
In any correspondence, refer to the instrument by model number and serial
number.
Use MILD SOAP AND WA TE R to clean the H P 1650B/51B cabinet and front
panel. Care must be taken to not use a harsh soap which may damage the
water-base paint finish of the instrument.
Installation HP 1650B/1651B
2-10 Service Manual
Contents
Section 3 Performance Tests
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Recommended Test Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Test Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Power-up Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Selectable Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Performance Test Interval. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Clock, Qualifier, and Data Inputs Test 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Clock, Qualifier, and Data Inputs Test 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Clock, Qualifier, and D ata Inputs Test 3 (HP 1650B Only) . . . . . . . . . . . . . . . . . 3-13
Clock, Qualifier, and Data Inputs Test 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Clock, Qualifier, and Data Inputs Test 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Clock, Qualifier, and Data Inputs Test 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Glitch Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-24
Threshold Accuracy Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-28
3
Performance Tests
Introduction These procedures test the electrical performance of the logic analyzer by using the
specifications in table 1-1 as the performance standards. All tests may be
performed without access to the interior of the instrument.
Recommended
Test Equipment
Equipment required for the performance tests in this section is listed in the
Recommended Test E quipment table in Section 1. Any equipment that satisfies
the critical specification listed in the table may be substituted for the
recommended model.
Test Connector The performance tests and adjustments require connecting pulse generator
outputs to probe pod inputs. Figure 3-1 is a test connector that may be built to
allow testing of multiple channels (up to eight at one time). The test connector
consists of a BNC connector and a length of wire. Connecting more than eight
channels to the test connector at a time will induce loading of the circuit and true
signal representation will degrade. Test results may not be accurate if more than
eight channels are connected to the test connector.
The Hewlett-Packard part number for the BNC connector in figure below is
1250-1032. An equivalent part may be used in place of the H ewlett-Packard part.
Figure 3-1. Test Connector
Test Record The results of the performance tests may be tabulated on the Test Record
provided at the end of this section. The Test Record lists the performance tests
and provides an area to mark whether the pod passed or failed the test. The
results recorded in the table at incoming inspection may be used for later
comparisons of the tests during periodic maintenance, troubleshooting, and after
repairs or adjustments.
HP 1650B/1651B Performance Tests
Service Manual 3-1
Self Tests The power-up self test is automatically performed upon applying power to the
logic analyzer. Since the performance tests require test equipment, self tests may
be performed individually to provide a higher level of confidence that the
instrument is operating properly. A message that the instrument has failed the test
will appear if any problem is encountered during the test. The individual self tests
may be performed for functions listed in the self test menu which is invoked via the
I/O menu. The HP 1650B/51B self test is located on the operating system disk and
is required to run the tests.
Power-up Self Test The power-up self test is automatically invoked at power-up of the HP 1650B/51B
Logic Analyzer. The revision number of the operating system firmware is given in
the upper right of the screen during the power-up self test. As each test
completes, either passed or failed is printed in front of the name of the test in the
following manner:
PERFORMING POWER-UP SELF TESTS
passed ROM test
passed RAM test
passed Interrupt test
passed Display test
passed Keyboard tes t
passed Acquisition test
passed Threshold test
passed Disk test
LOADING SYSTEM FILE
As indicated by the last message, the HP 1650B/51B automatically loads the
operating system disk in the disk drive. If the operating system disk is not in the
disk drive, the message SYSTEM DISC NOT FOU ND is displayed at the bottom
of the screen and NO DISK is displayed in front of disk test in place of "passed".
If the above message appears, turn off the instrument, insert the operating system
disk into the disk drive, and again apply power.
Performance Tests HP 1650B/1651B
3-2 Service Manual
Selectable Self
Tests
Seven self tests may be invoked individually via the Self Test menu. The seven
selectable self tests are:
·
Data Acquisition
·
RS-232-C
·
External Trigger BNCs
·
Keyboard
·
RAM
·
ROM
·
Disk Drive
·
Cycle through all tests
The required test is selected by moving the cursor to the test and pressing the front
panel SELECT key. A pop-up menu appears with a description of the test to be
performed. The self test does not begin until the cursor is placed on Execute and
the front panel SELECT key is pressed.
After the test has been completed, either Passed, Failed, or Tested is displayed on
the Self Test menu in front of the test. These tests are used as troubleshooting
aids. Section 6 contains information on the individual tests used for
troubleshooting.
Performance
Test Interval
The calibration cycle for the logic analyzer is two years, therefore, periodic
performance verification of the HP 1650B/51B is recommended at two year
intervals. The instrument’s performance should be verified after it has been
serviced, or if improper operation is suspected. Calibration should be performed
before any performance verification tests. Further checks requiring access to the
interior of the instrument are included in the adjustment section, but are not
required for the performance verification.
Test Record The results of the performance tests may be tabulated on the Test Record
provided at the end of this section. The Test Record lists the performance tests
and provides an area to mark whether the pod passed or failed the test. The
results recorded in the table at incoming inspection may be used for later
comparisons of the tests during periodic maintenance, troubleshooting, and after
repairs or adjustments.
HP 1650B/1651B Performance Tests
Service Manual 3-3
Clock,
Qualifier, and
Data Inputs
Test 1
Description: This test verifies maximum clock rate with counting mode for the HP
1650B/51B. This test also verifies the setup and hold times for the falling edge of
the H P 1650B L clock specification, and the falling edge of the HP 1651B J and K
clock specification.
Specification: Clock repetition rate: with time or state counting mode on,
minimum time between states is 60 ns.
³
Setup time: Data must be present prior to clock transition;
HP 1650B hold time: D ata must be p resent after falling edge of L clock transition;
0 ns.
HP 1651B hold time: D ata must be p resent after falling edge of J and K clock
transition; 0 ns.
Equipment:
Pulse Generator .............................. HP 8161A/020
Oscilloscope .................................... HP 54502A
50 Ohm Feedthru (2) ............................. HP 10100C
Test Connector see figure 3-1......................... (2)
Procedure:
1. Connect the HP 1650B\ 51B and test equipment as in figure 3-2.
10 ns.
Figure 3-2. Setup for Data Test 1
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be connected to ensure accurate test results.
Performance Tests HP 1650B/1651B
3-4 Service Manual
2. Adjust pulse generator for the output in figure 3-3.
Figure 3-3. Waveform for Data Test 1
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER) 60 ns --Width (WID) 10 ns 10 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level (HIL) 3.2 V 3.2 V
Low Level (LOL) 0 V 0 V
Delay (DEL) 0 ns 0 ns
Output Mode ENABLE ENABLE
3. Assign the pod under test to Analyzer 1 in the System Configuration as in
3-4. Refer to steps a through c if unfamiliar with menu.
Figure 3-4. System Configuration for Data Test 1
a. Move cursor to Type field of Analyzer 1 and SELECT.
b. Set the analyzer Type to State using cursor and SELECT.
c. Move cursor to Pod to be tested and assign to Machine 1.
HP 1650B/1651B Performance Tests
Service Manual 3-5
4. In the State Format Specification assign Clock Period > 60 ns. Also assign
lower 8 channels of the pod under test to a label as shown in next figure . If
testing H P 1650B then assign falling edge of L clock for all pods. If testing
HP 1651B then assign falling edge of J clock for all pods. Refer to steps a
through c if unfamiliar with the menus.
Figure 3-5. State Format Specification for Data Test 1
a. Press front-panel FORMAT key.
b. Move cursor to Clock field of menu. Use cursor and SELECT key to
set appropriate clock for falling edge as in next figure.
Figure 3-6. Clock Assignment for Data Test 1
Performance Tests HP 1650B/1651B
3-6 Service Manual
c. Move cursor to the bit assignment field and turn on appropriate eight
bits to be tested (* = on; . = off) as in figure below.
Figure 3-7. Bit Assignment for Data Test 1
5. Set up the State Trace Specification without sequencing levels and set
Count States as in next figure.
Figure 3-8. Trace Specification for Data Test 1
a. Press front-panel TRACE key.
b. Move cursor to Count, press SELECT, then move cursor to States,
press SE LE CT, and set to any state by pressing SELECT again.
HP 1650B/1651B Performance Tests
Service Manual 3-7
6. Press RUN. The State Listing is displayed and shows Fs for the channels
under test, when test is passed, as in figure 3-9.
Figure 3-9. State Listing for Data Test 1
Note To ensure consistent pattern of Fs in listing, use front-panel ROLL field and knob
to scroll through State Listing.
7. If testing the HP 1651B, connect the K clock of Pod 2 to the test connector
and repeat steps 4 and 6 for the falling edge of K clock.
8. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector. If testing the H P 1651B then
re-assign the falling edge of J clock.
9. Repeat steps 3, 4, 6 and 7 until all pods have been tested.
10. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector.
11. Repeat steps 3, 4, 6, 7 and 8 until the upper bits of all pods have been tested.
Performance Tests HP 1650B/1651B
3-8 Service Manual
Clock,
Qualifier, and
Data Inputs
Test 2
Description: This test verifies the setup and hold time specification for the rising
edge transition of all clocks on the HP 1650B/51B.
Specification:
Setup time: Data must be present prior to clock transition;
Hold time: Data must be present after rising clock transition; 0 ns.
Equipment:
Pulse Generator ............................. HP 8161A/020
Oscilloscope ................................... HP 54502A
50 Ohm Feedthru (2) ............................ HP 10100C
Test Connectors (2)........................see figure 3-1
Procedure:
1. Connect the HP 1650B\ 51B and test equipment as in figure 3-10.
³
10 ns.
Figure 3-10. Test Setup for Data Test 2
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be connected to ensure accurate test results.
HP 1650B/1651B Performance Tests
Service Manual 3-9
2. Adjust pulse generator for the output in figure 3-11. Pulse generator settings
Figure 3-11. Waveform for Data Test 2
are different for HP 1650B and HP 1651B.
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER)
HP 1650B 28.5 ns --HP 1651B 40 ns --Width (WID)
HP 1650B 18.5 ns 18.5ns
HP 1651B 30 ns 30 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level (HIL) 3.2 V 3.2 V
Low Level (LOL) 0 V 0 V
Delay (DEL) 0 ns 0 ns
Output Mode ENABLE ENABLE
3. Assign the pod under test to Analyzer 1 in System Configuration as in
previous test figure 3-4.
4. In the State Format Specification assign Clock Period < 60 ns, and rising
edge of J clock. Also, assign lower 8 channels of the pod under test to a label
as in figure 3-12.
Figure 3-12. State Format Specification for Data Test 2
Performance Tests HP 1650B/1651B
3-10 Service Manual
5. Set the State Trace Specification without sequencing levels and set Count to
Off as in Figure 3-13.
Figure 3-13. State Listing for Data Test 2
6. Press RUN. The State Listing is displayed and lists all 0s for the channels
under test, if passed test, as in figure 3-14.
Figure 3-14. Setup for Data Test 3
Note To ensure consistent pattern of 0s in listing, use front-panel ROLL keys and knob
to scroll through State Listing.
HP 1650B/1651B Performance Tests
Service Manual 3-11
7. Connect the next clock to the test connector and repeat steps 4 and 6 for the
appropriate clock. Repeat until all clocks have been tested (clocks J, K, L,
M and N).
8. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
9. Repeat steps 3, 4, 6 and 7 until all pods have been tested (pods 1 through 5).
Start again with the rising edge of J clock and test the pod with all clocks.
10. Repeat until the lower bits of all pods have been tested (pods 1 through 5).
11. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector. Repeat steps 3, 4,
6, 7, and 8 until the upper bits of all pods have been tested (pods 1 through 5).
Performance Tests HP 1650B/1651B
3-12 Service Manual
Clock,
Qualifier, and
Data Inputs
Test 3
(HP 1650B
Only)
Description: This performance test verifies the hold time specification for the
falling clock transitions of the J, K, M and N clock on the HP 1650B.
Specification: H P 1650B H old time: Data must be present after falling J, K, M
and N clock transition; 1 ns.
Equipment:
Pulse Generator .............................. HP 8161A/020
Oscilloscope .................................... HP 54502A
50 ohm Terminators............................... HP 10100C
Test Connectors see figure 3-1.........................(2)
Procedure:
1. Connect the HP 1650B and test equipment as in figure 3-15.
Figure 3-15. Setup for Data Test 3
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be connected to ensure accurate test results.
2. Adjust pulse generator for the outputs in figure 3-16.
Figure 3-16. Waveform for Data Test 3
HP 1650B/1651B Performance Tests
Service Manual 3-13
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER) 57 ns --Width (WID) 11 ns 10 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level (HIL) 3.2 V 3.2 V
Low Level (LOL) 0 V 0 V
Delay (DEL) 0 ns --Double Pulse (DBL) --- 28.5 ns
Output Mode ENABLE ENABLE
3. Assign the pod under test to Analyzer 1 in the System Configuration as in
previous test figure 3-4.
4. In the State Format Specification menu assign Clock Period < 60 ns, and
falling edge of J clock. Also, assign the lower 8 channels of the pod under test
to a label as in figure 3-12.
5. Set the State Trace Specification without sequencing levels and set Count
Off as in previous figure 3-13.
6. Press RUN. The State Listing is displayed and lists alternating Fs and 0s as
in figure 3-17, if test has passed.
Figure 3-17. State Listing for Data Test 3
Note To ensure consistent pattern of alternating Fs and 0s, use the front-panel ROLL
field and knob to scroll through State Listing.
7. Connect the next clock to the test connector and repeat steps 4 and 6 for the
appropriate clock. Repeat until the J, K, M and N clocks have been tested.
8. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector. Repeat steps 3, 4, 6 and 7 until all
pods have been tested (pods 1 through 5). Start again with the falling edge of
the J clock and test the pod with all clocks except L clock.
Performance Tests HP 1650B/1651B
3-14 Service Manual
9. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector. Repeat steps 3, 4, 6,
7 and 8 until the upper bits of all pods have been tested (pods 1 through 5).
Clock,
Qualifier, and
Data Inputs
Test 4
Description: This test verifies the minimum swing voltages of the input probes and
the maximum clock rate of the HP 1650B\ 51B when it is in single phase mode.
Specification:
Minimum swing: 600 mV peak-to-peak.
HP 1650B Clock repetition rate: Single phase is 35 MHz maximum.
HP 1651B Clock repetition rate: Single phase is 25 MHz maximum.
Clock pulse width:
Equipment:
Pulse Generator ............................... HP 8161A/020
Oscilloscope ..................................... HP 54502A
50 Ohm Feedthru (2) .............................. HP 10100C
Test Connectors see figure 3-1..........................(2)
Procedure:
1. Connect the HP 1650B\ 51B and test equipment as in figure 3-18. In order to
most accurately measure the amplitude of the test signals from the pulse
generator, high impedance scope probes should be used to look at the signal
levels at the output of the pulse generator.
³
10 ns at threshold.
Figure 3-18. Setup for Data Test 4
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be connected to ensure accurate test results. It is recommended that all
eight channel grounds be connected.
HP 1650B/1651B Performance Tests
Service Manual 3-15
2. Adjust pulse generator for the output in figure 3-19. Pulse generator settings
are different for HP 1650B and HP 1651B.
Figure 3-19. Waveform for Data Test 4
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER)
HP 1650B 57 ns --HP 1651B 80 ns --Width (WID) 20 ns 10 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level (HIL) 1.9V 1.9V (see Note)
Low Level (LOL) 1.3V 1.3V (see Note)
Delay (DEL)
HP 1650B 18.5 ns --HP 1651B 30 ns --Double Pulse (DBL)
HP 1650B --- 28.5 ns
HP 1651B --- 40 ns
Output Mode ENABLE ENABLE
Note The voltage levels of the waveforms must have the correct amplitude at the logic
analyzer probe tips. The pulse generator output may have to be increased slightly
to compensate for loading by the logic analyzer.
3. Assign the pod under test to Analyzer 1 in System Configuration as in
previous figure 3-4.
4. In the State Format Specification assign Clock Period < 60 ns, and rising
edge of J clock. Also, assign lower 8 channels of the pod under test to a label
as in previous figure 3-12.
5. Set the State Trace Specification without sequencing levels and set Count
Off as in previous test figure 3-13.
Performance Tests HP 1650B/1651B
3-16 Service Manual
6. Press RUN. The State Listing is displayed and shows alternating Fs and 0s
for the channels under test as in figure 3-20.
Figure 3-20. State Listing for Data Test 4
Note To ensure consistent pattern of alternating Fs and 0s, use the front-panel ROLL
keys and knob to scroll through State Listing.
7. Connect the next clock to the test connector and repeat steps 4 and 6.
Repeat until all clocks have been tested (clocks J, K, L, M and N).
8. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
9. Repeat steps 3, 4, 6 and 7 until all pods have been tested (pods 1 through 5).
Start again with the rising edge of J clock and test the pod with all clocks.
10. Repeat until the lower bits of all pods have been tested (pods 1 through 5).
11. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector.
12. Repeat steps 3, 4, 6, 7 and 8 until the upper bits of all pods have been tested
(pods 1 through 5).
HP 1650B/1651B Performance Tests
Service Manual 3-17
Clock,
Qualifier, and
Data Inputs
Test 5
Description: This performance test verifies the maximum clock rate for mixed
mode clocking during state operation.
Specification:
Clock repetition rate: H P 1650B single phase is 35 MHz maximum, HP 1651B is
25 MH z. With time or state counting, minimum time between states is 60 ns (16.7
MHz maximum). Both mixed and demultiplexed clocking use master-slave clock
timing; master clock must follow slave clock by at least 10 ns and precede the next
slave clock by 50 ns.
Equipment:
Pulse Generator ............................... HP 8161A/020
Oscilloscope ..................................... HP 54502A
50 Ohm Feedthru (2) .............................. HP 10100C
Test Connectors see figure 3-1..........................(2)
Procedure:
1. Connect the HP 1650B/51B and test equipment as in figure 3-21 by
connecting channels 0-3 and 8-11 of the pod under test to the test connector.
On the slave clock transition the four bits of the lower byte are transferred to
the logic analyzer, and on the master clock transition the four bits of the
upper byte are transferred to the logic analyzer.
Figure 3-21. Setup for Data Test 5
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be connected to ensure accurate test results.
Performance Tests HP 1650B/1651B
3-18 Service Manual
2. Adjust pulse generator for the output in figure 3-22.
Figure 3-22. Waveform for Data Test 5
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER) 120 ns --Width (WID) 60 ns 10 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level HIL) 3.2 V 3.2 V
Low Level (LOL) 0 V 0 V
Delay (DEL) 40 ns --Double Pulse (DBL) --- 60 ns
Output Mode ENABLE ENABLE
3. Assign the pod under test to Analyzer 1 in the System Configuration as in
previous figure 3-4.
4. Set up the State Format Specification as in figure 3-23, assigning the falling J
clock to Master Clock and the rising J clock to Slave Clock. Refer to steps a
through d after figure if unfamiliar with the menu.
Figure 3-23. State Format Specification for Data Test 5
HP 1650B/1651B Performance Tests
Service Manual 3-19
a. Move cursor to Clock field and SELECT, then assign Mixed Clocks.
b. Assign falling transition of the J clock to Master Clock and rising
transition of the J clock to Slave Clock.
c. Assign channels 0-3 and 8-11 of the pod under test.
d. Set Clock Period to > 60 ns.
5. Set the State Trace Specification without sequencing levels and Count Off
as in previoius figure 3-13.
6. Press RUN. The State Listing displays alternating Fs and 0s for the channels
under test as in figure 3-24.
Figure 3-24. State Listing for Data Test 5
Note To ensure consistent pattern of alternating Fs and 0s, use the front-panel ROLL
field and knob to scroll through State Listing.
7. Connect the next clock to the test connector and repeat steps 4 and 6.
Repeat until all clocks have been tested (clocks J, K, L, M and N).
8. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
9. Repeat steps 3, 4, 6 and 7 until all pods have been tested (pods 1 through 5).
Start again with the falling edge of J clock as the Master and rising edge of
the J clock as the Slave clock. Repeat until channels 0 - 3 and 8 - 11 of all
pods have been tested (pods 1 - 5).
10. Disconnect bits 0-3 and bits 8-11 from the test connector. Attach bits 4-7 and
bits 12-15 to the test connector. Repeat steps 3, 4, 6, 7 and 8 until all pods
have been tested (pods 1 through 5).
Performance Tests HP 1650B/1651B
3-20 Service Manual
Clock,
Qualifier, and
Data Inputs
Test 6
Description: This performance test verifies the maximum clock rate for
demultiplexed clocking during state operation.
Specification:
Clock repetition rate: H P 1650B single phase 35 MHz maximum, H P 1651B single
phase 25 MHz. With time or state counting, minimum time between states is 60 ns
(16.7 MH z maximum). Both mixed and demultiplexed clocking use master-slave
clock timing; master clock must follow slave clock by at least 10 ns and precede
the next slave clock by 50 ns.
Equipment:
Pulse Generator ............................... HP 8161A/020
Oscillscope....................................... HP 54502A
50 Ohm Feedthru (2) .............................. HP 10100C
Test Connectors (2)..........................see figure 3-1
Procedure:
1. Connect the HP 1650B/51B and test equipment as in figure 3-25 by
connecting channels 0-7 of the pod under test to the test connector. During
demultiplexed clocking only the lower eight bits of each pod are used.
Figure 3-25. Setup for Data Test 6
HP 1650B/1651B Performance Tests
Service Manual 3-21
2. Adjust pulse generator for the output in figure 3-26.
Figure 3-26. Waveform for Data Test 6
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER) 120 ns --Width (WID) 60 ns 10 ns
Leading Edge (LEE) 1 ns 1 ns
Trailing Edge (TRE) 1 ns 1 ns
High Level (HIL) 3.2 V 3.2 V
Low Level (LOL) 0 V 0 V
Delay (DEL) 40 ns --Double Pulse (DBL) --- 60 ns
Output Mode ENABLE ENABLE
3. Assign the pod under test to Analyzer 1 in System Configuration as in
previous figure 3-4.
4. Set up State Format Specification as in figure 3-27, assigning the falling J
clock as Master Clock and the rising J clock as Slave Clock. Refer to steps a
through d after figure if unfamiliar with the menus.
Figure 3-27. State Format Specification for Data Test 6
a. Move cursor to Clock field and SELECT, then assign Demultiplex.
Performance Tests HP 1650B/1651B
3-22 Service Manual
b. Assign falling clock transition of J clock to Master Clock and rising J
clock transition to Slave Clock.
c. Assign ALL channels to pod under test (only bits 0 through 7 are be
available for assignment).
d. Set Clock Period to < 60 ns.
5. Set State Trace Specification without sequencing levels and set Count Off
as in previous figure 3-13.
6. Press RUN. The State Listing shows alternating Fs and 0s for the pod under
test as in figure 3-28.
Figure 3-28. State Listing for Data Test 6
Note To ensure consistent pattern of alternating Fs and 0s in listing, use front-panel
ROLL field and knob to scroll through State Listing.
7. Connect the next clock to the test connector and repeat steps 4 and 6.
8. Repeat until all clocks have been tested (clocks J, K, L, M and N).
9. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
10. Repeat steps 3, 4, 6 and 7 until all pods have been tested (pods 1 through 5).
Start again with the falling edge of J clock as the Master Clock and rising
edge of the J clock as the Slave Clock.
HP 1650B/1651B Performance Tests
Service Manual 3-23
Glitch Test Description:
This performance test verifies the glitch detection specification of the
HP 1650B/51B.
Specification:
Minimum detectable glitch: 5 ns wide at the threshold.
Equipment:
Pulse Generator ............................... HP 8161A/020
Oscilloscope...................................... HP 54502A
50 ohm Feedthrough.(1)............................ HP 10100C
Test Connector (1) ...........................see figure 3-1
Procedure:
1. Connect the test equipment as in figure 3-29. The clock inputs are not used
for the glitch test since glitch detection is part of timing analysis. Use the
oscilloscope to make sure pulses are 5 ns wide at the threshold (1.6 V).
Figure 3-29. Setup for Glitch Test
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be grounded to ensure accurate test results.
Performance Tests HP 1650B/1651B
3-24 Service Manual
2. Adjust pulse generator for the output in figure 3-30.
Figure 3-30. Waveform for Glitch Test
Setting for HP 8161A:
Parameter Output A Output B
Input Mode Norm --Period (PER) 20 ns --Width (WID) 5 ns --Leading Edge (LEE) 1 ns --Trailing Edge (TRE) 1 ns --High Level (HIL) 3.2 V --Low Level (LOL) 0 V --Delay (DEL) 0 ns --Output Mode ENABLE ---
3. Assign the pod under test to Analyzer 1 in System Configuration as in figure
3-31. Refer to steps a and b if unfamiliar with menus.
Figure 3-31. System Configuration for Glitch Test
a. Move cursor to Type field of Analyzer 1 and SELECT.
b. Set the analyzer Type to Ti ming using cursor and SELECT.
c. Move cursor to pod to be tested and assign to Machine 1.
4. In State Format Specification assign the lower eight bits of the pod under test
to a label as shown in figure 3-32. Make sure the appropriate eight bits in the
bit assignment field are turned on.
HP 1650B/1651B Performance Tests
Service Manual 3-25
5. Set Timing Trace Specification as in figure 3-33. Follow steps a through c if
Figure 3-32. Glitch Test Timing Format Specification
unfamiliar with menu.
a. Move cursor to Acquisition mode field and SELECT Glitch.
b. Move cursor to Find Pattern field and SELECT. Push DON’T CARE
(all Xs) snd SELECT. Set Present for field to > 30 ns.
c. Set Then find Glitch on all channels (all * s).
Figure 3-33. Glitch Test Timing Trace Specification
Performance Tests HP 1650B/1651B
3-26 Service Manual
6. Press R UN. The timing analyzer acquires data and shows glitches for
channels under test as in figure 3-34. SELECT Delay field and rotate knob
to assure consistent glitch detection.
Figure 3-34. Glitch Test Timing Waveforms
Note If sample clock and data synchronize, glitches may be displayed on the timing
screen as valid data transitions.
7. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
8. Repeat steps 3, 4, and 6 until all pods have been tested (pods 1 through 5).
Make sure to assign correct pod to be tested in System Configuration.
9. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector.
10. Repeat steps 3, 4, 6 and 7 until the upper bits of all pods have been tested
(pods 1 through 5).
HP 1650B/1651B Performance Tests
Service Manual 3-27
Threshold
Accuracy Test
Description: This performance test verifies the threshold accuracy within the
three ranges stated in the specification.
Specification:
Threshold accuracy: 150 mV accuracy over the range -2.0 to + 2.0 volts; 300 mV
accuracy over the ranges -9.9 to -2.1 volts and + 2.1 to + 9.9 volts.
Equipment:
Power Supply .................................... HP 6216B
Test Connector (1)......................... see figure 3-1
Procedure:
1. Connect the test equipment as in figure 3-35.
Figure 3-35. Threshold Accuracy Test Setup
Note In this setup, only eight channels are tested at a time to minimize loading. Ground
lead must be grounded to ensure accurate test results.
2. Assign the pod under test to Analyzer 1 in System Configuration as in
previous figure 3-31.
3. Configure Timing Format Specification for User Defined pod threshold of
0.0 V for the pod under test and assign the lower eight bits in the bit
assignment field as in figure 3-36. Refer to steps a and b if unfamiliar with
menu.
a. Move cursor to Pod Threshold field and SE LE CT. Move cursor to
User-defined field and SELECT. Enter the appropriate voltage
threshold.
Performance Tests HP 1650B/1651B
3-28 Service Manual
b. Move cursor to bit assignment field and turn on the appropriate eight
bits to be tested (* = on; . = off).
Figure 3-36. Threshold Accuracy Format Specification
4. Set Timing Trace Specification as in figure 3-37. Follow steps a through c if
unfamiliar with menus.
a. Move cursor to Acquisition mode and SELECT Glitch.
b. Move cursor to Find Pattern and SELE CT. Push DON’T CAR E (all
X s) and SELECT. Set present for field to > 30 ns.
c. Set Then find Glitch to all DO N’T CARES (all
Figure 3-37. Threshold Accuracy Trace Specification
·
s).
HP 1650B/1651B Performance Tests
Service Manual 3-29
5. Adjust the power supply output for + 150 mV.
6. Press R UN. Data displayed on Timing Waveforms is be high for the pod and
channels under test as in figure 3-38.
Figure 3-38. Threshold Accuracy Timing Waveforms 1
7. Adjust power supply output for -150 mV.
8. Press RUN. Data displayed on Timing Waveforms is all low for the
channels under test as in figure 3-39.
Figure 3-39. Threshold Accuracy Timing Waveforms 2
9. Return to Timing Format Specification and change User Defined Pod
Threshold to + 9.9 V.
10. Adjust power supply for output of + 10.2 V.
11. Press RUN. Data displayed on Timing Waveforms all high for the pod and
channels under test as in previous test figure 3-37.
12. Adjust power supply for output of + 9.6 V.
13. Press RUN. Data displayed on Timing Waveforms is all low for the pod and
channels under test as in previous test figure 3-40.
Performance Tests HP 1650B/1651B
3-30 Service Manual
14. Return to the Timing Format Specification and change the User Defined pod
threshold to -9.9 V.
15. Adjust power supply for output of -9.6 V.
16. Press RUN. Data displayed on Timing Waveforms is all high for the pod and
channels under test as in previous test figure 3-39.
17. Adjust power supply for output of -10.2 V.
18. Press RUN. Data displayed on Timing Waveforms is all low for the pod and
channels under test as in previous test figure 3-40.
19. Remove the probe tip assembly from the logic analyzer probe cable and
attach to the next logic analyzer probe cable to be tested. Take care not to
dislodge grabbers from the test connector.
20. Repeat steps 2 through 18 until all pods have been tested (pods 1 through 5).
21. Disconnect lower eight bits (bits 0 through 7) from test connector. Attach
upper eight bits (bits 8 through 15) to the test connector.
22. Repeat steps 2 through 19 until the upper bits of all pods have been tested
(pods 1 through 5).
HP 1650B/1651B Performance Tests
Service Manual 3-31
Table 3-1. Performance Test Record
Hewlett-Packard Tested by
Model 1650B/51B ____________
Logic Analyzer Work Order No.
________
Serial Date Tested
Number ____________
____________
Recommended Calibration
Interval
Test Results
Clock, Qualifier, and Data Passed Failed
Inputs Test 1 Pod1 ______ ______
24 Months
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Clock, Qualifier, and Data Passed Failed
Inputs Test 2 Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Clock, Qualifier, and Data Passed Failed
Inputs Test 3 Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Clock, Qualifier, and Data Passed Failed
Inputs Test 4 Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Clock, Qualifier, and Data Passed Failed
Inputs Test 5 Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Performance Tests HP 1650B/1651B
3-32 Service Manual
Table 3-1. Performance Test Record (continued)
Test Results
Clock, Qualifier, and Data Passed Failed
Inputs Test 6 Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Glitch Test Passed Failed
Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
Threshold Accuracy Test Passed Failed
Pod1 ______ ______
Pod2 ______ ______
Pod3 ______ ______
Pod4 ______ ______
Pod5 ______ ______
HP 1650B/1651B Performance Tests
Service Manual 3-33
Contents
Section 4 Adjustments
Introduction ....................................................................................................................4-1
Calibration Interval ........................................................................................................ 4-1
Safety Requirements ...................................................................................................... 4-1
Recommended Test Equipment...................................................................................4-2
Instrument Warmup.......................................................................................................4-2
Calibration ....................................................................................................................... 4-2
Power Supply Assembly Adjustment ...........................................................................4-3
CRT Monitor Assembly Adjustments ......................................................................... 4-4
Intensity, Sub-bright, and Contrast Adjustment ....................................................4-4
Focus Adjustment...................................................................................................... 4-5
Horizontal Phase, Vertical Linearity, and H eight Adjustments..........................4-6
System Board Assembly Threshold Adjustment ........................................................4-7
Examples..................................................................................................................... 4-8
Introduction This section provides adjustment procedures for the HP 1650B/51B. The
assemblies with adjustments are: the power supply, CRT monitor, and the system
board. Figures in this section are the testpoint and adjustment locations for the
HP 1650B/51B.
4Adjustments
Calibration
Interval
The recommended calibration interval for the HP 1650B/51B is two years. The
adjustments are set at the factory on assemblies when they are tested. However,
adjustments may be necessary after repairs have been made to the instrument.
Usually the only assembly that may require adjustments is the assembly that has
been replaced.
Note An instrument warm-up of 15 minutes is recommended, but not required, before
adjustment procedures are performed.
Warning Read the Safety Summary at the beginning of this manual before
performing any adjustment procedures.
Caution The adjustment procedures are performed with the top cover of the instrument
removed. Take care to avoid shorting or damaging internal parts of the instrument.
Safety
Requirements
Specific warnings, cautions, and instructions are placed wherever applicable
throughout the manual. These must be observed during all phases of operation,
service, and repair of the module. Failure to comply with them violates safety
standards of design, manufacture, and intended use of this module.
Hewlett-Packard assumes no liability for the failure of the customer to comply with
these safety requirements.
HP 1650B/1651B Adjustments
Service Manual 4-1
Recommended
Test Equipment
Recommended test equipment for calibration and adjustment is listed in table 1-3.
Any equipment that satisfies the critical specifications given in the table may be
substituted for the recommended models.
Warning Read the safety summary at the front of this manual before any
adjustment, replacement, maintenance, or repair is performed.
Instrument
Warmup
Adjust and calibrate the instrument at it’s environmental ambient temperature and
after a 15 minute warm-up.
Calibration The calibration procedures in this section should be followed in their entirety and
in the same sequence as in this section.
Adjustments HP 1650B/1651B
4-2 Service Manual
Power Supply
Assembly
Adjustment
Caution High voltages exist on the sweep board that can cause personal injury. Avoid
1. Disconnect power cord from HP 1650B/51B. Refer to figure 4-1.
2. Connect the negative lead of the voltmeter to Power Supply Assembly ground.
3. Connect the positive lead of the voltmeter to + 5V on the Power Supply
Assembly.
4. Connect the power cord to the HP 1650B/51B and put power switch in ON
position.
5. Voltmeter should indicate voltage within the range of + 5.180 V to + 5.220 V.
6. If voltmeter reading is out of this range, adjust + 5 ADJ on Power Supply
Assembly to + 5.200 V % .050 V (+ 5.180 V to + 5.220 V).
contact with the CRT monitor sweep board when adjusting the + 5V.
Figure 4-1. Power Supply Adjustments
HP 1650B/1651B Adjustments
Service Manual 4-3
CRT Monitor
Assembly
Adjustments
Intensity,
1. Refer to figure for adjustment locations.
Sub-bright,
and Contrast
Adjustment
2. Place TIMING WAVEFORMS menu on the screen of the HP 1650B/51B, by
pressing front-panel DISPLAY key.
Note This menu is used because it has characters throughout the screen which are
watched during the procedures. Any other menu may be used; however, the
adjustments may not be as accurate if characters and/or lines are not displayed
throughout the screen.
3. Set rear-panel INTENSITY to the minimum setting.
4. Adjust sweep board SUB BRIGHT control to the lowest setting of brightness
where menu is visible on the CR T screen.
Caution High voltages exist on the sweep board. Avoid contact with the sweep board when
making CRT adjustments.
Figure 4-2. CRT Adjustment Locations
Adjustments HP 1650B/1651B
4-4 Service Manual
5. Turn rear-panel INTENSITY to bring up the intensity level on screen. Screen
intensity should be at a comfortable viewing level and the position of both
adjustments should be close to mid-range.
6. Press RUN and then STOP.
7. Adjust CONT so the error message is easily seen.
Focus
Adjustment
1. Refer to figure for adjustment locations.
2. Place TIMING WAVEFORMS menu on the screen of the H P 1650B/51B by
pressing the front-panel DISPLAY key.
3. Adjust sweep board FOCUS control for sharp pixels in the center of the
screen menu. Note FOCUS control position.
4. Adjust sweep board FOCUS for sharp pixels at the corners of the screen.
Note FOCUS control position.
5. Set sweep board FOCUS control for mid-position between the two positions
noted in steps 3 and 4 for best over-all pixel focus.
HP 1650B/1651B Adjustments
Service Manual 4-5
Horizontal
1. Refer to figure for adjustment locations.
Phase,
Vertical
Linearity, and
2. Place TIMING WAVE FORMS menu on the screen of the H P 1650B/51B by
pressing front-panel DISPLAY key.
Height
Adjustments
Note This menu is used because it has characters and lines throughout the menu which
are watched during the procedures. Any other menu may be used, however, the
adjustments may not be as accurate.
3. Adjust sweep board H . PHASE to center the menu horizontally on the CRT
screen.
4. Adjust sweep board V. LIN so top and bottom rows of text are equal in height.
Text height should be approximately 1mm.
Note The V. LIN and HE IG HT adjustments are interactive and may need to be
repeated as necessary.
5. Adjust sweep board H EIGHT to give the screen menu top and bottom
borders equal to the side borders of the menu.
6. Readjust steps 4 and 5 as necessary for a uniform display of the screen menu.
Adjustments HP 1650B/1651B
4-6 Service Manual
System Board
Assembly
Threshold
Adjustment
1. Disconnect power cord from HP 1650B/51B.
2. Connect negative (-) lead of voltmeter to TP GND. Refer to figure 4-3 for
testpoint and adjustment locations.
3. Connect positive (+ ) lead of voltmeter to HP 1650B A1TP3, or HP 1651B
A1TP2 on the System Board Assembly.
4. Connect power cord to logic analyzer and turn instrument power to ON.
Figure 4-3. System Board Testpoints and Adjustments
5. Assign HP 1650B POD 3, or HP 1651B POD 2, to a machine in the System
Configuration menu by using front-panel knob and SELECT key.
6. Set U ser defined Pod Threshold of the pod assigned in the previous step to
-9.9 V in the Format Specification menu by using the following steps if
unfamiliar with the menus.
HP 1650B/1651B Adjustments
Service Manual 4-7
a. Press front-panel FORMAT key.
b. Move cursor to TTL (threshold field) and press SELECT.
c. Assign User defined threshold by using front-panel knob and SELECT key.
7. Voltmeter readout should indicate voltage within the range of -.975 V to -1.005
V (-.990 V % .015 V).
8. Set U ser defined Pod Threshold of the pod assigned in the previous step to
+ 9.9 V in the Format Specification menu.
9. Note voltmeter readout. Voltage reading should be within the range of + .975
V to + 1.0005 V (+ .990 V % .015 V).
10. If either voltage reading is not within the given range, use the procedure below
to adjust the threshold level.
a. Set User defined Pod threshold of the pod assigned to -9.9 V.
b. Adjust A1R57 for reading of -.9900 V % .0005 V. R efer to figure 4-3 for
adjustment locations.
c. Set User defined Pod threshold to + 9.9 V.
d. Note the difference between this reading and + .9900 V.
e. Adjust A1R57 so the difference in step d is halved, % .0005 V.
EXAMPLES If reading is + .9952 V, the difference is .0052 V. Adjust A1R57 for + .9926 V %
.0005 V.
If reading is + .9834 V, the difference is .0066 V. Adjust A1R57 for + .9867 V %
.0005 V.
Adjustments HP 1650B/1651B
4-8 Service Manual
Contents
Section 5 Replaceable Parts
Introduction ...................................................................................................................5-1
Abbreviations .................................................................................................................5-1
Replaceable Parts List .................................................................................................. 5-1
Exchange Assemblies .................................................................................................... 5-1
Ordering Information ...................................................................................................5-2
Direct Mail Order System ............................................................................................ 5-2
Introduction This section contains information for ordering parts. Service support for this
instrument is to the assembly level. The replaceable parts include assemblies and
chassis parts. Figure 5-1 shows an exploded view of the instrument.
Abbreviations Table 5-1 lists the abbreviations used in the parts list and throughout this manual.
Abbreviations in the replaceable parts list are in capital letters. In other sections
of this manual abbreviations may be in uppercase or lowercase letters.
5Replaceable Parts
Replaceable
Parts List
Table 5-2 is a list of replaceable parts and is organized as follows:
1. Electrical assemblies in alphanumerical order by reference designation.
2. Chassis-mounted parts in alphanumerical order by reference designation.
Information given for each part consists of the following:.
·
Reference designation.
·
HP part number.
·
Part number Check Digit (CD).
·
Total quantity (Qty) in the instrument or on the assembly. The total quantity
is given once at the first appearance of the part number in the list.
·
Description of the part.
·
Typical manufacturer of the part in a five digit code. All parts in this list
(except hardware) is manufactured by or for Hewlett-Packard, code is 28480.
No list of manufacturers is provided.
Exchange
Assemblies
HP 1650B/1651B Replaceable Parts
Service Manual 5-1
Some of the assemblies used in this instrument have been set up on the exchange
program. This allows the customer to exchange his faulty assembly with one that
has been repaired, calibrated, and performance verified by the factory. The cost is
significantly less than that of a new assembly. The exchange assemblies have a part
number in the form XXXXX-695XX.
After receiving the repaired exchange assembly from Hewlett-Packard, a United
States customer has 30 days to return the faulty assembly. For orders not
originating in the U nited States, contact the local H P service organization. If the
faulty assembly is not returned within the warranty time limit, the customer will be
charged an additional amount. The additional amount will be the difference in
price between a new assembly and that of an exchange assembly.
Ordering
Information
To order a replaceable part, indicate the HP part number, check digit, and
quantity required. Send the order to the nearest HP Sales/Service office.
To order a part that is not listed in the replaceable parts table, include the
instrument model number, serial number, description and function of part, and
total quantity required. Address an order to the nearest HP Sales/Service office.
Direct Mail Order
System
Within the USA, Hewlett-Packard can supply parts through a direct mail order
system. Advantages of using this system are as follows:
·
Direct ordering and shipment from HP Parts Center, California, U .S.A. Call
your local Hewlett-Packard office for the toll free number.
·
No maximum or minimum on any mail order (there is a minimum order
amount for parts ordered through local HP offices when orders require billing
and invoicing).
·
Prepaid transportation (there is a small handling charge for each order).
·
No invoices.
To provide these advantages, check or money order must accompany each order.
Mail order forms and specific ordering information are available through your
local HP offices.
Replaceable Parts HP 1650B/1651B
5-2 Service Manual
Table 5-1. Reference Designator and Abbreviations
REFERENCE DESIGN ATOR
A
B
BT
C
CR
DL
DS
E
= a ssembly
= fan;motor
= b attery
= cap acitor
= d iode;dio de thyristor;
varactor
= d elay line
= annunciator;lamp;LED
= m isc. electrical part
F
FL
H
J
L
MP
P
=fuse
= filter
= h ardware
= electrical connector
(stationary po rtion);jack
= coil;inductor
= m isc. mechanical part
= electrical connector
(moveable po rtion);plug
ABBREVIATIONS
Q
R
RT
S
T
TB
TP
A
A/D
AC
ADJ
AL
AMPL
ANLG
ANSI
ASSY
ASTIG
ASYNCHRO
ATTEN
AWG
BAL
BCD
BD
BFR
BIN
BRDG
BSHG
BW
C
CAL
CC
CCW
CER
CFM
CH
CHAM
CHAN
CHAR
CM
CMOS
CMR
CNDCT
CNTR
CON
CONT
CRT
CW
D
D/A
DAC
DARL
DAT
DBL
DBM
DC
DCDR
DEG
DEMUX
DET
DIA
DIP
DIV
DMA
DPDT
DRC
DRVR
= transistor;SCR;
triode th yristor
=resistor
=thermistor
=switch;jumper
= transforme r
= terminal board
= test point
= am peres
= analog-to-digital
= alternating current
= adjust(ment)
= aluminum
= amplifier
=analog
= American National
Standards Institute
= a ssembly
= a stigmatism
= asynchronous
= atten uator
= American wire gauge
= b alance
= b inary-code decimal
= board
= b uffer
=binary
= bridge
= bushing
= bandwidth
= ceram ic;cermet
(resistor)
= calibrate;calibration
= carbon composition
= counterclockwise
= ceram ic
= cubic feet/minute
= choke
= ch amfered
= channel
=character
= cen timeter
= co mplementary metal oxide-semiconductor
= common mode rejec tion
= conductor
= counter
= connector
= contact
= cathode-ray tube
=clockwise
=diameter
= d igital-to-analog
= d igital-to-analog
converter
= darlington
=data
= double
= d ecibel referenced
to 1mW
= d irect current
= decoder
=degree
= d emultiplexer
= d etector
=diameter
= d ual in-line package
= d ivision
= d irect memory access
= double-pole,
double-throw
= DAC refresh con troller
=driver
U
V
VR
W
X
Y
DWL
ECL
ELAS
EXT
F
FC
FD
FEM
FF
FL
FM
FR
FT
FW
FXD
GEN
GND
GP
GRAT
GRV
H
HD
HDND
HG
HGT
HLCL
HORIZ
HP
HP-IB
HR
HV
HZ
I/O
IC
ID
IN
INCL
INCAND
INP
INTEN
INTL
INV
JFET
JKT
K
L
LB
LCH
LCL
LED
LG
LI
LK
LKWR
LS
LV
M
MACH
MAX
= i ntegrate d circu it;
microc ircuit
= electron tube; glow
lamp
= voltage regulator;
breakdown d iode
=cable
=socket
= crystal unit(piezo electric or q uartz)
=dowel
= emitter coupled logic
= elastomeric
=external
= farads;m etal film
(resi stor)
= carbon film/
comp osition
= feed
= fem ale
= flip-flop
=flat
= foam;from
=front
= gain bandwidth
product
= full wave
=fixed
= g enerator
= ground(ed)
= g eneral purpose
=graticule
=groove
= h enries;high
= h ardware
= hardened
=mercury
=height
= h elical
= horizontal
= Hewlett-Packard
= Hewlett-Packard
Interface Bus
= h our(s)
= high voltage
=Hertz
= input/output
= i ntegrate d circu it
= in side diameter
=inch
=include(s)
= incandescent
= input
=intensity
=internal
=inverter
= junction field effect transistor
=jacket
= kilo(103)
=low
= pound
=latch
=local
= light-emitting
diod e
=long
= lithium
=lock
=lockwasher
= lo w power Schottky
= low voltage
= m ega(106);megohms;
meter(distance)
= machine
=maximum
HP 1650B/1651B Replaceable Parts
Service Manual 5-3
Figure 5-1. HP 1650B/51B Exploded View
Replaceable Parts HP 1650B/1651B
5-4 Service Manual
Table 5-2. Replaceable Parts List
Reference HP Part Mfr Mfr Part
Designator Number CD Qty Description Code Number
A1 01652-66501 0 1 SYSTEM BOARD ASSEMBLY – 80 CHANNEL (1650B) 28480 01652-66501
A1 01653-66501 1 1 SYSTEM BOARD ASSEMBLY – 32 CHANNEL (1651B) 28480 01653-66501
A2 01650-66503 0 1 KEYBOARD CIRCUIT BOARD ASSEMBLY 28480 01650-66503
A3 2090-0204 9 1 MONITOR ASSEMBLY 28480 2090-0204
A4 0960-0753 6 1 ROTARY PULSE GENERATOR 28480 0960-0753
A5 0950-1879 8 1 POWER SUPPLY ASSEMBLY 28480 0950-1879
A6 0950-1798 0 1 DISK DRIVE ASSEMBLY 28480 0950-1798
A7 01650-61614 4 1 INTENSITY ADJUSTMENT ASSEMBLY 28480 01650-61614
A8 9135-0325 8 1 LINE FILTER SWITCH ASSEMBLY 28480 9135-0325
A9 01650-61608 6 5 PROBE TIP ASSEMBLY (1650B) 28480 01650-61608
A9 01650-61608 6 2 PROBE TIP ASSEMBLY (1651B) 28480 01650-61608
B1 3160-0429 0 1 FAN-TUBEAXIAL 100-CFM 12VDC 28480 3160-0429
E1 5959-9333 8 0 REPLACEMENT PROBE LEADS (PKG OF 5) 28480 5959-9333
E2 5959-9334 9 0 REPLACEMENT PROBE GROUNDS (PGK OF 5) 28480 5959-9334
E3 5959-9335 0 0 REPLACEMENT POD GROUNDS (PKG OF 5) 28480 5959-9335
E4 5959-0288 4 5 GRABBER ASSEMBLY SET – 20 28480 5959-0288
E4 5959-0288 4 2 GRABBER ASSEMBLY SET-20 (1651B) 28480 5959-0288
F1 2110-0003 0 1 FUSE 3A 250V NTD FE UL 28480 2110-0003
H1 0535-0113 1 10 NUT "U"-TP M3 X 0.500.3MM-THK (TOP COVER) 28480 0535-0113
H2 0535-0056 1 4 NUT-HEX PRVLG-TRQ M4 X 0.7 5MM-THK (CRT) 28480 0535-0056
H3 2950-0001 8 3 NUT-DBL-CHAM 3/8-32-THD0.094-IN-THK (RPG, BNC) 28480 2950-0001
H4 2950-0072 3 1 NUT-DBL-CHAM 1/4-32-THD0.062-IN-THK (INTEN ADJ) 28480 2950-0072
H5 0515-0372 2 10 SCREW M3 X 0.5 8MM-LG (DISK DRIVE, REAR PANEL) 28480 0515-0372
H6 0515-0821 6 4 SCREW- M3.5 X 0.6 (FAN) 28480 0515-0821
H7 0515-1035 6 22 SCREW-M3 X 0.5 8MM- (FEET, LINE FIL, TOP COVER) 28480 0515-1035
H8 0515-1135 7 4 SCREW- M3 X 0.5 25MM-LG (KEYPAD) 28480 0515-1135
H9 0515-1951 5 8 SCREW-TAPPING M4.2 (SYSTEM BOARD) 28480 0515-1951
H10 01650-82401 1 2 M5 SHOULDER SCREW (HANDLE) 28480 01650-82401
H11 2190-0009 4 2 WASHER-LK INTL T NO. 80.168-IN-ID 28480 2190-0009
H12 2190-0016 3 2 WASHER-LK INTL T 3/8 IN0.377-IN-ID (BNC) 28480 2190-0016
H13 2190-0027 6 1 WASHER-LK INTL T 1/4 IN0.256-IN-ID (INTEN ADJ) 28480 2190-0027
H14 3160-0092 3 1 FAN GUARD 28480 3160-0092
H15 0590-1868 1 4 FAN MOUNTING CLIP 28480 0590-1868
H16 1400-0611 0 1 CLAMP-FL-CA 1-WD (DISK DRIVE CABLE) 28480 1400-0611
H17 0380-1482 5 2 HEX STANDOFF .0340 (HP-IB CABLE) 28480 0380-1482
H18 01650-00203 3 2 NUT PLATE (HANDLE) 28480 01650-00203
MP1 01650-45201 1 1 ELAN CABINET MOLDED PLASTIC 28480 01650-45201
MP2 01650-04901 2 1 BALE HANDLE 28480 01650-04901
MP3 1460-1345 5 2 TILT STAND SST 28480 1460-1345
MP4 01650-47701 0 2 MOLDED FOOT 28480 01650-47701
MP5 01650-01202 0 1 GROUND BRACKET 28480 01650-01202
MP6 01650-94307 1 1 IDENTIFICATION LABEL (1650B) 28480 01650-94307
MP6 01651-94302 7 1 IDENTIFICATION LABEL (1651B) 28480 01651-94302
MP7 01650-94306 0 1 KEYBOARD LABEL 28480 01650-94306
MP8 01650-45206 6 1 KEYBOARD HOUSING 28480 01650-45206
MP9 01650-41901 0 1 ELASTOMERIC KEYPAD 28480 01650-41901
HP 1650B/1651B Replaceable Parts
Service Manual 5-5
Table 5-2. Replaceable Parts List (continued)
Reference HP Part Mfr Mfr Part
Designator Number CD Qty Description Code Number
MP10 01650-45205 5 1 KEYBOARD SPACER 28480 01650-45205
MP11 01650-46101 2 2 LOCKING PIN PCB 28480 01650-46101
MP12 01650-00205 1 1 REAR PANEL (1650B) 28480 01650-00205
MP12 01651-00203 0 1 REAR PANEL (1651B) 28480 01651-00203
MP13 7120-4835 0 1 CSA CERTIFICATION LABEL 28480 7120-4835
MP14 01650-04101 4 1 TOP COVER 28480 01650-04101
MP15 01650-84501 6 1 ACCESSORY POUCH 28480 01650-84501
MP16 01650-94303 7 1 PROBE LABELS 28480 01650-94303
MP17 01650-29101 6 5 GROUND SPRING (SYSTEM BOARD 1650B) - 28480 01650-29101
MP17 01650-29101 6 2 GROUND SPRING (SYSTEM BOARD 1651B) 28480 01650-29101
MP18 01650-29102 7 1 CLIP RS-232 ESD 28480 01650-29102
MP19 01650-25401 1 1 INSULATOR-ELAN DISK 28480 01650-25401
MP20 01650-63202 0 1 RS-232 LOOPBACK CONNECTOR 28480 01650-63202
MP21 01650-47401 7 1 RPG KNOB 28480 01650-47401
W1 01650-61601 9 1 SWEEP CABLE 28480 01650-61601
W2 54503-61606 7 1 POWER SUPPLY CABLE 28480 54503-61606
W3 01650-61604 2 1 DISK CABLE 28480 01650-61604
W4 01650-61605 3 2 BNC CABLE 28480 01650-61605
W5 01650-61607 5 5 PROBE CABLE (1650B) 28480 01650-61607
W5 01650-61607 5 2 PROBE CABLE (1651B) 28480 01650-61607
W6 01650-61613 3 1 HP-IB CABLE 28480 01650-61613
W7 01650-61616 6 1 FAN CABLE 28480 01650-61616
Replaceable Parts HP 1650B/1651B
5-6 Service Manual
Section 6 Service
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Theory of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Data Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Arming Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
CRT Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Disk Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Keypad and Knob Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
RS-232-C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
Trouble Isolation Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Power Supply Voltages Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
CRT Monitor Signals Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Keyboard Signals Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Assembly Removal and Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Removal and Replacement of System Assembly Board . . . . . . . . . . . . . . . . . . 6-17
Removal and Replacement of CRT Monitor Assembly. . . . . . . . . . . . . . . . . . 6-19
Removal and Replacement of Power Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Removal and Replacement of Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Removal and Replacement of Keyboard Assembly . . . . . . . . . . . . . . . . . . . . . 6-21
Self Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
Data Acquisition Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
RS-232-C Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
BNC Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
Keyboard Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
RAM Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
ROM Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Disk Drive Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Cycle Through Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Auxiliary Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Service
Introduction This section provides troubleshooting, service, and repair information for the
HP 1650B/51B Logic Analyzer . Troubleshooting consists of flowcharts, self- test
descriptions and instructions for use, and signal level tables. The troubleshooting
information is provided to isolate a faulty assembly. When a faulty assembly has
been located, the disassembly/assembly procedures help direct replacement of the
assembly.
Safety Read the Safety Summary at the front of this manual before servicing the
instrument. Before performing any procedure, review it for cautions and warnings.
Warning Maintenance should be performed by trained service personnel aware of
the hazards involved (for example, fire and electric shock). When
maintenance can be performed without power applied, the power cord
should be removed from the instrument.
6
HP 1650B/1651B Service
Service Manual 6-1
Figure 6-1. Simplified Block Diagram
Service HP 1650B/1651B
6-2 Service Manual
Theory of
Operation
The HP 1650B/51B Logic Analyzer is an 80/32 channel state and timing logic
analyzer. The human interface is a front-panel keypad and knob for instrument
control and 9" (diagonal) white phosphor CRT for information display. Available
on the rear panel are RS-232-C and HP-IB ports for communication to a printer or
from a controller. Also on the rear panel are two BNCs for input or output of an
external trigger.
The System Assembly Board is built around the 68000 microprocessor and
powerful data acquisition ICs that probe, shape, store, and analyze data from a
target system. An acquisition interface to the 68000 makes the acquisition system
fully compatible with the architecture of the 68000 microprocessor. The System
Assembly contains the necessary circuitry to interface the keypad, CRT monitor,
disk drive, RS-232-C and HP-IB ports.
Figure 6-1 is a simplified block diagram of the instrument. The hardware of the
HP 1650B/51B consists of four main assemblies. Also shown are rear panel
connectors. This manual supports troubleshooting to assembly level. Theory of
operation for the System Assembly is included for information only and is not
intended for troubleshooting purposes.
Data Acquisition The data acquisition of the System Assembly consists of the data acquisition pods,
acquisition ICs, and the interface to the 68000. The interface to the target system
is through any of the data acquisition pods. There are five pods available on the
HP 1650B (80 channels) and two pods available on the HP 1651B (32 channels).
Each pod contains 16 input data probes and one external clock input for state
mode measurements. The data probes can be used for state or timing
measurements.
Each pod consists of a probe tip assembly and a 4.5 foot woven cable. A probe tip
assembly includes 17 twelve-inch probes and a common ground return. This is
connected to one end of the cable. The other end of the woven cable terminates at
the rear panel of the logic analyzer. The woven cable consists of 17 nichrome
signal lines, 34 signal return lines and 2 power supply lines. All are woven together
with polyarmid yarn.
Each probe input has an input impedance of 100k ohms in parallel with
approximately 8 pF. The probes can be grounded in two ways: with a common
pod ground for state measurements, or a probe tip ground for higher frequency
measurements.
The input signals are attenuated by a factor of 10 in the passive probe. The signals
are applied to a comparator where they are compared against a voltage threshold
to determine if the voltage level is above or below the threshold level. The
comparator then shapes the single-ended signal and outputs it at an ECL level to
the acquisition IC. The input data is then stored at the acquisition IC.
Arming Control The two BNCs on the rear panel are used for arming control of the logic analyzer
acquisition ICs. An arm signal may be output from the ICs to the rear panel
EXTER NAL TRIGGER OU T (J10), or input to the ICs from EXTER NAL
TRIGGER IN (J9).
HP 1650B/1651B Service
Service Manual 6-3
Memory The memory of the logic analyzer consists of three separate memories: one ROM
and two RAMs. The system (EP)ROM is 64K long by 8 wide and is used primarily
for booting-up the system and self-test storage. The system (D)RAM is 1M long
by 8 wide and contains the operating system and the acquired data from the target
system. Since the R AM is a volatile memory, the operating system is loaded
loaded at each power-up of the instrument via the built-in disk drive and a mini
floppy disk.
The display (D)RAM is 64K long by 4 wide and is cycle shared between the 68000
and the display refresh cicuitry. This is why the display bus is separate from the
local bus. The two buses are separated by a set of address multiplexers and data
buffers.
CRT Controller The CRT controller provides the synchronization and timing signals needed by the
CRT Monitor Assembly to drive the CRT.
The controller generates four signals: Horizontal sync, vertical sync, display
enable and a 6.25 kH z signal. The horizontal and vertial sync signals are applied to
the CR T monitor assembly and to display PALs. The display PALs use the sync
signals to generate the timing signals for the display RAM.
The CRT Monitor Assembly consists of the sweep board circuitry, a 9-inch white
phosphor display CRT, and the CRT yoke. The assembly requires + 5 and + 12
volts, which it receives from the power supply via the System Board Assembly.
Disk Controller The disk controller performs the necessary functions for reading or writing data to
the built-in disk drive of the logic analyzer. The disk controller interface to the
68000 is an 8-bit bidirectional bus for data, status, and control word transfers.
The built-in disk drive is a 3.5-inch double-sided Sony disk drive. The main
features of the disk drive are low power consumption, low height, and high
reliability with simple mechanism and electronic circuitry.
Keypad and Knob
Interface
RS-232-C
Interface
The keypad and knob interface provide the circuitry to latch and send the keypad
and knob data to the 68000.
The keypad is elastomeric and each key has a single function.
The controlling IC of the R S-232-C Interface is a Signetics SCN2661 Enhanced
Programmable Communications Interface (EPCI), a universal
synchronous/asynchronous receiver/transmitter (USART) data
communications IC.
The SCN2661 serializes parallel data from the 68000 for transmission. At the same
time, it also receives serial data and converts it to parallel data characters for the
68000.
The IC contains a baud rate generator which can be programmed from the logic
analyzer I/O menu for one of eight baud rates. Protocol, word length, stop bits
length, and parity are also programmed via the I/O menu.
Service HP 1650B/1651B
6-4 Service Manual
The DS14C88 and DS14C89 are line drivers/receivers used by the logic analyzer
for interface of terminal equipment with data communications equipment. Slew
rate control is provided on the ICs eliminating the need for external capacitors.
Power Supply
Assembly
The switching power supply provides 120 W (200 W maximum) for the instrument.
The ac input to the power supply is 115V or 230 V, -25 to + 15%. Maximum input
power is 350 VA maximum. The ac input frequency is 48 - 66 H z.
All voltages necessary to operate the instrument are applied first to the System
Assembly. Unfiltered voltages of + 12V, -12V, + 5.2V, -5.2V and + 3.5V are
supplied to the board where they are then filtered and distributed throughout the
board and to the CR T Monitor Assembly. Filtered voltages of approximately + 5
V and + 12 V are routed through the System Assembly to the CRT Monitor
Assembly. The + 5.2 V supply is adjustable on the supply.
HP 1650B/1651B Service
Service Manual 6-5
Trouble
Isolation
Flowcharts
The trouble isolation flowcharts are the troubleshooting guide. Start there when
repairing a defective instrument.
The flowcharts refer to other tests, tables, and procedures to help isolate trouble.
Disassembly procedures are included to direct in replacing faulty assemblies. The
circled numbers on charts indicate the next chart to use for isolating a problem.
Figure 6-2. Primary Troubleshooting Flowchart
Service HP 1650B/1651B
6-6 Service Manual
Figure 6-3. Trouble Isolation Flowchart for Fan/Fuse
HP 1650B/1651B Service
Service Manual 6-7
Figure 6-4. Trouble Isolation for Power Supply
Service HP 1650B/1651B
6-8 Service Manual
Figure 6-5. Trouble Isolation for CRT Monitor
HP 1650B/1651B Service
Service Manual 6-9
Figure 6-6. Trouble Isolation for Flowchart
Service HP 1650B/1651B
6-10 Service Manual
Figure 6-7. Trouble Isolation for Disk Drive
HP 1650B/1651B Service
Service Manual 6-11
Figure 6-8. Trouble Isolation for Data Acquisition
Service HP 1650B/1651B
6-12 Service Manual
Figure 6-9. Trouble Isolation for RS-232-C
Figure 6-10. Trouble Isolation for BNC
HP 1650B/1651B Service
Service Manual 6-13
Power Supply
Voltages Check
The power supply must be loaded by either the System Assembly Board or with an
added resistor to check the voltages.
Warning This procedure is to be performed only by service-trained personnel
aware of the hazards involved (such as fire and electrical shock).
Power Supply Loaded by System Assembly
1. Remove instrument top cover.
2. Using the figure below, check for the voltages indicated at the testpoints.
Figure 6-11. Power Supply Test Points
Power Supply Isolated
Isolate and check the supply with the following steps. U se the figure above for
reference.
1. Remove instrument power cable.
2. Disconnect supply output cable at supply (see figure above).
3. Load + 5.20 V supply with a 2 ohm 25 watt resistor. Use jumper wires to
connect one end of the resistor to any of pins 1-4, and the other end to any of
pins 5-8.
Service HP 1650B/1651B
6-14 Service Manual
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