General Semiconductor SM15T Service Manual

SM15T SERIES

TRANSZORB™ SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

Breakdown Voltage - 6.8 to 220 Volts Peak Pulse Power - 1500 Watts

FEATURES

♦ For surface mounted applications in order to

optimize board space

♦ Low profile package
♦ Built-in strain relief
♦ Glass passivated junction
♦ Low inductance
♦ Excellent clamping capability
♦ Repetition Rate (duty cycle): 0.05%
♦ Fast reponse time: typically less than 1ps from 0 volts to

V

BR

min.

♦ Typical I

D

less than 1µA above 10V

♦ High temperature soldering: 250°C/10 seconds

at terminals

♦ Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

MECHANICAL DATA

Case: JEDEC DO-214AB (SMC) molded plastic over

passivated junction
Terminals: Solder plated solderable per MIL-STD-750,
Method 2026
Polarity: For uni-directional types: Color band
denotes positive end (cathode)

Standard Packaging: 12mm tape (EIA STD RS-481)
Weight: 0.003 ounces, 0.093 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified

SYMBOLS VALUE UNIT

Peak Pulse Power Dissipation on 10/1000µs
waveform

(NOTES 1, 2, Fig. 1)

P

PPM

Minimum 1500 Watts

Peak Pulse Current on 10/1000µs
waveform

(NOTE 1, Fig. 3)

I

PPM

See Table 1 Amps

Power Dissipation on Infinite Heatsink, TA=50°CP

M(AV)

6.5 Watts

Peak Forward Surge Current, 10ms Single Half Sine-wave,

I

FSM

200 Amps

Undirectional Only
Max. Junction Temperature T

J

150 °C

Storage Temperature Range T

STG

-65 to +175 °C

Thermal Resistance Junction to Ambient Air

(NOTE 2)

R

ΘJA

75 °C/W

Thermal Resistance Junction to Leads R

ΘJL

15 °C/W

NOTES:
(1) Non-repetitive current pulse, per Fig. 3 and derated above TA=25°C per Fig. 2

(2) Mounted on 5.0mm

2

(.013mm thick) land areas.

(3) Measured on 8.3ms single half sine-wave or equivalent squarewave, duty cycle 4 pulses per minute maximum.

1/21/99

0.006 (0.152)

0.012 (0.305)

0.030 (0.76)

0.060 (1.52)

0.008 (0.203)

0.305 (7.75)

0.320 (8.13)

0.260 (6.60)

0.280 (7.11)

0.079 (2.06)

0.103 (2.62)

0.220 (5.59)

0.245 (6.22)

0.126 (3.20)

0.114 (2.90)

MAX.

DO-214AB

Dimensions in inches and (millimeters)

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ELECTRICAL CHARACTERISTICS RATINGS at (TA=25ºC unless otherwise noted)

SM15T6V8A GDE7 GDE7 5.80 1000 6.45 7.14 10 10.5 143 13.4 746 5.7

SM15T7V5A GDK7 BDK7 6.40 500 7.13 7.88 10 11.3 132 14.5 690 6.1

SM15T10A GDT7 BDT7 8.55 10.0 9.50 10.5 1.0 14.5 103 18.6 538 7.3

SM15T12A GDX7 BDX7 10.2 5.00 11.4 12.6 1.0 16.7 90.0 21.7 461 7.8

SM15T15A GEG7 GEG7 12.8 5.00 14.3 15.8 1.0 21.2 71.0 27.2 368 8.4

SM15T18A GEM7 BEM7 15.3 5.00 17.1 18.9 1.0 25.2 59.5 32.5 308 8.8

SM15T22A GET7 BET7 18.8 5.00 20.9 23.1 1.0 30.6 49.0 39.3 254 9.2

SM15T24A GEV7 GEV7 20.5 5.00 22.8 25.2 1.0 33.2 45.0 42.8 234 9.4

SM15T27A GEX7 BEX7 23.1 5.00 25.7 28.4 1.0 37.5 40.0 48.3 207 9.6

SM15T30A GFE7 BFE7 25.6 5.00 28.5 31.5 1.0 41.5 36.0 53.5 187 9.7

SM15T33A GFG7 GFG7 28.2 5.00 31.4 34.7 1.0 45.7 33.0 59.0 169 9.8

SM15T36A GFK7 BFK7 30.8 5.00 34.2 37.8 1.0 49.9 30.0 64.3 156 9.9

SM15T39A GFM7 BFM7 33.3 5.00 37.1 41.0 1.0 53.9 28.0 69.7 143 10.0

SM15T68A GGG7 GGG7 58.1 5.00 64.6 71.4 1.0 92.0 16.3 121 83 10.4

SM15T100A GGV7 GGV7 85.5 5.00 95.0 105 1.0 137 11.0 178 56 10.6

SM15T150A GHK7 GHK7 128 5.00 143 158 1.0 207 7.20 265 38 10.8

SM15T200A GHR7 GHR7 171 5.00 190 210 1.0 274 5.50 353 28 10.8

SM15T220A GHR8 GHR8 188 5.00 209 231 1.0 328 4.60 388 26 10.8

NOTES:

(1) For bi-directional devices add “C” for ±10% and “CA” for ±5% tolerance of V

BR

(2) VBRmeasured after ITapplied for 300µs square wave pulse
(3) For bipolar devices with V

R

=10 Volts or under, the ITlimit is doubled

APPLICATION NOTES

A 1500W (SMC) device is normally selected when the threat of transients is from lightning induced transients, conducted via external leads or I/O lines. It is also used to
protect against switching transients induced by large coils or industrial motors. Source impedance at component level in a system is usually high enough to limit the current
within the peak pulse current (IPP) rating of this series. In an overstress condition, the failure mode is a short circuit.

RECOMMENDED PAD SIZES

The pad dimensions should be 0.010” (0.25mm) longer than the contact size, in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for
soldering methods

Type

(1)

Device

Marking Code

Uni Bi

Standoff

Voltage

V

RM

(Volts)

Leakage
Current

(3)

IRM@ V

RM

(µA)

Breakdown Voltage

VBR@ I

T

(2)

(Volts)

Min Max

Test

Current

I

T

(mA)

Clamping Voltage

VC@ I

PP

10/1000µs

(Volts) (Amps)

α

T

Max

10

-4

/°C

Clamping Voltage

V

C

@ I

PP

8/20µs

(Volts) (Amps)

0.190 (4.83)

0.125 (3.17)

0.070 (1.78)