HIT 2SK2851 Datasheet

Features
Low on-resistance
R
= 0.055typ. (at VGS = 10 V, ID = 2.5 A)
4V gate drive devices.
Large current capacitance
ID = 5 A
Outline
2SK2851
Silicon N Channel MOS FET High Speed Power Switching
ADE-208-478
1st. Edition
TO-92MOD.
G
D
3
2
1
S
1. Source
2. Drain
3. Gate
2SK2851
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body to drain diode reverse drain current I Avalanche current IAP* Avalanche energy EAR* Channel dissipation Pch*
DSS
GSS
D
D(pulse)
DR
1
*
3
3
2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Notes: 1. PW 10µs, duty cycle 1 %
2. Value at Ta = 25°C
3. Value at Tch = 25°C, Rg 50
60 V ±20 V 5A 20 A 5A 5A
2.14 mJ
0.9 W
2
2SK2851
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown
V
(BR)DSS
60——V I
voltage Gate to source breakdown
V
(BR)GSS
±20——V I
voltage Zero gate voltege drain
I
DSS
——10µAV
current Gate to source leak current I Gate to source cutoff voltage V Static drain to source on state R resistance R
GSS
GS(off)
DS(on)
DS(on)
——±10 µAV
1.0 2.0 V ID = 1mA, VDS = 10V — 0.055 0.07 ID = 2.5A, VGS = 10V*
0.07 0.1 ID = 2.5A, VGS = 4V* Forward transfer admittance |yfs|57—SI Input capacitance Ciss 500 pF VDS = 10V Output capacitance Coss 260 pF VGS = 0 Reverse transfer capacitance Crss 110 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body to drain diode forward
V
d(on)
r
d(off)
f
DF
10 ns VGS = 10V, ID = 2.5A
30 ns RL = 12
100 ns
—75—ns
0.9 V ID = 5A, VGS = 0 voltage
Body to drain diode reverse
t
rr
50 ns IF = 5A, VGS = 0 recovery time
Note: 1. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
= 60 V, VGS = 0
DS
= ±16V, VDS = 0
GS
= 2.5A, VDS = 10V*
D
diF/ dt = 50A/µs
1
1
1
3
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