HP 16500B User Manual

Errata

16500B/16501A Logic Analysis System Service Guide

16500-97011

August 1994

Title & Document Type:

Manual Part Number:

Revision Date:

HP References in this Manual

This manual may contain references to HP or Hewlett-Packard. Please note that HewlettPackard's former test and measurement, semiconductor products and chemical analysis businesses are now part of Agilent Technologies. We have made no changes to this manual copy. The HP XXXX referred to in this document is now the Agilent XXXX. For example, model number HP8648A is now model number Agilent 8648A.

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Service Guide

Publication number 16500-97011 First edition, August 1994

For Safety information, Warranties, and Regulatory information, see the pages at the end of the book.

HP 16500B/16501A Logic Analysis System

The HP 16500B is the mainframe of the Logic Analysis System, and the HP 16501A is the expansion frame. The HP 16500B/16501A is of modular structure using plug-in cards with a wide range of data acquisition and stimulus capabilities.

Features

Some of the main features of the HP 16500B/16501A are as follows:

• Modular mainframe with five card slots

• Expansion frame, which expands the total system card slots to ten

• Touchscreen user interface

• 86 Mbyte hard disk drive

• High-density 3.5-inch flexible disk drive

• Color monitor

• Intermodule triggering and time correlation of acquired data

• HP-IB, RS-232C or optional LAN interfaces for hardcopy output to a printer or

controller interface

Service Strategy

The service strategy for this instrument is the replacement of defective assemblies. This service guide contains information for finding a defective assembly by testing and servicing the HP 16500B/16501A.

This instrument can be returned to Hewlett-Packard for all service work, including troubleshooting. Contact your nearest Hewlett-Packard Sales Office for more details.

The HP 16500B Logic Analysis System

iii

In This Book

This book is the service guide for the HP 16500B/16501A Logic Analysis System and is divided into eight chapters.

Chapter 1 contains information about the instrument and includes accessories for the instrument, specifications and characteristics of the instrument, and a list of the equipment required for servicing the instrument.

Chapter 2 tells how to prepare the instrument for use. Chapter 3 gives instructions on how to test the performance of the instrument. Chapter 4 contains calibration instructions for the instrument. Chapter 5 contains self-tests and flowcharts for troubleshooting the instrument. Chapter 6 tells how to replace the instrument and assemblies of the instrument, and how to

return them to Hewlett-Packard. Chapter 7 lists replaceable parts, shows an exploded view, and gives ordering information. Chapter 8 explains how the instrument works and what the self-tests are checking. This book also contains information about the HP 16500L interface module when using an

expansion frame or an external monitor. For information about using the interface module with a local area network, refer to the manuals for the HP 16500L.

Contents

1 General Information

Accessories 1–2 Specifications 1–3 Characteristics 1–3 Recommended Test Equipment 1–6

2 Preparing for Use

To inspect the logic analysis system 2–2 To apply power 2–3 To operate the user interface 2–3 To set the line voltage 2–4 To degauss the display 2–5 To clean the logic analysis system 2–5 To test the logic analysis system 2–5 To install modules 2–6 To install the HP 16500L interface module 2–7 To connect the HP 16501A Expansion Frame 2–9 To connect an external monitor 2–10

3 Testing Performance

To perform the power-up tests 3–3 To perform the self-tests 3–4

4 Calibrating and Adjusting

To prepare the instrument 4–3 To access the test patterns 4–4 To adjust geometry 4–5 To adjust focus, landing, and convergence 4–6 To adjust white balance 4–13

5 Troubleshooting

To use the flowcharts 5–2 To check the power-up self-tests 5–18 To run the self-tests 5–19 To check the video signals 5–22 To check the power supply LEDs 5–23 To check the power supply voltages 5–24 To test the flexible disk drive voltages 5–25 To test the hard disk drive voltages 5–27 To test the expansion frame interface 5–29

Contents

6 Replacing Assemblies

To remove and replace the

Optional modules or filler panels 6–3 Covers 6–4 Flexible disk drive 6–5 Power supply 6–6 Rear fan 6–8 Side fan 6–9 HP 16500L interface module 6–10 Hard disk drive 6–12 Microprocessor board (CPU) 6–13 SIMM memory 6–14 Expansion interface board 6–15 Mother board 6–16 Front-panel board 6–18 Color display assembly 6–19

To return assemblies 6–22

7 Replaceable Parts

Replaceable Parts Ordering 7–2 Replaceable Parts List Description 7–3 HP 16500B Exploded View and Replaceable Parts 7–4 HP 16501A Exploded View and Replaceable Parts 7–9

8 Theory of Operation

Block-Level Theory 8–3

The HP 16500B Logic Analysis System 8–3 The Microprocessor Board 8–6

The Power-Up Routine 8–9

The Power-Up Screen 8–9 Power-Up Self-Tests 8–10 Power-Up Tasks 8–10 The System Configuration Menu 8–12

Self-Tests Description 8–13

Power-Up Self-Tests 8–13 Functional Performance Verification Tests 8–15

HP-IB 8–18

RS-232C 8–19

Accessories 1–2 Specifications 1–3 Characteristics 1–3 Recommended Test Equipment 1–6

General Information

This chapter lists the accessories, the specifications and characteristics, and the recommended test equipment.

Accessories

The following accessories are supplied with the HP 16500B/16501A Logic Analysis System.

Accessories Supplied Qty

Training Kit 1

Setting Up The System Guide 1

User’s Reference 1

Programming Reference 1

Service Guide 1

RS-232C Loopback Connector 1

Power cord 1

Disk pouch containing backup composite software 1

Feeling Comfortable With Logic Analyzers

Feeling Comfortable with Digitizing Oscilloscopes

Filler Panels Quantity depends on how many modules are

ordered wi th the HP 16500B/16501A

Accessories Available

Other accessories available for the HP 16500B/16501A Logic Analysis System are listed in the Accessories for HP Logic Analyzers brochure.

1–2

General Information

Specifications

The specifications are the performance standards against which the product is tested. There are no specifications for the HP 16500B or the HP 16501A.

Characteristics

These characteristics are not specifications, but are included as additional information. The following characteristics are typical for the HP 16500B/16501A system.

Hard Disk Drive Capacity 86 Mbyte unformatted; Formatted as a Microsoft DOS disk drive IDE Interface

Bus.

Flexible Disk Drive Capacity 1.44 Mbyte formatted Microsoft DOS or LIF supported.

Specifications

Programmability Instrument settings and operating modes, including automatic measurements, may be

remotely programmed via RS-232C, HP-IB (IEEE-488), or optional HP 16500L (Ethernet).

Hardcopy Output Printers Supported HP ThinkJet, HP QuietJet, HP LaserJet, HP PaintJet, HP Deskjet,

HP Deskjet C, Epson and Epson-compatible (for example, Epson FX-80) via RS-232C or HP-IB.

RS-232C Configurations Protocols: XON/XOFF, Hardware; Data bits: 8; Stop bits: 1, 1 1/2, 2; Parity: none, odd, or even; Baud rates: 110, 300, 600, 1200, 2400, 4800, 9600, 19200.

HP-IB Interface Functions SH1, AH1, T5, TE0, L3, LE0, SR1, RL1, PP1, DC1, DT1, C0 and E2.

Input/Output Rear Panel BNCs:

Intermodule Bus (IMB) Characteristics

Port-in

1.5 mA to +6 V at 1.6 mA.

Port-out

into 50 Ω.

Run Control Oscilloscope, timing, state, and pattern generation can be armed by Group Run. Modules can run concurrently or be armed in series. Each module can arm one or more modules.

Mixed Display Mode Any timing or oscilloscope waveform displays can be mixed. State listings can be included with waveforms in the State/Timing Mixed Mode display.

User selectable: TTL, ECL or user defined; Zin = 4 kΩ ; Maximum Vin = -6.0 V at

Output signal is active high, TTL output level, high > 2 V into 50 Ω, low < 0.4 V

Acquiring Data for Mixed Displays To obtain a mixed display, multiple modules must be armed through the IMB. To include state listings in mixed mode displays, state time tagging must be on.

1–3

General Information

Characteristics

Time Interval Accuracy Between Modules Equals the sum of the channel-to-channel time interval accuracies of each module used in the measurement, for a deskewed measurement.

Time Correlation Resolution 2 ns (500 MHz).

Operating Environment

Weight HP 16500B

Temperature

Instrument Disk Media Probes and Cables

Humidity

Instrument Disk media and hard drive

Altitude Up to 4600 m (15 000 ft). Hard drive to 300 m (10,000 ft.).

Vibration

Operating Random vibration 5-500Hz, 10 minutes per axis, ~ 2.41 g (rms). Non-operating Random vibration 5-500Hz, 10 minutes per axis, ~ 2.4 g (rms); and

swept sine resonant search, 5-500Hz, 0.75g (0-peak), 5 minute dwell at 4 resonances per axis.

Net 18.1 kg (40 lbs) + [0.7 kg (1.6 lbs) x number of optional cards installed]. Shipping 25.9 kg (57 lbs) + [3.6 kg (8 lbs) x number of optional cards installed].

HP 16501A

Net 12.2 kg (27 lbs) + [0.7 kg (1.6 lbs) x number of optional cards installed]. Shipping 19.9 kg (44 lbs) + [3.6 kg (8 lbs) x number of optional cards installed].

0 °C to 50 °C (+32 °F to 122 °F).

10 °C to 40 °C (+50 °F to 104 °F).

0 °C to 65 °C (+32 °F to 149 °F).

up to 95% relative humidity at 40 °C (104 °F).

8% to 80% relative humidity at 40 °C (104 °F).

Power Requirements HP 16500B 115 V/230 V, -22% to +10%, 48 to 66 Hz, 475 W max.

HP 16501A 115 V/230 V, -22% to +10%, 48 to 66 Hz, 420 W max.

1–4

Dimensions Refer to the following figure for dimensional detail.

General Information

Characteristics

Dimensional Detail

1–5

General Information

Recommended Test Equipment

Equipment Required

Equipment Critical Specifications Recommended

Model/Part

Oscilloscope 100 MHz Bandwidth HP 54600A T Voltmeter HP 3478A T RS-232C Loopback Connector

*A = Adjustment P = Performance Tests T = Troubleshooting

HP Part Number 01650-63202

Use

1–6

Preparing for Use

Preparing For Use

This chapter gives you instructions for preparing the logic analysis system for use.

Power Requirements

The logic analysis system mainframe requires a power source of either 115 Vac or 230 Vac, –22 % to +10 %, single phase, 48 to 66 Hz, 475 W maximum power.

The logic analysis system expansion frame requires a power source of either 115 Vac or 230 Vac, –22 % to +10 %, single phase, 48 to 66 Hz, 420 W maximum power.

Operating Environment

The operating environment is listed in chapter 1. Note the noncondensing humidity limitation. Condensation within the instrument can cause poor operation or malfunction. Provide protection against internal condensation.

The logic analysis system will operate at all specifications within the temperature and humidity range given in chapter 1. However, reliability is enhanced when operating it within the following ranges:

WARNING

• Temperature: +20 °C to +35 °C (+68 °F to +95 °F)

• Humidity: 20% to 80% noncondensing

Storage

Store or ship the logic analysis system in environments within the following limits:

• Temperature: -40 °C to + 75 °C

• Humidity: Up to 90% at 65 °C

• Altitude: Up to 15,300 meters (50,000 feet)

Protect the system from temperature extremes which cause condensation on the instrument.

To inspect the logic analysis system

1 Inspect the shipping container for damage.

If the shipping container or cushioning material is damaged, keep them until you have checked the contents of the shipment and checked the instrument mechanically and electrically.

Hazardous voltages exist in this instrument. To avoid electrical shock, do not apply power to a damaged instrument.

2–2

2 Check the supplied accessories.

Accessories supplied with the logic analysis system are listed in "Accessories" in chapter 1.

3 Inspect the product for physical damage.

Check the logic analysis system and the supplied accessories for obvious physical or mechanical defects. If you find any defects, contact your nearest Hewlett-Packard Sales Office. Arrangements for repair or replacement are made, at Hewlett-Packard’s option, without waiting for a claim settlement.

To apply power

1 Check that the line voltage selector, located on the rear panel, is on the correct

setting and the correct fuse is installed.

See also, "To set the line voltage" in this chapter.

2 Connect the power cord to the instrument and to the power source.

This instrument is equipped with a three-wire power cable. When connected to an appropriate ac power outlet, this cable grounds the instrument cabinet. The type of power cable plug shipped with the instrument depends on the country of destination. Refer to chapter 7, "Replaceable Parts," for option numbers of available power cables.

Turn on the instrument line switch located on the rear panel, then turn on the power

standby switch located on the front panel.

Preparing for Use

To apply power

To operate the user interface

• To select a field on the mainframe screen, use the touchscreen.

For more information about the logic analysis system interface, refer to the

HP 16500B/16501A Logic Analysis System User’s Reference.

• To set the HP-IB address or to configure for RS-232C, refer to the

HP 16500B/16501A Logic Analysis System User’s Reference.

2–3

Preparing for Use

To set the line voltage

When shipped from HP, the line voltage selector is set and an appropriate fuse is installed for operating the instrument in the country of destination. To operate the instrument from a power source other than the one set, perform the following steps.

Turn the front panel power switch to the STBY position, then turn the power switch

to the Off position. Remove the power cord from the instrument.

2 Replace the main fuse with a 5 A/250 V fuse for 230 V operation, or a 10 A/125 V fuse

for 115 V operation.

3 Set the rear panel line select switch for the desired voltage. 4 Reconnect the power cord, turn on the rear panel power switch, then continue

normal operation.

5 If your system includes an HP 16501A Expansion Frame, repeat this procedure for it.

The expansion frame has only one power switch, and that switch is located on the rear panel.

Line Voltage Selection

2–4

Preparing for Use

To degauss the display

• If the mainframe has been subjected to strong magnetic fields, the CRT might

become magnetized and display data might become distorted. To correct this condition, degauss the CRT with a conventional, external-television-type degaussing coil.

To clean the logic analysis system

• With the instrument turned off and unplugged, use mild soap and water to clean the

front and cabinet of the system. Harsh soap might damage the water-base paint.

To test the logic analysis system

The logic analysis system does not require calibration or adjustment.

• If you require a test to initially accept the operation, perform the self-tests in

chapter 3, "Testing Performance."

• If the logic analysis system does not operate correctly, go to the beginning of

chapter 5, "Troubleshooting."

2–5

CAUTION

Preparing for Use

To install modules

The following steps give general instructions for installing modules into the mainframe or the expansion frame of the system.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and mats when performing any service to modules.

Turn off the frame power switch, then unplug the power cord. Disconnect any input or output connections.

2 Plan your module configuration.

Refer to the manuals of individual modules for configuration information.

Loosen the thumb screws.

Cards or filler panels below the slots intended for installation do not have to be removed. Starting from the top, loosen the thumb screws on filler panels and cards that need to be

moved.

Starting from the top, pull the cards and filler panels that need to be moved halfway

out.

All multicard modules will be cabled together. To prevent damage to the cables and connectors, pull these cards out together.

Remove the cards and filler panels.

Remove the cards or filler panels that are in the slots intended for the module installation. Some modules for the logic analysis system require calibration if you move them to a different

slot. Refer to the manuals of individual modules for calibration information.

Install the module.

You may need to push all other cards into the card cage, but not completely in, to get them out of the way for installing the module.

Refer to the manuals of individual modules for cabling information.

Slide the complete module into the frame, but not completely in.

Each card is firmly seated and tightened one at a time in step 9.

8 Position all cards and filler panels so that the endplates overlap. 9 Seat the cards and tighten the thumbscrews.

Starting with the bottom card, firmly seat the cards into the backplane connector of the mainframe. Keep applying pressure to the center of the card endplate while tightening the thumbscrews finger-tight. Repeat this for all cards and filler panels starting at the bottom and moving to the top.

CAUTION

See Also Service Guides for the individual modules.

For correct air circulation, filler panels must be installed in all unused card slots. Correct air circulation keeps the instrument from overheating. Keep any extra filler panels for future use.

Plug in the system, then turn it on.

When you turn on the power switch, the logic analysis system performs power-up tests. After the power-up tests are complete, the screen will show your system configuration.

2–6

WARNING

CAUTION

Preparing for Use

To install the HP 16500L interface module

The HP 16500L interface module is required to connect the HP 16501A Expansion Frame to the HP 16500B mainframe.

Hazardous voltages exist on the power supply, the CRT, and the CRT driver board of the HP 16500B mainframe. To avoid electrical shock, disconnect the power from the instrument before performing the following procedures. After disconnecting the power, wait at least six minutes for the capacitors on the power supply board and the CRT driver board to discharge before servicing the instrument. However, if the AC LED on the power supply has any illumination, a significant charge remains on the power supply capacitors.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and mats when performing any service to this module or to the HP 16500B Logic Analysis System.

For correct orientation of the cables, match the slots on the cable connectors and on the board connectors.

Remove power from the HP 16500B mainframe, then remove the optional modules,

the four rear feet, and the top and bottom covers of the mainframe.

2 Remove the sheetmetal plate on the rear of the mainframe covering the slot where

the HP 16500L interface module will be installed.

With the interface module installed, you will not use the plate. Save the plate to use in case the interface module is removed.

Remove the cable connecting the CRT module to the CPU board.

To release the cable, push the tabs on the board connector to the outside of the connector. With the interface module installed, you will not use this cable. Save the cable to use in case

the interface module is removed.

If you need more room to replace the CRT cable, you can remove the hard disk drive. Removing the hard disk is not necessary, but gives you more room for replacing the CRT cable. The hard disk is connected with four screws.

Connect one end of the new 40-pin cable to the CRT module.

Push the cable connector into the board connector until the tabs lock in the cable. If you removed the hard disk drive, replace it before going to the next step.

2–7

Preparing for Use

To install the HP 16500L interface module

5 Slide the interface module into the mainframe through the slot in the rear panel. 6 Install the screws connecting the interface module to the mainframe.

Two screws through the top of the interface module connect it to the sheetmetal plate, and four screws through the rear plate of the interface module connect it to the rear panel of the mainframe.

Connect the end of the 40-pin CRT cable to the interface module.

7 8 Connect the 80-pin cable to the CPU board and to the interface module.

a Slide the 80-pin cable halfway through the rear slot of the card cage between the

interface module and the CPU board.

b Connect the cable to the CPU board.

c Connect the cable to the interface module.

Connect the 10-pin cable to the CPU board and to the interface module.

10 Replace the top and bottom covers, the optional modules, and the rear feet of the

mainframe.

11 Turn on the system.

a Connect a power cord to the frame.

b Turn on the line switch located on the rear panel the frame.

c Turn on the power standby switch located on the front panel of the mainframe.

When the power-up tests are complete, the mainframe screen shows "Ethernet" in the Communications menu.

2–8

CAUTION

Preparing for Use

To connect the HP 16501A Expansion Frame

The HP 16501A Expansion Frame includes an interface cable and requires an HP 16500L interface module to connect to the HP 16500B mainframe. To install the expansion frame, you need to install the interface module into the mainframe, then connect the cable from the module to the expansion frame.

Electrostatic discharge can damage electronic components. Use grounded wriststraps and mats when performing any service to this card.

Turn off the mainframe power switch, then unplug the power cord. Disconnect any input connections.

2 Verify that the line select switch located on the rear panel of the expansion frame is

in the off position.

3 Install the HP 16500L interface module into the mainframe.

The procedure for installing the HP 16500L is on page 2–7.

4 Connect the interface cable to the expansion frame and to the interface module in

the mainframe.

To ensure correct insertion, the 68-pin "D" connectors on each end of the interface cable are asymmetric in shape. They only fit into their respective ports on the cards when oriented to match the shape of the ports.

When connecting the interface cable, you will hear two clicks. Make sure the cable connector is properly seated into the port by pulling the connector without pressing the release tabs. If the connector is properly seated, it will remain connected to the port.

Turn on the system.

a Connect a power cord to each frame.

b Turn on the line switch located on the rear panel of each frame.

c Turn on the power standby switch located on the front panel of the mainframe.

When the power-up tests are complete, the mainframe screen shows "Master Frame" in a blue field.

2–9

Preparing for Use

To connect an external monitor

The following tables define the signal available for external monitors at the HP 16500L connector and pin numbers.

HP 16500L Output Signal For External Monitors

Horizontal deflection (fh) 25.0 kHz

Vertical deflection (fv) 59.95 Hz

Resolution 576 x 368 x dots x lines (WxH)

RGB video 0.714 VP-P, positive

Impedance 75 ohm , analog

External Sync Signal

Connector Pins

H TTL, negative 3.2 µS; W TTL, negative, 120 µS

Pin number Signal Pin number Signal

1 Red 6,7,8,10 Ground

2 Green 13 Horizontal Sync

3 Blue 14 Vertical Sync

1 Connect your monitor to the HP 16500L interface module installed into the

HP 16500B mainframe.

2 If your monitor needs adjusting, follow the manufacturer’s instructions.

2–10

Connector for external monitor

To perform the power-up tests 3–3 To perform the self-tests 3–4

Testing Performance

To ensure the logic analysis system is operating correctly, you can perform software tests (self-tests) on the system. Directions for performing the software tests are given in this chapter.

This chapter normally tells you how to test the performance of the logic analysis system against the specifications listed in chapter 1. Because there are no specifications for the HP 16500B/16501A, there are no performance verification tests.

Self-Tests

The self-tests listed in this chapter check the functional operation of the mainframe and the expansion frame. Self-tests for the optional modules installed in the frames are listed in the individual module Service Guides.

There are two types of self-tests: self-tests that automatically run at power-up, and self-tests that you select on the screen. For descriptions of the tests, refer to chapter 8, "Theory of Operation."

Perform the self-tests as an acceptance test when receiving the logic analysis system or when the logic analysis system is repaired.

If a test fails, refer to chapter 5, "Troubleshooting."

Test Interval

There is no recommended test interval for the HP 16500B mainframe or the HP 16501A expansion frame. However, each of the HP 16500-series option modules has performance verification tests and therefore require a periodic verification of specifications. Refer to the Service Guides of the individual modules for more information.

The Logic Analysis System Interface

To select a field on the HP 16500B screen, use the touchscreen. For more information about the logic analysis system interface, refer to the HP 16500B/16501A Logic Analysis System User’s Reference.

3–2

Testing Performance

To perform the power-up tests

The logic analysis system automatically performs power-up tests when you apply power to the instrument. The revision number of the boot ROM shows in the upper-right corner of the screen during these power-up tests. As each test completes, either "passed" or "failed" prints on the screen in front of the name of each test.

Disconnect all inputs, then insert a formatted disk into the flexible disk drive.

1 2 Let the instrument warm up for a few minutes, then cycle power by turning off then

turning on the power switch.

If the instrument is not warmed up, the power-up test screen will complete before you can view the screen.

As the tests complete, check if they pass or fail.

The Flexible Disk Test reports No Disk if a disk is not in the disk drive. If a power-up self-test fails, refer to chapter 5, "Troubleshooting."

Performing Power-Up Self-Tests

passed ROM Test

passed RAM Test

passed Interrupt Test

passed Display Test

passed HIL Controller Test

passed Front-Panel Test

passed Touchscreen Test

passed Correlator Test

passed Hard Disk Test

passed Flexible Disk Test

Loading Module Files

3–3

Testing Performance

To perform the self-tests

The self-tests verify the correct operation of the logic analysis system. Self-tests can be performed all at once or one at a time. While testing the performance of the logic analysis system, run the self-tests all at once.

1 If you just did the power-up self-tests, go to step 2.

If you did not just do the power-up self-tests, disconnect all inputs, then turn on the power switch. Wait until the power-up tests are complete.

2 In the System Configuration menu, select Configuration, then select Test.

3 Select the box labeled Load Test System. 4 Select Test System, then select Mainframe Test from the pop-up menu.

3–4

Testing Performance

To perform the self-tests

5 Install a formatted disk that is not write protected into the flexible disk drive.

Connect an RS-232C loopback connector onto the RS-232C port.

6 Select All System Tests.

You can run all tests at one time by running All System Tests. To see more details about each test, you can run each test individually. This step shows how to run all tests at once.

The status of the tests will change from Untested to Passed or Failed. If a test fails, refer to chapter 5, "Troubleshooting."

The Color Display Test is not normally needed. The screens are primarily used when the color display assembly requires adjusting. For the adjustment procedure, refer to chapter 4, "Calibrating and Adjusting."

Exit the mainframe tests.

a In the Mainframe Test menu, select Mainframe Test, then select Test System.

b Select Configuration, then select Exit Test in the pop-up menu.

c Select the field close to the center of the screen to exit the test system and to load the

mainframe operating system.

After the operating system is loaded, the System Configuration menu is displayed.

3–5

3–6

To prepare the instrument 4–3 To access the test patterns 4–4 To adjust geometry 4–5 To adjust focus, landing, and convergence 4–6 To adjust white balance 4–13

Calibrating and Adjusting

+ 99 hidden pages