General Semiconductor SM6T22A, SM6T24A, SM6T30A, SM6T33A, SM6T36A Datasheet

SM6T SERIES

TRANSZORB™ SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

Breakdown Voltage - 6.8 to 220 Volts Peak Pulse Power - 600 Watts

FEATURES

♦ For surface mounted applications in order

to optimize board space

♦ Low profile package
♦ Built-in strain relief
♦ Glass passivated junction
♦ Low inductance
♦ Excellent clamping capability
♦ Repetition Rate (duty cycle): 0.01%
♦ Fast reponse time: typically less than 1ps from 0 volts to

V

BR

min.

♦ Typical I

D

less than 1µA above 10V

♦ High temperature soldering: 250°C/10 seconds

at terminals

♦ Plastic package has Underwriters Laboratory

Flammability Classification 94V-O

MECHANICAL DATA

Case: JEDEC DO-214AA (SMB) molded plastic over

passivated junction
Terminals: Solder plated solderable per MIL-STD-750,
Method 2026
Polarity: For uni-directional types: Color band
denotes positive end (cathode)

Standard Packaging: 12mm tape (EIA STD RS-481)
Weight: 0.003 ounces, 0.093 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified

SYMBOLS VALUE UNIT

Peak Pulse Power Dissipation on 10/1000µs
waveform

(NOTES 1, 2, Fig. 1)

P

PPM

Minimum 600 Watts

Peak Pulse Current on 10/1000µs
waveform

(NOTE 1, Fig. 3)

I

PPM

See Table 1 Amps

Power Dissipation on Infinite Heatsink, TA=50°CP

M(AV)

5.0 Watts

Peak Forward Surge Current, 10ms Single Half Sine-wave,

I

FSM

100 Amps

Undirectional Only
Max. Junction Temperature T

J

150 °C

Storage Temperature Range T

STG

-65 to +175 °C

Thermal Resistance Junction to Ambient Air

(NOTE 2)

R

ΘJA

100 °C/W

Thermal Resistance Junction to Leads R

ΘJL

20 °C/W

NOTES

(1) Non-repetitive current pulse, per Fig. 3 and derated above T

A

=25°C per Fig. 2

(2) Mounted on 5.0mm

2

(.013mm thick) land areas.

(3) Measured on 8.3ms single half sine-wave or equivalent squarewave, duty cycle 4 pulses per minute maximum.

0.160 (4.06)

0.180 (4.57)

0.006 (0.152)

0.012 (0.305)

0.030 (0.76)

0.060 (1.52)

0.008 (0.203)

0.205 (5.21)

0.220 (5.59)

0.084 (2.13)

0.096 (2.44)

0.077 (1.95)

0.086 (2.20)

0.130 (3.30)

0.155 (3.94)

MAX.

DO-214AA

Dimensions in inches and (millimeters)

NEW PRODUCT NEW PRODUCT NEW PRODUCT

1/21/99

ELECTRICAL CHARACTERISTICS RATINGS at (TA=25ºC unless otherwise noted)

SM6T6V8A KE7 KE7 5.80 1000 6.45 7.14 10 10.5 57.0 13.4 298 5.7

SM6T7V5A KK7 AK7 6.40 500 7.13 7.88 10 11.3 53.0 14.5 276 6.1

SM6T10A KT7 AT7 8.55 10.0 9.50 10.5 1.0 14.5 41.0 18.6 215 7.3

SM6T12A KX7 AX7 10.2 5.00 11.4 12.6 1.0 16.7 36.0 21.7 184 7.8

SM6T15A LG7 LG7 12.8 1.00 14.3 15.8 1.0 21.2 28.0 27.2 147 8.4

SM6T18A LM7 BM7 15.3 1.00 17.1 18.9 1.0 25.2 24 32.5 123 8.8

SM6T22A LT7 BT7 18.8 1.00 20.9 23.1 1.0 30.6 20.0 39.3 102 9.2

SM6T24A LV7 LV7 20.5 1.00 22.8 25.2 1.0 33.2 18.0 42.8 93 9.4

SM6T27A LX7 BX7 23.1 1.00 25.7 28.4 1.0 37.5 16.0 48.3 83 9.6

SM6T30A ME7 CE7 25.6 1.00 28.5 31.5 1.0 41.5 14.5 53.5 75 9.7

SM6T33A MG7 MG7 28.2 1.00 31.4 34.7 1.0 45.7 13.1 59.0 68 9.8

SM6T36A MK7 CK7 30.8 1.00 34.2 37.8 1.0 49.9 12.0 64.3 62 9.9

SM6T39A MM7 CM7 33.3 1.00 37.1 41.0 1.0 53.9 11.1 69.7 57 10.0

SM6T68A NG7 NG7 58.1 1.00 64.6 71.4 1.0 92.0 6.50 121 33 10.4

SM6T100A NV7 NV7 85.5 1.00 95.0 105 1.0 137 4.40 178 22.5 10.6

SM6T150A PK7 PK7 128 1.00 143 158 1.0 207 2.90 265 15 10.8

SM6T200A PR7 PR7 171 1.00 190 210 1.0 274 2.20 353 11.3 10.8

SM6T220A PR8 PR8 188 1.00 209 231 1.0 328 2.00 388 10.3 10.8

NOTES:

(1) For bi-directional devices add “C” for ±10% and “CA” for ±5% tolerance of V

BR

(2) VBRmeasured after ITapplied for 300µs square wave pulse
(3) For bipolar devices with V

R

=10 Volts or under, the ITlimit is doubled

APPLICATION NOTES

A 600W (SMB) device is normally selected when the threat of transients is from lightning induced transients, conducted via external leads or I/O lines. It is also used to pro­tect against switching transients induced by large coils or industrial motors. Source impedance at component level in a system is usually high enough to limit the current
within the peak pulse current (IPP) rating of this series. In an overstress condition, the failure mode is a short circuit.

RECOMMENDED PAD SIZES

The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for
soldering methods.

0.90 (2.28)

0.025 (2.16)

0.070 (1.78)

Type

(1)

Device Marking Code

Uni Bi

Standoff

Voltage

V

RM

(Volts)

Leakage
Current

(3)

IRM@ V

RM

(µA)

Breakdown Voltage

V

BR

@ I

T

(2)

(Volts)

Min Max

Test

Current

I

T

(mA)

Clamping Voltage

VC@ I

PP

10/1000µs

(Volts) (Amps)

α

T

Max

10

-4

/°C

Clamping Voltage

VC@ I

PP

8/20µs

(Volts) (Amps)